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AU2001267913A1 - Operation monitoring method for treatment apparatus - Google Patents

Operation monitoring method for treatment apparatus

Info

Publication number
AU2001267913A1
AU2001267913A1 AU2001267913A AU6791301A AU2001267913A1 AU 2001267913 A1 AU2001267913 A1 AU 2001267913A1 AU 2001267913 A AU2001267913 A AU 2001267913A AU 6791301 A AU6791301 A AU 6791301A AU 2001267913 A1 AU2001267913 A1 AU 2001267913A1
Authority
AU
Australia
Prior art keywords
treatment apparatus
monitoring method
operation monitoring
treatment
monitoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001267913A
Other languages
English (en)
Inventor
Shinji Sakano
Tsuyoshi Sendoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000201729A external-priority patent/JP4570736B2/ja
Priority claimed from JP2000201731A external-priority patent/JP4610021B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2001267913A1 publication Critical patent/AU2001267913A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H10P74/23—
    • H10P50/283—

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
AU2001267913A 2000-07-04 2001-07-03 Operation monitoring method for treatment apparatus Abandoned AU2001267913A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000201729A JP4570736B2 (ja) 2000-07-04 2000-07-04 運転状態の監視方法
JP2000-201731 2000-07-04
JP2000201731A JP4610021B2 (ja) 2000-07-04 2000-07-04 処理装置の運転方法及び処理装置の異常検出方法
JP2000-201729 2000-07-04
PCT/JP2001/005758 WO2002003441A1 (fr) 2000-07-04 2001-07-03 Procede de surveillance de fonctionnement pour appareil de traitement

Publications (1)

Publication Number Publication Date
AU2001267913A1 true AU2001267913A1 (en) 2002-01-14

Family

ID=26595307

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001267913A Abandoned AU2001267913A1 (en) 2000-07-04 2001-07-03 Operation monitoring method for treatment apparatus

Country Status (5)

Country Link
US (1) US7054786B2 (fr)
CN (1) CN1197130C (fr)
AU (1) AU2001267913A1 (fr)
TW (1) TW499702B (fr)
WO (1) WO2002003441A1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003235901A1 (en) * 2002-05-16 2003-12-02 Tokyo Electron Limited Method of predicting processing device condition or processed result
CN100426471C (zh) * 2002-06-05 2008-10-15 东京毅力科创株式会社 处理装置用的多变量解析方法、处理装置的控制装置、处理装置的控制系统
US7505879B2 (en) 2002-06-05 2009-03-17 Tokyo Electron Limited Method for generating multivariate analysis model expression for processing apparatus, method for executing multivariate analysis of processing apparatus, control device of processing apparatus and control system for processing apparatus
JP2004047885A (ja) * 2002-07-15 2004-02-12 Matsushita Electric Ind Co Ltd 半導体製造装置のモニタリングシステム及びモニタリング方法
TWI264043B (en) * 2002-10-01 2006-10-11 Tokyo Electron Ltd Method and system for analyzing data from a plasma process
US7010374B2 (en) 2003-03-04 2006-03-07 Hitachi High-Technologies Corporation Method for controlling semiconductor processing apparatus
CN1295757C (zh) * 2003-03-04 2007-01-17 株式会社日立高新技术 半导体处理装置的控制方法
JP2004335841A (ja) * 2003-05-09 2004-11-25 Tokyo Electron Ltd プラズマ処理装置の予測装置及び予測方法
JP4342921B2 (ja) * 2003-12-09 2009-10-14 東京エレクトロン株式会社 基板処理装置の制御方法及び基板処理装置
US8676538B2 (en) * 2004-11-02 2014-03-18 Advanced Micro Devices, Inc. Adjusting weighting of a parameter relating to fault detection based on a detected fault
JP4972277B2 (ja) * 2004-11-10 2012-07-11 東京エレクトロン株式会社 基板処理装置の復帰方法、該装置の復帰プログラム、及び基板処理装置
US7231321B2 (en) * 2004-11-10 2007-06-12 Tokyo Electron Limited Method of resetting substrate processing apparatus, storage medium storing program for implementing the method, and substrate processing apparatus
JP4569956B2 (ja) * 2005-01-24 2010-10-27 東京エレクトロン株式会社 基板処理装置の復旧処理方法，基板処理装置，プログラム
DE112007002244T5 (de) * 2006-09-28 2009-07-30 Mitsubishi Electric Corp. Fehlerdetektionsvorrichtung, Fehlerdetektionsverfahren und Fehlerdetektionsprogramm
CN101330030B (zh) * 2007-06-21 2010-09-29 中芯国际集成电路制造(上海)有限公司 检测数据中异常点的去除方法
WO2015029777A1 (fr) * 2013-08-28 2015-03-05 堺ディスプレイプロダクト株式会社 Dispositif de traitement à plasma et procédé de contrôle de dispositif de traitement à plasma
CN103943452B (zh) * 2014-04-28 2016-04-27 南方科技大学 一种等离子体处理的工艺控制方法及装置
GB2535456A (en) 2015-02-12 2016-08-24 Edwards Ltd Processing tool monitoring
JP6351862B2 (ja) 2016-01-13 2018-07-04 三菱電機株式会社 運転状態分類装置
JP6676020B2 (ja) 2017-09-20 2020-04-08 株式会社日立ハイテク プラズマ処理装置及びプラズマ処理装置状態予測方法
JP6914211B2 (ja) 2018-01-30 2021-08-04 株式会社日立ハイテク プラズマ処理装置及び状態予測装置
JP7029362B2 (ja) * 2018-08-16 2022-03-03 三菱重工業株式会社 異常検出装置、異常検出方法、及びプログラム

