WO2025205618A1 - Pressure-bonding device and method for manufacturing display panel - Google Patents

Abstract

[Problem] To provide a pressure-bonding device that prevents deterioration of accuracy while achieving a reduction in takt time. [Solution] A pressure-bonding device according to one embodiment comprises a stage part on which a display panel is placed so that an edge portion protrudes. The pressure-bonding device is movable in the horizontal direction, the vertical direction, and the rotation direction, and further comprises a pressure-bonding head part for pressure-bonding an electronic component to the display panel. The pressure-bonding device further comprises a backup part that is opposed to a first pressure-bonding head part in the vertical direction, is movable in the horizontal direction, the vertical direction, and the rotation direction, and supports the edge portion of the display panel from a non-pressure-bonding surface side. The pressure-bonding device further comprises a control unit that performs control to move the backup part and the pressure-bonding head part. The control unit also performs control to adjust the orientation of the pressure-bonding head part and the backup part for holding the electronic component with respect to a corresponding electrode row on the display panel on the basis of information indicating a preset mounting position of the electronic component on the display panel.

Description

Pressure bonding device and display panel manufacturing method

Embodiments of the present invention relate to a crimping device and a method for manufacturing a display panel.

The manufacturing process for display panels such as liquid crystal panels and organic EL panels includes a process for mounting chip-type electronic components such as driver ICs for driving the display panel substrate, as well as film-type electronic components called COF (chip-on-film) that mount driver ICs, on the display panel substrate. Prior to this process, an anisotropic conductive material called ACF (anisotropic conductive film) is attached to the terminals of the substrate to join the terminals of the substrate and the terminals of the electronic components. In other words, the driver IC or COF is mounted on the substrate via the ACF.

ACF (Anisotropic Conducting Film) is a film-like material made of a thermosetting resin base material containing many small conductive particles. It is supplied as a tape-like material attached to release tape (hereinafter referred to as ACF tape) and is attached to the terminals of a circuit board. Such ACF is pre-slit to match the dimensions of the driver IC or COF, and after being attached to the terminals of the circuit board, the ACF attached to the terminals is separated from the ACF tape by this slit when the release tape is removed from the board.

A known example of a substrate processing apparatus that applies ACF to the terminals of a substrate is the one disclosed in Patent Document 1. The substrate processing apparatus disclosed in Patent Document 1 aims to improve productivity by arranging adjacent units that apply ACF to a single substrate, and simultaneously applying ACF to different terminals of the same substrate in parallel. Patent Document 1 also discloses that a large substrate processing apparatus consisting of adjacently arranged such substrate processing apparatuses can simultaneously apply ACF to multiple substrates in parallel.

International Publication No. 2011/001692

When the above-mentioned crimping device temporarily crimps a driver IC onto a display panel to which an anisotropic conductive material has been attached, the driver IC is aligned by moving or rotating the transfer stage on which it is mounted.

However, in recent years, the display panel market has seen an increase in the use of irregularly shaped display panels for use in vehicles, etc. Such display panels have curved shapes (curved portions) or concave edges (notched portions). There is a demand for a crimping device that can crimp driver ICs to curved portions, notched portions, and other portions of such display panels that have different crimping angles and depths.

Therefore, embodiments of the present invention provide a crimping device and a display panel manufacturing method that can crimp display panels that have curved portions or notched edges.

According to one embodiment, the device comprises a stage on which a display panel is placed so that its edges extend beyond the display panel; a crimping head that is movable horizontally, vertically, and rotationally to crimp an electronic component onto the display panel; a backup unit that is arranged vertically opposite the crimping head and is movable horizontally, vertically, and rotationally to support the edge of the display panel from the non-crimped side; and a control unit that controls the movement of the backup unit and the crimping head unit, and the control unit controls the adjustment of the orientation of the crimping head unit and the backup unit that hold the electronic component with respect to the corresponding electrode row on the display panel based on preset mounting position information of the electronic component on the display panel.

1 shows an example of connection between a display panel to be pressure-bonded and an electronic component in the first embodiment. 4 is a diagram illustrating an example of connection between an electrode array of a display panel and a terminal array of an electronic component in the first embodiment. 3 is a cross-sectional view showing a pressure-bonded portion of an ACF between a display panel and an electronic component in the first embodiment. FIG. FIG. 2 is a block diagram showing an example of the configuration of an OLB device according to the first embodiment. FIG. 2 is a perspective view showing a schematic configuration of a pre-press bonding unit in the first embodiment. 3A and 3B are diagrams schematically illustrating respective driving parts of the pre-press bonding unit in the first embodiment. FIG. 2 is a block diagram of a control unit according to the first embodiment. 3 is a plan view showing a state in which a position recognition device recognizes positions of the display panel and electronic components in the first embodiment. FIG. 10A to 10C are diagrams illustrating the imaging position of the display panel 1 and the fine adjustment operation of the temporary pressure bonding head in the first embodiment. 5A to 5C are diagrams illustrating how a temporary pressure-bonding unit is positioned in the first embodiment. 5A to 5C are diagrams illustrating how a temporary pressure-bonding unit is positioned in the first embodiment. 5A to 5C are diagrams illustrating how a temporary pressure-bonding unit is positioned in the first embodiment. 5A to 5C are diagrams illustrating how a temporary pressure-bonding unit is positioned in the first embodiment. 4 is an example of a flowchart of temporary pressure bonding in the first embodiment. 10A and 10B are diagrams illustrating the positioning of the temporary pressure bonding unit in a comparative example. FIG. 10 is a schematic configuration diagram of a temporary pressure bonding unit according to a second embodiment. 10A and 10B are diagrams illustrating a pre-pressure bonding position of a pre-pressure bonding head in a second embodiment. 10A and 10B are diagrams illustrating how a temporary pressure-bonding unit is positioned in the second embodiment. 10 is a flowchart illustrating an example of temporary pressure bonding according to the second embodiment.

Embodiments of the present disclosure will be described below with reference to the drawings. The present embodiments are not intended to limit the present invention. The drawings are schematic or conceptual, and the proportions of each part are not necessarily the same as those in reality. In the specification and drawings, elements similar to those previously described with reference to the drawings will be designated by the same reference numerals, and detailed descriptions will be omitted where appropriate.

Furthermore, the X, Y, and Z axes described below refer to axes that are perpendicular to each other, with the X and Y directions corresponding to the horizontal direction perpendicular to the direction of gravity, and the Z direction corresponding to the vertical direction parallel to the direction of gravity. Furthermore, the +Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction. Furthermore, the θ direction corresponds to the direction of rotation around the Z axis.

(First embodiment)
Fig. 1 shows an example of connection between a display panel 1 to be crimped in the first embodiment and an electronic component 2. Fig. 2 shows an example of connection between an electrode row ER of the display panel 1 and a terminal row TR of the electronic component 2 in the first embodiment, and shows an enlarged view of one crimping point on the display panel 1 and the electronic component 2.

With reference to Figures 1 and 2, the display panel 1 and electronic component 2 to be crimped in this embodiment will be described. In this example, as shown in Figures 1(A) to 1(F), a case will be described in which multiple electronic components 2 are crimped along the edge of the display panel 1, but only one electronic component 2 may also be crimped. Figure 1 shows an example in which multiple electronic components 2 are crimped onto a relatively large display panel 1 used in vehicles, etc.

Below, examples of electronic components 2 arranged along the edge of the display panel 1 will be described, including not only examples in which the electronic components 2 are arranged in the same straight line, but also examples in which the electronic components 2 are arranged non-collinearly, such as when the electronic components 2 are arranged along the edge of the display panel 1 that includes a curved portion, when the electronic components 2 are arranged along the edge of the display panel 1 that includes a notch portion that is a rectangular cutout, and when the electronic components 2 are arranged along the edges of multiple sides of the display panel 1. Figures 1(A) to 1(F) show examples in which multiple electronic components 2 are arranged in the same straight line or non-collinearly.

Figures 1(A), (B), and (C) show examples of crimping electronic components 2 along the edge of a display panel 1, including curved portions, while Figure 1(D) shows an example of crimping electronic components 2 along the edge of a display panel 1, including a notch portion. Furthermore, Figure 1(E) shows an example of crimping electronic components 2 along the edges of multiple sides of a display panel 1. Figure 1(F) shows an example of crimping electronic components 2 along a straight portion of a display panel 1.

As shown in Figure 2, electrode rows ER, which are conductive portions, are provided at the edges of the display panel 1. Each electrode row ER is connected to a circuit within the display area via a signal line. Multiple electrode rows ER are arranged side by side at a predetermined interval (pitch p).

