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MY144163A - Polishing composition - Google Patents

Polishing composition

Info

Publication number
MY144163A
MY144163A MYPI20055484A MYPI20055484A MY144163A MY 144163 A MY144163 A MY 144163A MY PI20055484 A MYPI20055484 A MY PI20055484A MY PI20055484 A MYPI20055484 A MY PI20055484A MY 144163 A MY144163 A MY 144163A
Authority
MY
Malaysia
Prior art keywords
polishing composition
substrate
compound
hard disk
amino groups
Prior art date
Application number
MYPI20055484A
Other languages
English (en)
Inventor
Shigeo Fujii
Kenichi Suenaga
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of MY144163A publication Critical patent/MY144163A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H10P52/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
MYPI20055484A 2004-11-30 2005-11-24 Polishing composition MY144163A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004347212A JP4836441B2 (ja) 2004-11-30 2004-11-30 研磨液組成物

Publications (1)

Publication Number Publication Date
MY144163A true MY144163A (en) 2011-08-15

Family

ID=35580228

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20055484A MY144163A (en) 2004-11-30 2005-11-24 Polishing composition

Country Status (6)

Country Link
US (2) US20060112647A1 (zh)
JP (1) JP4836441B2 (zh)
CN (1) CN1781971B (zh)
GB (1) GB2421244B (zh)
MY (1) MY144163A (zh)
TW (1) TWI370844B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4577296B2 (ja) * 2006-10-27 2010-11-10 富士電機デバイステクノロジー株式会社 磁気記録媒体用非金属基板の再生方法
JP2009013046A (ja) * 2007-06-05 2009-01-22 Asahi Glass Co Ltd ガラス基板表面を加工する方法
JP2008307676A (ja) * 2007-06-18 2008-12-25 Kao Corp ハードディスク基板用研磨液組成物
JP5063339B2 (ja) * 2007-12-28 2012-10-31 花王株式会社 ハードディスク基板用研磨液組成物、並びにこれを用いた研磨方法及びハードディスク基板の製造方法
JP5576634B2 (ja) * 2008-11-05 2014-08-20 山口精研工業株式会社 研磨剤組成物及び磁気ディスク基板の研磨方法
JP5657247B2 (ja) * 2009-12-25 2015-01-21 花王株式会社 研磨液組成物
JP5940278B2 (ja) * 2010-10-27 2016-06-29 花王株式会社 ガラスハードディスク基板の製造方法
JP5925454B2 (ja) 2010-12-16 2016-05-25 花王株式会社 磁気ディスク基板用研磨液組成物
JP5979872B2 (ja) * 2011-01-31 2016-08-31 花王株式会社 磁気ディスク基板の製造方法
CN103403109B (zh) * 2011-02-23 2015-12-23 大日精化工业株式会社 水性液态组合物、水性涂布液、功能性涂布膜、及复合材料
JP5933950B2 (ja) * 2011-09-30 2016-06-15 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 銅または銅合金用エッチング液
CN104583333B (zh) 2012-08-21 2017-06-16 大日精化工业株式会社 水性液态组合物、水性涂覆液、功能性涂覆膜、和复合材料
US20150251293A1 (en) * 2012-10-03 2015-09-10 Fujimi Incorporated Polishing method and method for producing alloy material
CN106716530B (zh) * 2014-09-17 2019-06-21 Hoya株式会社 磁盘用基板的制造方法
JP6659449B2 (ja) * 2016-05-09 2020-03-04 山口精研工業株式会社 無電解ニッケル−リンめっきされたアルミニウム磁気ディスク基板用研磨剤組成物
JP6734146B2 (ja) * 2016-08-23 2020-08-05 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物
CN108148507B (zh) * 2017-12-18 2020-12-04 清华大学 一种用于熔石英的抛光组合物
JP2021137931A (ja) * 2020-03-06 2021-09-16 株式会社フジミインコーポレーテッド アルミナスラリー、これを用いたウェットブラスト加工用スラリー及び加工方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4639394A (en) * 1985-04-01 1987-01-27 Ppg Industries, Inc. Non-aqueous dispersions prepared with styrene polymer dispersion stabilizers
US5209816A (en) * 1992-06-04 1993-05-11 Micron Technology, Inc. Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing
US5350788A (en) * 1993-03-11 1994-09-27 E. I. Du Pont De Nemours And Company Method for reducing odors in recycled plastics and compositions relating thereto
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5362784A (en) * 1993-05-28 1994-11-08 E. I. Du Pont De Nemours And Company Aldehyde scavenging compositions and methods relating thereto
US6855266B1 (en) * 1999-08-13 2005-02-15 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
KR100590664B1 (ko) * 1999-08-13 2006-06-19 캐보트 마이크로일렉트로닉스 코포레이션 연마 시스템 및 그의 사용 방법
JP4264781B2 (ja) * 1999-09-20 2009-05-20 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
JP3575750B2 (ja) * 2000-05-12 2004-10-13 花王株式会社 研磨液組成物
JP2002164307A (ja) * 2000-11-24 2002-06-07 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
US7323416B2 (en) * 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US6776810B1 (en) * 2002-02-11 2004-08-17 Cabot Microelectronics Corporation Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
JP2003347247A (ja) * 2002-05-28 2003-12-05 Hitachi Chem Co Ltd 半導体絶縁膜用ｃｍｐ研磨剤及び基板の研磨方法
JP3875155B2 (ja) * 2002-07-31 2007-01-31 花王株式会社 ロールオフ低減剤
GB2393186B (en) * 2002-07-31 2006-02-22 Kao Corp Polishing composition
JP4446371B2 (ja) * 2002-08-30 2010-04-07 花王株式会社 研磨液組成物
GB2393447B (en) * 2002-08-07 2006-04-19 Kao Corp Polishing composition
JP2004193495A (ja) * 2002-12-13 2004-07-08 Toshiba Corp 化学的機械的研磨用スラリーおよびこれを用いた半導体装置の製造方法
JP2004311484A (ja) * 2003-04-02 2004-11-04 Sumitomo Bakelite Co Ltd 研磨用組成物
JPWO2004100242A1 (ja) * 2003-05-09 2006-07-13 三洋化成工業株式会社 Ｃｍｐプロセス用研磨液及び研磨方法
JP2004335978A (ja) * 2003-05-12 2004-11-25 Jsr Corp 化学機械研磨方法
US7247566B2 (en) * 2003-10-23 2007-07-24 Dupont Air Products Nanomaterials Llc CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers

Also Published As

Publication number Publication date
US20080280538A1 (en) 2008-11-13
JP4836441B2 (ja) 2011-12-14
CN1781971B (zh) 2010-05-05
GB2421244A (en) 2006-06-21
GB2421244B (en) 2009-03-18
US20060112647A1 (en) 2006-06-01
TWI370844B (en) 2012-08-21
CN1781971A (zh) 2006-06-07
JP2006150534A (ja) 2006-06-15
GB0523438D0 (en) 2005-12-28
TW200621967A (en) 2006-07-01

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