WO2025118230A1

WO2025118230A1 - Heat pipe

Info

Publication number: WO2025118230A1
Application number: PCT/CN2023/137062
Authority: WO
Inventors: Songlin Zhou; Linghe Sui
Original assignee: Intel Corp
Current assignee: Intel Corp
Priority date: 2023-12-07
Filing date: 2023-12-07
Publication date: 2025-06-12
Anticipated expiration: 2026-06-07

Abstract

A heat pipe (100A) includes a heat transfer portion (102) having a vapor channel (1022) and a first capillary structure (1024) around the vapor channel (1022) and a liquid reservoir portion (104) connected with the first capillary structure (1024), wherein the liquid reservoir portion (104) has a liquid reservoir structure without the vapor channel (1022), and liquid absorption capacity of the liquid reservoir structure is less than that of the first capillary structure (1024).

Description

HEAT PIPE

Technical Field

Embodiments of the disclosure generally relate to the field of computing and/or device cooling, and more particularly, to a heat pipe with a liquid reservoir.

Background Art

Emerging trends in electronic devices are changing the expected performance and form factor of the electronics devices as they are expected to increase performance and function while having a relatively thin profile. However, the increase in performance and/or function causes an increase in the thermal challenges of the electronic devices. Insufficient cooling can cause a reduction in device performance, a reduction in the lifetime of a device, and delays in data throughput.

Brief Description of the Drawings

To provide a more complete understanding of the present disclosure and features and advantages thereof, reference is made to the following description, taken in conjunction with the accompanying figures, wherein like reference numerals represent like parts, in which:

FIG. 1A is a simplified block diagram of a heat pipe in accordance with some embodiments of the present disclosure.

FIG. 1B is a simplified block diagram of another heat pipe in accordance with some embodiments of the present disclosure.

FIG. 1C is a simplified block diagram of yet another heat pipe in accordance with some embodiments of the present disclosure.

FIG. 1D is a simplified block diagram of still another heat pipe in accordance with some embodiments of the present disclosure.

FIG. 2A is a simplified block diagram of an electronic device configured with the heat pipe shown in FIG. 1A in accordance with some embodiments of the present disclosure.

FIG. 2B is a simplified block diagram of another electronic device configured with the heat pipe shown in FIG. 1B in accordance with some embodiments of the present disclosure.

FIG. 2C is a simplified block diagram of yet another electronic device configured with the heat pipe shown in FIG. 1C in accordance with some embodiments of the present disclosure.

FIG. 2D is a simplified block diagram of yet another electronic device configured with the heat pipe shown in FIG. 1D in accordance with some embodiments of the present disclosure.

Detailed Description of Embodiments

The following detailed description sets forth examples of apparatuses, methods, and systems relating to enabling a heat pipe. Features such as structure (s) , function (s) , and/or characteristic (s) , for example, are described with reference to one embodiment as a matter of convenience; various embodiments may be implemented with any suitable one or more of the described features.

In the following description, various aspects of the illustrative implementations will be described using terms commonly employed by those skilled in the art to convey the substance of their work to others skilled in the art. However, it will be apparent to those skilled in the art that the embodiments disclosed herein may be practiced with only some of the described aspects. For purposes of explanation, specific numbers, materials, and configurations are set forth in order to provide a thorough understanding of the illustrative implementations. However, it will be apparent to one skilled in the art that the embodiments disclosed herein may be practiced without the specific details. In other instances, well-known features are omitted or simplified in order not to obscure the illustrative implementations.

The terms “over” , “under” , “below” , “between” , and “on” as used herein refer to a relative position of one layer or component with respect to other layers or components. For example, one layer or component disposed over or under another layer or component may be directly in contact with the other layer or component or may have one or more intervening layers or components. Moreover, one layer or component disposed between two layers or components may be directly in contact with the two layers or components or may have one or more intervening layers or components. In contrast, a first layer or first component “directly on” a second layer or second component is in direct contact with that second layer or second component. Similarly, unless explicitly stated otherwise, one feature disposed between two features may be in direct contact with the adjacent features or may have one or more intervening layers.

In the following detailed description, reference is made to the accompanying drawings that form a part hereof wherein like numerals designate like parts throughout, and in which is shown, by way of illustration, embodiments that may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. Therefore, the following detailed description is not to be taken in a limiting sense. For the purposes of the present disclosure, the phrase “A and/or B” means (A) , (B) , or (A and B) . For the purposes of the present disclosure, the phrase “A, B, and/or C” means (A) , (B) , (C) , (A and B) , (A and C) , (B and C) , or (A, B, and C) . Reference to “one embodiment” or “an embodiment” in the present disclosure means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. The appearances of the phrase “in one embodiment” or “in an embodiment” are not necessarily all referring to the same embodiment. The appearances of the phrase “for example” , “in an example” , or “in some examples” are not necessarily all referring to the same example.