As shown in Figure 1(A), the electronic component 2 is a component that is joined to the display panel 1 via an ACF 3. In the first embodiment, the electronic component 2 is, for example, a COF. A COF is a member in which a driver IC is mounted on a flexible sheet made of flexible resin and printed wiring is formed on the flexible sheet.

As shown in Figure 2, one side of the electronic component 2 is provided with a terminal row TR, which is a conductive portion. The terminal row TR is a collection of terminals for electrically connecting to the electrode row ER of the display panel 1. Each terminal row TR is connected to a driver IC on the COF, for example, via a signal line. Multiple terminal rows TR are arranged side by side at a predetermined interval (pitch p). The electrode row ER of the display panel 1 and the terminal row TR of the electronic component 2 have a predetermined correspondence relationship for how they should be connected to each other, and they need to be crimped so that the positions of corresponding electrodes and terminals are aligned. For this reason, the electrode row ER and the terminal row TR have the same spacing. The width and spacing of the electrode row ER and the terminal row TR are set to ensure the conductivity of corresponding electrodes and terminals while also ensuring the insulation of other adjacent electrodes and terminals.

Figure 3 is a cross-sectional view showing the pressure-bonded portion of the ACF 3 between the display panel 1 and the electronic component 2 in the first embodiment.

As shown in Figure 3(A), ACF 3 is an anisotropic conductive material, a film formed by dispersing conductive particles 32 in a substrate 31. The substrate 31 is made of a thermosetting resin that hardens when heated. After the electronic components 2 are aligned on the display panel 1, they are temporarily bonded to the panel via ACF 3 at a pressure of approximately 10 to 100 N.

As shown in Figure 3(B), during the final pressure bonding, the ACF 3 is sandwiched between the electronic component 2 and the display panel 1 and pressure-bonded with a pressure of approximately 200 to 1000 N. The conductive particles 32 located between the electrode array ER and the terminal array TR are crushed by being sandwiched between the electrode array ER and the terminal array TR, thereby achieving conductivity in the thickness direction of the electrode array ER and the terminal array TR and insulation in the surface direction. Furthermore, the thermosetting resin of the base material 31 of the ACF 3 hardens when heated, bonding the electronic component 2 to the display panel 1. In other words, the thermo-compression bonding achieves an electrical connection between the terminal array TR and the electrode array ER and a mechanical connection between the display panel 1 and the electronic component 2.

FIG. 4 is a block diagram showing an example of the configuration of an OLB (Outer lead bonding) device 10 in the first embodiment.

The above-mentioned ACF 3 attachment, temporary pressure bonding, and final pressure bonding are performed by an OLB device 10 shown in Figure 4. The OLB device 10 includes an ACF attachment device 20, a temporary pressure bonding device 40, and a final pressure bonding device 60. The OLB device 10 is an example of an electronic component mounting device.

The ACF application device 20 cuts the tape-like ACF 3 wound on a reel to a predetermined length and applies the ACF 3 to the electrode rows ER of the display panel 1. For example, the ACF application device 20 presses the cut ACF 3 against the display panel 1 to apply it. The display panel 1 with the ACF 3 applied is transported to the temporary pressure-bonding device 40 by a transport device (not shown).

The temporary pressure-bonding device 40 temporarily presses the electronic components 2 onto the display panel 1. The temporary pressure-bonding device 40 aligns the display panel 1 and the electronic components 2, then presses them together to temporarily press them together. This is the state shown in Figure 3(A) above. The display panel 1, with the electronic components 2 temporarily pressed together, is transported to the full pressure-bonding device 60 by a transport device (not shown).

The final pressure bonding device 60 performs final pressure bonding on the display panel 1 and the electronic component 2. The display panel 1 and the electronic component 2 are heated and pressure bonded together at a higher temperature and pressure than in the temporary pressure bonding, completing the pressure bonding. This is the state shown in Figure 3(B) above.

Figure 5 is a perspective view showing the general configuration of the temporary crimping unit 40a in the first embodiment.

As shown in Figure 5, the pre-bonding unit 40a includes a pre-bonding head 41, a transfer stage 42, a backup unit 43, and a position recognition device 44.

The temporary bonding head 41 moves in the X, Y, Z, and θ directions to bond the held electronic component 2 to the display panel 1. The transport stage 42 holds and transports the display panel 1. The backup unit 43 moves in the X, Y, Z, and θ directions to support the edge of the display panel 1 that protrudes from the transport stage 42 from the underside (non-bonding side). The position recognition device 44 captures images to recognize the relative positions of the display panel 1 held on the transport stage 42 and the electronic component 2 held by the temporary bonding head 41. Here, the temporary bonding head 41 is an example of a bonding head or first bonding head unit, the transport stage 42 is an example of a stage unit, and the backup unit 43 is an example of a backup unit or first backup unit.

In Figure 5, for the purpose of explaining each component, the scale of the components of the temporary bonding unit 40a, including the temporary bonding head 41, transport stage 42, backup unit 43, and position recognition device 44, is shown on a larger scale than the transport stage 42. For example, the temporary bonding head 41 has a width of approximately 50 mm in the X direction. The transport stage 42 is also larger than the temporary bonding head 41, and its size is selected to match the display panel 1 to be temporarily bonded.

The pre-compression bonding head 41 comprises a pressure tool 41a, a pre-compression bonding head drive mechanism 41b, and a heater (not shown). The pressure tool 41a receives the electronic component 2 transported by an electronic component supply mechanism (not shown), and suction-holds the electronic component 2 from its upper surface. The pre-compression bonding head drive mechanism 41b moves the pressure tool 41a in the X, Y, Z, and θ directions to align it with the pre-compression position. The heater is built into the pressure tool 41a and heats the pressure tool 41a. The pre-compression bonding head 41 operates under the control of the control unit 80.

The pre-compression bonding head drive mechanism 41b is equipped with an X-direction drive unit 51a, a Y-direction drive unit 51b, a Z-direction drive unit 51c, and a θ drive unit 51d. The X-direction drive unit 51a moves the pressure tool 41a in the X-direction, which is one horizontal direction. The Y-direction drive unit 51b moves the pressure tool 41a in the Y-direction, which is a horizontal direction perpendicular to the X-direction. The Z-direction drive unit 51c moves the pressure tool 41a in the Z-direction, which is perpendicular to the horizontal direction. The θ drive unit 51d rotates and moves the pressure tool 41a within a horizontal plane.

For example, the X-direction drive unit 51a and the Y-direction drive unit 51b are combined so that they are stacked in this order, and move in the X and Y directions on slide rails using a built-in ball screw and motor. The Z-direction drive unit 51c is attached to the Y-direction drive unit 51b, and moves in the Z direction using a built-in ball screw and motor. The θ drive unit 51d has a rotation axis centered in the Z direction, and rotates the pressure tool 41a using a servo motor connected to this rotation axis.

As shown in FIG. 5, the transfer stage 42 includes a mounting portion 42a and a transfer stage drive mechanism 42b. The display panel 1 is mounted on the mounting portion 42a. The transfer stage drive mechanism 42b moves the mounting portion 42a in the X and Y directions. The transfer stage 42 operates under the control of the control unit 80. When aligning the temporary pressure bonding head 41 and the backup unit 43, the transfer stage 42 is temporarily stopped from moving under the control of the control unit 80 and remains fixed.

The transport stage drive mechanism 42b includes an X-direction drive unit 52a and a Y-direction drive unit 52b. The X-direction drive unit 52a moves the mounting unit 42a in the X-direction, which is one horizontal direction. The Y-direction drive unit 52b moves the mounting unit 42a in the Y-direction, which is a horizontal direction perpendicular to the X-direction. The transport stage drive mechanism 42b is a drive unit configured by combining the X-direction drive unit 52a and the Y-direction drive unit 52b, stacked in this order from the bottom up. Each of the X-direction drive unit 52a and the Y-direction drive unit 52b may be configured to be driven by a linear motor, for example, under the control of the control unit 80.

The mounting surface 42c of the mounting portion 42a, on which the display panel 1 is placed, has multiple suction holes 42d formed therein for suction-holding the display panel 1. These suction holes 42d are primarily positioned opposite the image display area of the display panel 1 when the display panel 1 is placed on the mounting surface 42c. For example, with the display panel 1 placed on the mounting surface 42c, air is sucked through the suction holes 42d, thereby suction-holding the display panel 1 to the mounting surface 42c. In this embodiment, the suction holes 42d are arranged in a matrix at equal intervals within the area of the mounting surface 42c where the display panel 1 is placed (the area surrounded by dotted lines on the mounting surface 42c). Note that it is not necessary for the entire area of the display panel 1 placed on the mounting surface 42c to be suction-held. As will be described later, the display panel 1 is placed on the mounting portion 42a with at least the edge on which the electronic components 2 are mounted extending (overhanging) beyond the mounting portion 42a.

