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MX2012008415A - Metodo para la aplicacion de un nanorrevestimiento conformable por medio de un procedimiento de plasma de baja presion. - Google Patents

Metodo para la aplicacion de un nanorrevestimiento conformable por medio de un procedimiento de plasma de baja presion.

Info

Publication number
MX2012008415A
MX2012008415A MX2012008415A MX2012008415A MX2012008415A MX 2012008415 A MX2012008415 A MX 2012008415A MX 2012008415 A MX2012008415 A MX 2012008415A MX 2012008415 A MX2012008415 A MX 2012008415A MX 2012008415 A MX2012008415 A MX 2012008415A
Authority
MX
Mexico
Prior art keywords
low pressure
plasma process
pressure plasma
application
conformal
Prior art date
Application number
MX2012008415A
Other languages
English (en)
Inventor
Anthony Vanlandeghem
Filip Legein
Peter Martens
Original Assignee
Europlasma Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europlasma Nv filed Critical Europlasma Nv
Publication of MX2012008415A publication Critical patent/MX2012008415A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H10W74/40—
    • H10W74/47—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2506/00—Halogenated polymers
    • B05D2506/10—Fluorinated polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Polymerisation Methods In General (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Laminated Bodies (AREA)
  • Formation Of Insulating Films (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Materials For Medical Uses (AREA)

Abstract

La invención se refiere a un nanorrevestimiento conformable aplicado mediante un procedimiento de plasma de baja presión. La invención también se refiere a un método para obtener tal nanorrevestimiento conformable sobre una nanoestructura tridimensional, en particular una estructura tridimensional que contiene elementos eléctricamente conductores y no conductores.
MX2012008415A 2010-01-22 2011-01-21 Metodo para la aplicacion de un nanorrevestimiento conformable por medio de un procedimiento de plasma de baja presion. MX2012008415A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE2010/0035A BE1019159A5 (nl) 2010-01-22 2010-01-22 Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.
PCT/EP2011/000242 WO2011089009A1 (en) 2010-01-22 2011-01-21 Method for the application of a conformal nanocoating by means of a low pressure plasma process

Publications (1)

Publication Number Publication Date
MX2012008415A true MX2012008415A (es) 2012-08-15

Family

ID=42289590

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2012008415A MX2012008415A (es) 2010-01-22 2011-01-21 Metodo para la aplicacion de un nanorrevestimiento conformable por medio de un procedimiento de plasma de baja presion.

Country Status (14)

