AU2001265150A1 - Fast recovery diode and method for its manufacture - Google Patents
Fast recovery diode and method for its manufactureInfo
- Publication number
- AU2001265150A1 AU2001265150A1 AU2001265150A AU6515001A AU2001265150A1 AU 2001265150 A1 AU2001265150 A1 AU 2001265150A1 AU 2001265150 A AU2001265150 A AU 2001265150A AU 6515001 A AU6515001 A AU 6515001A AU 2001265150 A1 AU2001265150 A1 AU 2001265150A1
- Authority
- AU
- Australia
- Prior art keywords
- manufacture
- fast recovery
- recovery diode
- diode
- fast
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000011084 recovery Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/045—Manufacture or treatment of PN junction diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/50—Physical imperfections
- H10D62/53—Physical imperfections the imperfections being within the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/91—Diode arrays, e.g. diode read-only memory array
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09593333 | 2000-06-14 | ||
| US09/593,333 US6261874B1 (en) | 2000-06-14 | 2000-06-14 | Fast recovery diode and method for its manufacture |
| PCT/US2001/017381 WO2001097258A2 (en) | 2000-06-14 | 2001-05-30 | Fast recovery diode and method for its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001265150A1 true AU2001265150A1 (en) | 2001-12-24 |
Family
ID=24374317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001265150A Abandoned AU2001265150A1 (en) | 2000-06-14 | 2001-05-30 | Fast recovery diode and method for its manufacture |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6261874B1 (en) |
| JP (1) | JP2004503933A (en) |
| AU (1) | AU2001265150A1 (en) |
| DE (1) | DE10196161T1 (en) |
| WO (1) | WO2001097258A2 (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7485920B2 (en) * | 2000-06-14 | 2009-02-03 | International Rectifier Corporation | Process to create buried heavy metal at selected depth |
| US6589860B1 (en) * | 2001-03-16 | 2003-07-08 | Advanced Micro Devices, Inc. | System and method for calibrating electron beam defect inspection tool |
| WO2002084745A2 (en) * | 2001-04-11 | 2002-10-24 | Silicon Wireless Corporation | Power semiconductor devices and methods of forming same |
| JP4146645B2 (en) * | 2002-01-31 | 2008-09-10 | 三菱電機株式会社 | Manufacturing method of pn junction diode and pn junction diode |
| US7238976B1 (en) * | 2004-06-15 | 2007-07-03 | Qspeed Semiconductor Inc. | Schottky barrier rectifier and method of manufacturing the same |
| EP1635397A1 (en) * | 2004-09-14 | 2006-03-15 | STMicroelectronics S.r.l. | Integrated high voltage power device having an edge termination of enhanced effectiveness |
| WO2007075996A2 (en) * | 2005-12-27 | 2007-07-05 | Qspeed Semiconductor Inc. | Apparatus and method for a fast recovery rectifier structure |
| US8669554B2 (en) | 2006-05-10 | 2014-03-11 | Ho-Yuan Yu | Fast recovery reduced p-n junction rectifier |
| US7880166B2 (en) * | 2006-05-10 | 2011-02-01 | Ho-Yuan Yu | Fast recovery reduced p-n junction rectifier |
| JP2008172145A (en) * | 2007-01-15 | 2008-07-24 | Toyota Motor Corp | Diode manufacturing method |
| JP5261324B2 (en) * | 2009-08-26 | 2013-08-14 | トヨタ自動車株式会社 | Semiconductor device and manufacturing method thereof |
| ES2374901T3 (en) * | 2009-11-09 | 2012-02-23 | Abb Technology Ag | FAST RECOVERY DIODE AND METHOD OF MANUFACTURING IT. |
| FR2960097A1 (en) * | 2010-05-11 | 2011-11-18 | St Microelectronics Tours Sas | Bidirectional protection component for use in first-conductivity type semiconductor substrate, has metallization layer covering first-conductivity type implanted zone, and isolated trench traversing epitaxy layer |
| WO2012169022A1 (en) * | 2011-06-08 | 2012-12-13 | トヨタ自動車株式会社 | Semiconductor device and method for producing same |
| KR101238232B1 (en) | 2011-09-14 | 2013-03-04 | 주식회사 시지트로닉스 | Structure and fabrication method of mhj-frd |
| EP2595126B1 (en) | 2011-11-15 | 2019-03-06 | Siemens Schweiz AG | Alarm for use in the nuclear field with a heating system for heating semiconductor elements that are not typically radiation resistant to improve functional service life |
