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AR002312A1 - Procedimiento y dispositivo de soldadura por oleadas, integrada con una operación de pre-acondicionamiento superficial por via seca. - Google Patents

Procedimiento y dispositivo de soldadura por oleadas, integrada con una operación de pre-acondicionamiento superficial por via seca.

Info

Publication number
AR002312A1
AR002312A1 ARP960102917A AR10291796A AR002312A1 AR 002312 A1 AR002312 A1 AR 002312A1 AR P960102917 A ARP960102917 A AR P960102917A AR 10291796 A AR10291796 A AR 10291796A AR 002312 A1 AR002312 A1 AR 002312A1
Authority
AR
Argentina
Prior art keywords
gas
circuit
procedure
integrated
conditioning operation
Prior art date
Application number
ARP960102917A
Other languages
English (en)
Inventor
Thierry Sindzingre
Stephane Rabia
Nicolas Potier
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide filed Critical Air Liquide
Publication of AR002312A1 publication Critical patent/AR002312A1/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Arc Welding In General (AREA)
  • Furnace Details (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

La invención se refiere a un procedimiento para la soldadura por oleadas, de un circuito mediante una aleción de soldadura, en el transcurso del cual sepone en contacto el circuito con por lo menos una oleada de material líquido de soldadura,obten ida por bombeo de un bano líquido de la aleación de soldadura,contenida en un recipiente, a través de una tobera o boquilla, caracterizado porque previamente cada una de las caras del circuito ha sido traída, bajo unapresión atmosférica,frente a la salida del gas de por lo menos un aparato para la formación de especies gaseosas, excitadas o inestables, en el cual aparatose hace pasar una mezcla gaseosa inicial (7) que comprende un gas inerte y/o un gas reductor y/o un gas oxidante,obtenién ndose a la salida del gas del aparato,una mezcla gaseosa primaria (8) que comprende especies excitadas o inestables y que está sustancialmente desprovista de especies eléctricamente cargadas.
ARP960102917A 1995-06-09 1996-06-05 Procedimiento y dispositivo de soldadura por oleadas, integrada con una operación de pre-acondicionamiento superficial por via seca. AR002312A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9506818A FR2735053B1 (fr) 1995-06-09 1995-06-09 Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche

Publications (1)

Publication Number Publication Date
AR002312A1 true AR002312A1 (es) 1998-03-11

Family

ID=9479786

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP960102917A AR002312A1 (es) 1995-06-09 1996-06-05 Procedimiento y dispositivo de soldadura por oleadas, integrada con una operación de pre-acondicionamiento superficial por via seca.

Country Status (17)

Country Link
US (1) US5722581A (es)
EP (1) EP0747160B1 (es)
JP (1) JP3313972B2 (es)
KR (1) KR100321354B1 (es)
CN (1) CN1095316C (es)
AR (1) AR002312A1 (es)
AU (1) AU712613B2 (es)
BR (1) BR9602725A (es)
CA (1) CA2178465C (es)
DE (1) DE69603418T2 (es)
DK (1) DK0747160T3 (es)
ES (1) ES2136376T3 (es)
FR (1) FR2735053B1 (es)
GR (1) GR3031181T3 (es)
MX (1) MX9601752A (es)
TW (1) TW307092B (es)
ZA (1) ZA964623B (es)