For example, the mounting surface 42c may be configured to suction and hold an area of approximately half or one-third of the length of the display panel 1 from the side of the mounting surface 42c where the temporary pressure bonding head 41 is located. A suction mechanism (not shown) is connected to the suction hole 42d, and the mounting surface 42c uses this suction mechanism to suction and hold the display panel 1 and release it. Because the suction hole 42d suctions the display area of the display panel 1, it is preferable to set the hole diameter small so that suction marks do not remain on the display area due to suction. The hole diameter can be set to a size that does not leave suction marks by determining the relationship between the suction force required to fix the display panel 1 and the amount of deformation of the display panel 1 due to this suction, for example, by experiment. The mounting surface 42c may also be configured as a vacuum chuck using a porous material, such as porous ceramics.

After the display panel 1 is placed on the transport stage 42 by the transport arm described below, the transport stage 42 is moved to a predetermined reference position by driving the X-direction drive unit 52a and Y-direction drive unit 52b of the transport stage drive mechanism 42b. This predetermined reference position may be set, for example, as the origin of the movable range of the transport stage 42, temporary pressure bonding head 41, and backup unit 43. It may be a position that allows alignment with the temporary pressure bonding position by the backup unit 43 and temporary pressure bonding head 41, and is set in advance in the control unit 80.

The pre-bonding unit 40a performs pre-bonding by sandwiching the edge of the display panel 1 using the backup unit 43 and pre-bonding head 41. For this reason, the backup unit 43 is provided vertically opposite the pre-bonding head 41. The backup unit 43 can move in the θ direction in addition to the X, Y, and Z directions under the control of the control unit 80, so the orientation of the backup unit 43 can be changed and it can be moved to a position where the electronic component 2 is pre-bonded to the display panel 1.

The backup unit 43 comprises a backup tool 43a, a support base 43b, and a backup unit drive mechanism 43c. The backup tool 43a is elongated in the X direction and supports the edge of the display panel 1 where the electrode arrays ER are formed from below. The support base 43b supports the backup tool 43a and is formed in a roughly rectangular parallelepiped shape. The backup unit drive mechanism 43c moves the support base 43b in the X, Y, Z, and θ directions to align it with the temporary pressure-bonding position. The backup unit 43 also operates under the control of the control unit 80.

The backup tool 43a is made of, for example, stainless steel, and its upper end surface (support surface) that supports the edge of the display panel 1 is formed flat.

The backup unit drive mechanism 43c is equipped with an X-direction drive unit 53a, a Y-direction drive unit 53b, a Z-direction drive unit 53c, and a θ drive unit 53d. The X-direction drive unit 53a moves the support base 43b in the X-direction, which is one horizontal direction. The Y-direction drive unit 53b moves the support base 43b in the Y-direction, which is a horizontal direction perpendicular to the X-direction. The Z-direction drive unit 53c moves the support base 43b in the Z-direction, which is perpendicular to the horizontal direction. The θ drive unit 53d rotates the support base 43b within a horizontal plane. The backup unit drive mechanism 43c is a drive unit configured by combining an X-direction drive unit 53a, a Y-direction drive unit 53b, a Z-direction drive unit 53c, and a θ drive unit 53d, stacked in this order from the bottom up. Each of the X-direction drive unit 53a and the Y-direction drive unit 53b may be configured to be driven by a linear motor, for example, based on the control of the control unit 80. The Z-direction drive unit 53c may be configured to be driven by, for example, an air cylinder or an electric actuator, and the θ drive unit 53d may be configured to be driven by, for example, a servo motor.

Figure 8 is a plan view showing how the position of the display panel 1 and electronic component 2 in the first embodiment is recognized by the position recognition device 44.

As shown in Figures 8(A) and 8(B), the display panel 1 is placed on the placement portion 42a in an overhanging state. Figure 8(A) shows an example in which the temporary pressure-bonded portion of the display panel 1 includes a curved portion, while Figure 8(B) shows an example in which the temporary pressure-bonded portion of the display panel 1 includes a notch portion, which is a rectangular cutout. Specifically, in Figure 8(A), electrode rows ER and a pair of alignment marks PM are provided on the curve of the display panel 1 at two of the two positions on either side of the three pressure-bonded positions, while in Figure 8(B), electrode rows ER and a pair of alignment marks PM are provided on the notch portion of the display panel 1 at the center position of the three pressure-bonded positions.

Next, the above-mentioned position recognition device 44 will be described in detail using Figures 5 and 8(A). In the figures, the X direction will be the left-right direction. The display panel 1 has multiple electrode rows ER formed on its edges, and a pair of alignment marks PM provided on both the left and right sides of each electrode row ER. The electronic component 2 has terminal rows TR arranged to correspond to the electrode rows ER, and a pair of alignment marks WM provided on both the left and right sides of the terminal row TR.

As shown in FIG. 5, the position recognition device 44 includes a first imaging unit 44a, a second imaging unit 44b, and a light irradiation unit 44d. The first and second imaging units 44a, 44b are individually attached to the support base 43b of the backup unit 43, facing upward near the end of the backup tool 43a, via an X-direction drive unit 44e. In this example, the first imaging unit 44a and the second imaging unit 44b move together in the X, Y, Z, and θ directions in conjunction with the drive of the backup unit 43.

The pre-bonding unit 40a uses the control unit 80 to calculate the predetermined mounting position and orientation of the display panel 1, which is positioned in a predetermined position, from the recorded mounting position information, and moves the backup unit 43 to the calculated position in the required orientation. The mounting position information includes, for example, information regarding the position and orientation of the pre-bonding unit 40a relative to the display panel 1, and the position, shape, and bonding position of the display panel 1. At this time, the target position is calculated and moved taking into account the need to ensure that the first imaging unit 44a and the second imaging unit 44b can capture images of the alignment mark PM on the display panel 1 and the alignment mark WM on the electronic component 2.

Similar to the backup unit 43, the pre-compression bonding unit 40a uses the control unit 80 to calculate the predetermined mounting position and orientation of the display panel 1 positioned at a predetermined position from the recorded mounting position information, and moves the pre-compression bonding head 41 to the calculated position in the required orientation. At this time, the target position is calculated and moved taking into account that the first imaging unit 44a and the second imaging unit 44b can capture images of the alignment mark PM of the display panel 1 and the alignment mark WM of the electronic component 2. In other words, after positioning the backup unit 43 at the predetermined position in the predetermined orientation, the pre-compression bonding head 41 is moved and positioned to a position corresponding to the position of the backup unit 43. Therefore, the pre-compression bonding head 41 and backup unit 43 are positioned so that they are aligned in the same position in the X, Y, and θ directions.

After the backup unit 43 and the pre-compression bonding head 41 are positioned at the predetermined mounting position, the pre-compression bonding unit 40a causes the control unit 80 to capture images of one of a pair of alignment marks PM provided on the edge of the display panel 1 and one of a pair of alignment marks WM provided on the electronic component 2, so that they are simultaneously captured within the imaging area 44a1 (shown by dashed lines in Figure 8) from below the display panel 1. Furthermore, the second imaging unit 44b captures images of the other of the pair of alignment marks PM on the display panel 1 and the other of the pair of alignment marks WM, so that they are simultaneously captured within the imaging area 44b1 (shown by dashed lines in Figure 8) from below the display panel 1. After the first and second imaging units 44a and 44b capture images, the pre-bonding unit 40a fine-tunes the pre-bonding head 41 so that the alignment marks WM and PM are aligned.

The backup unit 43 and the pre-press bonding head 41 may be moved individually or simultaneously.

Note that the alignment marks PM and WM captured by the first imaging unit 44a are examples of first alignment marks, and the alignment marks PM and WM captured by the second imaging unit 44b are examples of second alignment marks. In the examples of Figures 8(A) and 8(B), the first alignment marks are arranged on non-collinear lines. Similarly, the second alignment marks are also arranged on non-collinear lines.

Furthermore, the first imaging unit 44a and the second imaging unit 44b each capture images so that the alignment mark PM and the corresponding alignment mark WM of the electronic component 2 are halfway within their fields of view. The captured images are processed by the image processing unit 44c, which determines the amount of correction required to correct the misalignment.