Country Link
US (1) US20120308762A1 (es)
EP (1) EP2525922A1 (es)
JP (1) JP2013517382A (es)
KR (1) KR20130000373A (es)
CN (1) CN102821873A (es)
AU (1) AU2011208879B2 (es)
BE (1) BE1019159A5 (es)
BR (1) BR112012018071A2 (es)
CA (1) CA2786855A1 (es)
CL (1) CL2012001954A1 (es)
MX (1) MX2012008415A (es)
NZ (1) NZ601365A (es)
SG (1) SG182542A1 (es)
WO (1) WO2011089009A1 (es)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8852693B2 (en) 2011-05-19 2014-10-07 Liquipel Ip Llc Coated electronic devices and associated methods
GB2489761B (en) * 2011-09-07 2015-03-04 Europlasma Nv Surface coatings
US11060183B2 (en) 2012-03-23 2021-07-13 Hzo, Inc. Apparatuses, systems and methods for applying protective coatings to electronic device assemblies
JP2013143563A (ja) 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
CA2864202A1 (en) * 2012-03-06 2013-09-12 Semblant Limited Coated electrical assembly
GB2494946B (en) * 2012-05-11 2013-10-09 Europlasma Nv Surface coatings
US20130335898A1 (en) 2012-06-18 2013-12-19 Hzo, Inc. Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices
WO2013192209A2 (en) * 2012-06-18 2013-12-27 Hzo, Inc. Apparatuses, systems and methods for protecting electronic device assemblies
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component
RU2015117763A (ru) * 2012-10-09 2016-12-10 Европлазма Нв Аппарат и способ для нанесения покрытий на поверхности
BR112014005790A2 (pt) 2013-01-08 2017-03-28 Hzo Inc remoção de partes selecionadas de revestimentos de proteção de substratos
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
US9002041B2 (en) 2013-05-14 2015-04-07 Logitech Europe S.A. Method and apparatus for improved acoustic transparency
BE1021288B1 (nl) * 2013-10-07 2015-10-20 Europlasma Nv Verbeterde manieren om plasma te genereren op continue vermogens wijze voor lage druk plasma processen
GB2521137A (en) * 2013-12-10 2015-06-17 Europlasma Nv Surface Coatings
CN104179011B (zh) * 2014-07-18 2016-08-24 青岛纺联控股集团有限公司 纺织品纳米等离子防水处理方法
CN105276554A (zh) * 2014-07-24 2016-01-27 北京中科纳通电子技术有限公司 一种纳米银溶液通过等离子体方法处理led灯体达到防水防油污增强散热效果
GB2556518B (en) 2015-06-09 2022-05-18 P2I Ltd Coatings
CN105047514B (zh) * 2015-07-27 2017-06-13 郑州大学 在玻璃表面等离子体刻蚀形成纹理结构的方法
US10531584B2 (en) * 2016-01-19 2020-01-07 Huawei Technologies Co., Ltd. Waterproofing method for electronic device
CN109069320A (zh) * 2016-04-29 2018-12-21 卢载昊 形成有纳米涂层的吸收产品及制造方法
US11154903B2 (en) 2016-05-13 2021-10-26 Jiangsu Favored Nanotechnology Co., Ltd. Apparatus and method for surface coating by means of grid control and plasma-initiated gas-phase polymerization
GB201610481D0 (en) * 2016-06-14 2016-08-03 Surface Innovations Ltd Coating
CN106868473B (zh) * 2017-01-23 2018-07-13 江苏菲沃泰纳米科技有限公司 一种梯度递减结构防液涂层的制备方法
CN107058979B (zh) * 2017-01-23 2018-05-11 江苏菲沃泰纳米科技有限公司 一种防水耐电击穿涂层的制备方法
CN107217243B (zh) * 2017-05-21 2018-07-13 江苏菲沃泰纳米科技有限公司 一种大占空比脉冲放电制备多功能性纳米防护涂层的方法
US11270871B2 (en) 2017-05-21 2022-03-08 Jiangsu Favored Nanotechnology Co., LTD Multi-layer protective coating
CN107177835B (zh) * 2017-05-21 2018-06-19 江苏菲沃泰纳米科技有限公司 一种循环大占空比脉冲放电制备多功能性纳米防护涂层的方法
CN107904574A (zh) * 2017-10-27 2018-04-13 中国船舶重工集团公司第七二三研究所 一种基于海上复杂环境的纳米防护涂层涂覆方法
DK3880335T3 (da) 2019-10-24 2023-06-06 Saati Spa Fremgangsmåde til fremstilling af et sammensat filtermedium, og det sammensatte filtermedium opnået med denne fremgangsmåde
CN114502252A (zh) 2019-10-24 2022-05-13 纱帝股份公司 一种用于制备复合过滤介质的方法和用该方法获得的复合过滤介质
