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MX2007008210A - Dispositivo de retencion de tablero de circuito impreso. - Google Patents

Dispositivo de retencion de tablero de circuito impreso.

Info

Publication number
MX2007008210A
MX2007008210A MX2007008210A MX2007008210A MX2007008210A MX 2007008210 A MX2007008210 A MX 2007008210A MX 2007008210 A MX2007008210 A MX 2007008210A MX 2007008210 A MX2007008210 A MX 2007008210A MX 2007008210 A MX2007008210 A MX 2007008210A
Authority
MX
Mexico
Prior art keywords
retaining device
circuit board
printed circuit
board retaining
heat sink
Prior art date
Application number
MX2007008210A
Other languages
English (en)
Inventor
Mark J Mayer
Original Assignee
Lumination Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumination Llc filed Critical Lumination Llc
Publication of MX2007008210A publication Critical patent/MX2007008210A/es

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/30—Lighting for domestic or personal use
    • F21W2131/305—Lighting for domestic or personal use for refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D27/00—Lighting arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un dispositivo de retencion sujete un TCI a un disipador termico que tiene canales para recibir el dispositivo de retencion. El dispositivo de retencion incluye un cuerpo que tiene porciones configuradas para recibir en los canales del disipador termico y orejas moviles y protuberancias que sobresalen lejos de una primera superficie de cada oreja movil. Se describe un metodo para sujetar el TCI al disipador termico. Tambien se describe un ensamble de iluminacion que incluye el dispositivo de retencion.
MX2007008210A 2005-01-05 2006-01-04 Dispositivo de retencion de tablero de circuito impreso. MX2007008210A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/029,843 US7170751B2 (en) 2005-01-05 2005-01-05 Printed circuit board retaining device
PCT/US2006/000094 WO2006074169A2 (en) 2005-01-05 2006-01-04 Printed circuit board retaining device

Publications (1)

Publication Number Publication Date
MX2007008210A true MX2007008210A (es) 2008-01-16

Family

ID=36640137

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2007008210A MX2007008210A (es) 2005-01-05 2006-01-04 Dispositivo de retencion de tablero de circuito impreso.

Country Status (4)

Country Link
US (1) US7170751B2 (es)
CN (1) CN101116384A (es)
MX (1) MX2007008210A (es)
WO (1) WO2006074169A2 (es)