The pre-bonding unit 40a may also include a focal length adjustment unit 90 that adjusts the focal length of the alignment marks PM and WM so that they are simultaneously focused when the first and second imaging units 44a, 44b simultaneously capture and image them. The focal length adjustment unit 90 may be, for example, a lens, and is provided on the optical path connecting the imaging units that image the alignment mark PM and the corresponding alignment mark WM on the Z axis. For example, the focal length adjustment unit 90 is provided on the optical path connecting the first imaging unit 44a that images one alignment mark PM and the corresponding alignment mark WM of a pair of alignment marks PM on the Z axis. The focal length adjustment unit 90 is also provided on the optical path connecting the second imaging unit 44b that images the other alignment mark PM and the corresponding alignment mark WM of the pair of alignment marks PM.

The first and second imaging units 44a, 44b capture still images of the alignment marks PM, WM, respectively, and are equipped with a camera 44f, such as a CCD (Charge Coupled Device) camera, and a lens barrel unit 44g equipped with an optical unit such as a telecentric lens. The X-direction drive unit 44e enables the first and second imaging units 44a, 44b to move synchronously so that the distance between them increases or decreases, allowing the spacing between the first and second imaging units 44a, 44b to be changed to match the distance between the left and right alignment marks PM, WM.

The image processing unit 44c within the control unit 80 (described below) receives the image signal from the camera 44f, recognizes the images of the alignment marks PM on the display panel 1 and the alignment marks WM on the electronic components 2 from the captured images captured in the imaging areas 44a1 and 44b1, and detects data relating to the positions of each alignment mark PM and WM (hereinafter referred to as "position data"). The image processing unit 44c may also be implemented in the position recognition device 44.

The image processing unit 44c uses known pattern matching processing to recognize as the alignment marks PM of the display panel 1 any image in the captured image that has a matching rate above a threshold with a preset reference pattern for the alignment marks PM of the display panel 1. The image processing unit 44c also recognizes as the alignment marks WM of the electronic component 2 any image that has a matching rate above a threshold with a reference pattern for the alignment marks WM of the electronic component 2. The image processing unit 44c then obtains position data for the recognized alignment marks PM and WM based on the camera coordinate system. The control unit 80 recognizes the positional relationship between the display panel 1 and the electronic component 2.

In addition, in this example, the pre-press bonding unit 40a is configured to capture images of the left and right alignment marks based on two imaging units, the first and second imaging units 44a and 44b, but the number of imaging units is not limited to this. For example, the pre-press bonding unit 40a may be equipped with only the first imaging unit 44a, and the X-direction driving unit 44e may be used to move the first imaging unit 44a to capture images of the left and right alignment marks.

The light irradiator 44d is positioned above the display panel 1 placed on the transfer stage 42 so that it can irradiate light directly downward. In this embodiment, a pair of light irradiators 44d are provided at the same interval as the spacing between the pair of alignment marks PM on the display panel 1. The light irradiator 44d is provided integrally with the pre-press bonding head 41 using a support (not shown), but this is not limited to this and the light irradiator 44d may be supported via a support on the frame or stand of the pre-press bonding device 40. It is sufficient that the light irradiator 44d is provided so that when the alignment mark PM on the display panel 1 is imaged by the first and second image capturing units 44a, 44b, it can irradiate light onto the alignment mark PM on the display panel 1 from the side opposite the first and second image capturing units 44a, 44b. Furthermore, a single elongated light irradiator 44d may be provided, and the number of light irradiators is not limited.

As shown in FIG. 7, the control unit 80 can be realized by installing a program for the control unit 80 on, for example, a PC (Programmable Controller). The CPU (Central Processing Unit) within the pre-press bonding device 40 executes the program for the control unit 80, thereby realizing the functions of the detection unit 81, mechanism control unit 85, setting unit 87, input/output control unit 88, and memory unit 86.

The mechanism control unit 85 controls the driving of each drive unit provided in the pre-bonding unit 40a. Specifically, the mechanism control unit 85 controls the driving of the X-direction drive unit 52a and Y-direction drive unit 52b of the transport stage drive mechanism 42b, moving the transport stage 42 to the reference position. The mechanism control unit 85 controls the fixing of the transport stage 42 when aligning the backup unit 43 and pre-bonding head 41.

The mechanism control unit 85 also controls the driving of the X-direction drive unit 53a, Y-direction drive unit 53b, Z-direction drive unit 53c, and θ drive unit 53d of the backup unit drive mechanism 43c, thereby moving and positioning the backup unit 43. The mechanism control unit 85 also controls the driving of the X-direction drive unit 51a, Y-direction drive unit 51b, Z-direction drive unit 51c, and θ drive unit 51d of the pre-compression bonding head drive mechanism 41b, thereby moving and positioning the pre-compression bonding head 41 to a position corresponding to the position of the backup unit 43.

In addition, the mechanism control unit 85 controls the operation of the first and second imaging units 44a and 44b to capture images of the alignment marks.

The image processing unit 44c recognizes the alignment marks PM and WM from the images captured by the first and second imaging units 44a and 44b, and obtains their position data. The mechanism control unit 85 can also use the position data of the alignment marks PM and WM to perform control to fine-tune the position of the pre-bonding head 41.

The detection unit 81 detects contact between the display panel 1 and the electronic component 2 based on the position of the pre-bonding head 41. After this contact detection, the mechanism control unit 85 controls the heater to heat and move it downward in the Z direction by a predetermined amount, performing pre-bonding for a predetermined bonding time.

The input/output control unit 88 is an interface that controls signal conversion and input/output between each drive unit to be controlled.

The memory unit 86 stores information necessary for control in this embodiment. For example, the memory unit 86 stores position data, reference position, mounting position information, push-in amount, crimping time, and setting information input by the operator.

The input unit 91 is an input device such as a switch, touch panel, keyboard, or mouse that allows the operator to operate the pre-pressure bonding device 40 via the control unit 80. The operator can use the input unit 91 to input various information to be set in the memory unit 86.

The setting unit 87 is a processing unit that sets information in the storage unit 86 according to input. For example, information input from the input unit 91 is stored in the storage unit as setting information.

The output unit 92 is an output means such as a display, lamp, meter, etc. that makes information for checking the status of the device visible to the operator. For example, the output unit 92 can display an input screen for information from the input unit 91.

For example, the input unit 91 and output unit 92 may be touch panel displays. The display may show the shape of the display panel 1 and the crimping locations, and the location where the crimping process is in progress may be displayed by flashing, or otherwise, so that it can be distinguished from other crimping locations. Information such as the shape of the display panel 1 and the crimping locations may be stored in advance in the memory unit 86 via external communication or recording media, and this information may be loaded and displayed when the program is executed.

The control unit 80 includes a processor such as a CPU, a main storage device such as RAM, an auxiliary storage device such as an HDD, etc. The control unit 80 is, for example, a computer such as a PC, and includes input devices such as a keyboard and mouse, and an output device such as a display.

The control unit 80 may, for example, be equipped with multiple processors, which allows multiple operations to be performed in parallel.

In this embodiment, the control unit 80 has a program containing the information necessary for processing installed in an auxiliary storage device. The data for this program is either temporarily stored in the main storage device or saved in the auxiliary storage device.

Next, the operation of the pre-press bonding unit 40a in the first embodiment will be explained using Figures 9 to 13 and 14.

In this first embodiment, the display panel 1 is transported to the mounting section 42a by the transport arm 70, and is placed on the mounting section 42a in an overhanging state. This is the initial state, and the control section 80 then aligns the backup unit 43 and the pre-bonding head 41 to perform pre-bonding. This section also describes an example of pre-bonding at the positions of the electrode rows ER1 to ER3 on the display panel 1 shown in Figures 10 to 13.

Furthermore, in addition to the reference position, data on the shape of the display panel 1 and the crimping position corresponding to that shape, i.e., mounting position information, which is the position data of the electrode rows ER1 to ER3, will be described as being loaded into memory when the program of the control unit 80 is executed. Note that in this embodiment, the pressure tool 41a will be described as being pre-heated.

First, the electronic component supply mechanism supplies the electronic component 2 to the pre-bonding head 41 (Step 1). As shown in Figures 10(A) and 10(B) and Figures 11(A) and 11(B), the X-direction drive unit 52a and Y-direction drive unit 52b of the transfer stage drive mechanism 42b are driven to move the transfer stage 42 to the reference position. After moving the transfer stage 42, the transfer stage 42 is temporarily fixed while the backup unit 43 and pre-bonding head 41 are aligned (Step 2). In this embodiment, the reference position is the position where the dashed dotted lines, which are the origin of the ranges of movement of the transfer stage 42, pre-bonding head 41, and backup unit 43, intersect.