IT201900019760A1 (it) 2019-10-24 2021-04-24 Saati Spa Procedimento per la realizzazione di un mezzo filtrante composito e mezzo filtrante composito ottenuto con questo procedimento.
JP7526290B2 (ja) * 2020-06-09 2024-07-31 江蘇菲沃泰納米科技股▲フン▼有限公司 保護コーティングおよびその製造方法
CN113275217B (zh) * 2021-05-18 2022-06-24 佛山市思博睿科技有限公司 等离子体接枝共聚膜层的制备方法
CN113365433B (zh) * 2021-06-07 2024-02-02 深圳奥拦科技有限责任公司 Pcba板表面派瑞林膜层的除去方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52116897A (en) * 1976-03-29 1977-09-30 Matsushita Electric Ind Co Ltd Forming transparent conductive film on organic substrate
JPS6047024B2 (ja) 1981-07-31 1985-10-19 日産自動車株式会社 プレス型における製品押出装置
US4628006A (en) * 1984-01-20 1986-12-09 The United States Of America As Represented By The Secretary Of The Navy Passivation of hybrid microelectronic circuits
US4606929A (en) * 1984-12-20 1986-08-19 Petrakov Vladimir P Method of ionized-plasma spraying and apparatus for performing same
EP0187595A3 (en) 1984-12-24 1987-09-30 Sangamo Weston, Inc. Protective coating for electrolytic capacitor
JPS6277463A (ja) * 1985-09-30 1987-04-09 Sumitomo Bakelite Co Ltd 耐熱性樹脂フイルム用真空ロ−ルコ−タ−
JPS63311794A (ja) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd フレキシブル配線板の製造方法
JPH0196364A (ja) * 1987-10-07 1989-04-14 Teijin Ltd 高分子樹脂基板の水分除去方法
JPH02102038A (ja) * 1988-10-12 1990-04-13 Furukawa Alum Co Ltd 耐食性金属板
EP0492828A1 (en) 1990-12-26 1992-07-01 Dow Corning Corporation Mixture of adhesion additives useful in UV curable compositions and compositions containing same
JPH04296337A (ja) * 1991-03-26 1992-10-20 Matsushita Electric Works Ltd 高分子膜の製造方法
US5618619A (en) * 1994-03-03 1997-04-08 Monsanto Company Highly abrasion-resistant, flexible coatings for soft substrates
SG48462A1 (en) * 1995-10-26 1998-04-17 Ibm Lead protective coating composition process and structure thereof
JP4260907B2 (ja) * 1995-12-12 2009-04-30 東洋紡績株式会社 フィルム積層体
US5843239A (en) * 1997-03-03 1998-12-01 Applied Materials, Inc. Two-step process for cleaning a substrate processing chamber
US6127038A (en) 1997-12-11 2000-10-03 American Meter Company Printed circuit board coating and method
DE10114897A1 (de) * 2001-03-26 2002-10-24 Infineon Technologies Ag Elektronisches Bauteil
AU2003303816B2 (en) * 2003-01-30 2006-11-02 Europlasma Method for providing a coating on the surfaces of a product with an open cell structure throughout its structure and use of such a method
US7202172B2 (en) * 2003-12-05 2007-04-10 Taiwan Semiconductor Manufacturing Company, Ltd. Microelectronic device having disposable spacer
US7673970B2 (en) * 2004-06-30 2010-03-09 Lexmark International, Inc. Flexible circuit corrosion protection
KR20070102482A (ko) * 2004-11-02 2007-10-18 아사히 가라스 가부시키가이샤 플루오로카본막 및 그 제조 방법
GB2434369B (en) * 2006-01-20 2010-08-25 P2I Ltd Plasma coated electrical or electronic devices
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP5223325B2 (ja) * 2007-12-21 2013-06-26 住友金属鉱山株式会社 金属被覆ポリエチレンナフタレート基板とその製造方法
GB0800305D0 (en) * 2008-01-09 2008-02-20 P2I Ltd Abatement apparatus and processing method

Also Published As

Publication number Publication date
BR112012018071A2 (pt) 2016-05-03
AU2011208879A1 (en) 2012-08-09
EP2525922A1 (en) 2012-11-28
JP2013517382A (ja) 2013-05-16
SG182542A1 (en) 2012-08-30
NZ601365A (en) 2015-03-27
CN102821873A (zh) 2012-12-12
CA2786855A1 (en) 2011-07-28
US20120308762A1 (en) 2012-12-06
CL2012001954A1 (es) 2013-02-01
KR20130000373A (ko) 2013-01-02
BE1019159A5 (nl) 2012-04-03
WO2011089009A1 (en) 2011-07-28
AU2011208879B2 (en) 2015-12-17

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