WO2026010393A1 - Electronic device comprising heat dissipation structure - Google Patents

Abstract

According to one embodiment of the present disclosure, an electronic device may comprise: a first housing; a second housing rotatably connected to the first housing and including a plate, an inner wall protruding from the plate, and a stepped portion recessed from the plate; a circuit board disposed in the second housing; a battery disposed in the second housing and spaced apart from the circuit board with the inner wall interposed therebetween; a heat dissipation member including a first heat dissipation area overlapping the circuit board and a second heat dissipation area overlapping the battery and at least partially accommodated in the stepped portion; and a battery tape configured to fix the battery to the plate. Various other embodiments may be possible.

Description

Electronic devices including heat dissipation structures

Various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including a heat dissipation structure.

Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio/video devices, desktop/laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, or functions such as schedule management or electronic wallets are being integrated into a single electronic device.

As the use of personal or portable communication devices, such as smartphones, becomes more widespread, user demand for portability and ease of use is increasing. For example, a touchscreen display can serve as an output device, such as a screen that outputs visual information, while also providing a virtual keypad that replaces mechanical input devices (e.g., button-type input devices). This allows portable communication devices or electronic devices to be miniaturized while still offering the same or improved usability (e.g., a larger screen). On the other hand, the commercialization of flexible displays, such as those that can be folded or rolled, is expected to further enhance the portability and usability of electronic devices. Electronic devices including flexible displays can be carried in a folded or rolled state with multiple different structures (e.g., housings) and can provide a large screen when unfolded, thereby enhancing portability and usability.

The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

According to one embodiment of the present disclosure, an electronic device may include a first housing, a second housing rotatably connected to the first housing and including a plate, an inner wall protruding from the plate, and a stepped portion recessed from the plate, a flexible display disposed on the first housing and the second housing, a circuit board disposed within the second housing, a battery disposed within the second housing and spaced apart from the circuit board with the inner wall therebetween, a heat dissipation member including a first heat dissipation area overlapping the circuit board and a second heat dissipation area overlapping the battery and at least partially accommodated in the stepped portion, the heat dissipation member including a heat dissipation material, and a battery tape configured to secure the battery to the plate, wherein the battery tape is seated on at least a portion of another portion of the plate that is different from the stepped portion of the plate, and may be disposed between the plate and the battery.

According to one embodiment of the present disclosure, an electronic device may include a first housing, a second housing rotatably connected to the first housing and including a plate and an inner wall protruding from the plate, a flexible display disposed on the first housing and the second housing, a circuit board disposed within the second housing, a battery disposed within the second housing and spaced apart from the circuit board with the inner wall interposed therebetween, the battery including a first side facing the plate and a second side opposite the first side, a heat dissipation member including a first heat dissipation area overlapping the circuit board and a second heat dissipation area overlapping the battery, the heat dissipation member including a heat dissipation material, and a battery tape configured to secure the battery to the plate.

FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

FIG. 5 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

FIG. 6 is a plan view showing a second housing and a heat dissipation member according to one embodiment of the present disclosure.

FIG. 7 is a perspective view showing a heat dissipation member and an inner wall according to one embodiment of the present disclosure.

FIG. 8 is a perspective view showing a bulkhead coupled to an inner wall according to one embodiment of the present disclosure.

FIG. 9 is a cross-sectional view of an electronic device taken along line A-A' of FIG. 2 according to one embodiment of the present disclosure.

FIG. 10A is a cross-sectional view of an electronic device taken along line B-B' of FIG. 2 according to one embodiment of the present disclosure.

FIG. 10b is a cross-sectional view of an electronic device taken along line B-B' of FIG. 2 according to one embodiment of the present disclosure.

FIG. 11 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 12 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 13 is a schematic diagram illustrating a second battery, a protective tape, and a film according to one embodiment of the present disclosure.

FIG. 14 is a plan view showing a film according to one embodiment of the present disclosure.

FIG. 15 is a plan view showing a film according to one embodiment of the present disclosure.

FIG. 16 is a plan view showing a film according to one embodiment of the present disclosure.

FIG. 17 is a plan view showing a film according to one embodiment of the present disclosure.

FIG. 18 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 19 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 20 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 21 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 22 is a plan view of an electronic device including a heat dissipation member and a battery tape according to one embodiment of the present disclosure.

FIG. 23 is a cross-sectional view of an electronic device including a heat dissipation member and a battery tape according to one embodiment of the present disclosure.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include a plurality of artificial neural network layers. The artificial neural network can be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model can additionally or alternatively include a software structure.

The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and/or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199). The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, ‘non-transitory’ simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

The embodiments of FIGS. 2 to 3 can be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 23.

Referring to FIGS. 2 and 3, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) may include a housing (201), a hinge cover (240) covering a foldable portion of the housing (201), and a display (230) (e.g., the display module (160) of FIG. 1) disposed within a space formed by the housing (201).

According to one embodiment, the surface on which the screen output from the display (230) is exposed may be defined as the front surface of the electronic device (101) (e.g., the first front surface (210a) and the second front surface (220a)). The surface opposite to the front surface may be defined as the back surface of the electronic device (101) (e.g., the first back surface (210b) and the second back surface (220b)). In one embodiment, the surface surrounding the space between the front surface and the back surface may be defined as the side surface of the electronic device (101) (e.g., the first side surface (210c) and the second side surface (220c)). The side surface of the electronic device (101) may be the side surface of at least one of the first housing (210) and the second housing (220). The electronic device (101) of FIGS. 2 and 3 may be referred to as a foldable electronic device, a portable electronic device, or a portable foldable electronic device. In one embodiment, the housing (201) may be referred to as a foldable housing. The display (230) may be referred to as a “flexible display.”

According to one embodiment, the housing (201) may include a first housing (210), a second housing (220) rotatable with respect to the first housing (210), a first rear cover (280), and a second rear cover (290). The housing (201) of the electronic device (101) is not limited to the shape and combination shown in FIGS. 2 and 3, and may be implemented by other shapes or combinations and/or combinations of parts. For example, in one embodiment, the first housing (210) and the first rear cover (280) may be formed integrally, and the second housing (220) and the second rear cover (290) may be formed integrally.

According to one embodiment, the first housing (210) is connected to a hinge structure (e.g., the hinge structure (202) of FIG. 4) and may include a first front surface (210a) facing a first direction and a first rear surface (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to the hinge structure and includes a second front surface (220a) facing a third direction and a second rear surface (220b) facing a fourth direction opposite to the third direction, and may rotate with respect to the first housing (210) about the hinge structure (202). Accordingly, the electronic device (101) may be variable between a folded state and an unfolded state. The folding or unfolding motion of the electronic device (101) can be understood as the rotation of the first housing (210) with respect to the hinge structure or the rotation of the second housing (220) with respect to the hinge structure. When the electronic device (101) is in a folded state, the first front side (210a) can face the second front side (220a). When the electronic device (101) is in an unfolded state, the third direction can be the same as the first direction. In the following, unless otherwise stated, the directions are described based on the unfolded state of the electronic device (101).

According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (Ax) as the center, and may have an overall symmetrical shape with respect to the folding axis (Ax). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the state of the electronic device (101) is in an unfolded state, a folded state, or an intermediate state. According to one embodiment, the second housing (220) additionally includes a sensor area (224) in which sensors (e.g., a front camera) are arranged, but may have a shape that is symmetrical with respect to the first housing (210) in other areas.

According to one embodiment, the folding axis (Ax) may be a plurality of parallel folding axes (e.g., two). In the present disclosure, the folding axis (Ax) is provided along the longitudinal direction (Y-axis direction) of the electronic device (101), but the direction of the folding axis (Ax) is not limited thereto. For example (not shown), an embodiment may be implemented in which the electronic device (101) includes a folding axis extending along the width direction (e.g., X-axis direction).

According to one embodiment, the electronic device (101) may include a structure into which a digital pen (not shown) can be attached. For example, the electronic device (101) may include a magnetic body configured to attach the digital pen to a side of the first housing (210) or a side of the second housing (220). According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be inserted. For example, a hole (not shown) into which a digital pen can be inserted may be formed in a side of the first housing (210) or a side of the second housing (220) of the electronic device (101).

According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic or non-metallic material having a rigidity of a size selected to support the display (230). At least a portion formed of the metallic material may provide a ground plane of the electronic device (101) and may be electrically connected to a ground line formed on a printed circuit board (e.g., the board portion (260) of FIG. 4).

According to one embodiment, the sensor area (224) may be formed to have a predetermined area adjacent to one edge or one corner of the second housing (220). However, the arrangement, shape, and size of the sensor area (224) are not limited to the illustrated example. For example, in another embodiment, the sensor area (224) may be provided in another corner of the second housing (220) or any area between the upper and lower corners or in the first housing (210). In one embodiment, components for performing various functions built into the electronic device (101) may be exposed to the front of the electronic device (101) through the sensor area (224) or through one or more openings provided in the sensor area (224). In one embodiment, the components may include various types of sensors. The sensor(s) may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

According to one embodiment, the first rear cover (280) is disposed on one side of the folding axis (Ax) at the rear of the electronic device (101) and may have, for example, a substantially rectangular periphery, the periphery of which may be wrapped by another structure of the first housing (210). Similarly, the second rear cover (290) is disposed on the other side of the folding axis (Ax) at the rear of the electronic device (101) and the periphery of which may be wrapped by another structure of the second housing (220).

According to one embodiment, the first rear cover (280) and/or the second rear cover (290) may have a shape that is substantially symmetrical about the folding axis (Ax). However, the first rear cover (280) and the second rear cover (290) do not necessarily have mutually symmetrical shapes, and in one embodiment, the electronic device (101) may include the first rear cover (280) and the second rear cover (290) of different shapes that are not symmetrical.

In one embodiment, the first rear cover (280), the second rear cover (290), the first housing (210), and the second housing (220) may provide spaces in which various components of the electronic device (101) (e.g., a printed circuit board or a battery) may be placed. In one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of the sub-display (234) may be visually exposed through at least a portion of the first rear cover (280). In another embodiment, one or more components or sensors may be visually exposed through at least a portion of the second rear cover (290). In various embodiments, the sensors may include a proximity sensor and/or a camera module (206) (e.g., a rear camera).

According to one embodiment, a front camera exposed to the front of the electronic device (101) through one or more openings provided in the sensor area (224) or a camera module (206) exposed through at least a portion of the second rear cover (290) may include one or more lenses, image sensors, and/or image signal processors. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

According to one embodiment, the hinge cover (240) may be disposed between the first housing (210) and the second housing (220) to cover internal components (e.g., the hinge structure (202) of FIG. 4). According to one embodiment, the hinge cover (240) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the state of the electronic device (101) (flat state or folded state).

According to one embodiment, as illustrated in FIG. 2, when the electronic device (101) is in an unfolded state, the hinge cover (240) may be covered by the first housing (210) and the second housing (220) and may not be exposed. As another example, as illustrated in FIG. 3, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge cover (240) may be exposed to the outside between the first housing (210) and the second housing (220). As another example, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded at a certain angle, the hinge cover (240) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than that in the fully folded state. In one embodiment, the hinge cover (240) may include a curved surface.

