WO2025247641A1 - An electronic device with a light sensor - Google Patents
An electronic device with a light sensorInfo
- Publication number
- WO2025247641A1 WO2025247641A1 PCT/EP2025/063206 EP2025063206W WO2025247641A1 WO 2025247641 A1 WO2025247641 A1 WO 2025247641A1 EP 2025063206 W EP2025063206 W EP 2025063206W WO 2025247641 A1 WO2025247641 A1 WO 2025247641A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- substrate
- light sensor
- external volume
- optical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
- G06F3/03547—Touch pads, in which fingers can move on a surface
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
- G01J1/0474—Diffusers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4204—Photometry, e.g. photographic exposure meter using electric radiation detectors with determination of ambient light
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/9627—Optical touch switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/105—Controlling the light source in response to determined parameters
- H05B47/11—Controlling the light source in response to determined parameters by determining the brightness or colour temperature of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/10—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/033—Indexing scheme relating to G06F3/033
- G06F2203/0339—Touch strips, e.g. orthogonal touch strips to control cursor movement or scrolling; single touch strip to adjust parameter or to implement a row of soft keys
Definitions
- the present disclosure relates to the field of electronic devices, particularly those with light sensors.
- a light sensor may be used to identify when a user is interacting with the electronic device, e.g., touching or in close proximity to the electronic device.
- a light sensor may be used to monitor an ambient light condition, e.g., to control the triggering of a certain action (such as the emission of light) at certain ambient light conditions.
- an electronic device comprising: a substrate having a first side facing an external volume and a second side, opposite the first side, facing away from the external volume; a light sensor positioned on the second side of the substrate; and an optical element configured to receive first light from the external volume and redirect the first light towards the light sensor.
- the light sensor and the optical element are configured such that the light sensor receives light from the external volume via the optical element.
- the present disclosure proposes an electronic device having a light sensor positioned on a rear side of a substrate. Light received at a front side of the substrate is guided to the light sensor at the rear of the substrate using an optical element.
- the proposed electronic device avoids light from falling directly, or only via refraction, on the light sensor, which increases a likelihood that the light monitored by the light sensor will be an ambient light. More particularly, the positioning of the light sensor and use of the optical element increases a uniformity of light incident upon the light sensor without the need for materially expensive and difficult to manufacture lenses.
- a lighting device comprising: a light emitting element configured to emit light; an electronic sensing device comprising a substrate having a first side facing an external volume and a second side, opposite the first side, facing away from the external volume; a light sensor positioned on the second side of the substrate; and an optical element configured to receive first light from the external volume and redirect the first light towards the light sensor.
- the light sensor and the optical element are configured such that the light sensor receives light from the external volume via the optical element, and the light sensor is configured to monitor light received at the light sensor and generate a sensing signal.
- the lighting device further comprises a control arrangement, and the control arrangement configured to control one or more properties of light emitted by the light emitting element responsive to the sensing signal.
- the light sensor and the optical element are configured such that the light sensor only receives light from the external volume via the optical element.
- the substrate comprises one or more substrate apertures spanning from the first side to the second side, each substrate aperture being configured to permit the passage of light from the external volume through the substrate; and the optical element is configured to redirect light from the external volume and transmitted through the one or more substrate apertures to the light sensor.
- This provides a compact and reliable mechanism for passing light from the first side of the substrate to the second side, thereby providing a more compact and space-efficient electronic device.
- the electronic device may further comprise a support element positioned on the first side of the substrate, wherein: the support element comprises, for the one or more substrate aperture, a corresponding support aperture through the support element; and the support aperture is aligned with the corresponding one or more substrate apertures and configured to permit the passage of light from the external volume to the corresponding one or more substrate apertures through the support element.
- the support element comprises, for each substrate aperture, a respective support aperture through the support element; and each support aperture is aligned with the respective substrate aperture and configured to permit the passage of light from the external volume to the respective substrate aperture through the support element.
- the support element helps provide structural support and/or mountability of the electronic device, whilst the support aperture(s) facilitate the transmission of light to the substrate aperture(s) in a reliable and compact manner.
- the support element comprises one or more mounting elements for connecting the electronic device to a surface. This facilitates connection of the electronic device to another component.
- the electronic device may comprise a cover element positioned on the first side of the substrate, wherein the cover element is at least partially transparent to permit the passage of light from the external volume to each substrate aperture.
- cover element facilitates improved ingress protection for the electronic device, in particular preventing or reducing a risk of foreign material ingress towards the second side of the substrate (e.g., and therefore the light sensor).
- the cover element may be configured to cover any aperture (e.g., any substrate or support aperture) through which the first light is transmitted when enroute to the first sensor.
- any aperture e.g., any substrate or support aperture
- the optical element is configured to cover the light sensor such that the light sensor only receives the first light. This embodiment reduces a risk of stray light becoming incident upon the light sensor, to increase a reliability of the light sensor for sensing the first light.
- the optical element is configured to scatter the first light when redirecting the first light toward the light sensor. This approach increases a uniformity of light received by the light sensor.
- the optical element comprises an optical substrate positioned on the second side of the substrate, the optical substrate comprising an optical cavity; and the light sensor is positioned within the optical cavity of the optical substrate.
- the substrate may be a printed circuit board carrying one or more electrical components for the electronic device.
- at least one of the one or more electrical components is positioned on the second side of the printed circuit board. This approach reduces an amount of wiring and/or vias required for connecting (if required) the light sensor to other electrical components for the electronic device.
- the light sensor is configured to monitor light received at the light sensor and generate a sensing signal responsive to a magnitude of the received light.
- the electronic device comprises a light emitting element configured to emit light; and a control arrangement configured to control one or more properties of light emitted by the light emitting element responsive to the sensing signal. In this way, the level of light emitted by the light emitting element changes responsive to the light level monitored by the light sensor. This may facilitate, for instance, user control over the light level (e.g., by blocking light that would otherwise pass to the light sensor to indicate a desire to change the light level) and/or to track an ambient light level, e.g., for triggering the generation of light when the environment is dark.
- the electronic device may comprise a plurality of light sensors positioned on the second side of the substrate, wherein the optical element is configured to, for each light sensor, receive respective first light from the external volume and redirect the respective first light towards the light sensor, wherein each light sensor and the optical element are configured such that each light sensor receives light from the external volume via the optical element.
- the light sensor and the optical element are configured such that the light sensor only receives light from the external volume via the optical element.
- the optical element is configured to cover each light sensor such that each light sensor only receives the respective first light.
- the first light comprises a different part of second light received at the electronic device from the external volume.
- each light sensor may track different, separate parts of light received at the electronic device. This can, for instance, facilitate precise user control over sensing signals generated by different light sensors (where relevant).
- the first light respectively received by different light sensors comes from a different orientation with respect to the electronic sensing device.
- an electronic arrangement comprising: the electronic device, wherein each light sensor of the electronic device is configured to monitor light received at said light sensor and generate a respective sensing signal responsive to a property of the received light: one or more further electronic components; and control circuitry configured to: receive each respective sensing signal from each light sensor of the electronic device; process the received sensing signals to determine a measure of a light property in different parts of the external volume; and control the one or more further electronic components responsive to the determined measure of the light property in the different parts of the external volume.
- Fig. 1 illustrates a portion of a proposed electronic sensing device
- Fig. 2 provides a first exploded view of a proposed electronic sensing device
- Fig. 3 illustrates a second exploded view of the proposed electronic sensing device
- Fig. 4 illustrates an optical element
- Fig. 5 illustrates a portion of another proposed electronic sensing device
- Fig. 6 illustrates a portion of another proposed electronic sensing device
- Fig. 7 illustrates a portion of another proposed electronic sensing device
- Fig. 8 illustrates a portion of another proposed electronic sensing device
- Fig. 9 illustrates a proposed lighting device with a proposed electronic sensing device
- Fig. 10 illustrates an environment in which a proposed electronic sensing device may be employed.
- the invention provides a mechanism for guiding light to a light sensor of an electronic sensing device.
- the light sensor is positioned on a second side of a substrate of the electronic sensing device, wherein a first (opposite) side faces an external volume.
- First light incident upon the electronic sensing device, from the external volume is guided to the light sensor on the second side of the substrate by an optical element. Only the first light, from the external volume, is passed to the light sensor.
- an element may be considered to be “on” a different element when directly connected/mounted thereto or positioned above the other element (e.g., without making direct contact).
- spatially relevant terms or descriptors e.g., “below”, “above” and so on
- orientations of the element(s) illustrated in the Figures The skilled person would readily understand how an element considered to be “above” another element may be considered to be “below” said other element if the two elements are rotated with respect to one another.
- the elements may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
- Figure 1 illustrates a cross-section of a portion of a proposed electronic sensing device 100.
- the electronic sensing device comprises a substrate 110, a light sensor 120 and an optical element 130.
- the substrate 110 has a first side 111 facing an external volume 190.
- the external volume is a volume (e.g., of air) that is external to the electronic sensing device.
- the location of the external volume is defined by the first side, i.e., being a volume of an external environment to which the first side 111 faces.
- the substrate 110 also comprises a second side 112 facing away from the external volume 190. In this way, the second side 112 is formed to be opposite the first side 111 of the substrate 110.
- the substrate 110 is formed from an opaque material, e.g., AI2O3, FR4, aluminum, ceramics and so on to prevent the passage of light through the material of the substrate.
- the substrate may instead be formed from other material, e.g., SiCh/glass.
- at least one side of the PCB is coated with an opaque layer or material (e.g., paint) to prevent the passage of light through the material of the substrate.
- the PCB is a double-sided PCB, and the first side of the PCB is copper-poured surface in a close contact with the support element 140 to realize a touch function, and the second side of the PCB provide a surface for mounting surface mount devices (SMDs), e.g. a SMD photosensor, thereon.
