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MX2022004241A - Aleacion de soldadura, pasta de soldadura, bola de soldadura, preforma de soldadura, junta de soldadura, circuito electronico en vehiculo, circuito electronico de ecu, dispositivo de circuito electronico en vehiculo y dispositivo de circuito electronico de ecu. - Google Patents

Aleacion de soldadura, pasta de soldadura, bola de soldadura, preforma de soldadura, junta de soldadura, circuito electronico en vehiculo, circuito electronico de ecu, dispositivo de circuito electronico en vehiculo y dispositivo de circuito electronico de ecu.

Info

Publication number
MX2022004241A
MX2022004241A MX2022004241A MX2022004241A MX2022004241A MX 2022004241 A MX2022004241 A MX 2022004241A MX 2022004241 A MX2022004241 A MX 2022004241A MX 2022004241 A MX2022004241 A MX 2022004241A MX 2022004241 A MX2022004241 A MX 2022004241A
Authority
MX
Mexico
Prior art keywords
electronic circuit
solder
circuit device
ecu
soldering
Prior art date
Application number
MX2022004241A
Other languages
English (en)
Inventor
Shunsaku Yoshikawa
Takashi Saito
Takahiro MATSUFUJI
Kanta DEI
Yuuki Iijima
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MX2022004241A publication Critical patent/MX2022004241A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)

Abstract

Una aleación de soldadura comprende Ag: 3.1 a 4.0% en masa, Cu: 0.6 a 0.8% en masa, Bi: 1.5 a 5.5% en masa, Sb: 1.0 a 6.0% en masa, Co: 0.001 a 0.030% en masa, Fe: 0.02 a 0.05% en masa, y el resto Sn.
MX2022004241A 2020-06-23 2021-06-22 Aleacion de soldadura, pasta de soldadura, bola de soldadura, preforma de soldadura, junta de soldadura, circuito electronico en vehiculo, circuito electronico de ecu, dispositivo de circuito electronico en vehiculo y dispositivo de circuito electronico de ecu. MX2022004241A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020107816A JP6889387B1 (ja) 2020-06-23 2020-06-23 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置
PCT/JP2021/023598 WO2021261486A1 (ja) 2020-06-23 2021-06-22 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置

Publications (1)

Publication Number Publication Date
MX2022004241A true MX2022004241A (es) 2023-05-18

Family

ID=76429566

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022004241A MX2022004241A (es) 2020-06-23 2021-06-22 Aleacion de soldadura, pasta de soldadura, bola de soldadura, preforma de soldadura, junta de soldadura, circuito electronico en vehiculo, circuito electronico de ecu, dispositivo de circuito electronico en vehiculo y dispositivo de circuito electronico de ecu.

Country Status (14)

Country Link
US (2) US12053843B2 (es)
EP (1) EP4019652B1 (es)
JP (1) JP6889387B1 (es)
KR (1) KR102491517B1 (es)
CN (1) CN114746209B (es)
BR (1) BR112022004264B1 (es)
CA (1) CA3156067C (es)
ES (1) ES2960421T3 (es)
MX (1) MX2022004241A (es)
MY (1) MY195124A (es)
PH (1) PH12022550696A1 (es)
PT (1) PT4019652T (es)
TW (1) TWI825437B (es)
WO (1) WO2021261486A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112022007400T5 (de) * 2022-06-20 2025-04-03 Mitsubishi Electric Corporation Lötverbindungselement, Halbleitervorrichtung, Lötverbindungsverfahren und Verfahren zum Herstellen einer Halbleitervorrichtung
CN115446493A (zh) * 2022-08-31 2022-12-09 昆明理工大学 一种含Bi、Sb、Yb的高润湿性Sn-Ag-Cu系无铅钎料
JP7323853B1 (ja) 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7323854B1 (ja) * 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7323855B1 (ja) 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7376842B1 (ja) * 2023-02-21 2023-11-09 千住金属工業株式会社 はんだ合金、はんだボール、はんだペースト及びはんだ継手
CN116140864A (zh) * 2023-03-27 2023-05-23 中山翰华锡业有限公司 环保型高熔点焊锡膏及其制备方法

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US6253988B1 (en) * 1999-03-29 2001-07-03 Antaya Technologies Corporation Low temperature solder
JP2002018589A (ja) * 2000-07-03 2002-01-22 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
US6660226B1 (en) * 2000-08-07 2003-12-09 Murata Manufacturing Co., Ltd. Lead free solder and soldered article
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
KR101265449B1 (ko) 2007-07-13 2013-05-16 센주긴조쿠고교 가부시키가이샤 차재 실장용 무납 땜납과 차재 전자 회로
JP4962570B2 (ja) * 2007-07-18 2012-06-27 千住金属工業株式会社 車載電子回路用Ｉｎ入り鉛フリーはんだ
JP2015077601A (ja) 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
JP6200534B2 (ja) * 2015-03-24 2017-09-20 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
US20160279741A1 (en) 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
JP2016107343A (ja) * 2015-12-24 2016-06-20 千住金属工業株式会社 鉛フリーはんだ合金と車載電子回路
MX2018011176A (es) * 2016-03-22 2019-03-28 Tamura Seisakusho Kk Aleacion de soldadura sin plomo, composicion de fundente, composicion de pasta de soldadura, placa de circuitos electronicos y controlador electronico.
MY201476A (en) 2016-05-06 2024-02-26 Alpha Assembly Solutions Inc High reliability lead-free solder alloy
US20180102464A1 (en) 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects
JP6578393B2 (ja) * 2018-02-27 2019-09-18 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置
JP6521161B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
CN109014652A (zh) * 2018-09-26 2018-12-18 深圳市安臣焊锡制品有限公司 一种环保型焊锡材料及其制备工艺
JP2019072770A (ja) * 2018-12-05 2019-05-16 千住金属工業株式会社 鉛フリーはんだ合金と車載電子回路
JP6731037B2 (ja) * 2018-12-28 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
JP6624322B1 (ja) * 2019-03-27 2019-12-25 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手

Also Published As

Publication number Publication date
KR102491517B1 (ko) 2023-01-26
ES2960421T3 (es) 2024-03-04
BR112022004264B1 (pt) 2022-10-18
US12053843B2 (en) 2024-08-06
EP4019652A4 (en) 2022-11-23
CN114746209B (zh) 2023-06-09
BR112022004264A2 (pt) 2022-05-31
PT4019652T (pt) 2023-09-25
US20220355420A1 (en) 2022-11-10
MY195124A (en) 2023-01-11
PH12022550696A1 (en) 2023-03-27
CA3156067A1 (en) 2021-12-30
KR20220065093A (ko) 2022-05-19
TWI825437B (zh) 2023-12-11
WO2021261486A1 (ja) 2021-12-30
US20240342838A1 (en) 2024-10-17
TW202204079A (zh) 2022-02-01
CA3156067C (en) 2023-03-14
EP4019652A1 (en) 2022-06-29
EP4019652B1 (en) 2023-09-06
JP2022002855A (ja) 2022-01-11
JP6889387B1 (ja) 2021-06-18
CN114746209A (zh) 2022-07-12

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