According to one embodiment, the display (230) may be positioned on a space formed (or defined) by the housing (201). For example, the display (230) may be seated on a recess provided by the housing (201) and may form a majority of the front surface of the electronic device (101). Accordingly, the front surface of the electronic device (101) may include the display (230), a portion of the first housing (210) adjacent to the display (230) and a portion of the second housing (220). The back surface of the electronic device (101) may include a first back cover (280), a portion of the first housing (210) adjacent to the first back cover (280), a second back cover (290), and a portion of the second housing (220) adjacent to the second back cover (290).

In one embodiment, the display (230) may include a plurality of display areas spaced apart from each other. For example, the display (230) may include a first display area (231) disposed on a first housing (210), a second display area (232) disposed on a second housing (220), and a folding area (233). In one embodiment, the first display area (231) and the second display area (232) may rotate about a folding axis (Ax).

According to one embodiment, the display (230) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. For example, the display (230) may be a foldable or flexible display. According to one embodiment, the display (230) may include a folding area (233), a first display area (231) arranged on one side (e.g., the left side of the folding area (233) illustrated in FIG. 2) with respect to the folding area (233), and a second display area (232) arranged on the other side (e.g., the right side of the folding area (233) illustrated in FIG. 2). However, the division of the areas of the display (230) is exemplary, and the display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the display (230) may be divided into regions by a folding region (233) or a folding axis (Ax) extending parallel to the Y-axis, but in other embodiments, the display (230) may be divided into regions based on other folding regions (e.g., a folding region parallel to the X-axis) or other folding axes (e.g., a folding axis parallel to the X-axis). According to one embodiment, the display (230) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer (not shown) configured to detect a magnetic field-type stylus pen.

According to one embodiment, the first display area (231) and the second display area (232) may have an overall symmetrical shape centered on the folding area (233). According to one embodiment (not shown), the second display area (232), unlike the first display area (231), may include a cut notch depending on the presence of the sensor area (224), but may have a shape that is substantially symmetrical with respect to the first display area (231) in other areas. For example, the first display area (231) and the second display area (232) may include a portion having a symmetrical shape with respect to each other and a portion having an asymmetrical shape with respect to each other.

Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of the display (230) according to the state of the electronic device (101) (e.g., flat state or unfolded state and folded state) will be described.

According to one embodiment, when the electronic device (101) is in a flat state (e.g., FIG. 2), the first housing (210) and the second housing (220) may be arranged to face the same direction at a substantially 180-degree angle. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a 180-degree angle with each other and face the same direction (e.g., toward the front of the electronic device). The folding area (233) may form the same plane as the first display area (231) and the second display area (232).

According to one embodiment, when the electronic device (101) is in a folded state (e.g., FIG. 3), the first housing (210) and the second housing (220) may be arranged to face each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a narrow angle (e.g., between about 0 and 10 degrees) with each other and may face each other. When the electronic device (101) is in a folded state, at least a portion of the folding area (233) may be formed as a curved surface having a predetermined curvature.

According to one embodiment, when the electronic device (101) is in an intermediate state (not shown), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form an angle that is greater than the angle in the folded state and less than the angle in the unfolded state. The folding area (233) may be formed as a curved surface having at least a certain curvature, and the curvature at this time may be less than that in the folded state.

FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

The embodiment of FIG. 4 can be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 5 to 23.

Referring to FIG. 4, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 3) may include a housing (201), a display (230), a hinge structure (202), a battery (250), and a circuit board (260). For example, the housing (201) may include a first housing (210), a second housing (220), a first rear cover (280), and a second rear cover (290). In one embodiment, the housing (201) may be understood to include a hinge cover (240). The configuration of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 4 may be all or part of the same as the configuration of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 2 and/or FIG. 3.

According to one embodiment, the first housing (210) and the second housing (220) can be assembled to each other so as to be coupled to both sides of the hinge structure (202). For example, the hinge structure (202) can be arranged in a hinge area between the first housing (210) and the second housing (220) to rotatably couple the first housing (210) and the second housing (220). Here, the 'hinge area' may refer to a space in which the hinge structure (202) is arranged, an area at least partially surrounded by the hinge cover (240), and/or a space between the folding area (233) of the display (230) and the hinge cover (240). In one embodiment, the hinge area may be understood as a space arranged substantially corresponding to the folding area (233).

According to one embodiment, the hinge structure (202) may connect the first housing (210) and the second housing (220) so that the first housing (210) and the second housing (220) can rotate relative to each other. The hinge structure (202) may be covered by a hinge cover (240). The electronic device (101) may include a hinge assembly including the hinge structure (202) and the hinge cover (240).

In one embodiment, the hinge structure (202) may provide a folding axis (Ax) (e.g., the folding axis (Ax) of FIG. 2). The hinge structure (202) may be connected to a first plate (212) of a first housing (210) and a second plate (222) of a second housing (220). The housings (210, 220) may be coupled to the hinge structure (202) and may rotate with respect to the hinge structure (202) or the hinge cover (240).

According to one embodiment, the first housing (210) may include a first plate (212) (e.g., a first support member, a first support area, or a first bracket) capable of supporting a component of the electronic device (101) (e.g., a first circuit board (262) and/or a first battery (252)) and a first side wall (211) surrounding at least a portion of the first plate (212). The first side wall (211) may include a first side surface of the electronic device (101) (e.g., the first side surface (210c) of FIG. 2). According to one embodiment, the second housing (220) may include a second plate (222) (e.g., a second support member, a second support area, or a second bracket) capable of supporting components of the electronic device (101) (e.g., a second circuit board (264) and/or a second battery (254)) and a second side wall (221) surrounding at least a portion of the second plate (222). The second side wall (221) may include a second side surface of the electronic device (101) (e.g., the second side surface (220c) of FIG. 2).

According to one embodiment, the first side wall (211) or the second side wall (221) may be understood as a frame shape that at least partially surrounds the space between the front and the back of the electronic device (101) (e.g., the first housing (210) or the second housing (220)). In one embodiment, the plates (212, 222) may have a structure extending from one of the side walls (211, 221). For example, for convenience of explanation, the plates (212, 222) and the side walls (211, 221) are described separately, but the embodiment(s) of the present disclosure are not limited thereto, and the plates (212 or 222) and the side walls (211 or 221) may be implemented as a single body. In one embodiment, the plates (212 or 222) and the side walls (211 or 221) may be implemented by combining an insulating material and an electrically conductive material, in which case the housings (210, 220) may be implemented by integrally forming the plates (212 or 222) and the side walls (211 or 221) through an insert injection process and/or a computer numerical control machining process.

According to one embodiment, the first plate (212) may include a front side (212a) (e.g., a front surface facing the +Z direction in FIG. 4) and a rear side opposite to the front side (212a) (e.g., a rear surface facing the -Z direction in FIG. 4). The front side (212a) of the first plate (212) may face the first display area (231). The rear side of the first plate (212) may face the first circuit board (262), the first battery (252), and/or the first rear cover (280).

According to one embodiment, the second plate (222) may include a front side (222a) (e.g., a front surface facing the +Z direction of FIG. 4) and a rear side opposite to the front side (222a) (e.g., a rear surface facing the -Z direction of FIG. 4). The front side (222a) of the second plate (222) may face the second display area (232). The rear side of the second plate (222) may face the second circuit board (264), the second battery (254), and/or the second rear cover (290).

In one embodiment, a portion of at least one of the housings (210, 220) may function as an antenna. For example, the portion of the electronic device (101) that functions as an antenna may embody at least a portion of a side surface of at least one of the housings (210, 220).

According to one embodiment, the portion functioning as an antenna of the electronic device (101) may be arranged adjacent to at least one side surface of the housings (210, 220) and/or oriented in a direction intersecting the Z-axis (e.g., X-axis direction or Y-axis direction). For example, the portion functioning as an antenna of the electronic device (101) may be implemented by a portion of the housings (210, 220), or may be manufactured as a separate component from the housings (210, 220) and arranged adjacent to an edge of the housings (210, 220). According to one embodiment, the phrase "the portion functioning as an antenna of the electronic device (101) is implemented by a portion of the housings (210, 220)" may be understood to include, for example, an example in which the portion functioning as an antenna is arranged to form a side surface of at least one of the housings (210, 220).

Although not shown, the first housing (210) may include a first waterproof member arranged on the first plate (212), and the second housing (220) may include a second waterproof member arranged on the second plate (222). The first waterproof member and/or the second waterproof member may be arranged in a gap between the display (230) and the plates (212, 222) to prevent moisture or foreign substances from entering the interior of the first housing (210) and/or the second housing (220) from the outside.

According to one embodiment, the display (230) (e.g., a flexible display or a foldable display) may include a first display area (231), a second display area (232), and/or a folding area (233). The configurations of the first display area (231), the second display area (232), and the folding area (233) of FIG. 4 may be partially or entirely identical to the configurations of the first display area (231), the second display area (232), and the folding area (233) of FIG. 2.

In one embodiment, at least a portion of the first display area (231) may be supported by the front surface (212a) of the first plate (212). At least a portion of the second display area (231) may be supported by the front surface (222a) of the second plate (222). At least a portion of the folding area (233) may be disposed over the hinge structure (202). The folding area (233) may be at least partially foldable or unfoldable. The folding area (233) may be connected to the first display area (231) and the second display area (232) and may be disposed across the hinge structure (202).

According to one embodiment, the electronic device (101) may further include a sub-display (234). The sub-display (234) may display a screen in a different direction from the display areas (231, 232). For example, the sub-display (234) may output a screen in a direction opposite to the first display area (231). According to one embodiment, the sub-display (234) may be disposed on the first rear cover (280). For example, the sub-display (234) may be disposed between the first rear cover (280) and the first plate (212).

According to one embodiment, the electronic device (101) may include a camera assembly (204) comprising a plurality of cameras (e.g., the camera module (206) of FIG. 2 or 3). Although not shown, the electronic device (101) may further include a camera that captures a subject by penetrating a portion of the display (230) (e.g., the first display area (231) or the second display area (232)) or a camera that captures a subject by penetrating a portion of the sub-display (234).

In one embodiment, the electronic device (101) and/or the second rear cover (290) may include a cover plate (299) arranged correspondingly to the camera assembly (204). The cover plate (299) may, for example, provide an optical path (e.g., a through hole) corresponding to the camera assembly (204) while allowing the optical path to be harmonized with the exterior of the electronic device (101). To provide aesthetic appeal to the exterior of the electronic device (101) or to realize a harmonious appearance, the cover plate (299) may include a metal material. For example, the cover plate (299) may be made of a metal material or may be finished (e.g., printed, deposited, coated, or plated) with a metal material. In one embodiment, the cover plate (299) may be understood as a part of the second rear cover (290), with a portion (e.g., an edge) disposed inside the second rear cover (290) and another portion exposed to the exterior.

In one embodiment, the battery (250) may include a first battery (252) disposed within the first housing (210) and a second battery (254) disposed within the second housing (220). In one embodiment, the first battery (252) may be electrically connected to the first circuit board (262), and the second battery (254) may be electrically connected to the second circuit board (264). In one embodiment, the battery (250) may supply power to at least one component of the electronic device (101). In one embodiment, the battery (250) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

According to one embodiment, the first battery (252) may be positioned between the rear surface of the first plate (212) (e.g., the surface facing the -Z direction in FIG. 4) and the first rear cover (280).

According to one embodiment, the second battery (254) may be positioned between the rear surface of the second plate (222) (e.g., the surface facing the -Z direction in FIG. 4) and the second rear cover (290).

According to one embodiment, the circuit board (260) may include a first circuit board (262) disposed within a first housing (210) and a second circuit board (264) disposed within a second housing (220).

