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AU2001265150A1 - Fast recovery diode and method for its manufacture - Google Patents

Fast recovery diode and method for its manufacture

Info

Publication number
AU2001265150A1
AU2001265150A1 AU2001265150A AU6515001A AU2001265150A1 AU 2001265150 A1 AU2001265150 A1 AU 2001265150A1 AU 2001265150 A AU2001265150 A AU 2001265150A AU 6515001 A AU6515001 A AU 6515001A AU 2001265150 A1 AU2001265150 A1 AU 2001265150A1
Authority
AU
Australia
Prior art keywords
manufacture
fast recovery
recovery diode
diode
fast
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001265150A
Inventor
Richard Francis
Chiu Ng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of AU2001265150A1 publication Critical patent/AU2001265150A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/01Manufacture or treatment
    • H10D8/045Manufacture or treatment of PN junction diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/50Physical imperfections
    • H10D62/53Physical imperfections the imperfections being within the semiconductor body 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/60Schottky-barrier diodes 
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/91Diode arrays, e.g. diode read-only memory array
AU2001265150A 2000-06-14 2001-05-30 Fast recovery diode and method for its manufacture Abandoned AU2001265150A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09593333 2000-06-14
US09/593,333 US6261874B1 (en) 2000-06-14 2000-06-14 Fast recovery diode and method for its manufacture
PCT/US2001/017381 WO2001097258A2 (en) 2000-06-14 2001-05-30 Fast recovery diode and method for its manufacture

Publications (1)

Publication Number Publication Date
AU2001265150A1 true AU2001265150A1 (en) 2001-12-24

Family

ID=24374317

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001265150A Abandoned AU2001265150A1 (en) 2000-06-14 2001-05-30 Fast recovery diode and method for its manufacture

Country Status (5)

Country Link
US (2) US6261874B1 (en)
JP (1) JP2004503933A (en)
AU (1) AU2001265150A1 (en)
DE (1) DE10196161T1 (en)
WO (1) WO2001097258A2 (en)

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US7485920B2 (en) * 2000-06-14 2009-02-03 International Rectifier Corporation Process to create buried heavy metal at selected depth
US6589860B1 (en) * 2001-03-16 2003-07-08 Advanced Micro Devices, Inc. System and method for calibrating electron beam defect inspection tool
WO2002084745A2 (en) * 2001-04-11 2002-10-24 Silicon Wireless Corporation Power semiconductor devices and methods of forming same
JP4146645B2 (en) * 2002-01-31 2008-09-10 三菱電機株式会社 Manufacturing method of pn junction diode and pn junction diode
US7238976B1 (en) * 2004-06-15 2007-07-03 Qspeed Semiconductor Inc. Schottky barrier rectifier and method of manufacturing the same
EP1635397A1 (en) * 2004-09-14 2006-03-15 STMicroelectronics S.r.l. Integrated high voltage power device having an edge termination of enhanced effectiveness
WO2007075996A2 (en) * 2005-12-27 2007-07-05 Qspeed Semiconductor Inc. Apparatus and method for a fast recovery rectifier structure
US8669554B2 (en) 2006-05-10 2014-03-11 Ho-Yuan Yu Fast recovery reduced p-n junction rectifier
US7880166B2 (en) * 2006-05-10 2011-02-01 Ho-Yuan Yu Fast recovery reduced p-n junction rectifier
JP2008172145A (en) * 2007-01-15 2008-07-24 Toyota Motor Corp Diode manufacturing method
JP5261324B2 (en) * 2009-08-26 2013-08-14 トヨタ自動車株式会社 Semiconductor device and manufacturing method thereof
ES2374901T3 (en) * 2009-11-09 2012-02-23 Abb Technology Ag FAST RECOVERY DIODE AND METHOD OF MANUFACTURING IT.
FR2960097A1 (en) * 2010-05-11 2011-11-18 St Microelectronics Tours Sas Bidirectional protection component for use in first-conductivity type semiconductor substrate, has metallization layer covering first-conductivity type implanted zone, and isolated trench traversing epitaxy layer
WO2012169022A1 (en) * 2011-06-08 2012-12-13 トヨタ自動車株式会社 Semiconductor device and method for producing same
KR101238232B1 (en) 2011-09-14 2013-03-04 주식회사 시지트로닉스 Structure and fabrication method of mhj-frd
EP2595126B1 (en) 2011-11-15 2019-03-06 Siemens Schweiz AG Alarm for use in the nuclear field with a heating system for heating semiconductor elements that are not typically radiation resistant to improve functional service life
JP5915756B2 (en) * 2012-08-22 2016-05-11 富士電機株式会社 Semiconductor device and manufacturing method of semiconductor device
US9123557B2 (en) 2013-11-08 2015-09-01 Sumpro Electronics Corporation Fast recovery rectifier
CN105762198B (en) * 2014-12-18 2019-03-12 江苏宏微科技股份有限公司 Plough groove type fast recovery diode and preparation method thereof
CN108493108B (en) * 2018-05-16 2021-02-09 江苏润奥电子制造股份有限公司 Manufacturing method of high-voltage fast soft recovery diode
CN110660847B (en) * 2018-06-28 2022-04-12 上海先进半导体制造有限公司 Bipolar transistor and method of making the same
CN108807173B (en) * 2018-07-11 2020-01-24 苏州达亚电子有限公司 A kind of preparation method of fast recovery diode and fast recovery diode