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US7405944B2 (en) * 2005-01-05 2008-07-29 Lumination Llc Printed circuit board retaining device
US20060289887A1 (en) * 2005-06-24 2006-12-28 Jabil Circuit, Inc. Surface mount light emitting diode (LED) assembly with improved power dissipation
US7394658B2 (en) * 2005-09-01 2008-07-01 Harman International Industries, Incorporated Heat sink with twist lock mounting mechanism
TWI280332B (en) * 2005-10-31 2007-05-01 Guei-Fang Chen LED lighting device
US7365988B2 (en) * 2005-11-04 2008-04-29 Graftech International Holdings Inc. Cycling LED heat spreader
NO325546B1 (no) * 2006-02-20 2008-06-16 Ledlight Group As Modulbasert lyssystem
TWM308441U (en) * 2006-05-08 2007-03-21 Yu-Nung Shen Heat sink
US20080068807A1 (en) * 2006-09-20 2008-03-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat-dissipating device for back light source for flat panel display
GB2442013A (en) * 2006-09-21 2008-03-26 Hogarth Fine Art Ltd A lamp with repositionable LEDs
US7824056B2 (en) * 2006-12-29 2010-11-02 Hussmann Corporation Refrigerated merchandiser with LED lighting
US7540761B2 (en) * 2007-05-01 2009-06-02 Tyco Electronics Corporation LED connector assembly with heat sink
ES2748331T3 (es) * 2007-05-02 2020-03-16 Signify Holding Bv Dispositivo de iluminación de estado sólido
DE102008017614B8 (de) * 2008-04-04 2010-02-11 Insta Elektro Gmbh Beleuchtungseinrichtung
ATE532400T1 (de) 2008-04-17 2011-11-15 Koninkl Philips Electronics Nv Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper
DE102008031262A1 (de) * 2008-07-02 2010-01-07 Osram Gesellschaft mit beschränkter Haftung Beleuchtungseinheit für Fahrzeugscheinwerfer und Fahrzeugscheinwerfer
CN101725937B (zh) * 2008-10-30 2012-06-13 富准精密工业(深圳)有限公司 发光二极管灯具
US8070310B2 (en) * 2009-02-18 2011-12-06 Ronald Paul Harwood Window lighting system
DE102009016778B4 (de) * 2009-04-07 2013-06-27 Abb Ag Unterputz-LED-Leuchte
US20110249406A1 (en) * 2009-06-20 2011-10-13 LEDAdventures LLC Heat dissipation system for electrical components
TWI390157B (zh) * 2010-01-20 2013-03-21 Delta Electronics Inc 照明裝置及其發光模組
DE102010023497B4 (de) 2010-03-11 2018-08-16 Liebherr-Hausgeräte Lienz Gmbh Beleuchtungseinheit
US8613528B2 (en) * 2010-05-07 2013-12-24 Abl Ip Holding Llc Light fixtures comprising an enclosure and a heat sink
DE102010041471B4 (de) 2010-09-27 2021-02-11 Zumtobel Lighting Gmbh Leuchtmodulanordnung mit einer LED auf einer Platine
US20130003379A1 (en) * 2010-10-04 2013-01-03 De Silva Niranjan B Led light system
US20120106148A1 (en) * 2010-10-04 2012-05-03 De Silva Niranjan B Led light system
DE102010042377A1 (de) * 2010-10-13 2012-04-19 Osram Ag Profilschiene, Verbindungselement, Leuchtmodul, Leuchtsystem und Leuchtkasten
TWI438369B (zh) * 2011-07-19 2014-05-21 Wistron Corp 燈條結構及光源裝置
TWI442000B (zh) * 2011-07-19 2014-06-21 Wistron Corp 燈條結構及其光源裝置
US8749981B2 (en) * 2012-01-24 2014-06-10 General Electric Company Mounting base for circuit boards
FI125617B (en) * 2013-07-04 2015-12-15 Lumitar Array Lighting Technology Finland Ab Heat Transfer Profile
CN104295947A (zh) * 2013-07-17 2015-01-21 晋宝电气（浙江）有限公司 一种使用带非安全电压条形光源的灯具
AT518266B1 (de) * 2016-02-24 2017-09-15 Zkw Group Gmbh Halterungsvorrichtung für ein elektronisches Bauteil
CN109923346B (zh) * 2016-08-19 2020-08-04 F·詹斯·范伦斯堡 散热器
US10638647B1 (en) * 2017-12-30 2020-04-28 Xeleum Lighting Attaching printed circuit board to heat exchanger
DE102020103187A1 (de) 2020-02-07 2021-08-12 Vossloh-Schwabe Deutschland Gmbh Anordnung, Verriegelungselement

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US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module
US5461541A (en) * 1994-02-22 1995-10-24 Dana Corporation Enclosure for an electronic circuit module
US5875097A (en) * 1997-06-09 1999-02-23 Power Trends, Inc. Heat sink for auxiliary circuit board
US6252773B1 (en) * 1999-04-23 2001-06-26 Lucent Technologies, Inc Heat sink attachment apparatus and method
DE10064194B4 (de) * 2000-12-22 2006-12-07 Infineon Technologies Ag Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls
US6714414B1 (en) * 2003-02-07 2004-03-30 Morningstar Corporation Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces
US7033060B2 (en) * 2003-05-23 2006-04-25 Gelcore Llc Method and apparatus for irradiation of plants using light emitting diodes

Also Published As

Publication number Publication date
US20060146502A1 (en) 2006-07-06
WO2006074169A2 (en) 2006-07-13
US7170751B2 (en) 2007-01-30
CN101116384A (zh) 2008-01-30
WO2006074169A3 (en) 2006-12-07

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