According to one embodiment, the first circuit board (262) and the second circuit board (264) may be electrically connected by at least one flexible printed circuit board (266). According to one embodiment, at least a portion of the flexible printed circuit board (266) may be disposed across a hinge region or a hinge structure (e.g., hinge structure (202)). According to one embodiment, the first circuit board (262) and the second circuit board (264) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). Components for implementing various functions of the electronic device (101) may be disposed on the first circuit board (262) and the second circuit board (264).

According to one embodiment, the first circuit board (262) may be disposed between the rear surface (e.g., the surface facing the -Z direction of FIG. 4) of the first plate (212) and the first rear cover (280). According to one embodiment, the first circuit board (262) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible PCB (RF-PCB).

According to one embodiment, the first circuit board (262) may be spaced apart from the first battery (252). For example, the first circuit board (262) may be spaced apart from the first battery (252) in the axial direction of the folding axis (Ax) (e.g., the Y-axis direction of FIG. 4).

According to one embodiment, the second circuit board (264) may be disposed between the rear surface (e.g., the surface facing the -Z direction of FIG. 4) of the second plate (222) and the second rear cover (290). According to one embodiment, the second circuit board (264) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible PCB (RF-PCB).

According to one embodiment, the second circuit board (264) may be spaced apart from the second battery (254). For example, the second circuit board (264) may be spaced apart from the first battery (252) in the axial direction of the folding axis (Ax) (e.g., the Y-axis direction of FIG. 4).

According to one embodiment, the electronic device (101) may include speakers (208a, 208b). According to one embodiment, the speakers (208a, 208b) may convert electrical signals into sound. According to one embodiment, the speakers (208a, 208b) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). According to one embodiment, the speakers (208a, 208b) may include an upper speaker (208a) positioned at the top (+Y direction) of the electronic device (101) and a lower speaker (208b) positioned at the bottom (-Y direction) of the electronic device (100). In the present disclosure, the speakers (208a, 208b) are illustrated as being positioned within one housing (e.g., the first housing (210) of FIG. 4), but this is an optional structure. For example, the speakers (208a, 208b) may be located within at least one of the first housing (210) or the second housing (220). The configuration of the speakers (208a, 208b) of FIG. 4 may be all or part of the same as the configuration of the sound output module (155) of FIG. 1.

According to one embodiment, the electronic device (101) may include a rear member (270) (or rear case). According to one embodiment, the rear member (270) may be disposed within the housing (201) (e.g., the second housing (220)). According to one embodiment, the rear member (270) may accommodate at least one antenna (275). In one embodiment, the rear member (270) may function as a structure for disposing the antenna (275) and may function as a structure for supporting or protecting one of the circuit boards (262, 264). For example, a portion of the rear member (270) indicated by reference numeral '279' may support a portion of the circuit board (262, 264).

According to one embodiment, the electronic device (101) may include an antenna (275). The antennas (275a, 275b) may include, for example, an ultra wide band (UWB) antenna (275a), a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna (275b). The antenna (275) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

In one embodiment, an antenna structure may be formed by a portion or a combination of the housing (201). For example, the antenna (275) may include a communication antenna (275c). The communication antenna (275c) may be used for communication with an external electronic device (e.g., Wi-Fi). For example, the communication antenna (275c) may be positioned on the upper portion (271a) or the lower portion (271b) of the rear member (270). In addition, the electronic device (101) may further include additional antennas positioned adjacent to portions of the side walls (211, 221) or electronic components such as the camera assembly (204).

According to one embodiment, the first plate (212) may be disposed between the first display area (231) and the first rear cover (280). The first display area (231) may be disposed on the front surface (211a) of the first plate (212) (e.g., the surface facing the +Z direction in FIG. 4). The first rear cover (280) may be disposed below the rear surface (e.g., the surface facing the -Z direction in FIG. 4) of the first plate (212).

According to one embodiment, the first battery (252) and the first circuit board (262) may be disposed on the rear surface (e.g., the surface facing the -Z direction in FIG. 4) of the first plate (212). For example, the first battery (252) and the first circuit board (262) may be disposed between the first plate (212) and the first rear cover (280). The first plate (212) may be disposed between the first display area (231) and the first battery (252). The first plate (212) may be disposed between the first display area (231) and the first circuit board (262).

According to one embodiment, the second plate (222) may be disposed between the second display area (232) and the second rear cover (290). The second display area (232) may be disposed on the front surface (e.g., the side facing the +Z direction in FIG. 4 ) of the second plate (222). The second rear cover (290) may be disposed below the rear surface (e.g., the side facing the -Z direction in FIG. 4 ) of the second plate (222).

According to one embodiment, the second battery (254) and the second circuit board (264) may be disposed on the rear surface (e.g., the surface facing the -Z direction in FIG. 4) of the second plate (222). For example, the second battery (254) and the second circuit board (264) may be disposed between the second plate (222) and the second rear cover (290). The second plate (222) may be disposed between the second display area (232) and the second battery (254). The second plate (222) may be disposed between the second display area (232) and the second circuit board (264).

According to one embodiment, at least one electrical component (e.g., a processor (120) and/or a memory (130) of FIG. 1) may be disposed on and/or mounted on a circuit board (260). The at least one electrical component may generate heat during operation. The electronic device (101) may include a heat dissipation member (e.g., a heat dissipation member (410) of FIG. 5) configured to dissipate heat generated from the at least one electrical component.

Hereinafter, the second housing (220) and the heat dissipation member (410) disposed inside the second housing (220) will be described with reference to FIGS. 5 to 23 as examples. Although not shown, the electronic device (101) may further include the first housing (210) and another heat dissipation member (not shown) disposed inside the first housing (210). The other heat dissipation member may be applied selectively and may be omitted depending on the embodiment. For example, when the electronic device (101) includes the other heat dissipation member, the description of the second housing (220) and the heat dissipation member (410) may be applied identically or similarly to the first housing (210) and the other heat dissipation member.

FIG. 5 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

FIG. 6 is a plan view showing a second housing and a heat dissipation member according to one embodiment of the present disclosure.

FIG. 7 is a perspective view showing a heat dissipation member and an inner wall according to one embodiment of the present disclosure.

FIG. 8 is a perspective view showing a bulkhead coupled to an inner wall according to one embodiment of the present disclosure.

FIG. 9 is a cross-sectional view of an electronic device taken along line A-A' of FIG. 2 according to one embodiment of the present disclosure.

The embodiments of FIGS. 5 to 9 can be combined with the embodiments of FIGS. 1 to 4, or the embodiments of FIGS. 10a to 23.

The configurations of the embodiments of FIGS. 5 to 9 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 4, or the configurations of the embodiments of FIGS. 10a to 23.

Referring to FIGS. 5 to 9, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 4) may include a foldable housing (301) (e.g., the foldable housing (201) of FIGS. 2 to 4).

According to one embodiment, the foldable housing (301) may include a first housing (310) (e.g., the first housing (210) of FIGS. 2 to 4)) and a second housing (320) rotatably connected to the first housing (310) (e.g., the second housing (320) of FIGS. 2 to 4).

According to one embodiment, the first housing (310) and the second housing (320) may be rotatably connected to each other via a hinge structure (e.g., hinge structure (202) of FIG. 4).

According to one embodiment, the first housing (310) may include a first side wall (311) (e.g., the first side wall (311) of FIG. 4) and a first rear cover (380) (e.g., the first rear cover (280) of FIG. 4).

According to one embodiment, a sub-display (334) (e.g., sub-display (234) of FIG. 4) may be disposed within the first housing (310). The sub-display (334) may be covered by a first rear cover (380) and may be visually exposed through the first rear cover (380).

According to one embodiment, the second housing (320) may include a second side wall (321) (e.g., the second side wall (221) of FIG. 4), a second plate (322) (e.g., the second plate (322) of FIG. 4), and a second rear cover (390) (e.g., the second rear cover (290) of FIG. 4).

According to one embodiment, the second plate (322) may be positioned between at least a portion (e.g., the second display area (332)) of the flexible display (330) (e.g., the flexible display (230) of FIG. 4) and the second rear cover (390).

According to one embodiment, the second plate (322) may be defined and/or referred to as a bracket, a support member, or a support plate.

According to one embodiment, the second plate (322) may include a front side (e.g., the front side (222a) of FIG. 4 or the front side (322a) of FIG. 9) and a rear side (322b) opposite the front side.

In one embodiment, the front surface of the second plate (322) may face at least a portion of the flexible display (330) and support the at least a portion of the flexible display (330). For example, the second display area (332) of the flexible display (330) may be disposed on the front surface of the second plate (322).

In one embodiment, the back surface (322b) of the second plate (322) may face the second back cover (390). The back surface (322b) of the second plate (322) may support a second circuit board (364) (e.g., the second circuit board (264) of FIG. 4) and a second battery (354) (e.g., the second battery (254) of FIG. 4). For example, the second circuit board (364) and the second battery (354) may be positioned between the back surface (322b) of the second plate (322) and the second back cover (390).

According to one embodiment, the electronic device (101) may include a second circuit board (364) and a second battery (354). The second circuit board (364) and the second battery (354) may be disposed on the rear surface (322b) of the second plate (322).

According to one embodiment, the electronic device (101) may include a rear member (370) (e.g., the rear member (270) of FIG. 4). The rear member (370) may support at least one antenna (375) (e.g., the at least one antenna (275) of FIG. 4). The rear member (370) may be disposed within the second housing (320) and at least partially between the second circuit board (364) and the second rear cover (390). The at least one antenna (375) may be disposed within the second housing (320) and at least partially between the rear member (370) and the second rear cover (390).

According to one embodiment, the electronic device (101) may include a flexible display (330) (e.g., the flexible display (330) of FIG. 4). The flexible display (330) may be disposed on a first housing (310) and a second housing (320). The flexible display (330) may include a first display area (331) (e.g., the first display area (331) of FIG. 4), a second display area (332) (e.g., the second display area (332) of FIG. 4), and a folding area (333) (e.g., the folding area (333) of FIG. 4).

According to one embodiment, the first display area (331) may be supported by a front surface (e.g., the front surface (212a) of FIG. 4) of a first plate (e.g., the first plate (212) of FIG. 4). The second display area (332) may be supported by a front surface (322a) of a second plate (322). The folding area (333) may be connected to the first display area (331) and the second display area (332) and may be at least partially folded or unfolded.

According to one embodiment, the second housing (320) may include an inner wall (324) (e.g., the inner wall (324) of FIGS. 6 to 8) protruding from the second plate (322). The inner wall (324) may protrude from the rear surface (322b) of the second plate (322) toward the second rear cover (390).

According to one embodiment, the inner wall (324) can divide the inner space of the second housing (320) into a plurality of regions. For example, the inner space of the second housing (320) (e.g., the space between the second plate (322) and the second rear cover (390)) can be partitioned into a first space (323a) and a second space (323b) by the inner wall (324). The inner wall (324) can be positioned between the first space (323a) and the second space (323b).

According to one embodiment, the inner wall (324) may extend in a second direction (e.g., the X-axis direction of FIGS. 4 to 8). The second direction may be, but is not limited to, a direction substantially perpendicular to an axial direction (e.g., the Y-axis direction of FIGS. 4 to 8) of a folding axis (e.g., the folding axis (Ax) of FIGS. 2 and 4). The second direction may be, but is not limited to, a direction substantially perpendicular to a first direction (e.g., the Z-axis direction of FIGS. 4 to 8) which is a thickness direction of the second battery (354).