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DE19749187A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Lötvorrichtung
DE19749185A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Mit einer Gasversorgung verbindbare Gasverteilung
FR2778190B1 (fr) * 1998-05-04 2000-06-02 Air Liquide Procede et appareil de traitement de surfaces metalliques par voie seche
DE19825423A1 (de) * 1998-06-06 1999-12-09 Alcatel Sa Vorrichtung zur Herstellung eines optischen Kabels
US6315189B1 (en) * 1998-10-13 2001-11-13 Texas Instruments Incorporated Semiconductor package lead plating method and apparatus
US6354481B1 (en) * 1999-02-18 2002-03-12 Speedline Technologies, Inc. Compact reflow and cleaning apparatus
US6468833B2 (en) 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
JP2002080950A (ja) * 2000-09-07 2002-03-22 Senju Metal Ind Co Ltd ドロスから酸化物を分離する方法および噴流はんだ槽
WO2002028586A1 (de) * 2000-10-06 2002-04-11 Pac Tech - Packaging Technologies Gmbh Verfahren zum flussmittelfreien aufbringen eines lötmittels auf ein substrat oder einen chip
US6776330B2 (en) 2001-09-10 2004-08-17 Air Products And Chemicals, Inc. Hydrogen fluxless soldering by electron attachment
JP4409134B2 (ja) * 2001-10-09 2010-02-03 パナソニック株式会社 実装システム
US20080190558A1 (en) * 2002-04-26 2008-08-14 Accretech Usa, Inc. Wafer processing apparatus and method
US6936546B2 (en) * 2002-04-26 2005-08-30 Accretech Usa, Inc. Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates
US20080011332A1 (en) * 2002-04-26 2008-01-17 Accretech Usa, Inc. Method and apparatus for cleaning a wafer substrate
US20080017316A1 (en) * 2002-04-26 2008-01-24 Accretech Usa, Inc. Clean ignition system for wafer substrate processing
US8361340B2 (en) 2003-04-28 2013-01-29 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
CA2465195C (en) * 2003-04-28 2012-06-19 Air Products And Chemicals, Inc. Electrode assembly for the removal of surface oxides by electron attachment
US7079370B2 (en) * 2003-04-28 2006-07-18 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
US7897029B2 (en) * 2008-03-04 2011-03-01 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US7387738B2 (en) 2003-04-28 2008-06-17 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment for wafer bumping applications
KR100918227B1 (ko) * 2005-04-06 2009-09-21 센주긴조쿠고교 가부시키가이샤 분류 땜납조
US7434719B2 (en) * 2005-12-09 2008-10-14 Air Products And Chemicals, Inc. Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment
DE102006024192A1 (de) * 2006-05-23 2007-11-29 Linde Ag Vorrichtung und Verfahren zum Wellenlöten
DE102006027027A1 (de) 2006-06-08 2007-12-13 Centrotherm Thermal Solutions Gmbh + Co.Kg Lötverfahren
US8567658B2 (en) * 2009-07-20 2013-10-29 Ontos Equipment Systems, Inc. Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds
US8454850B2 (en) 2009-09-02 2013-06-04 Air Products And Chemicals, Inc. Method for the removal of surface oxides by electron attachment
US8651360B2 (en) * 2011-01-17 2014-02-18 Orthodyne Electronics Corporation Systems and methods for processing ribbon and wire in ultrasonic bonding systems
US9006975B2 (en) 2011-02-09 2015-04-14 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment
US9053894B2 (en) 2011-02-09 2015-06-09 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment
JP2014157858A (ja) * 2013-02-14 2014-08-28 Fuji Electric Co Ltd 半導体装置の製造方法
KR102124042B1 (ko) * 2013-02-18 2020-06-18 삼성디스플레이 주식회사 기상 증착 장치, 이를 이용한 증착 방법 및 유기 발광 표시 장치 제조 방법
CN104425289B (zh) * 2013-09-11 2017-12-15 先进科技新加坡有限公司 利用激发的混合气体的晶粒安装装置和方法
KR20170106300A (ko) 2014-11-12 2017-09-20 온토스 이큅먼트 시스템즈 포토레지스트 표면 및 금속 표면을 준비하는 동시 친수화: 방법, 시스템, 및 생성물
KR20190058228A (ko) 2017-11-20 2019-05-29 (주)케이티엔에프 웨이브 솔더링 공정에서 피씨비(pcb)의 과열을 방지할 수 있는 웨이브 지그 및 이를 이용한 웨이브 솔더링 방법

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US5525204A (en) * 1994-09-29 1996-06-11 Motorola, Inc. Method for fabricating a printed circuit for DCA semiconductor chips

Also Published As

Publication number Publication date
EP0747160A2 (fr) 1996-12-11
JPH09122904A (ja) 1997-05-13
CA2178465C (fr) 2002-10-29
AU712613B2 (en) 1999-11-11
KR970003390A (ko) 1997-01-28
CA2178465A1 (fr) 1996-12-10
AU5583396A (en) 1996-12-19
DE69603418T2 (de) 2000-02-03
DK0747160T3 (da) 1999-12-13
GR3031181T3 (en) 1999-12-31
KR100321354B1 (ko) 2002-07-06
CN1143892A (zh) 1997-02-26
FR2735053B1 (fr) 1997-07-25
ES2136376T3 (es) 1999-11-16
MX9601752A (es) 1998-04-30
CN1095316C (zh) 2002-11-27
ZA964623B (en) 1996-12-12
FR2735053A1 (fr) 1996-12-13
TW307092B (es) 1997-06-01
US5722581A (en) 1998-03-03
JP3313972B2 (ja) 2002-08-12
HK1013039A1 (en) 1999-08-13
EP0747160B1 (fr) 1999-07-28
BR9602725A (pt) 1998-09-08
DE69603418D1 (de) 1999-09-02
EP0747160A3 (fr) 1997-02-12

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