[go: up one dir, main page]

MY7900005A - Gold plating electrolyte and method of electrodepositing gold in the production of semi conductor device - Google Patents

Gold plating electrolyte and method of electrodepositing gold in the production of semi conductor device

Info

Publication number
MY7900005A
MY7900005A MY19795A MY7900005A MY7900005A MY 7900005 A MY7900005 A MY 7900005A MY 19795 A MY19795 A MY 19795A MY 7900005 A MY7900005 A MY 7900005A MY 7900005 A MY7900005 A MY 7900005A
Authority
MY
Malaysia
Prior art keywords
plating
gold
substrates
alkali metal
production
Prior art date
Application number
MY19795A
Inventor
Roy Mason David
Blair Alan
Stuart Stevenson John
Original Assignee
Engelhard Industries Limited.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Industries Limited. filed Critical Engelhard Industries Limited.
Publication of MY7900005A publication Critical patent/MY7900005A/en

Links

Classifications

    • H10W72/013
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • H10W72/073
    • H10W72/07336

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1506380 Gold electro-plating ENGELHARD INDUSTRIES Ltd 21 Nov 1975 [4 Dec 1974] 52520/74 Heading C7B An aqueous gold plating electrolyte solution, for plating Ni-Fe substrates, e.g. transistor headers or integrated circuit flat pack lead frames employed in producing semi-conductor devices, to permit bonding of Ge or Si chips or slices to the substrates, consists of water, Au e.g. 1 to 100 g/l as an alkali metal (preferably K) Au(CN) 2 , at least one conducting compound e.g. in total 1 to 200 g/l selected from alkali metal (e.g. Na or K) acetate, (tetra or meta) borate, orthophosphate, nitrate sulphamate, sulphate, tartrate, thiocyanate, thiosulphate and boric acid, and if required a buffer salt e.g. 1 to 200 g/l K or ammonium H 2 PO 4 . Preferably the solution has a pH 4 to 8 and density 2 to 12 degrees BÚ. Plating may be effected at a cathode CD of 1 to 2000 ASF and at 20 to 90‹C with vigorous agitation. The electrolyte may be applied only to selected areas of the substrate as a high velocity jet.
MY19795A 1974-12-04 1979-12-31 Gold plating electrolyte and method of electrodepositing gold in the production of semi conductor device MY7900005A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB52520/74A GB1506380A (en) 1974-12-04 1974-12-04 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices

Publications (1)

Publication Number Publication Date
MY7900005A true MY7900005A (en) 1979-12-31

Family

ID=10464233

Family Applications (1)

Application Number Title Priority Date Filing Date
MY19795A MY7900005A (en) 1974-12-04 1979-12-31 Gold plating electrolyte and method of electrodepositing gold in the production of semi conductor device

Country Status (14)

Country Link
JP (1) JPS5198639A (en)
AT (1) ATA908275A (en)
BE (1) BE836293A (en)
CH (1) CH606505A5 (en)
DE (1) DE2554583A1 (en)
DK (1) DK545375A (en)
ES (1) ES443389A1 (en)
FR (1) FR2293500A1 (en)
GB (1) GB1506380A (en)
HK (1) HK73378A (en)
IT (1) IT1052476B (en)
MY (1) MY7900005A (en)
NL (1) NL7513699A (en)
SE (1) SE7513620L (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4465564A (en) * 1983-06-27 1984-08-14 American Chemical & Refining Company, Inc. Gold plating bath containing tartrate and carbonate salts

Also Published As

Publication number Publication date
IT1052476B (en) 1981-06-20
FR2293500B1 (en) 1980-08-01
CH606505A5 (en) 1978-10-31
ES443389A1 (en) 1977-05-01
SE7513620L (en) 1976-06-08
BE836293A (en) 1976-06-04
NL7513699A (en) 1976-06-09
ATA908275A (en) 1978-10-15
JPS5198639A (en) 1976-08-31
DK545375A (en) 1976-06-05
AU8674075A (en) 1977-05-26
GB1506380A (en) 1978-04-05
FR2293500A1 (en) 1976-07-02
HK73378A (en) 1978-12-22
DE2554583A1 (en) 1976-06-10

Similar Documents

Publication Publication Date Title
US4880464A (en) Electroless gold plating solution
DE69524011T2 (en) Process for refreshing electroless gold plating baths
GB1370387A (en) Electrochemical solutions and process
US4681670A (en) Bath and process for plating tin-lead alloys
EP0198038B1 (en) Bath and process for plating tin/lead alloys on composite substrates
US6767392B2 (en) Displacement gold plating solution
CA1202273A (en) Gold plating process
MY7900005A (en) Gold plating electrolyte and method of electrodepositing gold in the production of semi conductor device
US3506462A (en) Electroless gold plating solutions
SE8002598L (en) SILVER AND SILVER / GOLD PLATING BATH
GB1304424A (en)
GB1051383A (en)
US4207149A (en) Gold electroplating solutions and processes
US2783194A (en) Iodate-containing plating baths
JPH01239856A (en) Gold plating of electronic component of semiconductor integrated circuit
JP2954214B2 (en) Manufacturing method of gold plated conductor
GB1506496A (en) Gold plating baths
GB1156186A (en) Gold Plating
GB1375611A (en)
US3032484A (en) Jet plating method of manufacture of micro-alloy transistors
JPH1136094A (en) Gold plating solution and gold plating method
JPS63307293A (en) Gold electroplating solution
GB1199421A (en) Method of Producing Thin Ferromagnetic Layers.
JPS6379976A (en) Electroless gold plating solution
GB1188694A (en) Method of Making a Semiconductor Device