According to one embodiment, the second battery (354) may be spaced apart from the second circuit board (364) with an inner wall (324) therebetween. The inner wall (324) may be disposed between the second battery (354) and the second circuit board (364). The inner wall (324) may limit and/or prevent a side of the second battery (354) (e.g., a side facing the +Y direction in FIG. 5 ) from being struck by the second circuit board (364). For example, the side of the battery (354) may be limited and/or prevented from being struck by the second circuit board (364) due to movement of the second circuit board (364) within the second housing (320) when an external impact is applied to the electronic device (101). Accordingly, damage to the second battery (354) may be limited and/or reduced. The inner wall (324) may be defined and/or referred to as a battery wall (324).

According to one embodiment, the second circuit board (354) may be placed on the rear surface (322b) of the second plate (322) corresponding to the first space (323a).

According to one embodiment, the second battery (364) may be placed on the rear surface (322b) of the second plate (322) corresponding to the second space (323b).

According to one embodiment, the electronic device (101) may include a heat dissipation member (410). The heat dissipation member (410) may be configured to dissipate, disperse, or transfer heat generated from the second circuit board (364) and at least one electrical component disposed on the second circuit board (364). For example, the heat dissipation member (410) may include a heat dissipation material. The heat dissipation member (410) may be defined and/or referred to as a heat diffusion member (410).

According to one embodiment, the heat dissipation member (410) may include a vapor chamber. For example, when the heat dissipation member (410) includes a vapor chamber, the heat dissipation member (410) may include a metal plate (e.g., copper) forming an exterior, and a fluid contained within the metal plate.

According to one embodiment, the heat dissipation member (410) may include a graphite sheet.

According to one embodiment, the electronic device (101) may include an adhesive member (430). The adhesive member (430) may be positioned between the rear surface (322b) of the second plate (322) and the heat dissipation member (410). The adhesive member (430) may include an adhesive material. For example, the adhesive member (430) may include a double-sided tape or a bond.

According to one embodiment, the adhesive member (430) may be configured to adhere and/or secure the heat dissipation member (410) to the rear surface (322b) of the second plate (322).

According to one embodiment, the heat dissipation member (410) may be bonded, seated, and/or fixed to the rear surface (322b) of the second plate (322) via an adhesive member (430).

According to one embodiment, the heat dissipation member (410) may include a first heat dissipation region (411) disposed between the rear surface (322b) of the second plate (322) and the second circuit board (364). The first heat dissipation region (411) may be connected to the second circuit board (364) and electrical components (e.g., electrical components (365) of FIG. 9) disposed on the second circuit board (364) through a heat transfer material (e.g., heat transfer material (366) of FIG. 9). The first heat dissipation region (411) may overlap the second circuit board (364) in a first direction (e.g., the Z-axis direction of FIG. 5).

According to one embodiment, the heat dissipation member (410) may include a second heat dissipation area (413) disposed between the rear surface (322b) of the second plate (322) and the second battery (354). The second heat dissipation area (413) may overlap the second battery (354) in a first direction (e.g., the Z-axis direction of FIG. 5).

According to one embodiment, the heat dissipation member (410) may include a third heat dissipation region (415) connected to the first heat dissipation region (411) and the second heat dissipation region (413).

According to one embodiment, heat generated from the second circuit board (364) and the electrical components of the second circuit board (364) can be distributed along the first heat dissipation area (411), the third heat dissipation area (415), and the second heat dissipation area (413). For example, the heat can be transferred to the second housing (320) and/or the second plate (322) corresponding to the second space (323b).

According to one embodiment, the electronic device (101) may include a battery tape (450). The battery tape (450) may be configured to secure the second battery (354) to the second plate (322). The battery tape (450) may be configured to secure the second battery (354) to the rear surface (322b) of the second plate (322).

According to one embodiment, the battery tape (450) may include a double-sided tape disposed between the second battery (354) and the rear surface (322b) of the second plate (322). The battery tape (450) may be defined and/or referred to as an adhesive member. The tape portions (451, 453, 455) of the battery tape (450) may be defined and/or referred to as adhesive portions.

In one embodiment, the battery tape (450) may be arranged to surround at least a portion of the second heat dissipation area (413). For example, when looking at the second plate (322) and the rear surface (322b) of the second plate (322) (e.g., when looking from the -Z direction to the +Z direction in FIGS. 5 and 6), the battery tape (450) may be formed to surround an edge of the second heat dissipation area (413). For example, when looking from above the second plate (322), the battery tape (450) may be bent to surround the second heat dissipation area (413).

In one embodiment, the battery tape (450) may be positioned to surround a plurality of side edges of the second heat dissipation area (413). For example, the battery tape (450) may be positioned to surround at least three side edges of the second heat dissipation area (413).

According to one embodiment, the battery tape (450) may be positioned adjacent to, but not limited to, edges or side edges of the second heat dissipation area (413).

According to one embodiment, when looking at the second plate (322) and the back surface (322b) of the second plate (322), the second heat dissipation region (413) may be positioned between at least a portion of the battery tape (450) (e.g., the first tape portion (451)) and another portion of the battery tape (450) (e.g., the third tape portion (455)).

According to one embodiment, the battery tape (450) may include a first tape portion (451), a second tape portion (453), and a third tape portion (455).

According to one embodiment, the second heat dissipation region (413) may include a first edge (4131), a second edge (4132), and a third edge (4133). The second edge (4132) may face a hinge structure (e.g., hinge structure (202) of FIG. 4). The first edge (4131) may face opposite to the second edge (4132). The third edge (4133) may connect the first edge (4131) and the second edge (4132).

In one embodiment, the first tape portion (451) may extend along a first edge (4131) of the second heat dissipation region (413). The second tape portion (452) may extend along a third edge (4133) of the second heat dissipation region (413). The second tape portion (453) may be bent from the first tape portion (451). The third tape portion (455) may be bent from the second tape portion (453). The third tape portion (455) may extend along a second edge (4132) opposite the first edge (4131).

According to one embodiment, the battery tape (450) may not overlap the second heat dissipation area (413) in the first direction (e.g., the Z-axis direction of FIGS. 5 and 6), which is the thickness direction of the second battery (354).

According to one embodiment, the battery tape (450) may have a bent shape to avoid the second heat dissipation area (413) when looking at the rear surface (322b) of the second plate (322).

According to one embodiment, the battery tape (450) may include a sunken or penetrating opening (e.g., opening (457) of FIG. 6) in at least a portion of the battery tape (450). A second heat dissipation area (413) may be positioned in the opening (457).

Referring to FIGS. 7 and 8, the inner wall (324) may include a first inner wall (324a) and a second inner wall (324b). The second inner wall (324b) may be spaced apart from the first inner wall (324a). The second inner wall (324b) may be aligned in a line with the first inner wall (324a).

According to one embodiment, the third heat dissipation region (415) may be positioned between the first inner wall (324a) and the second inner wall (324b).

According to one embodiment, the first inner wall (324a) and the second inner wall (324b) may be defined as structures separated by a recess formed in the inner wall (324).

Referring to FIG. 8, the electronic device (101) may further include a partition wall (327). The partition wall (327) may be coupled to the first inner wall (324a) and the second inner wall (324b). The partition wall (327) may be positioned between the second circuit board (364) and the second battery (354).

In one embodiment, the partition wall (327) may limit and/or prevent the second circuit board (364) from causing damage to the side surface of the second battery (354). The partition wall (327) may include a base (e.g., polyethylene terephthalate (PET)) and an adhesive. In some embodiments, the partition wall (327) may be omitted, as shown in FIG. 8, but is not limited thereto.

Referring to FIG. 9, the heat dissipation member (410) can be arranged lengthwise along the rear surface (322b) of the second plate (322).

According to one embodiment, the first heat dissipation region (411) may be connected to the electrical component (365) via a heat transfer material (366) (e.g., a thermal interface material (TIM)). For example, the heat transfer material (366) may be a medium that transfers heat generated from the electrical component (365) to the first heat dissipation region (411).

According to one embodiment, the electrical component (365) may be positioned and/or mounted on the second circuit board (364). The electrical component (365) may include a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and/or a power management module (e.g., power management module (188) of FIG. 1).

According to one embodiment, the heat dissipation member (410) can transfer heat generated from the electrical component (365) to the second heat dissipation region (413). For example, the heat generated from the electrical component (365) can be transferred to the second heat dissipation region (413) through the first heat dissipation region (411) and the third heat dissipation region (415). The second heat dissipation region (415) can be configured to disperse the heat through the second plate (322).

According to one embodiment, the third heat dissipation region (413) may overlap the inner wall (324).

According to one embodiment, the second heat dissipation area (415) may be spaced apart from the second battery (354), but is not limited thereto.

According to one embodiment of the present disclosure, the electronic device (101) includes a heat dissipation member (410) extending from the first space (323a) of the second housing (320) to the second space (323b), so that the size of the heat dissipation structure can be sufficiently secured.

FIG. 10A is a cross-sectional view of an electronic device taken along line B-B' of FIG. 2 according to one embodiment of the present disclosure.

FIG. 10b is a cross-sectional view of an electronic device taken along line B-B' of FIG. 2 according to one embodiment of the present disclosure.

FIG. 11 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 12 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

The embodiments of FIGS. 10A to 12 can be combined with the embodiments of FIGS. 1 to 9, or the embodiments of FIGS. 13 to 23.

The configurations of the embodiments of FIGS. 10a to 12 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 9, or the configurations of the embodiments of FIGS. 13 to 23.

Referring to FIGS. 10A, 11, and 12, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 9) may include a second plate (322) (e.g., the second plate (322) of FIGS. 5 to 9).

According to one embodiment, a second display area (332) of a flexible display (330) (e.g., the flexible display (330) of FIG. 5) may be arranged on the front surface (322a) of the second plate (322). A heat dissipation member (410) (e.g., the heat dissipation member (410) of FIGS. 5 to 9) and a second battery (354) (e.g., the second battery (354) of FIG. 5) may be arranged on the rear surface (322b) of the flexible display (322).

According to one embodiment, the electronic device (101) may include at least one antenna (375) (e.g., at least one antenna (375) of FIG. 5) disposed between the second battery (354) and the second rear cover (390) (e.g., the second rear cover (390) of FIG. 5).

According to one embodiment, the second plate (322) may include a stepped portion (325). The stepped portion (325) may be recessed from the rear surface (322b) of the second plate (322) toward the front surface (322a) of the second plate (322). For example, the stepped portion (325) may include a recess or a groove.

According to one embodiment, the step portion (325) can accommodate at least a portion of the second heat dissipation region (413) (e.g., the second heat dissipation region (413) of FIG. 5). For example, the second heat dissipation region (413) can be at least partially accommodated in the step portion (325). The step portion (325) can be defined and/or referred to as an accommodated portion (325).

According to one embodiment, the second heat dissipation region (413) may be seated on an adhesive member (430) (e.g., adhesive member (430) of FIG. 5) disposed on a bottom surface (325a) of the step portion (325) (e.g., bottom surface (325a) of FIGS. 11 and 12). According to one embodiment, the second heat dissipation region (413) may be defined as being seated on the bottom surface (325a) of the step portion (325).

