[go: up one dir, main page]

MY140439A - Adhesive sheet for semiconductor device production, semiconductor device using the same, and production method of semiconductor device - Google Patents

Adhesive sheet for semiconductor device production, semiconductor device using the same, and production method of semiconductor device

Info

Publication number
MY140439A
MY140439A MYPI20041058A MYPI20041058A MY140439A MY 140439 A MY140439 A MY 140439A MY PI20041058 A MYPI20041058 A MY PI20041058A MY PI20041058 A MYPI20041058 A MY PI20041058A MY 140439 A MY140439 A MY 140439A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
production
adhesive sheet
same
adhesive
Prior art date
Application number
MYPI20041058A
Other languages
English (en)
Inventor
Takeshi Sato
Akinori Sei
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Publication of MY140439A publication Critical patent/MY140439A/en

Links

Classifications

    • H10W72/0198—
    • H10W72/071—
    • H10W72/073—
    • H10W72/075—
    • H10W72/50—
    • H10W72/5522—
    • H10W74/00—
    • H10W90/756—
    • H10W99/00—

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
MYPI20041058A 2003-03-25 2004-03-25 Adhesive sheet for semiconductor device production, semiconductor device using the same, and production method of semiconductor device MY140439A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003083795A JP4421204B2 (ja) 2003-03-25 2003-03-25 半導体装置製造用接着シート及びそれを用いた半導体装置並びに製造方法

Publications (1)

Publication Number Publication Date
MY140439A true MY140439A (en) 2009-12-31

Family

ID=33399169

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20041058A MY140439A (en) 2003-03-25 2004-03-25 Adhesive sheet for semiconductor device production, semiconductor device using the same, and production method of semiconductor device

Country Status (5)

Country Link
JP (1) JP4421204B2 (zh)
KR (1) KR100596186B1 (zh)
CN (1) CN100492586C (zh)
MY (1) MY140439A (zh)
TW (1) TWI313481B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4538398B2 (ja) * 2005-10-31 2010-09-08 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法
JP4654062B2 (ja) * 2005-03-30 2011-03-16 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法
JP4863690B2 (ja) * 2005-10-31 2012-01-25 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置並びにその製造方法
JP4505649B2 (ja) * 2006-03-23 2010-07-21 フジコピアン株式会社 固定シート
JP2009158817A (ja) * 2007-12-27 2009-07-16 Tomoegawa Paper Co Ltd Ｑｆｎ用熱硬化型樹脂組成物及びそれを用いたｑｆｎ用接着シート
KR20110087547A (ko) * 2010-01-26 2011-08-03 도레이첨단소재 주식회사 내열성 점착시트를 이용한 반도체 장치의 제조방법
JP5714349B2 (ja) * 2011-01-31 2015-05-07 ニッタ株式会社 易剥離性粘着シートおよび易剥離性粘着テープ
MY193426A (en) * 2014-08-08 2022-10-12 Toray Industries Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
TWI732764B (zh) * 2015-06-01 2021-07-11 日商富士軟片股份有限公司 暫時接著劑、接著膜、接著性支持體、積層體及接著劑套組
CN108922854B (zh) * 2018-06-14 2020-06-05 中国电子科技集团公司第二十四研究所 一种用于封装硅基芯片的瞬态电路封装结构实现方法
JP7187906B2 (ja) * 2018-09-10 2022-12-13 昭和電工マテリアルズ株式会社 半導体装置の製造方法
WO2021131925A1 (ja) * 2019-12-23 2021-07-01 日産化学株式会社 接着剤組成物、積層体及びその製造方法並びに積層体の剥離方法及び半導体形成基板を加工する方法

Also Published As

Publication number Publication date
HK1073178A1 (zh) 2005-09-23
CN1622279A (zh) 2005-06-01
TW200501208A (en) 2005-01-01
TWI313481B (en) 2009-08-11
KR20040084680A (ko) 2004-10-06
JP2004296549A (ja) 2004-10-21
JP4421204B2 (ja) 2010-02-24
CN100492586C (zh) 2009-05-27
KR100596186B1 (ko) 2006-07-03

Similar Documents

Publication Publication Date Title
MY140213A (en) Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof
MY140439A (en) Adhesive sheet for semiconductor device production, semiconductor device using the same, and production method of semiconductor device
TW200644297A (en) Semiconductor apparatus and manufacturing method thereof
TW200731900A (en) Method for producing a circuit substrate and a circuit board and a method for producing the same
DE602009000024D1 (de) Verfahren und Vorrichtung zur Herstellung eines Montageverbunds aus mindestens zwei elektronischen Mikrochips
TW200740317A (en) Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
KR20230164206A (ko) 전자 제품을 제조하는 방법, 관련된 배열 및 제품
TW200731494A (en) Circuit component, manufacturing method of circuit component, semiconductor device and multilayer structure on surface of circuit component
FI20020191A0 (fi) Menetelmõ komponentin upottamiseksi alustaan
DE502005009898D1 (de) Verfahren und vorrichtung zum kontinuierlichen herstellen elektronischer folienbauteile sowie elektronisches folienbauteil
TW200704736A (en) Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using the same
JP6430143B2 (ja) 樹脂成形装置及び樹脂成形方法並びに成形製品の製造方法
MY149696A (en) Method of manufacturing a semiconductor device and semiconductor device produced thereby
ATE509078T1 (de) Hitzeaktivierbares klebeband insbesondere für die verklebung von elektronischen bauteilen und leiterbahnen
ATE532215T1 (de) Halbleiterkapselung und deren herstellung
TW200629446A (en) Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate
TW200642019A (en) Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device
MY146344A (en) Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure
SG136968A1 (en) Electronic device with high lead density
TW200606735A (en) Die attach area cut-on-fly method and apparatus
TW200605169A (en) Circuit device and process for manufacture thereof
SG113568A1 (en) Process for producing semiconductor devices, and heat resistant adhesive tape used in this process
WO2009075159A1 (ja) 電気部品の実装方法及び実装装置
ATE459938T1 (de) Flacher transponder und verfahren zu seiner herstellung
TW200636883A (en) Semiconductor device and manufacturing method thereof