- SMDs surface mount devices
- the light sensor 120 is positioned on the second side of the substrate.
- the light sensor 120 is configured to generate a sensing signal responsive to one or more properties of light incident thereon, e.g., a light intensity and/or light color.
- the light sensor may be configured to generate a sensing signal responsive to an ambient light level in the immediate environment of the light sensor. In this way, the light sensor 120 may be an ambient light sensor.
- the light sensor 120 may be configured to monitor light received at the light sensor and generate a sensing signal responsive to a magnitude of the received light.
- the light sensor may take any suitable structure or design known in the art, such as a patch sensor, a flip patch sensor, a plug-in sensor and so on.
- the optical element 130 is configured to receive first light LI from the external volume and redirect the first light LI towards the light sensor 120. It will be appreciated that not all of the light received by the optical element from the external volume 190 needs to be redirected towards the light sensor (e.g., some may be absorbed or reflected back towards the first volume), rather at least some of the received light (i.e., the first light) is redirected towards the light sensor.
- At least some light from an external environment enters the electronic sensing device through a light input window 191.
- the first light LI received through the light input window, is redirected by the optical element 130 to the light sensor 120.
- TIR total internal reflection
- scattering particles e.g., the use of scattering particles
- the light sensor and the optical element are configured such that the light sensor (e.g., only) receives light from the external volume via the optical element.
- the light sensor e.g., only
- the light sensor receives light from the external volume 190 indirectly, e.g., via reflections, refractions and/or scattering by the optical element.
- the substrate is configured to have a transmittivity of less than 1%, e.g., be opaque and/or reflective. This reduces a risk of unwanted light (from the external volume) from being transmitted towards the light sensor.
- the optical element may comprise a shield element 139 for blocking light transmission directly from the external volume 190 to the light sensor 120.
- the shield element 139 may, for instance, be configured to have a transmittivity of less than 1%, e.g., be opaque and/or reflective.
- the optical element 130 comprises an optical substrate 131 positioned on the second side 112 of the substrate 110.
- the optical substrate 131 comprises a light guiding element 132 for guiding or redirecting light to the light sensor 120.
- the light guiding element takes the form of an optical cavity 132 (and shall be hereafter referred to as such).
- the light sensor is positioned within the optical cavity 132 of the optical substrate.
- the optical substrate is configured to perform redirection (e.g., employing refraction, reflection and/or scattering techniques) of the first light LI received by the optical substrate to disperse the light within the optical cavity.
- redirection e.g., employing refraction, reflection and/or scattering techniques
- an inner wall 133 that bounds the optical cavity is configured to direct the first light LI to the light sensor.
- the optical cavity 132 may take any suitable form or shape designed for directing and/or distributing light within the optical cavity, e.g., a frustum, a cone or truncated cone.
- the optical cavity may have a semi-circular cross-sectional shape (e.g., in a plane perpendicular to a plane in which the substrate lies).
- the inner wall 133 may include a reflective layer 135 (, for instance, the inner wall 133 may be coated in a reflective material or film (e.g., a metal such as aluminum or silver) to perform redirection of light.
- the inner wall 133 may be designed to perform the redirection of light using total internal reflection methodologies, e.g., by controlling the shape and/or material of the inner wall appropriately to perform or define the redirection of light towards the light sensor.
- the inner wall 133 of the optical cavity is white in color, to reduce a risk of changing the color of the first light (e.g., for more accurate sensing of the first light by the light sensor).
- the optical element is configured to scatter the first light when redirecting the first light toward the light sensor. This effectively causes the light in the optical cavity to be ambient light.
- the inner wall may be coated with a suitable film, coating or layer designed or configured for performing light scattering.
- suitable film coating or layer designed or configured for performing light scattering. Examples are known in the art, including thin film coatings or multilayer coatings, e.g., as indicated by Bousquet, P., F. Flory, and P. Roche. "Scattering from multilayer thin films: theory and experiment.” JOSA 71.9 (1981): 1115-1123.
- the inner wall may be coated with or suspend dispersive, diffusive or scattering particles for scattering or diffusing received light, e.g., perform diffusive reflection of light.
- suitable light scattering material from which light scattering particles may be formed include: titanium dioxide, barium sulfate, magnesium oxide, silicon dioxide, aluminum oxide or any combination thereof.
- Light scattering particles may, for instance, be white in color to achieve improved scattering of light.
- the inner wall may be patterned (e.g., at the boundary to the optical cavity) with one or more microstructure patterns configured for performing scattering and/or diffusive reflection of light. This can be achieved, for instance, using known approaches, such as those designed for use as back reflectors or similar.
- Example approaches are disclosed by US Patent Number 6,870,678, Sai, Hitoshi, Kimihiko Saito, and Michio Kondo. "Investigation of textured back reflectors with periodic honeycomb patterns in thin-film silicon solar cells for improved photovoltaic performance.” IEEE Journal of Photovoltaics 3.1 (2012): 5-10, Eisenhauer, D., et al. "Honeycomb micro-textures for light trapping in multi-crystalline silicon thin-film solar cells.” Optics Express 26.10 (2018): A498-A507.
- the substrate comprises one or more substrate apertures 115 (here: a single substrate aperture) spanning from the first side 111 to the second side 112.
- The/each substrate aperture 115 is configured to permit the passage of light LI from the external volume 190 through the substrate 110.
- the substrate aperture 115 is configured to permit the passage of light LI from the external volume into the optical cavity 132 of the optical element.
- the optical element is configured to redirect light from the external volume and transmitted through the one or more substrate apertures to the light sensor.
- the inner wall 133 bounding the optical cavity 132 redirects (e.g., using scattering) received light towards the light sensor.
- one or more substrate apertures facilitates the positioning of a light sensor away from the bounds or edges of the electronic sensing device, i.e., distancing the light sensor further away from an exterior to the electronic sensing device. This reduces a risk of light leakage towards the light sensor from other undesired sources.
- a (part of the) surface of the second side 112 facing towards the inner wall 133 is printed white.
- a (part of the) surface of the second side 112 in contact with the optical element 130 is printed black. This reduces a risk of light leakage towards the light sensor from other substrate apertures.
- the optical element 130 and the substrate 110 are configured to abut each other or be otherwise positioned closely to one another to further reduce a risk of light leakage towards the light sensor from other substrate apertures.
- the electronic sensing device is configured such that the light sensor only receives the first light via a single substrate aperture. This allows the sensing signal produced by the light sensor to effectively operate or function as a user input. For instance, a user may cover the single substrate aperture to change or modify the sensing signal, which can be used to control further operations of the electronic sensing device.
- the cross-sectional area of the substrate aperture is no more than 0.7 times the cross-sectional area of the optical cavity.
- the cross-sectional area of the substrate aperture and the optical cavity is measured in a plane parallel to that in which the substrate 110 lies. This approach allows for appropriate and suitable diffusion of light passing through the substrate aperture to the optical cavity.
- the cross-sectional area of the substrate aperture is no less than 0.5 times the cross-sectional area of the optical cavity.
- the cross-sectional area of the substrate aperture and the optical cavity is measured in a plane parallel to that in which the substrate 110 lies.
- a subset (e.g., some or all) of the one or more substrate apertures are configured to implement additional functions, e.g., to be configured to work as switches.
- the optical cavity may have a semi-circular cross-sectional shape (e.g., in a plane perpendicular to a plane in which the substrate lies). This allows the light sensor to be positioned close to or adjacent to the substrate aperture(s), e.g., for providing a more compact electronic sensing device.
- FIG. 1 Some further optional features of the electronic sensing device are illustrated in Figure 1, namely a support element 140 and a cover element 150.
- the (optional) support element 140 is positioned on the first side 111 of the substrate 110.
- the support element 140 is designed for providing structural support for the electronic sensing device (particularly the substrate and/or optical element).
- the support element 140 comprises, for each substrate aperture 115, a respective support aperture 145 through the support element 140.
- Each support aperture 140 is aligned (e.g., axially aligned) with the respective substrate aperture 115.
- Each support aperture 145 is also configured to permit the passage of light from the external volume 190 to the respective substrate aperture through the support element.
- the support aperture(s) 115 facilitate or permit the passage of light into the respective substrate aperture(s).
- the (optional) cover element 150 is also positioned on the first side 111 of the substrate 110.
- the cover element 150 is positioned on the support element 140, such that at least part of the support element lies between the support element 140 and the first side 111 of the substrate 110.
- the support element may be omitted or positioned elsewhere (e.g., on the second side 112 of the substrate).
- the cover element is configured to cover the substrate aperture(s) 115, e.g., with a solid material. This reduces a risk of foreign material ingress to the substrate aperture and, ultimately, towards the second side 112 of the substrate 110 and the light sensor 120.
- the cover element 150 is at least partially transparent, e.g., formed from a transparent/translucent material such as TiCE or SiCE.
- the light sensor 120 is illustrated to be positioned directly on (i.e., mounted directly to) the second side 112 of the substrate 110. However, this positioning is not essential. In alternative examples, the sensor may be positioned or mounted to another element on the second side 112 of the substrate, such as the optical element 130. For instance, the light sensor 120 may be positioned on the inner wall 133 of the optical element.
- the positioning of the light sensor and the structure of the overall electronic sensing device is such that the light sensor (e.g., only) receives light from the external volume (i.e., and therefore from the first side of the substrate 110) via the optical element 130.
- Figures 2 and 3 provide exploded views of the electronic sensing device 100.
- the electronic sensing device 100 comprises a substrate 110, an optical element 130, a (optional) support element 140 and a (optional) cover element 150.
- the electronic sensing device also comprises a light sensor 120 positioned on the substrate, specifically a second side 112 of the substrate.
- support element 140 and the cover element 150 may be provided as a one piece element to support and cover the substrate 110 and the optical element 130.
