[go: up one dir, main page]

Levant et al., 2007 - Google Patents

EMC assessment at chip and PCB level: Use of the ICEM model for jitter analysis in an integrated PLL

Levant et al., 2007

View PDF
Document ID
1915530458997698063
Author
Levant J
Ramdani M
Perdriau R
Drissi M
Publication year
Publication venue
IEEE Transactions on Electromagnetic Compatibility

External Links

Snippet

This paper deals with the use of the integrated circuit electromagnetic model (ICEM) to analyze, predict, and optimize autocompatibility and electromagnetic emission at chip and system level. ICEM is currently under standardization process (IEC62014-3). The basic …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G06F17/5036—Computer-aided design using simulation for analog modelling, e.g. for circuits, spice programme, direct methods, relaxation methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequence
    • G01R31/318342—Generation of test inputs, e.g. test vectors, patterns or sequence by preliminary fault modelling, e.g. analysis, simulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuit
    • G01R31/31903—Tester hardware, i.e. output processing circuit tester configuration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30—Marginal testing, e.g. varying supply voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
    • G06F17/5081—Layout analysis, e.g. layout verification, design rule check
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/70—Fault tolerant, i.e. transient fault suppression
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F1/00—Details of data-processing equipment not covered by groups G06F3/00 - G06F13/00, e.g. cooling, packaging or power supply specially adapted for computer application
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/24—Marginal checking or other specified testing methods not covered by G06F11/26, e.g. race tests

Similar Documents

Publication Publication Date Title
Levant et al. EMC assessment at chip and PCB level: Use of the ICEM model for jitter analysis in an integrated PLL
Caignet et al. The challenge of signal integrity in deep-submicrometer CMOS technology
Vrignon et al. Characterization and modeling of parasitic emission in deep submicron CMOS
Park et al. Measurement and analysis of statistical IC operation errors in a memory module due to system-level ESD noise
Song et al. Novel target-impedance extraction method-based optimal PDN design for high-performance SSD using deep reinforcement learning
Lafon et al. Immunity modeling of integrated circuits: An industrial case
KR102028921B1 (en) Device for measuring integrated circuit current and method for measuring integrated circuit current using the device
Ko et al. Simplified chip power modeling methodology without netlist information in early stage of soc design process
Berbel et al. Characterization and modeling of the conducted emission of integrated circuits up to 3 GHz
Ghfiri et al. Construction of an integrated circuit emission model of a FPGA
Ben Dhia et al. IC immunity modeling process validation using on-chip measurements
Ferrario et al. Moving from mixed signal to RF test hardware development
Baba et al. Noise Sources Extraction for Conducted Emission Modeling of IC’s using IBIS Models
Li et al. Development and validation of a microcontroller model for EMC
Ichikawa et al. Experimental verification of power supply noise modeling for EMI analysis through on-board and on-chip noise measurements
Lacrampe et al. Investigation on ESD transient immunity of integrated circuits
Britto et al. EMC analysis of PCB using ICEM model
Deobarro et al. On-chip sampling and EMC modeling of I/Os switching to evaluate conducted RF disturbances propagation
Baba et al. Signal integrity analysis and noise source extraction of integrated circuits using IBIS models
Matsuno et al. Modeling of power noise generation in standard-cell based CMOS digital circuits
Al Rashid Degradation and Lifetime Reliability Models to Assess the Electromagnetic Compatibility Performance of Integrated Circuits Under Environmental Constraints
Peyrard et al. Die capacitance and Power Distribution Network modeling method through measurement of resonant frequency
Zhang et al. Analyze and design high-speed power delivery networks using new multiinput impedances in printed circuit boards
Park et al. Noise immunity modeling and analysis of delay-locked loop
Wane et al. Dynamic power and signal integrity analysis for chip-package-board co-design and co-simulation