[go: up one dir, main page]

MXPA01013054A - Composicion de heteroatomo carbociclico o resina epoxica y agente de curacion y agente de curacion degradable de manera controlable. - Google Patents

Composicion de heteroatomo carbociclico o resina epoxica y agente de curacion y agente de curacion degradable de manera controlable.

Info

Publication number
MXPA01013054A
MXPA01013054A MXPA01013054A MXPA01013054A MXPA01013054A MX PA01013054 A MXPA01013054 A MX PA01013054A MX PA01013054 A MXPA01013054 A MX PA01013054A MX PA01013054 A MXPA01013054 A MX PA01013054A MX PA01013054 A MXPA01013054 A MX PA01013054A
Authority
MX
Mexico
Prior art keywords
carbocyclic
heteroatom
epoxy resin
curing agent
degradable composition
Prior art date
Application number
MXPA01013054A
Other languages
English (en)
Inventor
Takahisa Doba
Original Assignee
Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Corp filed Critical Loctite Corp
Publication of MXPA01013054A publication Critical patent/MXPA01013054A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • H10W72/071—
    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W74/47—
    • H10W72/073—
    • H10W72/856—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
MXPA01013054A 1999-06-17 2000-06-16 Composicion de heteroatomo carbociclico o resina epoxica y agente de curacion y agente de curacion degradable de manera controlable. MXPA01013054A (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US13948699P 1999-06-17 1999-06-17
US19339200P 2000-03-31 2000-03-31
US19339100P 2000-03-31 2000-03-31
US21047000P 2000-06-09 2000-06-09
PCT/US2000/011878 WO2000079582A1 (en) 1999-06-17 2000-06-16 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent

Publications (1)

Publication Number Publication Date
MXPA01013054A true MXPA01013054A (es) 2003-08-20

Family

ID=27495368

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA01013054A MXPA01013054A (es) 1999-06-17 2000-06-16 Composicion de heteroatomo carbociclico o resina epoxica y agente de curacion y agente de curacion degradable de manera controlable.

Country Status (8)

Country Link
EP (1) EP1194953A4 (es)
JP (1) JP4718070B2 (es)
KR (1) KR100372211B1 (es)
CN (1) CN1178287C (es)
AU (1) AU5722700A (es)
CA (1) CA2374187A1 (es)
MX (1) MXPA01013054A (es)
WO (1) WO2000079582A1 (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4609617B2 (ja) * 2000-08-01 2011-01-12 日本電気株式会社 半導体装置の実装方法及び実装構造体
CN1276490C (zh) 2000-11-14 2006-09-20 亨凯尔公司 硅晶片应用的助焊和填缝材料,和用其制造的层状电子组件
US6800371B2 (en) * 2001-03-07 2004-10-05 3M Innovative Properties Company Adhesives and adhesive compositions containing thioether groups
EP1674495A1 (en) * 2004-12-22 2006-06-28 Huntsman Advanced Materials (Switzerland) GmbH Coating system
KR100671137B1 (ko) 2004-12-30 2007-01-17 제일모직주식회사 재작업이 가능한 반도체 소자 언더필용 액상 에폭시 수지조성물 및 이를 이용한 반도체 소자
WO2007050611A1 (en) * 2005-10-25 2007-05-03 Henkel Corporation Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
KR101148051B1 (ko) * 2005-12-26 2012-05-25 에스케이케미칼주식회사 에폭시 수지 조성물
JP4923946B2 (ja) * 2006-10-24 2012-04-25 ダイソー株式会社 ポリエーテル系多元共重合体およびその架橋物
JP4931079B2 (ja) * 2007-12-21 2012-05-16 パナソニック株式会社 アンダーフィル用液状熱硬化性樹脂組成物とそれを用いた半導体装置
JP5098997B2 (ja) * 2008-12-22 2012-12-12 富士通株式会社 半導体装置とそのリペア方法、及び半導体装置の製造方法
KR101266540B1 (ko) 2008-12-31 2013-05-23 제일모직주식회사 반도체 소자 언더필용 액상 에폭시 수지 조성물 및 이를 이용한 반도체 소자
CN102153724A (zh) * 2010-02-11 2011-08-17 中国科学院化学研究所 芳香族聚醚缩水甘油醚环氧树脂及其制备方法
KR101877088B1 (ko) * 2011-05-31 2018-07-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그 및 적층판
SG11201503925QA (en) * 2012-11-28 2015-06-29 Mitsubishi Gas Chemical Co Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board
JP6596412B2 (ja) * 2013-03-22 2019-10-23 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ジエン／ジエノフィル対および補修性を有する熱硬化性樹脂組成物
JP6097815B1 (ja) 2015-12-18 2017-03-15 古河電気工業株式会社 接着剤組成物、これを用いた被着体の接合方法および積層体の製造方法
CN106117518A (zh) * 2016-06-22 2016-11-16 柳州市强威锻造厂 一种咪唑类环氧树脂固化配方
CN108530661B (zh) * 2018-02-14 2020-09-25 苏州大学 一种超疏水电热环氧树脂复合材料及其制备与自修复方法
CN110213905B (zh) * 2019-05-27 2021-01-08 维沃移动通信有限公司 一种组装电路板的封装方法、组装电路板及终端
KR20220085616A (ko) 2020-12-15 2022-06-22 삼성전자주식회사 에폭시 화합물, 이로부터 얻어지는 조성물, 반도체 장치, 전자 장치, 물품 및 에폭시 화합물 제조 방법
US12319781B2 (en) 2022-02-16 2025-06-03 International Business Machines Corporation Rehealable and reworkable polymer for electronic packaging

