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MY193145A - Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same - Google Patents

Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same

Info

Publication number
MY193145A
MY193145A MYPI2019004109A MYPI2019004109A MY193145A MY 193145 A MY193145 A MY 193145A MY PI2019004109 A MYPI2019004109 A MY PI2019004109A MY PI2019004109 A MYPI2019004109 A MY PI2019004109A MY 193145 A MY193145 A MY 193145A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
adhesive sheet
producing
mentioned above
same
Prior art date
Application number
MYPI2019004109A
Other languages
English (en)
Inventor
Yasufumi Kondou
Takamasa Ichikawa
Shouji IWASAKI
Wenfeng Fu
Yuuki Matsunaga
Original Assignee
Tomoegawa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Co Ltd filed Critical Tomoegawa Co Ltd
Publication of MY193145A publication Critical patent/MY193145A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H10W72/00—
    • H10W74/01—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H10W72/0198—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Engineering & Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
MYPI2019004109A 2017-02-02 2018-02-01 Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same MY193145A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017017490A JP6956492B2 (ja) 2017-02-02 2017-02-02 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法
PCT/JP2018/003406 WO2018143343A1 (ja) 2017-02-02 2018-02-01 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法

Publications (1)

Publication Number Publication Date
MY193145A true MY193145A (en) 2022-09-26

Family

ID=63040829

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019004109A MY193145A (en) 2017-02-02 2018-02-01 Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same

Country Status (7)

Country Link
JP (1) JP6956492B2 (zh)
KR (1) KR102424574B1 (zh)
CN (1) CN110214168B (zh)
MY (1) MY193145A (zh)
SG (1) SG11201906503UA (zh)
TW (1) TWI770112B (zh)
WO (1) WO2018143343A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6909171B2 (ja) * 2018-02-12 2021-07-28 株式会社巴川製紙所 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法
JP7187906B2 (ja) * 2018-09-10 2022-12-13 昭和電工マテリアルズ株式会社 半導体装置の製造方法
CN110982156B (zh) * 2019-12-24 2022-10-04 海隆石油产品技术服务（上海）有限公司 一种易粘结高填充聚烯烃板材及其制备方法和应用
CN116848635A (zh) * 2021-02-16 2023-10-03 株式会社巴川制纸所 半导体装置制造用粘接片及使用该半导体装置制造用粘接片的半导体装置的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3779601B2 (ja) 2001-11-28 2006-05-31 株式会社巴川製紙所 半導体装置組立用マスクシート
JP2004182804A (ja) * 2002-12-02 2004-07-02 Mitsui Chemicals Inc 樹脂組成物及びそれよりなるフィルム状接着剤
JP4319892B2 (ja) 2003-11-07 2009-08-26 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法
JP2008095014A (ja) * 2006-10-13 2008-04-24 Tomoegawa Paper Co Ltd Ｑｆｎ用熱硬化型樹脂組成物および接着シート
CN105981138B (zh) * 2014-02-14 2018-12-28 三井化学东赛璐株式会社 半导体晶片表面保护用粘着膜、以及使用粘着膜的半导体晶片的保护方法和半导体装置的制造方法

Also Published As

Publication number Publication date
TWI770112B (zh) 2022-07-11
JP6956492B2 (ja) 2021-11-02
KR102424574B1 (ko) 2022-07-25
CN110214168A (zh) 2019-09-06
JP2018123254A (ja) 2018-08-09
SG11201906503UA (en) 2019-08-27
TW201840770A (zh) 2018-11-16
WO2018143343A1 (ja) 2018-08-09
KR20190111911A (ko) 2019-10-02
CN110214168B (zh) 2025-12-02

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