- the cross-sectional shape of a substrate aperture 115 may be a circular segment. However, this is not essential. Rather, this cross-sectional shape may instead be any appropriate shape, e.g., circular, semi-circular, square, rectangular, oval, triangular and so on.
- the light sensor may be positioned proximate (or closest to) the chord of the circular segment.
- the support element 140 may comprise one or more mounting elements 141 for connecting the electronic sensing device to a surface. This provides a mechanism for securing the electronic sensing device to an external location.
- the substrate 110 is a printed circuit board carrying one or more electrical components 119 for the electronic sensing device. At least one of the electrical component s) is positioned on the second side 112 (visible in Figure 2) of the substrate 110.
- electronic sensing device may (as illustrated by Figures 2 and 3) be configured to comprise a plurality of light sensors 120, 121, 122, 123.
- Each light sensor may, for instance, be configured to generate a respective sensing signal responsive to light received by the respective light sensor.
- the optical element 130 may be configured to, for each light sensor 120, receive respective first light from the external volume and redirect the respective first light towards the light sensor.
- Each light sensor and the optical element are configured such that each light sensor (e.g., only) receives light from the external volume via the optical element.
- Example approaches for appropriate configuration of a light sensor and optical element are described in this disclosure, and the skilled person would be readily capable of adapting one (or more) of these approaches for defining the passage/guiding of light to each light sensor.
- the optical element is configured to cover each light sensor such that each light sensor only receives the respective first light.
- the first light comprises a different part of second light received at the electronic sensing device from the external volume.
- each light sensor may be sensitive to different parts of light received at the electronic sensing device. This reduces a risk of crosstalk between different light sensors.
- optical element can be configured to have a dedicated light guiding element (e.g., a dedicated optical cavity) for each light sensor.
- a dedicated light guiding element e.g., a dedicated optical cavity
- the substrate comprises one or more substrate apertures spanning from the first side to the second side 112 of the substrate.
- Each substrate aperture 115 is configured to permit the passage of light LI from the external volume 190 through the substrate 110.
- the substrate aperture 115 is configured to permit the passage of light from the external volume into the optical cavity or optical cavities 331, 332 of the optical element 130.
- the optical element 130 is configured to redirect light from the external volume and transmitted through the one or more substrate apertures to each light sensor 120, 121, 122, 123.
- the inner wall 133 bounding the optical cavity 132 redirects (e.g., using scattering) received light towards the light sensor. Suitable approaches for configuring the inner wall 133 to perform the redirection of light have been previously described.
- any (single) substrate aperture 116 may be configured to permit passage of light therethrough for a plurality of different light sensors 122, 123.
- the optical element may be configured to receive the transmitted light and distribute the received light to different light sensors. This can be achieved through the use of a different light guiding element (e.g., an optical cavities) for each light sensor 122, 123.
- Figure 4 illustrates another view of a proposed optical element 130 for improved contextual understanding.
- the optical element 130 comprises a respective optical cavity 331, 332 for each light sensor of the electronic sensing device.
- An optical cavity is one example of a light guiding element for guiding light received by the optical element to a light sensor.
- any optical cavity 331, 332 may be replaced by another form of light guiding element herein described.
- the following description provides detail on some alternative techniques or approaches for configuring an optical element to receive first light from the external volume and redirect the first light towards the light sensor (i.e., alternative light guiding elements).
- the following description also provides other example techniques and approaches for configuring a light sensor and optical element such that the light sensor (e.g., only) receives light from the external volume via the optical element.
- Figure 5 illustrates a portion of a proposed electronic sensing device 500 that employs one such alternative approach.
- the electronic sensing device 500 again comprises a substrate 110, a light sensor 120, an optical element 130, a (optional) support element 140 and a (optional) cover element. These elements may generally be embodied as previously described, with any variations being hereafter detailed.
- the light sensor 120 is positioned near an edge 511 of the substrate 110.
- the electronic sensing device is configured to permit the passage of light around the edge 511 of the substrate 110.
- the optical element is appropriately configured to guide the passage of the first light towards the light sensor, as well as to block the ingress of light outside of the external volume from passing into the optical element.
- This can be achieved using a waveguiding passage 531 whose bounds function guide light from the external volume 190, around the edge of the optical cavity and into the optical cavity 132.
- the waveguiding passage 531 may, for instance, be defined by a gap or space between the edge 511 of the substrate 110 and the optical element. In other words, at least the edge 511 of the substrate 110 and the optical element may at least partially define the bounds of the waveguiding passage.
- the function/operation of the optical cavity 132 and the inner wall 133 bounding the optical cavity may be identical/ similar to that previously described.
- suitable approaches for configuring the inner wall 133 to perform the redirection of light have been previously described.
- the support aperture(s) can be omitted.
- the electronic sensing device is configured to permit the passage of light around the edge 541 of the support element 140. In this way, the edge 541 of the support element 140 may define some of the bounds of the waveguiding passage.
- the support element may comprise a support aperture.
- the support aperture may be positioned or aligned to permit the passage of light received from the external volume 190 around the edge 541 of the support element (e.g., to the waveguiding passage).
- the cover element if present, may be designed or configured to cover (if present) any support aperture and/or any waveguiding passage 531. This reduces a risk of foreign material ingress towards the second side 112 of the substrate 110.
- Figure 6 illustrates a portion of a proposed electronic sensing device 600 that employs an alternative approach.
- the electronic sensing device 600 again comprises a substrate 110, a light sensor 120, an optical element 130, a (optional) support element 140 and a (optional) cover element. These elements may generally be embodied as previously described, with any variations being hereafter detailed.
- the optical element 130 is configured to, instead of an optical cavity bound by an inner wall, comprising a waveguide 631 for guiding received first light (from the external volume) towards the light sensor.
- the waveguide provides another example of a suitable light guiding element for guiding light received by the optical element to a light sensor, which can be employed in some embodiments.
- the waveguide 631 may be formed of any appropriate material, and may guide the transportation of the first light using, for instance, reflection and/or a total internal reflection technique.
- the bounds 634 of the waveguide 631 may be defined by a surface coated with reflective material.
- the bounds of the waveguide may be defined by an interface between a first material 632 of the optical element and a second material 633 of the optical element, with total internal reflection principles being exploited to guide the first light LI to the light sensor 120.
- the first material and the second material may have different optical properties, particularly different refractive indexes.
- the waveguide is configured to perform at least some scattering of received light.
- the bounds of the waveguide may be coated with dispersive, diffusive or scattering particles for scattering received light and/or the first material 632 of the waveguide may suspend such scatting particles.
- Other suitable approaches for configuring a waveguide to perform scattering of light will be readily apparent to the skilled person.
- suitable light scattering material from which light scattering particles may be formed include: titanium dioxide, barium sulfate, magnesium oxide, silicon dioxide, aluminum oxide or any combination thereof.
- Light scattering particles may, for instance, be white in color to achieve good scattering of light.
- the substrate 110 comprises (at least) one substrate aperture 115.
- the waveguide 631 is positioned to receive light transmitted through the substrate aperture(s) 115.
- the waveguide 631 may be positioned to receive light transmitted around an edge of the substrate aperture.
- the substrate aperture(s) may be omitted.
- the (optional) support element also comprises one or more support apertures.
- the one or more support apertures are designed for permitting the passage of light to the substrate aperture(s).
- each support aperture is aligned with at least one substrate aperture and configured to permit the passage of light from the external volume to the at least one substrate aperture through the support element.
- the substrate aperture(s) may be positioned to receive light transmitted around an edge of the support element (if present).
- the support aperture(s) may be omitted.
- each light guiding element e.g., optical cavity or waveguide
- each light guiding element is configured to guide first light to only a single light sensor.
- this approach is not a requirement of all embodiments.
- Figure 7 illustrates a portion of a proposed electronic sensing device 700 that employs an alternative approach.
- the electronic sensing device 700 again comprises a substrate 110, an optical element 130, a (optional) support element 140 and a (optional) cover element. These elements may generally be embodied as previously described, with any variations being hereafter detailed.
- the electronic sensing device 700 comprises a first light sensor
- Each light sensor 721, 722 may receive (via redirection by the optical element 130) different instances of first light LI A, LIB.
- each light sensor 721, 722 the first light LI A, LIB comprises a different part of second light received at the electronic sensing device from the external volume.
- each light sensor 721, 722 may be sensitive to different parts of light received at the electronic sensing device. More particularly, each light sensor 721,
- the 722 may be more sensitive to light from (i.e., represent) a different space or sub-volume of the external volume 190.
- first light i.e., the different parts of second light
- first light may effectively represent light coming from different orientations with respect to the electronic sensing device.
- Positioning two or more light sensors within a same optical cavity facilitates determination of the distribution of one or more properties of light (e.g., light intensity or light color) in different parts of the external volume by taking into account the position of each light sensor - which indicates which space or sub-volume of the external volume is represented by a sensing signal generated by each light sensor.
- one or more properties of light e.g., light intensity or light color
- the electronic sensing device further comprises a sensing arrangement configured to receive the sensing signals generated by the two or more light sensors 721, 722 (positioned in a same optical cavity) and generate spatial information identifying the property of light in different space or sub-volumes of the external volume.
- Figure 8 illustrates a portion of another proposed electronic sensing device 800 that employs an alternative approach. Reference is also made to Figure 1.
- the electronic sensing device 800 comprises a substrate 110, a light sensor 120, an optical element 130, a (optional) support element 140 and a (optional) cover element 150. These elements may generally be embodied as previously described, with any variations being hereafter detailed.
- the electronic sensing device 800 differs from the electronic sensing device 100 described with reference to Figure 1 by virtue of the shape of the optical cavity 132.
- the optical cavity takes the shape of a truncated pyramid in which the truncation plane 811 is not parallel to the base (lying in base plane 812) of the shape.
