MXPA05009600A - Dispositivos de conmutacion de calcogenuro multi-terminal. - Google Patents
Dispositivos de conmutacion de calcogenuro multi-terminal.Info
- Publication number
- MXPA05009600A MXPA05009600A MXPA05009600A MXPA05009600A MXPA05009600A MX PA05009600 A MXPA05009600 A MX PA05009600A MX PA05009600 A MXPA05009600 A MX PA05009600A MX PA05009600 A MXPA05009600 A MX PA05009600A MX PA05009600 A MXPA05009600 A MX PA05009600A
- Authority
- MX
- Mexico
- Prior art keywords
- terminal
- devices
- switching devices
- chalcogenide material
- chalcogenide switching
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/253—Multistable switching devices, e.g. memristors having three or more electrodes, e.g. transistor-like devices
-
- H10P10/00—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/257—Multistable switching devices, e.g. memristors having switching assisted by radiation or particle beam, e.g. optically controlled devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
- G11C2213/51—Structure including a barrier layer preventing or limiting migration, diffusion of ions or charges or formation of electrolytes near an electrode
Landscapes
- Semiconductor Memories (AREA)
- Electronic Switches (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Los dispositivos de conmutacion electronicos multi-terminales comprenden un material de calcogenuro conmutable entre un estado resistente y un estado conductivo. Los dispositivos incluyen una primera terminal, una segunda terminal y una terminal de control. La aplicacion de una senal de control en la terminal de control modula la conductividad del material de calcogenuro entre la primera y segunda terminales y/o el voltaje de umbral requerido para conmutar el material de calcogenuro entre la primera y segunda terminales desde un estado resistente en un estado conductivo. Los dispositivos puede utilizarse como dispositivos de interconexion o dispositivos de proporcion de senal en los circuitos y las redes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/384,994 US6967344B2 (en) | 2003-03-10 | 2003-03-10 | Multi-terminal chalcogenide switching devices |
| PCT/US2004/003111 WO2004081977A2 (en) | 2003-03-10 | 2004-02-04 | Multi-terminal chalcogenide switching devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MXPA05009600A true MXPA05009600A (es) | 2005-11-04 |
Family
ID=32961414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MXPA05009600A MXPA05009600A (es) | 2003-03-10 | 2004-02-04 | Dispositivos de conmutacion de calcogenuro multi-terminal. |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6967344B2 (es) |
| EP (1) | EP1636825B1 (es) |
| JP (1) | JP5396002B2 (es) |
| KR (1) | KR101056078B1 (es) |
| CN (1) | CN100521279C (es) |
| BR (1) | BRPI0408230A (es) |
| CA (1) | CA2518246A1 (es) |
| MX (1) | MXPA05009600A (es) |
| TW (1) | TWI257724B (es) |
| WO (1) | WO2004081977A2 (es) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7227170B2 (en) * | 2003-03-10 | 2007-06-05 | Energy Conversion Devices, Inc. | Multiple bit chalcogenide storage device |
| US7085155B2 (en) * | 2003-03-10 | 2006-08-01 | Energy Conversion Devices, Inc. | Secured phase-change devices |
