MY169102A - Epoxy resin composition and cured product thereof and curable resin composition - Google Patents
Epoxy resin composition and cured product thereof and curable resin compositionInfo
- Publication number
- MY169102A MY169102A MYPI2014703663A MYPI2014703663A MY169102A MY 169102 A MY169102 A MY 169102A MY PI2014703663 A MYPI2014703663 A MY PI2014703663A MY PI2014703663 A MYPI2014703663 A MY PI2014703663A MY 169102 A MY169102 A MY 169102A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin composition
- epoxy resin
- cured product
- curable resin
- carbon atoms
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 2
- 239000011342 resin composition Substances 0.000 title abstract 2
- 125000004432 carbon atom Chemical group C* 0.000 abstract 2
- 239000002685 polymerization catalyst Substances 0.000 abstract 2
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 238000010538 cationic polymerization reaction Methods 0.000 abstract 1
- 238000004737 colorimetric analysis Methods 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/26—Di-epoxy compounds heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/681—Metal alcoholates, phenolates or carboxylates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/20—Cross-linking
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012129406 | 2012-06-07 | ||
| JP2012129408 | 2012-06-07 | ||
| PCT/JP2013/065756 WO2013183736A1 (ja) | 2012-06-07 | 2013-06-06 | エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY169102A true MY169102A (en) | 2019-02-18 |
Family
ID=49712123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2014703663A MY169102A (en) | 2012-06-07 | 2013-06-06 | Epoxy resin composition and cured product thereof and curable resin composition |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6240069B2 (zh) |
| KR (1) | KR101913603B1 (zh) |
| CN (1) | CN104395371B (zh) |
| MY (1) | MY169102A (zh) |
| SG (1) | SG11201408155RA (zh) |
| TW (2) | TWI647248B (zh) |
| WO (1) | WO2013183736A1 (zh) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014175346A1 (ja) * | 2013-04-25 | 2014-10-30 | 日本化薬株式会社 | フェノール樹脂、該フェノール樹脂を含有するエポキシ樹脂組成物、およびその硬化物 |
| JP6550843B2 (ja) * | 2014-03-31 | 2019-07-31 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板 |
| US10233295B2 (en) | 2014-04-15 | 2019-03-19 | Mitsubishi Gas Chemical Company, Inc. | Fiber-reinforced composite material |
| JP2015209509A (ja) * | 2014-04-28 | 2015-11-24 | 京セラケミカル株式会社 | エポキシ樹脂組成物および樹脂封止型電子部品装置 |
| KR102327347B1 (ko) | 2014-08-22 | 2021-11-16 | 닛뽄 가야쿠 가부시키가이샤 | 에폭시(메타)아크릴레이트 화합물 및 그것을 함유하는 수지 조성물 그리고 그의 경화물, 컬러 필터 및 표시 소자 |
| WO2016031643A1 (ja) * | 2014-08-26 | 2016-03-03 | 日本化薬株式会社 | 反応性ポリエステル化合物、それを用いた活性エネルギー線硬化型樹脂組成物 |
| JP6428147B2 (ja) * | 2014-10-22 | 2018-11-28 | 味の素株式会社 | 樹脂組成物 |
| KR102490151B1 (ko) * | 2015-03-18 | 2023-01-18 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 시트, 및 프린트 배선판 |
| JP2017071706A (ja) * | 2015-10-08 | 2017-04-13 | 日本化薬株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物およびその硬化物 |
| CN108243614B (zh) | 2015-11-04 | 2021-10-22 | 琳得科株式会社 | 固化性树脂膜及第1保护膜形成用片 |
| CN105714857A (zh) * | 2016-02-03 | 2016-06-29 | 袁根木 | 最长的跨海江底的管段预制用钢丝网片代替模板方法 |
| KR102340503B1 (ko) * | 2016-03-28 | 2021-12-20 | 세키스이가가쿠 고교가부시키가이샤 | 수지 조성물 및 다층 기판 |
| US10487077B1 (en) | 2018-06-14 | 2019-11-26 | Sabic Global Technologies B.V. | Bis(benzoxazinyl)phthalimidine and associated curable composition and composite |
| CN109401707B (zh) * | 2018-11-01 | 2020-12-08 | 烟台信友新材料有限公司 | 一种单组份高耐温抗冲击阻燃型结构胶黏剂及其制备方法 |