As shown in Figure 10 (A), the transfer stage 42 moves so that the center of the electrode array ER1, which will be the initial mounting position, coincides with the reference position. Once moved to the reference position, the transfer stage 42 is fixed at the reference position with the display panel 1 placed thereon. The X-direction drive unit 53a, Y-direction drive unit 53b, Z-direction drive unit 53c, and θ drive unit 53d of the backup unit drive mechanism 43c are driven to position the backup unit 43 along the reference line, which is a dashed line extending in the X direction, at the position of the electrode array ER1 calculated from the mounting position information including the position, shape, and crimping position of the display panel 1 (Step 3).

Furthermore, the X-direction drive unit 51a, Y-direction drive unit 51b, and Z-direction drive unit 51c of the pre-compression head drive mechanism 41b are driven to position the pre-compression head 41 at the position of electrode row ER1 calculated from the mounting position information, in an orientation along a reference line extending in the X direction. The backup unit 43 and pre-compression head 41 are positioned so that they can simultaneously capture images of the alignment mark PM corresponding to electrode row ER1 on the display panel 1 and the alignment mark WM on the electronic component 2. Specifically, the first imaging unit 44a and second imaging unit 44b move the pre-compression head 41 and backup unit 43 to a position where they can capture images of the alignment mark corresponding to electrode row ER1 on the display panel 1 and the alignment mark on the electronic component 2. The Z-direction position of the pre-compression head 41 at this time is set to a height that is different from the pre-compression position, has a predetermined space from the display panel 1, and does not interfere with the component supply mechanism's supply of electronic components 2. The backup unit 43 and pre-bonding head 41 may be positioned simultaneously, or one of them may be positioned first.

Next, the first and second imaging units 44a and 44b are operated to capture an image of the alignment marks PM corresponding to the electrode row ER1 from below the display panel 1 (step 4). In the operation of step S2 or S3, the X-direction driving unit 44e may be moved to adjust the positions of the first and second imaging units 44a and 44b. The image processing unit 44c also recognizes images of the alignment marks PM on the display panel 1 from the captured image and detects position data for the alignment marks PM corresponding to each electrode row. The image processing unit 44c calculates the misalignment of the display panel 1 from the position data for the alignment marks PM. For example, the image processing unit 44c calculates how much the position of the alignment marks WM of the electronic component 2 needs to be moved relative to the alignment marks PM on the display panel 1 so that they are aligned in the X, Y, and θ directions.

As shown in Figures 9(A) and 11(A), the first imaging unit 44a and the second imaging unit 44b capture images of the alignment marks PM at both ends of the electrode row ER1 located in the center of the display panel 1, which has a curved portion, and the corresponding alignment marks WM of the electronic component 2. Then, as shown in Figures 9(B) and 11(B), the pre-bonding head 41 is driven to fine-tune the position of the pre-bonding head 41 in the X, Y, and θ directions according to the calculated correction amount (Step 5). This aligns the pre-bonding head 41 in the X, Y, and θ directions. At this time, the backup unit 43 is also driven to adjust the positions of the backup unit 43 in the X, Y, and θ directions, and then the backup unit 43 is positioned in the Z direction so that it contacts the display panel 1 (see Figure 11(C)).

After the pre-bonding head 41 has been fine-tuned and positioned at the backup crimping position, as shown in Figures 10(B) and 11(D), the pre-bonding head 41 presses the electronic component 2 with a predetermined pressure to pre-bond the electronic component 2 to the electrode array ER1 (step 6).

Next, as shown in Figures 10(C) and 12A, when pre-bonding electrode row ER2, pre-bonding unit 40a moves pre-bonding head 41 and backup unit 43 to a position and orientation corresponding to electrode row ER2 based on mounting position information, rather than using transport stage 42. As shown in Figure 10(C), pre-bonding head 41 and backup unit 43 move by rotating counterclockwise. Also, although not shown in this figure, after pre-bonding electrode row ER1, Z-direction drive unit 51c of pre-bonding head 41 is driven, and electronic component 2 is supplied from the supply arm of an electronic component supply mechanism (not shown) at a predetermined Z-direction position (step 7).

As shown in Figures 12(A) and 12(B), the pre-compression bonding head 41 and backup unit 43 move in the required orientation to a position based on the mounting position information. That is, the pre-compression bonding head 41 and backup unit 43 move in the corresponding orientation to the vicinity of electrode row ER2, which will be the mounting position (Step 8). At this time, the pre-compression bonding head 41 and backup unit 43 move to a position where the first imaging unit 44a and second imaging unit 44b can capture images of the alignment mark PM corresponding to electrode row ER2 of the display panel 1 and the alignment mark WM of the electronic component 2. The first imaging unit 44a and second imaging unit 44b capture images of the alignment mark PM corresponding to electrode row ER2 and the alignment mark WM of the electronic component 2 (Step 9). Once imaging is complete, the position of the pre-bonding head 41 in the X, Y, and θ directions is fine-tuned (step 10) based on the images captured by the first imaging unit 44a and the second imaging unit 44b, and the positions of the backup unit 43 in the X, Y, and θ directions are adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so that it comes into contact with the display panel 1 (see Figure 12 (C)).

After the position adjustment of the pre-bonding head 41 and backup unit 43 is complete, the pre-bonding head 41 presses the electronic component 2 with a predetermined pressure to pre-bond the electronic component 2 to the electrode array ER2 (step 11).

Next, after the electrode row ER2 has been pre-bonded, the Z-direction drive unit 51c of the pre-bonding head 41 is driven to supply the electronic component 2 from the supply arm of the electronic component supply mechanism (not shown) at a predetermined Z-direction position (step 12).

After the electronic component 2 is supplied to the pre-compression bonding head 41, as shown in Figures 13(A) and 13(B), the pre-compression bonding head 41 and backup unit 43 move in the required orientation to a position based on the mounting position information. That is, the pre-compression bonding head 41 and backup unit 43 move in the corresponding orientation to the vicinity of the electrode row ER3, which is the mounting position (step 13). As shown in Figure 10(D), the pre-compression bonding head 41 and backup unit 43 move by rotating clockwise. At this time, the pre-compression bonding head 41 and backup unit 43 move to a position where the alignment mark PM corresponding to the electrode row ER3 of the display panel 1 and the alignment mark WM of the electronic component 2 can be captured by the first imaging unit 44a and the second imaging unit 44b. The alignment mark PM corresponding to the electrode row ER3 and the alignment mark WM of the electronic component 2 are captured using the images captured by the first imaging unit 44a and the second imaging unit 44b (step 14). Based on the images captured by the first and second imaging units 44a and 44b, the position of the temporary pressure bonding head 41 in the X, Y, and θ directions is fine-tuned, and the position of the backup unit 43 in the X, Y, and θ directions is adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so that it comes into contact with the display panel 1 (step S14).

After the position adjustment of the pre-bonding head 41 and backup unit 43 is complete, as shown in FIG. 13(D), the pre-bonding head 41 presses the electronic component 2 against the electrode array ER3 with a predetermined pressure to perform pre-bonding (step S15).

Once the temporary bonding of the electronic components 2 to the electrode rows ER1 to ER3 of the display panel 1 is completed in the temporary bonding device 40, the display panel 1 is transported to the permanent bonding device 60 by a transport device (not shown). The display panel 1 is then heated and compressed by the permanent bonding device 60 at a higher temperature and pressure than in the temporary bonding. This completes the bonding of the electronic components 2 to each electrode row of the display panel 1.

According to this embodiment, the pre-bonding device 40 moves the backup unit 43 and pre-bonding head 41 when performing pre-bonding, and aligns the display panel 1 and electronic component 2. As a result, even when pre-bonding the electronic component 2 to a curved portion or notch portion of the display panel 1, it is possible to reduce the takt time and prevent a deterioration in the accuracy of the pre-bonding position compared to when the transfer stage 42 is moved for alignment.

In particular, when the transfer stage is moved to align curved or notched portions of a relatively large display panel 1, such as a display panel 1 for a vehicle, it takes time for the vibrations caused by the movement of the display panel 1 to settle, and the temporary pressure bonding device 40 cannot perform temporary pressure bonding until then. Furthermore, the vibrations generated when the transfer stage is moved are considerable, and there is a risk of damaging the display panel 1. On the other hand, the temporary pressure bonding device 40 in this embodiment does not align the display panel 1 using the transfer stage 42, so there is no need to wait for this time, and the takt time can be shortened.

Next, using Figure 15, we will explain the positioning of the temporary crimping unit 40a in a comparative example.

Figures 15(A) to 15(C) show an example of temporary pressure bonding performed on a display panel 1 having an electrode row ER1 on a curved portion by a temporary pressure bonding unit 40a in a comparative example. Figures 15(D) to 15(G) show an example of temporary pressure bonding performed on an electrode row ER2 on a display panel 1 by a temporary pressure bonding unit 40a in a comparative example. Figures 15(H) to 15(K) show an example of temporary pressure bonding performed on an electrode row ER3 on a display panel 1 by a temporary pressure bonding unit 40a in a comparative example. Figure 15(L) shows an example of the temporary pressure bonding performed by the temporary pressure bonding unit 40a in a comparative example after temporary pressure bonding has been completed.

In the comparative example, the pre-bonding head 41 is fixed in the X and Y directions, so the mechanism control unit 85 moves the transport stage 42 in the X, Y, and θ directions to match the shape of the display panel 1, aligning it with the electronic component 2 and pre-bonding the electrode rows ER1 to ER3 on the display panel 1. The following description also assumes that the electronic component supply mechanism supplies the electronic component 2 to the pre-bonding head 41.

In Figures 15(A) and 15(B), the mechanism control unit 85 moves the transport stage 42 in the X, Y, and θ directions to align it with the electronic component 2 held by the pre-compression bonding head 41 and perform pre-compression bonding to the electrode row ER1 on the display panel 1. After pre-compression bonding is complete, as shown in Figure 15(C), the mechanism control unit 85 temporarily retracts the transport stage 42 from the bonding position. As a result, the pre-compression bonding head 41 receives a supply of the electronic component 2 via the supply arm of the electronic component supply mechanism.

In Figures 15(D) to 15(F), the mechanism control unit 85 similarly moves the transport stage 42 in the X, Y, and θ directions to align it with the electronic component 2 held by the pre-compression bonding head 41 and perform pre-compression bonding on the electrode row ER2 on the display panel 1. This example shows the mechanism control unit 85 rotating the transport stage 42 in the +θ direction to align the electrode row ER2. After pre-compression bonding is complete, the mechanism control unit 85 temporarily retracts the transport stage 42 from the bonding position, as shown in Figure 15(G). As a result, the pre-compression bonding head 41 receives a supply of the electronic component 2 via the supply arm of the electronic component supply mechanism.

In Figures 15(H) to 15(J), the mechanism control unit 85 similarly moves the transport stage 42 in the X, Y, and θ directions to align it with the electronic component 2 held by the pre-compression bonding head 41 and perform pre-compression bonding on the electrode row ER2 on the display panel 1. This example shows how the mechanism control unit 85 rotates the transport stage 42 in the -θ direction to align the electrode row ER2. After pre-compression bonding is complete, as shown in Figure 15(K), the mechanism control unit 85 temporarily retracts the transport stage 42 from the bonding position. As a result, the pre-compression bonding head 41 receives a supply of the electronic component 2 via the supply arm of the electronic component supply mechanism.

After the temporary pressure bonding is completed, the mechanism control unit 85 retracts the transfer stage 42 so that the display panel 1 can be handed over to the full pressure bonding device 60.

When the pre-bonding unit 40a moves the transport stage 42 to align the mounting position of the electronic components 2 on the display panel 1, i.e., the position of the electrode array ER, with the pre-bonding head 41 and backup unit 43, time is required for the vibrations generated by the complex movement of a large, heavy display panel 1 with overhangs, such as an irregularly shaped panel, to settle to an acceptable vibration value, thereby lengthening the takt time. This waiting time tends to become longer as the size of the display panel 1 increases. Furthermore, in the case of a display panel 1 having a curved portion as shown in FIG. 8(A) or a display panel 1 having a notched portion as shown in FIG. 8(B), the movement of the transport stage 42 becomes more complex and the movement distance becomes longer compared to simple linear movement. Furthermore, the movement operation of the transport stage 42 as shown in FIG. 15 involves complex calculations of the movement position, which increases error and reduces positioning accuracy.

On the other hand, the pre-bonding unit 40a in this embodiment moves the backup unit 43 and pre-bonding head 41 to align and perform pre-bonding while keeping the large and heavy transport stage 42 fixed and unmoving. This eliminates factors that cause vibration in the display panel 1, shortens the takt time, and prevents a deterioration in accuracy.

Furthermore, the temporary pressure bonding unit 40a in this embodiment may perform partial alignment by moving the transport stage 42. For example, in the case of the display panel 1 shown in FIG. 1(A), the temporary pressure bonding head 41 and backup unit 43 may be configured to move in the Y and θ directions, while the transport stage 42 may be configured to move in the X direction. Similarly, in the case of the display panel 1 shown in FIG. 1(B), the temporary pressure bonding head 41 and backup unit 43 may be configured to move in the Y and θ directions, while the transport stage 42 may be configured to move in the X direction.

In this embodiment, the temporary pressure bonding device 40 reduces the number of drive axes for the transport stage drive mechanism 42b and allows it to move only in the X and Y directions, thereby increasing the rigidity of the transport stage 42 and improving the stability of the display panel 1 placed on it. This allows the temporary pressure bonding device 40 to prevent a deterioration in the accuracy of temporary pressure bonding.

In addition, although this embodiment shows an example in which the transport stage drive mechanism 42b is movable only in the X and Y directions, it may also be configured to move in the X, Y, Z, and θ directions.

Furthermore, according to this embodiment, the fewer the drive axes of the conveying stage 42, the easier it is to adjust the position, and the less likely it is that the alignment accuracy will deteriorate. Furthermore, by reducing the number of drive axes, i.e., the number of parts, the conveying stage 42 reduces the weight load on each drive axis of the conveying stage drive mechanism 42b, suppressing tilt of the entire conveying stage 42 and increasing deformation rigidity, and furthermore, the cost of the pre-crimping device 40 can be reduced.

Furthermore, according to this embodiment, the pre-compression bonding device 40 may be configured so that the pre-compression bonding head 41 and backup unit 43 are responsible for movement in the Y and θ directions, and the transport stage 42 is responsible for movement in the X direction. In the case of movement between pitches of the electrode array ER, which is a relatively short distance, no large vibrations are generated because it is a simple one-way movement, and the takt time can be further shortened by moving the transport stage 42 in parallel with changing the orientation of the pre-compression bonding head 41 and backup unit 43.

Furthermore, according to this embodiment, the temporary bonding device 40 can perform temporary bonding on electrode arrays ER that are arranged not only linearly but also non-linearly, in accordance with the shape of the display panel 1, by moving the temporary bonding head 41 in the X, Y, and θ directions under the control of the mechanism control unit 85, while the conveying stage 42 is fixed.

Second Embodiment
FIG. 16 is a schematic diagram of a temporary pressure-bonding unit 40a according to the second embodiment.

In this embodiment, the temporary bonding unit 40a is equipped with multiple temporary bonding heads 41 and backup units 43 for one transfer stage 42. In this figure, the temporary bonding device 40 is equipped with two sets of temporary bonding heads 41 and backup units 43. In order to distinguish between the respective configurations, of the two sets of temporary bonding heads 41 and backup units 43 provided in the X direction in the figure, the set on the +X direction side is represented as temporary bonding head 41' and backup unit 43'. The temporary bonding head 41' is an example of a second bonding head unit, and the backup unit 43' is an example of a second backup unit. The following mainly describes the differences from the first embodiment. Furthermore, the temporary bonding heads 41 and 41' have a fixed range of movement and are designed not to interfere with each other.

Furthermore, for ease of explanation, the first imaging unit 44a and the second imaging unit 44b provided in the backup unit 43' will be referred to as the third imaging unit 44a' and the fourth imaging unit 44b', respectively.

In this embodiment, the pre-bonding unit 40a is equipped with pre-bonding heads 41 and 41', and can therefore perform pre-bonding at two locations in parallel under the control of the control unit 80. For example, in the case of a display panel 1 having curved portions on the left and right as shown in FIG. 17, the pre-bonding head 41 may be oriented in advance for right-curve mounting so that it can pre-bond to the electrode row ER arranged in a curve in the -X direction, and the pre-bonding head 41' may be oriented in advance for left-curve mounting so that it can pre-bond to the electrode row ER arranged in a curve in the +X direction.

Similar to the first embodiment, the pre-bonding head 41' includes a pressure tool 41a', a pre-bonding head drive mechanism 41b', and a heater (not shown).

The pre-bonding head drive mechanism 41b' also includes an X-direction drive unit 51a', a Y-direction drive unit 51b', a Z-direction drive unit 51c', and a θ drive unit 51d'.

Similar to the first embodiment, the backup unit 43' includes a backup tool 43a', a support base 43b', and a backup unit drive mechanism 43c'.

The backup unit drive mechanism 43c' includes an X-direction drive unit 53a', a Y-direction drive unit 53b', a Z-direction drive unit 53c', and a θ drive unit 53d'.

