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MX2018000332A - Disipador termico. - Google Patents

Disipador termico.

Info

Publication number
MX2018000332A
MX2018000332A MX2018000332A MX2018000332A MX2018000332A MX 2018000332 A MX2018000332 A MX 2018000332A MX 2018000332 A MX2018000332 A MX 2018000332A MX 2018000332 A MX2018000332 A MX 2018000332A MX 2018000332 A MX2018000332 A MX 2018000332A
Authority
MX
Mexico
Prior art keywords
heat sink
heat
thermal heat
thermal radiation
dissipating sheet
Prior art date
Application number
MX2018000332A
Other languages
English (en)
Inventor
Moriyama Hirotake
Hayashi Akihiro
Original Assignee
Sumitomo Seika Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Seika Chemicals filed Critical Sumitomo Seika Chemicals
Publication of MX2018000332A publication Critical patent/MX2018000332A/es

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H10W40/10—
    • H10W40/22—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/06—Coatings; Surface treatments having particular radiating, reflecting or absorbing features, e.g. for improving heat transfer by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)

Abstract

Se proporciona un disipador térmico que sea ligero, fácil de trabajar y que tenga una buena capacidad de enfriamiento. Un disipador térmico X1 de la presente invención incluye una carcasa cuasi-tubular 1 que se fija a un objetivo de enfriamiento 01 y se conforma mediante una lámina termodisipadora. La lámina termodisipadora tiene una capa de transferencia de calor 1A y una capa de radiación térmica 1B laminada sobre la capa de transferencia de calor 1A. La capa de radiación térmica 1B constituye al menos una parte de una superficie exterior de la carcasa 1 situada lejos del objetivo de enfriamiento 01.
MX2018000332A 2015-07-10 2016-07-01 Disipador termico. MX2018000332A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015138934A JP2018139236A (ja) 2015-07-10 2015-07-10 ヒートシンク
PCT/JP2016/069664 WO2017010322A1 (ja) 2015-07-10 2016-07-01 ヒートシンク

Publications (1)

Publication Number Publication Date
MX2018000332A true MX2018000332A (es) 2018-06-07

Family

ID=57756967

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018000332A MX2018000332A (es) 2015-07-10 2016-07-01 Disipador termico.

Country Status (9)

Country Link
US (1) US20180195816A1 (es)
EP (1) EP3322270A4 (es)
JP (1) JP2018139236A (es)
KR (1) KR20180026735A (es)
CN (1) CN108029218A (es)
CA (1) CA2991695A1 (es)
MX (1) MX2018000332A (es)
TW (1) TW201719104A (es)
WO (1) WO2017010322A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017088809A (ja) * 2015-11-16 2017-05-25 住友精化株式会社 熱放射性塗膜形成用水性分散液、熱放射性塗膜及び放熱シート
WO2019030792A1 (ja) 2017-08-07 2019-02-14 ギガフォトン株式会社 コンデンサの冷却構造及びレーザ装置
JP6816678B2 (ja) * 2017-08-30 2021-01-20 トヨタ自動車株式会社 放熱シート
CN110416808A (zh) * 2019-07-10 2019-11-05 安徽迅科智能技术有限公司 一种弱电系统接线器
US11064632B2 (en) * 2019-09-05 2021-07-13 Ldc Precision Engineering Co., Ltd. Heat-sinking improved structure for evaporators
TWI703295B (zh) * 2019-10-15 2020-09-01 財團法人食品工業發展研究所 複合加熱裝置
KR20250070328A (ko) * 2023-11-13 2025-05-20 삼성전자주식회사 열전모듈 및 이를 포함하는 냉장고

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5564496A (en) * 1994-11-01 1996-10-15 United Technologies Corporation Composite parting sheet
JP2006093546A (ja) * 2004-09-27 2006-04-06 Oki Electric Ind Co Ltd 放熱シート、放熱筒状体およびそれらを用いた放熱構造
JP2006245523A (ja) * 2005-02-04 2006-09-14 Dainippon Printing Co Ltd 放熱シート、及びその製造方法
JP2006253601A (ja) * 2005-03-14 2006-09-21 Oki Electric Ind Co Ltd 放熱装置およびそれを用いた放熱構造
JP5193431B2 (ja) * 2006-04-18 2013-05-08 沖電線株式会社 放熱構造
JP2008091715A (ja) * 2006-10-03 2008-04-17 Techno Associe Co Ltd 放熱筒状体およびこれを用いる放熱構造
US20090303685A1 (en) * 2008-06-10 2009-12-10 Chen H W Interface module with high heat-dissipation
EP2578982A4 (en) * 2010-05-28 2015-10-28 Toyota Motor Co Ltd HEAT EXCHANGERS AND MANUFACTURING METHOD THEREFOR
JP2012078487A (ja) * 2010-09-30 2012-04-19 Sanyo Electric Co Ltd 投写型映像表示装置
JP6292549B2 (ja) * 2013-03-28 2018-03-14 住友精化株式会社 放熱フィルム、熱放射層用分散液、放熱フィルムの製造方法、及び、太陽電池
CN104919246A (zh) * 2013-03-29 2015-09-16 株式会社神户制钢所 预涂铝板材、铝板材以及车载led照明用散热器

Also Published As

Publication number Publication date
US20180195816A1 (en) 2018-07-12
KR20180026735A (ko) 2018-03-13
CN108029218A (zh) 2018-05-11
EP3322270A1 (en) 2018-05-16
CA2991695A1 (en) 2017-01-19
EP3322270A4 (en) 2018-12-26
JP2018139236A (ja) 2018-09-06
WO2017010322A1 (ja) 2017-01-19
TW201719104A (zh) 2017-06-01

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