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AU2001266742A1 - Orbital polishing apparatus - Google Patents

Orbital polishing apparatus

Info

Publication number
AU2001266742A1
AU2001266742A1 AU2001266742A AU6674201A AU2001266742A1 AU 2001266742 A1 AU2001266742 A1 AU 2001266742A1 AU 2001266742 A AU2001266742 A AU 2001266742A AU 6674201 A AU6674201 A AU 6674201A AU 2001266742 A1 AU2001266742 A1 AU 2001266742A1
Authority
AU
Australia
Prior art keywords
polishing apparatus
orbital polishing
orbital
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001266742A
Inventor
John D. Herb
Nikolay Korovin
Stephen C. Schultz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of AU2001266742A1 publication Critical patent/AU2001266742A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2001266742A 2000-06-08 2001-06-06 Orbital polishing apparatus Abandoned AU2001266742A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59031900A 2000-06-08 2000-06-08
US09590319 2000-06-08
PCT/US2001/018351 WO2001094075A1 (en) 2000-06-08 2001-06-06 Orbital polishing apparatus

Publications (1)

Publication Number Publication Date
AU2001266742A1 true AU2001266742A1 (en) 2001-12-17

Family

ID=24361775

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001266742A Abandoned AU2001266742A1 (en) 2000-06-08 2001-06-06 Orbital polishing apparatus

Country Status (7)

Country Link
US (1) US20030077986A1 (en)
JP (1) JP2004505435A (en)
KR (1) KR20030007928A (en)
AU (1) AU2001266742A1 (en)
DE (1) DE10196317T1 (en)
GB (1) GB2379626A (en)
WO (1) WO2001094075A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
TW201029807A (en) * 2009-02-06 2010-08-16 Inotera Memories Inc A pressure control system for a wafer polish machine
DE102009030294B4 (en) * 2009-06-24 2013-04-25 Siltronic Ag Process for polishing the edge of a semiconductor wafer
TWI530360B (en) * 2012-09-28 2016-04-21 荏原製作所股份有限公司 Grinding device
KR102540042B1 (en) 2021-06-30 2023-06-05 (주)피엔피 Front-facing Camera Front Area of Encap Glass Polishing Device OLED Display Pannel
CN115383622B (en) * 2022-04-20 2024-08-27 北京晶亦精微科技股份有限公司 Split universal joint for polishing head and polishing device

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5635083A (en) * 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
JP3311116B2 (en) * 1993-10-28 2002-08-05 株式会社東芝 Semiconductor manufacturing equipment
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
JPH07241764A (en) * 1994-03-04 1995-09-19 Fujitsu Ltd Polishing device and polishing method
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP3734878B2 (en) * 1996-04-25 2006-01-11 不二越機械工業株式会社 Wafer polishing equipment
JPH11156704A (en) * 1997-11-21 1999-06-15 Ebara Corp Substrate polishing equipment
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
DE19651761A1 (en) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Method and device for polishing semiconductor wafers
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US5882243A (en) * 1997-04-24 1999-03-16 Motorola, Inc. Method for polishing a semiconductor wafer using dynamic control
JP3027551B2 (en) * 1997-07-03 2000-04-04 キヤノン株式会社 Substrate holding device, polishing method and polishing device using the substrate holding device
JPH11226865A (en) * 1997-12-11 1999-08-24 Speedfam Co Ltd Carrier and CMP equipment
JP2907209B1 (en) * 1998-05-29 1999-06-21 日本電気株式会社 Back pad for wafer polishing equipment
US6093089A (en) * 1999-01-25 2000-07-25 United Microelectronics Corp. Apparatus for controlling uniformity of polished material
US6050882A (en) * 1999-06-10 2000-04-18 Applied Materials, Inc. Carrier head to apply pressure to and retain a substrate

Also Published As

Publication number Publication date
JP2004505435A (en) 2004-02-19
WO2001094075A1 (en) 2001-12-13
GB0227538D0 (en) 2002-12-31
US20030077986A1 (en) 2003-04-24
KR20030007928A (en) 2003-01-23
GB2379626A (en) 2003-03-19
DE10196317T1 (en) 2003-11-13

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