- the truncation plane 812 makes a non-zero angle with respect to the base 812 of the shape. In this way, the optical cavity may effectively be an inclined optical cavity.
- the truncation plane 812 may be angled such that a point of intersection between the truncation plane 811 and the base plane 812 is more proximate to the light sensor 120 (or the projection of the light sensor on the base plane 812) than the substrate aperture 115.
- each light sensor may be configured to generate a respective sensing signal responsive to one or more properties (e.g., magnitude or color) of the received first light.
- Each sensing signal is thereby able to act as a user input signal, as a user or operator may be able to (at least partially) block at least some light from passing to the light sensor(s), e.g., by placing a finger to block or cover a light input window to the electronic sensing device.
- each sensing signal act as a user input signal.
- the sensing signal simply indicates an ambient light level in an environment in which the electronic sensing device is positioned. This may be advantageous, for instance, for triggering one or more other components (e.g., a light) responsive to an ambient light level meeting certain conditions - e.g., reaching nighttime or daytime - or to control the operation of certain light elements responsive to an ambient light level (e.g., a magnitude of emitted light).
- the electronic sensing device 100 may further comprise one or more electronic components that function responsive to the sensing signal(s).
- the electronic sensing device may further comprise a light emitting element configured to emit light; and a control arrangement configured to control one or more properties of light emitted by the light emitting element responsive to the sensing signal.
- Figure 9 illustrates one example of a lighting device 900 comprising a light emitting element 910.
- the lighting device 900 further comprises the feature(s) and any optional feature, of any previously described electronic sensing device.
- the position 920 of the portion of the optical element that receives first light from the external volume is indicated.
- the lighting device 900 having a light emitting element 910 illustrated by Figure 9 takes the form of a desk lamp, embodiments are not limited thereto.
- the electronic device may instead take the form of a ceiling light, a plug-in light (such as a night light), a floor lamp, a streetlight and so on.
- the lighting device 900 may further comprise a control arrangement (not visible in Figure 9) configured to control one or more properties of light emitted by the light emitting element responsive to the sensing signal.
- different sensing signals may indicate a desire for a property to have a particular value and/or be associated with different properties.
- a sensing signal generated by a first light sensor may indicate a desire to turn on or off the light emitting element.
- Sensing signals generated by a set of second light sensors may indicate different desired magnitudes for light output by the light emitting element.
- Sensing signals generated by a set of third light sensors may indicate different desired colors for light output by the light emitting element.
- Sensing signals generated by a set of fourth light sensors may indicate different desired angles for light output by the light emitting element.
- each light sensor is associated with a different light guiding element (e.g., a different optical cavity). In other examples, each light sensor is associated with a same light guiding element (e.g., a same optical cavity).
- a combination of these two approaches may be employed in some embodiments, e.g., there may be a plurality of light guiding elements of which at least one is associated with multiple light sensors.
- the first light (received by each light sensor) comprises a different part of second light received at the electronic sensing device from the external volume.
- each instance of first light respectively received by different light sensors may come from a different orientation with respect to the electronic sensing device.
- an electronic arrangement comprising the electronic sensing device, wherein each light sensor of the electronic sensing device is configured to monitor light received at said light sensor and generate a respective sensing signal responsive to a property of the received light.
- the electronic arrangement further comprises one or more further electronic components; and control circuitry configured to: receive each respective sensing signal from each light sensor of the electronic sensing device; process the received sensing signals to determine a measure of a light property in different parts of the external volume; and control the one or more further electronic components responsive to the determined measure of the light property in the different parts of the external volume.
- the electronic circuitry may be integrated into the electronic device or provided as a separate element.
- the light property may be any suitable property of light, such as a light intensity or a light color.
- control circuitry in processing the sensing signals to determine a measure of the light property in the different parts of the external volume, may be configured to process the sensing signals to determine a measure of the light property for different orientations or angles of incidence (upon the electronic sensing device).
- each different part of the external volume may effectively represent a spherical sector or cone.
- control circuitry may be configured to control an intensity of light emitted by each light arrangement based on a determined light intensity at different orientations or parts of the external volume.
- each further electronic component comprises a light arrangement
- the control circuitry may be configured to control a color of light emitted by each light arrangement based on a determined light color at different orientations or parts of the external volume.
- Figure 10 conceptually illustrates an environment in which such approaches can be employed for the sake of improved contextual understanding.
- an electronic arrangement comprising an electronic sensing device 100 and a light emitting arrangement formed of a plurality of light emitting elements 1001, 1002, 1003.
- the control circuitry (here: integrated into the electronic sensing device 100) is configured to determine a measure of light intensity in different parts 1011, 1012 of the external volume.
- the different parts represent different sectors or ranges of orientation with respect to the electronic sensing device 100. Approaches for performing this procedure have been previously disclosed and would be apparent to the skilled person.
- the control circuitry is further configured to control a light intensity of light emitted by each light emitting element 1001, 1002, 1003 responsive to the determined measures of light intensity.
- control circuitry may be configured to control any light emitting elements illuminating a dimmer part of 1012 of the external volume to emit more light than any light emitting elements illuminating a brighter part 1011 of the external volume.
- Different parts of the external volume may, for instance, be brighter or dimmer as a result of the distribution of natural light within the environment (e.g., from a window 1050) and/or any light from any other artificial source.
- the light emitting element(s) closer to the window 1050 may be controlled to be dimmer than any light emitting elements further from the window 1050.
- control circuitry may be configured to control the emission of light emitted by each light emitting element 1001, 1002, 1003 to provide a more uniform distribution of light within the overall environment.
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Abstract
A mechanism for guiding light to a light sensor of an electronic device. The light sensor is positioned on a second side of a substrate of the electronic sensing device, wherein a first (opposite) side faces an external volume. First light incident upon the electronic sensing device, from the external volume, is guided to the light sensor on the second side of the substrate by an optical element. Only the first light, from the external volume, is passed to the light sensor.
Description
AN ELECTRONIC DEVICE WITH A LIGHT SENSOR
FIELD OF THE INVENTION
The present disclosure relates to the field of electronic devices, particularly those with light sensors.
BACKGROUND OF THE INVENTION
The use of electronic devices is becoming increasingly ubiquitous in society. Some forms of electronic device make use of light sensors, e.g., for controlling the operation of the electronic device.
By way of example, a light sensor may be used to identify when a user is interacting with the electronic device, e.g., touching or in close proximity to the electronic device. As an alternative example, a light sensor may be used to monitor an ambient light condition, e.g., to control the triggering of a certain action (such as the emission of light) at certain ambient light conditions.
There is an ongoing desire to improve the reliability of light sensing in an electronic device, particularly to reduce a risk of inaccurate identification of light conditions.
SUMMARY OF THE INVENTION
The invention is defined by the claims.
According to examples in accordance with an aspect of the invention, there is provided an electronic device comprising: a substrate having a first side facing an external volume and a second side, opposite the first side, facing away from the external volume; a light sensor positioned on the second side of the substrate; and an optical element configured to receive first light from the external volume and redirect the first light towards the light sensor. The light sensor and the optical element are configured such that the light sensor receives light from the external volume via the optical element.
The present disclosure proposes an electronic device having a light sensor positioned on a rear side of a substrate. Light received at a front side of the substrate is guided to the light sensor at the rear of the substrate using an optical element. The proposed electronic device avoids light from falling directly, or only via refraction, on the light sensor, which
increases a likelihood that the light monitored by the light sensor will be an ambient light. More particularly, the positioning of the light sensor and use of the optical element increases a uniformity of light incident upon the light sensor without the need for materially expensive and difficult to manufacture lenses.
According to examples in accordance with an aspect of the invention, there is further provided a lighting device comprising: a light emitting element configured to emit light; an electronic sensing device comprising a substrate having a first side facing an external volume and a second side, opposite the first side, facing away from the external volume; a light sensor positioned on the second side of the substrate; and an optical element configured to receive first light from the external volume and redirect the first light towards the light sensor. The light sensor and the optical element are configured such that the light sensor receives light from the external volume via the optical element, and the light sensor is configured to monitor light received at the light sensor and generate a sensing signal. The lighting device further comprises a control arrangement, and the control arrangement configured to control one or more properties of light emitted by the light emitting element responsive to the sensing signal.
In some examples, the light sensor and the optical element are configured such that the light sensor only receives light from the external volume via the optical element.
In some examples, the substrate comprises one or more substrate apertures spanning from the first side to the second side, each substrate aperture being configured to permit the passage of light from the external volume through the substrate; and the optical element is configured to redirect light from the external volume and transmitted through the one or more substrate apertures to the light sensor.
This provides a compact and reliable mechanism for passing light from the first side of the substrate to the second side, thereby providing a more compact and space-efficient electronic device.
The electronic device may further comprise a support element positioned on the first side of the substrate, wherein: the support element comprises, for the one or more substrate aperture, a corresponding support aperture through the support element; and the support aperture is aligned with the corresponding one or more substrate apertures and configured to permit the passage of light from the external volume to the corresponding one or more substrate apertures through the support element.
In some examples, the support element comprises, for each substrate aperture, a respective support aperture through the support element; and each support aperture is aligned
with the respective substrate aperture and configured to permit the passage of light from the external volume to the respective substrate aperture through the support element.
The support element helps provide structural support and/or mountability of the electronic device, whilst the support aperture(s) facilitate the transmission of light to the substrate aperture(s) in a reliable and compact manner.
In some examples, the support element comprises one or more mounting elements for connecting the electronic device to a surface. This facilitates connection of the electronic device to another component.
The electronic device may comprise a cover element positioned on the first side of the substrate, wherein the cover element is at least partially transparent to permit the passage of light from the external volume to each substrate aperture. The use of cover element facilitates improved ingress protection for the electronic device, in particular preventing or reducing a risk of foreign material ingress towards the second side of the substrate (e.g., and therefore the light sensor).