| JP7184002B2 (ja) * | 2019-09-13 | 2022-12-06 | 味の素株式会社 | 樹脂組成物 |
| JP7491741B2 (ja) * | 2020-05-27 | 2024-05-28 | 住友化学株式会社 | エポキシ樹脂組成物及びその硬化物 |
| CN112379546B (zh) * | 2020-11-23 | 2022-08-19 | 珠海兴业新材料科技有限公司 | 聚合物分散染料液晶材料、电致变色调光薄膜及制备方法 |
| US20250386649A1 (en) * | 2022-07-26 | 2025-12-18 | Mitsui Chemicals, Inc. | Encapsulatable material for display device, encapsulating material, organic el display, and led display |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH496021A (de) * | 1966-03-10 | 1970-09-15 | Ciba Geigy | Verfahren zur Herstellung von neuen Polyglycidyläthern |
| JPH01108217A (ja) * | 1987-10-21 | 1989-04-25 | Mitsui Petrochem Ind Ltd | エポキシ樹脂の精製方法 |
| JPH01108218A (ja) * | 1987-10-21 | 1989-04-25 | Mitsui Petrochem Ind Ltd | エポキシ樹脂の精製方法 |
| JP2556366B2 (ja) * | 1988-11-25 | 1996-11-20 | 日本化薬株式会社 | 高純度エポキシ樹脂及びその製造方法 |
| JPH0892231A (ja) * | 1994-09-22 | 1996-04-09 | Mitsui Toatsu Chem Inc | スピロビインダンジグリシジルエーテルおよびその製造方法 |
| JPH11255864A (ja) * | 1998-03-09 | 1999-09-21 | Toshiba Corp | 液状エポキシ樹脂組成物および樹脂封止型半導体装置 |
| JP2000007757A (ja) * | 1998-04-22 | 2000-01-11 | Asahi Chiba Kk | 新規エポキシ樹脂 |
| JP2002114835A (ja) * | 2000-10-06 | 2002-04-16 | Asahi Denka Kogyo Kk | エポキシ樹脂用硬化剤組成物及び塗料組成物 |
| JP2004099744A (ja) * | 2002-09-10 | 2004-04-02 | Mitsui Chemicals Inc | エポキシ樹脂の精製方法 |
| KR101116921B1 (ko) * | 2003-02-03 | 2012-03-13 | 신닛테츠가가쿠 가부시키가이샤 | 에폭시 수지, 그 제조방법, 그것을 사용한 에폭시 수지조성물 및 경화물 |
| JP2005154719A (ja) | 2003-04-25 | 2005-06-16 | Mitsui Chemicals Inc | エポキシ樹脂組成物およびその用途 |
| JP2007063565A (ja) * | 2006-10-17 | 2007-03-15 | Sumitomo Bakelite Co Ltd | 半導体用樹脂ペースト及び半導体装置 |
| WO2008140008A1 (ja) * | 2007-05-08 | 2008-11-20 | Mitsubishi Gas Chemical Company, Inc. | テトラグリシジルアミノ化合物の製造方法 |
| JP4782870B2 (ja) * | 2008-07-31 | 2011-09-28 | 積水化学工業株式会社 | 硬化体、シート状成形体、積層板及び多層積層板 |
| JP5153000B2 (ja) * | 2009-04-01 | 2013-02-27 | 新日鉄住金化学株式会社 | エポキシ樹脂、その製造方法、エポキシ樹脂組成物および硬化物 |
| KR20120026035A (ko) * | 2009-04-17 | 2012-03-16 | 니폰 카야쿠 가부시키가이샤 | 올레핀 수지, 에폭시 수지, 경화성 수지 조성물 및 그 경화물 |
| SG184093A1 (en) * | 2010-03-15 | 2012-10-30 | Sumitomo Bakelite Co | Resin composition for semiconductor encapsulation, and semiconductor device using same |
| JP5404514B2 (ja) * | 2010-04-19 | 2014-02-05 | 日本化薬株式会社 | エポキシ樹脂の製造法、エポキシ樹脂、および硬化性樹脂組成物 |
| JP5732774B2 (ja) * | 2010-08-16 | 2015-06-10 | Dic株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物、その硬化物、及びプリント配線基板 |
| JP5745248B2 (ja) * | 2010-10-08 | 2015-07-08 | 株式会社ダイセル | エポキシ樹脂用硬化剤組成物、硬化性樹脂組成物及びその硬化物 |
-
2013
- 2013-06-06 CN CN201380030140.7A patent/CN104395371B/zh active Active
- 2013-06-06 KR KR1020147033069A patent/KR101913603B1/ko active Active
- 2013-06-06 MY MYPI2014703663A patent/MY169102A/en unknown
- 2013-06-06 WO PCT/JP2013/065756 patent/WO2013183736A1/ja not_active Ceased
- 2013-06-06 JP JP2014520060A patent/JP6240069B2/ja active Active
- 2013-06-06 SG SG11201408155RA patent/SG11201408155RA/en unknown
- 2013-06-07 TW TW106141641A patent/TWI647248B/zh active
- 2013-06-07 TW TW102120279A patent/TW201412804A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR101913603B1 (ko) | 2018-10-31 |
| JPWO2013183736A1 (ja) | 2016-02-01 |
| SG11201408155RA (en) | 2015-01-29 |
| CN104395371B (zh) | 2017-03-15 |
| TW201412804A (zh) | 2014-04-01 |
| TW201809054A (zh) | 2018-03-16 |
| JP6240069B2 (ja) | 2017-11-29 |
| CN104395371A (zh) | 2015-03-04 |
| TWI647248B (zh) | 2019-01-11 |
| KR20150030645A (ko) | 2015-03-20 |
| WO2013183736A1 (ja) | 2013-12-12 |
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