Similar to the first embodiment, the position recognition device 44' includes a third imaging unit 44a', a fourth imaging unit 44b', a light irradiation unit 44d', and an X-direction driving unit 44e'. Furthermore, the third imaging unit 44a' and the fourth imaging unit 44b' each include a camera 44f' and a lens barrel unit 44g'.

The configurations of the pre-bonding head drive mechanism 41b, the transport stage drive mechanism 42b, and the backup unit drive mechanism 43c are merely examples and are not limited to the above-described structures. It is sufficient that the configuration includes at least the pre-bonding head 41 and the pre-bonding head 41' and performs pre-bonding at two locations in parallel on one display panel 1.

The temporary pressure bonding device 40 may also include a focal length adjustment unit 90'. The focal length adjustment unit 90' is provided on the Z axis on an optical path connecting the third imaging unit 44a', which images one alignment mark PM of a pair of alignment marks PM and the corresponding alignment mark WM. The focal length adjustment unit 90' is also provided on an optical path connecting the fourth imaging unit 44b', which images the other alignment mark PM of a pair of alignment marks PM and the corresponding alignment mark WM.

The pre-bonding head 41' and backup unit 43' are moved by the control unit 80 controlling each drive unit, as in the first embodiment.

For example, the mechanism control unit 85 controls the driving of the X-direction drive unit 53a', Y-direction drive unit 53b', Z-direction drive unit 53c', and θ drive unit 53d' of the backup unit drive mechanism 43c', thereby moving and positioning the backup unit 43'. The mechanism control unit 85 also controls the driving of the X-direction drive unit 51a', Y-direction drive unit 51b', Z-direction drive unit 51c', and θ drive unit 51d' of the pre-bonding head drive mechanism 41b', thereby moving and positioning the pre-bonding head 41' to a position corresponding to the position of the backup unit 43'.

Figure 17 is a diagram illustrating the pre-crimping position of the pre-crimping head 41 in the second embodiment.

In this example, the pre-bonding head 41 pre-bonds the electronic component 2 to the electrode rows ER1 and ER2. The pre-bonding head 41' pre-bonds the electronic component 2 to the electrode row ER3. For example, while the pre-bonding head 41 is mounting the electronic component 2 on the electrode row ER2 in the left curved portion, the mechanism control unit 85 moves these pre-bonding heads to a predetermined standby position so as to supply the electronic component 2 to the pre-bonding head 41'. For example, the predetermined standby position may be the home position, and is achieved by movement in the X and Y directions.

After mounting of the electronic components 2 on electrode row ER2 is complete, the mechanism control unit 85 retracts the pre-bonding head 41 in order to supply the electronic components 2 to the pre-bonding head 41. The mechanism control unit 85 then moves the pre-bonding head 41' to pre-bond the electronic components 2 to electrode row ER3.

Furthermore, in preparation for pre-pressure bonding of an electronic component 2 to the central electrode row ER1, the mechanism control unit 85 may move the pre-pressure bonding head 41 at the home position so that the X direction is parallel to the X direction of the electrode row ER1. After supplying the electronic component 2 to the pre-pressure bonding head 41', the mechanism control unit 85 moves the pre-pressure bonding head 41 to pre-pressure bond the electronic component 2 to the electrode row ER1. After all pre-pressure bonding is completed, the next display panel 1 is supplied and the pre-pressure bonding of the display panel 1 is repeated.

Furthermore, instead of the pre-bonding head 41 repeatedly pre-bonding the electronic components 2 to the central electrode row ER1, for example, the pre-bonding heads 41 and 41' may alternately pre-bond the electronic components 2 to the electrode row ER1.

If an electronic component supply mechanism is provided for each pre-bonding head, electronic components 2 can be supplied to each pre-bonding head simultaneously. This allows the left curved portion and the right curved portion to be mounted simultaneously. Pre-bonding of electronic components 2 to the central electrode row ER2 may also be performed by either pre-bonding head 41 or 41'.

The operation of pre-pressure bonding electronic components 2 to electrode rows ER1 to ER3 on a display panel 1 of the pre-pressure bonding unit 40a in the second embodiment will be described using Figures 18 and 19. Note that the operation of pre-pressure bonding electronic components 2 is performed, for example, in the order of ER2, ER3, and ER1.

Furthermore, as in the first embodiment, the movement of each pre-bonding head is controlled by the mechanism control unit 85, and the dotted arrows indicate the trajectory of each crimping head as it moves. The home positions of pre-bonding heads 41 and 41' are indicated as P and P', respectively.

First, in step S11, the pre-bonding head 41 is at home position P, and an electronic component 2 is supplied to it by an electronic component supply mechanism (not shown). As shown in FIG. 18(A), while the pre-bonding head 41 pre-bonds electrode row ER2, the pre-bonding head 41' is made to wait at home position P'. Also, while the pre-bonding head 41 is waiting at a predetermined waiting position, the pre-bonding head 41 is directed toward the center of electrode row ER1, which is parallel to the X direction.

In step S12, the mechanism control unit 85 drives the X-direction drive unit 52a and Y-direction drive unit 52b of the transport stage drive mechanism 42b to move the transport stage 42 to the reference position.

In step S13, the pre-compression bonding head 41 and backup unit 43 move in the X and Y directions in accordance with the orientation of electrode row ER2, and are positioned at a position corresponding to electrode row ER2. The orientation of the pre-compression bonding head 41 may also be aligned with the orientation in which electrode row ER2 is arranged in advance. After positioning is complete, in step S14, the first imaging unit 44a and the second imaging unit 44b capture images of the alignment mark PM corresponding to electrode row ER2 on the display panel 1 and the alignment mark WM on the electronic component 2.

In step S15, based on the images captured by the first and second imaging units 44a and 44b, the positions of the pre-bonding head 41 in the X, Y, and θ directions are fine-tuned, and the positions of the backup unit 43 in the X, Y, and θ directions are adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so that it comes into contact with the display panel 1.

In step S16, after the position adjustment of the pre-bonding head 41 and backup unit 43 is completed, as shown in FIG. 18(A), the pre-bonding head 41 presses the electronic component 2 against the electrode array ER2 with a predetermined pressure to perform pre-bonding.

In step S17, in parallel with step S13, the pre-bonding head 41' is positioned at home position P'. In step S18, an electronic component 2 is supplied to the pre-bonding head 41' by an electronic component supply mechanism (not shown).

In step S19, as shown in Figure 18 (B), the temporary crimping head 41' and backup unit 43' are aligned with the electrode row ER3 and moved in the X and Y directions to position them on the electrode row ER3.

In step S20, the alignment mark PM corresponding to the electrode row ER2 of the display panel 1 and the alignment mark WM of the electronic component 2 are imaged by the third imaging unit 44a' and the fourth imaging unit 44b'. In step S21, based on the images captured by the first imaging unit 44a and the second imaging unit 44b, the position of the pre-press bonding head 41' in the X, Y, and θ directions is fine-tuned, and the position of the backup unit 43' in the X, Y, and θ directions is adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so that it comes into contact with the display panel 1.

In step S22, after positioning is complete and the position adjustment of the pre-bonding head 41' and backup unit 43' is completed, the pre-bonding head 41' pre-bonds the electronic component 2 to the electrode array ER3 with a predetermined pressure, as shown in Figure 18 (B).

As shown in FIG. 18(B), in step S23, in parallel with step S19, the pre-compression bonding head 41 pre-compresses the electronic component 2 onto the electrode row ER2, and then moves to the home position P. In step S24, an electronic component supply mechanism (not shown) supplies the electronic component 2 to the pre-compression bonding head 41. Also, in step S23 or step S24, the pre-compression bonding head 41 may be oriented toward the center so as to be parallel to the X direction of the electrode row ER1 while waiting, in preparation for pre-compression bonding the electronic component 2 onto the central electrode row ER1.

Note that while the pre-bonding of electronic component 2 to electrode row ER2 and the pre-bonding of electronic component 2 to electrode row ER3 are performed in this order, these pre-bonding operations may also be performed simultaneously. This is not a limitation, and the mechanism control unit 85 may also perform pre-bonding by operating pre-bonding heads 41 and 41' in parallel.

In step S25, as shown in Figure 18 (C), the temporary bonding head 41 and backup unit 43 are moved from home position P to electrode row ER1 and positioned at electrode row ER1. At this time, the orientations of the temporary bonding head 41 and backup unit 43 are adjusted in the X and Y directions to correspond to the orientation of electrode row ER1.

