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MX2009004133A - Formulacion acuosa que contiene plata y su uso para producir recubrimientos electricamente conductores o reflectivos. - Google Patents

Formulacion acuosa que contiene plata y su uso para producir recubrimientos electricamente conductores o reflectivos.

Info

Publication number
MX2009004133A
MX2009004133A MX2009004133A MX2009004133A MX2009004133A MX 2009004133 A MX2009004133 A MX 2009004133A MX 2009004133 A MX2009004133 A MX 2009004133A MX 2009004133 A MX2009004133 A MX 2009004133A MX 2009004133 A MX2009004133 A MX 2009004133A
Authority
MX
Mexico
Prior art keywords
weight
production
electrically conductive
reflective coatings
nanometres
Prior art date
Application number
MX2009004133A
Other languages
English (en)
Inventor
Matthias Boll
Stefanie Eiden
Johan Kijlstra
Original Assignee
Bayer Materialscience Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38925689&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX2009004133(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Bayer Materialscience Ag filed Critical Bayer Materialscience Ag
Publication of MX2009004133A publication Critical patent/MX2009004133A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B05D5/067—Metallic effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/298—Physical dimension

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nanotechnology (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Paints Or Removers (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Se describe una formulación que contiene agua, dispersa, que contiene plata y su uso para producir recubrimientos eléctricamente conductores y/u ópticamente reflectores. La formulación contiene por lo menos a) 0.5 a 30 partes en peso de partículas de metal de plata con un diámetro efectivo de cuando mucho 150 nm, preferiblemente cuando mucho 100 nm, en particular preferiblemente 40 a 80 nm, con una distribución de tamaño bimodal, b) 50 a 99.5 partes en peso de agua y opcionalmente hasta 30 partes en peso de solvente, c) 0.01 a 10 partes en peso de por lo menos un dispersante, en particular polimérico, d) 0 a 5 partes en peso de productor de película, e) 0 a 5 partes en peso de aditivos, f) 0 a 5 partes en peso de polímeros conductores, y tiene una viscosidad de cuando mucho 150 mPa.s.
MX2009004133A 2006-10-25 2007-10-12 Formulacion acuosa que contiene plata y su uso para producir recubrimientos electricamente conductores o reflectivos. MX2009004133A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006050380 2006-10-25
DE102007037079A DE102007037079A1 (de) 2006-10-25 2007-08-06 Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen
PCT/EP2007/008876 WO2008049519A1 (de) 2006-10-25 2007-10-12 Silberhaltige wässrige formulierung und ihre verwendung zur herstellung von elektrisch leitenden oder spiegelnden beschichtungen

Publications (1)

Publication Number Publication Date
MX2009004133A true MX2009004133A (es) 2009-06-05

Family

ID=38925689

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2009004133A MX2009004133A (es) 2006-10-25 2007-10-12 Formulacion acuosa que contiene plata y su uso para producir recubrimientos electricamente conductores o reflectivos.

Country Status (16)

Country Link
US (2) US7824580B2 (es)
EP (1) EP2087490B1 (es)
JP (1) JP5954922B2 (es)
KR (1) KR101405656B1 (es)
CN (1) CN101529531B (es)
BR (1) BRPI0718186A2 (es)
CA (1) CA2667219C (es)
DE (1) DE102007037079A1 (es)
ES (1) ES2660666T3 (es)
IL (1) IL198335A (es)
MX (1) MX2009004133A (es)
MY (1) MY146242A (es)
RU (1) RU2009119426A (es)
SG (1) SG176423A1 (es)
TW (1) TWI426111B (es)
WO (1) WO2008049519A1 (es)

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CN101529531B (zh) 2013-11-13
WO2008049519A1 (de) 2008-05-02
CA2667219A1 (en) 2008-05-02
US7976736B2 (en) 2011-07-12
JP2010507727A (ja) 2010-03-11
RU2009119426A (ru) 2010-11-27
US7824580B2 (en) 2010-11-02
DE102007037079A1 (de) 2008-04-30
CN101529531A (zh) 2009-09-09
US20080113195A1 (en) 2008-05-15
SG176423A1 (en) 2011-12-29
BRPI0718186A2 (pt) 2013-11-05
TWI426111B (zh) 2014-02-11
IL198335A0 (en) 2010-02-17
KR101405656B1 (ko) 2014-06-11
EP2087490B1 (de) 2017-12-13
US20100252784A1 (en) 2010-10-07
CA2667219C (en) 2014-08-12
IL198335A (en) 2014-04-30
ES2660666T3 (es) 2018-03-23
TW200838955A (en) 2008-10-01
KR20090069182A (ko) 2009-06-29
EP2087490A1 (de) 2009-08-12
MY146242A (en) 2012-07-31
JP5954922B2 (ja) 2016-07-20

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