Furthermore, the term “connected” may be used to describe a direct connection between the things that are connected, without any intermediary devices, while the term “coupled” may be used to describe either a direct connection between the things that are connected, or an indirect connection through one or more intermediary devices. The terms “substantially” , “close” , “approximately” , “near” , and “about” generally refer to being within +/-20%of a target value based on the context of a particular value as described herein or as known in the art. Similarly, terms indicating orientation of various elements, e.g., “coplanar” , “perpendicular” , “orthogonal” , “parallel” , or any other angle between the elements, generally refer to being within +/-5-20%of a target value based on the context of a particular value as described herein or as known in the art.

FIG. 1A is a simplified block diagram of a heat pipe 100A in accordance with some embodiments of the present disclosure. As shown in FIG. 1A, in some embodiments, the heat pipe 100A includes a heat transfer portion 102 having a vapor channel 1022 and a capillary structure 1024 around the vapor channel 1022 and a liquid reservoir portion 104 connected with the capillary structure 1024, wherein the liquid reservoir portion 104 has a liquid reservoir structure without the vapor channel 1022, and liquid absorption capacity of the liquid reservoir structure is less than that of the capillary structure 1024.

As shown in FIG. 1A, in some embodiments, the heat transfer portion 102 includes a heat section, a cool section, and a middle section between the heat section and the cool section, and the liquid reservoir portion 104 is connected to the capillary structure 1024 at the heat section. It should be appreciated that the liquid reservoir portion 104 may also be connected to the capillary structure 1024 at the cool section or the middle section.

FIG. 1B is a simplified block diagram of a heat pipe 100B in accordance with some embodiments of the present disclosure. As shown in FIG. 1A and FIG. 1B, the heat pipe 100B differs from the heat pipe 100A in that the heat pipe 100B includes liquid reservoir pools 104-1 and 104-2 as components of the liquid reservoir portion 104, the liquid reservoir pool 104-1 is connected to the capillary structure 1024 at the hot section, and the liquid reservoir pool 104-2 is connected to the capillary structure 1024 at the cool section. It should be appreciated that the heat pipe 100B may include more than two liquid reservoir pools, which are connected with different parts of the capillary structure 1024, respectively.

FIG. 1C is a simplified block diagram of a heat pipe 100C in accordance with some embodiments of the present disclosure. As shown in FIG. 1A and FIG. 1C, the heat pipe 100C differs from the heat pipe 100A in that the heat pipe 100C includes the liquid reservoir pools 104-1 and 104-2 as components of the liquid reservoir portion 104, the heat transfer portion 102 includes a first cool section, a second cool section and the heat section between the first cool section and the second cool section, the liquid reservoir pool 104-1 is connected to the capillary structure 1024 at the first cool section, and the liquid reservoir pool 104-2 is connected to the capillary structure 1024 at the second cool section. It should be appreciated that the heat pipe 100C may include more than two liquid reservoir pools, which are connected with different parts of the capillary structure 1024, respectively.

FIG. 1D is a simplified block diagram of a heat pipe 100D in accordance with some embodiments of the present disclosure. As shown in FIG. 1A and FIG. 1D, the heat pipe 100D differs from the heat pipe 100A in that the heat pipe 100D includes the liquid reservoir pools 104-1 and 104-2 as components of the liquid reservoir portion 104, the heat transfer portion 102 includes a first heat section, a second heat section and the cool section between the first heat section and the second heat section, the liquid reservoir pool 104-1 is connected to the capillary structure 1024 at the first heat section, and the liquid reservoir pool 104-2 is connected to the capillary structure 1024 at the second heat section. It should be appreciated that the heat pipe 100D may include more than two liquid reservoir pools, which are connected with different parts of the capillary structure 1024, respectively.

In the heat pipe 100A/100B/100C/100D, as the liquid absorption capacity of the liquid reservoir structure of the liquid reservoir portion 104/the liquid reservoir pools 104-1 and 104-2 is less than that of the capillary structure 1024, the capillary structure 1024 has a higher priority to obtain coolant liquid, and the coolant liquid is transferred from the liquid reservoir structure of the liquid reservoir portion 104/the liquid reservoir pools 104-1 and 104-2 to the capillary structure 1024 when the heat transfer portion 102 starts to experience dryout.

In some embodiments, the liquid reservoir portion 104/the liquid reservoir pools 104-1 and 104-2 may be filled with at least two coolant liquids having different boiling points ranging from 0℃ to a predetermined temperature, wherein the predetermined temperature is dependent on a maximum temperature reachable by a heat source, heat generated by which is transferred by the heat pipe 100A/100B/100C/100D. For example, a first coolant liquid with a first boiling point and a second coolant liquid with a second boiling point are filled in the liquid reservoir portion 104/the liquid reservoir pools 104-1 and 104-2, wherein the first boiling point is lower than the second boiling point. When the temperature of the heat source is lower than the second boiling point and higher than the first boiling point, the first coolant liquid is vaporized and liquefied within the heat pipe 100A/100B/100C/100D to transfer the heat generated by the heat source. When the temperature of the heat source is higher than both the first boiling point and the second boiling point, both the first coolant liquid and the second coolant liquid are vaporized and liquefied within the heat pipe 100A/100B to transfer the heat generated by the heat source.

Furthermore, it should be appreciated that the heat pipe 100A/100B/100C/100D may be straight or may be bended into any shape according to practical needs.

FIG. 2A is a simplified block diagram of an electronic device 200A configured with the heat pipe 100A in accordance with some embodiments of the present disclosure. As shown in FIG. 2A, in some embodiments, the electronic device 200A may include the heat pipe 100A, a heatsink 202, and a heat source 204. The heat pipe 100A is configured to help cool the heat source 204 and transfer the heat from the heat source 204 to the heatsink 202. The heatsink 202 is configured to help transfer the heat collected by the heat pipe 100A away from the electronic device 200A (e.g., to the environment around the electronic device 200A) . The heatsink 202 may be a passive cooling device or an active cooling device to help reduce the thermal energy or temperature of the heat source 204. In an example, the heatsink 202 may draw air into the electronic device 200A though one or more inlet vents in a housing or chassis of the electronic device 200A and use the air to help dissipate the heat collected by the heat pipe 100A. The heat source 204 may be one or more heat generating devices (e.g., processor, logic unit, field programmable gate array (FPGA) , chip set, integrated circuit (IC) , a graphics processor, graphics card, battery, memory, or some other type of heat generating device) .

As shown in FIG. 2A, in some embodiments, the heat pipe 100A may be in direct or indirect contact with the heat source 204 and extend to the heatsink 202. For example, the heat section of the heat pipe 100A may be over and/or proximate to the heat source 204, and the cool section of the heat pipe 100A may be connected, coupled, near, or proximate to the heatsink 202.

FIG. 2B is a simplified block diagram of an electronic device 200B configured with the heat pipe 100B in accordance with some embodiments of the present disclosure. As shown in FIG. 2A and FIG. 2B, the electronic device 200B differs from the electronic device 200A in that the electronic device 200B includes the heat pipe 100B instead of the heat pipe 100A, and other specific details of the electronic device 200B are similar as those of the electronic device 200A and thus are not redundantly described.

FIG. 2C is a simplified block diagram of an electronic device 200C configured with the heat pipe 100C in accordance with some embodiments of the present disclosure. As shown in FIG. 2C, in some embodiments, the electronic device 200C may include the heat pipe 100C, one or more heatsinks 202, and one or more heat sources 204, wherein the first cool section and the second cool section of the heat pipe 100C may be connected, coupled, near, or proximate to different heatsinks 202, respectively, and the heat section of the heat pipe 100C may be over and/or proximate to the heat source 204. Other specific details of the electronic device 200C are similar as those of the electronic device 200A and thus are not redundantly described.

FIG. 2D is a simplified block diagram of an electronic device 200D configured with the heat pipe 100D in accordance with some embodiments of the present disclosure. As shown in FIG. FIG. 2D, the electronic device 200D may include the heat pipe 100D, one or more heatsinks 202, and one or more heat sources 204, wherein the first heat section and the second heat section of the heat pipe 100D may be over and/or proximate to different heat sources 204, respectively, and the cool section of the heat pipe 100D may be connected, coupled, near, or proximate to the heatsink 202. Other specific details of the electronic device 200D are similar as those of the electronic device 200A and thus are not redundantly described.

Implementations of the embodiments disclosed herein may be formed or carried out on a substrate, such as a non-semiconductor substrate or a semiconductor substrate. In one implementation, the non-semiconductor substrate may be silicon dioxide, an inter-layer dielectric composed of silicon dioxide, silicon nitride, titanium oxide and other transition metal oxides. Although a few examples of materials from which the non-semiconducting substrate may be formed are described here, any material that may serve as a foundation upon which a non-semiconductor device may be built falls within the spirit and scope of the embodiments disclosed herein.

In another implementation, the semiconductor substrate may be a crystalline substrate formed using a bulk silicon or a silicon-on-insulator substructure. In other implementations, the semiconductor substrate may be formed using alternate materials, which may or may not be combined with silicon, that include but are not limited to germanium, indium antimonide, lead telluride, indium arsenide, indium phosphide, gallium arsenide, indium gallium arsenide, gallium antimonide, or other combinations of group III-V or group IV materials. In other examples, the substrate may be a flexible substrate including 2D materials such as graphene and molybdenum disulphide, organic materials such as pentacene, transparent oxides such as indium gallium zinc oxide poly/amorphous (low temperature of dep) III-V semiconductors and germanium/silicon, and other non-silicon flexible substrates. Although a few examples of materials from which the substrate may be formed are described here, any material that may serve as a foundation upon which a semiconductor device may be built falls within the spirit and scope of the embodiments disclosed herein.

The electronic device 200A/200B/200C/200D may be in communication with cloud services, one or more servers, and/or one or more network elements using a network. In some examples, the electronic device 200A/200B/200C/200D may be standalone devices and not connected to the network or another device.

Elements of FIG. 2B/200C/200D may be coupled to one another through one or more interfaces employing any suitable connections (wired or wireless) , which provide viable pathways for network communications. Additionally, any one or more of these elements of FIG. 2B/200C/200D may be combined or removed from the architecture based on particular configuration needs. The electronic device 200A/200B/200C/200D may also operate in conjunction with a user datagram protocol/IP (UDP/IP) or any other suitable protocol where appropriate and based on particular needs.

Although the present disclosure has been described in detail with reference to particular arrangements and configurations, these example configurations and arrangements may be changed significantly without departing from the scope of the present disclosure. Moreover, certain components may be combined, separated, eliminated, or added based on particular needs and implementations. Additionally, although the heat pipe 100A/100B/100C/100D has been illustrated with reference to particular elements and operations, these elements and operations may be replaced by any suitable architecture, protocols, and/or processes that achieve the intended functionality of the heat pipe 100A/100B/100C/100D.

The following paragraphs describe examples of various embodiments.

Example 1 includes a heat pipe, comprising: a heat transfer portion having a vapor channel and a first capillary structure around the vapor channel; and a liquid reservoir portion connected with the first capillary structure, wherein the liquid reservoir portion has a liquid reservoir structure without the vapor channel, and liquid absorption capacity of the liquid reservoir structure is less than that of the first capillary structure.

Example 2 includes the heat pipe of Example 1, wherein the liquid reservoir portion is filled with at least two coolant liquids.

Example 3 includes the heat pipe of Example 1, wherein the heat transfer portion comprises a heat section, a cool section, and a middle section between the heat section and the cool section, and the liquid reservoir portion is connected to the first capillary structure at the heat section, the cool section, or the middle section.

Example 4 includes the heat pipe of Example 1, wherein the liquid reservoir structure is a second capillary structure different from the first capillary structure in material, surface structure, and/or powder size.

Example 5 includes the heat pipe of Example 1, wherein the liquid reservoir portion comprises at least two liquid reservoir pools, which are connected with different parts of the first capillary structure, respectively.

Example 6 includes the heat pipe of Example 5, wherein the heat transfer portion comprises a heat section and a cool section, and the at least two liquid reservoir pools are connected to the first capillary structure at the cool section or the hot section.

Example 7 includes the heat pipe of Example 2, wherein the at least two coolant liquids have different boiling points ranging from 0℃ to a predetermined temperature.

Example 8 includes the heat pipe of Example 7, wherein the predetermined temperature is dependent on a maximum temperature reachable by a heat source, heat of which is transferred by the heat pipe.

Example 9 includes the heat pipe of Example 2, wherein one or more of the at least two coolant liquids are transferred from the liquid reservoir structure to the first capillary structure when the heat transfer portion starts to experience dryout.

Example 10 includes a device, comprising: a heat source; a heatsink; and a heat pipe in direct or indirect contact with the heat source and extending to the heatsink, wherein the heat pipe comprises: a heat transfer portion having a vapor channel and a first capillary structure around the vapor channel; and a liquid reservoir portion connected with the first capillary structure, wherein the liquid reservoir portion has a liquid reservoir structure without the vapor channel, and liquid absorption capacity of the liquid reservoir structure is less than that of the first capillary structure.

Example 11 includes the device of Example 10, wherein the liquid reservoir portion is filled with at least two coolant liquids.

Example 12 includes the device of Example 10, wherein the heat transfer portion comprises a heat section, a cool section, and a middle section between the heat section and the cool section, and the liquid reservoir portion is connected to the first capillary structure at the heat section, the cool section, or the middle section.

