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ZA200406199B - Method for producing and treating epoxide resin moulding materials. - Google Patents

Method for producing and treating epoxide resin moulding materials. Download PDF

Info

Publication number
ZA200406199B
ZA200406199B ZA200406199A ZA200406199A ZA200406199B ZA 200406199 B ZA200406199 B ZA 200406199B ZA 200406199 A ZA200406199 A ZA 200406199A ZA 200406199 A ZA200406199 A ZA 200406199A ZA 200406199 B ZA200406199 B ZA 200406199B
Authority
ZA
South Africa
Prior art keywords
mixer
moulding compositions
moulding
granules
hardeners
Prior art date
Application number
ZA200406199A
Other languages
English (en)
Inventor
Heinz-Gunter Reichwein
Jens Steinmann
Gunda Panik
Michael Schwab
Thomas Dressen
Frank Bayerl
Original Assignee
Bakelite Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bakelite Ag filed Critical Bakelite Ag
Publication of ZA200406199B publication Critical patent/ZA200406199B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
ZA200406199A 2002-02-28 2004-08-03 Method for producing and treating epoxide resin moulding materials. ZA200406199B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2002108644 DE10208644A1 (de) 2002-02-28 2002-02-28 Verfahren zur Herstellung und Verarbeitung von Epoxidharz-Formmassen

Publications (1)

Publication Number Publication Date
ZA200406199B true ZA200406199B (en) 2005-09-09

Family

ID=27740504

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200406199A ZA200406199B (en) 2002-02-28 2004-08-03 Method for producing and treating epoxide resin moulding materials.

Country Status (13)

Country Link
US (1) US20060286385A1 (de)
EP (1) EP1480813A1 (de)
JP (1) JP2005518957A (de)
KR (1) KR20040088488A (de)
CN (1) CN1638947A (de)
AU (1) AU2003212250B8 (de)
BR (1) BR0303325A (de)
DE (1) DE10208644A1 (de)
MX (1) MXPA04006905A (de)
PL (1) PL370424A1 (de)
RU (1) RU2308374C2 (de)
WO (1) WO2003072339A1 (de)
ZA (1) ZA200406199B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2422273C1 (ru) * 2009-12-10 2011-06-27 Государственное образовательное учреждение высшего профессионального образования "Тихоокеанский государственный университет" Способ формования изделий из эпоксидной смолы
EP2372725B1 (de) * 2010-03-26 2013-09-11 ABB Research Ltd. Herstellung einer elektrischen Isolierung und isolierte Produkte
RU2460641C1 (ru) * 2011-03-15 2012-09-10 Государственное образовательное учреждение высшего профессионального образования "Тихоокеанский государственный университет" Способ формования изделий из эпоксидной смолы
CN102785326A (zh) * 2011-05-19 2012-11-21 深圳市安托山特种机电有限公司 一种新型封装材料注射机
CN104924593B (zh) * 2015-07-17 2018-02-23 威海两岸环保新材料科技有限公司 一步法制备聚乳酸薄膜的方法
CN106477969B (zh) * 2016-09-14 2019-03-01 九牧厨卫股份有限公司 一种制备砂浆的组合物、由其制备的砂浆、包含该砂浆的树脂浆组合物及其制备方法
JP6546623B2 (ja) * 2017-06-26 2019-07-17 矢崎総業株式会社 端子付き電線の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT350248B (de) * 1970-06-11 1979-05-25 Rother Dr Franz Verfahren zur herstellung von formkoerpern aus einer mischung aus anorganischen pulvern und epoxidharz
JPS5137152A (ja) * 1974-09-25 1976-03-29 Tokyo Nippon Yoki Kogyo Kk Ehokishijushifuntaisoseibutsu
JPS5692011A (en) * 1979-12-26 1981-07-25 Nitto Electric Ind Co Ltd Production of epoxy resin molding material
DE3175558D1 (en) * 1980-02-21 1986-12-11 Ciba Geigy Ag Mixture with filler in suspended form and use of synthetic crystalline calcium silicate
JPS5924762A (ja) * 1982-07-31 1984-02-08 Toto Kasei Kk 速硬化性粉体塗料組成物
JPS6155123A (ja) * 1984-08-27 1986-03-19 Nitto Electric Ind Co Ltd 粉末状エポキシ樹脂組成物の製造方法
JPH01129035A (ja) * 1987-11-12 1989-05-22 Nitto Denko Corp 粉末状エポキシ樹脂組成物の製造方法
EP0376884A3 (de) * 1988-12-21 1991-06-05 Ciba-Geigy Ag Rieselfähiges Granulat
RU2012502C1 (ru) * 1991-05-06 1994-05-15 Соколов Анатолий Данилович Способ переработки реактопластов
GB9224854D0 (en) * 1992-11-27 1993-01-13 Ciba Geigy Ag Moulding process
EP0827159B1 (de) * 1996-08-29 2003-05-21 Mitsubishi Denki Kabushiki Kaisha Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
JP4020274B2 (ja) * 1996-10-07 2007-12-12 ソマール株式会社 シリカ含有液状エポキシ樹脂組成物及び半導体チップ封止剤
JPH10204262A (ja) * 1996-11-25 1998-08-04 Somar Corp 低溶融粘度性エポキシ樹脂粉体組成物の製造方法及びその方法により得られるエポキシ樹脂粉体組成物
US6054222A (en) * 1997-02-20 2000-04-25 Kabushiki Kaisha Toshiba Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet
US6093493A (en) * 1997-07-03 2000-07-25 Ciba Specialty Chemicals Corp. Method for the coating or encapsulation of fluidizable substrates
WO1999008321A1 (en) * 1997-08-07 1999-02-18 Matsushita Electric Works, Ltd. Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same
JP4126575B2 (ja) * 1998-08-24 2008-07-30 Ｄｉｃ株式会社 電子部品封止材料の製造方法
JP4229499B2 (ja) * 1998-11-02 2009-02-25 富士通マイクロエレクトロニクス株式会社 半導体封止用樹脂組成物、その製造方法及び製造装置ならびにそれを使用した半導体装置

Also Published As

Publication number Publication date
EP1480813A1 (de) 2004-12-01
JP2005518957A (ja) 2005-06-30
BR0303325A (pt) 2004-03-30
PL370424A1 (en) 2005-05-30
MXPA04006905A (es) 2004-12-06
AU2003212250A1 (en) 2003-09-09
DE10208644A1 (de) 2003-09-11
KR20040088488A (ko) 2004-10-16
AU2003212250B2 (en) 2008-09-11
US20060286385A1 (en) 2006-12-21
WO2003072339A1 (de) 2003-09-04
AU2003212250B8 (en) 2009-03-26
RU2004129283A (ru) 2005-08-10
RU2308374C2 (ru) 2007-10-20
CN1638947A (zh) 2005-07-13

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