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842290A (ja) * 1981-09-07 1983-03-11 日立化成工業株式会社 可撓性印刷回路用基板
JPS62295029A (ja) * 1986-06-16 1987-12-22 Hitachi Ltd 液晶表示素子
JPS63159426A (ja) * 1986-12-23 1988-07-02 Sumitomo Bakelite Co Ltd 可撓性エポキシ樹脂組成物
JPH0218412A (ja) * 1988-07-07 1990-01-22 Sumitomo Bakelite Co Ltd 可撓性エポキシ樹脂組成物
JP2728106B2 (ja) * 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子パッケージングにおける除去可能なデバイス保護のための開裂性ジエポキシド
JP3193112B2 (ja) * 1992-03-25 2001-07-30 株式会社タイルメント 一液系可撓性エポキシ樹脂組成物並びにそれからなるシーリング材または接着剤
JP3339083B2 (ja) * 1992-10-27 2002-10-28 新日本理化株式会社 エポキシ樹脂組成物
JP2742190B2 (ja) * 1992-12-18 1998-04-22 株式会社トクヤマ 硬化性導電組成物
JPH06256468A (ja) * 1993-03-08 1994-09-13 Toray Chiokoole Kk 透水性舗装用バインダー樹脂
JP3399095B2 (ja) * 1994-07-04 2003-04-21 新日本理化株式会社 液状エポキシ樹脂組成物
US5932682A (en) * 1995-12-19 1999-08-03 International Business Machines Corporation Cleavable diepoxide for removable epoxy compositions
JPH09316421A (ja) * 1996-03-27 1997-12-09 Sumitomo Seika Chem Co Ltd 接着剤
US6008266A (en) * 1996-08-14 1999-12-28 International Business Machines Corporation Photosensitive reworkable encapsulant
JPH10120753A (ja) * 1996-10-17 1998-05-12 Hitachi Chem Co Ltd 封止用成形材料及び電子部品
JPH10152554A (ja) * 1996-11-21 1998-06-09 Nippon Kayaku Co Ltd エネルギー線硬化性組成物及びその硬化物
JPH1117074A (ja) * 1997-06-26 1999-01-22 Jsr Corp 半導体封止用組成物および半導体装置

Also Published As

Publication number Publication date
JP4718070B2 (ja) 2011-07-06
EP1194953A1 (en) 2002-04-10
CA2374187A1 (en) 2000-12-28
KR100372211B1 (ko) 2003-02-14
AU5722700A (en) 2001-01-09
WO2000079582A1 (en) 2000-12-28
KR20020027352A (ko) 2002-04-13
EP1194953A4 (en) 2002-09-04
CN1178287C (zh) 2004-12-01
WO2000079582A9 (en) 2001-03-15
CN1384975A (zh) 2002-12-11
JP2003502484A (ja) 2003-01-21

Similar Documents

Publication Publication Date Title
MXPA01013054A (es) Composicion de heteroatomo carbociclico o resina epoxica y agente de curacion y agente de curacion degradable de manera controlable.
SG86374A1 (en) An olefinic resin composition and their moldings
GB2315269B (en) Epoxy resin composition and curing catalyst therefor
DE60011200D1 (de) Härtbare zweikomponenten-zusammensetzung und härtungsmittel dafür
DE60011160D1 (de) Sauerstoffabsorbierende Harzzusammensetzung
SG87012A1 (en) Epoxy resin composition and semiconductor device using the same
GB2288404B (en) Composition of epoxy group-containing cycloolefin resin
DE60128038D1 (de) Härtbare Harz- und Beschichtungszusammensetzung
GB2316407B (en) Modified epoxy resin, epoxy composition and cured product thereof
MX222601B (en) High strength epoxy adhesive and uses thereof
AU7256396A (en) Cold curing epoxy resin formulations
DE69730932D1 (de) Härtbare Harzzusammensetzung, Klebmittel sowie Schichtstoff daraus
DE60006183D1 (de) Härtungsbeschleuniger und Harzzusammensetzung
EP1153982A4 (en) NETWORKABLE RESIN COMPOSITION
AU2002239716A1 (en) Hardener for epoxy of polyols and n-containing hardener
HUP9600836A2 (en) Curing agent for elastic epoxy resin-systems, epoxy resin dispersion and the use thereof
SG92753A1 (en) N-sulfornyloxyimide compound and radiation-sensitive resin composition using the same
SG87144A1 (en) Flexible resin composition and uses thereof
EP0932648A4 (en) EPOXY CURING AGENT
NO20004324L (no) Fotoherdbar resin-sammensetning og fremgangsmåte for herding av samme
EP1440991A4 (en) HARDENING COMPOSITION FOR EPOXY RESINS, EPOXY RESIN COMPOSITION AND USE THEREOF
SG63691A1 (en) Epoxy resin epoxy resin composition and hardened product thereof
BR9914454B1 (pt) composiÇço de resina epàxi e mÉtodo para preparar uma dispersço aquosa estÁvel de uma resina epàxi.
AU2001247541A1 (en) Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent
AU5225999A (en) Epoxy curing agent of phenol-aldehyde reacted with polyamine