| US20040257848A1 (en) * | 2003-06-18 | 2004-12-23 | Macronix International Co., Ltd. | Method for adjusting the threshold voltage of a memory cell |
| US7381611B2 (en) * | 2003-08-04 | 2008-06-03 | Intel Corporation | Multilayered phase change memory |
| US7485891B2 (en) * | 2003-11-20 | 2009-02-03 | International Business Machines Corporation | Multi-bit phase change memory cell and multi-bit phase change memory including the same, method of forming a multi-bit phase change memory, and method of programming a multi-bit phase change memory |
| DE102004037450B4 (de) * | 2004-08-02 | 2009-04-16 | Qimonda Ag | Verfahren zum Betrieb eines Schalt-Bauelements |
| US20080286446A1 (en) * | 2005-01-28 | 2008-11-20 | Smuruthi Kamepalli | Seed-Assisted MOCVD Growth of Threshold Switching and Phase-Change Materials |
| US20060172067A1 (en) * | 2005-01-28 | 2006-08-03 | Energy Conversion Devices, Inc | Chemical vapor deposition of chalcogenide materials |
| US7317200B2 (en) * | 2005-02-23 | 2008-01-08 | Micron Technology, Inc. | SnSe-based limited reprogrammable cell |
| US7525117B2 (en) * | 2005-08-09 | 2009-04-28 | Ovonyx, Inc. | Chalcogenide devices and materials having reduced germanium or telluruim content |
| CN100382330C (zh) * | 2005-08-11 | 2008-04-16 | 上海交通大学 | 可实现多位存储的单元结构 |
| US7494849B2 (en) * | 2005-11-03 | 2009-02-24 | Cswitch Inc. | Methods for fabricating multi-terminal phase change devices |
| US8183551B2 (en) * | 2005-11-03 | 2012-05-22 | Agale Logic, Inc. | Multi-terminal phase change devices |
| US7511532B2 (en) | 2005-11-03 | 2009-03-31 | Cswitch Corp. | Reconfigurable logic structures |
| US7746682B2 (en) * | 2005-11-03 | 2010-06-29 | Agata Logic Inc. | SEU hardened latches and memory cells using programmable resistance devices |
| US7675765B2 (en) | 2005-11-03 | 2010-03-09 | Agate Logic, Inc. | Phase-change memory (PCM) based universal content-addressable memory (CAM) configured as binary/ternary CAM |
| US8222917B2 (en) * | 2005-11-03 | 2012-07-17 | Agate Logic, Inc. | Impedance matching and trimming apparatuses and methods using programmable resistance devices |
| US7741638B2 (en) * | 2005-11-23 | 2010-06-22 | Hewlett-Packard Development Company, L.P. | Control layer for a nanoscale electronic switching device |
| KR101501980B1 (ko) * | 2005-12-12 | 2015-03-18 | 오보닉스, 아이엔씨. | 칼코겐화물 소자 및 감소된 저매늄 또는 텔러륨 함량을 갖는 재료 |
| US7754603B2 (en) * | 2006-05-22 | 2010-07-13 | Ovonyx, Inc. | Multi-functional chalcogenide electronic devices having gain |
| US7547906B2 (en) * | 2006-05-22 | 2009-06-16 | Ovonyx, Inc. | Multi-functional chalcogenide electronic devices having gain |
| US7969769B2 (en) * | 2007-03-15 | 2011-06-28 | Ovonyx, Inc. | Multi-terminal chalcogenide logic circuits |
| US7687309B2 (en) | 2007-06-28 | 2010-03-30 | International Business Machines Corporation | CMOS-process-compatible programmable via device |
| US7772582B2 (en) * | 2007-07-11 | 2010-08-10 | International Business Machines Corporation | Four-terminal reconfigurable devices |
| US7659534B2 (en) * | 2007-08-03 | 2010-02-09 | International Business Machines Corporation | Programmable via devices with air gap isolation |
| US7969770B2 (en) * | 2007-08-03 | 2011-06-28 | International Business Machines Corporation | Programmable via devices in back end of line level |
