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MY171200A - Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package - Google Patents

Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package

Info

Publication number
MY171200A
MY171200A MYPI2014703152A MYPI2014703152A MY171200A MY 171200 A MY171200 A MY 171200A MY PI2014703152 A MYPI2014703152 A MY PI2014703152A MY PI2014703152 A MYPI2014703152 A MY PI2014703152A MY 171200 A MY171200 A MY 171200A
Authority
MY
Malaysia
Prior art keywords
film adhesive
silica filler
epoxy resin
spherical silica
semiconductor package
Prior art date
Application number
MYPI2014703152A
Inventor
Minoru Morita
Hiroyuki Yano
Shinji Ohira
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY171200A publication Critical patent/MY171200A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H10W72/013—
    • H10W72/073—
    • H10W72/30—
    • H10W74/473—
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H10W72/075—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Die Bonding (AREA)

Abstract

A method for producing a film adhesive composition which comprises an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a surface-treated spherical silica filler (D) obtained by subjecting a 10 spherical silica filler having an average particle diameter of 0.01 to 2.0 ~m to a surface treatment with a silane coupling agent, and which has a content of the surface-treated spherical 15 silica filler (D) of 30 to 70% by mass relative to a total amount of the epoxy resin (A), the epoxy resin curing agent (B), the phenoxy resin (C), and the surface-treated spherical silica filler (D), an elastic modulus at 200?C after thermal curing 20 of 20 to 3000 MPa, a saturated water absorption rate after thermal curing of 1.5% by mass or less, the method comprising: a step of obtaining a surface-treated spherical silica filler dispersion liquid by dispersing the surface-treated spherical silica filler (0) in an organic solvent; and a step of obtaining the film adhesive composition by mixing the surface-treated spherical silica filler dispersion liquid with the epoxy resin (A), the epoxy resin curing agent (B), and the phenoxy resin (C).
MYPI2014703152A 2012-04-26 2013-04-24 Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package MY171200A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012100831 2012-04-26

Publications (1)

Publication Number Publication Date
MY171200A true MY171200A (en) 2019-10-01

Family

ID=49483172

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014703152A MY171200A (en) 2012-04-26 2013-04-24 Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package

Country Status (8)

Country Link
JP (1) JP6239500B2 (en)
KR (1) KR101704891B1 (en)
CN (1) CN104245874B (en)
MY (1) MY171200A (en)
PH (1) PH12014502374A1 (en)
SG (1) SG11201406941TA (en)
TW (1) TWI513787B (en)
WO (1) WO2013161864A1 (en)

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Publication number Priority date Publication date Assignee Title
JP6013406B2 (en) * 2014-07-24 2016-10-25 株式会社タムラ製作所 Adhesive composition and method for joining electronic parts
JP5901715B1 (en) * 2014-09-05 2016-04-13 古河電気工業株式会社 Film adhesive, semiconductor package using film adhesive, and manufacturing method thereof
US9324601B1 (en) 2014-11-07 2016-04-26 International Business Machines Corporation Low temperature adhesive resins for wafer bonding
JP6476517B2 (en) * 2015-02-02 2019-03-06 ナミックス株式会社 Film adhesive and semiconductor device using the same
JP2016219619A (en) * 2015-05-21 2016-12-22 日東電工株式会社 Adhesive sheet, dicing tape integrated adhesive sheet, film, method for manufacturing semiconductor device, and semiconductor device
JP6858520B2 (en) * 2015-09-30 2021-04-14 日東電工株式会社 Sheet for heat bonding and sheet for heat bonding with dicing tape
JP6870943B2 (en) * 2015-09-30 2021-05-12 日東電工株式会社 Heat-bonding sheet and heat-bonding sheet with dicing tape
JP6721325B2 (en) * 2015-12-14 2020-07-15 デクセリアルズ株式会社 Thermosetting adhesive sheet and method for manufacturing semiconductor device
KR102056178B1 (en) * 2016-03-31 2019-12-16 후루카와 덴키 고교 가부시키가이샤 Tape for Electronic Device Package
JP6339619B2 (en) 2016-03-31 2018-06-06 古河電気工業株式会社 Electronic device packaging tape
JP2020009946A (en) * 2018-07-10 2020-01-16 日立化成株式会社 Method for manufacturing semiconductor device
CN110859029B (en) * 2018-08-23 2022-04-01 鹏鼎控股(深圳)股份有限公司 Flexible circuit board and manufacturing method thereof
WO2020101236A1 (en) * 2018-11-14 2020-05-22 주식회사 엘지화학 Resin composition for semiconductor adhesion, semiconductor adhesive film using same, dicing die bonding film and semiconductor wafer dicing method
KR102376144B1 (en) * 2018-11-14 2022-03-18 주식회사 엘지화학 Resin composition for bonding semiconductor, adhesive film for semiconductor, dicing diebonding film, and method for dicing of semiconductor wafer using the same
CN112341969B (en) * 2019-08-09 2022-12-27 深圳市优宝新材料科技有限公司 Adhesive for OLED frame packaging and preparation and application methods thereof
CN112980372B (en) * 2019-12-16 2022-11-22 深圳市优宝新材料科技有限公司 Adhesive and preparation method thereof
JP7385483B2 (en) 2020-01-27 2023-11-22 キオクシア株式会社 Semiconductor device and its manufacturing method
US20230081969A1 (en) * 2020-02-17 2023-03-16 Zhejiang Third Age Material Technology Co., Ltd Preparation method for spherical silica powder filler, powder filler obtained thereby and use thereof
JP7042986B1 (en) * 2020-07-30 2022-03-28 古河電気工業株式会社 A composition for an adhesive, a film-like adhesive, and a semiconductor package using the film-like adhesive and a method for manufacturing the same.
CN113512058B (en) * 2021-08-10 2023-10-03 中国科学院深圳先进技术研究院 Zwitterionic liquid silane coupling agent, synthetic method and application thereof
CN113969041A (en) * 2021-12-07 2022-01-25 苏州生益科技有限公司 A resin composition and prepreg and metal foil laminate prepared by using the same
CN115975587A (en) * 2023-02-17 2023-04-18 苏州博濬新材料科技有限公司 High-light-transmittance adhesive film and preparation method thereof

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TW310481B (en) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
JP4446552B2 (en) * 1999-05-06 2010-04-07 シーマ電子株式会社 Adhesives for ultra-high density semiconductors
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Also Published As

Publication number Publication date
JPWO2013161864A1 (en) 2015-12-24
CN104245874A (en) 2014-12-24
KR101704891B1 (en) 2017-02-08
PH12014502374B1 (en) 2015-01-12
WO2013161864A1 (en) 2013-10-31
TW201404847A (en) 2014-02-01
PH12014502374A1 (en) 2015-01-12
JP6239500B2 (en) 2017-11-29
KR20150005658A (en) 2015-01-14
CN104245874B (en) 2016-08-24
SG11201406941TA (en) 2014-11-27
TWI513787B (en) 2015-12-21

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