In step S26, the alignment mark PM corresponding to the electrode row ER2 of the display panel 1 and the alignment mark WM of the electronic component 2 are imaged by the first imaging unit 44a and the second imaging unit 44b. In step S27, based on the images captured by the first imaging unit 44a and the second imaging unit 44b, the position of the pre-press bonding head 41 is fine-tuned in the X, Y, and θ directions, and the position of the backup unit 43 in the X, Y, and θ directions is adjusted accordingly, and then the backup unit 43 is positioned in the Z direction so that it comes into contact with the display panel 1.

In step S28, after positioning is complete and the position adjustment of the temporary bonding head 41 and backup unit 43 is complete, the temporary bonding head 41 temporarily bonds the electronic component 2 to the electrode array ER1 with a predetermined pressure, as shown in Figure 18 (C).

Furthermore, in step S29, the temporary crimping head 41' and backup unit 43' are retracted from interference. In this example, after the temporary crimping head 41' and backup unit 43' are returned to their original orientation, the temporary crimping head 41' and backup unit 43' are moved to home position P'. At this time, the orientation of the temporary crimping head 41' and backup unit 43' may be aligned with the orientation of the electrode row at the next crimping position. After the temporary crimping head 41' has moved, the electronic component supply mechanism supplies an electronic component 2 to the temporary crimping head 41'.

According to this embodiment, the pre-compression bonding device 40 is equipped with multiple pre-compression heads 41 and backup units 43 for one transport stage 42. This allows the pre-compression bonding device 40 to perform pre-compression bonding at multiple locations in parallel based on the control of the control unit 80, thereby improving bonding efficiency and shortening the takt time. Furthermore, because the pre-compression bonding device 40 is equipped with multiple pre-compression heads 41, even if the display panel 1 is long in the X direction, for example, the takt time can be shortened by moving multiple pre-compression bonding heads 41 in the X direction and performing pre-compression bonding respectively, compared to pre-compression bonding using a single pre-compression head 41.

Furthermore, according to this embodiment, the temporary bonding device 40 performs temporary bonding on the continuous curved portion of the display panel 1 using the temporary bonding head 41 or the temporary bonding head 41', while the other temporary bonding head can receive electronic components 2 from the electronic component supply mechanism, allowing temporary bonding to be performed at multiple locations in parallel. Furthermore, the temporary bonding device 40 can perform temporary bonding at multiple locations simultaneously even if the temporary bonding locations on the display panel 1 include a continuous notched portion and a continuous non-notched portion.

In the above embodiment, the pre-crimping device 40 was mainly described as the crimping device, but the configuration of the backup unit 43 and pre-crimping head 41 described in the above embodiment can also be applied to the backup unit and head in the full crimping device 60.

Note that the configurations of the pre-bonding head drive mechanism 41b, transport stage drive mechanism 42b, and backup unit drive mechanism 43c described in the above embodiment are merely examples and are not limited to the above-described structures. These structures may be any structure for moving the pre-bonding head 41, transport stage 42, and backup unit 43, respectively.

For example, in the case of a vehicle display panel 1 that displays various vehicle information such as speed and fuel amount, it is expected that the type of electronic component 2 mounted will differ depending on the area that displays map image information, the area that displays speed information, etc.

In such a case, since the electronic component supply mechanism supplies multiple types of electronic components 2 in one display panel 1 mounting process, the pre-press bonding unit 40a may be provided with supply units (e.g., trays) corresponding to the types of electronic components 2. Furthermore, these supply units may be of any size depending on the size and type of electronic components 2.

Furthermore, since the mounting method of the electronic components 2 on the display panel 1 may vary, such as COF or COG, the pre-bonding unit 40a may combine techniques other than COF to mount the electronic components 2. Furthermore, the ACF may be supplied by punching it from tape, for example.

In other words, the temporary pressure bonding unit 40a may also change the type of electronic component 2 depending on the display area of the display panel 1, and may be equipped with various supply units for supplying these electronic components 2.

Although several embodiments have been described above, these embodiments are presented as examples only and are not intended to limit the scope of the invention. The novel crimping device and the like described in this specification can be embodied in various other forms. Furthermore, various omissions, substitutions, modifications, and combinations can be made to the forms of the crimping device described in this specification without departing from the spirit of the invention. The appended claims and their equivalents are intended to include such forms and modifications that fall within the scope and spirit of the invention.

1: display panel 1, 2: electronic components, 3: ACF, 10: OLB device,
20: ACF attachment device, 31: substrate, 32: conductive particles,
40: Pre-press bonding device, 41: Pre-press bonding head, 41': Pre-press bonding head,
41a: pressure tool, 41a': pressure tool, 41b: temporary pressure bonding head driving mechanism,
41b': temporary pressure bonding head drive mechanism, 42: transport stage, 42a: placement unit,
42b: transport stage driving mechanism, 42c: mounting surface, 42d: suction hole,
43: backup unit, 43': backup unit,
43a: backup tool, 43a': backup tool, 43b: support base,
43b': support base, 43c: backup unit drive mechanism,
43c': backup unit drive mechanism, 44: position recognition device,
44': position recognition device, 44a: first imaging unit, 44a': third imaging unit,
44a1: imaging area, 44b: second imaging unit, 44b': fourth imaging unit,
44b1: imaging region, 44c: image processing unit, 44d: light irradiation unit, 44d': light irradiation unit,
44e: X-direction driving unit, 44e': X-direction driving unit, 44f: camera, 44f': camera,
44g: lens barrel section, 44g': lens barrel section, 51a: X-direction driving section, 51a': X-direction driving section,
51b: Y-direction driving unit, 51b': Y-direction driving unit, 51c: Z-direction driving unit,
51c': Z direction drive unit, 51d: θ drive unit, 51d': θ drive unit,
52a: X-direction driving unit, 52b: Y-direction driving unit, 53a: X-direction driving unit,
53a': X-direction driving unit, 53b: Y-direction driving unit, 53b': Y-direction driving unit,
53c: Z direction drive unit, 53c': Z direction drive unit, 53d: θ drive unit,
53d': θ driving unit, 60: main pressure bonding device, 70: transfer arm, 80: control unit,
81: detection unit, 85: mechanism control unit, 86: storage unit, 87: setting unit,
88: Input/output control unit, 90: focal length adjustment unit, 91: input unit, 92: output unit,
90: focal length adjustment unit, 91: input unit, 92: output unit,
WM: alignment mark, PM: alignment mark,
ER: electrode row, TR: terminal row

Claims (8)

a stage portion on which a display panel is placed so that its edge extends beyond the display panel;
a crimping head unit that is movable in horizontal, vertical, and rotational directions and crimps an electronic component onto the display panel;
a backup section that is provided vertically opposite the crimping head section, is movable in horizontal, vertical and rotational directions, and supports the edge section of the display panel from the non-crimped surface side;
a control unit that controls the movement of the backup unit and the crimping head unit,
The control unit
performing control to adjust the orientations of the crimping head unit and the backup unit that hold the electronic component with respect to the corresponding electrode row on the display panel based on preset mounting position information of the electronic component on the display panel;
A crimping device characterized by: an imaging unit that images alignment marks of the electrode rows provided on the edge portion of the display panel;
The crimping device according to claim 1 , wherein the control unit moves the backup unit to a crimping position after capturing an image of the alignment mark. The crimping device according to claim 2, characterized in that the control unit controls the crimping head unit and the backup unit to move simultaneously and position them at the imaging position. The crimping device described in any one of claims 1 to 3, characterized in that the control unit further controls the stage unit to be fixed when the backup unit and the crimping head unit are moving. The crimping device described in claim 2, characterized in that the multiple alignment marks are arranged in the same straight line along the edge of the display panel. The crimping device of claim 2, wherein the alignment marks are arranged non-colinearly along the edge of the display panel. The crimping head includes a plurality of crimping heads;
the backup unit comprises a plurality of backup units,
The control unit
performing control to adjust orientations of the plurality of crimping head units and the plurality of backup units that hold the electronic components with respect to corresponding electrode rows on the display panel based on preset mounting position information of the electronic components on the display panel;
2. The crimping device according to claim 1. The display panel is placed on the stage so that the edge of the display panel protrudes.
A method for manufacturing a display panel, comprising controlling a crimping head unit that moves in horizontal, vertical, and rotational directions and a backup unit that is provided vertically opposite the crimping head unit and moves in horizontal, vertical, and rotational directions to crimp an electronic component onto the display panel,
The control
performing control to adjust the orientations of the crimping head unit and the backup unit with respect to the corresponding electrode rows on the display panel based on preset mounting position information of electronic components on the display panel;
10. A method for manufacturing a display panel comprising the steps of: