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AU2001240989A1 - Single camera alignment system using up/down optics - Google Patents

Single camera alignment system using up/down optics

Info

Publication number
AU2001240989A1
AU2001240989A1 AU2001240989A AU4098901A AU2001240989A1 AU 2001240989 A1 AU2001240989 A1 AU 2001240989A1 AU 2001240989 A AU2001240989 A AU 2001240989A AU 4098901 A AU4098901 A AU 4098901A AU 2001240989 A1 AU2001240989 A1 AU 2001240989A1
Authority
AU
Australia
Prior art keywords
alignment system
single camera
camera alignment
down optics
optics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001240989A
Inventor
Ernest Fischer
Edison T. Hudson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infotech AG
Original Assignee
Infotech AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infotech AG filed Critical Infotech AG
Publication of AU2001240989A1 publication Critical patent/AU2001240989A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)
AU2001240989A 2000-03-10 2001-03-09 Single camera alignment system using up/down optics Abandoned AU2001240989A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18835900P 2000-03-10 2000-03-10
US60188359 2000-03-10
PCT/IB2001/000453 WO2001067838A2 (en) 2000-03-10 2001-03-09 Single camera alignment system using up/down optics

Publications (1)

Publication Number Publication Date
AU2001240989A1 true AU2001240989A1 (en) 2001-09-17

Family

ID=22692804

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001240989A Abandoned AU2001240989A1 (en) 2000-03-10 2001-03-09 Single camera alignment system using up/down optics

Country Status (4)

Country Link
US (1) US20020030736A1 (en)
EP (1) EP1264524A2 (en)
AU (1) AU2001240989A1 (en)
WO (1) WO2001067838A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4527717B2 (en) * 2003-03-28 2010-08-18 アッセンブレオン エヌ ヴィ Method and system for mounting at least one component on at least one substrate
CH698718B1 (en) 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag A device for mounting a flip chip on a substrate.
US8063975B2 (en) * 2008-10-29 2011-11-22 Jabil Circuit, Inc. Positioning wafer lenses on electronic imagers
US8319831B2 (en) * 2009-03-25 2012-11-27 Fuji Xerox Co., Ltd. Component manipulating method, component extracting method, component assembling method, component manipulating apparatus, component extracting apparatus, and component assembling apparatus
DE102011077962B4 (en) 2010-09-27 2016-01-07 Xenon Automatisierungstechnik Gmbh Device for 3-D processing of components
US10312118B2 (en) * 2014-01-16 2019-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Bonding apparatus and method
JP6689301B2 (en) * 2016-02-18 2020-04-28 株式会社Ｆｕｊｉ Component determination device and component determination method
CN105914171B (en) * 2016-05-31 2018-11-06 广东工业大学 A kind of machine vision flight system
JP6930517B2 (en) * 2018-12-21 2021-09-01 オムロン株式会社 Alignment device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182718A (en) * 1982-04-20 1983-10-25 Datsuku Eng Kk Positioning device
DE69116709T2 (en) * 1990-03-19 1997-02-06 Hitachi Ltd Device and method for transporting components
US5172468A (en) * 1990-08-22 1992-12-22 Sony Corporation Mounting apparatus for electronic parts
WO1997002708A1 (en) * 1995-06-30 1997-01-23 Precision Assembly Systems, Inc. Automated system for placement of components

Also Published As

Publication number Publication date
EP1264524A2 (en) 2002-12-11
WO2001067838A2 (en) 2001-09-13
US20020030736A1 (en) 2002-03-14
WO2001067838A3 (en) 2001-12-20

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