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MX2019002740A - Sistemas de enfriamiento para dispositivos dispuestos en filas. - Google Patents

Sistemas de enfriamiento para dispositivos dispuestos en filas.

Info

Publication number
MX2019002740A
MX2019002740A MX2019002740A MX2019002740A MX2019002740A MX 2019002740 A MX2019002740 A MX 2019002740A MX 2019002740 A MX2019002740 A MX 2019002740A MX 2019002740 A MX2019002740 A MX 2019002740A MX 2019002740 A MX2019002740 A MX 2019002740A
Authority
MX
Mexico
Prior art keywords
rows
electronic equipment
air
cold aisle
air duct
Prior art date
Application number
MX2019002740A
Other languages
English (en)
Other versions
MX386369B (es
Inventor
Heim Frank
J Gebke Kevin
L Kaufmann Nicholas
SLOAN Philip
Original Assignee
Rite Hite Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rite Hite Holding Corp filed Critical Rite Hite Holding Corp
Publication of MX2019002740A publication Critical patent/MX2019002740A/es
Publication of MX386369B publication Critical patent/MX386369B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Ventilation (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Se describen sistemas de enfriamiento para dispositivos dispuestos en filas. Un sistema de enfriamiento ejemplar incluye un conducto de aire inflable para posicionarse sobre un pasillo frío definido entre dos filas de equipos electrónicos. El conducto de aire inflable debe ser permeable al aire para suministrar aire acondicionado en el pasillo frío. Los equipos electrónicos tienen ventiladores para forzar el aire frío dentro del pasillo frío a través de los equipos electrónicos a los pasillos calientes adyacentes en lados opuestos de las dos filas de los equipos electrónicos. El conducto de aire inflable para estar separado de las filas de computadoras de manera que el pasillo frío se encuentre en comunicación fluida no obstruida con los pasillos calientes adyacentes sobre la cima de las filas de equipos electrónicos. El aire acondicionado suministrado desde el conducto de aire inflable para evitar substancialmente una mezcla de aire caliente en los pasillos calientes con el aire frío en el pasillo frío.
MX2019002740A 2016-09-09 2017-09-05 Sistemas de enfriamiento para dispositivos dispuestos en filas MX386369B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/261,280 US10251312B2 (en) 2016-09-09 2016-09-09 Cooling systems for devices arranged in rows
PCT/US2017/050092 WO2018048804A1 (en) 2016-09-09 2017-09-05 Cooling systems for devices arranged in rows

Publications (2)

Publication Number Publication Date
MX2019002740A true MX2019002740A (es) 2019-06-20
MX386369B MX386369B (es) 2025-03-18

Family

ID=59846753

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019002740A MX386369B (es) 2016-09-09 2017-09-05 Sistemas de enfriamiento para dispositivos dispuestos en filas

Country Status (8)

Country Link
US (1) US10251312B2 (es)
EP (3) EP3713382B1 (es)
CN (1) CN109691254B (es)
AU (1) AU2017324277B2 (es)
CA (1) CA3035838C (es)
DK (2) DK3713382T3 (es)
MX (1) MX386369B (es)
WO (1) WO2018048804A1 (es)

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US10908658B2 (en) * 2018-08-02 2021-02-02 Core Scientific, Inc. System and method for cooling computing devices within a facility
US10299412B1 (en) 2018-08-02 2019-05-21 Core Scientific, Inc. System and method for cooling computing devices within a facility
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US12146685B1 (en) * 2021-07-14 2024-11-19 Core Scientific, Inc. System and method for using waste heat from computing devices

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Also Published As

Publication number Publication date
CA3035838C (en) 2021-04-13
EP3713382A1 (en) 2020-09-23
EP3510848B1 (en) 2020-05-27
EP4236647A1 (en) 2023-08-30
AU2017324277B2 (en) 2020-06-11
US10251312B2 (en) 2019-04-02
EP3510848A1 (en) 2019-07-17
CN109691254B (zh) 2020-09-08
AU2017324277A1 (en) 2019-03-21
CA3035838A1 (en) 2018-03-15
CN109691254A (zh) 2019-04-26
DK3713382T3 (da) 2023-09-18
WO2018048804A1 (en) 2018-03-15
DK3510848T3 (da) 2020-08-31
EP3713382B1 (en) 2023-06-07
MX386369B (es) 2025-03-18
US20180077822A1 (en) 2018-03-15

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