| JP5915756B2 (en) * | 2012-08-22 | 2016-05-11 | 富士電機株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| US9123557B2 (en) | 2013-11-08 | 2015-09-01 | Sumpro Electronics Corporation | Fast recovery rectifier |
| CN105762198B (en) * | 2014-12-18 | 2019-03-12 | 江苏宏微科技股份有限公司 | Plough groove type fast recovery diode and preparation method thereof |
| CN108493108B (en) * | 2018-05-16 | 2021-02-09 | 江苏润奥电子制造股份有限公司 | Manufacturing method of high-voltage fast soft recovery diode |
| CN110660847B (en) * | 2018-06-28 | 2022-04-12 | 上海先进半导体制造有限公司 | Bipolar transistor and method of making the same |
| CN108807173B (en) * | 2018-07-11 | 2020-01-24 | 苏州达亚电子有限公司 | A kind of preparation method of fast recovery diode and fast recovery diode |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3852120A (en) * | 1973-05-29 | 1974-12-03 | Ibm | Method for manufacturing ion implanted insulated gate field effect semiconductor transistor devices |
| JPS5395581A (en) * | 1977-02-02 | 1978-08-21 | Hitachi Ltd | Manufacture for semiconductor device |
| GB8713440D0 (en) * | 1987-06-09 | 1987-07-15 | Texas Instruments Ltd | Semiconductor device |
| JPH0750791B2 (en) * | 1989-09-20 | 1995-05-31 | 株式会社日立製作所 | Semiconductor rectifier diode, power supply device using the same, and electronic computer |
| JP2570022B2 (en) * | 1991-09-20 | 1997-01-08 | 株式会社日立製作所 | Constant voltage diode, power conversion device using the same, and method of manufacturing constant voltage diode |
| JP2850694B2 (en) * | 1993-03-10 | 1999-01-27 | 株式会社日立製作所 | High breakdown voltage planar type semiconductor device |
| US5479031A (en) * | 1993-09-10 | 1995-12-26 | Teccor Electronics, Inc. | Four layer overvoltage protection device having buried regions aligned with shorting dots to increase the accuracy of overshoot voltage value |
| JP2851026B2 (en) * | 1993-10-05 | 1999-01-27 | 東洋電機製造株式会社 | High speed diode |
| DE4421529C2 (en) * | 1994-06-20 | 1996-04-18 | Semikron Elektronik Gmbh | Fast power diode |
| DE69430913D1 (en) | 1994-07-25 | 2002-08-08 | Cons Ric Microelettronica | Procedure for the local reduction of the carrier lifetime |
| US5682044A (en) * | 1995-01-31 | 1997-10-28 | Takashige Tamamushi | Reverse conducting thyristor with a planar-gate, buried-gate, or recessed-gate structure |
| JP4020987B2 (en) * | 1996-01-19 | 2007-12-12 | 信越半導体株式会社 | Silicon single crystal having no crystal defects around the wafer and its manufacturing method |
| US5739732A (en) * | 1996-01-23 | 1998-04-14 | Kit; Page Huie Man | AC noise spike suppression circuit with parallel back-to-back fast diodes |
| JP3444081B2 (en) * | 1996-02-28 | 2003-09-08 | 株式会社日立製作所 | Diode and power converter |
| US5880513A (en) * | 1996-04-18 | 1999-03-09 | Harris Corporation | Asymmetric snubber resistor |
| JPH10125896A (en) | 1996-10-16 | 1998-05-15 | Fuji Electric Co Ltd | Insulated gate thyristor |
| US6441455B1 (en) * | 1997-03-06 | 2002-08-27 | International Rectifier Corporation | Low dosage field rings for high voltage semiconductor device |
| JPH11204452A (en) * | 1998-01-13 | 1999-07-30 | Mitsubishi Electric Corp | Semiconductor substrate processing method and semiconductor substrate |
| US6274892B1 (en) | 1998-03-09 | 2001-08-14 | Intersil Americas Inc. | Devices formable by low temperature direct bonding |
| US6699775B2 (en) * | 2000-02-22 | 2004-03-02 | International Rectifier Corporation | Manufacturing process for fast recovery diode |
-
2000
- 2000-06-14 US US09/593,333 patent/US6261874B1/en not_active Expired - Lifetime
-
2001
- 2001-05-21 US US09/862,017 patent/US6603153B2/en not_active Expired - Lifetime
- 2001-05-30 WO PCT/US2001/017381 patent/WO2001097258A2/en not_active Ceased
- 2001-05-30 AU AU2001265150A patent/AU2001265150A1/en not_active Abandoned
- 2001-05-30 JP JP2002511367A patent/JP2004503933A/en active Pending
- 2001-05-30 DE DE10196161T patent/DE10196161T1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001097258A3 (en) | 2002-04-25 |
| US20020008246A1 (en) | 2002-01-24 |
| WO2001097258A2 (en) | 2001-12-20 |
| JP2004503933A (en) | 2004-02-05 |
| US6261874B1 (en) | 2001-07-17 |
| US6603153B2 (en) | 2003-08-05 |
| DE10196161T1 (en) | 2003-05-22 |
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