MX2015014349A - Dispositivo de emision de luz. - Google Patents
Dispositivo de emision de luz.Info
- Publication number
- MX2015014349A MX2015014349A MX2015014349A MX2015014349A MX2015014349A MX 2015014349 A MX2015014349 A MX 2015014349A MX 2015014349 A MX2015014349 A MX 2015014349A MX 2015014349 A MX2015014349 A MX 2015014349A MX 2015014349 A MX2015014349 A MX 2015014349A
- Authority
- MX
- Mexico
- Prior art keywords
- light emitting
- emitting device
- transmitting member
- light
- light transmitting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H10W90/00—
-
- H10W90/724—
Landscapes
- Led Device Packages (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
Abstract
El propósito de la presente invención es proporcionar un dispositivo de emisión de luz que sea adicionalmente reducido en tamaño y tenga una menor irregularidad de color. La presente invención es un dispositivo de emisión de luz que es proporcionado con: un elemento de emisión de luz (1) en donde la superficie superior sirve como una superficie de extracción de luz; y un miembro de transmisión de luz (2) que tiene una superficie superior (2a) y una superficie inferior (2b) y cubre la superficie de extracción de luz del elemento de emisión de luz (1). El miembro de transmisión de luz (2) contiene un fósforo, y la superficie superior (2a) y la superficie inferior (2b) del miembro de transmisión de luz (2) son superficies planas que son paralelas entre sí. Una superficie lateral (2c) del miembro de transmisión de luz (2) está en contacto con la superficie inferior (2b) y tiene una parte proyectada (3) que sobresale en dirección lateral.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013086357 | 2013-04-17 | ||
| PCT/JP2014/058530 WO2014171277A1 (ja) | 2013-04-17 | 2014-03-26 | 発光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2015014349A true MX2015014349A (es) | 2016-06-07 |
| MX349884B MX349884B (es) | 2017-08-17 |
Family
ID=51731230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2015014349A MX349884B (es) | 2013-04-17 | 2014-03-26 | Dispositivo de emision de luz. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9496465B2 (es) |
| JP (1) | JP6444299B2 (es) |
| BR (1) | BR112015026316B1 (es) |
| MX (1) | MX349884B (es) |
| WO (1) | WO2014171277A1 (es) |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015204057B4 (de) * | 2015-03-06 | 2024-12-12 | Inventronics Gmbh | Herstellen eines Beleuchtungsmoduls |
| JP2016167518A (ja) * | 2015-03-09 | 2016-09-15 | パナソニックIpマネジメント株式会社 | 発光装置、及び、照明装置 |
| JP6481559B2 (ja) | 2015-08-18 | 2019-03-13 | 日亜化学工業株式会社 | 発光装置 |
| EP3174110B1 (en) | 2015-11-30 | 2020-12-23 | Nichia Corporation | Light emitting device |
| JP6332294B2 (ja) * | 2015-11-30 | 2018-05-30 | 日亜化学工業株式会社 | 発光装置 |
| JP6399017B2 (ja) | 2016-02-29 | 2018-10-03 | 日亜化学工業株式会社 | 発光装置 |
| EP3491679B1 (en) * | 2016-07-26 | 2023-02-22 | CreeLED, Inc. | Light emitting diodes, components and related methods |
| JP7082270B2 (ja) | 2017-08-28 | 2022-06-08 | 日亜化学工業株式会社 | 発光装置 |
| JP6729537B2 (ja) | 2017-11-20 | 2020-07-22 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP6733646B2 (ja) | 2017-11-30 | 2020-08-05 | 日亜化学工業株式会社 | 発光装置とその製造方法 |
| US20190198564A1 (en) | 2017-12-20 | 2019-06-27 | Lumileds Llc | Monolithic segmented led array architecture with islanded epitaxial growth |
| US11961875B2 (en) | 2017-12-20 | 2024-04-16 | Lumileds Llc | Monolithic segmented LED array architecture with islanded epitaxial growth |
| US10879431B2 (en) | 2017-12-22 | 2020-12-29 | Lumileds Llc | Wavelength converting layer patterning for LED arrays |
| DE102018101170A1 (de) * | 2018-01-19 | 2019-07-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches halbleiterbauteil |
| CN110323213B (zh) * | 2018-03-30 | 2024-05-03 | 日亚化学工业株式会社 | 发光装置的制造方法 |
| JP6777127B2 (ja) * | 2018-03-30 | 2020-10-28 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| US11121298B2 (en) | 2018-05-25 | 2021-09-14 | Creeled, Inc. | Light-emitting diode packages with individually controllable light-emitting diode chips |
| US11335833B2 (en) | 2018-08-31 | 2022-05-17 | Creeled, Inc. | Light-emitting diodes, light-emitting diode arrays and related devices |
| US11233183B2 (en) | 2018-08-31 | 2022-01-25 | Creeled, Inc. | Light-emitting diodes, light-emitting diode arrays and related devices |
| US11271033B2 (en) | 2018-09-27 | 2022-03-08 | Lumileds Llc | Micro light emitting devices |
| US10811460B2 (en) | 2018-09-27 | 2020-10-20 | Lumileds Holding B.V. | Micrometer scale light emitting diode displays on patterned templates and substrates |
| US10964845B2 (en) | 2018-09-27 | 2021-03-30 | Lumileds Llc | Micro light emitting devices |
| US10923628B2 (en) | 2018-09-27 | 2021-02-16 | Lumileds Llc | Micrometer scale light emitting diode displays on patterned templates and substrates |
| JP6940776B2 (ja) * | 2018-11-05 | 2021-09-29 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| CN109802015B (zh) * | 2018-12-25 | 2024-02-20 | 广东晶科电子股份有限公司 | 一种半导体器件及其封装方法 |
| EP3956925A1 (en) | 2019-04-18 | 2022-02-23 | Lumileds Holding B.V. | Lighting device |
| JP7288343B2 (ja) * | 2019-05-16 | 2023-06-07 | スタンレー電気株式会社 | 発光装置 |
| US11101411B2 (en) * | 2019-06-26 | 2021-08-24 | Creeled, Inc. | Solid-state light emitting devices including light emitting diodes in package structures |
| CN111081850A (zh) * | 2019-12-03 | 2020-04-28 | 弘凯光电(深圳)有限公司 | Led封装结构及其制作方法 |
| US11674795B2 (en) | 2019-12-18 | 2023-06-13 | Lumileds Llc | Miniature pattern projector using microLEDs and micro-optics |
| US11404473B2 (en) | 2019-12-23 | 2022-08-02 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
| US11923398B2 (en) | 2019-12-23 | 2024-03-05 | Lumileds Llc | III-nitride multi-wavelength LED arrays |
| US11569415B2 (en) | 2020-03-11 | 2023-01-31 | Lumileds Llc | Light emitting diode devices with defined hard mask opening |
| US11942507B2 (en) | 2020-03-11 | 2024-03-26 | Lumileds Llc | Light emitting diode devices |
| US11735695B2 (en) | 2020-03-11 | 2023-08-22 | Lumileds Llc | Light emitting diode devices with current spreading layer |
| US11848402B2 (en) | 2020-03-11 | 2023-12-19 | Lumileds Llc | Light emitting diode devices with multilayer composite film including current spreading layer |
| US11688832B2 (en) * | 2020-04-16 | 2023-06-27 | Creeled, Inc. | Light-altering material arrangements for light-emitting devices |
| US11901491B2 (en) | 2020-10-29 | 2024-02-13 | Lumileds Llc | Light emitting diode devices |
| US11626538B2 (en) | 2020-10-29 | 2023-04-11 | Lumileds Llc | Light emitting diode device with tunable emission |
| US12040432B2 (en) | 2020-10-30 | 2024-07-16 | Lumileds Llc | Light emitting diode devices with patterned TCO layer including different thicknesses |
| US11631786B2 (en) | 2020-11-12 | 2023-04-18 | Lumileds Llc | III-nitride multi-wavelength LED arrays with etch stop layer |
| US11955583B2 (en) | 2020-12-01 | 2024-04-09 | Lumileds Llc | Flip chip micro light emitting diodes |
| US11705534B2 (en) | 2020-12-01 | 2023-07-18 | Lumileds Llc | Methods of making flip chip micro light emitting diodes |
| US11600656B2 (en) | 2020-12-14 | 2023-03-07 | Lumileds Llc | Light emitting diode device |
| US12484346B2 (en) | 2021-09-03 | 2025-11-25 | Lumileds Singapore Pte. Ltd. | Light emitting diode devices with bonding and/or ohmic contact-reflective material |
| US12402440B2 (en) | 2021-09-03 | 2025-08-26 | Lumileds Llc | Light emitting diode devices with bonding and/or ohmic contact-reflective material |
| US12419137B2 (en) | 2021-09-10 | 2025-09-16 | Lumileds Llc | Light emitting diodes with segmented anodes by pixel |
| US12433080B2 (en) | 2021-09-29 | 2025-09-30 | Lumileds Singapore Pte. Ltd. | Hybrid CMOS micro-LED display layout |
| US12431478B2 (en) | 2021-09-29 | 2025-09-30 | Lumileds Singapore Pte. Ltd. | Hybrid CMOS micro-LED display layout |
| US11935987B2 (en) | 2021-11-03 | 2024-03-19 | Lumileds Llc | Light emitting diode arrays with a light-emitting pixel area |
| US12490570B2 (en) | 2021-11-12 | 2025-12-02 | Lumileds Singapore Pte. Ltd. | Thin-film LED array with low refractive index patterned structures |
| JPWO2023248771A1 (es) * | 2022-06-21 | 2023-12-28 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100499129B1 (ko) | 2002-09-02 | 2005-07-04 | 삼성전기주식회사 | 발광 다이오드 및 그 제조방법 |
| EP2216834B1 (en) * | 2007-11-29 | 2017-03-15 | Nichia Corporation | Light-emitting apparatus |
| JP5278023B2 (ja) | 2009-02-18 | 2013-09-04 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP5482378B2 (ja) | 2009-04-20 | 2014-05-07 | 日亜化学工業株式会社 | 発光装置 |
| JP2011204376A (ja) | 2010-03-24 | 2011-10-13 | Stanley Electric Co Ltd | 半導体発光装置 |
| JP5572013B2 (ja) * | 2010-06-16 | 2014-08-13 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| JP5566785B2 (ja) * | 2010-06-22 | 2014-08-06 | 日東電工株式会社 | 複合シート |
| JP2012038889A (ja) | 2010-08-06 | 2012-02-23 | Koito Mfg Co Ltd | 蛍光部材および発光モジュール |
| JP2012079776A (ja) * | 2010-09-30 | 2012-04-19 | Citizen Holdings Co Ltd | 半導体発光装置及びその製造方法 |
| JP2013038187A (ja) * | 2011-08-05 | 2013-02-21 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
| JP5956167B2 (ja) * | 2012-01-23 | 2016-07-27 | スタンレー電気株式会社 | 発光装置、車両用灯具及び発光装置の製造方法 |
-
2014
- 2014-03-26 US US14/785,027 patent/US9496465B2/en active Active
- 2014-03-26 WO PCT/JP2014/058530 patent/WO2014171277A1/ja not_active Ceased
- 2014-03-26 BR BR112015026316-0A patent/BR112015026316B1/pt active IP Right Grant
- 2014-03-26 JP JP2015512379A patent/JP6444299B2/ja active Active
- 2014-03-26 MX MX2015014349A patent/MX349884B/es active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US9496465B2 (en) | 2016-11-15 |
| BR112015026316B1 (pt) | 2022-01-11 |
| BR112015026316A2 (pt) | 2017-07-25 |
| US20160079486A1 (en) | 2016-03-17 |
| WO2014171277A1 (ja) | 2014-10-23 |
| JPWO2014171277A1 (ja) | 2017-02-23 |
| MX349884B (es) | 2017-08-17 |
| JP6444299B2 (ja) | 2018-12-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant or registration |