| JP4621897B2 (ja) * | 2007-08-31 | 2011-01-26 | 独立行政法人産業技術総合研究所 | 固体メモリ |
| JP4595125B2 (ja) * | 2007-08-31 | 2010-12-08 | 独立行政法人産業技術総合研究所 | 固体メモリ |
| US8228719B2 (en) * | 2008-06-06 | 2012-07-24 | Ovonyx, Inc. | Thin film input/output |
| US8467236B2 (en) | 2008-08-01 | 2013-06-18 | Boise State University | Continuously variable resistor |
| US8377741B2 (en) * | 2008-12-30 | 2013-02-19 | Stmicroelectronics S.R.L. | Self-heating phase change memory cell architecture |
| US7939815B2 (en) * | 2008-12-30 | 2011-05-10 | Stmicroelectronics S.R.L. | Forming a carbon passivated ovonic threshold switch |
| US8148707B2 (en) | 2008-12-30 | 2012-04-03 | Stmicroelectronics S.R.L. | Ovonic threshold switch film composition for TSLAGS material |
| US8546785B2 (en) | 2010-03-31 | 2013-10-01 | Hewlett-Packard Development Company, L.P. | Memristive device |
| US8345472B2 (en) | 2010-12-21 | 2013-01-01 | Intel Corporation | Three-terminal ovonic threshold switch as a current driver in a phase change memory |
| FR2977077B1 (fr) * | 2011-06-27 | 2013-08-02 | Commissariat Energie Atomique | Generateur de retards utilisant une resistance programmable a base de materiau a changement de phase |
| US8737114B2 (en) * | 2012-05-07 | 2014-05-27 | Micron Technology, Inc. | Switching device structures and methods |
| US9019743B2 (en) * | 2012-11-29 | 2015-04-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and structure for resistive switching random access memory with high reliable and high density |
| CN105940553A (zh) * | 2014-02-14 | 2016-09-14 | Hrl实验室有限责任公司 | 像素化金属贴片的可重构电磁表面 |
| US20160005965A1 (en) * | 2014-07-01 | 2016-01-07 | Micron Technology, Inc. | Memory cells having a first selecting chalcogenide material and a second selecting chalcogenide material and methods therof |
| US9406881B1 (en) | 2015-04-24 | 2016-08-02 | Micron Technology, Inc. | Memory cells having a heater electrode formed between a first storage material and a second storage material and methods of forming the same |
| KR102608887B1 (ko) * | 2016-08-10 | 2023-12-04 | 에스케이하이닉스 주식회사 | 반도체 장치 |
| WO2018066320A1 (ja) * | 2016-10-04 | 2018-04-12 | ソニーセミコンダクタソリューションズ株式会社 | スイッチ素子および記憶装置ならびにメモリシステム |
| KR102295524B1 (ko) * | 2017-03-27 | 2021-08-30 | 삼성전자 주식회사 | 메모리 소자 |
| US10541271B2 (en) | 2017-10-18 | 2020-01-21 | Macronix International Co., Ltd. | Superlattice-like switching devices |
| EP3570339B1 (en) | 2018-05-17 | 2020-12-30 | IMEC vzw | Switching device with active portion switching from insulating state to conducting state |
| US10374009B1 (en) | 2018-07-17 | 2019-08-06 | Macronix International Co., Ltd. | Te-free AsSeGe chalcogenides for selector devices and memory devices using same |
| US10943952B2 (en) | 2019-06-10 | 2021-03-09 | Sandisk Technologies Llc | Threshold switch for memory |
| CN110783454B (zh) * | 2019-09-24 | 2021-03-09 | 华中科技大学 | 纳米级相变存储器单元电极配置结构的加工方法 |
| CN110767802B (zh) * | 2019-09-24 | 2021-03-09 | 华中科技大学 | 用于纳米级相变存储器单元的电极配置结构 |
| US11289540B2 (en) | 2019-10-15 | 2022-03-29 | Macronix International Co., Ltd. | Semiconductor device and memory cell |
| US11158787B2 (en) | 2019-12-17 | 2021-10-26 | Macronix International Co., Ltd. | C—As—Se—Ge ovonic materials for selector devices and memory devices using same |
