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MX2017004574A - Aparato de electroenchapado de aleacion de cobre-niquel. - Google Patents

Aparato de electroenchapado de aleacion de cobre-niquel.

Info

Publication number
MX2017004574A
MX2017004574A MX2017004574A MX2017004574A MX2017004574A MX 2017004574 A MX2017004574 A MX 2017004574A MX 2017004574 A MX2017004574 A MX 2017004574A MX 2017004574 A MX2017004574 A MX 2017004574A MX 2017004574 A MX2017004574 A MX 2017004574A
Authority
MX
Mexico
Prior art keywords
copper
anode
chamber
redox potential
nickel alloy
Prior art date
Application number
MX2017004574A
Other languages
English (en)
Inventor
Yuasa Satoshi
Sakurai Hitoshi
Hashimoto Akira
Ono Kazunori
Original Assignee
Dipsol Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dipsol Chem filed Critical Dipsol Chem
Publication of MX2017004574A publication Critical patent/MX2017004574A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/002—Alloys based on nickel or cobalt with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Se proporciona un aparato de electroenchapado de aleación de cobre-níquel que es capaz de formar establemente un recubrimiento enchapado de cobre-níquel sobre una pieza de trabajo con una composición uniforme y que permite que un baño de enchapado se use por un período prolongado. La presente invención proporciona un aparato. de electroenchapado de aleación de cobre-níquel (1), que comprende: una cámara de cátodo (4) en la cual una pieza de trabajo (5) se va a colocar; una cámara de ánodo (6); un ánodo (7) colocado en la cámara de ánodo; un diafragma eléctricamente, conductor (14) colocado para separar la cámara de cátodo y la cámara de ánodo entre sí; un tanque de ajuste de potencial de oxidación-reducción de cámara de cátodo (8) para ajustar el potencial de oxidación-reducción de un líquido de enchapado en la cámara de cátodo; un tanque de ajuste de potencial de oxidación-reducción de cámara de ánodo (10) para ajustar el potencial de oxidación-reducción de un líquido de enchapado en la cámara de ánodo; y una unidad de suministro de energía (36) que proporciona una corriente eléctrica para fluir entre la pieza de trabajo y el ánodo.
MX2017004574A 2014-10-17 2015-06-25 Aparato de electroenchapado de aleacion de cobre-niquel. MX2017004574A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014212524A JP6435546B2 (ja) 2014-10-17 2014-10-17 銅−ニッケル合金電気めっき装置
PCT/JP2015/068332 WO2016059833A1 (ja) 2014-10-17 2015-06-25 銅－ニッケル合金電気めっき装置

Publications (1)

Publication Number Publication Date
MX2017004574A true MX2017004574A (es) 2017-07-17

Family

ID=55746382

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017004574A MX2017004574A (es) 2014-10-17 2015-06-25 Aparato de electroenchapado de aleacion de cobre-niquel.

Country Status (13)

Country Link
US (1) US10538854B2 (es)
EP (1) EP3208364B1 (es)
JP (1) JP6435546B2 (es)
KR (1) KR101916614B1 (es)
CN (1) CN107075713B (es)
BR (1) BR112017007630A2 (es)
MX (1) MX2017004574A (es)
MY (1) MY190427A (es)
PH (1) PH12017500597A1 (es)
RU (1) RU2648811C1 (es)
SG (1) SG11201703049XA (es)
TW (1) TWI651438B (es)
WO (1) WO2016059833A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法
KR101872734B1 (ko) * 2017-07-20 2018-06-29 주식회사 익스톨 니켈 전기 도금액 및 이를 이용한 전기 도금 방법
JP2020097764A (ja) * 2018-12-18 2020-06-25 トヨタ自動車株式会社 成膜装置、及びそれを用いた金属膜の形成方法
CN110387573B (zh) * 2019-07-04 2021-01-05 广州兴森快捷电路科技有限公司 多废液分流方法及电镀生产系统
CA3109026A1 (en) 2020-02-18 2021-08-18 Magna Exteriors Inc. Tailgate accessibility
CN112126953B (zh) * 2020-09-10 2024-07-16 深圳市生利科技有限公司 一种铜-镍合金电镀工艺

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1019027A1 (ru) * 1982-02-16 1983-05-23 Проектно-конструкторский технологический институт машиностроения Ванна дл гальванической обработки деталей
JPH04198499A (ja) * 1990-07-20 1992-07-17 Asahi Glass Co Ltd 電位調節機構を有する銅溶解槽
KR100660485B1 (ko) 1998-11-30 2006-12-22 가부시키가이샤 에바라 세이사꾸쇼 도금장치
EP1229154A4 (en) * 2000-03-17 2006-12-13 Ebara Corp METHOD AND DEVICE FOR ELECTROPLATING
JP2004519557A (ja) * 2001-02-23 2004-07-02 株式会社荏原製作所 銅めっき液、めっき方法及びめっき装置
JP2003183898A (ja) * 2001-12-20 2003-07-03 Toho Kako Kensetsu Kk めっき液濃度自動調整装置及び方法
US20040007473A1 (en) * 2002-07-11 2004-01-15 Applied Materials, Inc. Electrolyte/organic additive separation in electroplating processes
IES20030443A2 (en) * 2003-06-16 2004-12-01 Fraudhalt Ltd A method and apparatus for determining if an optical disk originated from a valid source
US8128791B1 (en) * 2006-10-30 2012-03-06 Novellus Systems, Inc. Control of electrolyte composition in a copper electroplating apparatus
US8694933B2 (en) * 2010-07-24 2014-04-08 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for implementing electronic circuit designs with simulation awareness
JP5631775B2 (ja) * 2011-02-24 2014-11-26 新光電気工業株式会社 複合めっき液
US9518332B2 (en) * 2011-03-17 2016-12-13 Taiwan Semiconductor Manufacturing Company, Ltd. Electrochemical plating
JP6047711B2 (ja) * 2012-02-08 2016-12-21 石原ケミカル株式会社 無電解ニッケル及びニッケル合金メッキ方法、並びに当該メッキ用の前処理液
RU2588894C2 (ru) 2012-04-19 2016-07-10 Дипсол Кемикалз Ко., Лтд. Ванна для нанесения гальванического покрытия из медно-никелевого сплава и способ нанесения гальванического покрытия

Also Published As

Publication number Publication date
SG11201703049XA (en) 2017-05-30
EP3208364A4 (en) 2018-05-30
JP6435546B2 (ja) 2018-12-12
EP3208364B1 (en) 2019-08-07
PH12017500597A1 (en) 2017-08-30
RU2648811C1 (ru) 2018-03-28
US20170241040A1 (en) 2017-08-24
TWI651438B (zh) 2019-02-21
KR20170053675A (ko) 2017-05-16
BR112017007630A2 (pt) 2018-01-30
CN107075713A (zh) 2017-08-18
US10538854B2 (en) 2020-01-21
TW201615900A (zh) 2016-05-01
JP2016079460A (ja) 2016-05-16
EP3208364A1 (en) 2017-08-23
WO2016059833A1 (ja) 2016-04-21
CN107075713B (zh) 2019-09-24
KR101916614B1 (ko) 2018-11-07
MY190427A (en) 2022-04-21

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