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MY161129A - Epoxy resin composition for sealing and electronic component device - Google Patents

Epoxy resin composition for sealing and electronic component device

Info

Publication number
MY161129A
MY161129A MYPI2011006371A MYPI2011006371A MY161129A MY 161129 A MY161129 A MY 161129A MY PI2011006371 A MYPI2011006371 A MY PI2011006371A MY PI2011006371 A MYPI2011006371 A MY PI2011006371A MY 161129 A MY161129 A MY 161129A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
sealing
electronic component
component device
Prior art date
Application number
MYPI2011006371A
Inventor
Tanaka Kenji
Hamada Mitsuyoshi
Furusawa Fumio
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY161129A publication Critical patent/MY161129A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H10W74/47—
    • H10W74/473—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

AN EPOXY RESIN COMPOSITION FOR SEALING INCLUDING (A) AN EPOXY RESIN HAVING TWO OR MORE EPOXY GROUPS IN ONE MOLECULE THEREOF; (B) A CURING AGEN; AND (C) A BENZOPHENONE DERIVATIVE HAVING ONE OR MORE PHENOLIC HYDROXYL GROUPS IN ONE MOLECULE THEREOF. (C) THE EPOXY RESIN COMPOSITION FOR SEALING PREFERABLY HAS A CONTENT OF THE BENZOPHENONE DERIVATIVE HAVING ONE OR MORE PHENOLIC HYDROXYL GROUPS IN ONE MOLECULE THEREOF OF FROM 0.1% BY MASS TO 1.0% BY MASS, AND PREFERABLY FURTHER INCLUDES (D) A SILANE COMPOUND, (E) A CURING ACCELERATING AGENT, OR (F) AN INORGANIC FILLER.
MYPI2011006371A 2011-01-06 2011-12-29 Epoxy resin composition for sealing and electronic component device MY161129A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011001130A JP5630652B2 (en) 2011-01-06 2011-01-06 Epoxy resin molding material for sealing and electronic component device

Publications (1)

Publication Number Publication Date
MY161129A true MY161129A (en) 2017-04-14

Family

ID=46474716

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011006371A MY161129A (en) 2011-01-06 2011-12-29 Epoxy resin composition for sealing and electronic component device

Country Status (5)

Country Link
JP (1) JP5630652B2 (en)
KR (2) KR101924233B1 (en)
CN (2) CN102585438B (en)
MY (1) MY161129A (en)
TW (2) TWI554538B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5768023B2 (en) * 2012-08-29 2015-08-26 日東電工株式会社 Thermosetting resin sheet for encapsulating electronic parts, resin-encapsulated semiconductor device, and method for producing resin-encapsulated semiconductor device
KR102246144B1 (en) 2012-10-26 2021-04-30 헨켈 아이피 앤드 홀딩 게엠베하 Adhesive compositions
JP6263835B2 (en) * 2012-12-13 2018-01-24 日立化成株式会社 Thermosetting resin molding material and electronic component device
JP6246050B2 (en) * 2014-04-14 2017-12-13 オリンパス株式会社 Resin composition, backing material for ultrasonic vibrator, ultrasonic vibrator, and ultrasonic endoscope
HUE051779T2 (en) * 2015-04-30 2021-03-29 Sumitomo Bakelite Co Encapsulating resin composition and electronic component device
JP7060011B2 (en) * 2017-03-31 2022-04-26 昭和電工マテリアルズ株式会社 Epoxy resin composition for encapsulation and electronic component equipment
JP6500947B2 (en) * 2017-08-10 2019-04-17 日清紡ケミカル株式会社 One-part adhesive and fuel cell separator
CN111527147A (en) * 2017-12-28 2020-08-11 日立化成株式会社 Epoxy resin composition for ball grid array encapsulation, epoxy resin cured product and electronic component device
KR102840984B1 (en) * 2017-12-28 2025-07-30 가부시끼가이샤 레조낙 Epoxy resin composition for sealing ball grid array packages, epoxy resin cured product and electronic component device
NL2021145B1 (en) * 2018-06-18 2020-01-06 Besi Netherlands Bv Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
WO2020065872A1 (en) * 2018-09-27 2020-04-02 日立化成株式会社 Resin composition for encapsulation, electronic component device and method for manufacturing electronic component device
WO2020066856A1 (en) * 2018-09-27 2020-04-02 日立化成株式会社 Sealing resin composition, electronic component device, and method for manufacturing electronic component device
JP7279333B2 (en) * 2018-10-17 2023-05-23 株式会社レゾナック Additive for curable resin composition, curable resin composition and electronic component device
JPWO2021220726A1 (en) * 2020-04-30 2021-11-04
EP4317237A4 (en) * 2021-03-31 2024-08-21 Sumitomo Bakelite Co.Ltd. Resin composition for encapsulating and electronic device using same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985701B2 (en) * 1995-01-27 1999-12-06 松下電工株式会社 Liquid epoxy resin composition
JP2003286395A (en) * 2002-03-28 2003-10-10 Sumitomo Bakelite Co Ltd Flame-retardant epoxy resin composition, and semiconductor sealing material and semiconductor device made by using it
JP2005089607A (en) * 2003-09-17 2005-04-07 Sumitomo Bakelite Co Ltd Epoxy resin composition for optical semiconductor encapsulation and optical semiconductor device
CN102341430B (en) * 2009-03-11 2013-11-06 日本曹达株式会社 Epoxy resin composition, curing agent and curing accelerator
JP5546914B2 (en) * 2009-03-19 2014-07-09 日本曹達株式会社 Novel inclusion complex, epoxy resin composition and epoxy resin composition for semiconductor encapsulation

Also Published As

Publication number Publication date
TWI554538B (en) 2016-10-21
CN102585438A (en) 2012-07-18
CN106085316B (en) 2020-03-13
CN106085316A (en) 2016-11-09
TW201619230A (en) 2016-06-01
JP2012140566A (en) 2012-07-26
KR20180131517A (en) 2018-12-10
TW201241029A (en) 2012-10-16
KR20120080128A (en) 2012-07-16
JP5630652B2 (en) 2014-11-26
KR102013533B1 (en) 2019-08-22
CN102585438B (en) 2016-07-06
KR101924233B1 (en) 2018-11-30
TWI589617B (en) 2017-07-01

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