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AU5722700A - Controllably degradable composition of heteroatom carbocyclic or epoxy resin andcuring agent - Google Patents

Controllably degradable composition of heteroatom carbocyclic or epoxy resin andcuring agent

Info

Publication number
AU5722700A
AU5722700A AU57227/00A AU5722700A AU5722700A AU 5722700 A AU5722700 A AU 5722700A AU 57227/00 A AU57227/00 A AU 57227/00A AU 5722700 A AU5722700 A AU 5722700A AU 5722700 A AU5722700 A AU 5722700A
Authority
AU
Australia
Prior art keywords
andcuring
carbocyclic
heteroatom
agent
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU57227/00A
Inventor
Takahisa Doba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Loctite Corp
Original Assignee
Loctite Japan Corp
Henkel Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Japan Corp, Henkel Loctite Corp filed Critical Loctite Japan Corp
Publication of AU5722700A publication Critical patent/AU5722700A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • H10W72/071—
    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W74/47—
    • H10W72/073—
    • H10W72/856—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Wire Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AU57227/00A 1999-06-17 2000-06-16 Controllably degradable composition of heteroatom carbocyclic or epoxy resin andcuring agent Abandoned AU5722700A (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US13948699P 1999-06-17 1999-06-17
US60139486 1999-06-17
US19339100P 2000-03-31 2000-03-31
US19339200P 2000-03-31 2000-03-31
US60193391 2000-03-31
US60193392 2000-03-31
US21047000P 2000-06-09 2000-06-09
US60210470 2000-06-09
PCT/US2000/011878 WO2000079582A1 (en) 1999-06-17 2000-06-16 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent

Publications (1)

Publication Number Publication Date
AU5722700A true AU5722700A (en) 2001-01-09

Family

ID=27495368

Family Applications (1)

Application Number Title Priority Date Filing Date
AU57227/00A Abandoned AU5722700A (en) 1999-06-17 2000-06-16 Controllably degradable composition of heteroatom carbocyclic or epoxy resin andcuring agent

Country Status (8)

Country Link
EP (1) EP1194953A4 (en)
JP (1) JP4718070B2 (en)
KR (1) KR100372211B1 (en)
CN (1) CN1178287C (en)
AU (1) AU5722700A (en)
CA (1) CA2374187A1 (en)
MX (1) MXPA01013054A (en)
WO (1) WO2000079582A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4609617B2 (en) * 2000-08-01 2011-01-12 日本電気株式会社 Semiconductor device mounting method and mounting structure
AU2002245103A1 (en) 2000-11-14 2002-07-30 Henkel Loctite Corporation Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
US6800371B2 (en) * 2001-03-07 2004-10-05 3M Innovative Properties Company Adhesives and adhesive compositions containing thioether groups
EP1674495A1 (en) * 2004-12-22 2006-06-28 Huntsman Advanced Materials (Switzerland) GmbH Coating system
KR100671137B1 (en) 2004-12-30 2007-01-17 제일모직주식회사 Liquid epoxy resin composition for refilling semiconductor device underfill and semiconductor device using same
WO2007050611A1 (en) * 2005-10-25 2007-05-03 Henkel Corporation Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
KR101148051B1 (en) * 2005-12-26 2012-05-25 에스케이케미칼주식회사 Epoxy resin composition
JP4923946B2 (en) * 2006-10-24 2012-04-25 ダイソー株式会社 Polyether-based multi-component copolymer and cross-linked product thereof
JP4931079B2 (en) * 2007-12-21 2012-05-16 パナソニック株式会社 Liquid thermosetting resin composition for underfill and semiconductor device using the same
JP5098997B2 (en) * 2008-12-22 2012-12-12 富士通株式会社 Semiconductor device, repair method thereof, and manufacturing method of semiconductor device
KR101266540B1 (en) 2008-12-31 2013-05-23 제일모직주식회사 Liquid epoxy resin composition for underfilling semiconductor device and semiconductor device using the same
CN102153724A (en) * 2010-02-11 2011-08-17 中国科学院化学研究所 Aromatic polyether glycidyl ether epoxide resin and preparation method of aromatic polyether glycidyl ether epoxide resin
US9480164B2 (en) 2011-05-31 2016-10-25 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, and laminate
CN104837922B (en) 2012-11-28 2019-05-10 三菱瓦斯化学株式会社 Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board
WO2014153513A1 (en) 2013-03-22 2014-09-25 Henkel IP & Holding GmbH Diene/dienophile couples and thermosetting resin compositions having reworkability
JP6097815B1 (en) * 2015-12-18 2017-03-15 古河電気工業株式会社 Adhesive composition, adherend bonding method using the same, and laminate manufacturing method
CN106117518A (en) * 2016-06-22 2016-11-16 柳州市强威锻造厂 A kind of imidazoles epoxy resin cure formula
CN108530661B (en) * 2018-02-14 2020-09-25 苏州大学 A kind of super-hydrophobic electrothermal epoxy resin composite material and its preparation and self-healing method
CN110213905B (en) * 2019-05-27 2021-01-08 维沃移动通信有限公司 Packaging method for assembling circuit board, assembling circuit board and terminal
KR20220085616A (en) 2020-12-15 2022-06-22 삼성전자주식회사 Epoxy compound, Composition prepared therefrom, Semiconductor device prepared therefrom, Electronic Device prepared therefrom, Article prepared therefrom, and Method for preparing article
US12319781B2 (en) 2022-02-16 2025-06-03 International Business Machines Corporation Rehealable and reworkable polymer for electronic packaging