More particularly, the cover element may be configured to cover any aperture (e.g., any substrate or support aperture) through which the first light is transmitted when enroute to the first sensor.
In some examples, the optical element is configured to cover the light sensor such that the light sensor only receives the first light. This embodiment reduces a risk of stray light becoming incident upon the light sensor, to increase a reliability of the light sensor for sensing the first light.
In some examples, the optical element is configured to scatter the first light when redirecting the first light toward the light sensor. This approach increases a uniformity of light received by the light sensor.
In some examples, the optical element comprises an optical substrate positioned on the second side of the substrate, the optical substrate comprising an optical cavity; and the light sensor is positioned within the optical cavity of the optical substrate.
The substrate may be a printed circuit board carrying one or more electrical components for the electronic device. Preferably, at least one of the one or more electrical components is positioned on the second side of the printed circuit board. This approach reduces an amount of wiring and/or vias required for connecting (if required) the light sensor to other electrical components for the electronic device.
In some examples, the light sensor is configured to monitor light received at the light sensor and generate a sensing signal responsive to a magnitude of the received light.
In some examples, the electronic device comprises a light emitting element configured to emit light; and a control arrangement configured to control one or more properties of light emitted by the light emitting element responsive to the sensing signal. In this way, the level of light emitted by the light emitting element changes responsive to the light level monitored by the light sensor. This may facilitate, for instance, user control over the light level (e.g., by blocking light that would otherwise pass to the light sensor to indicate a desire to change the light level) and/or to track an ambient light level, e.g., for triggering the generation of light when the environment is dark.
The electronic device may comprise a plurality of light sensors positioned on the second side of the substrate, wherein the optical element is configured to, for each light sensor, receive respective first light from the external volume and redirect the respective first light towards the light sensor, wherein each light sensor and the optical element are configured such that each light sensor receives light from the external volume via the optical element.
In some examples, the light sensor and the optical element are configured such that the light sensor only receives light from the external volume via the optical element.
In some examples, the optical element is configured to cover each light sensor such that each light sensor only receives the respective first light.
In some examples, for each light sensor, the first light comprises a different part of second light received at the electronic device from the external volume. In this way, each light sensor may track different, separate parts of light received at the electronic device. This can, for instance, facilitate precise user control over sensing signals generated by different light sensors (where relevant).
In some examples, the first light respectively received by different light sensors comes from a different orientation with respect to the electronic sensing device.
There is also provided an electronic arrangement comprising: the electronic device, wherein each light sensor of the electronic device is configured to monitor light received at said light sensor and generate a respective sensing signal responsive to a property of the received light: one or more further electronic components; and control circuitry configured to: receive each respective sensing signal from each light sensor of the electronic device; process the received sensing signals to determine a measure of a light property in different parts of the external volume; and control the one or more further electronic components responsive to the determined measure of the light property in the different parts of the external volume.
These and other aspects of the invention will be apparent from and elucidated with reference to the embodiment s) described hereinafter.
BRIEF DESCRIPTION OF THE DRAWINGS
For a better understanding of the invention, and to show more clearly how it may be carried into effect, reference will now be made, by way of example only, to the accompanying drawings, in which:
Fig. 1 illustrates a portion of a proposed electronic sensing device;
Fig. 2 provides a first exploded view of a proposed electronic sensing device;
Fig. 3 illustrates a second exploded view of the proposed electronic sensing device;
Fig. 4 illustrates an optical element;
Fig. 5 illustrates a portion of another proposed electronic sensing device;
Fig. 6 illustrates a portion of another proposed electronic sensing device;
Fig. 7 illustrates a portion of another proposed electronic sensing device;
Fig. 8 illustrates a portion of another proposed electronic sensing device;
Fig. 9 illustrates a proposed lighting device with a proposed electronic sensing device; and
Fig. 10 illustrates an environment in which a proposed electronic sensing device may be employed.
DETAILED DESCRIPTION OF THE EMBODIMENTS
The invention will be described with reference to the Figures.
It should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the apparatus, systems and methods, are intended for purposes of illustration only and are not intended to limit the scope of the invention. These and other features, aspects, and advantages of the apparatus, systems and methods of the present invention will become better understood from the following description, appended claims, and accompanying drawings. It should be understood that the Figures are merely schematic and are not drawn to scale. It should also be understood that the same reference numerals are used throughout the Figures to indicate the same or similar parts.
The invention provides a mechanism for guiding light to a light sensor of an electronic sensing device. The light sensor is positioned on a second side of a substrate of the electronic sensing device, wherein a first (opposite) side faces an external volume. First light
incident upon the electronic sensing device, from the external volume, is guided to the light sensor on the second side of the substrate by an optical element. Only the first light, from the external volume, is passed to the light sensor.
In the context of the present disclosure, an element may be considered to be “on” a different element when directly connected/mounted thereto or positioned above the other element (e.g., without making direct contact). In the context of the present disclosure, spatially relevant terms or descriptors (e.g., “below”, “above” and so on) are used for the sake of explanative clarity with respect to orientations of the element(s) illustrated in the Figures. The skilled person would readily understand how an element considered to be “above” another element may be considered to be “below” said other element if the two elements are rotated with respect to one another. The elements may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Figure 1 illustrates a cross-section of a portion of a proposed electronic sensing device 100. The electronic sensing device comprises a substrate 110, a light sensor 120 and an optical element 130.
The substrate 110 has a first side 111 facing an external volume 190. The external volume is a volume (e.g., of air) that is external to the electronic sensing device. The location of the external volume is defined by the first side, i.e., being a volume of an external environment to which the first side 111 faces.
The substrate 110 also comprises a second side 112 facing away from the external volume 190. In this way, the second side 112 is formed to be opposite the first side 111 of the substrate 110.
Preferably, the substrate 110 is formed from an opaque material, e.g., AI2O3, FR4, aluminum, ceramics and so on to prevent the passage of light through the material of the substrate. However, this is not essential, and the substrate may instead be formed from other material, e.g., SiCh/glass. In some examples, at least one side of the PCB is coated with an opaque layer or material (e.g., paint) to prevent the passage of light through the material of the substrate. In some examples, the PCB is a double-sided PCB, and the first side of the PCB is copper-poured surface in a close contact with the support element 140 to realize a touch function, and the second side of the PCB provide a surface for mounting surface mount devices (SMDs), e.g. a SMD photosensor, thereon.
The light sensor 120 is positioned on the second side of the substrate.
The light sensor 120 is configured to generate a sensing signal responsive to one or more properties of light incident thereon, e.g., a light intensity and/or light color. In particular, the light sensor may be configured to generate a sensing signal responsive to an ambient light level in the immediate environment of the light sensor. In this way, the light sensor 120 may be an ambient light sensor.
In particular, the light sensor 120 may be configured to monitor light received at the light sensor and generate a sensing signal responsive to a magnitude of the received light.
The light sensor may take any suitable structure or design known in the art, such as a patch sensor, a flip patch sensor, a plug-in sensor and so on.
The optical element 130 is configured to receive first light LI from the external volume and redirect the first light LI towards the light sensor 120. It will be appreciated that not all of the light received by the optical element from the external volume 190 needs to be redirected towards the light sensor (e.g., some may be absorbed or reflected back towards the first volume), rather at least some of the received light (i.e., the first light) is redirected towards the light sensor.
In this way, at least some light from an external environment (including the first light LI) enters the electronic sensing device through a light input window 191. The first light LI, received through the light input window, is redirected by the optical element 130 to the light sensor 120.
Approaches for configuring and designing an optical element to redirect light towards a target are well known in the art, and may make use of reflective materials, total internal reflection (TIR) techniques and/or scattering techniques (e.g., the use of scattering particles).
More particularly, the light sensor and the optical element are configured such that the light sensor (e.g., only) receives light from the external volume via the optical element. In this way, the light sensor (e.g., only) receives light from the external volume 190 indirectly, e.g., via reflections, refractions and/or scattering by the optical element.
This can be achieved by, for instance, appropriate positioning and/or angling of the light sensor on the second surface of the substrate (e.g., so that the substrate blocks the direct transmission of light to a light sensitive surface of the light sensor) and/or appropriate configuration of the optical element, e.g., to control the redirecting of light towards the light sensor.
Preferably, the substrate is configured to have a transmittivity of less than 1%, e.g., be opaque and/or reflective. This reduces a risk of unwanted light (from the external volume) from being transmitted towards the light sensor.
Other approaches can be employed, e.g., the optical element may comprise a shield element 139 for blocking light transmission directly from the external volume 190 to the light sensor 120. The shield element 139 may, for instance, be configured to have a transmittivity of less than 1%, e.g., be opaque and/or reflective.
In the illustrated example, the optical element 130 comprises an optical substrate 131 positioned on the second side 112 of the substrate 110. The optical substrate 131 comprises a light guiding element 132 for guiding or redirecting light to the light sensor 120. In this example, the light guiding element takes the form of an optical cavity 132 (and shall be hereafter referred to as such). The light sensor is positioned within the optical cavity 132 of the optical substrate.
The optical substrate is configured to perform redirection (e.g., employing refraction, reflection and/or scattering techniques) of the first light LI received by the optical substrate to disperse the light within the optical cavity. In particular, for the illustrated example, an inner wall 133 that bounds the optical cavity is configured to direct the first light LI to the light sensor.
The optical cavity 132 may take any suitable form or shape designed for directing and/or distributing light within the optical cavity, e.g., a frustum, a cone or truncated cone.
In some examples, the optical cavity may have a semi-circular cross-sectional shape (e.g., in a plane perpendicular to a plane in which the substrate lies).
The inner wall 133 may include a reflective layer 135 (, for instance, the inner wall 133 may be coated in a reflective material or film (e.g., a metal such as aluminum or silver) to perform redirection of light. In some examples, the inner wall 133 may be designed to perform the redirection of light using total internal reflection methodologies, e.g., by controlling the shape and/or material of the inner wall appropriately to perform or define the redirection of light towards the light sensor.
