MX2013011094A - Composicion de blindaje semiconductor con desprendibilidad mejorada. - Google Patents
Composicion de blindaje semiconductor con desprendibilidad mejorada.Info
- Publication number
- MX2013011094A MX2013011094A MX2013011094A MX2013011094A MX2013011094A MX 2013011094 A MX2013011094 A MX 2013011094A MX 2013011094 A MX2013011094 A MX 2013011094A MX 2013011094 A MX2013011094 A MX 2013011094A MX 2013011094 A MX2013011094 A MX 2013011094A
- Authority
- MX
- Mexico
- Prior art keywords
- vinyl acetate
- units derived
- per
- grams
- semiconductive shield
- Prior art date
Links
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 abstract 4
- 229920000459 Nitrile rubber Polymers 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 abstract 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 abstract 1
- 239000006229 carbon black Substances 0.000 abstract 1
- 229920003020 cross-linked polyethylene Polymers 0.000 abstract 1
- 239000004703 cross-linked polyethylene Substances 0.000 abstract 1
- 239000005038 ethylene vinyl acetate Substances 0.000 abstract 1
- 229910052740 iodine Inorganic materials 0.000 abstract 1
- 239000011630 iodine Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
- C08L23/0853—Ethene vinyl acetate copolymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/02—Copolymers with acrylonitrile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/448—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from other vinyl compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/38—Insulated conductors or cables characterised by their form with arrangements for facilitating removal of insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/296—Rubber, cellulosic or silicic material in coating
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Los blindajes de aislamiento de cable comprenden, en porcentaje en peso con base en el peso del blindaje de aislamiento, (A) 37-53% de acetato de etilenvinilo (EVA, por sus siglas en inglés) que tiene 30-33% en peso de unidades derivadas de acetato de vinilo, (B) 10% o más de caucho de nitrilo butadieno (NBR, por sus siglas en inglés) que tiene 25 a 55% en peso de unidades derivadas de acrilonitrilo, y (C) 35% o más de negro de carbono que tiene (1) 80-115 mililitros por 100 gramos (ml/100g) de valor de absorción de ftalato de dibutilo (DBP, por sus siglas en inglés), (2) 30 a 60 miligramos por gramo (mg/g) de absorción de yodo (l2NO), y (3) 0.3 a 0.6 gramos por mililitro (g/ml) de densidad aparente), presentan una fuerza de desprendimiento contra una capa aislante de polietileno reticulado adyacente menor que 5.4 kN/m (15 libras por media pulgada).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161468869P | 2011-03-29 | 2011-03-29 | |
| US201161469227P | 2011-03-30 | 2011-03-30 | |
| PCT/US2012/030658 WO2012135170A1 (en) | 2011-03-29 | 2012-03-27 | Semiconductive shield composition with improved strippability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2013011094A true MX2013011094A (es) | 2013-12-16 |
Family
ID=45953246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2013011094A MX2013011094A (es) | 2011-03-29 | 2012-03-27 | Composicion de blindaje semiconductor con desprendibilidad mejorada. |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20140011029A1 (es) |
| EP (1) | EP2691964A1 (es) |
| JP (1) | JP2014514399A (es) |
| KR (1) | KR20140007908A (es) |
| CN (1) | CN103460302A (es) |
| BR (1) | BR112013025058A2 (es) |
| CA (1) | CA2831301A1 (es) |
| MX (1) | MX2013011094A (es) |
| TW (1) | TW201239025A (es) |
| WO (1) | WO2012135170A1 (es) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6776344B2 (ja) * | 2015-10-07 | 2020-10-28 | ユニオン カーバイド コーポレーション | 半導電性シールド組成物 |
| US10413378B2 (en) * | 2016-05-04 | 2019-09-17 | Startbox, Llc | Safety-blade dispenser and related methods |
| KR101862058B1 (ko) * | 2016-10-06 | 2018-06-29 | 넥쌍 | 에틸렌 비닐 아세테이트 공중합체 및 니트릴 고무를 포함하는 가교된 조성물 |
| CN106674709A (zh) * | 2016-12-09 | 2017-05-17 | 晋源电气集团股份有限公司 | 一种韧性好且热稳定性能优异的电缆 |
| KR102513093B1 (ko) | 2016-12-21 | 2023-03-24 | 다우 글로벌 테크놀로지스 엘엘씨 | 경화성 반도체성 조성물 |
| US11031153B2 (en) * | 2018-11-05 | 2021-06-08 | General Cable Technologies Corporation | Water tree resistant cables |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3296189A (en) | 1965-07-29 | 1967-01-03 | Warren O Eastman | Chemically cross-linked polyethylene stabilized with polymerized trimethyl quinoline |
| US4286023A (en) | 1976-10-04 | 1981-08-25 | Union Carbide Corporation | Article of manufacture, the cross-linked product of a semi-conductive composition bonded to a crosslinked polyolefin substrate |
| US4857600A (en) | 1988-05-23 | 1989-08-15 | Union Carbide Corporation | Process for grafting diacid anhydrides |
| JPH03127403A (ja) | 1989-09-29 | 1991-05-30 | Union Carbide Chem & Plast Co Inc | 絶縁電気導体 |
| US5246783A (en) | 1991-08-15 | 1993-09-21 | Exxon Chemical Patents Inc. | Electrical devices comprising polymeric insulating or semiconducting members |
| US5725650A (en) * | 1995-03-20 | 1998-03-10 | Cabot Corporation | Polyethylene glycol treated carbon black and compounds thereof |
| US5575965A (en) | 1995-05-19 | 1996-11-19 | Union Carbide Chemicals & Plastics Technology Corporation | Process for extrusion |
| US6496629B2 (en) | 1999-05-28 | 2002-12-17 | Tycom (Us) Inc. | Undersea telecommunications cable |
| US6858296B1 (en) | 2000-10-05 | 2005-02-22 | Union Carbide Chemicals & Plastics Technology Corporation | Power cable |
| US6714707B2 (en) | 2002-01-24 | 2004-03-30 | Alcatel | Optical cable housing an optical unit surrounded by a plurality of gel layers |
| US20060182961A1 (en) * | 2003-03-27 | 2006-08-17 | Person Timothy J | Power cable compositions for strippable adhesion |
| US6972099B2 (en) * | 2003-04-30 | 2005-12-06 | General Cable Technologies Corporation | Strippable cable shield compositions |
| EP2195378B1 (en) * | 2007-09-25 | 2013-01-09 | Dow Global Technologies LLC | Styrenic polymers as blend components to control adhesion between olefinic substrates |
| ATE503797T1 (de) * | 2008-05-27 | 2011-04-15 | Borealis Ag | Ablösbare halbleitende zusammensetzung mit bei niedriger temperatur schmelzenden polyolefinen |
-
2012
- 2012-03-27 MX MX2013011094A patent/MX2013011094A/es not_active Application Discontinuation
- 2012-03-27 WO PCT/US2012/030658 patent/WO2012135170A1/en not_active Ceased
- 2012-03-27 CA CA2831301A patent/CA2831301A1/en not_active Abandoned
- 2012-03-27 KR KR1020137024452A patent/KR20140007908A/ko not_active Withdrawn
- 2012-03-27 EP EP12714124.0A patent/EP2691964A1/en not_active Withdrawn
- 2012-03-27 BR BR112013025058A patent/BR112013025058A2/pt not_active IP Right Cessation
- 2012-03-27 CN CN2012800163332A patent/CN103460302A/zh active Pending
- 2012-03-27 US US14/001,603 patent/US20140011029A1/en not_active Abandoned
- 2012-03-27 JP JP2014502670A patent/JP2014514399A/ja active Pending
- 2012-03-28 TW TW101110783A patent/TW201239025A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20140011029A1 (en) | 2014-01-09 |
| KR20140007908A (ko) | 2014-01-20 |
| EP2691964A1 (en) | 2014-02-05 |
| WO2012135170A1 (en) | 2012-10-04 |
| CA2831301A1 (en) | 2012-10-04 |
| BR112013025058A2 (pt) | 2017-02-14 |
| TW201239025A (en) | 2012-10-01 |
| JP2014514399A (ja) | 2014-06-19 |
| CN103460302A (zh) | 2013-12-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA | Abandonment or withdrawal |