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842290A (en) * 1981-09-07 1983-03-11 日立化成工業株式会社 Substrate for flexible printed circuit
JPS62295029A (en) * 1986-06-16 1987-12-22 Hitachi Ltd Liquid crystal display element
JPS63159426A (en) * 1986-12-23 1988-07-02 Sumitomo Bakelite Co Ltd Flexible epoxy resin composition
JPH0218412A (en) * 1988-07-07 1990-01-22 Sumitomo Bakelite Co Ltd Flexible epoxy resin composition
JP2728106B2 (en) * 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション Cleavable diepoxide for removable device protection in electronic packaging
JP3193112B2 (en) * 1992-03-25 2001-07-30 株式会社タイルメント One-part flexible epoxy resin composition and sealing material or adhesive comprising the same
JP3339083B2 (en) * 1992-10-27 2002-10-28 新日本理化株式会社 Epoxy resin composition
JP2742190B2 (en) * 1992-12-18 1998-04-22 株式会社トクヤマ Curable conductive composition
JPH06256468A (en) * 1993-03-08 1994-09-13 Toray Chiokoole Kk Binder resin for water-permeable pavement
JP3399095B2 (en) * 1994-07-04 2003-04-21 新日本理化株式会社 Liquid epoxy resin composition
US5932682A (en) * 1995-12-19 1999-08-03 International Business Machines Corporation Cleavable diepoxide for removable epoxy compositions
JPH09316421A (en) * 1996-03-27 1997-12-09 Sumitomo Seika Chem Co Ltd Adhesive
US6008266A (en) * 1996-08-14 1999-12-28 International Business Machines Corporation Photosensitive reworkable encapsulant
JPH10120753A (en) * 1996-10-17 1998-05-12 Hitachi Chem Co Ltd Molding material for sealing and electronic part
JPH10152554A (en) * 1996-11-21 1998-06-09 Nippon Kayaku Co Ltd Composition curable by energy ray and its cured product
JPH1117074A (en) * 1997-06-26 1999-01-22 Jsr Corp Semiconductor sealing composition and semiconductor device

Also Published As

Publication number Publication date
EP1194953A1 (en) 2002-04-10
WO2000079582A1 (en) 2000-12-28
CA2374187A1 (en) 2000-12-28
JP2003502484A (en) 2003-01-21
EP1194953A4 (en) 2002-09-04
KR20020027352A (en) 2002-04-13
JP4718070B2 (en) 2011-07-06
CN1384975A (en) 2002-12-11
MXPA01013054A (en) 2003-08-20
KR100372211B1 (en) 2003-02-14
WO2000079582A9 (en) 2001-03-15
CN1178287C (en) 2004-12-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase