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WO2025118145A1 - Method for molding and processing variable capacitor - Google Patents

Method for molding and processing variable capacitor Download PDF

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Publication number
WO2025118145A1
WO2025118145A1 PCT/CN2023/136477 CN2023136477W WO2025118145A1 WO 2025118145 A1 WO2025118145 A1 WO 2025118145A1 CN 2023136477 W CN2023136477 W CN 2023136477W WO 2025118145 A1 WO2025118145 A1 WO 2025118145A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
molding
wall
injection
fixedly connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2023/136477
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French (fr)
Chinese (zh)
Inventor
董加银
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huai'an Yongjie Electronic Technology Co Ltd
Original Assignee
Huai'an Yongjie Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huai'an Yongjie Electronic Technology Co Ltd filed Critical Huai'an Yongjie Electronic Technology Co Ltd
Priority to PCT/CN2023/136477 priority Critical patent/WO2025118145A1/en
Publication of WO2025118145A1 publication Critical patent/WO2025118145A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/02Stamping using rigid devices or tools
    • B21D22/08Stamping using rigid devices or tools with die parts on rotating carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture

Definitions

  • the present invention relates to the technical field of variable capacitors, and in particular to a forming and processing method of a variable capacitor.
  • a variable capacitor is a capacitor whose capacitance can be adjusted within a certain range. When the relative effective area between the pole pieces or the distance between the pole pieces changes, its capacitance changes accordingly. It is usually used as a tuning capacitor in a radio receiving circuit. It is generally composed of two sets of pole pieces that are insulated from each other: a fixed set of pole pieces is called a fixed piece, and a movable set of pole pieces is called a moving piece. The moving pieces of several variable capacitors can be assembled on the same shaft to form a coaxial variable capacitor (commonly known as a double-connected, triple-connected, etc.). Variable capacitors have a long handle that can be equipped with a pull wire or a dial for adjustment.
  • variable capacitor is a capacitor whose capacitance can be adjusted within a certain range. It is usually used as a tuning capacitor in a radio receiving circuit.
  • the shell of the variable capacitor currently used is usually made by machine tool processing, which requires multiple milling processes, and the processing method is relatively cumbersome and the processing efficiency is low.
  • the present invention provides a forming and processing method for a variable capacitor, which solves the problem that the variable capacitor housing currently used is usually made by machine tool processing, which requires multiple milling processes, the processing method is relatively cumbersome, and the processing efficiency is low.
  • a molding method for a variable capacitor comprises the following steps:
  • the molding device comprises a fixed base, the top of the fixed base is rotatably connected to a rotating disk via a rotating table, the top of the rotating disk is provided with a mounting groove, the bottom of the inner wall of the mounting groove is provided with a connecting hole, a molding die is provided inside the mounting groove, and the sides of the fixed base are respectively provided with a material changing device, a spraying device, a material injection device and a cooling device;
  • the forming mold includes a die, a slide groove is provided on one side of the die, an injection hole is provided at the center of the bottom of the inner wall of the die, one end of the slide groove is connected to the top of the side of the injection hole, a cut-off block is slidably connected to the inner wall of the slide groove, an expansion cavity is provided inside the cut-off block, a slide hole is provided at the bottom of one end of the expansion cavity, a push rod is slidably connected to the inner wall of the bottom of the slide hole, plugs are fixedly connected at both ends of the push rod, and a punch is slidably connected to the inner wall of the die.
  • the die When in use, the die is placed inside the installation slot through the material changing device, and then the rotating disk is driven to rotate through the fixed base, and the rotating disk drives the die to move to the bottom of the spraying device, and the release agent is sprayed inside the die through the spraying device box, and then the rotating disk drives the die to move to the position of the injection device, and the injection device injects material into the die, and extends the punch into the die, squeezes the material inside the die and shapes the material inside the die, and then the rotating disk drives the die to move to the position of the cooling device, and the molded part inside the die is cooled by the cooling device.
  • the present invention provides continuous processing with high processing efficiency.
  • a forming die is provided.
  • a slide groove and a cut-off block are provided inside the forming die.
  • the cut-off block While pushing the piston to move outward, the cut-off block is pushed back through the baffle plate so that the cut-off block is inserted into the injection hole. At this time, the cut-off block blocks the injection hole, and the heat expansion medium in the expansion cavity continues to expand, pushing the plug into the injection hole and the communicating hole, so that the material in the injection hole and the communicating hole can be pushed out, which is convenient for cutting off the material between the injection device and the die, making it more convenient for the rotating disk to drive the die to move, and avoiding the adhesion of the material to the bottom of the rotating disk.
  • the die is arranged inside the mounting groove and is slidably connected to the inner wall of the mounting groove, the top of the punch is fixed on the injection device, the end of the inner wall of the expansion cavity away from the sliding hole is slidably connected to a push piston, the push piston, one end of the push piston passes through the expansion cavity and is slidably connected to the cut-off block, and one side of the die is fixedly connected to a top plate that matches the push piston.
  • the expansion cavity is filled with a thermal expansion medium
  • a receiving groove matched with the plug is provided at the bottom of the cut-off block
  • the plug at the bottom of the push rod is matched with the shape of the inner wall of the injection hole
  • the shape of the inner wall of the injection hole is matched with the shape of the connecting hole.
  • the injection device includes an injection base, one side of the injection base is fixedly connected with a bracket, the top of the bracket is fixedly connected with a telescopic rod, the bottom of the telescopic rod is fixedly connected with a positioning seat, a melting cavity is arranged inside the injection base, the top of the melting cavity is connected with a telescopic tube, the bottom of the inner wall of the melting cavity is provided with an extrusion plug, the bottom of the extrusion plug is fixedly connected with a push rod, and an injection device is provided.
  • the telescopic tube When the rotating disk drives the die to move to the position of the injection device, the telescopic tube extends and is inserted into the connecting hole, and the push rod drives the extrusion plug to rise and squeezes the material inside the melting cavity into the die.
  • the telescopic rod drives the positioning seat and the punch at the bottom of the positioning seat to move downward, and the punch is inserted into the die to form a shape and then is withdrawn from the molding material. This facilitates the integration of injection and molding, and improves work efficiency through one-time molding.
  • one side of the injection base is fixedly connected to the side of the fixed base, and the bottom of the positioning seat is fixedly connected to the top of the punch.
  • a heating device is provided inside the melting chamber, and a portion of the melting chamber above the extrusion plug is filled with molten material.
  • the cooling device includes a circulating water tank, the top of one side of the circulating water tank is connected to a water inlet of a circulating water pump, the top of the circulating water tank is connected to a cooling water pipe, a cooling water pump is arranged on the cooling water pipe, the top of the cooling water pipe is connected to a cooling nozzle, a telescopic sleeve is arranged on the outer sleeve of the cooling nozzle, a sealing ring is fixedly connected to the top of the telescopic sleeve, and a cooling device is arranged.
  • the telescopic sleeve When the rotating disk drives the die to move to the position of the cooling device through the injection device, the telescopic sleeve is extended to drive the sealing ring to be tightly attached to the bottom of the rotating disk, and the cooling water pump draws out the cooling water inside the circulating water tank, and sprays it on the rotating disk through the cooling nozzle, so as to cool the rotating disk and the die on the rotating disk, thereby facilitating the rapid cooling and shaping of the molded parts inside the die.
  • one side of the circulating water tank is fixedly connected to the side of the fixed base, the water outlet of the circulating water pump is connected to the external water tank, the bottom of one side of the circulating water tank is connected to the external water tank through a connecting pipe, and the bottom of the cooling water pipe extends to the bottom of the inner wall of the circulating water tank.
  • the present invention provides a forming method of a variable capacitor, which has the following beneficial effects:
  • a molding processing method for a variable capacitor wherein a die is placed inside a mounting groove through a material changing device, and then a rotating disk is driven to rotate through a fixed base, and the rotating disk drives the die to move to the bottom of a spraying device, and a mold release agent is sprayed inside the die through the spraying device, and then the rotating disk drives the die to move to the position of a material injection device, and the injection device injects material into the die, and extends a punch into the die, squeezes the material inside the die and shapes the material inside the die, and then the rotating disk drives the die to move to the position of a cooling device, and the molded part inside the die is cooled by the cooling device.
  • the rotating disk After cooling, the rotating disk drives the die to move to the position of a material changing device, and the die inside the mounting groove is taken out by the material changing device, and then a new die is placed, so that the workpiece can be formed at one time, the processing operation is simple, and continuous processing can be achieved, and the processing efficiency is high.
  • a molding processing method for a variable capacitor comprises a molding die, a slide groove and a cut-off block are arranged inside the molding die, when the injection device injects the molten material into the die, the temperature of the die and the cut-off block rises, the heat expansion medium inside the expansion cavity expands due to the heat, and pushes the piston to move outside the expansion cavity, and pushes the cut-off block back through the baffle plate while pushing the piston to move outward, so that the cut-off block is inserted into the injection hole, at this time, the cut-off block blocks the injection hole, and the heat expansion medium inside the expansion cavity continues to expand, pushing the plug into the injection hole and the connecting hole, so that the material inside the injection hole and the connecting hole can be pushed out, which is convenient for cutting off the material between the injection device and the die, making it more convenient for the rotating disk to drive the die to move, and avoiding the material from sticking to the bottom of the rotating disk.
  • a molding processing method of a variable capacitor is provided with an injection device.
  • the rotating disk drives the die to move to the position of the injection device
  • the telescopic tube is extended and inserted into the connecting hole, and the push rod drives the extrusion plug to rise to squeeze the material in the molten cavity into the die.
  • the telescopic rod drives the positioning seat and the punch at the bottom of the positioning seat to move downward.
  • the punch is inserted into the die to form the shape and then withdrawn from the molding material. This facilitates the integration of injection and molding, and improves work efficiency by one-time molding.
  • a molding processing method of a variable capacitor is provided with a cooling device.
  • the rotating disk drives the die to move to the position of the cooling device through the injection device, the telescopic sleeve is extended to drive the sealing ring to be tightly attached to the bottom of the rotating disk.
  • the cooling water pump draws out the cooling water inside the circulating water tank and sprays it on the rotating disk through the cooling nozzle.
  • the rotating disk and the die on the rotating disk can be cooled, which facilitates the rapid cooling and shaping of the molded part inside the die.
  • Fig. 1 is a flowchart of the present invention
  • Fig. 2 is a schematic diagram of the structure of the present invention.
  • FIG3 is a schematic diagram of the structure of a forming die according to the present invention.
  • FIG4 is a schematic structural diagram of the injection device of the present invention.
  • FIG5 is a schematic diagram of the internal structure of the injection device of the present invention.
  • FIG. 6 is a schematic diagram of the structure of the cooling device of the present invention.
  • the present invention provides a molding method for a variable capacitor, comprising the following steps:
  • a molding method of a variable capacitor wherein a molding device comprises a fixed base 1, a rotating disk 2 is rotatably connected to the top of the fixed base 1 through a rotating table, a mounting groove 3 is arranged on the top of the rotating disk 2, a connecting hole 4 is opened at the bottom of the inner wall of the mounting groove 3, a molding die 5 is arranged inside the mounting groove 3, and a material changing device 6, a spraying device 7, a material injection device 8 and a cooling device 9 are respectively arranged on the side of the fixed base 1;
  • the forming mold 5 includes a die 51, a slide groove 52 is provided on one side of the die 51, an injection hole 53 is provided at the center of the bottom of the inner wall of the die 51, one end of the slide groove 52 is connected to the top of the side of the injection hole 53, a cut-off block 54 is slidably connected to the inner wall of the slide groove 52, an expansion cavity 55 is provided inside the cut-off block 54, a slide hole 56 is provided at the bottom of one end of the expansion cavity 55, a push rod 57 is slidably connected to the inner wall of the bottom of the slide hole 56, plugs 58 are fixedly connected at both ends of the push rod 57, and a punch 59 is slidably connected to the inner wall of the die 51.
  • the die 51 is arranged inside the mounting groove 3 and is slidably connected to the inner wall of the mounting groove 3.
  • the top of the punch 59 is fixed on the injection device 8.
  • the end of the inner wall of the expansion cavity 55 away from the sliding hole 56 is slidably connected with a push piston 50.
  • the push piston 50 has one end that penetrates the expansion cavity 55 and is slidably connected to the cut-off block 54.
  • One side of the die 51 is fixedly connected to a top plate that matches the push piston 50.
  • the expansion cavity 55 is filled with a heat expansion medium, a receiving groove matched with the plug 58 is provided at the bottom of the cut-off block 54, the plug 58 at the bottom of the push rod 57 is matched with the shape of the inner wall of the injection hole 53, and the shape of the inner wall of the injection hole 53 is matched with the shape of the connecting hole 4.
  • the die 51 When in use, the die 51 is placed inside the mounting groove 3 through the material changing device 6, and then the rotating disk 2 is driven to rotate through the fixed base 1, and the rotating disk 2 drives the die 51 to move to the bottom of the spraying device 7, and the release agent is sprayed inside the die 51 through the spraying device 7, and then the rotating disk 2 drives the die 51 to move to the position of the injection device 8, and the injection device 8 injects material into the die 51, and extends the punch 59 into the die 51, squeezes the material inside the die 51 and shapes the material inside the die 51, and then the rotating disk 2 drives the die 51 to move to the position of the cooling device 9, and the molded part inside the die 51 is cooled by the cooling device 9.
  • the rotating disk 2 drives the die 51 to move to the position of the material changing device 6, and the die 51 inside the mounting groove 3 is taken out by the material changing device 6, and then a new die 51 is placed, which is convenient for the workpiece to be formed at one time, the processing operation is simple, and continuous Continuous processing has high processing efficiency.
  • a forming mold 5 is provided.
  • a slide groove 52 and a cut-off block 54 are provided inside the forming mold 5.
  • the cut-off block 54 While pushing the piston 50 to move outward, the cut-off block 54 is pushed back through the baffle plate so that the cut-off block 54 is inserted into the injection hole 53. At this time, the cut-off block 54 blocks the injection hole 53, and the heat expansion medium in the expansion cavity 55 continues to expand, pushing the plug 58 into the injection hole 53 and the connecting hole 4, so that the material inside the injection hole 53 and the connecting hole 4 can be pushed out, which is convenient for cutting off the material between the injection device 8 and the die 51, making it more convenient for the rotating disk 2 to drive the die 51 to move, and avoiding the adhesion of the material to the bottom of the rotating disk 2.
  • the injection device 8 includes an injection base 81, one side of the injection base 81 is fixedly connected to a bracket 82, the top of the bracket 82 is fixedly connected to a telescopic rod 83, the bottom of the telescopic rod 83 is fixedly connected to a positioning seat 84, a melting cavity 85 is arranged inside the injection base 81, the top of the melting cavity 85 is connected to a telescopic tube 86, an extrusion plug 87 is arranged at the bottom of the inner wall of the melting cavity 85, and a push rod 88 is fixedly connected to the bottom of the extrusion plug 87, one side of the injection base 81 is fixedly connected to the side of the fixed base 1, the bottom of the positioning seat 84 is fixedly connected to the top of the punch 59, and the melting cavity 85 is provided with a melting cavity 85.
  • the telescopic tube 86 drives the extrusion plug 87 to rise to squeeze the material inside the melting cavity 85 into the female mold 51.
  • the telescopic rod 83 drives the positioning seat 84 and the male mold 59 at the bottom of the positioning seat 84 to move downward, and the male mold 59 is inserted into the female mold 51 for molding and then withdrawn from the molding material. It is convenient to integrate the injection and molding together, and the one-time molding improves the work efficiency.
  • the cooling device 9 includes a circulating water tank 91, the top of one side of the circulating water tank 91 is connected to the water inlet of the circulating water pump 92, the top of the circulating water tank 91 is connected to the cooling water pipe 93, the cooling water pipe 93 is provided with a cooling water pump 94, the top of the cooling water pipe 93 is connected to a cooling nozzle 95, the outer sleeve of the cooling nozzle 95 is provided with a telescopic sleeve 96, the top of the telescopic sleeve 96 is fixedly connected to a sealing ring 97, one side of the circulating water tank 91 is fixedly connected to the side of the fixed base 1, and the water outlet of the circulating water pump 92 is connected to the cooling water pipe 93.
  • a cooling device 9 is provided.
  • the rotating disk 2 drives the die 51 to move to the position of the cooling device 9 through the injection device 8
  • the telescopic sleeve 96 extends and drives the sealing ring 97 to fit tightly under the rotating disk 2.
  • the cooling water pump 92 draws out the cooling water from the inside of the circulating water tank 91 and sprays it on the rotating disk 2 through the cooling nozzle 95.
  • the rotating disk 2 and the die 51 on the rotating disk 2 can be cooled, which facilitates the rapid cooling and shaping of the molded parts inside the die 51.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

A method for molding and processing a variable capacitor, the method comprising the following steps: feeding a molten material into a molding apparatus, molding a housing of a capacitor by means of the molding apparatus, and removing the molded housing from the molding apparatus; mounting a semiconductor substrate inside the molded housing, forming a first well of a first conductivity type in a first region of the semiconductor substrate, and then forming a second well of a second conductivity type in a second region adjacent to the first region of the semiconductor substrate; and forming a first insulating film above the first region and the second region of the semiconductor substrate, and forming a gate electrode above the first insulating film of the first region, wherein the molding apparatus comprises a fixing base. By using the method for molding and processing a variable capacitor, a workpiece can be conveniently molded in one step, the processing operation is simple, continuous processing can be achieved, and the processing efficiency is high.

Description

一种可变电容器的成型加工方法A forming method for a variable capacitor 技术领域Technical Field

本发明涉及可变电容器技术领域,具体为一种可变电容器的成型加工方法。The present invention relates to the technical field of variable capacitors, and in particular to a forming and processing method of a variable capacitor.

背景技术Background Art

可变电容器是一种电容量可以在一定范围内调节的电容器,通过改变极片间相对的有效面积或片间距离改变时,它的电容量就相应地变化,通常在无线电接收电路中作调谐电容器用,一般由相互绝缘的两组极片组成:固定不动的一组极片称为定片,可动的一组极片称为动片,几只可变电容器的动片可合装在同一转轴上,组成同轴可变的电容器(俗称双联、三联等),可变电容器都有一个长柄,可装上拉线或拨盘调节,外形如图:可变电容器一种电容量可以在一定范围内调节的电容器,通常在无线电接收电路中作调谐电容器用。目前使用的可变电容器外壳通常使用机床加工的方式制成,这种方式需要经过多次铣削,加工方式比较繁琐,加工效率较低。A variable capacitor is a capacitor whose capacitance can be adjusted within a certain range. When the relative effective area between the pole pieces or the distance between the pole pieces changes, its capacitance changes accordingly. It is usually used as a tuning capacitor in a radio receiving circuit. It is generally composed of two sets of pole pieces that are insulated from each other: a fixed set of pole pieces is called a fixed piece, and a movable set of pole pieces is called a moving piece. The moving pieces of several variable capacitors can be assembled on the same shaft to form a coaxial variable capacitor (commonly known as a double-connected, triple-connected, etc.). Variable capacitors have a long handle that can be equipped with a pull wire or a dial for adjustment. The appearance is shown in the figure: A variable capacitor is a capacitor whose capacitance can be adjusted within a certain range. It is usually used as a tuning capacitor in a radio receiving circuit. The shell of the variable capacitor currently used is usually made by machine tool processing, which requires multiple milling processes, and the processing method is relatively cumbersome and the processing efficiency is low.

技术问题Technical issues

针对现有技术的不足,本发明提供了一种可变电容器的成型加工方法,解决了目前使用的可变电容器外壳通常使用机床加工的方式制成,这种方式需要经过多次铣削,加工方式比较繁琐,加工效率较低的问题。In view of the shortcomings of the prior art, the present invention provides a forming and processing method for a variable capacitor, which solves the problem that the variable capacitor housing currently used is usually made by machine tool processing, which requires multiple milling processes, the processing method is relatively cumbersome, and the processing efficiency is low.

技术解决方案Technical Solutions

为实现以上目的,本发明通过以下技术方案予以实现:一种可变电容器的成型加工方法,包括以下步骤:To achieve the above objectives, the present invention is implemented through the following technical solutions: A molding method for a variable capacitor comprises the following steps:

S1、将熔融物料送入成型装置内部,通过成型装置对电容器的外壳进行成型,并将成型后的外壳从成型装置上取下;S1, feeding the molten material into the molding device, molding the shell of the capacitor through the molding device, and removing the molded shell from the molding device;

S2、将半导体衬底安装在成型外壳内部,在半导体衬底的第一区域中形成第一导电类型的第一阱,然后在与该半导体衬底的该第一区域相邻的第二区域中形成第二导电类型的第二阱;S2, installing the semiconductor substrate inside the molded housing, forming a first well of a first conductivity type in a first region of the semiconductor substrate, and then forming a second well of a second conductivity type in a second region adjacent to the first region of the semiconductor substrate;

S3、在该半导体衬底的该第一区域和该第二区域上方形成第一绝缘膜,在该第一区域的该第一绝缘膜上方形成栅极。S3. Form a first insulating film over the first region and the second region of the semiconductor substrate, and form a gate over the first insulating film in the first region.

优选的,所述成型装置包括固定底座,所述固定底座顶部通过旋转台转动连接有转动盘,所述转动盘顶部设置有安装槽,所述安装槽内壁底部开设有连通孔,所述安装槽内部设置有成型模,所述固定底座侧面分别设置有换料装置、喷涂装置、注料装置和冷却装置;Preferably, the molding device comprises a fixed base, the top of the fixed base is rotatably connected to a rotating disk via a rotating table, the top of the rotating disk is provided with a mounting groove, the bottom of the inner wall of the mounting groove is provided with a connecting hole, a molding die is provided inside the mounting groove, and the sides of the fixed base are respectively provided with a material changing device, a spraying device, a material injection device and a cooling device;

所述成型模包括凹模,所述凹模一侧开设有滑槽,所述凹模内壁底部中心位置开设有注料孔,所述滑槽一端与注料孔侧面顶部连通,所述滑槽内壁滑动连接有截断挡块,所述截断挡块内部开设有膨胀空腔,所述膨胀空腔一端底部开设有滑孔,所述滑孔底部内壁滑动连接有顶杆,所述顶杆两端均固定连接有堵头塞,所述凹模内壁滑动连接有凸模。The forming mold includes a die, a slide groove is provided on one side of the die, an injection hole is provided at the center of the bottom of the inner wall of the die, one end of the slide groove is connected to the top of the side of the injection hole, a cut-off block is slidably connected to the inner wall of the slide groove, an expansion cavity is provided inside the cut-off block, a slide hole is provided at the bottom of one end of the expansion cavity, a push rod is slidably connected to the inner wall of the bottom of the slide hole, plugs are fixedly connected at both ends of the push rod, and a punch is slidably connected to the inner wall of the die.

使用时通过换料装置将凹模放置到安装槽内部,然后通过固定底座带动转动盘转动,转动盘带动凹模移动至喷涂装置下方,通过喷涂装置箱凹模内部喷涂脱模剂,然后转动盘带动凹模移动至注料装置的位置,注料装置向凹模内部注料,并将凸模伸入凹模内部,挤压凹模内部的物料并使凹模内部的物料成型,然后转动盘带动凹模移动至冷却装置的位置,通过冷却装置对凹模内部的成型件进行冷却,冷却结束之后,转动盘带动凹模移动至换料装置的位置,通过换料装置将安装槽内部凹模取出,然后放上新的凹模即可,方便工件能够一次成型,加工操作简单,并且能够实现连续加工,加工效率较高,设置有成型模,成型模内部设置有滑槽和截断挡块,当注料装置将熔融物料注入凹模内部时,凹模和截断挡块的温度升高,膨胀空腔内部的热膨胀介质受热膨胀,推动推动活塞向膨胀空腔外部移动,推动活塞向外侧移动的同时通过挡板反推截断挡块,使得截断挡块插入注料孔内部,此时截断挡块将注料孔堵住,膨胀空腔内部的热膨胀介质继续膨胀,推动堵头塞进入注料孔和连通孔内部,即可将注料孔和连通孔内部的物料推出,方便将注料装置与凹模之间的物料截断,使转动盘带动凹模移动更加方便,避免物料黏连导致粘附在转动盘底部。When in use, the die is placed inside the installation slot through the material changing device, and then the rotating disk is driven to rotate through the fixed base, and the rotating disk drives the die to move to the bottom of the spraying device, and the release agent is sprayed inside the die through the spraying device box, and then the rotating disk drives the die to move to the position of the injection device, and the injection device injects material into the die, and extends the punch into the die, squeezes the material inside the die and shapes the material inside the die, and then the rotating disk drives the die to move to the position of the cooling device, and the molded part inside the die is cooled by the cooling device. After cooling, the rotating disk drives the die to move to the position of the material changing device, and the die inside the installation slot is taken out by the material changing device, and then a new die is placed, which is convenient for the workpiece to be formed at one time, and the processing operation is simple and can be realized The present invention provides continuous processing with high processing efficiency. A forming die is provided. A slide groove and a cut-off block are provided inside the forming die. When the injection device injects the molten material into the die, the temperature of the die and the cut-off block rises, and the heat expansion medium in the expansion cavity expands due to the heat, pushing the piston to move outside the expansion cavity. While pushing the piston to move outward, the cut-off block is pushed back through the baffle plate so that the cut-off block is inserted into the injection hole. At this time, the cut-off block blocks the injection hole, and the heat expansion medium in the expansion cavity continues to expand, pushing the plug into the injection hole and the communicating hole, so that the material in the injection hole and the communicating hole can be pushed out, which is convenient for cutting off the material between the injection device and the die, making it more convenient for the rotating disk to drive the die to move, and avoiding the adhesion of the material to the bottom of the rotating disk.

优选的,所述凹模设置在安装槽内部并与安装槽内壁滑动连接,所述凸模顶部固定在注料装置上,所述膨胀空腔内壁远离滑孔的一端滑动连接有推动活塞,所述推动活塞,所述推动活塞一端贯穿膨胀空腔并与截断挡块滑动连接,所述凹模一侧固定连接有与推动活塞相适配的顶板。Preferably, the die is arranged inside the mounting groove and is slidably connected to the inner wall of the mounting groove, the top of the punch is fixed on the injection device, the end of the inner wall of the expansion cavity away from the sliding hole is slidably connected to a push piston, the push piston, one end of the push piston passes through the expansion cavity and is slidably connected to the cut-off block, and one side of the die is fixedly connected to a top plate that matches the push piston.

优选的,所述膨胀空腔内部填充有热膨胀介质,所述截断挡块底部开设有与堵头塞相适配的收纳槽,所述顶杆底部的堵头塞与注料孔内壁的形状相适配,所述注料孔内壁的形状与连通孔的形状相适配。Preferably, the expansion cavity is filled with a thermal expansion medium, a receiving groove matched with the plug is provided at the bottom of the cut-off block, the plug at the bottom of the push rod is matched with the shape of the inner wall of the injection hole, and the shape of the inner wall of the injection hole is matched with the shape of the connecting hole.

优选的,所述注料装置包括注料基座,所述注料基座一侧固定连接有支架,所述支架顶部固定连接有伸缩杆,所述伸缩杆底部固定连接有定位座,所述注料基座内部设置有熔融腔,所述熔融腔顶部连通有伸缩管,所述熔融腔内壁底部设置有挤压塞,所述挤压塞底部固定连接有推杆,设置有注料装置,当转动盘带动凹模移动至注料装置的位置时,伸缩管伸长并插入连通孔内部,推杆带动挤压塞上升将熔融腔内部的物料挤压至凹模内部,当注料完成之后,伸缩杆带动定位座及定位座底部的凸模向下移动,凸模插入凹模内部成型之后再从成型物料内部抽出即可,方便将注料与成型集成在一起,一次成型提高工作效率。Preferably, the injection device includes an injection base, one side of the injection base is fixedly connected with a bracket, the top of the bracket is fixedly connected with a telescopic rod, the bottom of the telescopic rod is fixedly connected with a positioning seat, a melting cavity is arranged inside the injection base, the top of the melting cavity is connected with a telescopic tube, the bottom of the inner wall of the melting cavity is provided with an extrusion plug, the bottom of the extrusion plug is fixedly connected with a push rod, and an injection device is provided. When the rotating disk drives the die to move to the position of the injection device, the telescopic tube extends and is inserted into the connecting hole, and the push rod drives the extrusion plug to rise and squeezes the material inside the melting cavity into the die. When the injection is completed, the telescopic rod drives the positioning seat and the punch at the bottom of the positioning seat to move downward, and the punch is inserted into the die to form a shape and then is withdrawn from the molding material. This facilitates the integration of injection and molding, and improves work efficiency through one-time molding.

优选的,所述注料基座一侧与固定底座侧面固定连接,所述定位座底部与凸模顶部固定连接。Preferably, one side of the injection base is fixedly connected to the side of the fixed base, and the bottom of the positioning seat is fixedly connected to the top of the punch.

优选的,所述熔融腔内部设置有加热装置,所述熔融腔内部位于挤压塞上方的部分填充有熔融物料。Preferably, a heating device is provided inside the melting chamber, and a portion of the melting chamber above the extrusion plug is filled with molten material.

优选的,所述冷却装置包括循环水箱,所述循环水箱一侧顶部连通有循环水泵的进水口,所述循环水箱顶部连通有冷却水管,所述冷却水管上设置有冷却水泵,所述冷却水管顶部连通有冷却喷头,所述冷却喷头外部套设有伸缩套管,所述伸缩套管顶部固定连接有密封圈,设置有冷却装置,当转动盘带动凹模经过注料装置移动至冷却装置的位置时,伸缩套管伸长带动密封圈贴紧在转动盘下方,冷却水泵将循环水箱内部的冷却水抽出,通过冷却喷头喷在转动盘上,即可对转动盘及转动盘上的凹模进行冷却,方便凹模内部的成型件快速冷却定型。Preferably, the cooling device includes a circulating water tank, the top of one side of the circulating water tank is connected to a water inlet of a circulating water pump, the top of the circulating water tank is connected to a cooling water pipe, a cooling water pump is arranged on the cooling water pipe, the top of the cooling water pipe is connected to a cooling nozzle, a telescopic sleeve is arranged on the outer sleeve of the cooling nozzle, a sealing ring is fixedly connected to the top of the telescopic sleeve, and a cooling device is arranged. When the rotating disk drives the die to move to the position of the cooling device through the injection device, the telescopic sleeve is extended to drive the sealing ring to be tightly attached to the bottom of the rotating disk, and the cooling water pump draws out the cooling water inside the circulating water tank, and sprays it on the rotating disk through the cooling nozzle, so as to cool the rotating disk and the die on the rotating disk, thereby facilitating the rapid cooling and shaping of the molded parts inside the die.

优选的,所述循环水箱一侧与固定底座侧面固定连接,所述循环水泵的出水口与外部水箱连通,所述循环水箱一侧底部通过连通管与外部水箱连通,所述冷却水管底部延伸至循环水箱内壁底部。Preferably, one side of the circulating water tank is fixedly connected to the side of the fixed base, the water outlet of the circulating water pump is connected to the external water tank, the bottom of one side of the circulating water tank is connected to the external water tank through a connecting pipe, and the bottom of the cooling water pipe extends to the bottom of the inner wall of the circulating water tank.

有益效果Beneficial Effects

本发明提供了一种可变电容器的成型加工方法。具备以下有益效果:The present invention provides a forming method of a variable capacitor, which has the following beneficial effects:

(一)、该一种可变电容器的成型加工方法,通过换料装置将凹模放置到安装槽内部,然后通过固定底座带动转动盘转动,转动盘带动凹模移动至喷涂装置下方,通过喷涂装置箱凹模内部喷涂脱模剂,然后转动盘带动凹模移动至注料装置的位置,注料装置向凹模内部注料,并将凸模伸入凹模内部,挤压凹模内部的物料并使凹模内部的物料成型,然后转动盘带动凹模移动至冷却装置的位置,通过冷却装置对凹模内部的成型件进行冷却,冷却结束之后,转动盘带动凹模移动至换料装置的位置,通过换料装置将安装槽内部凹模取出,然后放上新的凹模即可,方便工件能够一次成型,加工操作简单,并且能够实现连续加工,加工效率较高。(I) A molding processing method for a variable capacitor, wherein a die is placed inside a mounting groove through a material changing device, and then a rotating disk is driven to rotate through a fixed base, and the rotating disk drives the die to move to the bottom of a spraying device, and a mold release agent is sprayed inside the die through the spraying device, and then the rotating disk drives the die to move to the position of a material injection device, and the injection device injects material into the die, and extends a punch into the die, squeezes the material inside the die and shapes the material inside the die, and then the rotating disk drives the die to move to the position of a cooling device, and the molded part inside the die is cooled by the cooling device. After cooling, the rotating disk drives the die to move to the position of a material changing device, and the die inside the mounting groove is taken out by the material changing device, and then a new die is placed, so that the workpiece can be formed at one time, the processing operation is simple, and continuous processing can be achieved, and the processing efficiency is high.

(二)、该一种可变电容器的成型加工方法,设置有成型模,成型模内部设置有滑槽和截断挡块,当注料装置将熔融物料注入凹模内部时,凹模和截断挡块的温度升高,膨胀空腔内部的热膨胀介质受热膨胀,推动推动活塞向膨胀空腔外部移动,推动活塞向外侧移动的同时通过挡板反推截断挡块,使得截断挡块插入注料孔内部,此时截断挡块将注料孔堵住,膨胀空腔内部的热膨胀介质继续膨胀,推动堵头塞进入注料孔和连通孔内部,即可将注料孔和连通孔内部的物料推出,方便将注料装置与凹模之间的物料截断,使转动盘带动凹模移动更加方便,避免物料黏连导致粘附在转动盘底部。(ii) A molding processing method for a variable capacitor comprises a molding die, a slide groove and a cut-off block are arranged inside the molding die, when the injection device injects the molten material into the die, the temperature of the die and the cut-off block rises, the heat expansion medium inside the expansion cavity expands due to the heat, and pushes the piston to move outside the expansion cavity, and pushes the cut-off block back through the baffle plate while pushing the piston to move outward, so that the cut-off block is inserted into the injection hole, at this time, the cut-off block blocks the injection hole, and the heat expansion medium inside the expansion cavity continues to expand, pushing the plug into the injection hole and the connecting hole, so that the material inside the injection hole and the connecting hole can be pushed out, which is convenient for cutting off the material between the injection device and the die, making it more convenient for the rotating disk to drive the die to move, and avoiding the material from sticking to the bottom of the rotating disk.

(三)、该一种可变电容器的成型加工方法,设置有注料装置,当转动盘带动凹模移动至注料装置的位置时,伸缩管伸长并插入连通孔内部,推杆带动挤压塞上升将熔融腔内部的物料挤压至凹模内部,当注料完成之后,伸缩杆带动定位座及定位座底部的凸模向下移动,凸模插入凹模内部成型之后再从成型物料内部抽出即可,方便将注料与成型集成在一起,一次成型提高工作效率。(III) A molding processing method of a variable capacitor is provided with an injection device. When the rotating disk drives the die to move to the position of the injection device, the telescopic tube is extended and inserted into the connecting hole, and the push rod drives the extrusion plug to rise to squeeze the material in the molten cavity into the die. When the injection is completed, the telescopic rod drives the positioning seat and the punch at the bottom of the positioning seat to move downward. The punch is inserted into the die to form the shape and then withdrawn from the molding material. This facilitates the integration of injection and molding, and improves work efficiency by one-time molding.

(四)、该一种可变电容器的成型加工方法,设置有冷却装置,当转动盘带动凹模经过注料装置移动至冷却装置的位置时,伸缩套管伸长带动密封圈贴紧在转动盘下方,冷却水泵将循环水箱内部的冷却水抽出,通过冷却喷头喷在转动盘上,即可对转动盘及转动盘上的凹模进行冷却,方便凹模内部的成型件快速冷却定型。(IV) A molding processing method of a variable capacitor is provided with a cooling device. When the rotating disk drives the die to move to the position of the cooling device through the injection device, the telescopic sleeve is extended to drive the sealing ring to be tightly attached to the bottom of the rotating disk. The cooling water pump draws out the cooling water inside the circulating water tank and sprays it on the rotating disk through the cooling nozzle. The rotating disk and the die on the rotating disk can be cooled, which facilitates the rapid cooling and shaping of the molded part inside the die.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1为本发明流程框图;Fig. 1 is a flowchart of the present invention;

图2为本发明结构示意图;Fig. 2 is a schematic diagram of the structure of the present invention;

图3为本发明成形模结构示意图;FIG3 is a schematic diagram of the structure of a forming die according to the present invention;

图4为本发明注料装置结构示意图;FIG4 is a schematic structural diagram of the injection device of the present invention;

图5为本发明注料装置内部结构示意图;FIG5 is a schematic diagram of the internal structure of the injection device of the present invention;

图6为本发明冷却装置结构示意图。FIG. 6 is a schematic diagram of the structure of the cooling device of the present invention.

图中:1、固定底座;2、转动盘;3、安装槽;4、连通孔;5、成型模;51、凹模;52、滑槽;53、注料孔;54、截断挡块;55、膨胀空腔;56、滑孔;57、顶杆;58、堵头塞;59、凸模;50、推动活塞;6、换料装置;7、喷涂装置;8、注料装置;81、注料基座;82、支架;83、伸缩杆;84、定位座;85、熔融腔;86、伸缩管;87、挤压塞;88、推杆;9、冷却装置;91、循环水箱;92、循环水泵;93、冷却水管;94、冷却水泵;95、冷却喷头;96、伸缩套管;97、密封圈。In the figure: 1. fixed base; 2. rotating disk; 3. mounting groove; 4. connecting hole; 5. forming mold; 51. concave mold; 52. slide groove; 53. injection hole; 54. cut-off block; 55. expansion cavity; 56. slide hole; 57. ejector rod; 58. plug; 59. punch; 50. push piston; 6. material changing device; 7. spraying device; 8. injection device; 81. injection base; 82. bracket; 83. telescopic rod; 84. positioning seat; 85. melting cavity; 86. telescopic tube; 87. extrusion plug; 88. push rod; 9. cooling device; 91. circulating water tank; 92. circulating water pump; 93. cooling water pipe; 94. cooling water pump; 95. cooling nozzle; 96. telescopic sleeve; 97. sealing ring.

本发明的实施方式Embodiments of the present invention

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

实施例一:Embodiment 1:

请参阅图1,本发明提供一种可变电容器的成型加工方法,包括以下步骤:Referring to FIG. 1 , the present invention provides a molding method for a variable capacitor, comprising the following steps:

S1、将熔融物料送入成型装置内部,通过成型装置对电容器的外壳进行成型,并将成型后的外壳从成型装置上取下;S1, feeding the molten material into the molding device, molding the shell of the capacitor through the molding device, and removing the molded shell from the molding device;

S2、将半导体衬底安装在成型外壳内部,在半导体衬底的第一区域中形成第一导电类型的第一阱,然后在与该半导体衬底的该第一区域相邻的第二区域中形成第二导电类型的第二阱;S2, installing the semiconductor substrate inside the molded housing, forming a first well of a first conductivity type in a first region of the semiconductor substrate, and then forming a second well of a second conductivity type in a second region adjacent to the first region of the semiconductor substrate;

S3、在该半导体衬底的该第一区域和该第二区域上方形成第一绝缘膜,在该第一区域的该第一绝缘膜上方形成栅极。S3. Form a first insulating film over the first region and the second region of the semiconductor substrate, and form a gate over the first insulating film in the first region.

实施例二:Embodiment 2:

请参阅图1-4,在实施例一的基础上本发明提供一种技术方案:一种可变电容器的成型加工方法,成型装置包括固定底座1,固定底座1顶部通过旋转台转动连接有转动盘2,转动盘2顶部设置有安装槽3,安装槽3内壁底部开设有连通孔4,安装槽3内部设置有成型模5,固定底座1侧面分别设置有换料装置6、喷涂装置7、注料装置8和冷却装置9;Referring to FIGS. 1-4 , the present invention provides a technical solution based on the first embodiment: a molding method of a variable capacitor, wherein a molding device comprises a fixed base 1, a rotating disk 2 is rotatably connected to the top of the fixed base 1 through a rotating table, a mounting groove 3 is arranged on the top of the rotating disk 2, a connecting hole 4 is opened at the bottom of the inner wall of the mounting groove 3, a molding die 5 is arranged inside the mounting groove 3, and a material changing device 6, a spraying device 7, a material injection device 8 and a cooling device 9 are respectively arranged on the side of the fixed base 1;

成型模5包括凹模51,凹模51一侧开设有滑槽52,凹模51内壁底部中心位置开设有注料孔53,滑槽52一端与注料孔53侧面顶部连通,滑槽52内壁滑动连接有截断挡块54,截断挡块54内部开设有膨胀空腔55,膨胀空腔55一端底部开设有滑孔56,滑孔56底部内壁滑动连接有顶杆57,顶杆57两端均固定连接有堵头塞58,凹模51内壁滑动连接有凸模59。The forming mold 5 includes a die 51, a slide groove 52 is provided on one side of the die 51, an injection hole 53 is provided at the center of the bottom of the inner wall of the die 51, one end of the slide groove 52 is connected to the top of the side of the injection hole 53, a cut-off block 54 is slidably connected to the inner wall of the slide groove 52, an expansion cavity 55 is provided inside the cut-off block 54, a slide hole 56 is provided at the bottom of one end of the expansion cavity 55, a push rod 57 is slidably connected to the inner wall of the bottom of the slide hole 56, plugs 58 are fixedly connected at both ends of the push rod 57, and a punch 59 is slidably connected to the inner wall of the die 51.

凹模51设置在安装槽3内部并与安装槽3内壁滑动连接,凸模59顶部固定在注料装置8上,膨胀空腔55内壁远离滑孔56的一端滑动连接有推动活塞50,推动活塞50,推动活塞50一端贯穿膨胀空腔55并与截断挡块54滑动连接,凹模51一侧固定连接有与推动活塞50相适配的顶板。The die 51 is arranged inside the mounting groove 3 and is slidably connected to the inner wall of the mounting groove 3. The top of the punch 59 is fixed on the injection device 8. The end of the inner wall of the expansion cavity 55 away from the sliding hole 56 is slidably connected with a push piston 50. The push piston 50 has one end that penetrates the expansion cavity 55 and is slidably connected to the cut-off block 54. One side of the die 51 is fixedly connected to a top plate that matches the push piston 50.

膨胀空腔55内部填充有热膨胀介质,截断挡块54底部开设有与堵头塞58相适配的收纳槽,顶杆57底部的堵头塞58与注料孔53内壁的形状相适配,注料孔53内壁的形状与连通孔4的形状相适配。The expansion cavity 55 is filled with a heat expansion medium, a receiving groove matched with the plug 58 is provided at the bottom of the cut-off block 54, the plug 58 at the bottom of the push rod 57 is matched with the shape of the inner wall of the injection hole 53, and the shape of the inner wall of the injection hole 53 is matched with the shape of the connecting hole 4.

使用时通过换料装置6将凹模51放置到安装槽3内部,然后通过固定底座1带动转动盘2转动,转动盘2带动凹模51移动至喷涂装置7下方,通过喷涂装置7箱凹模51内部喷涂脱模剂,然后转动盘2带动凹模51移动至注料装置8的位置,注料装置8向凹模51内部注料,并将凸模59伸入凹模51内部,挤压凹模51内部的物料并使凹模51内部的物料成型,然后转动盘2带动凹模51移动至冷却装置9的位置,通过冷却装置9对凹模51内部的成型件进行冷却,冷却结束之后,转动盘2带动凹模51移动至换料装置6的位置,通过换料装置6将安装槽3内部凹模51取出,然后放上新的凹模51即可,方便工件能够一次成型,加工操作简单,并且能够实现连续加工,加工效率较高,设置有成型模5,成型模5内部设置有滑槽52和截断挡块54,当注料装置8将熔融物料注入凹模51内部时,凹模51和截断挡块54的温度升高,膨胀空腔55内部的热膨胀介质受热膨胀,推动推动活塞50向膨胀空腔55外部移动,推动活塞50向外侧移动的同时通过挡板反推截断挡块54,使得截断挡块54插入注料孔53内部,此时截断挡块54将注料孔53堵住,膨胀空腔55内部的热膨胀介质继续膨胀,推动堵头塞58进入注料孔53和连通孔4内部,即可将注料孔53和连通孔4内部的物料推出,方便将注料装置8与凹模51之间的物料截断,使转动盘2带动凹模51移动更加方便,避免物料黏连导致粘附在转动盘2底部。When in use, the die 51 is placed inside the mounting groove 3 through the material changing device 6, and then the rotating disk 2 is driven to rotate through the fixed base 1, and the rotating disk 2 drives the die 51 to move to the bottom of the spraying device 7, and the release agent is sprayed inside the die 51 through the spraying device 7, and then the rotating disk 2 drives the die 51 to move to the position of the injection device 8, and the injection device 8 injects material into the die 51, and extends the punch 59 into the die 51, squeezes the material inside the die 51 and shapes the material inside the die 51, and then the rotating disk 2 drives the die 51 to move to the position of the cooling device 9, and the molded part inside the die 51 is cooled by the cooling device 9. After cooling, the rotating disk 2 drives the die 51 to move to the position of the material changing device 6, and the die 51 inside the mounting groove 3 is taken out by the material changing device 6, and then a new die 51 is placed, which is convenient for the workpiece to be formed at one time, the processing operation is simple, and continuous Continuous processing has high processing efficiency. A forming mold 5 is provided. A slide groove 52 and a cut-off block 54 are provided inside the forming mold 5. When the injection device 8 injects the molten material into the inside of the die 51, the temperature of the die 51 and the cut-off block 54 rises, and the heat expansion medium in the expansion cavity 55 expands due to the heat, pushing the piston 50 to move outside the expansion cavity 55. While pushing the piston 50 to move outward, the cut-off block 54 is pushed back through the baffle plate so that the cut-off block 54 is inserted into the injection hole 53. At this time, the cut-off block 54 blocks the injection hole 53, and the heat expansion medium in the expansion cavity 55 continues to expand, pushing the plug 58 into the injection hole 53 and the connecting hole 4, so that the material inside the injection hole 53 and the connecting hole 4 can be pushed out, which is convenient for cutting off the material between the injection device 8 and the die 51, making it more convenient for the rotating disk 2 to drive the die 51 to move, and avoiding the adhesion of the material to the bottom of the rotating disk 2.

实施例三:Embodiment three:

请参阅图1-5,在实施例一和实施例二的基础上本发明提供一种技术方案:注料装置8包括注料基座81,注料基座81一侧固定连接有支架82,支架82顶部固定连接有伸缩杆83,伸缩杆83底部固定连接有定位座84,注料基座81内部设置有熔融腔85,熔融腔85顶部连通有伸缩管86,熔融腔85内壁底部设置有挤压塞87,挤压塞87底部固定连接有推杆88,注料基座81一侧与固定底座1侧面固定连接,定位座84底部与凸模59顶部固定连接,熔融腔85内部设置有加热装置,熔融腔85内部位于挤压塞87上方的部分填充有熔融物料,设置有注料装置8,当转动盘2带动凹模51移动至注料装置8的位置时,伸缩管86伸长并插入连通孔4内部,推杆88带动挤压塞87上升将熔融腔85内部的物料挤压至凹模51内部,当注料完成之后,伸缩杆83带动定位座84及定位座84底部的凸模59向下移动,凸模59插入凹模51内部成型之后再从成型物料内部抽出即可,方便将注料与成型集成在一起,一次成型提高工作效率。Please refer to Figures 1-5. On the basis of the first and second embodiments, the present invention provides a technical solution: the injection device 8 includes an injection base 81, one side of the injection base 81 is fixedly connected to a bracket 82, the top of the bracket 82 is fixedly connected to a telescopic rod 83, the bottom of the telescopic rod 83 is fixedly connected to a positioning seat 84, a melting cavity 85 is arranged inside the injection base 81, the top of the melting cavity 85 is connected to a telescopic tube 86, an extrusion plug 87 is arranged at the bottom of the inner wall of the melting cavity 85, and a push rod 88 is fixedly connected to the bottom of the extrusion plug 87, one side of the injection base 81 is fixedly connected to the side of the fixed base 1, the bottom of the positioning seat 84 is fixedly connected to the top of the punch 59, and the melting cavity 85 is provided with a melting cavity 85. 5 is provided with a heating device inside, the part of the melting cavity 85 located above the extrusion plug 87 is filled with molten material, and an injection device 8 is provided. When the rotating disk 2 drives the female mold 51 to move to the position of the injection device 8, the telescopic tube 86 is extended and inserted into the connecting hole 4, and the push rod 88 drives the extrusion plug 87 to rise to squeeze the material inside the melting cavity 85 into the female mold 51. When the injection is completed, the telescopic rod 83 drives the positioning seat 84 and the male mold 59 at the bottom of the positioning seat 84 to move downward, and the male mold 59 is inserted into the female mold 51 for molding and then withdrawn from the molding material. It is convenient to integrate the injection and molding together, and the one-time molding improves the work efficiency.

实施例四:Embodiment 4:

请参阅图1-6,在实施例一、实施例二和实施例三的基础上本发明提供一种技术方案:冷却装置9包括循环水箱91,循环水箱91一侧顶部连通有循环水泵92的进水口,循环水箱91顶部连通有冷却水管93,冷却水管93上设置有冷却水泵94,冷却水管93顶部连通有冷却喷头95,冷却喷头95外部套设有伸缩套管96,伸缩套管96顶部固定连接有密封圈97,循环水箱91一侧与固定底座1侧面固定连接,循环水泵92的出水口与外部水箱连通,循环水箱91一侧底部通过连通管与外部水箱连通,冷却水管93底部延伸至循环水箱91内壁底部,设置有冷却装置9,当转动盘2带动凹模51经过注料装置8移动至冷却装置9的位置时,伸缩套管96伸长带动密封圈97贴紧在转动盘2下方,冷却水泵92将循环水箱91内部的冷却水抽出,通过冷却喷头95喷在转动盘2上,即可对转动盘2及转动盘2上的凹模51进行冷却,方便凹模51内部的成型件快速冷却定型。Please refer to Figures 1-6. On the basis of the first, second and third embodiments, the present invention provides a technical solution: the cooling device 9 includes a circulating water tank 91, the top of one side of the circulating water tank 91 is connected to the water inlet of the circulating water pump 92, the top of the circulating water tank 91 is connected to the cooling water pipe 93, the cooling water pipe 93 is provided with a cooling water pump 94, the top of the cooling water pipe 93 is connected to a cooling nozzle 95, the outer sleeve of the cooling nozzle 95 is provided with a telescopic sleeve 96, the top of the telescopic sleeve 96 is fixedly connected to a sealing ring 97, one side of the circulating water tank 91 is fixedly connected to the side of the fixed base 1, and the water outlet of the circulating water pump 92 is connected to the cooling water pipe 93. It is connected to an external water tank, and the bottom of one side of the circulating water tank 91 is connected to the external water tank through a connecting pipe. The bottom of the cooling water pipe 93 extends to the bottom of the inner wall of the circulating water tank 91. A cooling device 9 is provided. When the rotating disk 2 drives the die 51 to move to the position of the cooling device 9 through the injection device 8, the telescopic sleeve 96 extends and drives the sealing ring 97 to fit tightly under the rotating disk 2. The cooling water pump 92 draws out the cooling water from the inside of the circulating water tank 91 and sprays it on the rotating disk 2 through the cooling nozzle 95. The rotating disk 2 and the die 51 on the rotating disk 2 can be cooled, which facilitates the rapid cooling and shaping of the molded parts inside the die 51.

显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域及相关领域的普通技术人员在没有作出创造性劳动的前提下所获得的所有其他实施例,都应属于本发明保护的范围。本发明中未具体描述和解释说明的结构、装置以及操作方法,如无特别说明和限定,均按照本领域的常规手段进行实施。Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims (7)

一种可变电容器的成型加工方法,其特征在于:包括以下步骤:A molding method for a variable capacitor, characterized in that it comprises the following steps: S1、将熔融物料送入成型装置内部,通过成型装置对电容器的外壳进行成型,并将成型后的外壳从成型装置上取下;S1, feeding the molten material into the molding device, molding the shell of the capacitor through the molding device, and removing the molded shell from the molding device; 所述成型装置包括固定底座(1),所述固定底座(1)顶部通过旋转台转动连接有转动盘(2),所述转动盘(2)顶部设置有安装槽(3),所述安装槽(3)内壁底部开设有连通孔(4),所述安装槽(3)内部设置有成型模(5),所述固定底座(1)侧面分别设置有换料装置(6)、喷涂装置(7)、注料装置(8)和冷却装置(9);The molding device comprises a fixed base (1), the top of the fixed base (1) is rotatably connected to a rotating disk (2) via a rotating table, the top of the rotating disk (2) is provided with a mounting groove (3), the bottom of the inner wall of the mounting groove (3) is provided with a connecting hole (4), a molding die (5) is arranged inside the mounting groove (3), and the side of the fixed base (1) is respectively provided with a material changing device (6), a spraying device (7), a material injection device (8) and a cooling device (9); 所述成型模(5)包括凹模(51),所述凹模(51)一侧开设有滑槽(52),所述凹模(51)内壁底部中心位置开设有注料孔(53),所述滑槽(52)一端与注料孔(53)侧面顶部连通,所述滑槽(52)内壁滑动连接有截断挡块(54),所述截断挡块(54)内部开设有膨胀空腔(55),所述膨胀空腔(55)一端底部开设有滑孔(56),所述滑孔(56)底部内壁滑动连接有顶杆(57),所述顶杆(57)两端均固定连接有堵头塞(58),所述凹模(51)内壁滑动连接有凸模(59);The molding die (5) comprises a die (51), a slide groove (52) is provided on one side of the die (51), a material injection hole (53) is provided at the center of the bottom of the inner wall of the die (51), one end of the slide groove (52) is connected to the top of the side of the material injection hole (53), a cut-off block (54) is slidably connected to the inner wall of the slide groove (52), an expansion cavity (55) is provided inside the cut-off block (54), a slide hole (56) is provided at the bottom of one end of the expansion cavity (55), a push rod (57) is slidably connected to the inner wall of the bottom of the slide hole (56), plugs (58) are fixedly connected to both ends of the push rod (57), and a punch (59) is slidably connected to the inner wall of the die (51); 所述注料装置(8)包括注料基座(81),所述注料基座(81)一侧固定连接有支架(82),所述支架(82)顶部固定连接有伸缩杆(83),所述伸缩杆(83)底部固定连接有定位座(84),所述注料基座(81)内部设置有熔融腔(85),所述熔融腔(85)顶部连通有伸缩管(86),所述熔融腔(85)内壁底部设置有挤压塞(87),所述挤压塞(87)底部固定连接有推杆(88);The injection device (8) comprises an injection base (81), one side of the injection base (81) is fixedly connected to a bracket (82), the top of the bracket (82) is fixedly connected to a telescopic rod (83), the bottom of the telescopic rod (83) is fixedly connected to a positioning seat (84), a melting cavity (85) is arranged inside the injection base (81), the top of the melting cavity (85) is connected to a telescopic tube (86), an extrusion plug (87) is arranged at the bottom of the inner wall of the melting cavity (85), and the bottom of the extrusion plug (87) is fixedly connected to a push rod (88); S2、将半导体衬底安装在成型外壳内部,在半导体衬底的第一区域中形成第一导电类型的第一阱,然后在与该半导体衬底的该第一区域相邻的第二区域中形成第二导电类型的第二阱;S2, installing the semiconductor substrate inside the molded housing, forming a first well of a first conductivity type in a first region of the semiconductor substrate, and then forming a second well of a second conductivity type in a second region adjacent to the first region of the semiconductor substrate; S3、在该半导体衬底的该第一区域和该第二区域上方形成第一绝缘膜,在该第一区域的该第一绝缘膜上方形成栅极。S3. Form a first insulating film over the first region and the second region of the semiconductor substrate, and form a gate over the first insulating film in the first region. 根据权利要求1所述的一种可变电容器的成型加工方法,其特征在于:所述凹模(51)设置在安装槽(3)内部并与安装槽(3)内壁滑动连接,所述凸模(59)顶部固定在注料装置(8)上,所述膨胀空腔(55)内壁远离滑孔(56)的一端滑动连接有推动活塞(50),所述推动活塞(50),所述推动活塞(50)一端贯穿膨胀空腔(55)并与截断挡块(54)滑动连接,所述凹模(51)一侧固定连接有与推动活塞(50)相适配的顶板。A molding processing method for a variable capacitor according to claim 1, characterized in that: the die (51) is arranged inside the mounting groove (3) and is slidably connected to the inner wall of the mounting groove (3), the top of the punch (59) is fixed on the injection device (8), and the end of the inner wall of the expansion cavity (55) away from the sliding hole (56) is slidably connected to a push piston (50), and the push piston (50), one end of the push piston (50) passes through the expansion cavity (55) and is slidably connected to the cut-off block (54), and one side of the die (51) is fixedly connected to a top plate adapted to the push piston (50). 根据权利要求1所述的一种可变电容器的成型加工方法,其特征在于:所述膨胀空腔(55)内部填充有热膨胀介质,所述截断挡块(54)底部开设有与堵头塞(58)相适配的收纳槽,所述顶杆(57)底部的堵头塞(58)与注料孔(53)内壁的形状相适配,所述注料孔(53)内壁的形状与连通孔(4)的形状相适配。A forming processing method for a variable capacitor according to claim 1, characterized in that: the expansion cavity (55) is filled with a thermal expansion medium, the bottom of the cut-off block (54) is provided with a receiving groove adapted to the plug (58), the plug (58) at the bottom of the push rod (57) is adapted to the shape of the inner wall of the injection hole (53), and the shape of the inner wall of the injection hole (53) is adapted to the shape of the connecting hole (4). 根据权利要求1所述的一种可变电容器的成型加工方法,其特征在于:所述注料基座(81)一侧与固定底座(1)侧面固定连接,所述定位座(84)底部与凸模(59)顶部固定连接。A molding method for a variable capacitor according to claim 1, characterized in that one side of the injection base (81) is fixedly connected to the side of the fixed base (1), and the bottom of the positioning seat (84) is fixedly connected to the top of the punch (59). 根据权利要求1所述的一种可变电容器的成型加工方法,其特征在于:所述熔融腔(85)内部设置有加热装置,所述熔融腔(85)内部位于挤压塞(87)上方的部分填充有熔融物料。A molding method for a variable capacitor according to claim 1, characterized in that a heating device is provided inside the melting cavity (85), and a portion of the melting cavity (85) located above the extrusion plug (87) is filled with molten material. 根据权利要求1所述的一种可变电容器的成型加工方法,其特征在于:所述冷却装置(9)包括循环水箱(91),所述循环水箱(91)一侧顶部连通有循环水泵(92)的进水口,所述循环水箱(91)顶部连通有冷却水管(93),所述冷却水管(93)上设置有冷却水泵(94),所述冷却水管(93)顶部连通有冷却喷头(95),所述冷却喷头(95)外部套设有伸缩套管(96),所述伸缩套管(96)顶部固定连接有密封圈(97)。A forming processing method for a variable capacitor according to claim 1, characterized in that: the cooling device (9) comprises a circulating water tank (91), the top of one side of the circulating water tank (91) is connected to a water inlet of a circulating water pump (92), the top of the circulating water tank (91) is connected to a cooling water pipe (93), a cooling water pump (94) is provided on the cooling water pipe (93), the top of the cooling water pipe (93) is connected to a cooling nozzle (95), the cooling nozzle (95) is externally provided with a telescopic sleeve (96), and a sealing ring (97) is fixedly connected to the top of the telescopic sleeve (96). 根据权利要求6所述的一种可变电容器的成型加工方法,其特征在于:所述循环水箱(91)一侧与固定底座(1)侧面固定连接,所述循环水泵(92)的出水口与外部水箱连通,所述循环水箱(91)一侧底部通过连通管与外部水箱连通,所述冷却水管(93)底部延伸至循环水箱(91)内壁底部。A forming processing method for a variable capacitor according to claim 6, characterized in that: one side of the circulating water tank (91) is fixedly connected to the side of the fixed base (1), the water outlet of the circulating water pump (92) is connected to the external water tank, the bottom of one side of the circulating water tank (91) is connected to the external water tank through a connecting pipe, and the bottom of the cooling water pipe (93) extends to the bottom of the inner wall of the circulating water tank (91).
PCT/CN2023/136477 2023-12-05 2023-12-05 Method for molding and processing variable capacitor Pending WO2025118145A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020195637A1 (en) * 2001-06-26 2002-12-26 Koichi Kokubun Semiconductor device having trench capacitor formed in SOI substrate, and method of manufacturing the same
CN101276846A (en) * 2007-03-27 2008-10-01 富士通株式会社 Semiconductor variable capacitor and manufacturing method thereof
US20100304539A1 (en) * 2009-06-01 2010-12-02 Fujitsu Semiconductor Limited Method for manufacturing semiconductor device
CN111477457A (en) * 2020-04-17 2020-07-31 南皮县杰特光电有限公司 Tantalum capacitor shell extrusion forming process and device
CN111630663A (en) * 2018-12-28 2020-09-04 深圳市汇顶科技股份有限公司 Capacitor and method of making the same
CN114360910A (en) * 2022-01-10 2022-04-15 淮安永捷电子科技有限公司 Forming processing method of variable capacitor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020195637A1 (en) * 2001-06-26 2002-12-26 Koichi Kokubun Semiconductor device having trench capacitor formed in SOI substrate, and method of manufacturing the same
CN101276846A (en) * 2007-03-27 2008-10-01 富士通株式会社 Semiconductor variable capacitor and manufacturing method thereof
US20100304539A1 (en) * 2009-06-01 2010-12-02 Fujitsu Semiconductor Limited Method for manufacturing semiconductor device
CN111630663A (en) * 2018-12-28 2020-09-04 深圳市汇顶科技股份有限公司 Capacitor and method of making the same
CN111477457A (en) * 2020-04-17 2020-07-31 南皮县杰特光电有限公司 Tantalum capacitor shell extrusion forming process and device
CN114360910A (en) * 2022-01-10 2022-04-15 淮安永捷电子科技有限公司 Forming processing method of variable capacitor

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