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MY175700A - Wire bonding and method of manufacturing wire bonding - Google Patents

Wire bonding and method of manufacturing wire bonding

Info

Publication number
MY175700A
MY175700A MYPI2016702764A MYPI2016702764A MY175700A MY 175700 A MY175700 A MY 175700A MY PI2016702764 A MYPI2016702764 A MY PI2016702764A MY PI2016702764 A MYPI2016702764 A MY PI2016702764A MY 175700 A MY175700 A MY 175700A
Authority
MY
Malaysia
Prior art keywords
core material
wire bonding
antidiscoloring
layer
bonding wire
Prior art date
Application number
MYPI2016702764A
Inventor
Tsuyoshi Hasegawa
Yuji Kurosaki
Original Assignee
Tatsuta Electric Wire & Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire & Cable Co Ltd filed Critical Tatsuta Electric Wire & Cable Co Ltd
Publication of MY175700A publication Critical patent/MY175700A/en

Links

Classifications

    • H10W72/0115—
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45601—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/45609—Indium (In) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45644—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45664—Palladium (Pd) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/4569—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H10W72/522—
    • H10W72/552—
    • H10W72/5522—
    • H10W74/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

There is provided a bonding wire containing Ag in a core material, in which discoloration of a surface and damage of a semiconductor element during bonding can be suppressed, and continuous bondability and productivity are excellent. The bonding wire includes the core material containing 75% by mass or more of Ag, and an antidiscoloring layer 14 formed on an outer circumferential surface of this core material. The antidiscoloring layer is fonned by coating the outer peripheral surface of the core material with an aqueous solution containing at least one aliphatic organic compound having 8 to 18 carbon atoms and at least one thiol group, and at least one surfactant.
MYPI2016702764A 2014-01-31 2015-01-20 Wire bonding and method of manufacturing wire bonding MY175700A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014017580 2014-01-31

Publications (1)

Publication Number Publication Date
MY175700A true MY175700A (en) 2020-07-06

Family

ID=53756818

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016702764A MY175700A (en) 2014-01-31 2015-01-20 Wire bonding and method of manufacturing wire bonding

Country Status (6)

Country Link
JP (1) JP5842068B2 (en)
KR (1) KR101668975B1 (en)
CN (1) CN105393343A (en)
MY (1) MY175700A (en)
TW (1) TWI534835B (en)
WO (1) WO2015115241A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015074703A1 (en) * 2013-11-21 2015-05-28 Heraeus Deutschland GmbH & Co. KG Coated wire for bonding applications
TWI605559B (en) 2014-04-21 2017-11-11 新日鐵住金高新材料股份有限公司 Bonding wire for semiconductor device
WO2016203659A1 (en) * 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 Bonding wire for semiconductor device
WO2017013796A1 (en) 2015-07-23 2017-01-26 日鉄住金マイクロメタル株式会社 Bonding wire for semiconductor device
DE112015004682B4 (en) * 2015-08-12 2020-07-30 Nippon Micrometal Corporation Bond wire for semiconductor device
SG10201508103QA (en) * 2015-09-29 2017-04-27 Heraeus Materials Singapore Pte Ltd Alloyed silver wire
SG10201509634UA (en) * 2015-11-23 2017-06-29 Heraeus Oriental Hitec Co Ltd Coated wire
CN105950895B (en) * 2016-05-06 2018-04-20 河南优克电子材料有限公司 A kind of manufacture method of the fine silver alloy bonding line of small chip LED encapsulation
JP6969869B2 (en) * 2016-12-19 2021-11-24 株式会社大和化成研究所 Vaporizable discoloration inhibitor
TWI802555B (en) * 2017-03-31 2023-05-21 日商拓自達電線股份有限公司 bonding wire
JP6869920B2 (en) 2018-04-02 2021-05-12 田中電子工業株式会社 Precious metal-coated silver wire for ball bonding and its manufacturing method, and semiconductor device using precious metal-coated silver wire for ball bonding and its manufacturing method
JP6869919B2 (en) * 2018-04-02 2021-05-12 田中電子工業株式会社 Precious metal-coated silver wire for ball bonding and its manufacturing method, and semiconductor device using precious metal-coated silver wire for ball bonding and its manufacturing method
JP6807426B2 (en) * 2019-04-12 2021-01-06 田中電子工業株式会社 Gold-coated silver bonding wire and its manufacturing method, and semiconductor device and its manufacturing method
USD904836S1 (en) * 2019-06-03 2020-12-15 Ji Yeon JEONG Tongs for cooking
KR20220034846A (en) * 2019-08-13 2022-03-18 쌩-고벵 글래스 프랑스 Reduces silver wire corrosion on glass substrates
EP3993017B1 (en) * 2019-11-22 2024-10-09 NIPPON STEEL Chemical & Material Co., Ltd. Ag alloy bonding wire for semiconductor device
WO2022169407A1 (en) * 2021-02-05 2022-08-11 Heraeus Materials Singapore Pte. Ltd. Coated wire
KR102812812B1 (en) * 2022-03-08 2025-05-27 엘티메탈 주식회사 Manufacturing method of bonding wire and the wire boding manufactured thereby
KR102810270B1 (en) * 2022-03-08 2025-05-26 엘티메탈 주식회사 Manufacturing method of bonding wire and the wire boding manufactured thereby
KR102812809B1 (en) * 2022-12-14 2025-05-27 엘티메탈 주식회사 Manufacturing method of bonding wire and the wire boding manufactured thereby
KR102812817B1 (en) * 2022-12-14 2025-05-27 엘티메탈 주식회사 Manufacturing method of bonding wire and the wire boding manufactured thereby
CN117133852B (en) * 2023-07-20 2024-08-06 贵研半导体材料(云南)有限公司 Low-light-attenuation anti-color-change bonding silver wire and preparation method thereof
CN117712072A (en) * 2023-12-08 2024-03-15 郑州机械研究所有限公司 Silver alloy bonding wire and preparation method and application thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423794B2 (en) 1975-01-27 1979-08-16
JPS5626459A (en) 1979-08-11 1981-03-14 Noge Denki Kogyo:Kk Bonding wire for assembling of semiconductor device
JPS5691306A (en) * 1979-12-21 1981-07-24 Nippon Electric Co Bonding wire
JP2002308708A (en) * 2001-04-12 2002-10-23 Katayama Chem Works Co Ltd Discoloration inhibitor for silver antimicrobial agent, silver antimicrobial agent comprising the same and antimicrobial method
JPWO2006112031A1 (en) * 2005-04-14 2008-11-27 ゼネラルテクノロジー株式会社 Ink composition and printing method using the same
JP5616165B2 (en) * 2010-08-24 2014-10-29 タツタ電線株式会社 Silver bonding wire
JP2013219329A (en) * 2012-03-15 2013-10-24 Jx Nippon Mining & Metals Corp Bonding wire for semiconductor device

Also Published As

Publication number Publication date
TW201535417A (en) 2015-09-16
KR101668975B1 (en) 2016-10-24
JP5842068B2 (en) 2016-01-13
TWI534835B (en) 2016-05-21
JP2015164186A (en) 2015-09-10
WO2015115241A1 (en) 2015-08-06
CN105393343A (en) 2016-03-09
KR20160007663A (en) 2016-01-20

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