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MX2018015564A - Blindaje semiconductor sin lineas de soldadura y protrusiones. - Google Patents

Blindaje semiconductor sin lineas de soldadura y protrusiones.

Info

Publication number
MX2018015564A
MX2018015564A MX2018015564A MX2018015564A MX2018015564A MX 2018015564 A MX2018015564 A MX 2018015564A MX 2018015564 A MX2018015564 A MX 2018015564A MX 2018015564 A MX2018015564 A MX 2018015564A MX 2018015564 A MX2018015564 A MX 2018015564A
Authority
MX
Mexico
Prior art keywords
protrusions
semiconductive shield
weld lines
polymer
ethylene
Prior art date
Application number
MX2018015564A
Other languages
English (en)
Inventor
Li Wei
Sun Yabin
Chen Hongyu
Song Xiaomei
Wu Youjun
Miao Xiaoxiong
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2018015564A publication Critical patent/MX2018015564A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B9/00—Power cables
    • H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
    • H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing four or more carbon atoms
    • C08L23/0815—Copolymers of ethene with unsaturated hydrocarbons only containing four or more carbon atoms with aliphatic 1-olefins containing one carbon-to-carbon double bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Insulated Conductors (AREA)
  • Sealing Material Composition (AREA)

Abstract

Las capas de blindaje semiconductor para las construcciones de cables eléctricos están hechas de una composición que comprende: (A) Un polímero no polar a base de etileno que tiene una densidad mayor de (>) 0.90 g/cc y un índice de fusión de >20 g/10 min a 190°C/2.16 kg; (B) Un polímero polar que consiste en etileno y un éster alquílico insaturado que tiene de 4 a 20 átomos de carbono; (C) Negro de humo de acetileno; y (D) Un agente de curado; con la condición de que (1) la composición tiene una estructura separada en fases, y (2) la relación en peso del polímero no polar con respecto al polímero polar es de 0.25 a 4.
MX2018015564A 2016-06-30 2016-06-30 Blindaje semiconductor sin lineas de soldadura y protrusiones. MX2018015564A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/087870 WO2018000314A1 (en) 2016-06-30 2016-06-30 Semiconductive shield free of weld lines and protrusions

Publications (1)

Publication Number Publication Date
MX2018015564A true MX2018015564A (es) 2019-11-28

Family

ID=60784945

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018015564A MX2018015564A (es) 2016-06-30 2016-06-30 Blindaje semiconductor sin lineas de soldadura y protrusiones.

Country Status (10)

Country Link
US (1) US10726976B2 (es)
EP (1) EP3478760B1 (es)
JP (1) JP6960418B2 (es)
KR (1) KR102580573B1 (es)
CN (1) CN109348719B (es)
BR (1) BR112018077213A2 (es)
CA (1) CA3029340C (es)
MX (1) MX2018015564A (es)
TW (1) TWI734792B (es)
WO (1) WO2018000314A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110698752A (zh) * 2019-10-08 2020-01-17 深圳市晖耀电线电缆有限公司 一种导电屏蔽膜材料及其制备方法、屏蔽数据线
CN112724500B (zh) * 2020-12-29 2022-08-23 浙江万马高分子材料集团有限公司 一种半导电屏蔽料及其制备方法和应用
CN119331341A (zh) * 2024-10-28 2025-01-21 北京北化高科新技术股份有限公司 一种聚合物半导体屏蔽材料、制备方法及半导体屏蔽层

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Also Published As

Publication number Publication date
CN109348719A (zh) 2019-02-15
BR112018077213A2 (pt) 2019-04-09
JP2019527249A (ja) 2019-09-26
US20190156973A1 (en) 2019-05-23
WO2018000314A1 (en) 2018-01-04
CA3029340C (en) 2023-09-26
CN109348719B (zh) 2021-12-10
CA3029340A1 (en) 2018-01-04
TWI734792B (zh) 2021-08-01
KR20190025628A (ko) 2019-03-11
US10726976B2 (en) 2020-07-28
EP3478760A4 (en) 2020-02-26
JP6960418B2 (ja) 2021-11-05
EP3478760B1 (en) 2021-01-20
TW201809106A (zh) 2018-03-16
KR102580573B1 (ko) 2023-09-21
EP3478760A1 (en) 2019-05-08

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