NO961166D0 - Kjölelegeme for halvlederkomponenter o.l. - Google Patents

Kjölelegeme for halvlederkomponenter o.l.

Info

Publication number: NO961166D0
Authority: NO; Norway
Prior art keywords: cooling; base plate; insertion slot; fin; heat sink
Prior art date: 1995-03-24

Application number

NO961166A

Other languages

English (en)

Other versions

NO961166L (no

Inventor

Uwe Bock

Original Assignee

Alusuisse Lonza Services Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-03-24

Filing date

1996-03-22

Publication date

1996-03-22

1996-03-22 Application filed by Alusuisse Lonza Services Ag filed Critical Alusuisse Lonza Services Ag

1996-03-22 Publication of NO961166D0 publication Critical patent/NO961166D0/no

1996-09-25 Publication of NO961166L publication Critical patent/NO961166L/no

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
- H10W40/22—
- H10W40/226—
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Catalysts (AREA)
Physical Or Chemical Processes And Apparatus (AREA)
Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

NO961166A 1995-03-24 1996-03-22 Kjölelegeme for halvlederkomponenter o.l. NO961166L (no)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE29505000		1995-03-24

Publications (2)

Publication Number	Publication Date
NO961166D0 true NO961166D0 (no)	1996-03-22
NO961166L NO961166L (no)	1996-09-25

Family

ID=8005817

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO961166A NO961166L (no)	1995-03-24	1996-03-22	Kjölelegeme for halvlederkomponenter o.l.

Country Status (7)

Country	Link
US (1)	US5682948A (no)
EP (1)	EP0734062B1 (no)
AT (1)	ATE206245T1 (no)
DE (2)	DE29602367U1 (no)
DK (1)	DK0734062T3 (no)
ES (1)	ES2161340T3 (no)
NO (1)	NO961166L (no)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6009937A (en) *	1995-12-20	2000-01-04	Hoogovens Aluminium Profiltechnik Gmbh	Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
US6009938A (en) *	1997-12-11	2000-01-04	Eastman Kodak Company	Extruded, tiered high fin density heat sinks and method of manufacture
EP1239359A4 (en) *	1999-06-11	2007-12-12	Jiung-Jung Wang	THE HEAT RADIATION OF A PORTABLE CALCULATOR CPU
JP4355412B2 (ja) *	1999-11-26	2009-11-04	昭和電工株式会社	ヒートシンクおよびその製造方法
DE10058574B4 (de) *	2000-11-24	2005-09-15	Danfoss Drives A/S	Kühlgerät für Leistungshalbleiter
US6604575B1 (en) *	2002-08-30	2003-08-12	Southeastern Univer. Research Assn. Inc.	Heat exchange apparatus
CN2701072Y (zh) *	2004-04-29	2005-05-18	鸿富锦精密工业（深圳）有限公司	散热装置
CN2783219Y (zh) *	2004-11-24	2006-05-24	温耀生	热电制冷模块
US8499824B2 (en) *	2005-10-04	2013-08-06	Elektronische Bauelemente Gesellschaft M.B.H.	Heat sink
DE102006038980B4 (de) *	2006-08-21	2009-02-19	Alcan Technology & Management Ag	Kühlkörper für Halbleiterbauelemente sowie Verfahren zu seiner Herstellung
US8498116B2 (en) *	2010-07-16	2013-07-30	Rockwell Automation Technologies, Inc.	Heat sink for power circuits
US9279625B2 (en)	2013-10-29	2016-03-08	Caterpillar Inc.	Heat sink device for power modules of power converter assembly
CN109578160A (zh) *	2019-01-07	2019-04-05	浙江康思特动力机械有限公司	带有强制冷却风道的通用汽油机曲轴箱体
US11280559B2 (en) *	2020-05-12	2022-03-22	Hanon Systems	Dumbbell shaped plate fin
JP7800168B2 (ja) *	2022-01-31	2026-01-16	日本軽金属株式会社	ヒートシンク

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2502472C2 (de) *	1975-01-22	1982-09-02	Siemens AG, 1000 Berlin und 8000 München	Kühlkörper für Thyristoren
JPS5846660A (ja) *	1981-09-15	1983-03-18	Nippon Light Metal Co Ltd	ヒ−トシンクの製造法
DE8429523U1 (de) *	1984-10-08	1984-11-29	Nixdorf Computer Ag, 4790 Paderborn	Kühlkörper für elektronische Bauelemente und/oder Geräte
DE3518310A1 (de) *	1985-05-22	1986-11-27	Aluminium-Walzwerke Singen Gmbh, 7700 Singen	Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
US4953058A (en) *	1989-09-01	1990-08-28	General Dynamics Corporation, Space Systems Div.	Modular segment adapted to provide a passively cooled housing for heat generating electronic modules
DE59106364D1 (de) *	1990-10-24	1995-10-05	Alusuisse Lonza Services Ag	Kühlkörper für Halbleiterbauelemente.
JP3122173B2 (ja) *	1990-11-09	2001-01-09	株式会社東芝	放熱器、放熱装置および放熱器の製造方法
JPH05259673A (ja) *	1992-03-11	1993-10-08	Fujitsu Ltd	電子ユニットの冷却構造
DE4314663A1 (de) *	1993-05-04	1994-11-10	Alusuisse Lonza Services Ag	Kühlkörper für Halbleiterbauelemente
DE9409517U1 (de) *	1994-06-13	1994-07-28	Siemens AG, 80333 München	Kühlkörper

1996
- 1996-02-10 DE DE29602367U patent/DE29602367U1/de not_active Expired - Lifetime
- 1996-02-20 US US08/603,579 patent/US5682948A/en not_active Expired - Lifetime
- 1996-03-14 EP EP96810159A patent/EP0734062B1/de not_active Expired - Lifetime
- 1996-03-14 AT AT96810159T patent/ATE206245T1/de not_active IP Right Cessation
- 1996-03-14 DE DE59607745T patent/DE59607745D1/de not_active Expired - Fee Related
- 1996-03-14 DK DK96810159T patent/DK0734062T3/da active
- 1996-03-14 ES ES96810159T patent/ES2161340T3/es not_active Expired - Lifetime
- 1996-03-22 NO NO961166A patent/NO961166L/no unknown

Also Published As

Publication number	Publication date
DE59607745D1 (de)	2001-10-31
EP0734062B1 (de)	2001-09-26
ATE206245T1 (de)	2001-10-15
US5682948A (en)	1997-11-04
EP0734062A3 (de)	1997-05-28
EP0734062A2 (de)	1996-09-25
DE29602367U1 (de)	1996-05-15
NO961166L (no)	1996-09-25
DK0734062T3 (da)	2002-01-21
ES2161340T3 (es)	2001-12-01

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