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US3852120A (en) * 1973-05-29 1974-12-03 Ibm Method for manufacturing ion implanted insulated gate field effect semiconductor transistor devices
JPS5395581A (en) * 1977-02-02 1978-08-21 Hitachi Ltd Manufacture for semiconductor device
GB8713440D0 (en) * 1987-06-09 1987-07-15 Texas Instruments Ltd Semiconductor device
JPH0750791B2 (en) * 1989-09-20 1995-05-31 株式会社日立製作所 Semiconductor rectifier diode, power supply device using the same, and electronic computer
JP2570022B2 (en) * 1991-09-20 1997-01-08 株式会社日立製作所 Constant voltage diode, power conversion device using the same, and method of manufacturing constant voltage diode
JP2850694B2 (en) * 1993-03-10 1999-01-27 株式会社日立製作所 High breakdown voltage planar type semiconductor device
US5479031A (en) * 1993-09-10 1995-12-26 Teccor Electronics, Inc. Four layer overvoltage protection device having buried regions aligned with shorting dots to increase the accuracy of overshoot voltage value
JP2851026B2 (en) * 1993-10-05 1999-01-27 東洋電機製造株式会社 High speed diode
DE4421529C2 (en) * 1994-06-20 1996-04-18 Semikron Elektronik Gmbh Fast power diode
DE69430913D1 (en) 1994-07-25 2002-08-08 Cons Ric Microelettronica Procedure for the local reduction of the carrier lifetime
US5682044A (en) * 1995-01-31 1997-10-28 Takashige Tamamushi Reverse conducting thyristor with a planar-gate, buried-gate, or recessed-gate structure
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US6441455B1 (en) * 1997-03-06 2002-08-27 International Rectifier Corporation Low dosage field rings for high voltage semiconductor device
JPH11204452A (en) * 1998-01-13 1999-07-30 Mitsubishi Electric Corp Semiconductor substrate processing method and semiconductor substrate
US6274892B1 (en) 1998-03-09 2001-08-14 Intersil Americas Inc. Devices formable by low temperature direct bonding
US6699775B2 (en) * 2000-02-22 2004-03-02 International Rectifier Corporation Manufacturing process for fast recovery diode

Also Published As

Publication number Publication date
WO2001097258A3 (en) 2002-04-25
US20020008246A1 (en) 2002-01-24
WO2001097258A2 (en) 2001-12-20
JP2004503933A (en) 2004-02-05
US6261874B1 (en) 2001-07-17
US6603153B2 (en) 2003-08-05
DE10196161T1 (en) 2003-05-22

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