According to one embodiment, a first edge (4131) of the second heat dissipation area (413) may be spaced apart from a first tape portion (451) of the battery tape (450) (e.g., the battery tape (450) of FIGS. 5 and 6). A second edge (4132) of the second heat dissipation area (413) may be spaced apart from a third tape portion (455) of the battery tape (450).

According to one embodiment, the second battery (354) may include a first side (354a) facing the second plate (322) and a second side (354b) opposite the second side (354a) and facing the second rear cover (390).

According to one embodiment, the thickness direction of the second battery (354) may be defined and/or referred to as a first direction (e.g., the Z-axis direction of FIG. 10a). The first direction may be a direction from the second surface (354b) toward the first surface (354a).

According to one embodiment, the battery tape (450) may not overlap the second heat dissipation area (413) of the heat dissipation member (410) in the first direction.

According to one embodiment, the battery tape (450) may be secured to at least a portion of another portion of the second plate (322) that is different from the step portion (325) of the second plate (322) (e.g., another portion (3221b) of FIG. 10A). For example, the battery tape (450) may be secured and/or placed on at least a portion of the portion (3221b) of the rear surface (322b) of the second plate (322) where the step portion (325) is not formed.

According to one embodiment, the battery tape (450) may be placed between the second plate (322) and the second battery (354).

According to one embodiment, the electronic device (101) may further include a film (470) and a protective tape (490).

In one embodiment, the film (470) may wrap at least a portion of the second battery (354). The film (470) may be configured to facilitate separation of the second battery (354) disposed in the second space (e.g., the second space (323b) of FIG. 6) of the second plate (322) for repair or replacement of the second battery (354).

In one embodiment, the film (470) may include an inner surface and an outer surface facing in the opposite direction from the inner surface. The inner surface of the film (470) may wrap or cover at least a portion of the outer surface of the second battery (354).

In one embodiment, the film (470) may include, but is not limited to, a PET (polyethylene terephthalate) film. The film (470) may be bonded to the second battery (354) via an adhesive. For example, the adhesive may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

In one embodiment, the film (470) may include a knob (475). The knob (475) may be utilized as a handle for easily separating the second battery (354) from the second plate (322). For example, when the knob (475) is pulled, the second battery (354) may be lifted or separated from the second plate (322).

According to one embodiment, the film (470) may be defined and/or referred to as a pull-tap tape.

According to one embodiment, the film (470) may include a first film portion (471) and a second film portion (473) covering a first side (354a) of the second battery (354).

According to one embodiment, the first film portion (471) may be positioned between the first tape portion (451) and the first side (354a) of the second battery (354). The second tape portion (453) may be positioned between the third tape portion (455) and the second side (354a) of the second battery (354).

According to one embodiment, the first tape portion (451) and the second tape portion (453) may be spaced apart from each other.

According to one embodiment, the film (470) may cover a first side (e.g., the side facing the +X direction in FIG. 10A) of the second battery (354) and include a third film portion (474) extending from the first film portion (471).

In one embodiment, the film (470) may cover the second side (354b) of the second battery (354) and include a fourth film portion (476) extending from the third film portion (474).

According to one embodiment, the film (470) may cover a second side (e.g., the side facing the -X direction of FIG. 10A) of the second battery (354) and include a fifth film portion (478) extending from the second film portion (473).

In one embodiment, the film (470) may include a knob (475) extending from the fifth film portion (478) and covering the second side (354b) of the second battery (354). The knob (475) may be spaced apart from the fourth film portion (476).

According to one embodiment, the electronic device (101) may further include a protective tape (490). The protective tape (490) may include a PET (polyethylene terephthalate) film. The protective tape (490) may be adhered to the first side (354a) of the second battery (354) via an adhesive. For example, the adhesive may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

According to one embodiment, the protective tape (490) may be placed on the first side (354a) of the second battery (354). The protective tape (490) may be positioned between the first film portion (471) and the second film portion (473).

According to one embodiment, the protective tape (490) may face the second heat dissipation area (413).

According to one embodiment, the thickness (t3) of the film (470) (e.g., the thickness in the Z-axis direction of FIG. 10A) may be greater than the thickness (t4) of the protective tape (490) (e.g., the thickness in the Z-axis direction of FIG. 10A). For example, the thickness (t3) of the first film portion (471) and the thickness (t3) of the second film portion (473) may be greater than the thickness (t4) of the protective tape (490).

According to one embodiment, the second heat dissipation area (413) may be accommodated in the step portion (325). An upper surface of the second heat dissipation area (413) (e.g., a surface facing the -Z direction in FIG. 10a) may protrude with respect to the rear surface (322b) of the second plate (322) by a first thickness (t1) (e.g., a thickness in the Z direction in FIG. 10a).

According to one embodiment, the distance between the second heat dissipation area (413) and the second battery (354) (e.g., the distance in the Z-axis direction of FIG. 10a) may be smaller than the distance between the rear surface (322b) of the second plate (322) and the second battery (354) (e.g., the distance in the Z-axis direction of FIG. 10a).

In one embodiment, the second thickness (t2) of the battery tape (450) may be greater than the first thickness (t1). For example, the thickness (t2) of the first tape portion (451) and the thickness (t2) of the third tape portion (455) may be greater than the thickness (t1) of the protruding portion of the second heat dissipation area (413) with respect to the rear surface (322b) of the second plate (322).

According to one embodiment, an air gap (g) may be formed between the first surface (354a) of the second battery (354) and the second heat dissipation area (413). For example, an air gap (g) may be formed between the protective tape (490) and the second heat dissipation area (413).

In one embodiment, the height (t5) of the air gap (g) (e.g., the height in the Z-axis direction of FIG. 10A) may be, but is not limited to, about 0.04 mm (millimeter) to about 0.06 mm. For example, the height (t5) of the air gap (g) may be, but is not limited to, about 0.05 mm.

According to one embodiment, as the protective tape (490) and the second heat dissipation area (413) are spaced apart from each other to form an air gap (g) therebetween, the first surface (354a) of the second battery (354) may be limited and/or reduced from being hit by the second heat dissipation area (413). For example, when assembling the second battery (354) or when an external impact is applied to the electronic device (101), the second battery (374) may be limited and/or reduced from hitting the second heat dissipation area (413). In addition, as the protective tape (490) covers a portion of the first surface (354a) corresponding to the second heat dissipation area (413), the protective tape (490) may protect the surface of the second battery (354).

Referring to FIGS. 11 and 12, the step portion (325) may be a space defined by a bottom surface (325a) and a lateral surface (325b) surrounding the bottom surface (325a).

According to one embodiment, the rear surface (322b) of the second plate (322) may be connected to the side surface (325b) via a connecting surface (326). The connecting surface (326) may be inclined with respect to the side surface (325b). The connecting surface (326) may be defined by a portion of the side surface (325b).

According to one embodiment, the first tape portion (451) may be configured to cover a boundary (326a) between the second plate (322) and the step portion (325). For example, the first tape portion (451) may be arranged to cover a boundary (326a) defined by an end of the rear surface (322b) of the second plate (322) and an end of the connecting surface (326).

According to one embodiment, as the sharply formed boundary (326a) is covered by the first tape portion (451), the surface of the second battery (354) is protected by the first tape portion (451), and scratches caused by the boundary (326a) can be limited and/or reduced.

According to one embodiment, the first edge (4131) of the second heat dissipation region (413) may be spaced apart from the side surface (325b) of the step portion (325) by a first distance (d1) (e.g., the distance in the X-axis direction of FIGS. 11 and 12). Accordingly, since a tolerance is secured between the second heat dissipation region (413) and the side surface (325b), the second heat dissipation region (413) may be limited and/or prevented from being caught on the side surface (325b) during assembly of the second heat dissipation region (413). Although not illustrated, the edge of the second heat dissipation region (413) (e.g., the second edge (4132) of FIG. 10a) may be spaced apart from the other side surface of the step portion (325) by a predetermined distance.

Referring to FIGS. 11 and 12, the protective tape (490, 4901) may have a size substantially the same as or larger than the second heat dissipation area (413) when viewed in the first direction (e.g., the Z-axis direction of FIGS. 11 and 12) of the second battery (354).

Referring to FIG. 11, the entire area of the protective tape (490) may overlap with the second heat dissipation area (413) when viewed in the first direction. The distance between an end of the protective tape (490) (e.g., an end facing the +X direction in FIG. 11) and a side surface (325b) (e.g., a distance in the X-axis direction in FIG. 11) may be substantially equal to the first distance (d1). For example, the protective tape (490) may have a size substantially equal to the second heat dissipation area (413).

Referring to FIG. 12, a portion of the protective tape (490) may overlap with the second heat dissipation region (413) when viewed in the first direction. The remaining portion of the protective tape (490) may not overlap with the second heat dissipation region (413) when viewed in the first direction. A second distance (d2) (e.g., a distance in the X-axis direction in FIG. 12) between an end of the protective tape (4901) (e.g., an end facing the +X direction in FIG. 11) and a side surface (325b) may be smaller than the first distance (d1). For example, the protective tape (490) may have a size larger than the second heat dissipation region (413).

Referring to FIG. 10b, the second plate (322) may include a hole (3251).

According to one embodiment, the hole (3251) may be formed to penetrate from the front side (322a) to the rear side (322b) of the second plate (322). The hole (3251) may be defined and/or referred to as an opening or a penetrated portion.

According to one embodiment, the heat dissipation member (410) (e.g., the heat dissipation member (410) of FIG. 10a) may include a second heat dissipation region (413a) (e.g., the second heat dissipation region (413) of FIG. 10a).

According to one embodiment, the second heat dissipation area (413a) may be disposed on the front surface (322a) of the second plate (322). For example, the second heat dissipation area (413a) may be disposed on the front surface (322a) of the second plate (322) via an adhesive member (430a) (e.g., the adhesive member (430) of FIG. 10a).

According to one embodiment, at least a portion of the second heat dissipation region (413a) may be seated and/or arranged on a step portion (3221a) of the second plate (322) (e.g., the step portion (325) of FIG. 10a). The step portion (3221a) of the second plate (322) may be recessed from the front surface (322a) toward the rear surface (322b). The step portion (3221a) of the second plate (322) may be interpreted as a portion of the front surface (322a). The step portion (3221a) of the second plate (322) may be interpreted as forming or defining at least a portion of the hole (3251) of the second plate (322).

According to one embodiment, an air gap (g) (e.g., air gap (g) of FIG. 10a) may be formed between the second heat dissipation area (413a) and the first protective tape (490) (e.g., protective tape (490) of FIG. 10a).

According to one embodiment, the electronic device (101) may further include a second protective tape (460). The second protective tape (460) may be bonded to the second heat dissipation area (413a) via an adhesive. For example, the adhesive may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

According to one embodiment, the second protective tape (460) may be positioned between the second heat dissipation area (413a) and the second display area (332) (e.g., the second display area (332) of FIG. 10a). The second protective tape (460) may cover one side of the second heat dissipation area (413a) (e.g., the side facing the +Z direction of FIG. 10b) to limit and/or prevent the second heat dissipation area (413a) from being touched by the second display area (332). For example, the second protective tape (460) may be configured to protect one side of the second heat dissipation area (413a).

According to one embodiment, the second heat dissipation region (413a) may be at least partially accommodated in a hole (3251) of the second plate (322).

According to one embodiment, the second heat dissipation area (413a) may face the second battery (354a) and/or the first protective tape (490) through the hole (3251).

According to one embodiment, at least a portion of the second heat dissipation region (413a) may overlap with the second battery (354) in the first direction (e.g., the Z-axis direction of FIG. 10b). Other portions (e.g., both end portions) of the second heat dissipation region (413A) may overlap with the first tape portion (451) (e.g., the first tape portion (451) of FIG. 10a) and the third tape portion (455) (e.g., the third tape portion (455) of FIG. 10a) of the battery tape (450) (e.g., the battery tape (450) of FIG. 10a)) in the first direction.

According to one embodiment, at least a portion of the second plate (322) may be disposed between the second battery (354) and the second heat dissipation area (413a) in the first direction. For example, at least a portion of the second plate (322) defining the hole (3251) or surrounding the hole (3251) may be disposed between the second battery (354) and the second heat dissipation area (413a).

According to one embodiment, the adhesive member (430a) (e.g., the adhesive member (430) of FIG. 10a) may be configured to adhere the second heat dissipation region (413a) to the second plate (322).

According to one embodiment, the adhesive member (430a) can be secured to the step portion (3221a). The adhesive member (430a) can be positioned between at least a portion of the front surface (322a) of the second plate (322) defining the step portion (3221a) and the second heat dissipation area (413a).

According to one embodiment, the adhesive member (430a) may include a first adhesive portion (431a) and a second adhesive portion (435a).

According to one embodiment, the first adhesive portion (431a) may be disposed on a step portion (3221a) of the front surface (322a) of the second plate (322). The first adhesive portion (431a) may be disposed between the first tape portion (451) and the second heat dissipation region (413a) in a first direction (e.g., the Z-axis direction of FIG. 10b). For example, the first adhesive portion (431a) may overlap the first tape portion (451) in the first direction.

According to one embodiment, the second adhesive portion (435a) may be disposed on a step portion (3221a) of the front surface (322a) of the second plate (322). The second adhesive portion (435a) may be disposed between the third tape portion (455) and the second heat dissipation region (413a) in the first direction (e.g., the Z-axis direction of FIG. 10b). For example, the second adhesive portion (435a) may overlap the third tape portion (451) in the first direction.

According to one embodiment, the first adhesive portion (431a) and the second adhesive portion (435a) may be separate members, but are not limited thereto. For example, the first adhesive portion (431a) and the second adhesive portion (435a) may be formed integrally. When the first adhesive portion (431a) and the second adhesive portion (435a) are formed integrally, the adhesive member (430a) may further include a third adhesive portion (not shown) positioned to correspond to and overlap the second tape portion (e.g., the second tape portion (453) of FIG. 6).

FIG. 13 is a schematic diagram illustrating a second battery, a protective tape, and a film according to one embodiment of the present disclosure.

FIG. 14 is a plan view showing a film according to one embodiment of the present disclosure.

FIG. 15 is a plan view showing a film according to one embodiment of the present disclosure.

FIG. 16 is a plan view showing a film according to one embodiment of the present disclosure.

FIG. 17 is a plan view showing a film according to one embodiment of the present disclosure.

The embodiments of FIGS. 13 to 17 can be combined with the embodiments of FIGS. 1 to 12, or the embodiments of FIGS. 18 to 23.

The configurations of the embodiments of FIGS. 13 to 17 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 12, or the configurations of the embodiments of FIGS. 18 to 23.

Referring to FIG. 13, the second battery (354) (e.g., the second battery (354) of FIG. 10A) may include a conductive connector (355). The conductive connector (355) may be physically and/or electrically connected to a second circuit board (e.g., the second circuit board (364) of FIG. 5), but is not limited thereto.

FIG. 13 illustrates a state in which the configurations associated with the second battery (354) are projected onto the second battery (354) when viewed from above on the second side of the second battery (354) (e.g., the second side (354a) of FIG. 10a).

According to one embodiment, a protective tape (490) (e.g., the protective tape (490) of FIG. 10A) may be attached to a second battery (354). The protective tape (490) may be surrounded by a battery tape (450) (e.g., the battery tape (450) of FIG. 10A). For example, the protective tape (490) may be surrounded by a first tape portion (451), a second tape portion (453), and a third tape portion (455).

According to one embodiment, a film (e.g., film (470) of FIG. 10A or film (470) of FIGS. 14-17) may include a plurality of glue areas. The plurality of glue areas may be arranged on an inner surface of the film (e.g., a surface facing the second battery (354)) so as to adhere the film (470) and the second battery (354) to each other.

According to one embodiment, among the plurality of glue regions, the first glue regions (501, 503) located around the protective tape (490) may be larger in size than the other glue regions.

According to one embodiment, among the plurality of glue regions, the adhesive strength of the first glue regions (501, 503) located around the protective tape (490) may be relatively greater than the adhesive strength of the other glue regions. Accordingly, when an external impact is applied to the electronic device and the second battery (354) is twisted, the film (470) may be restricted and/or reduced from being separated from the second battery (354).

Figures 14 to 17 illustrate a state in which the film (470) is fully unfolded (e.g., not wrapping the second battery (354)).

Referring to FIGS. 14 to 17, the film (470) may include a knob (475) (e.g., the knob (475) of FIG. 10A) and an opening (479). The opening (479) may be formed in at least a portion of the film (470) corresponding to a protective tape (490). The protective tape (490) may be placed in the opening (479).

Referring to FIG. 14, the film (470) may include a plurality of glue regions (511, 512, 513, 514, 515, 516). For example, the plurality of glue regions (511, 512, 513, 514, 515, 516) may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

According to one embodiment, the first glue regions (511, 512, 513, 514, 515) may be arranged around the protective tape (490) and the opening (479) corresponding to the protective tape (490). The size of each of the first glue regions (511, 512, 513, 514, 515) may be larger than the size of the other glue regions (516).

According to one embodiment, the first-first glue region (511) may extend obliquely with respect to the first-second glue region(s) (512). The first-second glue region(s) (512) may be arranged along the first edge of the protective tape (490) (e.g., the edge facing the +X direction in FIG. 13).

According to one embodiment, the first-third glue region (513) may extend obliquely relative to the first-fourth glue region(s) (514). The first-fourth glue region(s) (514) may be arranged along the second edge of the protective tape (490) (e.g., the edge facing the -X direction in FIG. 13).

According to one embodiment, the first-fifth glue region(s) (515) may be spaced apart from the first-fourth glue region(s) (514).

In one embodiment, the second glue region(s) (516) may be positioned in portions of the film (470) where the first glue regions are absent.

Referring to FIG. 15, the film (470) may include a plurality of glue regions (521, 522, 523, 524, 525, 526). For example, the plurality of glue regions (521, 522, 523, 524, 525, 526) may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

According to one embodiment, the first glue regions (521, 522, 523, 524, 525) may be arranged around the protective tape (490) and the opening (479) corresponding to the protective tape (490). The size of each of the first glue regions (521, 522, 523, 524, 525) may be larger than the size of the other glue regions (526).

According to one embodiment, the first-first glue region(s) (521) may be arranged on one side relative to the first-second glue region(s) (522), and the first-first glue regions (521) may be arranged adjacent to each other to have a triangular shape. The first-second glue regions (522) may be arranged along the first edge of the protective tape (490) (e.g., the edge facing the +X direction in FIG. 13).

According to one embodiment, the first-third glue region(s) (523) may be arranged on one side relative to the first-fourth glue region(s) (524), and the first-third glue region(s) (523) may be arranged adjacent to each other to have a triangular shape. The first-fourth glue region(s) (524) may be arranged along the second edge of the protective tape (490) (e.g., the edge facing the -X direction in FIG. 13).

According to one embodiment, the first-fifth glue region(s) (525) may be spaced apart from the first-fourth glue region(s) (524).

In one embodiment, the second glue region(s) (526) may be positioned in portions of the film (470) where the first glue regions are absent.

Referring to FIG. 16, the film (470) may include a plurality of glue regions (532, 534, 535, 536). For example, the plurality of glue regions (532, 534, 535, 536) may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

According to one embodiment, the first glue regions (532, 534, 535) may be arranged around the protective tape (490) and the opening (479) corresponding to the protective tape (490). The size of each of the first glue regions (532, 534, 535) may be larger than the size of the other glue regions (536).

According to one embodiment, the first-second glue region(s) (532) may be arranged along a first edge of the protective tape (490) (e.g., an edge facing the +X direction of FIG. 13).

According to one embodiment, the first-fourth glue region(s) (534) may be arranged along the second edge of the protective tape (490) (e.g., the edge facing the -X direction of FIG. 13).

According to one embodiment, the first-fifth glue region(s) (535) may be spaced apart from the first-fourth glue region(s) (534).

Referring to FIG. 17, the film (470) may include a plurality of glue regions (541, 542, 543, 544, 545, 546). For example, the plurality of glue regions (541, 542, 543, 544, 545, 546) may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

According to one embodiment, the first glue regions (541, 542, 543, 544, 545) may be arranged around the protective tape (490) and the opening (479) corresponding to the protective tape (490). The size of each of the first glue regions (541, 542, 543, 544, 545) may be larger than the size of the other glue regions (546).

According to one embodiment, the first-first glue region(s) (541) may be arranged on one side relative to the first-second glue region(s) (542), and the first-first glue regions(s) (541) may be spaced apart from each other. The first-first glue region(s) (541) may extend in a direction substantially perpendicular to the arrangement direction of the first-second glue region(s) (542). The first-second glue region(s) (542) may be arranged along a first edge of the protective tape (490) (e.g., an edge facing the +X direction of FIG. 13).

According to one embodiment, the first-third glue region(s) (543) may be arranged on one side relative to the first-fourth glue region(s) (544), and the first-third glue region(s) (543) may be spaced apart from each other. The first-third glue region(s) (543) may extend in a direction substantially perpendicular to the arrangement direction of the first-fourth glue region(s) (544). The first-fourth glue region(s) (544) may be arranged along a second edge of the protective tape (490) (e.g., an edge facing the -X direction of FIG. 13).

According to one embodiment, the first-fifth glue region(s) (545) may be spaced apart from the first-fourth glue region(s) (544).

According to one embodiment, the second glue region(s) (546) may be positioned in portions of the film (470) where the first glue regions are absent.

FIG. 18 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 19 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 20 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

FIG. 21 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

The embodiments of FIGS. 18 to 21 can be combined with the embodiments of FIGS. 1 to 17, or the embodiments of FIGS. 22 to 23.

The configurations of the embodiments of FIGS. 18 to 21 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 17, or the configurations of the embodiments of FIGS. 22 to 23.

Referring to FIGS. 18 to 21, an electronic device (101) (e.g., the electronic device (101) of FIGS. 5 to 6, or the electronic device (101) of FIG. 10A) may include a second plate (322) (e.g., the plate (322) of FIGS. 10A and 6).

According to one embodiment, a second display area (332) (e.g., the second display area (332) of FIG. 10a) of a flexible display (330) (e.g., the flexible display (330) of FIG. 10a) may be disposed on a front surface (322a) of a second plate (322).

According to one embodiment, the second battery (354) (e.g., the second battery (354) of FIG. 10A) may be supported by the rear surface (322b) of the second plate (322). A first surface (354a) of the second battery (354) may face the second plate (322), and a second surface (354b) of the second battery (354) may face the second rear cover (390).

According to one embodiment, at least one antenna (375) (e.g., at least one antenna (375) of FIG. 10A) may be positioned between the second battery (354) and the second rear cover (390) (e.g., the second rear cover (390) of FIG. 10A).

