ATE66969T1 - Galvanisierungseinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. - Google Patents
Galvanisierungseinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten.Info
- Publication number
- ATE66969T1 ATE66969T1 AT88100684T AT88100684T ATE66969T1 AT E66969 T1 ATE66969 T1 AT E66969T1 AT 88100684 T AT88100684 T AT 88100684T AT 88100684 T AT88100684 T AT 88100684T AT E66969 T1 ATE66969 T1 AT E66969T1
- Authority
- AT
- Austria
- Prior art keywords
- route
- travel
- electrolyte
- plate
- circuit boards
- Prior art date
Links
- 238000005246 galvanizing Methods 0.000 title 1
- 239000003792 electrolyte Substances 0.000 abstract 3
- 239000008151 electrolyte solution Substances 0.000 abstract 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3702229 | 1987-01-26 | ||
| EP88100684A EP0276725B1 (de) | 1987-01-26 | 1988-01-19 | Galvanisierungseinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten |
| DE3823072A DE3823072A1 (de) | 1987-01-26 | 1988-07-07 | Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE66969T1 true ATE66969T1 (de) | 1991-09-15 |
Family
ID=39387448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT88100684T ATE66969T1 (de) | 1987-01-26 | 1988-01-19 | Galvanisierungseinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. |
Country Status (2)
| Country | Link |
|---|---|
| AT (1) | ATE66969T1 (de) |
| DE (1) | DE3823072A1 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4437848C1 (de) * | 1994-10-22 | 1996-01-18 | Bosch Gmbh Robert | Vorrichtung zur kontinuierlichen Galvanisierung von ebenen Werkstücken und deren Verwendung |
| DE19717512C3 (de) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
| DE10206660C1 (de) * | 2002-02-12 | 2003-07-24 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum Transport von flachem Behandlungsgut in Durchlaufanlagen |
| DE102012221012B4 (de) | 2012-11-16 | 2023-01-19 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur Behandlung von flachem Behandlungsgut |
-
1988
- 1988-01-19 AT AT88100684T patent/ATE66969T1/de not_active IP Right Cessation
- 1988-07-07 DE DE3823072A patent/DE3823072A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| DE3823072A1 (de) | 1990-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE82335T1 (de) | Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. | |
| DE60226196T2 (de) | Zinn-Plattieren | |
| ATE66969T1 (de) | Galvanisierungseinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. | |
| CN113355721B (zh) | 一种电镀喷流系统 | |
| JPS63192894A (ja) | プレート状加工物用電気めつき装置 | |
| JPH02107793A (ja) | 水性電気メッキ浴 | |
| US4994155A (en) | High speed tin, lead or tin/lead alloy electroplating | |
| US3471271A (en) | Electrodeposition of a micro-cracked corrosion resistant nickel-chromium plate | |
| EP0319997A1 (de) | Zinn-, Blei- und Zinn-Blei-Legierungs-Elektrolyten für Elekroplattieren bei hoher Geschwindigkeit | |
| CN108315808A (zh) | 一种电镀生产设备 | |
| EP1091023A2 (de) | Legierungszusammensetzung und Plattierungsverfahren | |
| KR100801908B1 (ko) | 구리 조 및 매트한 구리 코팅의 침착 방법 | |
| CA2079033A1 (en) | Electroplating means for perforated printed circuit boards to be treated in a horizontal pass | |
| CN210596303U (zh) | 一种pcb镀金槽阳极组件 | |
| NO900801D0 (no) | Forbedringer av aluminiumsmeltende celler. | |
| CN208167143U (zh) | 一种电镀生产设备 | |
| JPS56119792A (en) | Electroplating method | |
| CN2525104Y (zh) | 阳极装置改良结构 | |
| JPS6013096A (ja) | 高速電鍍方法及びそのための装置 | |
| CN211814679U (zh) | 一种电泳槽组件 | |
| JPS56158891A (en) | Electrolytic treatment of strip metallic plate | |
| CN209854270U (zh) | 一种电镀挂架 | |
| DE3804070A1 (de) | Galvanisieranlage fuer leiterplatten | |
| CN101935860A (zh) | 表面设有包胶的电镀夹头 | |
| JPH0243399A (ja) | 電気めっき槽 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| REN | Ceased due to non-payment of the annual fee |