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MY161535A - Curable epoxy resin composition - Google Patents

Curable epoxy resin composition

Info

Publication number
MY161535A
MY161535A MYPI2013001561A MYPI2013001561A MY161535A MY 161535 A MY161535 A MY 161535A MY PI2013001561 A MYPI2013001561 A MY PI2013001561A MY PI2013001561 A MYPI2013001561 A MY PI2013001561A MY 161535 A MY161535 A MY 161535A
Authority
MY
Malaysia
Prior art keywords
resin composition
epoxy resin
curable epoxy
alicyclic
compound
Prior art date
Application number
MYPI2013001561A
Inventor
Hirose Suzuki
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of MY161535A publication Critical patent/MY161535A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H10W74/47—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)

Abstract

PROVIDED IS A CURABLE EPOXY RESIN COMPOSITION CAPABLE OF GIVING A CURED PRODUCT THAT IS SATISFACTORILY TRANSPARENT AND ALSO HIGHLY RESISTANT TO HEAT, LIGHT, AND CRACKING. THE CURABLE EPOXY RESIN COMPOSITION INCLUDES AN ALICYCLIC EPOXY COMPOUND (A), A MONOALLYL DIGLYCIDYL ISOCYANURATE COMPOUND (B) OF FOLLOWING FORMULA (1), AN ALICYCLIC POLYESTER RESIN (C), A CURING AGENT (D), AND A CURING ACCELERATOR CE): [CHEM. 1] WHEREIN R1S AND R2 EACH INDEPENDENTLY REPRESENT A HYDROGEN ATOM OR AN ALKYL GROUP HAVING 1 TO 8 CARBON ATOMS.
MYPI2013001561A 2011-01-07 2011-12-21 Curable epoxy resin composition MY161535A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011002457 2011-01-07

Publications (1)

Publication Number Publication Date
MY161535A true MY161535A (en) 2017-04-28

Family

ID=46457451

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013001561A MY161535A (en) 2011-01-07 2011-12-21 Curable epoxy resin composition

Country Status (6)

Country Link
JP (1) JP5852014B2 (en)
KR (1) KR101832537B1 (en)
CN (1) CN103154072B (en)
MY (1) MY161535A (en)
TW (1) TWI512034B (en)
WO (1) WO2012093591A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103649216A (en) * 2011-09-06 2014-03-19 株式会社大赛璐 Resin composition for sealing optical semiconductor, and optical semiconductor device using same
WO2014038446A1 (en) * 2012-09-07 2014-03-13 株式会社ダイセル Curable epoxy resin composition and cured product thereof, and optical semiconductor device
JP6185703B2 (en) * 2012-10-19 2017-08-23 株式会社ダイセル Curable epoxy resin composition, cured product thereof, and optical semiconductor device
JP6059538B2 (en) * 2013-01-09 2017-01-11 株式会社ダイセル Curable epoxy resin composition
WO2014109317A1 (en) * 2013-01-09 2014-07-17 株式会社ダイセル Curable epoxy resin composition
JP2017125212A (en) * 2017-04-10 2017-07-20 株式会社ダイセル Curable epoxy resin composition and cured article and optical semiconductor device
JP6606316B1 (en) 2018-03-28 2019-11-13 日本板硝子株式会社 Hardened product of resin composition, laminate, and resin composition
CN115667351A (en) * 2020-05-21 2023-01-31 株式会社大赛璐 Curable epoxy composition for rotating electrical machine

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3477111B2 (en) * 1999-06-01 2003-12-10 四国化成工業株式会社 Thermosetting epoxy resin composition
JP4560982B2 (en) * 2000-04-17 2010-10-13 三菱電機株式会社 Method for manufacturing insulation coil for high-pressure rotating machine
JP2003277591A (en) * 2002-03-26 2003-10-02 Sumitomo Bakelite Co Ltd Epoxy resin composition, prepreg and laminate
JP3787658B2 (en) * 2002-10-09 2006-06-21 よこはまティーエルオー株式会社 Epoxy resin composition
JP4775374B2 (en) * 2005-11-25 2011-09-21 日立化成工業株式会社 Liquid resin composition for electronic components and electronic component device
JP5638812B2 (en) * 2010-02-01 2014-12-10 株式会社ダイセル Curable epoxy resin composition

Also Published As

Publication number Publication date
JP5852014B2 (en) 2016-02-03
CN103154072B (en) 2015-11-25
TWI512034B (en) 2015-12-11
KR101832537B1 (en) 2018-02-26
CN103154072A (en) 2013-06-12
JPWO2012093591A1 (en) 2014-06-09
WO2012093591A1 (en) 2012-07-12
KR20140009202A (en) 2014-01-22
TW201233726A (en) 2012-08-16

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