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MXPA02010116A - Sustrato transparente provisto con pistas electricamente conductoras. - Google Patents

Sustrato transparente provisto con pistas electricamente conductoras.

Info

Publication number
MXPA02010116A
MXPA02010116A MXPA02010116A MXPA02010116A MXPA02010116A MX PA02010116 A MXPA02010116 A MX PA02010116A MX PA02010116 A MXPA02010116 A MX PA02010116A MX PA02010116 A MXPA02010116 A MX PA02010116A MX PA02010116 A MXPA02010116 A MX PA02010116A
Authority
MX
Mexico
Prior art keywords
transparent substrate
strips
screen
screen printing
substrate provided
Prior art date
Application number
MXPA02010116A
Other languages
English (en)
Inventor
Dieter Hahn
Original Assignee
Saint Gobain
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10038768A external-priority patent/DE10038768A1/de
Priority claimed from FR0016199A external-priority patent/FR2818087B3/fr
Application filed by Saint Gobain filed Critical Saint Gobain
Publication of MXPA02010116A publication Critical patent/MXPA02010116A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Surface Heating Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Surface Treatment Of Glass (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Conductive Materials (AREA)
  • Printing Methods (AREA)

Abstract

La invencion se refiere a un método para fabricar pistas eléctricamente conductoras sobre un sustrato transparente, mediante serigrafía de una pasta eléctricamente conductora, y el sustrato transparente que se proporciona con las pistas. La invencion está caracterizada porque consiste en: la formacion de pistas conductoras que tienen una longitud no mayor de 0.3 mm mediante la aplicacion por serigrafía de una pasta eléctricamente conductora, tixotropica que tiene una proporcion de viscosidad sin esfuerzo cortante a la viscosidad con esfuerzo cortante en condiciones de serigrafía de al menos 50 y que tiene un contenido de plata mayor a 35% y en donde al menos 98% de las partículas que la forman tienen un tamaño menor de 25 °m, utilizacion de un tamiz que tiene al menos 90 hilos por cm, el recubrimiento del tamiz se proporciona con ranuras cuyo tamaño más pequeño es igual a 0.25 mm + 0.05 mm, y por el sometimiento de las pistas a un proceso de coccion.
MXPA02010116A 2000-04-14 2001-04-17 Sustrato transparente provisto con pistas electricamente conductoras. MXPA02010116A (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE10018902 2000-04-14
DE10038768A DE10038768A1 (de) 2000-04-14 2000-08-09 Verfahren zum Herstellen von elektrischen Leiterbahnen auf Glasscheiben und transparentes Substrat mit einem Muster aus elektrisch leitfähigen Leiterbahnen
DE10056777A DE10056777A1 (de) 2000-04-14 2000-11-16 Verfahren zum Herstellen von elektrischen Leiterbahnen auf Glasscheiben und transparentes Substrat mit einem Muster aus elektrisch leitfähigen Leiterbahnen
FR0016199A FR2818087B3 (fr) 2000-12-13 2000-12-13 Procede de fabrication de pistes electroconductrices sur un substrat transparent et substrat obtenu
PCT/FR2001/001175 WO2001080608A1 (fr) 2000-04-14 2001-04-17 Substrat transparent pourvu de pistes electroconductrices

Publications (1)

Publication Number Publication Date
MXPA02010116A true MXPA02010116A (es) 2003-06-04

Family

ID=41394093

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02010116A MXPA02010116A (es) 2000-04-14 2001-04-17 Sustrato transparente provisto con pistas electricamente conductoras.