According to one embodiment, a second heat dissipation area (413) (e.g., the second heat dissipation area (413) of FIG. 10A) of a heat dissipation member (410) (e.g., the heat dissipation member (410) of FIG. 10A) may overlap with a second battery (354) and be disposed under the second battery (354).

According to one embodiment, the second heat dissipation region (413) may be secured to the second plate (322) via an adhesive member (430) (e.g., the adhesive member (430) of FIG. 10A).

According to one embodiment, the second battery (354) may be secured to the second plate (322) and/or the step portion (325) via a battery tape (e.g., battery tape (450) of FIG. 10A).

In one embodiment, at least a portion of the second battery (354) may be wrapped by a film (470) (e.g., film (470) of FIG. 10A).

Referring to FIG. 18, the second heat dissipation region (413) may be disposed and/or accommodated in, at least partially, the step portion (325) (e.g., the step portion (325) of FIG. 10a).

According to one embodiment, at least a portion of the second heat dissipation region (413) may be disposed between the first tape portion (451) and the second tape portion (455).

In one embodiment, at least a portion (4701) of the film (470) can face the second heat dissipation area (413). The film (470) can completely cover the first side (354a) of the second battery (354). At least a portion (4701) of the film (470) can be positioned between the second heat dissipation area (413) and the first side (354a) of the second battery (354).

According to one embodiment, an air gap (g) may be formed between the second heat dissipation region (413) and at least a portion (4701) of the film (470).

According to one embodiment, the battery tape (450) may not overlap the second heat dissipation area (413) in the thickness direction of the second battery (354) (e.g., the Z-axis direction of FIG. 18).

Referring to FIG. 19, the second heat dissipation area (413) may be placed on the rear surface (322b) of the second plate (322).

According to one embodiment, at least a portion of the second heat dissipation region (413) may be disposed between the first tape portion (4511) and the second tape portion (4551).

In one embodiment, at least a portion (4701) of the film (470) can face the second heat dissipation area (413). The film (470) can completely cover the first side (354a) of the second battery (354). At least a portion (4701) of the film (470) can be positioned between the second heat dissipation area (413) and the first side (354a) of the second battery (354).

According to one embodiment, the thickness of the first tape portion (4511) (e.g., the thickness in the Z-axis direction of FIG. 19) may be greater than the sum of the thickness of the second heat dissipation region (413) and the thickness of the adhesive member (430). The thickness of the second tape portion (4551) may be greater than the sum of the thickness of the second heat dissipation region (413) and the thickness of the adhesive member (430). The thickness of the first tape portion (4511) may be substantially the same as the thickness of the second tape portion (4551) (e.g., the thickness in the Z-axis direction of FIG. 19).

According to one embodiment, an air gap (g) may be formed between the second heat dissipation region (413) and at least a portion (4701) of the film (470).

According to one embodiment, the battery tape (450) may not overlap the second heat dissipation area (413) in the thickness direction of the second battery (354) (e.g., the Z-axis direction of FIG. 19).

Referring to FIG. 20, the second heat dissipation region (413) may be disposed and/or accommodated in, at least partially, the step portion (325) (e.g., the step portion (325) of FIG. 10a).

In one embodiment, at least a portion (4501) of the battery tape (450) may overlap with the second heat dissipation area (413). For example, at least a portion (4501) of the battery tape (450) may be positioned between the second heat dissipation area (413) and the second battery (354). At least a portion (4501) of the battery tape (450) may overlap with the second heat dissipation area (413) in the thickness direction of the second battery (354) (e.g., the Z-axis direction in FIG. 20).

According to one embodiment, one side (e.g., the side facing the +Z direction of FIG. 20) of at least a portion (4501) of the battery tape (450) may face the second heat dissipation region (413).

According to one embodiment, the electronic device (101) may include a first protective tape (491) (e.g., the protective tape (490) of FIG. 10A) disposed on the first surface (4501). An air gap (g) may be formed between the first protective tape (491) and the second heat dissipation area (413).

According to one embodiment, at least a portion (4501) of the battery tape (450) may have a surface (e.g., a surface facing the -Z direction of FIG. 20) facing the second battery (354).

According to one embodiment, the electronic device (101) may include a second protective tape (493) (e.g., the protective tape (493) of FIG. 10A) disposed on the other surface. An air gap may be formed between the second protective tape (493) and the second battery (354).

Referring to FIG. 21, the second heat dissipation region (413) may be disposed and/or accommodated in, at least partially, the step portion (325) (e.g., the step portion (325) of FIG. 10a).

In one embodiment, at least a portion (4502) of the battery tape (450) may overlap the second heat dissipation area (413). For example, at least a portion (4502) of the battery tape (450) may be positioned between the second heat dissipation area (413) and the second battery (354). At least a portion (4502) of the battery tape (450) may overlap the second heat dissipation area (413) in the thickness direction of the second battery (354) (e.g., the Z-axis direction of FIG. 21).

According to one embodiment, at least one side (e.g., the side facing the +Z direction of FIG. 21) of a portion (4502) of the battery tape (450) may face the second heat dissipation region (413).

According to one embodiment, the electronic device (101) may include a first protective tape (4911) (e.g., protective tape (490) of FIG. 10A) disposed on the surface. An air gap (g) may be formed between the first protective tape (4911) and the second heat dissipation area (413).

In one embodiment, at least a portion (4502) of the battery tape (450) may have a surface (e.g., a surface facing the -Z direction of FIG. 20 ) facing the second battery (354).

In one embodiment, at least a portion (4702) of the film (470) can completely cover the first side (354a) of the second battery (354). At least a portion (4702) of the film (470) can be positioned between the second heat dissipation area (413) and the first side (354a) of the second battery (354). At least a portion (4702) of the film (470) can be positioned between at least a portion (4502) of the battery tape (450) and the first side (354a) of the second battery (354).

FIG. 22 is a plan view of an electronic device including a heat dissipation member and a battery tape according to one embodiment of the present disclosure.

FIG. 23 is a cross-sectional view of an electronic device including a heat dissipation member and a battery tape according to one embodiment of the present disclosure.

The embodiments of FIGS. 22 and 23 can be combined with the embodiments of FIGS. 1 to 21.

The configurations of the embodiments of FIGS. 22 and 23 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 21.

Referring to FIGS. 22 and 23, the electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 6) may include a second housing (320) (e.g., the second housing (320) of FIG. 5) including a second plate (322) and a second side wall (321).

According to one embodiment, a heat dissipation member (410) (e.g., the heat dissipation member (410) of FIGS. 5 and 6) may be disposed on the rear surface (322b) of the second plate (322).

According to one embodiment, the heat dissipation member (410) may include a first heat dissipation area (410) (e.g., the first heat dissipation area (410) of FIG. 6) connected to a second circuit board (e.g., the second circuit board (364) of FIG. 5) and overlapping with the second circuit board.

According to one embodiment, the heat dissipation member (410) may include a second heat dissipation area (413, 4131) spaced apart from and overlapping the second battery (e.g., the second battery (354) of FIG. 5).

According to one embodiment, the heat dissipation member (410) may include a third heat dissipation region (415) connected to the first heat dissipation region (411) and the second heat dissipation region (413, 4131).

In one embodiment, the battery tape (450) (e.g., the battery tape (450) of FIGS. 5 and 6) may not overlap with the second heat dissipation area (413, 4131). For example, the battery tape (450) may not overlap with the second heat dissipation area (413, 4131) in the thickness direction of the second battery (e.g., the Z-axis direction of FIGS. 22 and 23).

Referring to FIG. 22, the battery tape (450) may be formed to surround the edge of the first heat dissipation area (413). The battery tape (450) may include a first tape portion (451) (e.g., the first tape portion (451) of FIG. 6), a second tape portion (453) (e.g., the second tape portion (453) of FIG. 6), and a third tape portion (455) (e.g., the third tape portion (455) of FIG. 6).

According to one embodiment, the first tape portion (451), the second tape portion (453), and the third tape portion (455) may not overlap the second heat dissipation area (413) in the thickness direction of the second battery (e.g., the Z-axis direction of FIG. 22).

According to one embodiment, the second tape portion (453) may be integrally formed with the first tape portion (451) and the third tape portion (455).

According to one embodiment, the third tape portion (455) may be positioned between the second heat dissipation region (413) and the folding axis (Ax) (e.g., the folding axis (Ax) of FIGS. 2 and 4). For example, the third tape portion (455) may be positioned between the second heat dissipation region (413) and the hinge structure (e.g., the hinge structure (202) of FIG. 4).

Referring to FIG. 23, the battery tape (450) may include a plurality of tape portions (551, 553, 555, 557). The plurality of tape portions (551, 553, 555, 557) may be spaced apart from each other. The plurality of tape portions (551, 553, 555, 557) may not overlap the second heat dissipation area (4131) in the thickness direction (e.g., the Z-axis direction in FIG. 23) of the second battery (e.g., the second battery (354) in FIG. 5).

In one embodiment, the plurality of tape portions (551, 553, 555, 557) may not be disposed between the second heat dissipation region (4131) and the folding axis (Ax) (e.g., the folding axis (Ax) of FIGS. 2 and 4). For example, the plurality of tape portions (551, 553, 555, 557) may not be disposed between the second heat dissipation region (4131) and the hinge structure (e.g., the hinge structure (202) of FIG. 4).

According to one embodiment of the present disclosure, a battery tape (e.g., a battery tape (450) of FIGS. 22 and 23) for fixing a second battery (e.g., a second battery (354) of FIG. 5) to a second plate (322) may not overlap at least a portion of a heat dissipation member (410) (e.g., a second heat dissipation area (413, 4131) of FIGS. 22 and 23) in a thickness direction of the second battery (e.g., a Z-axis direction of FIGS. 22 and 23). Accordingly, at least a portion of the heat dissipation member (410) may be positioned to correspond to the second battery, while the thickness of the second housing (320) (e.g., a thickness in the Z-axis direction of FIGS. 22 and 23) may be provided slimly.

An electronic device may include a circuit board comprising at least one electrical component (e.g., a processor or memory). The at least one electrical component disposed on the circuit board may generate heat during operation.

Since the above heat may reduce the operating efficiency of at least one electrical component disposed on the circuit board, the electronic device may include a heat dissipation member that transfers heat generated from the electrical component to another structure or another component.

However, due to the integration and miniaturization of electronic devices, it may be difficult to mount a heat dissipation member large enough for heat dissipation performance.

According to one embodiment of the present disclosure, an electronic device may be provided that includes a heat dissipation structure capable of dissipating heat generated from a circuit board and limiting and/or reducing damage to a battery.

However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

According to one embodiment of the present disclosure, an electronic device may be provided that includes a heat dissipation structure in which sufficient space for disposing a heat dissipation member inside the electronic device is secured by disposing at least a portion of the heat dissipation member in an opening formed in an inner wall (e.g., a battery wall) disposed between a battery and a circuit board.

According to one embodiment of the present disclosure, an electronic device may be provided that includes a heat dissipation structure capable of limiting and/or reducing distortion of the electronic device and/or housing upon being dropped, by including a battery wall.

According to one embodiment of the present disclosure, an electronic device can be provided that includes a heat dissipation structure capable of improving battery capacity by sufficiently securing a size of the battery and limiting and/or preventing damage to the battery.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

According to one embodiment of the present disclosure, the electronic device (101) may include a first housing (310).