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Publication number Priority date Publication date Assignee Title
US5442562A (en) 1993-12-10 1995-08-15 Eastman Kodak Company Method of controlling a manufacturing process using multivariate analysis
US5691642A (en) * 1995-07-28 1997-11-25 Trielectrix Method and apparatus for characterizing a plasma using broadband microwave spectroscopic measurements
US5658423A (en) * 1995-11-27 1997-08-19 International Business Machines Corporation Monitoring and controlling plasma processes via optical emission using principal component analysis
US6351683B1 (en) * 1997-09-17 2002-02-26 Tokyo Electron Limited System and method for monitoring and controlling gas plasma processes
US6341257B1 (en) * 1999-03-04 2002-01-22 Sandia Corporation Hybrid least squares multivariate spectral analysis methods
US6442445B1 (en) * 1999-03-19 2002-08-27 International Business Machines Corporation, User configurable multivariate time series reduction tool control method
US6368975B1 (en) * 1999-07-07 2002-04-09 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis
EP1200982A1 (fr) * 1999-08-12 2002-05-02 Infineon Technologies AG Procede de surveillance d'un processus de production pour le traitement d'un substrat dans la fabrication de semi-conducteurs
US6582618B1 (en) * 1999-09-08 2003-06-24 Advanced Micro Devices, Inc. Method of determining etch endpoint using principal components analysis of optical emission spectra
US6419846B1 (en) * 1999-09-08 2002-07-16 Advanced Micro Devices, Inc. Determining endpoint in etching processes using principal components analysis of optical emission spectra
US6413867B1 (en) * 1999-12-23 2002-07-02 Applied Materials, Inc. Film thickness control using spectral interferometry
EP1252652A1 (fr) * 2000-01-25 2002-10-30 Infineon Technologies AG Procede de surveillance d'un processus de fabrication
AU2001247336B2 (en) * 2000-03-10 2006-02-02 Smiths Detection, Inc. Control for an industrial process using one or more multidimensional variables
JP4754757B2 (ja) * 2000-03-30 2011-08-24 東京エレクトロン株式会社 基板のプラズマ処理を調節するための方法、プラズマ処理システム、及び、電極組体
WO2002003256A1 (fr) * 2000-07-05 2002-01-10 Camo, Inc. Procede et systeme d'analyse dynamique de donnees
JP3634734B2 (ja) * 2000-09-22 2005-03-30 株式会社日立製作所 プラズマ処理装置および処理方法
US6627463B1 (en) * 2000-10-19 2003-09-30 Applied Materials, Inc. Situ measurement of film nitridation using optical emission spectroscopy
US6789052B1 (en) * 2000-10-24 2004-09-07 Advanced Micro Devices, Inc. Method of using control models for data compression
US6549864B1 (en) * 2001-08-13 2003-04-15 General Electric Company Multivariate statistical process analysis systems and methods for the production of melt polycarbonate
US6616759B2 (en) * 2001-09-06 2003-09-09 Hitachi, Ltd. Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor
US6723574B1 (en) * 2002-09-26 2004-04-20 Lam Research Corporation Method for quantifying uniformity patterns and including expert knowledge for tool development and control

Also Published As

Publication number Publication date
US7054786B2 (en) 2006-05-30
US20040254761A1 (en) 2004-12-16
TW499702B (en) 2002-08-21
WO2002003441A1 (fr) 2002-01-10
CN1197130C (zh) 2005-04-13
CN1451174A (zh) 2003-10-22

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