PH12016500977B1 - Solvent composition for producing electric device - Google Patents
Solvent composition for producing electric deviceInfo
- Publication number
- PH12016500977B1 PH12016500977B1 PH12016500977A PH12016500977A PH12016500977B1 PH 12016500977 B1 PH12016500977 B1 PH 12016500977B1 PH 12016500977 A PH12016500977 A PH 12016500977A PH 12016500977 A PH12016500977 A PH 12016500977A PH 12016500977 B1 PH12016500977 B1 PH 12016500977B1
- Authority
- PH
- Philippines
- Prior art keywords
- solvent composition
- solvent
- interconnection
- electronic device
- electric device
- Prior art date
Links
- 239000002904 solvent Substances 0.000 title abstract 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 abstract 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 abstract 1
- 239000012965 benzophenone Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 235000010290 biphenyl Nutrition 0.000 abstract 1
- 239000004305 biphenyl Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000010304 firing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Paints Or Removers (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Provided is a solvent composition for electronic device production. The solvent composition serves as a material for a paste composition that is capable of being applied with good precision via a printing process and, by firing after application, gives an interconnection/coating in a good yield, where the interconnection/coating less suffers from the formation of ash and volatile components and has excellent electrical properties. The solvent composition according to the present invention for electronic device production includes a solvent and a compound represented by Formula (1), in which Ring Z represents a ring selected from benzene, benzophenone, biphenyl, and naphthalene; R represents, independently in each occurrence, a C6 or higher aliphatic hydrocarbon group; and n represents an integer of 3 or more, where "n" occurrences of R may be identical or different.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013254105 | 2013-12-09 | ||
| PCT/JP2014/082290 WO2015087811A1 (en) | 2013-12-09 | 2014-12-05 | Solvent composition for electric device production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PH12016500977A1 PH12016500977A1 (en) | 2016-07-11 |
| PH12016500977B1 true PH12016500977B1 (en) | 2016-07-11 |
Family
ID=53371116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12016500977A PH12016500977B1 (en) | 2013-12-09 | 2016-05-25 | Solvent composition for producing electric device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6453765B2 (en) |
| KR (1) | KR102202848B1 (en) |
| CN (1) | CN105814162B (en) |
| PH (1) | PH12016500977B1 (en) |
| WO (1) | WO2015087811A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102461100B1 (en) | 2014-07-07 | 2022-10-31 | 주식회사 다이셀 | Thickening agent and composition thickened using same |
| JP2018095661A (en) * | 2015-04-02 | 2018-06-21 | 株式会社ダイセル | Solvent composition for manufacturing electric device |
| JP6921669B2 (en) * | 2016-08-05 | 2021-08-18 | 花王株式会社 | Three-dimensional object precursor treatment agent composition |
| WO2018025704A1 (en) | 2016-08-05 | 2018-02-08 | 花王株式会社 | Composition for treating three-dimensional object precursor |
| JP6852238B2 (en) * | 2017-07-13 | 2021-03-31 | 日本特殊化学工業株式会社 | Method for producing ether composition |
| CN112133469B (en) * | 2020-09-28 | 2022-03-11 | 长春黄金研究院有限公司 | Mixed organic solvent for preparing high-temperature sintering conductive slurry |
| KR102692892B1 (en) * | 2021-01-29 | 2024-08-07 | 주식회사 아모그린텍 | Magnetic paste for printing, method for manufacturing security paper using thereof, and security paper manufactured therefrom |
| JP7205705B2 (en) * | 2021-03-05 | 2023-01-17 | 株式会社リコー | Modeling liquid and manufacturing method of modeled object |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284814A (en) * | 1997-03-31 | 1998-10-23 | Kawaguchiko Seimitsu Kk | Circuit pattern and its formation |
| JP2006299030A (en) | 2005-04-19 | 2006-11-02 | Sekisui Chem Co Ltd | Coating paste vehicle and coating paste |
| JP5401644B2 (en) * | 2007-12-28 | 2014-01-29 | 新日本理化株式会社 | Novel organogelator |
| US8178192B2 (en) * | 2008-03-06 | 2012-05-15 | Ngk Insulators, Ltd. | Ceramic green sheet, ceramic green sheet laminate, production method of ceramic green sheet, and production method of ceramic green sheet laminate |
| JP2012077195A (en) * | 2010-10-01 | 2012-04-19 | National Institute Of Advanced Industrial Science & Technology | Method for adjusting viscosity of fluid organic substance, and viscosity adjusting agent for the same |
| JP5940790B2 (en) * | 2010-10-26 | 2016-06-29 | 株式会社ダイセル | Solvent for printing or solvent composition |
| JP5733612B2 (en) * | 2011-03-08 | 2015-06-10 | 国立大学法人信州大学 | Material for organic semiconductor thin film, method of forming organic semiconductor thin film using the material, and organic thin film transistor |
| US9315720B2 (en) * | 2011-09-23 | 2016-04-19 | Synoil Fluids Holdings Inc. | Pyromellitamide gelling agents |
| WO2014057846A1 (en) * | 2012-10-11 | 2014-04-17 | 株式会社ダイセル | Solvent composition for manufacturing electric device |
| WO2014123110A1 (en) * | 2013-02-08 | 2014-08-14 | 株式会社ダイセル | Thickening stabilizer, and thickening/stabilizing composition using same |
| JP6312669B2 (en) * | 2013-06-25 | 2018-04-18 | 株式会社ダイセル | Thickening stabilizer and thickening and stabilizing composition using the same |
-
2014
- 2014-12-05 JP JP2015552426A patent/JP6453765B2/en not_active Expired - Fee Related
- 2014-12-05 KR KR1020167014745A patent/KR102202848B1/en not_active Expired - Fee Related
- 2014-12-05 CN CN201480067318.XA patent/CN105814162B/en not_active Expired - Fee Related
- 2014-12-05 WO PCT/JP2014/082290 patent/WO2015087811A1/en not_active Ceased
-
2016
- 2016-05-25 PH PH12016500977A patent/PH12016500977B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR102202848B1 (en) | 2021-01-14 |
| WO2015087811A1 (en) | 2015-06-18 |
| JP6453765B2 (en) | 2019-01-16 |
| PH12016500977A1 (en) | 2016-07-11 |
| JPWO2015087811A1 (en) | 2017-03-16 |
| CN105814162A (en) | 2016-07-27 |
| CN105814162B (en) | 2019-03-29 |
| KR20160094958A (en) | 2016-08-10 |
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