Country Status (17)

Country Link
US (2) US7053313B2 (es)
EP (1) EP2140742B1 (es)
JP (2) JP5255742B2 (es)
KR (1) KR100758255B1 (es)
CN (1) CN1279797C (es)
AT (1) ATE511743T1 (es)
AU (1) AU5486201A (es)
BE (1) BE1014124A5 (es)
BR (1) BRPI0110089B1 (es)
CA (1) CA2405991C (es)
CZ (1) CZ307170B6 (es)
IT (1) ITMI20010807A1 (es)
MX (1) MXPA02010116A (es)
PL (1) PL198898B1 (es)
PT (1) PT2140742E (es)
SK (1) SK287628B6 (es)
WO (1) WO2001080608A1 (es)

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* Cited by examiner, † Cited by third party
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US8207268B2 (en) * 2005-06-28 2012-06-26 Nuplex Resins B.V. Polyurea product as thixotropic rheology modifying agent
KR100953555B1 (ko) * 2006-05-03 2010-04-21 주식회사 엘지화학 투명한 전기 전도성 테이프 및 그 제조방법
RU2313926C1 (ru) * 2006-06-05 2007-12-27 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления печатных плат
JP4355010B2 (ja) * 2006-10-04 2009-10-28 昭栄化学工業株式会社 積層電子部品用導体ペースト
US20100096647A1 (en) * 2007-04-03 2010-04-22 Koninklijke Philips Electronics N.V. Light output device
US8895899B2 (en) 2007-10-26 2014-11-25 Philippe Marquet Glazing comprising a network of conducting wires
KR20140032973A (ko) 2011-01-14 2014-03-17 아사히 가라스 가부시키가이샤 차량용 창유리 및 그의 제조 방법
WO2014065383A1 (ja) 2012-10-25 2014-05-01 旭硝子株式会社 車両用窓ガラスおよびその取付構造
US11361204B2 (en) 2018-03-07 2022-06-14 X-Card Holdings, Llc Metal card
CN210381444U (zh) * 2019-06-05 2020-04-21 众普森科技（株洲）有限公司 Pcb板及电器设备
CN111261803B (zh) * 2020-01-19 2022-05-24 福建华佳彩有限公司 一种改善frit胶凹陷的方法
CN111901980A (zh) * 2020-07-13 2020-11-06 珠海杰赛科技有限公司 挠性线路板制作方法

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US3813519A (en) * 1964-11-09 1974-05-28 Saint Gobain Electrically heated glass window
NL169018C (nl) * 1969-03-07 1982-05-17 Saint Gobain Werkwijze voor het vervaardigen van een elektrisch verwarmbare glasruit.
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US3832527A (en) 1970-12-18 1974-08-27 Asahi Glass Co Ltd Defogging glass plate
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Also Published As

Publication number Publication date
CN1436439A (zh) 2003-08-13
CZ20023414A3 (cs) 2003-08-13
BRPI0110089B1 (pt) 2015-08-18
CZ307170B6 (cs) 2018-02-21
BE1014124A5 (fr) 2003-05-06
ITMI20010807A1 (it) 2002-10-13
PL365984A1 (en) 2005-01-24
US20060065435A1 (en) 2006-03-30
PT2140742E (pt) 2011-09-08
ATE511743T1 (de) 2011-06-15
US20040031146A1 (en) 2004-02-19
JP5255742B2 (ja) 2013-08-07
KR100758255B1 (ko) 2007-09-13
CA2405991C (fr) 2009-07-14
WO2001080608A1 (fr) 2001-10-25
ITMI20010807A0 (it) 2001-04-13
BR0110089A (pt) 2004-12-28
EP2140742A1 (fr) 2010-01-06
AU5486201A (en) 2001-10-30
CN1279797C (zh) 2006-10-11
US7053313B2 (en) 2006-05-30
JP2003531461A (ja) 2003-10-21
CA2405991A1 (fr) 2001-10-25
US7582833B2 (en) 2009-09-01
SK287628B6 (sk) 2011-04-05
EP2140742B1 (fr) 2011-06-01
PL198898B1 (pl) 2008-07-31
KR20040029941A (ko) 2004-04-08
JP2013062249A (ja) 2013-04-04
SK14752002A3 (sk) 2003-04-01

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