| US11362276B2 (en) | 2020-03-27 | 2022-06-14 | Macronix International Co., Ltd. | High thermal stability SiOx doped GeSbTe materials suitable for embedded PCM application |
| US12310031B2 (en) | 2022-07-08 | 2025-05-20 | Macronix International Co., Ltd. | Multi-layer ovonic threshold switch (OTS) for switching devices and memory devices using the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3336486A (en) * | 1966-09-06 | 1967-08-15 | Energy Conversion Devices Inc | Control system having multiple electrode current controlling device |
| US3611060A (en) * | 1969-11-17 | 1971-10-05 | Texas Instruments Inc | Three terminal active glass memory element |
| FR2103896A5 (es) * | 1970-08-13 | 1972-04-14 | Energy Conversion Devices Inc | |
| JPS5620714B2 (es) * | 1972-06-27 | 1981-05-15 | ||
| GB2127221B (en) * | 1982-09-06 | 1986-03-12 | Secr Defence | Radiation-controlled electrical switches |
| JP2503091B2 (ja) * | 1990-03-14 | 1996-06-05 | 富士通株式会社 | 超電導光機能素子 |
| JPH04192368A (ja) * | 1990-11-23 | 1992-07-10 | Sony Corp | 縦チャンネルfet |
| US5831276A (en) * | 1995-06-07 | 1998-11-03 | Micron Technology, Inc. | Three-dimensional container diode for use with multi-state material in a non-volatile memory cell |
| US7173317B1 (en) * | 1998-11-09 | 2007-02-06 | Micron Technology, Inc. | Electrical and thermal contact for use in semiconductor devices |
| JP2001320052A (ja) * | 2000-05-02 | 2001-11-16 | Fujitsu Ltd | 半導体装置及び半導体集積回路 |
| US6448576B1 (en) * | 2001-08-30 | 2002-09-10 | Bae Systems Information And Electronic Systems Integration, Inc. | Programmable chalcogenide fuse within a semiconductor device |
| US6969869B2 (en) * | 2001-08-30 | 2005-11-29 | Ovonyx, Inc. | Programmable resistance memory element with indirect heating |
-
2003
- 2003-03-10 US US10/384,994 patent/US6967344B2/en not_active Expired - Lifetime
-
2004
- 2004-02-04 CN CNB2004800123650A patent/CN100521279C/zh not_active Expired - Lifetime
- 2004-02-04 KR KR1020057016961A patent/KR101056078B1/ko not_active Expired - Lifetime
- 2004-02-04 JP JP2006508659A patent/JP5396002B2/ja not_active Expired - Fee Related
- 2004-02-04 WO PCT/US2004/003111 patent/WO2004081977A2/en not_active Ceased
- 2004-02-04 BR BRPI0408230-3A patent/BRPI0408230A/pt not_active IP Right Cessation
- 2004-02-04 CA CA002518246A patent/CA2518246A1/en not_active Abandoned
- 2004-02-04 MX MXPA05009600A patent/MXPA05009600A/es not_active Application Discontinuation
- 2004-02-04 EP EP04708160.9A patent/EP1636825B1/en not_active Expired - Lifetime
- 2004-03-09 TW TW093106103A patent/TWI257724B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1636825A2 (en) | 2006-03-22 |
| WO2004081977A3 (en) | 2006-10-26 |
| KR20050110668A (ko) | 2005-11-23 |
| CN100521279C (zh) | 2009-07-29 |
| EP1636825B1 (en) | 2013-04-10 |
| CN1993842A (zh) | 2007-07-04 |
| WO2004081977A2 (en) | 2004-09-23 |
| BRPI0408230A (pt) | 2006-02-21 |
| TWI257724B (en) | 2006-07-01 |
| CA2518246A1 (en) | 2004-09-23 |
| EP1636825A4 (en) | 2010-03-24 |
| JP5396002B2 (ja) | 2014-01-22 |
| JP2007525816A (ja) | 2007-09-06 |
| US6967344B2 (en) | 2005-11-22 |
| US20040178401A1 (en) | 2004-09-16 |
| TW200505066A (en) | 2005-02-01 |
| KR101056078B1 (ko) | 2011-08-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA | Abandonment or withdrawal |