Example 13 includes the device of Example 10, wherein the liquid reservoir structure is a second capillary structure different from the first capillary structure in material, surface structure, and/or powder size.

Example 14 includes the device of Example 10, wherein the liquid reservoir portion comprises at least two liquid reservoir pools, which are connected with different parts of the capillary structure, respectively.

Example 15 includes the device of Example 14, wherein the heat transfer portion comprises a heat section and a cool section, and the at least two liquid reservoir pools are connected to the first capillary structure at the cool section or the hot section.

Example 16 includes the device of Example 11, wherein the at least two coolant liquids have different boiling points ranging from 0℃ to a predetermined temperature.

Example 17 includes the device of Example 16, wherein the predetermined temperature is dependent on a maximum temperature reachable by the heat source.

Example 18 includes the device of Example 11, wherein one or more of the at least two coolant liquids are transferred from the liquid reservoir structure to the first capillary structure when the heat transfer portion starts to experience dryout.

Although certain embodiments have been illustrated and described herein for purposes of description, a wide variety of alternate and/or equivalent embodiments or implementations to achieve the same purposes may be substituted for the embodiments shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the embodiments discussed herein. Therefore, it is manifestly intended that embodiments described herein are limited by the appended claims and the equivalents thereof.

Claims

A heat pipe, comprising:

a heat transfer portion having a vapor channel and a first capillary structure around the vapor channel; and

a liquid reservoir portion connected with the first capillary structure, wherein the liquid reservoir portion has a liquid reservoir structure without the vapor channel, and liquid absorption capacity of the liquid reservoir structure is less than that of the first capillary structure.
The heat pipe of claim 1, wherein the liquid reservoir portion is filled with at least two coolant liquids.
The heat pipe of claim 1, wherein the heat transfer portion comprises a heat section, a cool section, and a middle section between the heat section and the cool section, and the liquid reservoir portion is connected to the first capillary structure at the heat section, the cool section, or the middle section.
The heat pipe of claim 1, wherein the liquid reservoir structure is a second capillary structure different from the first capillary structure in material, surface structure, or powder size.
The heat pipe of claim 1, wherein the liquid reservoir portion comprises at least two liquid reservoir pools, which are connected with different parts of the first capillary structure, respectively.
The heat pipe of claim 5, wherein the heat transfer portion comprises a heat section and a cool section, and the at least two liquid reservoir pools are connected to the first capillary structure at the cool section or the hot section.
The heat pipe of claim 2, wherein the at least two coolant liquids have different boiling points ranging from 0℃ to a predetermined temperature.
The heat pipe of claim 7, wherein the predetermined temperature is dependent on a maximum temperature reachable by a heat source, heat of which is transferred by the heat pipe.
The heat pipe of claim 2, wherein one or more of the at least two coolant liquids are transferred from the liquid reservoir structure to the first capillary structure when the heat transfer portion starts to experience dryout.
A device, comprising:

a heat source;

a heatsink; and

a heat pipe in direct or indirect contact with the heat source and extending to the heatsink, wherein the heat pipe comprises:

a heat transfer portion having a vapor channel and a first capillary structure around the vapor channel; and

a liquid reservoir portion connected with the first capillary structure, wherein the liquid reservoir portion has a liquid reservoir structure without the vapor channel, and liquid absorption capacity of the liquid reservoir structure is less than that of the first capillary structure.
The device of claim 10, wherein the liquid reservoir portion is filled with at least two coolant liquids.
The device of claim 10, wherein the heat transfer portion comprises a heat section, a cool section, and a middle section between the heat section and the cool section, and the liquid reservoir portion is connected to the first capillary structure at the heat section, the cool section, or the middle section.
The device of claim 10, wherein the liquid reservoir structure is a second capillary structure different from the first capillary structure in material, surface structure, or powder size.
The device of claim 10, wherein the liquid reservoir portion comprises at least two liquid reservoir pools, which are connected with different parts of the capillary structure, respectively.
The device of claim 14, wherein the heat transfer portion comprises a heat section and a cool section, and the at least two liquid reservoir pools are connected to the first capillary structure at the cool section or the hot section.
The device of claim 11, wherein the at least two coolant liquids have different boiling points ranging from 0℃ to a predetermined temperature.
The device of claim 16, wherein the predetermined temperature is dependent on a maximum temperature reachable by the heat source.
The device of claim 11, wherein one or more of the at least two coolant liquids are transferred from the liquid reservoir structure to the first capillary structure when the heat transfer portion starts to experience dryout.