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MX2018005902A - Disposición y procedimiento de pulverización para la distribución optimizada del flujo de energía. - Google Patents

Disposición y procedimiento de pulverización para la distribución optimizada del flujo de energía.

Info

Publication number
MX2018005902A
MX2018005902A MX2018005902A MX2018005902A MX2018005902A MX 2018005902 A MX2018005902 A MX 2018005902A MX 2018005902 A MX2018005902 A MX 2018005902A MX 2018005902 A MX2018005902 A MX 2018005902A MX 2018005902 A MX2018005902 A MX 2018005902A
Authority
MX
Mexico
Prior art keywords
disposition
energy flow
optimized distribution
spraying procedure
spray
Prior art date
Application number
MX2018005902A
Other languages
English (en)
Other versions
MX389814B (es
Inventor
Lendi Daniel
Krassnitzer Siegfried
Kurapov Denis
Original Assignee
Oerlikon Surface Solutions Ag Pfaeffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Pfaeffikon filed Critical Oerlikon Surface Solutions Ag Pfaeffikon
Publication of MX2018005902A publication Critical patent/MX2018005902A/es
Publication of MX389814B publication Critical patent/MX389814B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Nozzles (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

La presente invención se refiere a una disposición de pulverización, una instalación de revestimiento bajo vacío y un procedimiento para realizar procesos de revestimiento HiPIMS, en que la disposición de pulverización presenta por lo menos dos posibilidades de conexión diferentes, y en que mediante la conmutación a la segunda posibilidad de conexión, cuando dos subdisposiciones de pulverización funcionan simultáneamente con altos impulsos de potencia, se logra una ganancia de productividad.
MX2018005902A 2015-11-12 2016-11-14 Disposición y procedimiento de pulverización para la distribución optimizada del flujo de energía MX389814B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562254451P 2015-11-12 2015-11-12
PCT/EP2016/001891 WO2017080672A1 (de) 2015-11-12 2016-11-14 Sputter-anordnung und - verfahren zur optimierten verteilung des energieflusses

Publications (2)

Publication Number Publication Date
MX2018005902A true MX2018005902A (es) 2019-04-04
MX389814B MX389814B (es) 2025-03-20

Family

ID=57354318

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018005902A MX389814B (es) 2015-11-12 2016-11-14 Disposición y procedimiento de pulverización para la distribución optimizada del flujo de energía

Country Status (17)

Country Link
US (1) US10943774B2 (es)
EP (1) EP3375006B1 (es)
JP (1) JP6895432B2 (es)
KR (1) KR102738210B1 (es)
CN (1) CN108352286B (es)
BR (1) BR112018009585B1 (es)
CA (1) CA3004920C (es)
ES (1) ES2883198T3 (es)
HU (1) HUE055816T2 (es)
IL (1) IL259263B (es)
MX (1) MX389814B (es)
MY (1) MY193962A (es)
PH (1) PH12018501018A1 (es)
PL (1) PL3375006T3 (es)
RU (1) RU2741614C2 (es)
SG (1) SG11201803970RA (es)
WO (1) WO2017080672A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7509790B2 (ja) 2019-02-11 2024-07-02 アプライド マテリアルズ インコーポレイテッド パルスｐｖｄにおけるプラズマ改質によるウエハからの粒子除去方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19651615C1 (de) * 1996-12-12 1997-07-10 Fraunhofer Ges Forschung Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern
US9771648B2 (en) * 2004-08-13 2017-09-26 Zond, Inc. Method of ionized physical vapor deposition sputter coating high aspect-ratio structures
EP2272080B1 (de) 2008-04-28 2012-08-01 CemeCon AG Vorrichtung und verfahren zum vorbehandeln und beschichten von körpern
RU2371514C1 (ru) * 2008-08-20 2009-10-27 Государственное образовательное учреждение высшего профессионального образования "Томский политехнический университет" Дуальная магнетронная распылительная система
DE102008050499B4 (de) * 2008-10-07 2014-02-06 Systec System- Und Anlagentechnik Gmbh & Co. Kg PVD-Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens und nach dem Verfahren beschichtete Substrate
DE102011018363A1 (de) * 2011-04-20 2012-10-25 Oerlikon Trading Ag, Trübbach Hochleistungszerstäubungsquelle
WO2012143091A1 (de) 2011-04-20 2012-10-26 Oerlikon Trading Ag, Trübbach Verfahren zur bereistellung sequenzieller leistungspulse
DE102011116576A1 (de) 2011-10-21 2013-04-25 Oerlikon Trading Ag, Trübbach Bohrer mit Beschichtung

Also Published As

Publication number Publication date
CA3004920A1 (en) 2017-05-18
ES2883198T3 (es) 2021-12-07
KR102738210B1 (ko) 2024-12-05
IL259263A (en) 2018-07-31
MY193962A (en) 2022-11-03
HUE055816T2 (hu) 2021-12-28
JP6895432B2 (ja) 2021-06-30
US10943774B2 (en) 2021-03-09
IL259263B (en) 2022-04-01
EP3375006B1 (de) 2021-05-12
EP3375006A1 (de) 2018-09-19
CA3004920C (en) 2024-01-23
KR20180081776A (ko) 2018-07-17
RU2018120892A3 (es) 2020-01-30
SG11201803970RA (en) 2018-06-28
CN108352286A (zh) 2018-07-31
BR112018009585B1 (pt) 2022-12-27
RU2018120892A (ru) 2019-12-13
PL3375006T3 (pl) 2021-11-22
CN108352286B (zh) 2020-12-22
US20180330931A1 (en) 2018-11-15
RU2741614C2 (ru) 2021-01-27
JP2018535323A (ja) 2018-11-29
BR112018009585A2 (pt) 2018-12-04
MX389814B (es) 2025-03-20
PH12018501018A1 (en) 2018-12-17
WO2017080672A1 (de) 2017-05-18

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