According to one embodiment, the electronic device (101) may include a second housing (320) rotatably connected to the first housing (310) and including a plate (322), an inner wall (324) protruding from the plate (322), and a stepped portion (325) recessed from the plate (322).

According to one embodiment, the electronic device (101) may include a flexible display (330) disposed on the first housing (310) and the second housing (320).

According to one embodiment, the electronic device (101) may include a circuit board (364) disposed within the second housing (320).

According to one embodiment, the electronic device (101) may include a battery (354) disposed within the second housing (320) and spaced apart from the circuit board (364) with the inner wall (324) therebetween.

According to one embodiment, the electronic device (101) may include a first heat dissipation area (411) overlapping the circuit board (364) and a second heat dissipation area (413) overlapping the battery (354) and at least partially accommodated in the step portion (325), and may include a heat dissipation member (410) including a heat dissipation material.

According to one embodiment, the electronic device (101) may include a battery tape (450) configured to secure the battery (354) to the plate (322).

According to one embodiment, the battery tape (450) may be mounted on at least a portion of another portion (3221b) of the plate (322) other than the step portion (325) of the plate (322).

According to one embodiment, the battery tape (450) may be placed between the plate (322) and the battery (354).

According to one embodiment, when viewed from above the plate (322), the battery tape (450) may be arranged to surround the second heat dissipation area (413).

According to one embodiment, the second heat dissipation region (413) may be at least partially disposed between at least a portion of the battery tape (450) and another portion of the battery tape (450).

According to one embodiment, the battery tape (450) may include a first tape portion (451) extending along a first edge (4131) of the second heat dissipation area (413).

According to one embodiment, the battery tape (450) may include a second tape portion (453) bent from the first tape portion (451).

According to one embodiment, the battery tape (450) may include a third tape portion (455) that is bent from the second tape portion (453) and extends along a second edge (4132) opposite the first edge (4131) of the second heat dissipation area (413).

According to one embodiment, the first tape portion (451) may be spaced apart from the first edge (4131).

According to one embodiment, the third tape portion (455) may be spaced apart from the second edge (4132).

According to one embodiment, the first tape portion (451) may be configured to cover the boundary (326a) of the plate (322) and the step portion (325).

According to one embodiment, the battery (354) may include a first side (354a) facing the plate (322) and a second side (354b) opposite the first side (354a).

According to one embodiment, the battery tape (450) may not overlap the second heat dissipation area (413) in a first direction from the second side (354b) toward the first side (354a).

According to one embodiment, an air gap (g) may be formed between the first surface (354a) of the battery (354) and the second heat dissipation area (413).

According to one embodiment, the electronic device (101) may further include a protective tape (490) disposed on the first side (354a) of the battery (354) and facing the second heat dissipation area (413).

According to one embodiment, the electronic device (101) may further include a film (470) that surrounds the battery (354) and includes a first film portion (471) disposed between the battery (354) and the first tape portion (451) and a second film portion (473) disposed between the battery (354) and the third tape portion (455).

According to one embodiment, the protective tape (490) may be placed between the first film portion (471) and the second film portion (473).

According to one embodiment, the thickness of the film (470) may be greater than the thickness of the protective tape (490).

According to one embodiment, the film (470) may further include a plurality of glue areas (511, 512, 513, 514, 515, 516) configured to adhere to the battery (354).

According to one embodiment, the size of the first glue areas (511, 512, 513, 514, 515) located around the protective tape (490) may be larger than the size of the other glue areas (516).

According to one embodiment, the plate (322) may include a front side (322a) facing at least a portion (332) of the flexible display (330) and a rear side (322b) opposite the front side (322a).

According to one embodiment, the circuit board (364) and the battery (354) may be placed on the rear surface (322b).

According to one embodiment, the step portion (325) may be formed on the rear surface (322b).

According to one embodiment, the distance between the second heat dissipation area (413) and the battery (354) may be smaller than the distance between the rear surface (322b) and the battery (354).

According to one embodiment, the inner wall (324) may include a first inner wall (324a) and a second inner wall (324b) spaced apart from the first inner wall (324a) and aligned in a line with the first inner wall (324a).

According to one embodiment, the heat dissipation member (410) may further include a third heat dissipation region (415) connected to the first heat dissipation region (411) and the second heat dissipation region (413) and positioned between the first inner wall (324a) and the second inner wall (324b).

According to one embodiment, the second housing (320) may further include a partition (327) coupled to the first inner wall (324a) and the second inner wall (324b) and positioned between the circuit board (364) and the battery (354).

According to one embodiment of the present disclosure, the electronic device (101) may include a first housing (310).

According to one embodiment, the electronic device (101) may include a second housing (320) rotatably connected to the first housing (310) and including a plate (322) and an inner wall (324) protruding from the plate (322).

According to one embodiment, the electronic device (101) may include a flexible display (330) disposed on the first housing (310) and the second housing (320).

According to one embodiment, the electronic device (101) may include a circuit board (364) disposed within the second housing (320).

According to one embodiment, the electronic device (101) may include a battery (354) disposed within the second housing (320), spaced apart from the circuit board (364) with the inner wall (324) therebetween, and including a first side (354a) facing the plate (322) and a second side (354b) opposite the first side (354a).

According to one embodiment, the electronic device (101) may include a first heat dissipation area (411) overlapping the circuit board (364) and a second heat dissipation area (413) overlapping the battery (354), and may include a heat dissipation member (410) including a heat dissipation material.

According to one embodiment, the electronic device (101) may include a battery tape (450) configured to secure the battery (354) to the plate (322).

According to one embodiment, the electronic device (101) may further include a film (470) that surrounds at least a portion of the battery (354).

According to one embodiment, at least a portion (4701) of the film (470) may be disposed between the second heat dissipation region (413) and the first surface (354a) of the battery (354).

According to one embodiment, the battery tape (450) may be positioned so as not to overlap with the second heat dissipation area (413).

According to one embodiment, at least a portion (4501) of the battery tape (450) may be positioned to overlap the second heat dissipation area (413).

According to one embodiment of the present disclosure, an electronic device (101) may include a housing (320) including a plate (322), an inner wall (324) protruding from the plate (322), and a stepped portion (325) recessed from the plate (322).

According to one embodiment, the electronic device (101) may include a flexible display (330) disposed on the housing (320).

According to one embodiment, the electronic device (101) may include a circuit board (364) disposed within the housing (320).

According to one embodiment, the electronic device (101) may include a battery (354) disposed within the housing (320) and spaced apart from the circuit board (364) with the inner wall (324) therebetween.

According to one embodiment, the electronic device (101) may include a first heat dissipation area (411) overlapping the circuit board (364) and a second heat dissipation area (413) overlapping the battery (354) and at least partially accommodated in the step portion (325), and may include a heat dissipation member (410) including a heat dissipation material.

According to one embodiment, the electronic device (101) may include a battery tape (450) configured to secure the battery (354) to the plate (322).

According to one embodiment, the battery tape (450) may be arranged so that, when viewed from above the plate (322), the battery tape (450) surrounds at least three side edges of the second heat dissipation area (413).

According to one embodiment, the at least three side edges may include a first edge (4131), a second edge (4132), and a third edge (4133).

Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims (15)

In an electronic device (101), First housing (310); A second housing (320) rotatably connected to the first housing (310) and including a plate (322), an inner wall (324) protruding from the plate (322), and a stepped portion (325) recessed from the plate (322); A flexible display (330) disposed on the first housing (310) and the second housing (320); A circuit board (364) placed within the second housing (320); A battery (354) disposed within the second housing (320) and spaced apart from the circuit board (364) with the inner wall (324) therebetween; A heat dissipation member (410) comprising a heat dissipation material, including a first heat dissipation area (411) overlapping the circuit board (364) and a second heat dissipation area (413) overlapping the battery (354) and at least partially accommodated in the step portion (325); and A battery tape (450) configured to secure the battery (354) to the plate (322), The above battery tape (450) is seated on at least a portion of another portion (3221b) of the plate (322) that is different from the step portion (325) of the plate (322), and is disposed between the plate (322) and the battery (354), in an electronic device (101). In the first paragraph, The second heat dissipation area (413) is an electronic device (101) disposed at least partially between at least a portion of the battery tape (450) and another portion of the battery tape (450). In claim 1 or 2, The above battery tape (450) is, A first tape portion (451) extending along the first edge (4131) of the second heat dissipation area (413); A second tape portion (453) bent from the first tape portion (451); and An electronic device (101) comprising a third tape portion (455) bent from the second tape portion (453) and extending along a second edge (4132) opposite to the first edge (4131) of the second heat dissipation region (413). In any one of paragraphs 1 to 3, The above first tape portion (451) is spaced apart from the first edge (4131), The third tape portion (455) is an electronic device (101) spaced apart from the second edge (4132). In any one of paragraphs 1 to 4, The first tape portion (451) is configured to cover the boundary (326a) of the plate (322) and the step portion (325), in an electronic device (101). In any one of paragraphs 1 to 5, The above battery (354) includes a first side (354a) facing the plate (322) and a second side (354b) opposite to the first side (354a), The above battery tape (450) is an electronic device (101) that does not overlap the second heat dissipation area (413) in a first direction from the second side (354b) toward the first side (354a). In any one of paragraphs 1 to 6, An electronic device in which an air gap (g) is formed between the first surface (354a) of the battery (354) and the second heat dissipation area (413). In any one of paragraphs 1 to 7, An electronic device (101) further comprising a protective tape (490) disposed on the first surface (354a) of the battery (354) and facing the second heat dissipation area (413). In any one of paragraphs 1 to 8, An electronic device (101) further comprising a film (470) comprising a first film portion (471) disposed between the battery (354) and the first tape portion (451) and a second film portion (473) disposed between the battery (354) and the third tape portion (455) and wrapping the battery (354). In any one of paragraphs 1 to 9, The above protective tape (490) is an electronic device (101) placed between the first film portion (471) and the second film portion (473). In any one of paragraphs 1 to 10, The thickness of the above film (470) is greater than the thickness of the above protective tape (490) in the electronic device (101). In any one of paragraphs 1 to 11, The above film (470) further includes a plurality of glue areas (511, 512, 513, 514, 515, 516) configured to be adhered to the battery (354), The size of the first glue areas (511, 512, 513, 514, 515) located around the protective tape (490) is larger than the size of the other glue areas (516) of the electronic device (101). In any one of paragraphs 1 to 12, The plate (322) includes a front side (322a) facing at least a portion (332) of the flexible display (330) and a rear side (322b) opposite to the front side (322a). The circuit board (364) and the battery (354) are placed on the rear surface (322b), The above step portion (325) is formed on the rear surface (322b), An electronic device (101) in which the distance between the second heat dissipation area (413) and the battery (354) is smaller than the distance between the rear surface (322b) and the battery (354). In any one of paragraphs 1 to 13, The inner wall (324) includes a first inner wall (324a) and a second inner wall (324b) spaced apart from the first inner wall (324a) and aligned in a line with the first inner wall (324a). An electronic device (101) in which the heat dissipation member (410) is connected to the first heat dissipation region (411) and the second heat dissipation region (413), and further includes a third heat dissipation region (415) disposed between the first inner wall (324a) and the second inner wall (324b). In any one of paragraphs 1 to 14, An electronic device (101) in which the second housing (320) is coupled to the first inner wall (324a) and the second inner wall (324b) and further includes a partition wall (327) disposed between the circuit board (364) and the battery (354).