WO2025262019A1

WO2025262019A1 - Connecting a pir sensor to a printed circuit board

Info

Publication number: WO2025262019A1
Application number: PCT/EP2025/066849
Authority: WO
Inventors: Zhipei WANG
Original assignee: Signify Holding BV
Current assignee: Signify Holding BV
Priority date: 2024-06-21
Filing date: 2025-06-17
Publication date: 2025-12-26
Anticipated expiration: 2026-12-21

Abstract

A mechanism for connecting a PIR sensor to a printed circuit board (PCB). A connecting element comprises two pin sockets that make a predefined angle with respect to one another. A pin of the PIR sensor is able to be inserted into either pin socket. The connecting element further comprises a PCB connecting portion for connecting the connecting element to the PCB via solder.

Description

CONNECTING A PIR SENSOR TO A PRINTED CIRCUIT BOARD

FIELD OF THE INVENTION

The present disclosure relates to the field of PIR sensors, and in particular to the connection of PIR sensors to printed circuit boards.

BACKGROUND OF THE INVENTION

Passive infrared (PIR) sensors are used in a wide variety of environments for detecting motion and/or triggering the activation of other electronic components. By way of example only, a PIR sensor may be used to trigger the activation of a light or alarm when a motion is detected.

A typical PIR sensor will comprise a set of pins, such as a ground pin, a power pin and a signal pin. When there is a desire to connect the PIR sensor to a printed circuit board (PCB), there is a need to electrically connect each pin of the PIR sensor to the PCB. A common approach for performing this electrical connection is to solder the pins of the PIR sensor to the PCB.

However, it is recognized that the PIR sensor is a heat-sensitive component. As such, high temperatures (such as those caused by a wave soldering process) can irreversibly damage the function of the PIR sensor, increasing the noise level and increasing a risk of false triggers.

There is therefore an ongoing desire to facilitate the connection of a PIR sensor to a printed circuit board with increased flexibility of placement and reduced risk of damage to the function of the PIR sensor.

EP2569827 discloses a mounting rail bus system for supplying power voltage and data signals to a plurality of modules, including a plurality of longitudinally-arranged bus devices mounting the modules in parallel spaced transverse on a mounting rail, each of the bus devices including a printed circuit board having parallel strip conductors for transmitting data signals, and a pair of power contact pins for transmitting a power voltage, characterized by the provision of a plurality of generally L-shaped double bushing contact elements have module bush segments for respectively connecting the strip conductor s and the contact pins of the bus device with the associated module, and orthogonally arranged partner bush segments for connecting together the strip conductors and pin contacts of adjacent bus devices, respectively, whereby power voltage and data signals are transmitted from the bus device both to the associated module and to the adjacent partner bus device.

SUMMARY OF THE INVENTION

The invention is defined by the claims.

According to examples in accordance with an aspect of the invention, there is provided a connecting element for connecting a pin of a PIR sensor to a printed circuit board. The connecting element comprises: a PCB connection portion for electrically connecting to the printed circuit board; a pin socket arrangement comprising: a first pin socket for receiving the pin of the PIR sensor; and a second pin socket for receiving the pin of the PIR sensor, wherein the first pin socket and the second pin socket make a predefined non-zero angle with respect to one another, wherein the PCB connection portion, the first pin socket and the second pin socket are electrically connected to one another. The connecting arrangement further comprise a housing having side surfaces that bound a housing volume, wherein the housing is configured to, when the pin socket arrangement of each connecting element is positioned within the housing volume, expose the PCB connection portion of each connecting element outside of the housing volume.

The present invention thereby provides a connecting element for acting as an intermediary between a PIR sensor and a printed circuit board. In particular, the connecting element provides a mechanism by which a PIR sensor can be connected to the printed circuit board at two different angles, without the need to directly solder the PIR sensor to the circuit board. This significantly reduces a risk of heat damage to the PIR sensor (e.g., during the soldering process) whilst maintaining a flexibility of the positioning of the PIR sensor. The use of a housing reduces an exposure of the connecting elements to an exterior volume, thereby reducing a risk of unintentional short circuiting or electrical connecting of each connecting element. Moreover, the use of a housing provides structural stability to the connecting elements, e.g., to hold the connecting elements in their place.

In some examples, the predefined non-zero angle is between 70° and 110°. For instance, the predefined non-zero angle may be substantially 90°. It is recognized that there is a desire to facilitate parallel and perpendicular angling of the PIR sensor with respect to the printed circuit board, which is more readily facilitated through use of the proposed connecting element(s). In some examples, the first pin socket comprises a first elastic element configured to press against any pin of the PIR sensor received by the first pin socket; and/or the second pin socket comprises a second elastic element configured to press against any pin of the PIR sensor received by the second pin socket. This approach reduces a risk of the PIR sensor dislodging or disconnecting from the pin socket into which it is positioned, e.g., during transportation or installation of a device containing the PIR sensor and connecting element. Thus, use of the elastic elements increases a robustness of a connection between the connecting element and the PIR sensor.

In some examples, the first elastic element is configured to clamp any pin of the PIR sensor received by the first pin socket; and the second elastic element is configured to clamp any pin of the PIR sensor received by the second pin socket. This approach further enhances the advantages laid out above.

There is also proposed a connecting arrangement for connecting a PIR sensor, comprising a plurality of pins, to a printed circuit board, the connecting arrangement comprising, for each pin of the PIR sensor, a respective connecting element, wherein each connecting element is as herein disclosed.

In some examples, the side surfaces of the housing comprise: a first side surface having, for each connecting element, a respective first aperture for permitting passage of a pin of the PIR sensor towards the first pin socket of the pin socket arrangement of said connecting element when the pin socket arrangement is positioned within the housing; and a second side surface having, for each connecting element, a respective second aperture for permitting passage of a pin of the PIR sensor towards the second pin socket of the pin socket arrangement of said connecting element when the pin socket arrangement is positioned within the housing, wherein the first side surface and the second side surface make a non-zero angle with respect to one another.

This approach provides a means for allowing entry of the pins of the PIR sensor towards respective pin sockets within the housing. This facilitates protection of the connection between the PIR sensor and the connecting element(s).

The first side surface may make the predefined non-zero angle with respect to the second side surface. As previously mentioned, in some examples, the predefined non-zero angle is between 70° and 110°. For instance, the predefined non-zero angle may be substantially 90°.

In some examples, the housing comprises, for each connecting element, a respective connecting element aperture configured to permit partial insertion of the connecting element into the housing to thereby position the pin socket arrangement of said connecting element in the housing. This provides an easy mechanism for assembling the connecting arrangement. In particular, the housing and connecting elements may be manufactured separately and then brought together by simply inserting the connecting elements through respective connecting element apertures of the housing.

Each connecting element may comprise one or more projections configured to engage with the bounds of the respective connecting element aperture to restrict or prevent removal of the connecting element after insertion into the housing. The use of the project! on(s) thereby improves a robustness of the connecting arrangement, by reducing a risk of the connecting elements detaching from the connecting arrangement.

Each connecting element aperture of the housing may comprise one or more engagement elements configured to engage with the one or more projections of the respective connecting element inserted into the aperture. This further increases a strength of a connection between the connecting element(s) and the housing.

In some examples, the housing comprises a first connection side surface comprising one or more connecting element apertures; and the housing comprises a second connection side surface comprising one or more connecting element apertures, wherein the first connection side surface and the second connection side surface make a non-zero angle with respect to one another.

There is also provided an electronic arrangement comprising any herein disclosed connecting arrangement; and a printed circuit board, wherein the PCB connection portion of each connecting element is electrically connected, via solder, to the printed circuit board.

The electronic arrangement may further comprise the PIR sensor connected to either the first pin of each connecting element or the second pin of each connecting element.

These and other aspects of the invention will be apparent from and elucidated with reference to the embodiment s) described hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the invention, and to show more clearly how it may be carried into effect, reference will now be made, by way of example only, to the accompanying drawings, in which:

Fig. 1 illustrates an existing electronic arrangement;

Fig. 2 illustrates a proposed connecting element; Fig. 3 illustrates another proposed connecting element;

Fig. 4 illustrates a proposed connecting arrangement;

Fig. 5 also illustrates the proposed connecting arrangement;

Fig. 6 also illustrates the proposed connecting arrangement;

Fig. 7 illustrates an approach for connecting a PIR sensor to a proposed connecting arrangement;

Fig. 8 illustrates a portion of a proposed electronic arrangement; and

Fig. 9 illustrates a portion of another proposed electronic arrangement.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The invention will be described with reference to the Figures.

It should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the apparatus, systems and methods, are intended for purposes of illustration only and are not intended to limit the scope of the invention. These and other features, aspects, and advantages of the apparatus, systems and methods of the present invention will become better understood from the following description, appended claims, and accompanying drawings. It should be understood that the Figures are merely schematic and are not drawn to scale. It should also be understood that the same reference numerals are used throughout the Figures to indicate the same or similar parts.

The invention provides a mechanism for connecting a PIR sensor to a printed circuit board (PCB). A connecting element comprises two pin sockets that make a predefined angle with respect to one another. A pin of the PIR sensor is able to be inserted into either pin socket. The connecting element further comprises a PCB connecting portion for connecting the connecting element to the PCB via solder.

Embodiments are based on the realization that it would be advantageous to provide an intermediary between the PIR sensor and the PCB circuit board, at least to reduce a risk of heat damage to the PIR sensor, whilst still facilitating a selection of an angle at which the PIR sensor faces. By providing a connecting element with multiple pin sockets, and therefore multiple options for positioning of the PIR sensor, this goal is achieved.

Figure 1 illustrates a portion of an existing electronic arrangement 100 for the purposes of improved contextual understanding.

The electronic arrangement 100 comprises a printed circuit board 110, which mounts a plurality of different electrical components 121, 122, 123. One of the electrical components is a passive infrared (PIR) sensor 121. The electrical components may be connected together by one or more electrical tracks or connectors (not illustrated). Of course, in practice, the electronic arrangement 100 may comprise many more other electrical components, of which only a subset are illustrated in Figure 1 for illustrative clarity.

The PIR sensor may be adapted for a variety of purposes, but may generally be used to monitor for movement within an environment and trigger one or more other electrical components 122, 123 responsive to detected movement. For instance, the PIR sensor 121 may be configured to trigger a light emitting element to generate light responsive to a detected movement. As another example, the PIR sensor may be configured to generate and/or store an alarm responsive to a detected movement. A wide variety of other uses and embodiments for a PIR sensor will be readily apparent to the skilled person.

The PIR sensor 121 comprises a plurality of pins that are soldered (e.g., via solder 125) to the printed circuit board. However, it is recognized that a typical PIR sensor, by its nature, is a heat sensitive component. Use of a wave soldering process can therefore irrevocably damage the PIR sensor, specifically increasing a noise of the PIR sensor which may result in false triggers. The damage caused by such a soldering process may go undetected by automated test equipment (ATE) or other quality control procedures, as the function of the PIR sensor may still operate correctly, albeit with additional noise. A similar effect results from use of a manual soldering process in which the time and temperature of soldering are not carefully controlled.

There are a number of different electronic arrangements that make use of a PIR sensor mounted on a printed circuit board. In some designs,

If a PIR sensor 121 needs to be angled with respect to the printed circuit board 110, as illustrated in Figure 1, then there are two existing methodologies that are used.

A first methodology is illustrated in Figure 1. In this approach, the pins or legs of the PIR sensor are bent before soldering the (pins of the) PIR sensor 121 to the printed circuit board. This requires a significant and complicated pre-forming process and labor cost, as well as being difficult to accurately align the PIR sensor in a desired direction (as the PIR sensor 121 may effectively float above the printed circuit board.

A second methodology is to first connect the PIR sensor 121 to a daughterboard (i.e., a separate printed circuit board), which is then attached to the printed circuit board 110 using a board-to-board connector at a desired angle. This technique requires significantly more material and components, to provide at least the daughterboard and B2B connector, as well as additional manufacturing steps for soldering and connecting the PIR sensor to the daughterboard, and then the daughterboard to the printed circuit board. The present disclosure provides a new mechanism that resolves at least some of the issues outlined above. In particular, the present disclosure provides a new mechanism that facilitates mounting of a PIR sensor to a printed circuit board at an angle. A skilled person will appreciate such new mechanism can be used to mount other sensors with pins to a printed circuit board.

Embodiments proposes a connecting element for mounting or connecting the PIR sensor to a printed circuit board. The connecting element thereby acts as an intermediary between the PIR sensor and the printed circuit board. The connecting element comprises two separate pin sockets, each designed to receive a same pin of the PIR sensor. The two pin sockets are angled with respect to one another. In this way, the PIR sensor can be mounted or connected at a choice of angles with respect to a printed circuit board.

Figure 2 illustrates a first proposed connecting element 200 for connecting a pin of a PIR sensor to a printed circuit board.

The connecting element 200 comprises a PCB connection portion 210 for electrically connecting to the printed circuit board. In particular, the PCB connection portion may be suitably sized and/or shaped for being soldered to a printed circuit board. At least the PCB connection portion may therefore be formed from a suitable material for soldering to the printed circuit board.

In this way, the PCB connection portion provides a soldering surface for soldering the connecting element to a PCB or similar.

The connecting element 200 also comprises a pin socket arrangement 220. The pin socket arrangement 220 comprises a first pin socket 221 for receiving the pin of the PIR sensor; and a second pin socket 222 for receiving the pin of the PIR sensor.

The first pin socket and the second pin socket make a predefined non-zero angle with respect to one another. In the illustrated example, the first pin socket 221 and the second pin socket 222 are substantially perpendicular to one another, e.g., make an angle of 90° to one another within an acceptable margin of error (e.g., ±5°) - i.e., substantially 90° with respect to one another.

However, the first and second pin sockets may make other predefined non-zero angles with respect to one another. For instance, the predefined non-zero angle may be an angle of between 70° and 110°.

The PCB connection portion 210, the first pin socket 221 and the second pin socket 222 are electrically connected to one another. Preferably, the first pin socket comprises a first elastic element configured to press against any pin of the PIR sensor received by the first pin socket. Similarly, the second pin socket comprises a second elastic element configured to press against any pin of the PIR sensor received by the second pin socket.

In this way, the first and/or second pin sockets may press against any received pin of the PIR sensor. In the illustrated example, each elastic element comprises an elastic clamping structure 225 configured to clamp the received pin therebetween. In general, each elastic element should, when the pin socket receives the respective pin, press or applying a biasing force against the pin. The skilled person will appreciate a wide variety of techniques and designs for an elastic element that is capable of performing this function.

In one example, at least one of the first pin socket 221 and the second pin socket 222 are positioned to lie perpendicular to a plane on which the connecting element 200 sits or lies when connected to the printed circuit board. The other of the first pin socket 221 and the second pin socket 222 may be positioned to lie parallel to this plane.

In the illustrated example, the connecting element is formed from a single, monolithic piece of conductive material. This advantageously increases an ease of manufacturing the connecting element, whilst providing the necessary electrical conductivity for connecting the pin of the PIR sensor to the printed circuit board.

Examples of suitable conductive materials are well known in the art, e.g., metals or the like. In particular examples, the connecting element may be formed or cut out from a sheet of metal. Thus, the connecting element may be generally planar.

The connecting element thereby provides a mechanism for mounting or connecting a pin of a PIR sensor to a printed circuit board.

Figure 3 illustrates a second proposed connecting element 300 for connecting a pin of a PIR sensor to a printed circuit board. The connecting element 300 again comprises a PCB connection portion 310 and a pin socket arrangement 320, comprising a first pin socket 321 and a second pin socket 322. This may be generally embodied as previously described.

The second proposed connecting element 300 differs from the previously described connecting element by way of its structure. In particular, the first pin socket is more distant from the PCB connection portion in the second proposed connecting element than in the previously described embodiment. Similarly, the second pin socket 322 is more distant from the first pin socket 321 in the second proposed connecting element than in the previously described embodiment. The different structures or layouts of the different connecting elements are designed for facilitating connection to different pins of the PIR sensor. In particular, the first proposed connecting element may be designed for connecting to a first set of one or more pins of the PIR sensor. Similarly, the second proposed connecting element may be designed for connecting to a second set of one or more pins of the PIR sensor.

However, the skilled person will appreciate that the precise design and layout of the connecting element will at least partially depend upon the design of the pin of the PIR sensor and/or the design of the PIR sensor with which the connecting element is configured to co-operate. The disclosure takes the PIR sensor as an example, and the skilled person will appreciate that the connecting arrangement 400 can be used for all sensors with pins to be assembled on the PCB.

Figures 4, 5 and 6 provide views of a connecting arrangement 400 for connecting a PIR sensor, comprising a plurality of pins, to a printed circuit board. Figure 4 provides an exploded view. Figure 5 provides a view of the underside of the connecting arrangement. Figure 6 provides a cross-sectional view of the connecting arrangement.

The connecting arrangement 400 comprises, for each pin of the PIR sensor, a respective connecting element 200, 300. The illustrated connecting arrangement 400 is designed for a three pin PIR sensor, i.e., a PIR sensor having three pins. In this approach, appropriately designed connecting elements are used or selected for connecting facilitating to the three pins of the PIR sensor.

In particular, each connecting element may be designed so that, when each first pin socket of the connecting elements receives a respective pin of the PIR sensor, the PCB connection portion of each connecting element lies in a same plane.

Similarly, each connecting element may be designed so that, when each second pin socket of the connecting elements receives a respective pin of the PIR sensor, the PCB connection portion of each connecting element lies in a same plane.

The connecting elements may be arranged and/or designed such that, when one of the first pin sockets of the connecting elements receives a respective pin of the PIR sensor, each other first pin socket of the connecting element is able to receive a respective other pin of the PIR sensor.

Similarly, the connecting elements may be arranged and/or designed such that, when one of the second pin sockets of the connecting elements receives a respective pin of the PIR sensor, each other second pin socket of the connecting element is able to receive a respective other pin of the PIR sensor. These above embodiments can be readily achieved through appropriate positioning of the first and second pin sockets of each connecting element/or the PCB connection portion of each connecting element. The skilled person will readily appreciate how the design and structure of such elements may depend upon the precise arrangement of the pins of the PIR sensor, which may vary depending upon the use case scenario.

Connection of the PIR sensor to the connecting elements can be readily achieved, e.g., by manual manipulation of the pins of the PIR sensor into the first pin sockets of the connecting elements or the second pin sockets of the connecting elements.

The connecting arrangement 400 here further comprises a housing 410. The housing has side surfaces 411, 412 that bound a housing volume. The housing is configured to, when the pin socket arrangement of each connecting element is positioned within the housing volume, expose the PCB connection portion of each connecting element outside of the housing volume. This is, perhaps, best illustrated in Figure 5.

In particular, the housing (e.g., at least one side surface 415, 416 of the housing) may comprise at least one connecting element aperture configured to permit configured to permit partial insertion of the connecting element into the housing to thereby position the pin socket arrangement of said connecting element in the housing.

More particularly, the housing may comprise a first connection side surface 415 comprising one or more connecting element apertures; and a second connection side surface 416 comprising one or more connecting element apertures. The first connection side surface and the second connection side surface may make a non-zero angle with respect to one another.

Each connecting element aperture may be sized and/or otherwise configured such that, when receiving a respective connecting element, the PCB connection portion of the received connecting element is exposed (as illustrated in Figure 5). This provides a surface against which the connecting element can be soldered to the printed circuit board, e.g., without damaging the housing.

In preferred examples, the side surfaces 411, 412, 415, 416 of the housing comprise a first side surface 411. The first side surface 411 may have, for each connecting element 200, 300 a respective first aperture 421, 422, 423 for permitting passage of a (respective) pin of the PIR sensor towards the first pin socket of the pin socket arrangement of said connecting element when the pin socket arrangement is positioned within the housing.

In this way, each connecting element is able to connect to a respective pin of the PIR sensor that passes through a respective first aperture. More particularly, the first pin socket of each connecting element is aligned or positioned with respect to a respective first aperture (when the connecting element is inserted within the housing 410) to thereby receive a respective pin when it passes through the respective first aperture.

Similarly, the side surfaces 411, 412, 415, 416 may also comprise a second side surface 412 having, for each connecting element, a respective second aperture 431, 432, 433 for permitting passage of a pin of the PIR sensor towards the second pin socket of the pin socket arrangement of said connecting element when the pin socket arrangement is positioned within the housing,

The first side surface 411 and the second side surface 412 make a non-zero angle with respect to one another. In particular, the first side surface may make the predefined nonzero angle with respect to the second side surface.

Thus, the first and second side surfaces may make an angle of 90° to one another within an acceptable margin of error (e.g., ±5°) - i.e., substantially 90° with respect to one another. However, the first and second side surfaces may make other predefined non-zero angles with respect to one another. For instance, the predefined non-zero angle may be an angle of between 70° and 110°.

As previously explained, the housing may comprise a first connection side surface 415 comprising one or more connecting element apertures; and a second connection side surface 416 comprising one or more connecting element apertures. The first connection side surface and the second connection side surface may make a non-zero angle with respect to one another.

By way of working example, the first connection side surface may form a bottom side surface 415 comprising at least one connecting element aperture for permitting partial insertion of a respective connecting element therein.

Preferably, the bottom side surface 415 comprises a respective connecting element aperture for each connecting element of the connecting arrangement. More particularly, each connecting element aperture in the bottom side surface may be configured to (when receiving a respective connecting element) expose at least the PCB connecting portion of the received connecting element. This increases an ease of subsequent connection of the connecting arrangement to a printed circuit board.

The first connection side surface 415 is preferably substantially parallel (e.g., lies at an angle of 0°±5°) to the second side surface 412. The first connection side surface 415 is distinct (e.g., distanced from) the second side surface, e.g., connected by one or more other side surfaces that make a non-zero angle (e.g., an angle >30°) with respect to both the second side surface or the first connection side surface. In some examples, second connection side surface 416 forms a back or rear side surface 416 comprising at least one connecting element aperture for permitting partial insertion of a respective connecting element therein. In the illustrated example, the back or rear side surface 416 comprises a single connecting element aperture for a single connecting element.

In some examples, a connecting element aperture may span more than one side surface 415, 416 of the housing. For instance, the connecting element aperture may span across an edge between two side surfaces. This allows, for instance, increased ease of inserting a connecting element through the connecting element aperture, whilst still facilitating exposure of the PCB connection portion of the connecting element from the bottom side surface of the housing 410.

The second connection side surface 416 is preferably substantially parallel (e.g., lies at an angle of 0°±5°) to the first side surface. The second connection side surface 416 is distinct (e.g., distanced from) the first side surface, e.g., connected by one or more other side surfaces that make a non-zero angle (e.g., an angle >30°) with respect to both the first side surface or the second connection side surface.

In one working example, illustrated by at least Figures 4 and 5, the housing comprises a first connection side surface 415 and a second connection side surface 416. The first connection side surface 415 lies substantially parallel to the second side surface 412 and the second connection side surface 416 lies substantially parallel to the first side surface 411.

In this working example, the connecting arrangement comprises two first connecting elements 200 and a single second connecting element 300, previously described. The first connection side surface 415 comprises a respective connecting element aperture for each first connecting element 200. The second connection side surface 416 comprises a respective connecting element aperture for the second connecting element 300. This provides a connecting arrangement designed for use with a 3 -pin PIR sensor.

Thus, in this working example, each first connecting element 200 passes or extends through a respective connecting element aperture positioned in the first connection side surface 415 (e.g., a bottom side surface) of the housing. Similarly, the second connecting element passes or extends through a connecting element aperture positioned in the second connection side surface (e.g., a rear side surface or back side surface 416) of the housing.

The first and second connecting elements are positioned and configured such that each pin socket of each connecting element is aligned with a respective aperture (in the housing 400) for permitting passage of a pin of the PIR sensor therethrough. This is achieved through appropriate design and positioning of the housing and each connecting element. The different designs or layouts of the first and second connecting elements facilitate connection to different pins of the PIR sensor, whilst taking into account the pin layout of the PIR sensor. The skilled person will appreciate how a connecting arrangement configured or designed for a different design of the PIR sensor (e.g., a two-pin PIR sensor) may comprise a different number, arrangement and/or design of the connecting element(s) and/or housing - to appropriately align the pattern of the first pin sockets and the second pin sockets with the pattern of the pins of the PIR sensor.

In some examples, each connecting element comprises one or more projections 610 or gripping elements configured to engage with the housing to restrict or prevent removal of the connecting element after insertion into the housing. In particular, where the housing comprises a respective connecting element aperture for each connecting element, the bounds of each respective connecting element aperture may engage with the project! on(s) or gripping element(s) of its respectively received connecting element.

In the illustrated example, each projection is configured to engage with a portion of the housing. For instance, each projection may comprise a barb or protrusion that engages (e.g., via friction) with the housing. As another example, the housing may comprise complimentarily shaped holes or protrusions configured to engage with respective projections of the connecting elements.

Thus, each connecting element aperture of the housing may comprise one or more engagement elements configured to engage with the one or more projections of the respective connecting element inserted into the aperture.

The connecting arrangement may additionally or otherwise comprise one or more further connecting element retaining mechanisms configured to restrict or prevent removal of the connecting element after insertion into the housing. Suitable example retaining mechanisms include adhesive (for adhering the connecting element(s) to the housing), clipping mechanisms, friction elements and so on.

Preferably, the housing is formed from a non-conductive or insulating material such as a plastic or ceramic. This reduces a risk of unintentional electrical connection of the connecting element(s) to any other component in which the PIR sensor is deployed.

As illustrated in Figures 4 and 5, the housing 400 may have a (substantially) cuboidal shape.

Figure 7 further illustrates the connecting arrangement 400, and further acts to demonstrate how a PIR sensor 700 may be connected to the connecting arrangement at one of two different angles. This is achieved by appropriate positioning of the connecting elements of the connecting arrangement 400.

For illustrative clarity, a pin 710 of the PIR sensor 700 is also illustrated.

Figure 8 illustrates an example of an electronic arrangement 800. The electronic arrangement comprises the herein proposed connecting arrangement 400 and a printed circuit board 810. The PCB connection portion of each connecting element (of the connecting arrangement 400) is electrically connected, via solder, to the printed circuit board.

The electronic arrangement 800 here further comprises the PIR sensor 700 connected to the first pin of each connecting element.

Figure 9 illustrates an alternative example of an electronic arrangement 900. Similarly, the electronic arrangement 900 comprises the herein proposed connecting arrangement 400 and a printed circuit board 910. The PCB connection portion of each connecting element (of the connecting arrangement 400) is electrically connected, via solder, to the printed circuit board.

The electronic arrangement 800 here further comprises the PIR sensor 700 connected to the second pin of each connecting element.

In this way, the PIR sensor 700 can be arranged in two different orientations with respect to the printed circuit board 810, 910.

Variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality.

The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

If the term "adapted to" is used in the claims or description, it is noted the term "adapted to" is intended to be equivalent to the term "configured to". If the term "arrangement" is used in the claims or description, it is noted the term "arrangement" is intended to be equivalent to the term "system", and vice versa.

Any reference signs in the claims should not be construed as limiting the scope.

Claims

CLAIMS:

1. A connecting element (200, 300) for connecting a pin (710) of a sensor (700) to a printed circuit board (810, 910), the connecting element comprising: a PCB connection portion (210, 310) for electrically connecting to the printed circuit board; a pin socket arrangement (220, 320) comprising: a first pin socket (221, 321) for receiving the pin of the sensor; and a second pin socket (321, 322) for receiving the pin of the sensor, wherein the first pin socket and the second pin socket make a predefined non-zero angle with respect to one another, wherein the PCB connection portion, the first pin socket and the second pin socket are electrically connected to one another, wherein the connecting element (200,300) further comprising a housing (410) having side surfaces that bound a housing volume, wherein the housing is configured to, when the pin socket arrangement of each connecting element is positioned within the housing volume, expose the PCB connection portion of each connecting element outside of the housing volume.

2. The connecting element of claim 1, wherein the predefined non-zero angle is between 70° and 110°.

3. The connecting element of claim 2, wherein the predefined non-zero angle is substantially 90°.

4. The connecting element of any one of claims 1 to 3, wherein: the first pin socket comprises a first elastic element configured to press against any pin of the sensor received by the first pin socket; and/or the second pin socket comprises a second elastic element configured to press against any pin of the sensor received by the second pin socket.

5. The connecting element of claim 4, wherein: the first elastic element is configured to clamp any pin of the sensor received by the first pin socket; and the second elastic element is configured to clamp any pin of the sensor received by the second pin socket.

6. A connecting arrangement (400) for connecting a sensor, comprising a plurality of pins, to a printed circuit board, the connecting arrangement comprising, for each pin of the sensor, a respective connecting element according to any of claims 1 to 5.

7. The connecting arrangement of claim 6, wherein the side surfaces of the housing comprise: a first side surface having, for each connecting element, a respective first aperture for permitting passage of a pin of the sensor towards the first pin socket of the pin socket arrangement of said connecting element when the pin socket arrangement is positioned within the housing; and a second side surface having, for each connecting element, a respective second aperture for permitting passage of a pin of the sensor towards the second pin socket of the pin socket arrangement of said connecting element when the pin socket arrangement is positioned within the housing, wherein the first side surface and the second side surface make a non-zero angle with respect to one another, optionally wherein the first side surface makes the predefined nonzero angle with respect to the second side surface.

8. The connecting arrangement of any one of claims 6 or 7, wherein the housing comprises, for each connecting element, a respective connecting element aperture configured to permit partial insertion of the connecting element into the housing to thereby position the pin socket arrangement of said connecting element in the housing.

9. The connecting arrangement of claim 8, wherein each connecting element comprises one or more projections configured to engage with the bounds of the respective connecting element aperture to restrict or prevent removal of the connecting element after insertion into the housing.

10. The connecting arrangement of claim 9, wherein each connecting element aperture of the housing comprises one or more engagement elements configured to engage with the one or more projections of the respective connecting element inserted into the aperture.

11. The connecting arrangement of any one of claims 9 to 10, wherein: the housing comprises a first connection side surface (415) comprising one or more connecting element apertures; and the housing comprises a second connection side surface (416) comprising one or more connecting element apertures, wherein the first connection side surface and the second connection side surface make a non-zero angle with respect to one another.

12. The connecting arrangement of claim 11, wherein: the first connection side surface comprises two connecting element aperture for receiving a respective connecting element; and the second connection side surface comprises a single connecting element aperture for receiving a respective connecting element.

13. An electronic arrangement comprising: the connecting arrangement of any one of claims 6 to 12; and a printed circuit board, wherein the PCB connection portion of each connecting element is electrically connected, via solder, to the printed circuit board.

14. The electronic arrangement of claim 13, further comprising the sensor connected to either the first pin of each connecting element or the second pin of each connecting element.