Preferably, the inner wall 133 of the optical cavity is white in color, to reduce a risk of changing the color of the first light (e.g., for more accurate sensing of the first light by the light sensor).
More preferably, the optical element is configured to scatter the first light when redirecting the first light toward the light sensor. This effectively causes the light in the optical cavity to be ambient light.
Approaches for designing the optical element to achieve light scattering can employ any known phenomenon that results in scattering of light, such as those put forward in Amra, Claude. "From light scattering to the microstructure of thin-film multilayers." Applied Optics 32.28 (1993): 5481-5491.
In some examples, the inner wall may be coated with a suitable film, coating or layer designed or configured for performing light scattering. Examples are known in the art, including thin film coatings or multilayer coatings, e.g., as indicated by Bousquet, P., F. Flory, and P. Roche. "Scattering from multilayer thin films: theory and experiment." JOSA 71.9 (1981): 1115-1123.
In some examples, the inner wall may be coated with or suspend dispersive, diffusive or scattering particles for scattering or diffusing received light, e.g., perform diffusive reflection of light. Examples of suitable light scattering material, from which light scattering particles may be formed include: titanium dioxide, barium sulfate, magnesium oxide, silicon dioxide, aluminum oxide or any combination thereof. Light scattering particles may, for instance, be white in color to achieve improved scattering of light.
In some examples, the inner wall may be patterned (e.g., at the boundary to the optical cavity) with one or more microstructure patterns configured for performing scattering and/or diffusive reflection of light. This can be achieved, for instance, using known approaches, such as those designed for use as back reflectors or similar.
Example approaches are disclosed by US Patent Number 6,870,678, Sai, Hitoshi, Kimihiko Saito, and Michio Kondo. "Investigation of textured back reflectors with periodic honeycomb patterns in thin-film silicon solar cells for improved photovoltaic performance." IEEE Journal of Photovoltaics 3.1 (2012): 5-10, Eisenhauer, D., et al. "Honeycomb micro-textures for light trapping in multi-crystalline silicon thin-film solar cells." Optics Express 26.10 (2018): A498-A507.
Of course, any combination of the above techniques and/or others known in the art can be employed in proposed embodiments.
In this way, when light from the external volume 190 passes into the optical cavity, light is reflected and refracted by an inner wall 133 bounding of the optical cavity to achieve a function of levelling light or dispersal of the light within the optical cavity.
In the illustrated example, the substrate comprises one or more substrate apertures 115 (here: a single substrate aperture) spanning from the first side 111 to the second side 112. The/each substrate aperture 115 is configured to permit the passage of light LI from the external volume 190 through the substrate 110.
More particularly, in the illustrated example, the substrate aperture 115 is configured to permit the passage of light LI from the external volume into the optical cavity 132 of the optical element.
The optical element is configured to redirect light from the external volume and transmitted through the one or more substrate apertures to the light sensor. In the illustrated example, the inner wall 133 bounding the optical cavity 132 redirects (e.g., using scattering) received light towards the light sensor.
The use of one or more substrate apertures facilitates the positioning of a light sensor away from the bounds or edges of the electronic sensing device, i.e., distancing the light sensor further away from an exterior to the electronic sensing device. This reduces a risk of light leakage towards the light sensor from other undesired sources.
Preferably, a (part of the) surface of the second side 112 facing towards the inner wall 133 is printed white. In some examples, a (part of the) surface of the second side 112 in contact with the optical element 130 is printed black. This reduces a risk of light leakage towards the light sensor from other substrate apertures. Preferably, the optical element 130 and the substrate 110 are configured to abut each other or be otherwise positioned closely to one another to further reduce a risk of light leakage towards the light sensor from other substrate apertures.
In some embodiments, the electronic sensing device is configured such that the light sensor only receives the first light via a single substrate aperture. This allows the sensing signal produced by the light sensor to effectively operate or function as a user input. For instance, a user may cover the single substrate aperture to change or modify the sensing signal, which can be used to control further operations of the electronic sensing device.
Preferably, the cross-sectional area of the substrate aperture is no more than 0.7 times the cross-sectional area of the optical cavity. In this context, the cross-sectional area of the substrate aperture and the optical cavity is measured in a plane parallel to that in which the substrate 110 lies. This approach allows for appropriate and suitable diffusion of light passing through the substrate aperture to the optical cavity.
Preferably, the cross-sectional area of the substrate aperture is no less than 0.5 times the cross-sectional area of the optical cavity. In this context, the cross-sectional area of
the substrate aperture and the optical cavity is measured in a plane parallel to that in which the substrate 110 lies.
In some embodiments, a subset (e.g., some or all) of the one or more substrate apertures are configured to implement additional functions, e.g., to be configured to work as switches.
In some examples, the optical cavity may have a semi-circular cross-sectional shape (e.g., in a plane perpendicular to a plane in which the substrate lies). This allows the light sensor to be positioned close to or adjacent to the substrate aperture(s), e.g., for providing a more compact electronic sensing device.
Some further optional features of the electronic sensing device are illustrated in Figure 1, namely a support element 140 and a cover element 150.
The (optional) support element 140 is positioned on the first side 111 of the substrate 110. The support element 140 is designed for providing structural support for the electronic sensing device (particularly the substrate and/or optical element).
In the illustrated example, the support element 140 comprises, for each substrate aperture 115, a respective support aperture 145 through the support element 140. Each support aperture 140 is aligned (e.g., axially aligned) with the respective substrate aperture 115. Each support aperture 145 is also configured to permit the passage of light from the external volume 190 to the respective substrate aperture through the support element.
In this way, the support aperture(s) 115 facilitate or permit the passage of light into the respective substrate aperture(s).
The (optional) cover element 150 is also positioned on the first side 111 of the substrate 110. Here, the cover element 150 is positioned on the support element 140, such that at least part of the support element lies between the support element 140 and the first side 111 of the substrate 110. However, in some embodiments the support element may be omitted or positioned elsewhere (e.g., on the second side 112 of the substrate).
The cover element is configured to cover the substrate aperture(s) 115, e.g., with a solid material. This reduces a risk of foreign material ingress to the substrate aperture and, ultimately, towards the second side 112 of the substrate 110 and the light sensor 120.
To permit the passage of light from the external volume to the substrate aperture(s), the cover element 150 is at least partially transparent, e.g., formed from a transparent/translucent material such as TiCE or SiCE.
In the illustrated example, the light sensor 120 is illustrated to be positioned directly on (i.e., mounted directly to) the second side 112 of the substrate 110. However, this
positioning is not essential. In alternative examples, the sensor may be positioned or mounted to another element on the second side 112 of the substrate, such as the optical element 130. For instance, the light sensor 120 may be positioned on the inner wall 133 of the optical element.
However, it will be appreciated that the positioning of the light sensor and the structure of the overall electronic sensing device is such that the light sensor (e.g., only) receives light from the external volume (i.e., and therefore from the first side of the substrate 110) via the optical element 130.
Figures 2 and 3 provide exploded views of the electronic sensing device 100. As previously explained, the electronic sensing device 100 comprises a substrate 110, an optical element 130, a (optional) support element 140 and a (optional) cover element 150. The electronic sensing device also comprises a light sensor 120 positioned on the substrate, specifically a second side 112 of the substrate.
Although illustrated as separate elements, in practice the support element 140 and the cover element 150 may be provided as a one piece element to support and cover the substrate 110 and the optical element 130.
Further optional features of the electronic sensing device are hereafter described.
As illustrated in Figures 2 and 3, the cross-sectional shape of a substrate aperture 115 (in a plane in which the substrate 110 lies) may be a circular segment. However, this is not essential. Rather, this cross-sectional shape may instead be any appropriate shape, e.g., circular, semi-circular, square, rectangular, oval, triangular and so on.
Where the cross-sectional shape of a substrate aperture 115 (in a plane in which the substrate 110 lies) is a circular segment, in preferred examples the light sensor may be positioned proximate (or closest to) the chord of the circular segment.
In particular, the support element 140 may comprise one or more mounting elements 141 for connecting the electronic sensing device to a surface. This provides a mechanism for securing the electronic sensing device to an external location.
In some examples, the substrate 110 is a printed circuit board carrying one or more electrical components 119 for the electronic sensing device. At least one of the electrical component s) is positioned on the second side 112 (visible in Figure 2) of the substrate 110.
Although the foregoing description has described an electronic sensing device in the context of only a single light sensor, it will be appreciated that electronic sensing device may (as illustrated by Figures 2 and 3) be configured to comprise a plurality of light sensors
120, 121, 122, 123. Each light sensor may, for instance, be configured to generate a respective sensing signal responsive to light received by the respective light sensor.
Where the electronic sensing device comprises a plurality of light sensors, the optical element 130 may be configured to, for each light sensor 120, receive respective first light from the external volume and redirect the respective first light towards the light sensor. Each light sensor and the optical element are configured such that each light sensor (e.g., only) receives light from the external volume via the optical element.
Example approaches for appropriate configuration of a light sensor and optical element are described in this disclosure, and the skilled person would be readily capable of adapting one (or more) of these approaches for defining the passage/guiding of light to each light sensor.
In particular example, the optical element is configured to cover each light sensor such that each light sensor only receives the respective first light.
In particularly preferable examples, for each light sensor, the first light comprises a different part of second light received at the electronic sensing device from the external volume. In this way, each light sensor may be sensitive to different parts of light received at the electronic sensing device. This reduces a risk of crosstalk between different light sensors.
This can be achieved, for instance, by configuring the optical element to have a dedicated light guiding element (e.g., a dedicated optical cavity) for each light sensor. This approach is perhaps best illustrated by Figure 3. An alternative approach is described later.
In the illustrated example of Figures 2 and 3, the substrate comprises one or more substrate apertures spanning from the first side to the second side 112 of the substrate. Each substrate aperture 115 is configured to permit the passage of light LI from the external volume 190 through the substrate 110.
More particularly, in the illustrated example, the substrate aperture 115 is configured to permit the passage of light from the external volume into the optical cavity or optical cavities 331, 332 of the optical element 130.
The optical element 130 is configured to redirect light from the external volume and transmitted through the one or more substrate apertures to each light sensor 120, 121, 122, 123. In the illustrated example, the inner wall 133 bounding the optical cavity 132 redirects (e.g., using scattering) received light towards the light sensor. Suitable approaches for configuring the inner wall 133 to perform the redirection of light have been previously described.
In some examples, any (single) substrate aperture 116 may be configured to permit passage of light therethrough for a plurality of different light sensors 122, 123. The optical element may be configured to receive the transmitted light and distribute the received light to different light sensors. This can be achieved through the use of a different light guiding element (e.g., an optical cavities) for each light sensor 122, 123.
Figure 4 illustrates another view of a proposed optical element 130 for improved contextual understanding. The optical element 130 comprises a respective optical cavity 331, 332 for each light sensor of the electronic sensing device.
An optical cavity is one example of a light guiding element for guiding light received by the optical element to a light sensor. However, any optical cavity 331, 332 may be replaced by another form of light guiding element herein described.
The following description provides detail on some alternative techniques or approaches for configuring an optical element to receive first light from the external volume and redirect the first light towards the light sensor (i.e., alternative light guiding elements). The following description also provides other example techniques and approaches for configuring a light sensor and optical element such that the light sensor (e.g., only) receives light from the external volume via the optical element.
Although such approaches are disclosed in the context of a single light sensor, the skilled person would be readily capable of modifying the elements of the electronic sensing device to employ any one or more of these approaches for use in an electronic sensing device comprising a plurality of light sensors.
Figure 5 illustrates a portion of a proposed electronic sensing device 500 that employs one such alternative approach.
The electronic sensing device 500 again comprises a substrate 110, a light sensor 120, an optical element 130, a (optional) support element 140 and a (optional) cover element. These elements may generally be embodied as previously described, with any variations being hereafter detailed.
In the electronic sensing device 500, the light sensor 120 is positioned near an edge 511 of the substrate 110. Instead of employing a substrate aperture to permit the passage of first light LI from the external volume 190 to the optical cavity 132, the electronic sensing device is configured to permit the passage of light around the edge 511 of the substrate 110.
The optical element is appropriately configured to guide the passage of the first light towards the light sensor, as well as to block the ingress of light outside of the external volume from passing into the optical element. This can be achieved using a waveguiding
passage 531 whose bounds function guide light from the external volume 190, around the edge of the optical cavity and into the optical cavity 132. The waveguiding passage 531 may, for instance, be defined by a gap or space between the edge 511 of the substrate 110 and the optical element. In other words, at least the edge 511 of the substrate 110 and the optical element may at least partially define the bounds of the waveguiding passage.
The function/operation of the optical cavity 132 and the inner wall 133 bounding the optical cavity may be identical/ similar to that previously described. In other words, suitable approaches for configuring the inner wall 133 to perform the redirection of light have been previously described.
In some examples, such as the illustrated embodiment, the support aperture(s) can be omitted. In such approaches, the electronic sensing device is configured to permit the passage of light around the edge 541 of the support element 140. In this way, the edge 541 of the support element 140 may define some of the bounds of the waveguiding passage.
However, in other examples, the support element may comprise a support aperture. The support aperture may be positioned or aligned to permit the passage of light received from the external volume 190 around the edge 541 of the support element (e.g., to the waveguiding passage).
The cover element, if present, may be designed or configured to cover (if present) any support aperture and/or any waveguiding passage 531. This reduces a risk of foreign material ingress towards the second side 112 of the substrate 110.
Figure 6 illustrates a portion of a proposed electronic sensing device 600 that employs an alternative approach.
The electronic sensing device 600 again comprises a substrate 110, a light sensor 120, an optical element 130, a (optional) support element 140 and a (optional) cover element. These elements may generally be embodied as previously described, with any variations being hereafter detailed.
In this approach, the optical element 130 is configured to, instead of an optical cavity bound by an inner wall, comprising a waveguide 631 for guiding received first light (from the external volume) towards the light sensor. The waveguide provides another example of a suitable light guiding element for guiding light received by the optical element to a light sensor, which can be employed in some embodiments.
The waveguide 631 may be formed of any appropriate material, and may guide the transportation of the first light using, for instance, reflection and/or a total internal reflection technique.
Thus, in some examples, the bounds 634 of the waveguide 631 may be defined by a surface coated with reflective material. In other examples, the bounds of the waveguide may be defined by an interface between a first material 632 of the optical element and a second material 633 of the optical element, with total internal reflection principles being exploited to guide the first light LI to the light sensor 120. Thus, the first material and the second material may have different optical properties, particularly different refractive indexes.
Preferably, the waveguide is configured to perform at least some scattering of received light. In some such examples, the bounds of the waveguide may be coated with dispersive, diffusive or scattering particles for scattering received light and/or the first material 632 of the waveguide may suspend such scatting particles. Other suitable approaches for configuring a waveguide to perform scattering of light will be readily apparent to the skilled person.
Examples of suitable light scattering material, from which light scattering particles may be formed include: titanium dioxide, barium sulfate, magnesium oxide, silicon dioxide, aluminum oxide or any combination thereof. Light scattering particles may, for instance, be white in color to achieve good scattering of light.
In the illustrated example, the substrate 110 comprises (at least) one substrate aperture 115. The waveguide 631 is positioned to receive light transmitted through the substrate aperture(s) 115.
Alternatively, the waveguide 631 may be positioned to receive light transmitted around an edge of the substrate aperture. In such approaches, the substrate aperture(s) may be omitted.
In the example illustrated by Figure 6, which employs at least one substrate aperture, the (optional) support element also comprises one or more support apertures. The one or more support apertures are designed for permitting the passage of light to the substrate aperture(s). Thus, each support aperture is aligned with at least one substrate aperture and configured to permit the passage of light from the external volume to the at least one substrate aperture through the support element.
Alternatively, the substrate aperture(s) may be positioned to receive light transmitted around an edge of the support element (if present). In such approaches, the support aperture(s) may be omitted.
In the previously described embodiments, each light guiding element (e.g., optical cavity or waveguide) of the optical element is configured to guide first light to only a
single light sensor. Thus, there is a single (respective) light guiding element for each light sensor. However, this approach is not a requirement of all embodiments.
Figure 7 illustrates a portion of a proposed electronic sensing device 700 that employs an alternative approach.
The electronic sensing device 700 again comprises a substrate 110, an optical element 130, a (optional) support element 140 and a (optional) cover element. These elements may generally be embodied as previously described, with any variations being hereafter detailed.
In this approach, the electronic sensing device 700 comprises a first light sensor
721 and a second light sensor 722, both of which are positioned in a same optical cavity 132 of the optical element 130. Each light sensor 721, 722 may receive (via redirection by the optical element 130) different instances of first light LI A, LIB.
In particularly preferable examples, for each light sensor 721, 722, the first light LI A, LIB comprises a different part of second light received at the electronic sensing device from the external volume. In this way, each light sensor 721, 722 may be sensitive to different parts of light received at the electronic sensing device. More particularly, each light sensor 721,
722 may be more sensitive to light from (i.e., represent) a different space or sub-volume of the external volume 190.
It will be appreciated that the different instances of first light (i.e., the different parts of second light) may effectively represent light coming from different orientations with respect to the electronic sensing device.
Positioning two or more light sensors within a same optical cavity facilitates determination of the distribution of one or more properties of light (e.g., light intensity or light color) in different parts of the external volume by taking into account the position of each light sensor - which indicates which space or sub-volume of the external volume is represented by a sensing signal generated by each light sensor.
Thus, in some embodiments, the electronic sensing device further comprises a sensing arrangement configured to receive the sensing signals generated by the two or more light sensors 721, 722 (positioned in a same optical cavity) and generate spatial information identifying the property of light in different space or sub-volumes of the external volume.
Of course, although only two light sensors are illustrated for the electronic sensing device 700 as being positioned in a same optical cavity, the skilled person will appreciate that any number of light sensors (e.g., three or more) may be positioned within a same optical cavity).
Figure 8 illustrates a portion of another proposed electronic sensing device 800 that employs an alternative approach. Reference is also made to Figure 1.
The electronic sensing device 800 comprises a substrate 110, a light sensor 120, an optical element 130, a (optional) support element 140 and a (optional) cover element 150. These elements may generally be embodied as previously described, with any variations being hereafter detailed.
The electronic sensing device 800 differs from the electronic sensing device 100 described with reference to Figure 1 by virtue of the shape of the optical cavity 132. In particular, rather than the optical cavity taking the shape of a frustum (as in Figure 1), the optical cavity takes the shape of a truncated pyramid in which the truncation plane 811 is not parallel to the base (lying in base plane 812) of the shape. In particular, the truncation plane 812 makes a non-zero angle with respect to the base 812 of the shape. In this way, the optical cavity may effectively be an inclined optical cavity.
More particularly, the truncation plane 812 may be angled such that a point of intersection between the truncation plane 811 and the base plane 812 is more proximate to the light sensor 120 (or the projection of the light sensor on the base plane 812) than the substrate aperture 115.
It has been previously explained how each light sensor may be configured to generate a respective sensing signal responsive to one or more properties (e.g., magnitude or color) of the received first light.
Each sensing signal is thereby able to act as a user input signal, as a user or operator may be able to (at least partially) block at least some light from passing to the light sensor(s), e.g., by placing a finger to block or cover a light input window to the electronic sensing device.
Of course, it is not essential that each sensing signal act as a user input signal. In some examples, the sensing signal simply indicates an ambient light level in an environment in which the electronic sensing device is positioned. This may be advantageous, for instance, for triggering one or more other components (e.g., a light) responsive to an ambient light level meeting certain conditions - e.g., reaching nighttime or daytime - or to control the operation of certain light elements responsive to an ambient light level (e.g., a magnitude of emitted light).
The electronic sensing device 100 may further comprise one or more electronic components that function responsive to the sensing signal(s).
For instance, the electronic sensing device may further comprise a light emitting element configured to emit light; and a control arrangement configured to control one or more properties of light emitted by the light emitting element responsive to the sensing signal.
Figure 9 illustrates one example of a lighting device 900 comprising a light emitting element 910. The lighting device 900 further comprises the feature(s) and any optional feature, of any previously described electronic sensing device. For the sake of illustrative clarity, the position 920 of the portion of the optical element that receives first light from the external volume is indicated.
Although the lighting device 900 having a light emitting element 910 illustrated by Figure 9 takes the form of a desk lamp, embodiments are not limited thereto. For instance, the electronic device may instead take the form of a ceiling light, a plug-in light (such as a night light), a floor lamp, a streetlight and so on.
The lighting device 900 may further comprise a control arrangement (not visible in Figure 9) configured to control one or more properties of light emitted by the light emitting element responsive to the sensing signal.
Where the electronic sensing device comprises a plurality of light sensors, then different sensing signals may indicate a desire for a property to have a particular value and/or be associated with different properties.
By way of example, a sensing signal generated by a first light sensor may indicate a desire to turn on or off the light emitting element. Sensing signals generated by a set of second light sensors may indicate different desired magnitudes for light output by the light emitting element. Sensing signals generated by a set of third light sensors may indicate different desired colors for light output by the light emitting element. Sensing signals generated by a set of fourth light sensors may indicate different desired angles for light output by the light emitting element.
A wide variety of other example properties of light emitted or emittable by a light emitting element, which may be controlled responsive to one or more sensing signals, will be readily apparent to the appropriately skilled person.
Some previously described examples comprise multiple light sensors positioned on the second side of the substrate. In some examples, each light sensor is associated with a different light guiding element (e.g., a different optical cavity). In other examples, each light sensor is associated with a same light guiding element (e.g., a same optical cavity). Of course, a combination of these two approaches may be employed in some embodiments, e.g., there
may be a plurality of light guiding elements of which at least one is associated with multiple light sensors.
In some scenarios, for at least two of the light sensors, the first light (received by each light sensor) comprises a different part of second light received at the electronic sensing device from the external volume. In particular, each instance of first light respectively received by different light sensors may come from a different orientation with respect to the electronic sensing device.
In such scenarios, there is provided an electronic arrangement comprising the electronic sensing device, wherein each light sensor of the electronic sensing device is configured to monitor light received at said light sensor and generate a respective sensing signal responsive to a property of the received light.
The electronic arrangement further comprises one or more further electronic components; and control circuitry configured to: receive each respective sensing signal from each light sensor of the electronic sensing device; process the received sensing signals to determine a measure of a light property in different parts of the external volume; and control the one or more further electronic components responsive to the determined measure of the light property in the different parts of the external volume.
The electronic circuitry may be integrated into the electronic device or provided as a separate element. The light property may be any suitable property of light, such as a light intensity or a light color.
In particular examples, the control circuitry, in processing the sensing signals to determine a measure of the light property in the different parts of the external volume, may be configured to process the sensing signals to determine a measure of the light property for different orientations or angles of incidence (upon the electronic sensing device). In this way, each different part of the external volume may effectively represent a spherical sector or cone.
By way of example, where each further electronic component comprises a light arrangement, the control circuitry may be configured to control an intensity of light emitted by each light arrangement based on a determined light intensity at different orientations or parts of the external volume.
As another example, where each further electronic component comprises a light arrangement, the control circuitry may be configured to control a color of light emitted by each light arrangement based on a determined light color at different orientations or parts of the external volume.
Figure 10 conceptually illustrates an environment in which such approaches can be employed for the sake of improved contextual understanding.
In this scenario, there is an electronic arrangement comprising an electronic sensing device 100 and a light emitting arrangement formed of a plurality of light emitting elements 1001, 1002, 1003.
The control circuitry (here: integrated into the electronic sensing device 100) is configured to determine a measure of light intensity in different parts 1011, 1012 of the external volume. In this scenario, the different parts represent different sectors or ranges of orientation with respect to the electronic sensing device 100. Approaches for performing this procedure have been previously disclosed and would be apparent to the skilled person.
The control circuitry is further configured to control a light intensity of light emitted by each light emitting element 1001, 1002, 1003 responsive to the determined measures of light intensity.
By way of example only, the control circuitry may be configured to control any light emitting elements illuminating a dimmer part of 1012 of the external volume to emit more light than any light emitting elements illuminating a brighter part 1011 of the external volume. Different parts of the external volume may, for instance, be brighter or dimmer as a result of the distribution of natural light within the environment (e.g., from a window 1050) and/or any light from any other artificial source. Thus, in a scenario in which a window 1050 transmits natural light into the environment, the light emitting element(s) closer to the window 1050 may be controlled to be dimmer than any light emitting elements further from the window 1050.
In particular examples, the control circuitry may be configured to control the emission of light emitted by each light emitting element 1001, 1002, 1003 to provide a more uniform distribution of light within the overall environment.
Variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality.
The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
If the term "adapted to" is used in the claims or description, it is noted the term "adapted to" is intended to be equivalent to the term "configured to". If the term "arrangement" is used in the claims or description, it is noted the term "arrangement" is intended to be equivalent to the term "system", and vice versa.
Any reference signs in the claims should not be construed as limiting the scope.
Claims
1. A lighting device (900) comprising: a light emitting element (910) configured to emit light; and an electronic sensing device (100, 500, 600, 700, 800) comprising: a substrate (110) having a first side (111) facing an external volume (190) and a second side (112), opposite the first side, facing away from the external volume; a light sensor (120) positioned on the second side of the substrate; and an optical element (130) configured to receive first light (LI, L1A, LIB) from the external volume and redirect the first light towards the light sensor, wherein the light sensor and the optical element are configured such that the light sensor receives light from the external volume via the optical element, wherein the light sensor is configured to monitor light received at the light sensor and generate a sensing signal, wherein the lighting device (900) further comprises a control arrangement, and the control arrangement configured to control one or more properties of light emitted by the light emitting element (910, 1001, 1003) responsive to the sensing signal.
2. The lighting device of claim 1, wherein: the substrate comprises one or more substrate apertures (115) spanning from the first side to the second side, each substrate aperture being configured to permit the passage of light from the external volume through the substrate; and the optical element is configured to redirect light from the external volume and transmitted through the one or more substrate apertures to the light sensor.
3. The lighting device of claim 2, wherein the electronic sensing device further comprises a support element (140) positioned on the first side of the substrate, wherein: the support element comprises, for the one or more substrate aperture, a corresponding support aperture (145) through the support element; and
the support aperture is aligned with the corresponding one or more substrate apertures and configured to permit the passage of light from the external volume to the corresponding one or more substrate apertures through the support element.
4. The lighting device of claim 3, wherein the support element comprises one or more mounting elements (141) for connecting the electronic sensing device to a surface.
5. The lighting device of any one of claims 2 to 4, wherein the electronic sensing device further comprises a cover element (150) positioned on the first side of the substrate, wherein the cover element is at least partially transparent to permit the passage of light from the external volume to each substrate aperture.
6. The lighting device of any one of claims 1 to 5, wherein the optical element is configured to cover the light sensor such that the light sensor receives the first light.
7. The lighting device of any of claims 1 to 6, wherein the optical element is configured to scatter the first light when redirecting the first light toward the light sensor.
8. The lighting device of any one of claims 1 to 7, wherein: the optical element comprises an optical substrate (131) positioned on the second side of the substrate, the optical substrate comprising an optical cavity (132); and the light sensor is positioned within the optical cavity of the optical substrate.
9. The lighting device of any one of claims 1 to 8, wherein the substrate is a printed circuit board carrying one or more electrical components (119) for the electronic sensing device.
10. The lighting device of claim 9, wherein at least one of the one or more electrical components is positioned on the second side of the printed circuit board.
11. The lighting device of any one of claims 1 to 10, comprising a plurality of light sensors positioned on the second side of the substrate,
wherein the optical element is configured to, for each light sensor, receive respective first light from the external volume and redirect the respective first light towards the light sensor, wherein each light sensor and the optical element are configured such that each light sensor receives light from the external volume via the optical element.
12. The lighting device of claim 11, wherein, for each light sensor, the first light respectively received by different light sensors comes from a different orientation with respect to the electronic sensing device.
13. The lighting device of claim 12, wherein each light sensor of the electronic sensing device is configured to monitor light received at said light sensor and generate a respective sensing signal responsive to a property of the received light: the lighting device comprises one or more further electronic components; and control circuitry configured to: receive each respective sensing signal from each light sensor of the electronic sensing device; process the received sensing signals to determine a measure of a light property in different parts of the external volume; and control the one or more further electronic components responsive to the determined measure of the light property in the different parts of the external volume.
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| CN2024096416 | 2024-05-30 | ||
| CNPCT/CN2024/096416 | 2024-05-30 | ||
| EP24191939.8 | 2024-07-31 | ||
| EP24191939 | 2024-07-31 |
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| WO2025247641A1 true WO2025247641A1 (en) | 2025-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/EP2025/063206 Pending WO2025247641A1 (en) | 2024-05-30 | 2025-05-14 | An electronic device with a light sensor |
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| Country | Link |
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| WO (1) | WO2025247641A1 (en) |
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