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WO2025115685A1 - Substrate processing device and connection assembly - Google Patents

Substrate processing device and connection assembly Download PDF

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Publication number
WO2025115685A1
WO2025115685A1 PCT/JP2024/040864 JP2024040864W WO2025115685A1 WO 2025115685 A1 WO2025115685 A1 WO 2025115685A1 JP 2024040864 W JP2024040864 W JP 2024040864W WO 2025115685 A1 WO2025115685 A1 WO 2025115685A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing apparatus
substrate processing
female screw
sliding
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/040864
Other languages
French (fr)
Japanese (ja)
Inventor
智也 加藤
健一 加藤
和也 松本
浩史 太田
均 ▲高▼▲瀬▼
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Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of WO2025115685A1 publication Critical patent/WO2025115685A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Definitions

  • the present disclosure relates to a substrate processing apparatus and a connection assembly.
  • Patent Document 1 discloses a substrate processing apparatus (film formation apparatus) that performs plasma processing such as film formation on a substrate. This type of substrate processing apparatus is affected by the plasma during plasma processing, causing thermal expansion in members installed in the processing vessel.
  • connecting parts that connect these components are subjected to stress due to the difference in thermal expansion. For this reason, connecting parts that connect components with different thermal expansion coefficients are required to have a structure that can tolerate the difference in thermal expansion.
  • This disclosure provides technology that can stably connect multiple components with different thermal expansion coefficients.
  • a substrate processing apparatus for processing a substrate, comprising: a first member and a second member that are stacked on top of each other and have different thermal expansion coefficients; and a connecting assembly that extends parallel to the stacking direction of the first member and the second member and connects the first member and the second member, the connecting assembly having a sliding structure that is slidable in a direction perpendicular to the stacking direction upon thermal expansion of the first member and/or the second member.
  • multiple components with different thermal expansion coefficients can be stably connected together.
  • FIG. 1 is a diagram showing an overall configuration of a plasma processing system having a substrate processing apparatus (plasma processing apparatus) according to an embodiment.
  • FIG. 1 is an enlarged cross-sectional view showing the vicinity of the outer periphery of a showerhead having a connection assembly.
  • 3A is a first enlarged view of the connection assembly when the cooling plate is not thermally expanded
  • FIG 3B is a second enlarged view of the connection assembly when the cooling plate is thermally expanded.
  • FIG. 4 is a third enlarged view showing the connecting assembly in a state where the ceiling member has thermally expanded.
  • FIG. 11 is an enlarged cross-sectional view showing the vicinity of the outer periphery of a shower head having a connection assembly according to a modified example.
  • FIG. 6(A) is a first enlarged view showing a connection assembly according to a modified example when the cooling plate is not thermally expanded
  • Fig. 6(B) is a second enlarged view showing a connection assembly according to a modified example when the cooling plate is thermally expanded.
  • [Plasma Processing System] 1 is a diagram showing the overall configuration of a plasma processing system having a substrate processing apparatus (plasma processing apparatus 1) according to an embodiment of the present invention. First, an example of the configuration of the plasma processing system will be described with reference to FIG.
  • the plasma processing system includes a capacitively coupled plasma processing device 1, which is a substrate processing device, and a control unit 2.
  • the plasma processing device 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40.
  • the plasma processing device 1 also includes a substrate support unit 11 and a gas introduction unit.
  • the gas introduction unit is configured to introduce at least one processing gas into the plasma processing chamber 10.
  • the gas introduction unit includes a shower head 50.
  • the substrate support unit 11 is disposed in the plasma processing chamber 10.
  • the shower head 50 is disposed above the substrate support unit 11. In one embodiment, the shower head 50 constitutes at least a part of the ceiling of the plasma processing chamber 10.
  • the plasma processing chamber 10 has a plasma processing space 10s defined by the shower head 50, the sidewall 10a of the plasma processing chamber 10, and the substrate support unit 11.
  • the plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 10s and at least one gas exhaust port for exhausting gas from the plasma processing space.
  • the sidewall 10a is grounded.
  • the showerhead 50 and the substrate support 11 are electrically insulated from the plasma processing chamber 10 housing.
  • the substrate support 11 includes a main body 111 and a ring assembly 112.
  • the main body 111 has a central region (substrate support surface) 111a for supporting a substrate (wafer) W, and an annular region (ring support surface) 111b for supporting the ring assembly 112.
  • the annular region 111b of the main body 111 surrounds the central region 111a of the main body 111 in a planar view.
  • the substrate W is disposed on the central region 111a of the main body 111
  • the ring assembly 112 is disposed on the annular region 111b of the main body 111 so as to surround the substrate W on the central region 111a of the main body 111.
  • the main body 111 includes a base and an electrostatic chuck.
  • the base includes a conductive member.
  • the conductive member of the base functions as a lower electrode.
  • the electrostatic chuck is disposed on the base.
  • the upper surface of the electrostatic chuck has a substrate support surface 111a.
  • the ring assembly 112 includes one or more annular members. At least one of the one or more annular members is an edge ring.
  • the substrate support 11 may include a temperature adjustment module configured to adjust at least one of the electrostatic chuck, the ring assembly 112, and the substrate to a target temperature.
  • the temperature adjustment module may include a heater, a heat transfer medium, a flow path, or a combination thereof.
  • a heat transfer fluid such as brine or gas flows through the flow path.
  • the substrate support 11 may also include a heat transfer gas supply unit configured to supply a heat transfer gas between the back surface of the substrate W and the substrate support surface 111a.
  • the showerhead 50 is configured to introduce at least one processing gas from the gas supply unit 20 into the plasma processing space 10s.
  • the showerhead 50 has at least one gas supply port 50a, at least one gas diffusion chamber 50b, and multiple gas inlets 50c.
  • the processing gas supplied to the gas supply port 50a passes through the gas diffusion chamber 50b and is introduced into the plasma processing space 10s from the multiple gas inlets 50c.
  • the showerhead 50 also includes a conductive member.
  • the conductive member of the showerhead 50 functions as an upper electrode.
  • the shower head 50 has a layered structure in which multiple components are stacked.
  • the multiple components of the shower head 50 include a ceiling member (first member) 51 that forms the ceiling surface of the plasma processing space 10s, and a cooling plate (second member) 52 that is stacked on top of the ceiling member 51.
  • the ceiling member 51 is formed in a disk shape and has multiple gas inlets 50c along the surface direction (horizontal direction).
  • the ceiling member 51 according to the embodiment is configured as a conductive member (upper electrode) to which a source RF signal, a bias RF signal, etc. are supplied from a power source 30 described below.
  • the ceiling member 51 generates plasma from the processing gas in the plasma processing space 10s by the supplied source RF signal, bias RF signal, etc. For this reason, the ceiling member 51 is formed from a material having conductivity.
  • the material of the ceiling member 51 is not particularly limited, but examples include carbon (C: graphite, etc.), silicon (Si), silicon carbide (SiC), or a combination of these materials.
  • the cooling plate 52 is formed in a disk shape with a recess, and is laminated on the upper surface of the ceiling member 51 to form a gas diffusion chamber 50b at the boundary with the ceiling member 51.
  • the cooling plate 52 is also provided so as to be in close contact with the ceiling member 51, and has an internal cooling mechanism (not shown). As a result, heat from the ceiling member 51, which becomes hot due to the heat input from the plasma, is transferred to the cooling plate 52, thereby cooling the ceiling member 51.
  • the cooling mechanism of the cooling plate 52 has, for example, a spiral or annular coolant flow path (not shown) extending in the circumferential direction.
  • the cooling mechanism circulates the coolant by supplying and discharging a low-temperature coolant from a chiller unit provided outside the plasma processing chamber 10 to the coolant flow path of the cooling plate 52. Cooling water, Galden (registered trademark), or the like is used as the coolant.
  • the cooling plate 52 is preferably formed of a material with high thermal conductivity in order to cool the ceiling member 51.
  • the material of the cooling plate 52 is not particularly limited, but examples thereof include aluminum or aluminum alloys that have been anodized.
  • the gas introduction section of the plasma processing chamber 10 may include one or more side gas injectors (SGIs) attached to one or more openings formed in the side wall 10a.
  • SGIs side gas injectors
  • the gas supply 20 may include at least one gas source 21 and at least one flow controller 22.
  • the gas supply 20 is configured to supply at least one process gas from a respective gas source 21 through a respective flow controller 22 to the showerhead 50.
  • Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller.
  • the gas supply 20 may include one or more flow modulation devices to modulate or pulse the flow rate of the at least one process gas.
  • the power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit.
  • the RF power supply 31 is configured to supply at least one RF signal (RF power), such as a source RF signal and a bias RF signal, to the conductive member of the substrate support 11 and/or the conductive member of the showerhead 50. This causes a plasma to be formed from at least one processing gas supplied to the plasma processing space 10s.
  • the RF power supply 31 can function as at least a part of a plasma generating unit configured to generate plasma from one or more processing gases in the plasma processing chamber 10.
  • a bias RF signal to the conductive member of the substrate support 11
  • a bias potential is generated on the substrate W, and ion components in the formed plasma can be attracted to the substrate W.
  • the RF power supply 31 includes a first RF generating unit 31a and a second RF generating unit 31b.
  • the first RF generating unit 31a is coupled to the conductive member of the substrate support 11 and/or the conductive member of the showerhead 50 via at least one impedance matching circuit and is configured to generate a source RF signal (source RF power) for plasma generation.
  • the source RF signal has a frequency in the range of 13 MHz to 150 MHz.
  • the first RF generating unit 31a may be configured to generate multiple source RF signals having different frequencies. The generated one or more source RF signals are supplied to the conductive member of the substrate support 11 and/or the conductive member of the showerhead 50.
  • the second RF generating unit 31b is coupled to the conductive member of the substrate support 11 via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power).
  • the bias RF signal has a lower frequency than the source RF signal.
  • the bias RF signal has a frequency in the range of 400 kHz to 13.56 MHz.
  • the second RF generator 31b may be configured to generate multiple bias RF signals having different frequencies.
  • the generated bias RF signal or signals are provided to the conductive members of the substrate support 11. Also, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.
  • the power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10.
  • the DC power supply 32 includes a first DC generator 32a and a second DC generator 32b.
  • the first DC generator 32a is connected to a conductive member of the substrate support 11 and configured to generate a first DC signal.
  • the generated first bias DC signal is applied to the conductive member of the substrate support 11.
  • the first DC signal may be applied to another electrode, such as an electrode in an electrostatic chuck.
  • the second DC generator 32b is connected to a conductive member of the showerhead 50 and configured to generate a second DC signal.
  • the generated second DC signal is applied to the conductive member of the showerhead 50.
  • at least one of the first and second DC signals may be pulsed.
  • the first and second DC generating units 32a and 32b may be provided in addition to the RF power source 31, or the first DC generating unit 32a may be provided in place of the second RF generating unit 31b.
  • the exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10.
  • the exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is adjusted by the pressure regulating valve.
  • the vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.
  • the control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform the various steps described in this disclosure.
  • the control unit 2 may be configured to control each element of the plasma processing apparatus 1 to perform the various steps described herein. In one embodiment, a part or all of the control unit 2 may be included in the plasma processing apparatus 1.
  • the control unit 2 may include, for example, a computer 2a.
  • the computer 2a may include, for example, a processing unit (CPU: Central Processing Unit) 2a1, a memory unit 2a2, and a communication interface 2a3.
  • the processing unit 2a1 may be configured to perform various control operations based on a program stored in the memory unit 2a2.
  • the memory unit 2a2 may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof.
  • the communication interface 2a3 may communicate with the plasma processing device 1 via a communication line such as a LAN (Local Area Network).
  • FIG. 2 is an enlarged cross-sectional view showing the vicinity of the outer periphery of the showerhead 50 having the connection assembly 60.
  • the showerhead 50 of the plasma processing apparatus 1 is installed on the upper part of the plasma processing chamber 10 in a state in which the above-mentioned multiple members (ceiling member 51, cooling plate 52) are stacked.
  • the showerhead 50 includes multiple connection assemblies 60 that connect the ceiling member 51 and the cooling plate 52 to the outer periphery of the ceiling member 51 and the cooling plate 52.
  • the ceiling member 51 and the cooling plate 52 are formed from different materials as described above. Therefore, the thermal expansion coefficients of the ceiling member 51 and the cooling plate 52 are also different.
  • the connecting assembly 60 has a clamping function that clamps and connects the ceiling member 51 and the cooling plate 52 in the up-down direction (vertical direction).
  • the shower head 50 may be configured by stacking other members in addition to the ceiling member 51 and the cooling plate 52.
  • the connecting assembly 60 is not limited to one that clamps two members, but may be configured to clamp three or more members.
  • the ceiling member 51 of the shower head 50 has an attachment step 511 that can be hooked onto the connecting assembly 60 on the outer periphery radially outward of the discharge surface having the multiple gas inlets 50c.
  • the attachment step 511 of the ceiling member 51 is formed to be thinner than the thickness of the discharge surface portion, and has a circular ring shape that goes around the ceiling member 51.
  • the cooling plate 52 of the shower head 50 has a protruding outer periphery 521 that protrudes radially outward from the main body portion that contacts the ceiling member 51.
  • This protruding outer periphery 521 is formed in an annular shape and is located radially outward from the mounting step 511 of the ceiling member 51.
  • An accommodation hole 522 that accommodates a part (upper part) of the connecting assembly 60 is provided in an adjacent position on the radial outside of the protruding outer periphery 521 of the ceiling member 51.
  • the accommodation holes 522 are provided in a number corresponding to the number of connecting assemblies 60 to be installed, and are arranged at intervals in the circumferential direction of the protruding outer periphery 521.
  • the multiple connecting assemblies 60 have a portion that engages with the mounting step 511 of the ceiling member 51 and a portion that is inserted into the accommodation hole 522 and engages with the cooling plate 52, and clamp the ceiling member 51 and the cooling plate 52. Each connecting assembly 60 clamps the ceiling member 51 and the cooling plate 52 at multiple points around the circumference, thereby maintaining the ceiling member 51 and the cooling plate 52 in a sealed state.
  • the showerhead 50 may also have an O-ring (not shown) or the like at the boundary between the ceiling member 51 and the cooling plate 52 to hermetically seal both members.
  • Each connection assembly 60 includes a male screw member 61, a disc spring 62, an elastic receiving member 63, an upper sliding seat member 64, a locking member 65, a female screw member 66, a washer 67, a lower sliding seat member 68, a guide member 69, and a female screw holder 70.
  • the plasma processing chamber 10 also has a protective case 71 that covers the female screw holder 70, and an insulating member 72 that sandwiches the protective case 71 between the cooling plate 52.
  • the male screw member 61 is a member whose upper portion is accommodated in the accommodation hole 522 of the cooling plate 52, while its lower portion exposed from the accommodation hole 522 is inserted into the female screw member 66.
  • the male screw member 61 and the female screw member 66 extend parallel to the stacking direction of the ceiling member 51 and the cooling plate 52, and form a fastening structure 73 that screws together.
  • the connecting assembly 60 can adjust the clamping force on the ceiling member 51 and the cooling plate 52 by adjusting the axial length of the screwed male screw member 61 and the female screw member 66.
  • the male screw member 61 has a lower screw portion 611 having a thread 61a on its outer circumferential surface that screws into the female screw member 66, an intermediate rod portion 612 connected to the upper end of the lower screw portion 611, and a head portion 613 provided at the upper end of the intermediate rod portion 612.
  • the head portion 613 also includes a flange 614 that protrudes radially outward from the intermediate rod portion 612, a connecting member 615 provided at the axis of the intermediate rod portion 612, and a heat insulating member 616 connected to the connecting member 615.
  • the lower screw portion 611, the intermediate rod portion 612, and the flange 614 are integrally molded with each other.
  • the lower region of the lower screw portion 611 is inserted into the female screw hole 663 of the female screw member 66, and is directly screwed into the female screw member 66.
  • the intermediate rod portion 612 has a smooth outer peripheral surface, and the disc spring 62 is arranged around its side.
  • the flange 614 is formed in an annular shape in a plan view, and functions as a seat that receives the elastic force of the disc spring 62.
  • the connecting member 615 is housed in a T-shaped hole in a cross-sectional view formed at the axis of the intermediate rod portion 612, and protrudes slightly vertically upward from the intermediate rod portion 612.
  • the insulating member 616 covers the protruding connecting member 615 and is fixed to the connecting member 615, thereby suppressing the transfer of temperature from the cooling plate 52 to the male screw member 61.
  • the coned disc spring 62 is disposed between the flange 614 of the male screw member 61 and the elastic receiving member 63, and has the function of elastically receiving the load applied to both members (load parallel to the stacking direction).
  • the connecting assembly 60 has multiple (five) coned disc springs 62 stacked vertically, and can mitigate large loads applied in the vertical direction.
  • the coned disc spring 62 can move integrally with the male screw member 61 by contacting the outer circumferential surface of the intermediate rod portion 612 of the male screw member 61.
  • the elastic receiving member 63 is a cylindrical member arranged around the male screw member 61, with one end of the disc spring 62 in contact with its upper end surface.
  • the outer circumferential surface of the elastic receiving member 63 is formed with an outer diameter slightly larger than the outer diameter of the flange 614 of the male screw member 61 and the outer diameter of the disc spring 62.
  • the elastic receiving member 63 is formed with an outer diameter in the range of about 2/3 to 9/10 of the inner diameter of the accommodation hole 522. This creates an appropriate gap C1 between the outer circumferential surface of the elastic receiving member 63 and the inner circumferential surface of the accommodation hole 522 (see FIG. 3A).
  • the gap C1 allows the male screw member 61, the disc spring 62, and the elastic receiving member 63 to slide horizontally (in a direction perpendicular to the stacking direction of the ceiling member 51 and the cooling plate 52).
  • the lower end surface of the elastic receiving member 63 is a flat (smooth) sliding surface 631 that extends horizontally and is in contact with the upper sliding seat member 64.
  • the sliding surface 631 allows the elastic receiving member 63 to slide relative to the upper sliding seat member 64.
  • the upper sliding seat member 64 is formed in a circular ring shape with its underside supported by the locking member 65, and is a member that supports the above-mentioned elastic receiving member 63 so that it can move relative to the elastic receiving member 63.
  • the connecting assembly 60 by using the elastic receiving member 63 and the upper sliding seat member 64, forms a sliding structure 74 that can slide in the horizontal direction perpendicular to the stacking direction.
  • the outer diameter of the upper sliding seat member 64 roughly matches the inner diameter of the accommodation hole 522. As a result, the upper sliding seat member 64 maintains a state in which horizontal sliding within the accommodation hole 522 is restricted.
  • the upper surface of the upper sliding seat member 64 is a flat (smooth) sliding surface 641 extending horizontally.
  • the sliding structure 74 is not limited to the sliding surface 631 of the elastic receiving member 63 and the sliding surface 641 of the upper sliding seat member 64 described above, and can have various configurations.
  • the sliding structure 74 may be a sliding bearing applied to either the elastic receiving member 63 or the upper sliding seat member 64, the sliding bearing having multiple rolling elements that are in contact with the sliding surface of the other and can roll.
  • the locking member 65 is formed in a circular ring shape in a plan view, and is fitted into an engagement groove formed on the inner circumferential surface of the accommodation hole 522.
  • This locking member 65 is fixed in an undetachable manner to the cooling plate 52, and is therefore able to stably support the upper sliding seat member 64.
  • the male screw member 61, disc spring 62, elastic receiving member 63, and upper sliding seat member 64 are prevented from falling out of the accommodation hole 522 by the locking member 65, and it is also possible to elastically support the male screw member 61 along the vertical direction.
  • the female screw member 66 is a member that screws into the male screw member 61 in the connecting assembly 60, and is formed to be thicker than the male screw member 61.
  • This female screw member 66 has a female screw body 661 that extends vertically, and a flange head 662 that is connected to the lower end of the female screw body 661.
  • the female screw body 661 and the flange head 662 are molded integrally with each other.
  • the female screw body 661 extends linearly in the vertical direction and is longer than the lower screw engagement portion 611 of the male screw member 61.
  • An opening for a female screw hole 663 is provided at the upper end of the female screw body 661.
  • the female screw hole 663 is formed vertically downward from the opening to a predetermined depth, and its inner peripheral surface is formed with a screw groove (not shown) into which the thread 61a of the male screw member 61 can be screwed.
  • a rotation hole portion 664 is provided at the lower end surface of the female screw body 661 for inserting a wrench (such as a hexagonal wrench) (not shown) to rotate the female screw member 66 (see FIG. 3(A)).
  • the flange head 662 protrudes a short distance radially outward from the lower end of the female screw body 661.
  • a washer 67 is layered on the upper surface of this flange head 662.
  • the washer 67 is formed in an annular shape, is supported by the flange head 662, and protrudes radially outward beyond the outer circumferential surface of the flange head 662.
  • the lower sliding seat member 68 is formed in an annular shape, supported by a washer 67, and fitted onto the outer circumferential surface of the female screw body 661.
  • the inner diameter of the lower sliding seat member 68 roughly matches the outer diameter of the female screw body 661. This allows the lower sliding seat member 68 to move integrally with the female screw member 66.
  • the lower sliding seat member 68 like the upper sliding seat member 64, slidably supports the guide member 69 that is stacked on its upper surface.
  • the upper surface of the lower sliding seat member 68 is a flat (smooth) sliding surface 681 extending horizontally.
  • the sliding structure 74 of the lower sliding seat member 68 and the guide member 69 is not limited to this, and for example, a sliding bearing having multiple rolling elements may be applied to either the lower sliding seat member 68 or the guide member 69.
  • the guide member 69 is supported by the lower sliding seat member 68 and is fitted to the outer circumferential surface of the female screw body 661.
  • the inner diameter of the guide member 69 is larger than the outer diameter of the female screw body 661, and a gap C2 is created between the inner circumferential surface of the guide member 69 and the outer circumferential surface of the female screw body 661. This gap C2 allows the female screw holder 70 to slide horizontally relative to the female screw body 661.
  • the guide member 69 is formed in a D-shape in a plan view, and is inserted into the through-hole 703 (lower hole 703b) of the female screw holder 70, which is also formed in a D-shape (see also FIG. 3(A)). This allows the guide member 69 to align the female screw holder 70 in a fixed direction.
  • the female screw holder 70 is arranged to face the accommodation hole 522 of the cooling plate 52, and is configured as a square tube-shaped member that covers the side periphery of the female screw member 66 and hooks onto the mounting step 511 of the ceiling member 51.
  • the female screw holder 70 has a holder portion 701 that extends vertically to a length approximately equal to that of the female screw member 66, and an engagement protrusion 702 that protrudes from the lower side of the holder portion 701 toward the ceiling member 51.
  • a through hole 703 for placing the female screw member 66 is formed inside the holder portion 701.
  • the through hole 703 includes an upper hole 703a in which the female screw body 661 is placed at the top, and a lower hole 703b in which the flange head 662, washer 67, lower sliding seat member 68, and guide member 69 are placed below the upper hole 703a.
  • the inner diameter of the upper hole 703a is formed larger than the outer diameter of the female screw body 661 of the female screw member 66, forming a gap C2.
  • the lower hole 703b is formed in a D-shape and houses the guide member 69.
  • the engaging protrusion 702 protrudes toward the ceiling member 51, and its upper surface contacts the mounting step 511 of the ceiling member 51.
  • the connecting assembly 60 adjusts the axial length of the male screw member 61 and the female screw member 66 by screwing them together, so that the engaging protrusion 702 comes into contact with the mounting step 511 and can clamp the ceiling member 51.
  • the connecting assembly 60 sandwiches the ceiling member 51 and the cooling plate 52 between the locking member 65 connected to the cooling plate 52 and the female screw holder 70 that engages with the ceiling member 51.
  • the protective case 71 also extends from the sidewall 10a of the plasma processing chamber 10 to the ceiling member 51 of the shower head 50, covering the above-mentioned connection assembly 60 and preventing the connection assembly 60 from being exposed to the plasma processing space 10s.
  • the insulating member 72 is provided between the sidewall 10a of the plasma processing chamber 10 and the shower head 50 (including the connecting assembly 60), thereby insulating the ceiling member 51, which functions as an upper electrode, from the sidewall 10a. This allows the plasma processing apparatus 1 to stably generate plasma in the plasma processing space 10s based on a signal supplied from the power source 30 to the ceiling member 51.
  • the plasma processing apparatus 1 is basically configured as described above, and its operation will be described below.
  • the plasma processing apparatus 1 supplies processing gas to the plasma processing space 10s of the plasma processing chamber 10 through the shower head 50.
  • the plasma processing apparatus 1 also supplies a source RF signal or a bias RF signal from the power supply 30 to the shower head 50 to generate plasma in the plasma processing space 10s.
  • the shower head 50 receives heat from the plasma generated in the plasma processing space 10s.
  • the ceiling member 51 and the cooling plate 52 of the shower head 50 are made of materials with different thermal expansion coefficients. Therefore, a difference in thermal expansion occurs between the ceiling member 51 and the cooling plate 52 when the heat of the plasma is input.
  • the plasma processing apparatus 1 uses a connection assembly 60 to connect the ceiling member 51 and the cooling plate 52, as described above.
  • Fig. 3(A) is a first enlarged view showing the connecting assembly 60 when the cooling plate 52 is not thermally expanded.
  • Fig. 3(B) is a second enlarged view showing the connecting assembly 60 when the cooling plate 52 is thermally expanded.
  • Fig. 4 is a third enlarged view showing the connecting assembly 60 when the ceiling member 51 is thermally expanded.
  • the middle view shows a cross-sectional view along line A-A in the upper view, and the lower view shows a view in the direction of arrow B in the upper view.
  • the connecting assembly 60 forms a gap C1 between the inner circumferential surface of the accommodation hole 522 of the cooling plate 52 and the male screw member 61, the disc spring 62, and the elastic receiving member 63.
  • This gap C1 allows the connecting assembly 60 to allow relative movement of the male screw member 61, the disc spring 62, the elastic receiving member 63, etc. with respect to the upper sliding seat member 64 (and the locking member 65).
  • the connecting assembly 60 forms a gap C2 between the female screw member 66, washer 67, and lower sliding seat member 68 and the guide member 69 and the inner circumferential surface of the through hole 703 of the female screw holder 70.
  • This gap C2 allows the connecting assembly 60 to move the guide member 69 and the female screw holder 70 relative to the lower sliding seat member 68.
  • the male screw member 61 and the female screw member 66 are screwed together to firmly clamp the ceiling member 51 and the cooling plate 52.
  • the male screw member 61 accommodated in the accommodation hole 522 is hooked onto the cooling plate 52 via the flange 614, the disc spring 62, the elastic receiving member 63, the upper sliding seat member 64, and the locking member 65.
  • the connecting assembly 60 applies a force that pushes the cooling plate 52 downward in the vertical direction.
  • the female screw member 66 is hooked onto the mounting step portion 511 of the ceiling member 51 via the flange head 662, the washer 67, the lower sliding seat member 68, the guide member 69, and the female screw holder 70.
  • the connecting assembly 60 applies a force that pushes the ceiling member 51 upward in the vertical direction. Therefore, the connection assembly 60 can firmly clamp the ceiling member 51 and the cooling plate 52, bringing the two members into close contact. Even if the plasma in the plasma processing space 10s inputs heat to the ceiling member 51 during plasma processing, the shower head 50 can smoothly dissipate the heat from the ceiling member 51 to the cooling plate 52.
  • the elastic receiving member 63 which is in contact with the sliding surface 641 of the upper sliding seat member 64 via the sliding surface 631, does not follow the sliding of the upper sliding seat member 64 because the sliding surfaces 631, 641 slide horizontally against each other. This causes the upper sliding seat member 64 to slide relative to the elastic receiving member 63. As a result, the connecting assembly 60 moves the locking member 65 and the upper sliding seat member 64 horizontally outward in response to thermal expansion of the cooling plate 52, while maintaining the positions of the elastic receiving member 63, disc spring 62, male screw member 61, etc. Therefore, the inside of the gap C1 (towards the center of the cooling plate 52) becomes smaller.
  • the male screw member 61 is not displaced even by the thermal expansion of the cooling plate 52, and can maintain good screw engagement with the female screw member 66.
  • the connecting assembly 60 can prevent the stress of the thermal expansion of the cooling plate 52 from being applied to the fastening structure 73, making it possible to avoid damage to the connecting assembly 60, the ceiling member 51, or the cooling plate 52, etc.
  • the ceiling member 51 thermally expands relative to the cooling plate 52.
  • the ceiling member 51 may thermally expand.
  • the mounting step portion 511 also moves radially outward.
  • the female screw holder 70 engaged with the mounting step portion 511 also slides horizontally (radially outward from the ceiling member 51).
  • the guide member 69 of the female screw holder 70 moves relative to the lower sliding seat member 68 because the sliding surface 691 contacts the sliding surface 681 of the lower sliding seat member 68.
  • the female screw member 66, washer 67, and lower sliding seat member 68 do not follow the sliding of the female screw holder 70 or guide member 69.
  • the connecting assembly 60 can accommodate the thermal expansion of the ceiling member 51 while reducing the inside of the gap C2 (the side toward the center of the ceiling member 51).
  • the female screw member 66 is not displaced even by the thermal expansion of the ceiling member 51, and can maintain good screw engagement with the male screw member 61.
  • the connecting assembly 60 can prevent the stress of the thermal expansion of the ceiling member 51 from being applied to the fastening structure 73, and can avoid damage to the connecting assembly 60, the ceiling member 51, or the cooling plate 52, etc.
  • the connecting assembly 60 has a sliding structure 74, which allows it to stably connect components with different thermal expansion coefficients. Furthermore, the connecting assembly 60 has sliding structures 74 at multiple locations (locations corresponding to the male threaded member 61 and locations corresponding to the female threaded member 66), which allows it to appropriately accommodate thermal expansion depending on the location of the component with large thermal expansion. Furthermore, the multiple sliding structures 74 can accommodate thermal expansion even when there is a large difference in thermal expansion.
  • the connecting assembly 60 can firmly attach the ceiling member 51 and the cooling plate 52 by adjusting the axial length of the screwed male screw member 61 and the female screw member 66. Furthermore, the connecting assembly 60 has a sliding structure 74 outside the outer circumferential surface of the fastening structure 73 (male screw member 61, female screw member 66), so that the sliding structure 74 can slide appropriately while maintaining the screwed fastening structure 73.
  • the sliding structure 74 is disposed adjacent to the female screw member 66, so that it can easily absorb the shear force applied to the female screw member 66 during thermal expansion.
  • the sliding structure 74 is disposed adjacent to the male screw member 61, so that it can easily absorb the shear force applied to the male screw member 61 during thermal expansion.
  • the sliding structure 74 has two sliding surfaces 631, 641 (or sliding surfaces 681, 691) in contact with each other, and thus can perform sliding in a direction perpendicular to the stacking direction with a simple configuration. Alternatively, when a member having a rolling body that contacts the sliding surface is used, the sliding structure 74 can perform even smoother sliding.
  • connection assembly 60 connects the ceiling member 51 and the cooling plate 52 of the shower head 50.
  • the connection assembly 60 may connect other members in the plasma processing chamber 10.
  • the other members include the substrate support 11, a baffle plate attached to the plasma processing chamber 10, a shielding member, etc.
  • the connection assembly 60 may be used as a connection part that connects the plasma processing chambers 10.
  • the connection assembly 60 may be applied to a substrate processing apparatus that performs a heat treatment without performing a plasma treatment.
  • connection assembly 60 the male thread member 61 is disposed on the cooling plate 52 side, and the female thread member 66 is disposed on the ceiling member 51 side.
  • this arrangement may be reversed.
  • the connecting assembly 60 is configured to engage the engaging protrusion 702 of the female screw holder 70 with the mounting step 511 of the ceiling member 51.
  • the ceiling member 51 has a hole with a similar configuration to the through hole 703 described above, the ceiling member 51 can be fastened with the female screw member 66 without using the female screw holder 70.
  • a washer 67, a lower sliding seat member 68, a guide member 69, etc. may be interposed between the female screw member 66 and the ceiling member 51.
  • FIG. 5 is an enlarged cross-sectional view showing the vicinity of the outer periphery of the shower head 50 having the connection assembly 60A according to the modified example.
  • Fig. 6(A) is a first enlarged view showing the connection assembly 60A according to the modified example in a state in which the cooling plate 52 is not thermally expanded.
  • Fig. 6(B) is a second enlarged view showing the connection assembly 60A according to the modified example in a state in which the cooling plate 52 is thermally expanded.
  • the lower diagrams of Figs. 6(A) and 6(B) show views in the direction of the arrow B in the upper diagrams.
  • the modified connecting assembly 60A differs from the connecting assembly 60 in that it has a sliding structure 74 adjacent to the female threaded member 66 (between the female threaded member 66 and the female threaded holder 70), but does not have a sliding structure 74 adjacent to the male threaded member 61.
  • connection assembly 60A includes a male screw member 61, a disc spring 62, an elastic receiving member 63, a locking member 65, a female screw member 66, a washer 67, a lower sliding seat member 68, a guide member 69, and a female screw holder 70.
  • the female screw member 66 is inserted into the elastic receiving member 63 while being screwed into the male screw member 61 and placed in the receiving hole 522.
  • the male screw member 61 has a lower screw-in portion 611, an intermediate rod portion 612, and a head portion 613.
  • the disc spring 62 has one end in contact with the head portion 613, which protrudes radially outward, and is fitted to the outer circumferential surface of the intermediate rod portion 612.
  • the elastic receiving member 63 is formed in a cylindrical shape extending along the vertical direction, and is supported by a locking member 65 fitted into the accommodation hole 522 at its vertically lower side.
  • the elastic receiving member 63 has a hole portion 63h into which the female screw member 66 can be inserted from the vertically lower side.
  • the outer diameter of the elastic receiving member 63 is approximately the same as the inner diameter of the accommodation hole 522, and is configured so that there is no gap C1 (see Figure 3 (A)) between it and the cooling plate 52.
  • the elastic receiving member 63 and the female screw member 66 also move horizontally in response to the thermal expansion.
  • the female screw member 66 has a female screw body 661 and a flange head 662, and the upper end of the female screw body 661 is inserted into the elastic receiving member 63 and accommodated in the accommodation hole 522.
  • the washer 67 is supported by the flange head 662 of this female screw member 66.
  • the lower sliding seat member 68 is formed in an annular shape and has a sliding surface 681 on its upper surface.
  • the guide member 69 has a sliding surface 691 on its lower surface that contacts the lower sliding seat member 68.
  • the connecting assembly 60A forms a single sliding structure 74 by the lower sliding seat member 68 and the guide member 69.
  • the guide member 69 is fixed to the female screw holder 70.
  • the female screw holder 70 has a holder portion 701 and an engaging protrusion 702, and the engaging protrusion 702 engages with the mounting step portion 511 of the ceiling member 51.
  • the through hole 703 of the female screw holder 70 has an upper hole 703a and a lower hole 703b, and forms a gap C2 between the female screw member 66. Furthermore, the lower hole 703b of the through hole 703 is formed as an elongated hole that moves the flange head 662 of the female screw member 66 in one direction.
  • the modified connecting assembly 60 is basically formed as described above, and its function will be explained below.
  • the connecting assembly 60A firmly clamps the ceiling member 51 and the cooling plate 52 by screwing together the male screw member 61 and the female screw member 66.
  • the male screw member 61 is hooked onto the cooling plate 52 via the flange 614, the disc spring 62, the elastic receiving member 63, and the locking member 65, thereby pushing the cooling plate 52 downward in the vertical direction.
  • the female screw member 66 is hooked onto the flange head 662, the washer 67, the lower sliding seat member 68, the guide member 69, and the female screw holder 70 at the protruding outer periphery 521, thereby pushing the ceiling member 51 upward in the vertical direction. Therefore, the connecting assembly 60A makes it possible to bring the ceiling member 51 and the cooling plate 52 into close contact with each other.
  • the connecting assembly 60A forms a gap C2 between the outer peripheral surface of the female screw member 66 (female screw body 661, flange head 662) and the inner peripheral surface of the through hole 703 of the guide member 69 and the female screw holder 70.
  • the horizontal sliding of the female screw member 66 also causes the washer 67 and the lower sliding seat member 68 to slide.
  • the guide member 69 which is in contact with the sliding surface 681 of the lower sliding seat member 68 via the sliding surface 691, does not follow the sliding of the lower sliding seat member 68. This causes the lower sliding seat member 68 to move relative to the guide member 69.
  • the connecting assembly 60A can accommodate the thermal expansion of the cooling plate 52 while reducing the outer side of the gap C2 (the side away from the cooling plate 52).
  • the female screw member 66 can be maintained in a state where it is not displaced even by the thermal expansion of the cooling plate 52. This prevents the stress of the thermal expansion of the cooling plate 52 from being exerted on the fastening structure 73, and prevents damage to the connecting assembly 60A, the ceiling member 51, or the cooling plate 52.
  • the modified connecting assembly 60A can also effectively connect two components with different thermal expansion coefficients, and can tolerate the difference in thermal expansion of multiple components.
  • the connecting assembly 60A with a single sliding structure 74, the structure can be further simplified, making it possible to reduce manufacturing costs.
  • the connection assembly has a sliding structure that is slidable in a direction perpendicular to the stacking direction when the first member and/or the second member undergo thermal expansion.
  • Substrate processing equipment [Appendix 2]
  • the connection assembly has a male screw member and a female screw member that extend in the stacking direction and screw together, a clamping force for the first member and the second member is adjusted by adjusting an axial length of the male screw member and the female screw member in the screwed engagement; 2.
  • the substrate processing apparatus of claim 1 [Appendix 3] The sliding structure is provided outside the outer circumferential surface of the male thread member and the outer circumferential surface of the female thread member. 3. The substrate processing apparatus of claim 2. [Appendix 4] The sliding structure is disposed adjacent to the female screw member. 4. The substrate processing apparatus according to claim 2 or 3. [Appendix 5] The sliding structure is disposed adjacent to the male screw member exposed from the female screw member. 5. The substrate processing apparatus according to claim 2 . [Appendix 6] The connecting assembly has a plurality of the sliding structures along the stacking direction. 6. The substrate processing apparatus according to claim 1 .
  • the sliding structure has sliding surfaces of two members each having a sliding surface extending in a direction perpendicular to the stacking direction, the sliding surfaces being in contact with each other. 7.
  • the substrate processing apparatus according to claim 1 [Appendix 8]
  • the sliding structure is configured to contact a member having a sliding surface extending in a direction perpendicular to the stacking direction with a member having a rolling element in contact with the sliding surface. 8.
  • the first member and the second member are provided in a plasma processing chamber having a plasma processing space therein for generating plasma. 9. The substrate processing apparatus according to claim 1 .
  • the first member and the second member constitute a showerhead that discharges a processing gas inside the plasma processing chamber and receives power for generating the plasma; 10.
  • the first member is a ceiling member having a plurality of gas inlets through which the processing gas is introduced into the plasma processing space,
  • the second member is a cooling plate that is provided vertically above the first member and dissipates heat from the ceiling member. 11.
  • connection assembly for connecting a first member and a second member provided in a substrate processing apparatus for processing a substrate, the connection assembly comprising: the first member and the second member are laminated on each other and have different thermal expansion coefficients;
  • the connection assembly includes: a sliding structure extending parallel to a stacking direction of the first member and the second member and capable of sliding in a direction perpendicular to the stacking direction when the first member and/or the second member is thermally expanded; Linkage assembly.
  • the substrate processing apparatus and connection assemblies 60, 60A are illustrative in all respects and not restrictive.
  • the embodiments may be modified and improved in various ways without departing from the spirit and scope of the appended claims.
  • the matters described in the above embodiments may be configured in other ways as long as they are not inconsistent, and may be combined as long as they are not inconsistent.
  • the substrate processing apparatus disclosed herein can be applied to any type of apparatus, including Atomic Layer Deposition (ALD) apparatus, Capacitively Coupled Plasma (CCP), Inductively Coupled Plasma (ICP), Radial Line Slot Antenna (RLSA), Electron Cyclotron Resonance Plasma (ECR), and Helicon Wave Plasma (HWP).
  • ALD Atomic Layer Deposition
  • CCP Capacitively Coupled Plasma
  • ICP Inductively Coupled Plasma
  • RLSA Radial Line Slot Antenna
  • ECR Electron Cyclotron Resonance Plasma
  • HWP Helicon Wave Plasma

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Abstract

This substrate processing device processes a substrate. The substrate processing device comprises: a first member and a second member that are mutually laminated and that have mutually different thermal expansion coefficients; and a connection assembly that extends in parallel to the lamination direction of the first member and the second member and that connects the first member and the second member. The connection assembly has a sliding structure that can slide in a direction orthogonal to the lamination direction when the first member and/or the second member thermally expands.

Description

基板処理装置、および連結アセンブリSubstrate Processing Apparatus and Connection Assembly

 本開示は、基板処理装置、および連結アセンブリに関する。 The present disclosure relates to a substrate processing apparatus and a connection assembly.

 特許文献1には、成膜等のプラズマ処理を基板に施す基板処理装置(成膜装置)が開示されている。この種の基板処理装置は、プラズマ処理時のプラズマの影響を受けることで、処理容器に設けられる部材に熱膨張が生じる。 Patent Document 1 discloses a substrate processing apparatus (film formation apparatus) that performs plasma processing such as film formation on a substrate. This type of substrate processing apparatus is affected by the plasma during plasma processing, causing thermal expansion in members installed in the processing vessel.

 複数の部材同士の間で熱膨張係数が異なる場合、これらの部材を連結している連結部は、熱膨張の差に伴う応力を受けることになる。このため、熱膨張係数が異なる部材同士を連結する連結部には、熱膨張の差を許容し得る構造が要望されている。 When the thermal expansion coefficients of multiple components differ, the connecting parts that connect these components are subjected to stress due to the difference in thermal expansion. For this reason, connecting parts that connect components with different thermal expansion coefficients are required to have a structure that can tolerate the difference in thermal expansion.

特開2020‐17697号公報JP 2020-17697 A

 本開示は、熱膨張係数が異なる複数の部材同士を安定して連結できる技術を提供する。 This disclosure provides technology that can stably connect multiple components with different thermal expansion coefficients.

 本開示の一態様によれば、基板を処理する基板処理装置であって、相互に積層され、かつ相互に異なる熱膨張係数を有する第1部材および第2部材と、前記第1部材および前記第2部材の積層方向に平行して延在し、前記第1部材と前記第2部材を連結する連結アセンブリと、を備え、前記連結アセンブリは、前記第1部材および/または前記第2部材の熱膨張時に、前記積層方向と直交する方向にスライド可能なすべり構造を有する、基板処理装置が提供される。 According to one aspect of the present disclosure, there is provided a substrate processing apparatus for processing a substrate, comprising: a first member and a second member that are stacked on top of each other and have different thermal expansion coefficients; and a connecting assembly that extends parallel to the stacking direction of the first member and the second member and connects the first member and the second member, the connecting assembly having a sliding structure that is slidable in a direction perpendicular to the stacking direction upon thermal expansion of the first member and/or the second member.

 一態様によれば、熱膨張係数が異なる複数の部材同士を安定して連結できる。 According to one aspect, multiple components with different thermal expansion coefficients can be stably connected together.

実施形態に係る基板処理装置(プラズマ処理装置)を有するプラズマ処理システムの全体構成を示す図である。1 is a diagram showing an overall configuration of a plasma processing system having a substrate processing apparatus (plasma processing apparatus) according to an embodiment. 連結アセンブリを有するシャワーヘッドの外周部付近を拡大して示す断面図である。FIG. 1 is an enlarged cross-sectional view showing the vicinity of the outer periphery of a showerhead having a connection assembly. 図3(A)は、クーリングプレートが熱膨張していない状態の連結アセンブリを示す第1拡大図である。図3(B)は、クーリングプレートが熱膨張した状態の連結アセンブリを示す第2拡大図である。3A is a first enlarged view of the connection assembly when the cooling plate is not thermally expanded, and FIG 3B is a second enlarged view of the connection assembly when the cooling plate is thermally expanded. 天井部材が熱膨張した状態の連結アセンブリを示す第3拡大図である。FIG. 4 is a third enlarged view showing the connecting assembly in a state where the ceiling member has thermally expanded. 変形例に係る連結アセンブリを有するシャワーヘッドの外周部付近を拡大して示す断面図である。FIG. 11 is an enlarged cross-sectional view showing the vicinity of the outer periphery of a shower head having a connection assembly according to a modified example. 図6(A)は、クーリングプレートが熱膨張していない状態の変形例に係る連結アセンブリを示す第1拡大図である。図6(B)は、クーリングプレートが熱膨張した状態の変形例に係る連結アセンブリを示す第2拡大図である。Fig. 6(A) is a first enlarged view showing a connection assembly according to a modified example when the cooling plate is not thermally expanded, and Fig. 6(B) is a second enlarged view showing a connection assembly according to a modified example when the cooling plate is thermally expanded.

 以下、図面を参照して本開示を実施するための形態について説明する。各図面において、同一構成部分には同一符号を付し、重複した説明を省略する場合がある。 Below, a description will be given of a mode for carrying out the present disclosure with reference to the drawings. In each drawing, the same components are given the same reference numerals, and duplicate descriptions may be omitted.

[プラズマ処理システム]
 図1は、実施形態に係る基板処理装置(プラズマ処理装置1)を有するプラズマ処理システムの全体構成を示す図である。まず図1を参照しながら、プラズマ処理システムの構成例について説明する。
[Plasma Processing System]
1 is a diagram showing the overall configuration of a plasma processing system having a substrate processing apparatus (plasma processing apparatus 1) according to an embodiment of the present invention. First, an example of the configuration of the plasma processing system will be described with reference to FIG.

 プラズマ処理システムは、基板処理装置である容量結合型のプラズマ処理装置1および制御部2を含む。プラズマ処理装置1は、プラズマ処理チャンバ10、ガス供給部20、電源30および排気システム40を含む。また、プラズマ処理装置1は、基板支持部11およびガス導入部を含む。ガス導入部は、少なくとも1つの処理ガスをプラズマ処理チャンバ10内に導入するように構成される。ガス導入部は、シャワーヘッド50を含む。基板支持部11は、プラズマ処理チャンバ10内に配置される。シャワーヘッド50は、基板支持部11の上方に配置される。一実施形態において、シャワーヘッド50は、プラズマ処理チャンバ10の天部(ceiling)の少なくとも一部を構成する。プラズマ処理チャンバ10は、シャワーヘッド50、プラズマ処理チャンバ10の側壁10aおよび基板支持部11により規定されたプラズマ処理空間10sを有する。プラズマ処理チャンバ10は、少なくとも1つの処理ガスをプラズマ処理空間10sに供給するための少なくとも1つのガス供給口と、プラズマ処理空間からガスを排出するための少なくとも1つのガス排出口とを有する。側壁10aは接地される。シャワーヘッド50および基板支持部11は、プラズマ処理チャンバ10筐体とは電気的に絶縁される。 The plasma processing system includes a capacitively coupled plasma processing device 1, which is a substrate processing device, and a control unit 2. The plasma processing device 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. The plasma processing device 1 also includes a substrate support unit 11 and a gas introduction unit. The gas introduction unit is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas introduction unit includes a shower head 50. The substrate support unit 11 is disposed in the plasma processing chamber 10. The shower head 50 is disposed above the substrate support unit 11. In one embodiment, the shower head 50 constitutes at least a part of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the shower head 50, the sidewall 10a of the plasma processing chamber 10, and the substrate support unit 11. The plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 10s and at least one gas exhaust port for exhausting gas from the plasma processing space. The sidewall 10a is grounded. The showerhead 50 and the substrate support 11 are electrically insulated from the plasma processing chamber 10 housing.

 基板支持部11は、本体部111およびリングアセンブリ112を含む。本体部111は、基板(ウェハ)Wを支持するための中央領域(基板支持面)111aと、リングアセンブリ112を支持するための環状領域(リング支持面)111bとを有する。本体部111の環状領域111bは、平面視で本体部111の中央領域111aを囲んでいる。基板Wは、本体部111の中央領域111a上に配置され、リングアセンブリ112は、本体部111の中央領域111a上の基板Wを囲むように本体部111の環状領域111b上に配置される。一実施形態において、本体部111は、基台および静電チャックを含む。基台は、導電性部材を含む。基台の導電性部材は下部電極として機能する。静電チャックは、基台の上に配置される。静電チャックの上面は、基板支持面111aを有する。リングアセンブリ112は、1または複数の環状部材を含む。1または複数の環状部材のうち少なくとも1つはエッジリングである。また、図示は省略するが、基板支持部11は、静電チャック、リングアセンブリ112および基板のうち少なくとも1つをターゲット温度に調節するように構成される温調モジュールを含んでもよい。温調モジュールは、ヒータ、伝熱媒体、流路、またはこれらの組み合わせを含んでもよい。流路には、ブラインやガスのような伝熱流体が流れる。また、基板支持部11は、基板Wの裏面と基板支持面111aとの間に伝熱ガスを供給するように構成された伝熱ガス供給部を含んでもよい。 The substrate support 11 includes a main body 111 and a ring assembly 112. The main body 111 has a central region (substrate support surface) 111a for supporting a substrate (wafer) W, and an annular region (ring support surface) 111b for supporting the ring assembly 112. The annular region 111b of the main body 111 surrounds the central region 111a of the main body 111 in a planar view. The substrate W is disposed on the central region 111a of the main body 111, and the ring assembly 112 is disposed on the annular region 111b of the main body 111 so as to surround the substrate W on the central region 111a of the main body 111. In one embodiment, the main body 111 includes a base and an electrostatic chuck. The base includes a conductive member. The conductive member of the base functions as a lower electrode. The electrostatic chuck is disposed on the base. The upper surface of the electrostatic chuck has a substrate support surface 111a. The ring assembly 112 includes one or more annular members. At least one of the one or more annular members is an edge ring. Although not shown, the substrate support 11 may include a temperature adjustment module configured to adjust at least one of the electrostatic chuck, the ring assembly 112, and the substrate to a target temperature. The temperature adjustment module may include a heater, a heat transfer medium, a flow path, or a combination thereof. A heat transfer fluid such as brine or gas flows through the flow path. The substrate support 11 may also include a heat transfer gas supply unit configured to supply a heat transfer gas between the back surface of the substrate W and the substrate support surface 111a.

 シャワーヘッド50は、ガス供給部20からの少なくとも1つの処理ガスをプラズマ処理空間10s内に導入するように構成される。シャワーヘッド50は、少なくとも1つのガス供給口50a、少なくとも1つのガス拡散室50b、および複数のガス導入口50cを有する。ガス供給口50aに供給された処理ガスは、ガス拡散室50bを通過して複数のガス導入口50cからプラズマ処理空間10s内に導入される。また、シャワーヘッド50は、導電性部材を含む。シャワーヘッド50の導電性部材は上部電極として機能する。 The showerhead 50 is configured to introduce at least one processing gas from the gas supply unit 20 into the plasma processing space 10s. The showerhead 50 has at least one gas supply port 50a, at least one gas diffusion chamber 50b, and multiple gas inlets 50c. The processing gas supplied to the gas supply port 50a passes through the gas diffusion chamber 50b and is introduced into the plasma processing space 10s from the multiple gas inlets 50c. The showerhead 50 also includes a conductive member. The conductive member of the showerhead 50 functions as an upper electrode.

 実施形態に係るシャワーヘッド50は、複数の部材を積層した積層構造を呈している。シャワーヘッド50の複数の部材としては、プラズマ処理空間10sの天井面を形成する天井部材(第1部材)51、および天井部材51の上部に積層されるクーリングプレート(第2部材)52があげられる。 The shower head 50 according to the embodiment has a layered structure in which multiple components are stacked. The multiple components of the shower head 50 include a ceiling member (first member) 51 that forms the ceiling surface of the plasma processing space 10s, and a cooling plate (second member) 52 that is stacked on top of the ceiling member 51.

 天井部材51は、円盤状に形成され、面方向(水平方向)に沿って複数のガス導入口50cを有する。また、実施形態に係る天井部材51は、後記の電源30からソースRF信号、バイアスRF信号等が供給される導電性部材(上部電極)に構成される。天井部材51は、供給されるソースRF信号、バイアスRF信号等によって、プラズマ処理空間10sの処理ガスからプラズマを生成する。このため、天井部材51は、導電性を有する材料により形成される。この天井部材51の材料は、特に限定されるものではないが、例えば、炭素(C:グラファイト等)、シリコン(Si)、炭化シリコン(SiC)、またはこれらの材料を組み合わせたもの等があげられる。 The ceiling member 51 is formed in a disk shape and has multiple gas inlets 50c along the surface direction (horizontal direction). The ceiling member 51 according to the embodiment is configured as a conductive member (upper electrode) to which a source RF signal, a bias RF signal, etc. are supplied from a power source 30 described below. The ceiling member 51 generates plasma from the processing gas in the plasma processing space 10s by the supplied source RF signal, bias RF signal, etc. For this reason, the ceiling member 51 is formed from a material having conductivity. The material of the ceiling member 51 is not particularly limited, but examples include carbon (C: graphite, etc.), silicon (Si), silicon carbide (SiC), or a combination of these materials.

 一方、クーリングプレート52は、窪みを有する円盤状に形成され、天井部材51の上面に積層されることで、天井部材51との境界部にガス拡散室50bを形成する。また、クーリングプレート52は、天井部材51と密着するように設けられると共に、図示しない冷却機構を内部に有する。これにより、クーリングプレート52には、プラズマの入熱により高温となる天井部材51の熱が伝達され、天井部材51を冷却できる。 On the other hand, the cooling plate 52 is formed in a disk shape with a recess, and is laminated on the upper surface of the ceiling member 51 to form a gas diffusion chamber 50b at the boundary with the ceiling member 51. The cooling plate 52 is also provided so as to be in close contact with the ceiling member 51, and has an internal cooling mechanism (not shown). As a result, heat from the ceiling member 51, which becomes hot due to the heat input from the plasma, is transferred to the cooling plate 52, thereby cooling the ceiling member 51.

 クーリングプレート52の冷却機構は、例えば、円周方向に延びる渦巻き状または環状の冷媒流路(不図示)を有する。冷却機構は、プラズマ処理チャンバ10の外部に設けられたチラーユニットから低温の冷媒を、クーリングプレート52の冷媒流路に供給および排出して冷媒を循環させる。この冷媒としては、冷却水やガルデン(登録商標)等が用いられる。クーリングプレート52は、天井部材51を冷却するために、熱伝導率が高い材料により形成されることが好ましい。このクーリングプレート52の材料は、特に限定されないが、例えば、陽極酸化処理がされたアルミニウムやアルミニウム合金等があげられる。なお、プラズマ処理チャンバ10のガス導入部は、シャワーヘッド50に加えて、側壁10aに形成された1または複数の開口部に取り付けられる1または複数のサイドガス注入部(SGI:Side Gas Injector)を含んでもよい。 The cooling mechanism of the cooling plate 52 has, for example, a spiral or annular coolant flow path (not shown) extending in the circumferential direction. The cooling mechanism circulates the coolant by supplying and discharging a low-temperature coolant from a chiller unit provided outside the plasma processing chamber 10 to the coolant flow path of the cooling plate 52. Cooling water, Galden (registered trademark), or the like is used as the coolant. The cooling plate 52 is preferably formed of a material with high thermal conductivity in order to cool the ceiling member 51. The material of the cooling plate 52 is not particularly limited, but examples thereof include aluminum or aluminum alloys that have been anodized. In addition to the shower head 50, the gas introduction section of the plasma processing chamber 10 may include one or more side gas injectors (SGIs) attached to one or more openings formed in the side wall 10a.

 ガス供給部20は、少なくとも1つのガスソース21および少なくとも1つの流量制御器22を含んでもよい。一実施形態において、ガス供給部20は、少なくとも1つの処理ガスを、それぞれに対応のガスソース21からそれぞれに対応の流量制御器22を介してシャワーヘッド50に供給するように構成される。各流量制御器22は、例えばマスフローコントローラまたは圧力制御式の流量制御器を含んでもよい。さらに、ガス供給部20は、少なくとも1つの処理ガスの流量を変調またはパルス化する1またはそれ以上の流量変調デバイスを含んでもよい。 The gas supply 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply 20 is configured to supply at least one process gas from a respective gas source 21 through a respective flow controller 22 to the showerhead 50. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply 20 may include one or more flow modulation devices to modulate or pulse the flow rate of the at least one process gas.

 電源30は、少なくとも1つのインピーダンス整合回路を介してプラズマ処理チャンバ10に結合されるRF電源31を含む。RF電源31は、ソースRF信号およびバイアスRF信号のような少なくとも1つのRF信号(RF電力)を、基板支持部11の導電性部材および/またはシャワーヘッド50の導電性部材に供給するように構成される。これにより、プラズマ処理空間10sに供給された少なくとも1つの処理ガスからプラズマが形成される。従って、RF電源31は、プラズマ処理チャンバ10において1またはそれ以上の処理ガスからプラズマを生成するように構成されるプラズマ生成部の少なくとも一部として機能し得る。また、バイアスRF信号を基板支持部11の導電性部材に供給することにより、基板Wにバイアス電位が発生し、形成されたプラズマ中のイオン成分を基板Wに引き込むことができる。 The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is configured to supply at least one RF signal (RF power), such as a source RF signal and a bias RF signal, to the conductive member of the substrate support 11 and/or the conductive member of the showerhead 50. This causes a plasma to be formed from at least one processing gas supplied to the plasma processing space 10s. Thus, the RF power supply 31 can function as at least a part of a plasma generating unit configured to generate plasma from one or more processing gases in the plasma processing chamber 10. In addition, by supplying a bias RF signal to the conductive member of the substrate support 11, a bias potential is generated on the substrate W, and ion components in the formed plasma can be attracted to the substrate W.

 一実施形態において、RF電源31は、第1のRF生成部31aおよび第2のRF生成部31bを含む。第1のRF生成部31aは、少なくとも1つのインピーダンス整合回路を介して基板支持部11の導電性部材および/またはシャワーヘッド50の導電性部材に結合され、プラズマ生成用のソースRF信号(ソースRF電力)を生成するように構成される。一実施形態において、ソースRF信号は、13MHz~150MHzの範囲内の周波数を有する。一実施形態において、第1のRF生成部31aは、異なる周波数を有する複数のソースRF信号を生成するように構成されてもよい。生成された1または複数のソースRF信号は、基板支持部11の導電性部材および/またはシャワーヘッド50の導電性部材に供給される。第2のRF生成部31bは、少なくとも1つのインピーダンス整合回路を介して基板支持部11の導電性部材に結合され、バイアスRF信号(バイアスRF電力)を生成するように構成される。一実施形態において、バイアスRF信号は、ソースRF信号よりも低い周波数を有する。一実施形態において、バイアスRF信号は、400kHz~13.56MHzの範囲内の周波数を有する。一実施形態において、第2のRF生成部31bは、異なる周波数を有する複数のバイアスRF信号を生成するように構成されてもよい。生成された1または複数のバイアスRF信号は、基板支持部11の導電性部材に供給される。また、種々の実施形態において、ソースRF信号およびバイアスRF信号のうち少なくとも1つがパルス化されてもよい。 In one embodiment, the RF power supply 31 includes a first RF generating unit 31a and a second RF generating unit 31b. The first RF generating unit 31a is coupled to the conductive member of the substrate support 11 and/or the conductive member of the showerhead 50 via at least one impedance matching circuit and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 13 MHz to 150 MHz. In one embodiment, the first RF generating unit 31a may be configured to generate multiple source RF signals having different frequencies. The generated one or more source RF signals are supplied to the conductive member of the substrate support 11 and/or the conductive member of the showerhead 50. The second RF generating unit 31b is coupled to the conductive member of the substrate support 11 via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power). In one embodiment, the bias RF signal has a lower frequency than the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 400 kHz to 13.56 MHz. In one embodiment, the second RF generator 31b may be configured to generate multiple bias RF signals having different frequencies. The generated bias RF signal or signals are provided to the conductive members of the substrate support 11. Also, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

 また、電源30は、プラズマ処理チャンバ10に結合されるDC電源32を含んでもよい。DC電源32は、第1のDC生成部32aおよび第2のDC生成部32bを含む。一実施形態において、第1のDC生成部32aは、基板支持部11の導電性部材に接続され、第1のDC信号を生成するように構成される。生成された第1のバイアスDC信号は、基板支持部11の導電性部材に印加される。一実施形態において、第1のDC信号が、静電チャック内の電極のような他の電極に印加されてもよい。一実施形態において、第2のDC生成部32bは、シャワーヘッド50の導電性部材に接続され、第2のDC信号を生成するように構成される。生成された第2のDC信号は、シャワーヘッド50の導電性部材に印加される。種々の実施形態において、第1および第2のDC信号のうち少なくとも1つがパルス化されてもよい。なお、第1および第2のDC生成部32a,32bは、RF電源31に加えて設けられてもよく、第1のDC生成部32aが第2のRF生成部31bに代えて設けられてもよい。 The power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generator 32a and a second DC generator 32b. In one embodiment, the first DC generator 32a is connected to a conductive member of the substrate support 11 and configured to generate a first DC signal. The generated first bias DC signal is applied to the conductive member of the substrate support 11. In one embodiment, the first DC signal may be applied to another electrode, such as an electrode in an electrostatic chuck. In one embodiment, the second DC generator 32b is connected to a conductive member of the showerhead 50 and configured to generate a second DC signal. The generated second DC signal is applied to the conductive member of the showerhead 50. In various embodiments, at least one of the first and second DC signals may be pulsed. The first and second DC generating units 32a and 32b may be provided in addition to the RF power source 31, or the first DC generating unit 32a may be provided in place of the second RF generating unit 31b.

 排気システム40は、例えばプラズマ処理チャンバ10の底部に設けられたガス排出口10eに接続され得る。排気システム40は、圧力調整弁および真空ポンプを含んでもよい。圧力調整弁によって、プラズマ処理空間10s内の圧力が調整される。真空ポンプは、ターボ分子ポンプ、ドライポンプまたはこれらの組み合わせを含んでもよい。 The exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is adjusted by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

 制御部2は、本開示において述べられる種々の工程をプラズマ処理装置1に実行させるコンピュータ実行可能な命令を処理する。制御部2は、ここで述べられる種々の工程を実行するようにプラズマ処理装置1の各要素を制御するように構成され得る。一実施形態において、制御部2の一部または全てがプラズマ処理装置1に含まれてもよい。制御部2は、例えばコンピュータ2aを含んでもよい。コンピュータ2aは、例えば、処理部(CPU:Central Processing Unit)2a1、記憶部2a2、および通信インターフェース2a3を含んでもよい。処理部2a1は、記憶部2a2に格納されたプログラムに基づいて種々の制御動作を行うように構成され得る。記憶部2a2は、RAM(Random Access Memory)、ROM(Read Only Memory)、HDD(Hard Disk Drive)、SSD(Solid State Drive)、またはこれらの組み合わせを含んでもよい。通信インターフェース2a3は、LAN(Local Area Network)等の通信回線を介してプラズマ処理装置1との間で通信してもよい。 The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform the various steps described in this disclosure. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 to perform the various steps described herein. In one embodiment, a part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include, for example, a computer 2a. The computer 2a may include, for example, a processing unit (CPU: Central Processing Unit) 2a1, a memory unit 2a2, and a communication interface 2a3. The processing unit 2a1 may be configured to perform various control operations based on a program stored in the memory unit 2a2. The memory unit 2a2 may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing device 1 via a communication line such as a LAN (Local Area Network).

[シャワーヘッド50および連結アセンブリ60の構成]
 図2は、連結アセンブリ60を有するシャワーヘッド50の外周部付近を拡大して示す断面図である。図2に示すように、プラズマ処理装置1シャワーヘッド50は、上記した複数の部材(天井部材51、クーリングプレート52)を積層した状態として、プラズマ処理チャンバ10の上部に設置する。このため、シャワーヘッド50は、天井部材51およびクーリングプレート52の外周部に、天井部材51およびクーリングプレート52を連結する複数の連結アセンブリ60を備える。
[Configuration of showerhead 50 and connection assembly 60]
2 is an enlarged cross-sectional view showing the vicinity of the outer periphery of the showerhead 50 having the connection assembly 60. As shown in Fig. 2, the showerhead 50 of the plasma processing apparatus 1 is installed on the upper part of the plasma processing chamber 10 in a state in which the above-mentioned multiple members (ceiling member 51, cooling plate 52) are stacked. For this reason, the showerhead 50 includes multiple connection assemblies 60 that connect the ceiling member 51 and the cooling plate 52 to the outer periphery of the ceiling member 51 and the cooling plate 52.

 天井部材51とクーリングプレート52は、上記したように相互に異なる材料により形成されている。このため、天井部材51の熱膨張係数とクーリングプレート52の熱膨張係数も相互に異なっている。連結アセンブリ60は、これら天井部材51およびクーリングプレート52を上下方向(鉛直方向)に挟み込んで連結するクランプ機能を有する。なお、シャワーヘッド50は、天井部材51およびクーリングプレート52の他に、別の部材を積層して構成されてもよい。このシャワーヘッド50に応じて、連結アセンブリ60も、2つの部材を挟み込むものに限らず、3つ以上の部材を挟み込む構成としてもよい。 The ceiling member 51 and the cooling plate 52 are formed from different materials as described above. Therefore, the thermal expansion coefficients of the ceiling member 51 and the cooling plate 52 are also different. The connecting assembly 60 has a clamping function that clamps and connects the ceiling member 51 and the cooling plate 52 in the up-down direction (vertical direction). The shower head 50 may be configured by stacking other members in addition to the ceiling member 51 and the cooling plate 52. Depending on the shower head 50, the connecting assembly 60 is not limited to one that clamps two members, but may be configured to clamp three or more members.

 具体的には、シャワーヘッド50の天井部材51は、複数のガス導入口50cを有する吐出面よりも径方向外側の外周部に、連結アセンブリ60に引っ掛かり可能な取付用段差部511を有する。天井部材51の取付用段差部511は、吐出面部分の肉厚よりも薄く形成され、また天井部材51を周回する円環状を呈している。 Specifically, the ceiling member 51 of the shower head 50 has an attachment step 511 that can be hooked onto the connecting assembly 60 on the outer periphery radially outward of the discharge surface having the multiple gas inlets 50c. The attachment step 511 of the ceiling member 51 is formed to be thinner than the thickness of the discharge surface portion, and has a circular ring shape that goes around the ceiling member 51.

 一方、シャワーヘッド50のクーリングプレート52は、天井部材51に接触する本体部分から径方向外側に突出する突出外周部521を有する。この突出外周部521は、円環状に形成され、天井部材51の取付用段差部511よりも径方向外側に位置している。突出外周部521における天井部材51の径方向外側の隣接位置には、連結アセンブリ60の一部(上部)を収容する収容穴522が設けられている。収容穴522は、連結アセンブリ60の設置数に対応する数だけ設けられ、突出外周部521の周方向に間隔をあけて配置されている。 On the other hand, the cooling plate 52 of the shower head 50 has a protruding outer periphery 521 that protrudes radially outward from the main body portion that contacts the ceiling member 51. This protruding outer periphery 521 is formed in an annular shape and is located radially outward from the mounting step 511 of the ceiling member 51. An accommodation hole 522 that accommodates a part (upper part) of the connecting assembly 60 is provided in an adjacent position on the radial outside of the protruding outer periphery 521 of the ceiling member 51. The accommodation holes 522 are provided in a number corresponding to the number of connecting assemblies 60 to be installed, and are arranged at intervals in the circumferential direction of the protruding outer periphery 521.

 複数の連結アセンブリ60は、天井部材51の取付用段差部511に係合する部分と、収容穴522に挿入されてクーリングプレート52に係合する部分と、を備えており、天井部材51およびクーリングプレート52をクランプする。各連結アセンブリ60は、天井部材51およびクーリングプレート52の周方向の複数箇所をクランプすることで、天井部材51およびクーリングプレート52の密閉状態を維持する。なお、シャワーヘッド50は、天井部材51とクーリングプレート52の境界に、両部材を気密にシールするOリング(不図示)等を備えてもよい。 The multiple connecting assemblies 60 have a portion that engages with the mounting step 511 of the ceiling member 51 and a portion that is inserted into the accommodation hole 522 and engages with the cooling plate 52, and clamp the ceiling member 51 and the cooling plate 52. Each connecting assembly 60 clamps the ceiling member 51 and the cooling plate 52 at multiple points around the circumference, thereby maintaining the ceiling member 51 and the cooling plate 52 in a sealed state. The showerhead 50 may also have an O-ring (not shown) or the like at the boundary between the ceiling member 51 and the cooling plate 52 to hermetically seal both members.

 各連結アセンブリ60は、雄ネジ部材61、皿ばね62、弾性受部材63、上側すべり座部材64、係止部材65、雌ネジ部材66、ワッシャ67、下側すべり座部材68、ガイド部材69および雌ネジホルダ70を含む。また、プラズマ処理チャンバ10は、雌ネジホルダ70を覆う保護ケース71と、クーリングプレート52との間で保護ケース71を挟み込む絶縁部材72を有している。 Each connection assembly 60 includes a male screw member 61, a disc spring 62, an elastic receiving member 63, an upper sliding seat member 64, a locking member 65, a female screw member 66, a washer 67, a lower sliding seat member 68, a guide member 69, and a female screw holder 70. The plasma processing chamber 10 also has a protective case 71 that covers the female screw holder 70, and an insulating member 72 that sandwiches the protective case 71 between the cooling plate 52.

 雄ネジ部材61は、クーリングプレート52の収容穴522にその上部が収容される一方で、収容穴522から露出している下部が雌ネジ部材66に挿入される部材である。雄ネジ部材61と雌ネジ部材66は、天井部材51およびクーリングプレート52の積層方向に平行して延在すると共に、相互に螺合する締結構造73を構成している。連結アセンブリ60は、雄ネジ部材61および雌ネジ部材66の螺合における軸方向の長さを調整することで、天井部材51およびクーリングプレート52に対するクランプ力を調整できる。 The male screw member 61 is a member whose upper portion is accommodated in the accommodation hole 522 of the cooling plate 52, while its lower portion exposed from the accommodation hole 522 is inserted into the female screw member 66. The male screw member 61 and the female screw member 66 extend parallel to the stacking direction of the ceiling member 51 and the cooling plate 52, and form a fastening structure 73 that screws together. The connecting assembly 60 can adjust the clamping force on the ceiling member 51 and the cooling plate 52 by adjusting the axial length of the screwed male screw member 61 and the female screw member 66.

 詳細には、雄ネジ部材61は、雌ネジ部材66に螺合されるネジ山61aを外周面に有する下側螺合部611と、下側螺合部611の上端に連なる中間棒部612と、中間棒部612の上端に設けられる頭部613と、を有する。また、頭部613は、中間棒部612から径方向外側に突出するフランジ614と、中間棒部612の軸心に設けられる連結部材615と、連結部材615に連結される断熱部材616と、を含む。下側螺合部611、中間棒部612、フランジ614は、相互に一体成形されている。 In detail, the male screw member 61 has a lower screw portion 611 having a thread 61a on its outer circumferential surface that screws into the female screw member 66, an intermediate rod portion 612 connected to the upper end of the lower screw portion 611, and a head portion 613 provided at the upper end of the intermediate rod portion 612. The head portion 613 also includes a flange 614 that protrudes radially outward from the intermediate rod portion 612, a connecting member 615 provided at the axis of the intermediate rod portion 612, and a heat insulating member 616 connected to the connecting member 615. The lower screw portion 611, the intermediate rod portion 612, and the flange 614 are integrally molded with each other.

 下側螺合部611の下部領域は、雌ネジ部材66の雌ネジ穴663に挿入されることで、雌ネジ部材66に直接螺合される部分となる。中間棒部612は、滑らかな外周面を有しており、その側周囲に皿バネ62が配置される。フランジ614は、平面視で円環状に形成され、皿バネ62の弾性力を受ける座として機能する。連結部材615は、中間棒部612の軸心に形成された断面視でT字形状の穴に収容され、中間棒部612から鉛直方向上側に短く突出している。断熱部材616は、突出している連結部材615を覆うと共に連結部材615に固定されることで、クーリングプレート52から雄ネジ部材61への温度の伝達を抑制する。 The lower region of the lower screw portion 611 is inserted into the female screw hole 663 of the female screw member 66, and is directly screwed into the female screw member 66. The intermediate rod portion 612 has a smooth outer peripheral surface, and the disc spring 62 is arranged around its side. The flange 614 is formed in an annular shape in a plan view, and functions as a seat that receives the elastic force of the disc spring 62. The connecting member 615 is housed in a T-shaped hole in a cross-sectional view formed at the axis of the intermediate rod portion 612, and protrudes slightly vertically upward from the intermediate rod portion 612. The insulating member 616 covers the protruding connecting member 615 and is fixed to the connecting member 615, thereby suppressing the transfer of temperature from the cooling plate 52 to the male screw member 61.

 皿バネ62は、雄ネジ部材61のフランジ614と、弾性受部材63と、の間に配置され、両部材にかかる荷重(積層方向と平行な方向の荷重)を弾力的に受ける機能を有している。例えば、連結アセンブリ60は、複数(5つ)の皿バネ62を鉛直方向に積層しており、鉛直方向にかかる大きな荷重を緩和することができる。また、皿バネ62は、雄ネジ部材61の中間棒部612の外周面に対して接触することで、雄ネジ部材61と一体に移動することができる。 The coned disc spring 62 is disposed between the flange 614 of the male screw member 61 and the elastic receiving member 63, and has the function of elastically receiving the load applied to both members (load parallel to the stacking direction). For example, the connecting assembly 60 has multiple (five) coned disc springs 62 stacked vertically, and can mitigate large loads applied in the vertical direction. In addition, the coned disc spring 62 can move integrally with the male screw member 61 by contacting the outer circumferential surface of the intermediate rod portion 612 of the male screw member 61.

 弾性受部材63は、雄ネジ部材61の周囲に配置される円筒状の部材であり、その上端面に皿バネ62の一端が接触している。弾性受部材63の外周面は、雄ネジ部材61のフランジ614の外径や皿バネ62の外径よりも若干大きな外径に形成されている。例えば、弾性受部材63は、収容穴522の内径に対して2/3~9/10程度の範囲の外径に形成されることが好ましい。これにより、弾性受部材63の外周面と収容穴522の内周面との間には、適宜の隙間C1が生じるようになる(図3(A)参照)。隙間C1は、雄ネジ部材61、皿バネ62および弾性受部材63を、水平方向(天井部材51とクーリングプレート52の積層方向と直交する方向)にスライド可能とする。 The elastic receiving member 63 is a cylindrical member arranged around the male screw member 61, with one end of the disc spring 62 in contact with its upper end surface. The outer circumferential surface of the elastic receiving member 63 is formed with an outer diameter slightly larger than the outer diameter of the flange 614 of the male screw member 61 and the outer diameter of the disc spring 62. For example, it is preferable that the elastic receiving member 63 is formed with an outer diameter in the range of about 2/3 to 9/10 of the inner diameter of the accommodation hole 522. This creates an appropriate gap C1 between the outer circumferential surface of the elastic receiving member 63 and the inner circumferential surface of the accommodation hole 522 (see FIG. 3A). The gap C1 allows the male screw member 61, the disc spring 62, and the elastic receiving member 63 to slide horizontally (in a direction perpendicular to the stacking direction of the ceiling member 51 and the cooling plate 52).

 弾性受部材63の下端面は、水平方向に延在する平坦状の(平滑な)すべり面631となっており、上側すべり座部材64に接触している。すべり面631は、上側すべり座部材64と相対的に弾性受部材63をスライド可能とする。 The lower end surface of the elastic receiving member 63 is a flat (smooth) sliding surface 631 that extends horizontally and is in contact with the upper sliding seat member 64. The sliding surface 631 allows the elastic receiving member 63 to slide relative to the upper sliding seat member 64.

 上側すべり座部材64は、係止部材65により下側が支持される円環状に形成されており、また上記の弾性受部材63を相対移動可能に支持する部材である。つまり、連結アセンブリ60は、弾性受部材63および上側すべり座部材64によって、積層方向と直交する水平方向にスライド可能なすべり構造74を構成している。上側すべり座部材64の外径は、収容穴522の内径に概ね一致している。これにより、上側すべり座部材64は、収容穴522内にて水平方向のスライドが規制された状態を維持する。 The upper sliding seat member 64 is formed in a circular ring shape with its underside supported by the locking member 65, and is a member that supports the above-mentioned elastic receiving member 63 so that it can move relative to the elastic receiving member 63. In other words, the connecting assembly 60, by using the elastic receiving member 63 and the upper sliding seat member 64, forms a sliding structure 74 that can slide in the horizontal direction perpendicular to the stacking direction. The outer diameter of the upper sliding seat member 64 roughly matches the inner diameter of the accommodation hole 522. As a result, the upper sliding seat member 64 maintains a state in which horizontal sliding within the accommodation hole 522 is restricted.

 実施形態に係る上側すべり座部材64の上面は、水平方向に延在する平坦状の(平滑な)すべり面641となっている。ただし、すべり構造74は、上記の弾性受部材63のすべり面631、および上側すべり座部材64のすべり面641に限定されず、種々の構成をとり得る。例えば、すべり構造74は、弾性受部材63および上側すべり座部材64のうちいずれか一方に、他方のすべり面に接触すると共に転動可能な複数の転動体を有する滑り軸受を適用してもよい。 The upper surface of the upper sliding seat member 64 according to the embodiment is a flat (smooth) sliding surface 641 extending horizontally. However, the sliding structure 74 is not limited to the sliding surface 631 of the elastic receiving member 63 and the sliding surface 641 of the upper sliding seat member 64 described above, and can have various configurations. For example, the sliding structure 74 may be a sliding bearing applied to either the elastic receiving member 63 or the upper sliding seat member 64, the sliding bearing having multiple rolling elements that are in contact with the sliding surface of the other and can roll.

 係止部材65は、平面視で円環状に形成され、収容穴522の内周面に形成された係合溝に嵌め込まれる。この係止部材65は、クーリングプレート52に対して離脱不能に固定されることで、上側すべり座部材64を安定して支持することができる。言い換えれば、雄ネジ部材61、皿バネ62、弾性受部材63および上側すべり座部材64は、係止部材65によって収容穴522からの脱落が防止され、また雄ネジ部材61を鉛直方向に沿って弾力的に支持することが可能となる。 The locking member 65 is formed in a circular ring shape in a plan view, and is fitted into an engagement groove formed on the inner circumferential surface of the accommodation hole 522. This locking member 65 is fixed in an undetachable manner to the cooling plate 52, and is therefore able to stably support the upper sliding seat member 64. In other words, the male screw member 61, disc spring 62, elastic receiving member 63, and upper sliding seat member 64 are prevented from falling out of the accommodation hole 522 by the locking member 65, and it is also possible to elastically support the male screw member 61 along the vertical direction.

 一方、雌ネジ部材66は、連結アセンブリ60において雄ネジ部材61と螺合する部材であり、雄ネジ部材61よりも太く形成されている。この雌ネジ部材66は、鉛直方向に延在する雌ネジ本体661と、雌ネジ本体661の下端に連なるフランジ頭部662と、を有する。雌ネジ本体661およびフランジ頭部662は、相互に一体成形されている。 On the other hand, the female screw member 66 is a member that screws into the male screw member 61 in the connecting assembly 60, and is formed to be thicker than the male screw member 61. This female screw member 66 has a female screw body 661 that extends vertically, and a flange head 662 that is connected to the lower end of the female screw body 661. The female screw body 661 and the flange head 662 are molded integrally with each other.

 雌ネジ本体661は、鉛直方向に沿って直線状に延在しており、また雄ネジ部材61の下側螺合部611よりも長く形成されている。雌ネジ本体661の上端には、雌ネジ穴663の開口が設けられている。雌ネジ穴663は、開口から鉛直方向下側に向かって所定の深さに形成され、その内周面には、雄ネジ部材61のネジ山61aが螺合可能なネジ溝(不図示)が形成されている。また、雌ネジ本体661の下端面には、図示しないレンチ(六角レンチ等)が挿入されて、雌ネジ部材66を回転させるための回転用穴部664が設けられている(図3(A)参照)。 The female screw body 661 extends linearly in the vertical direction and is longer than the lower screw engagement portion 611 of the male screw member 61. An opening for a female screw hole 663 is provided at the upper end of the female screw body 661. The female screw hole 663 is formed vertically downward from the opening to a predetermined depth, and its inner peripheral surface is formed with a screw groove (not shown) into which the thread 61a of the male screw member 61 can be screwed. In addition, a rotation hole portion 664 is provided at the lower end surface of the female screw body 661 for inserting a wrench (such as a hexagonal wrench) (not shown) to rotate the female screw member 66 (see FIG. 3(A)).

 フランジ頭部662は、雌ネジ本体661の下端において径方向外側に短く突出している。このフランジ頭部662の上面には、ワッシャ67が積層される。ワッシャ67は、円環状に形成され、フランジ頭部662に支持されると共に、フランジ頭部662の外周面よりも径方向外側に突出している。 The flange head 662 protrudes a short distance radially outward from the lower end of the female screw body 661. A washer 67 is layered on the upper surface of this flange head 662. The washer 67 is formed in an annular shape, is supported by the flange head 662, and protrudes radially outward beyond the outer circumferential surface of the flange head 662.

 下側すべり座部材68は、円環状に形成され、ワッシャ67に支持されると共に、雌ネジ本体661の外周面に外装される。下側すべり座部材68の内径は、雌ネジ本体661の外径に概ね一致している。これにより、下側すべり座部材68は雌ネジ部材66と一体に移動可能となっている。下側すべり座部材68は、上側すべり座部材64と同様に、その上面に積層されるガイド部材69をスライド可能に支持する。 The lower sliding seat member 68 is formed in an annular shape, supported by a washer 67, and fitted onto the outer circumferential surface of the female screw body 661. The inner diameter of the lower sliding seat member 68 roughly matches the outer diameter of the female screw body 661. This allows the lower sliding seat member 68 to move integrally with the female screw member 66. The lower sliding seat member 68, like the upper sliding seat member 64, slidably supports the guide member 69 that is stacked on its upper surface.

 実施形態に係る下側すべり座部材68の上面は、水平方向に延在する平坦状の(平滑な)すべり面681となっている。ただし、下側すべり座部材68およびガイド部材69のすべり構造74は、これに限定されず、例えば、下側すべり座部材68およびガイド部材69のうちいずれか一方に、複数の転動体を有する滑り軸受を適用してもよい。 The upper surface of the lower sliding seat member 68 according to the embodiment is a flat (smooth) sliding surface 681 extending horizontally. However, the sliding structure 74 of the lower sliding seat member 68 and the guide member 69 is not limited to this, and for example, a sliding bearing having multiple rolling elements may be applied to either the lower sliding seat member 68 or the guide member 69.

 ガイド部材69は、下側すべり座部材68に支持されると共に、雌ネジ本体661の外周面に外装される。ただし、ガイド部材69の内径は、雌ネジ本体661の外径よりも大きく形成されており、ガイド部材69の内周面と雌ネジ本体661の外周面との間には、隙間C2が生じている。この隙間C2は、雌ネジ本体661に対する雌ネジホルダ70の水平方向のスライドを許容する。 The guide member 69 is supported by the lower sliding seat member 68 and is fitted to the outer circumferential surface of the female screw body 661. However, the inner diameter of the guide member 69 is larger than the outer diameter of the female screw body 661, and a gap C2 is created between the inner circumferential surface of the guide member 69 and the outer circumferential surface of the female screw body 661. This gap C2 allows the female screw holder 70 to slide horizontally relative to the female screw body 661.

 また、ガイド部材69は、平面視でD字形状に形成されており、同じくD字形状に形成された雌ネジホルダ70の貫通孔703(下側孔703b)に挿入される(図3(A)も参照)。これにより、ガイド部材69は、雌ネジホルダ70の向きを一定の方向に沿わせることができる。 The guide member 69 is formed in a D-shape in a plan view, and is inserted into the through-hole 703 (lower hole 703b) of the female screw holder 70, which is also formed in a D-shape (see also FIG. 3(A)). This allows the guide member 69 to align the female screw holder 70 in a fixed direction.

 雌ネジホルダ70は、クーリングプレート52の収容穴522に対向するように設けられ、雌ネジ部材66の側周囲を覆いながら、天井部材51の取付用段差部511に引っ掛かる角筒状の部材に構成されている。具体的には、雌ネジホルダ70は、鉛直方向に沿って雌ネジ部材66と同程度の長さで延在するホルダ部701と、ホルダ部701の下側において天井部材51側に突出する係合凸部702と、を備える。 The female screw holder 70 is arranged to face the accommodation hole 522 of the cooling plate 52, and is configured as a square tube-shaped member that covers the side periphery of the female screw member 66 and hooks onto the mounting step 511 of the ceiling member 51. Specifically, the female screw holder 70 has a holder portion 701 that extends vertically to a length approximately equal to that of the female screw member 66, and an engagement protrusion 702 that protrudes from the lower side of the holder portion 701 toward the ceiling member 51.

 ホルダ部701の内部には、雌ネジ部材66を配置するための貫通孔703が形成されている。貫通孔703は、上部において雌ネジ本体661が配置される上側孔703aと、上側孔703aの下部においてフランジ頭部662、ワッシャ67、下側すべり座部材68およびガイド部材69が配置される下側孔703bを、を含む。上側孔703aの内径は、雌ネジ部材66の雌ネジ本体661の外径よりも大きく形成され、隙間C2を形成している。下側孔703bは、D字形状に形成され、ガイド部材69を収容している。 A through hole 703 for placing the female screw member 66 is formed inside the holder portion 701. The through hole 703 includes an upper hole 703a in which the female screw body 661 is placed at the top, and a lower hole 703b in which the flange head 662, washer 67, lower sliding seat member 68, and guide member 69 are placed below the upper hole 703a. The inner diameter of the upper hole 703a is formed larger than the outer diameter of the female screw body 661 of the female screw member 66, forming a gap C2. The lower hole 703b is formed in a D-shape and houses the guide member 69.

 係合凸部702は、天井部材51に向かって突出しており、その上面が天井部材51の取付用段差部511に接触する。連結アセンブリ60は、雄ネジ部材61および雌ネジ部材66の螺合によって相互の軸方向長さを調整することで、係合凸部702が取付用段差部511に接触して、天井部材51をクランプすることが可能となる。つまり、連結アセンブリ60は、クーリングプレート52に連結される係止部材65と、天井部材51に係合する雌ネジホルダ70との間で、天井部材51およびクーリングプレート52を挟み込んだ状態となる。 The engaging protrusion 702 protrudes toward the ceiling member 51, and its upper surface contacts the mounting step 511 of the ceiling member 51. The connecting assembly 60 adjusts the axial length of the male screw member 61 and the female screw member 66 by screwing them together, so that the engaging protrusion 702 comes into contact with the mounting step 511 and can clamp the ceiling member 51. In other words, the connecting assembly 60 sandwiches the ceiling member 51 and the cooling plate 52 between the locking member 65 connected to the cooling plate 52 and the female screw holder 70 that engages with the ceiling member 51.

 また、保護ケース71は、プラズマ処理チャンバ10の側壁10aからシャワーヘッド50の天井部材51まで延在して、上記の連結アセンブリ60を覆うことで、プラズマ処理空間10sに連結アセンブリ60が露出されることを防止する。 The protective case 71 also extends from the sidewall 10a of the plasma processing chamber 10 to the ceiling member 51 of the shower head 50, covering the above-mentioned connection assembly 60 and preventing the connection assembly 60 from being exposed to the plasma processing space 10s.

 絶縁部材72は、プラズマ処理チャンバ10の側壁10aと、シャワーヘッド50(連結アセンブリ60を含む)との間に設けられることで、上部電極として機能する天井部材51を側壁10aから絶縁する。これにより、プラズマ処理装置1は、電源30から天井部材51に供給した信号に基づき、プラズマ処理空間10sにプラズマを安定的に生成することができる。 The insulating member 72 is provided between the sidewall 10a of the plasma processing chamber 10 and the shower head 50 (including the connecting assembly 60), thereby insulating the ceiling member 51, which functions as an upper electrode, from the sidewall 10a. This allows the plasma processing apparatus 1 to stably generate plasma in the plasma processing space 10s based on a signal supplied from the power source 30 to the ceiling member 51.

[プラズマ処理装置1の作用]
 実施形態に係るプラズマ処理装置1は、基本的には以上のように構成され、以下その作用について説明する。
[Function of Plasma Processing Apparatus 1]
The plasma processing apparatus 1 according to the embodiment is basically configured as described above, and its operation will be described below.

 図1に示すように、プラズマ処理装置1は、シャワーヘッド50によりプラズマ処理チャンバ10のプラズマ処理空間10sに処理ガスを供給する。また、プラズマ処理装置1は、電源30からシャワーヘッド50にソースRF信号またはバイアスRF信号を供給して、プラズマ処理空間10sにプラズマを生成する。シャワーヘッド50は、プラズマ処理空間10sにて生成されたプラズマの熱を受けることになる。ここで、シャワーヘッド50の天井部材51とクーリングプレート52とは、熱膨張係数が異なる材料により形成されている。このため、天井部材51およびクーリングプレート52は、プラズマの入熱において熱膨張の差が生じる。 As shown in FIG. 1, the plasma processing apparatus 1 supplies processing gas to the plasma processing space 10s of the plasma processing chamber 10 through the shower head 50. The plasma processing apparatus 1 also supplies a source RF signal or a bias RF signal from the power supply 30 to the shower head 50 to generate plasma in the plasma processing space 10s. The shower head 50 receives heat from the plasma generated in the plasma processing space 10s. The ceiling member 51 and the cooling plate 52 of the shower head 50 are made of materials with different thermal expansion coefficients. Therefore, a difference in thermal expansion occurs between the ceiling member 51 and the cooling plate 52 when the heat of the plasma is input.

 仮に、天井部材51およびクーリングプレート52を、単純な構成であるネジ(不図示)によって締結している場合には、相互の熱膨張に差が生じることで、天井部材51、クーリングプレート52またはネジ自体に熱膨張の応力がかかることになる。この応力が大きい場合には、天井部材51やクーリングプレート52が割れる等の損傷を受けるおそれがある。これに対して、実施形態に係るプラズマ処理装置1は、上記したように、天井部材51とクーリングプレート52との連結において、連結アセンブリ60を適用している。 If the ceiling member 51 and the cooling plate 52 were fastened together with a simple screw (not shown), a difference in their mutual thermal expansion would result in thermal expansion stress being applied to the ceiling member 51, the cooling plate 52, or the screw itself. If this stress is large, the ceiling member 51 or the cooling plate 52 may be damaged, such as cracked. In response to this, the plasma processing apparatus 1 according to the embodiment uses a connection assembly 60 to connect the ceiling member 51 and the cooling plate 52, as described above.

 図3(A)は、クーリングプレート52が熱膨張していない状態の連結アセンブリ60を示す第1拡大図である。図3(B)は、クーリングプレート52が熱膨張した状態の連結アセンブリ60を示す第2拡大図である。図4は、天井部材51が熱膨張した状態の連結アセンブリ60を示す第3拡大図である。なお、図3および図4において、中図は、上図のA‐A線断面図を示しており、下図は、上図の矢印B方向の矢視図を示している。 Fig. 3(A) is a first enlarged view showing the connecting assembly 60 when the cooling plate 52 is not thermally expanded. Fig. 3(B) is a second enlarged view showing the connecting assembly 60 when the cooling plate 52 is thermally expanded. Fig. 4 is a third enlarged view showing the connecting assembly 60 when the ceiling member 51 is thermally expanded. In Figs. 3 and 4, the middle view shows a cross-sectional view along line A-A in the upper view, and the lower view shows a view in the direction of arrow B in the upper view.

 図3(A)に示すように、シャワーヘッド50に熱膨張が生じていない場合に、連結アセンブリ60は、クーリングプレート52の収容穴522の内周面と、雄ネジ部材61、皿バネ62および弾性受部材63との間に隙間C1を形成している。連結アセンブリ60は、この隙間C1により、上側すべり座部材64(および係止部材65)に対する、雄ネジ部材61、皿バネ62、弾性受部材63等の相対移動を許容している。 As shown in FIG. 3A, when there is no thermal expansion in the shower head 50, the connecting assembly 60 forms a gap C1 between the inner circumferential surface of the accommodation hole 522 of the cooling plate 52 and the male screw member 61, the disc spring 62, and the elastic receiving member 63. This gap C1 allows the connecting assembly 60 to allow relative movement of the male screw member 61, the disc spring 62, the elastic receiving member 63, etc. with respect to the upper sliding seat member 64 (and the locking member 65).

 同様に、連結アセンブリ60は、雌ネジ部材66、ワッシャ67および下側すべり座部材68と、ガイド部材69および雌ネジホルダ70の貫通孔703の内周面との間に隙間C2を形成している。連結アセンブリ60は、この隙間C2により、下側すべり座部材68に対する、ガイド部材69および雌ネジホルダ70の相対移動を許容している。 Similarly, the connecting assembly 60 forms a gap C2 between the female screw member 66, washer 67, and lower sliding seat member 68 and the guide member 69 and the inner circumferential surface of the through hole 703 of the female screw holder 70. This gap C2 allows the connecting assembly 60 to move the guide member 69 and the female screw holder 70 relative to the lower sliding seat member 68.

 そして、連結アセンブリ60は、隙間C1、C2を備えている場合でも、雄ネジ部材61と雌ネジ部材66の螺合によって、天井部材51とクーリングプレート52を強固にクランプすることができる。具体的には、収容穴522に収容された雄ネジ部材61は、フランジ614、皿バネ62、弾性受部材63、上側すべり座部材64および係止部材65を介して、クーリングプレート52に引っ掛かる。これにより、連結アセンブリ60は、クーリングプレート52を鉛直方向下側に押し下げる力をかける。一方、雌ネジ部材66は、フランジ頭部662、ワッシャ67、下側すべり座部材68、ガイド部材69および雌ネジホルダ70を介して天井部材51の取付用段差部511に引っ掛かる。これにより、連結アセンブリ60は、天井部材51を鉛直方向上側に押し上げる力をかける。したがって、連結アセンブリ60は、天井部材51およびクーリングプレート52を強固にクランプして、両部材を密着させることが可能となる。プラズマ処理時に、プラズマ処理空間10sのプラズマが天井部材51に入熱しても、シャワーヘッド50は、天井部材51からクーリングプレート52にスムーズに放熱することができる。 Even if the connecting assembly 60 has the gaps C1 and C2, the male screw member 61 and the female screw member 66 are screwed together to firmly clamp the ceiling member 51 and the cooling plate 52. Specifically, the male screw member 61 accommodated in the accommodation hole 522 is hooked onto the cooling plate 52 via the flange 614, the disc spring 62, the elastic receiving member 63, the upper sliding seat member 64, and the locking member 65. As a result, the connecting assembly 60 applies a force that pushes the cooling plate 52 downward in the vertical direction. Meanwhile, the female screw member 66 is hooked onto the mounting step portion 511 of the ceiling member 51 via the flange head 662, the washer 67, the lower sliding seat member 68, the guide member 69, and the female screw holder 70. As a result, the connecting assembly 60 applies a force that pushes the ceiling member 51 upward in the vertical direction. Therefore, the connection assembly 60 can firmly clamp the ceiling member 51 and the cooling plate 52, bringing the two members into close contact. Even if the plasma in the plasma processing space 10s inputs heat to the ceiling member 51 during plasma processing, the shower head 50 can smoothly dissipate the heat from the ceiling member 51 to the cooling plate 52.

 次に図3(B)を参照して、天井部材51に対してクーリングプレート52が大きく熱膨張した場合について説明する。クーリングプレート52が熱膨張すると、クーリングプレート52の径方向外側に設けられる突出外周部521も、径方向外側に移動(膨出)する。これにより、収容穴522に挿入されている係止部材65、および係止部材65に支持されている上側すべり座部材64も、水平方向外側(クーリングプレート52の径方向外側)にスライドする。 Next, referring to FIG. 3(B), a case where the cooling plate 52 undergoes large thermal expansion relative to the ceiling member 51 will be described. When the cooling plate 52 undergoes thermal expansion, the protruding outer periphery 521 provided on the radially outer side of the cooling plate 52 also moves (expands) radially outward. As a result, the locking member 65 inserted into the accommodation hole 522 and the upper sliding seat member 64 supported by the locking member 65 also slide horizontally outward (radially outward of the cooling plate 52).

 ただし、上側すべり座部材64のすべり面641に対しすべり面631により接触している弾性受部材63は、すべり面631、641同士が水平方向にすべることで、上側すべり座部材64のスライドに追従しない。これにより、弾性受部材63と相対的に、上側すべり座部材64がスライドすることになる。この結果、連結アセンブリ60は、クーリングプレート52の熱膨張に伴い係止部材65、上側すべり座部材64を水平方向外側に移動させる一方で、弾性受部材63、皿バネ62、雄ネジ部材61等の位置を維持する。よって、隙間C1の内側(クーリングプレート52の中心方向側)が小さくなる。 However, the elastic receiving member 63, which is in contact with the sliding surface 641 of the upper sliding seat member 64 via the sliding surface 631, does not follow the sliding of the upper sliding seat member 64 because the sliding surfaces 631, 641 slide horizontally against each other. This causes the upper sliding seat member 64 to slide relative to the elastic receiving member 63. As a result, the connecting assembly 60 moves the locking member 65 and the upper sliding seat member 64 horizontally outward in response to thermal expansion of the cooling plate 52, while maintaining the positions of the elastic receiving member 63, disc spring 62, male screw member 61, etc. Therefore, the inside of the gap C1 (towards the center of the cooling plate 52) becomes smaller.

 雄ネジ部材61は、クーリングプレート52の熱膨張によっても変位しないことで、雌ネジ部材66との螺合を良好に維持できる。連結アセンブリ60は、クーリングプレート52の熱膨張の応力が締結構造73にかかることを抑制でき、連結アセンブリ60の損傷、天井部材51またはクーリングプレート52の損傷等を回避することが可能となる。 The male screw member 61 is not displaced even by the thermal expansion of the cooling plate 52, and can maintain good screw engagement with the female screw member 66. The connecting assembly 60 can prevent the stress of the thermal expansion of the cooling plate 52 from being applied to the fastening structure 73, making it possible to avoid damage to the connecting assembly 60, the ceiling member 51, or the cooling plate 52, etc.

 次に、図4に示すように、クーリングプレート52に対して天井部材51が熱膨張した場合について説明する。例えば、クーリングプレート52において熱交換を行っていない、または熱交換の開始初期等では、天井部材51が熱膨張することがある。天井部材51が熱膨張すると、取付用段差部511も径方向外側に移動する。これにより、取付用段差部511に係合している雌ネジホルダ70も、水平方向(天井部材51の径方向外側)にスライドする。 Next, as shown in FIG. 4, a case where the ceiling member 51 thermally expands relative to the cooling plate 52 will be described. For example, when no heat exchange is taking place in the cooling plate 52 or at the beginning of heat exchange, the ceiling member 51 may thermally expand. When the ceiling member 51 thermally expands, the mounting step portion 511 also moves radially outward. As a result, the female screw holder 70 engaged with the mounting step portion 511 also slides horizontally (radially outward from the ceiling member 51).

 雌ネジホルダ70のガイド部材69は、すべり面691により下側すべり座部材68のすべり面681に接触していることで、下側すべり座部材68に対して相対移動する。言い換えれば、雌ネジ部材66、ワッシャ67、下側すべり座部材68は、雌ネジホルダ70やガイド部材69のスライドに追従しない。この結果、連結アセンブリ60は、隙間C2の内側(天井部材51の中心方向側)を小さくしながら、天井部材51の熱膨張を受容することができる。 The guide member 69 of the female screw holder 70 moves relative to the lower sliding seat member 68 because the sliding surface 691 contacts the sliding surface 681 of the lower sliding seat member 68. In other words, the female screw member 66, washer 67, and lower sliding seat member 68 do not follow the sliding of the female screw holder 70 or guide member 69. As a result, the connecting assembly 60 can accommodate the thermal expansion of the ceiling member 51 while reducing the inside of the gap C2 (the side toward the center of the ceiling member 51).

 例えば、雌ネジ部材66は、天井部材51の熱膨張によっても変位しないことで、雄ネジ部材61との螺合を良好に維持できる。連結アセンブリ60は、天井部材51の熱膨張の応力が締結構造73にかかることを抑制でき、連結アセンブリ60の損傷、天井部材51またはクーリングプレート52の損傷等を回避できる。 For example, the female screw member 66 is not displaced even by the thermal expansion of the ceiling member 51, and can maintain good screw engagement with the male screw member 61. The connecting assembly 60 can prevent the stress of the thermal expansion of the ceiling member 51 from being applied to the fastening structure 73, and can avoid damage to the connecting assembly 60, the ceiling member 51, or the cooling plate 52, etc.

 以上のように、連結アセンブリ60は、すべり構造74を有することで、熱膨張係数が異なる部材同士を安定して連結することができる。しかも、連結アセンブリ60は、複数箇所(雄ネジ部材61に対応する箇所と、雌ネジ部材66に対応する箇所)において、スライド可能なすべり構造74を備えることで、熱膨張が大きい部材の位置に応じて当該熱膨張を適切に許容することが可能となる。また、複数のすべり構造74は、熱膨張に大きな差が生じても、当該熱膨張を受容できる。 As described above, the connecting assembly 60 has a sliding structure 74, which allows it to stably connect components with different thermal expansion coefficients. Furthermore, the connecting assembly 60 has sliding structures 74 at multiple locations (locations corresponding to the male threaded member 61 and locations corresponding to the female threaded member 66), which allows it to appropriately accommodate thermal expansion depending on the location of the component with large thermal expansion. Furthermore, the multiple sliding structures 74 can accommodate thermal expansion even when there is a large difference in thermal expansion.

 また、連結アセンブリ60は、雄ネジ部材61および雌ネジ部材66の螺合における軸方向の長さを調整することで、天井部材51およびクーリングプレート52を強固に密着させることができる。さらに、連結アセンブリ60は、締結構造73(雄ネジ部材61、雌ネジ部材66)の外周面よりも外側にすべり構造74を備えることで、締結構造73の螺合を維持しながら、すべり構造74において適切にスライドを実行させることができる。特に、すべり構造74は、雌ネジ部材66の隣接位置に配置されていることで、熱膨張において雌ネジ部材66にかかるせん断力を簡単に吸収することができる。さらに、すべり構造74は、雄ネジ部材61の隣接位置に配置されていることで、熱膨張において雄ネジ部材61にかかるせん断力も簡単に吸収することができる。 The connecting assembly 60 can firmly attach the ceiling member 51 and the cooling plate 52 by adjusting the axial length of the screwed male screw member 61 and the female screw member 66. Furthermore, the connecting assembly 60 has a sliding structure 74 outside the outer circumferential surface of the fastening structure 73 (male screw member 61, female screw member 66), so that the sliding structure 74 can slide appropriately while maintaining the screwed fastening structure 73. In particular, the sliding structure 74 is disposed adjacent to the female screw member 66, so that it can easily absorb the shear force applied to the female screw member 66 during thermal expansion. Furthermore, the sliding structure 74 is disposed adjacent to the male screw member 61, so that it can easily absorb the shear force applied to the male screw member 61 during thermal expansion.

 そして、すべり構造74は、2つのすべり面631、641(またはすべり面681、691)同士を接触させていることで、簡単な構成によって積層方向と直交する方向へのスライドを実行させることができる。あるいは、すべり構造74は、すべり面に接触する転動体を有する部材を適用した場合に、一層スムーズなスライドを実行させることができる。 The sliding structure 74 has two sliding surfaces 631, 641 (or sliding surfaces 681, 691) in contact with each other, and thus can perform sliding in a direction perpendicular to the stacking direction with a simple configuration. Alternatively, when a member having a rolling body that contacts the sliding surface is used, the sliding structure 74 can perform even smoother sliding.

 なお、本開示の技術は、上記の実施形態に限定されず、種々の変形例をとり得る。例えば、実施形態に係る連結アセンブリ60は、シャワーヘッド50の天井部材51およびクーリングプレート52を連結するものであった。しかしながら、連結アセンブリ60は、プラズマ処理チャンバ10内の他の部材同士を連結するものでもよい。例えば、他の部材としては、基板支持部11、プラズマ処理チャンバ10に取り付けられるバッフル板、遮蔽部材等があげられる。またプラズマ処理チャンバ10が複数の部材により組み立てられている場合に、連結アセンブリ60は、当該プラズマ処理チャンバ10を連結する連結部として用いてよい。また、連結アセンブリ60は、プラズマ処理を行わずに加熱処理を行う基板処理装置に適用されてもよい。 The technology disclosed herein is not limited to the above embodiment, and various modifications are possible. For example, the connection assembly 60 according to the embodiment connects the ceiling member 51 and the cooling plate 52 of the shower head 50. However, the connection assembly 60 may connect other members in the plasma processing chamber 10. For example, the other members include the substrate support 11, a baffle plate attached to the plasma processing chamber 10, a shielding member, etc. In addition, when the plasma processing chamber 10 is assembled from multiple members, the connection assembly 60 may be used as a connection part that connects the plasma processing chambers 10. In addition, the connection assembly 60 may be applied to a substrate processing apparatus that performs a heat treatment without performing a plasma treatment.

 また、例えば、実施形態に係る連結アセンブリ60は、雄ネジ部材61をクーリングプレート52側に配置し、雌ネジ部材66を天井部材51側に配置した。しかしながら、この配置は逆であってもよい。 Also, for example, in the connection assembly 60 according to the embodiment, the male thread member 61 is disposed on the cooling plate 52 side, and the female thread member 66 is disposed on the ceiling member 51 side. However, this arrangement may be reversed.

 また、実施形態に係る連結アセンブリ60は、天井部材51の取付用段差部511に雌ネジホルダ70の係合凸部702を係合させる構成とした。しかしながら、天井部材51が上記した貫通孔703と同様の構成の孔部を有する場合には、雌ネジホルダ70を適用せずに、雌ネジ部材66により天井部材51を締結することができる。この場合、雌ネジ部材66と天井部材51との間には、ワッシャ67、下側すべり座部材68、ガイド部材69等が介在してもよい。 The connecting assembly 60 according to the embodiment is configured to engage the engaging protrusion 702 of the female screw holder 70 with the mounting step 511 of the ceiling member 51. However, if the ceiling member 51 has a hole with a similar configuration to the through hole 703 described above, the ceiling member 51 can be fastened with the female screw member 66 without using the female screw holder 70. In this case, a washer 67, a lower sliding seat member 68, a guide member 69, etc. may be interposed between the female screw member 66 and the ceiling member 51.

[変形例]
 次に、変形例に係る連結アセンブリ60Aについて、図5および図6を参照しながら説明する。図5は、変形例に係る連結アセンブリ60Aを有するシャワーヘッド50の外周部付近を拡大して示す断面図である。図6(A)は、クーリングプレート52が熱膨張していない状態の変形例に係る連結アセンブリ60Aを示す第1拡大図である。図6(B)は、クーリングプレート52が熱膨張した状態の変形例に係る連結アセンブリ60Aを示す第2拡大図である。なお、図6(A)および図6(B)の下図は、上図の矢印B方向の矢視図を示している。
[Modification]
Next, a connection assembly 60A according to a modified example will be described with reference to Figs. 5 and 6. Fig. 5 is an enlarged cross-sectional view showing the vicinity of the outer periphery of the shower head 50 having the connection assembly 60A according to the modified example. Fig. 6(A) is a first enlarged view showing the connection assembly 60A according to the modified example in a state in which the cooling plate 52 is not thermally expanded. Fig. 6(B) is a second enlarged view showing the connection assembly 60A according to the modified example in a state in which the cooling plate 52 is thermally expanded. The lower diagrams of Figs. 6(A) and 6(B) show views in the direction of the arrow B in the upper diagrams.

 変形例に係る連結アセンブリ60Aは、雌ネジ部材66の隣接位置(雌ネジ部材66と雌ネジホルダ70との間)にすべり構造74を有する一方で、雄ネジ部材61の隣接位置にすべり構造74を備えない点で、上記の連結アセンブリ60と異なる。 The modified connecting assembly 60A differs from the connecting assembly 60 in that it has a sliding structure 74 adjacent to the female threaded member 66 (between the female threaded member 66 and the female threaded holder 70), but does not have a sliding structure 74 adjacent to the male threaded member 61.

 具体的には、連結アセンブリ60Aは、雄ネジ部材61、皿バネ62、弾性受部材63、係止部材65、雌ネジ部材66、ワッシャ67、下側すべり座部材68、ガイド部材69および雌ネジホルダ70を含む。そして、雌ネジ部材66は、雄ネジ部材61に螺合して収容穴522に配置された状態で、弾性受部材63に挿入される。 Specifically, the connection assembly 60A includes a male screw member 61, a disc spring 62, an elastic receiving member 63, a locking member 65, a female screw member 66, a washer 67, a lower sliding seat member 68, a guide member 69, and a female screw holder 70. The female screw member 66 is inserted into the elastic receiving member 63 while being screwed into the male screw member 61 and placed in the receiving hole 522.

 雄ネジ部材61は、下側螺合部611、中間棒部612、および頭部613を有する。また、皿バネ62は、径方向外側に突出している頭部613に対して一端が接触すると共に、中間棒部612の外周面に外装される。 The male screw member 61 has a lower screw-in portion 611, an intermediate rod portion 612, and a head portion 613. The disc spring 62 has one end in contact with the head portion 613, which protrudes radially outward, and is fitted to the outer circumferential surface of the intermediate rod portion 612.

 弾性受部材63は、鉛直方向に沿って延在する円筒状に形成され、鉛直方向下側において収容穴522に嵌め込まれた係止部材65に支持されている。弾性受部材63は、鉛直方向下側から雌ネジ部材66が挿入可能な穴部63hを有している。また、弾性受部材63の外径は、収容穴522の内径と略一致しており、クーリングプレート52との間に隙間C1(図3(A)参照)を備えない構成としている。これにより、クーリングプレート52が熱膨張した場合に、弾性受部材63および雌ネジ部材66も熱膨張に追従して水平方向に移動することになる。 The elastic receiving member 63 is formed in a cylindrical shape extending along the vertical direction, and is supported by a locking member 65 fitted into the accommodation hole 522 at its vertically lower side. The elastic receiving member 63 has a hole portion 63h into which the female screw member 66 can be inserted from the vertically lower side. The outer diameter of the elastic receiving member 63 is approximately the same as the inner diameter of the accommodation hole 522, and is configured so that there is no gap C1 (see Figure 3 (A)) between it and the cooling plate 52. As a result, when the cooling plate 52 thermally expands, the elastic receiving member 63 and the female screw member 66 also move horizontally in response to the thermal expansion.

 一方、雌ネジ部材66は、雌ネジ本体661およびフランジ頭部662を有し、雌ネジ本体661の上端が弾性受部材63に挿入される共に、収容穴522に収容される。ワッシャ67は、この雌ネジ部材66のフランジ頭部662に支持される。 On the other hand, the female screw member 66 has a female screw body 661 and a flange head 662, and the upper end of the female screw body 661 is inserted into the elastic receiving member 63 and accommodated in the accommodation hole 522. The washer 67 is supported by the flange head 662 of this female screw member 66.

 下側すべり座部材68は、円環状に形成され、その上面にすべり面681を有する。ガイド部材69は、下側すべり座部材68に接触する下面にすべり面691を有する。つまり、連結アセンブリ60Aは、下側すべり座部材68とガイド部材69とによって1つのすべり構造74を形成している。 The lower sliding seat member 68 is formed in an annular shape and has a sliding surface 681 on its upper surface. The guide member 69 has a sliding surface 691 on its lower surface that contacts the lower sliding seat member 68. In other words, the connecting assembly 60A forms a single sliding structure 74 by the lower sliding seat member 68 and the guide member 69.

 ガイド部材69は、雌ネジホルダ70に固定されている。雌ネジホルダ70は、ホルダ部701、係合凸部702を有し、係合凸部702により天井部材51の取付用段差部511に係合する。また、雌ネジホルダ70の貫通孔703は、上側孔703a、下側孔703bを有し、雌ネジ部材66との間に隙間C2を形成している。さらに、貫通孔703の下側孔703bは、雌ネジ部材66のフランジ頭部662を一方向に沿って移動させる長孔に形成されている。 The guide member 69 is fixed to the female screw holder 70. The female screw holder 70 has a holder portion 701 and an engaging protrusion 702, and the engaging protrusion 702 engages with the mounting step portion 511 of the ceiling member 51. The through hole 703 of the female screw holder 70 has an upper hole 703a and a lower hole 703b, and forms a gap C2 between the female screw member 66. Furthermore, the lower hole 703b of the through hole 703 is formed as an elongated hole that moves the flange head 662 of the female screw member 66 in one direction.

 変形例に係る連結アセンブリ60は、基本的には以上のように形成され、以下その作用について説明する。 The modified connecting assembly 60 is basically formed as described above, and its function will be explained below.

 図6(A)に示すように、連結アセンブリ60Aは、雄ネジ部材61と雌ネジ部材66の螺合によって天井部材51とクーリングプレート52を強固に挟持している。具体的には、雄ネジ部材61は、フランジ614、皿バネ62、弾性受部材63および係止部材65を介してクーリングプレート52に引っ掛かることで、当該クーリングプレート52を鉛直方向下側に押し下げている。雌ネジ部材66は、フランジ頭部662、ワッシャ67、下側すべり座部材68、ガイド部材69および雌ネジホルダ70に突出外周部521に引っ掛かることで、天井部材51を鉛直方向上側に押し上げている。したがって、連結アセンブリ60Aは、天井部材51およびクーリングプレート52を密着させることが可能となる。 As shown in FIG. 6(A), the connecting assembly 60A firmly clamps the ceiling member 51 and the cooling plate 52 by screwing together the male screw member 61 and the female screw member 66. Specifically, the male screw member 61 is hooked onto the cooling plate 52 via the flange 614, the disc spring 62, the elastic receiving member 63, and the locking member 65, thereby pushing the cooling plate 52 downward in the vertical direction. The female screw member 66 is hooked onto the flange head 662, the washer 67, the lower sliding seat member 68, the guide member 69, and the female screw holder 70 at the protruding outer periphery 521, thereby pushing the ceiling member 51 upward in the vertical direction. Therefore, the connecting assembly 60A makes it possible to bring the ceiling member 51 and the cooling plate 52 into close contact with each other.

 そして、連結アセンブリ60Aは、シャワーヘッド50に熱膨張が生じていない場合に、雌ネジ部材66(雌ネジ本体661、フランジ頭部662)の外周面と、ガイド部材69および雌ネジホルダ70の貫通孔703の内周面との間に隙間C2を形成している。 When no thermal expansion occurs in the shower head 50, the connecting assembly 60A forms a gap C2 between the outer peripheral surface of the female screw member 66 (female screw body 661, flange head 662) and the inner peripheral surface of the through hole 703 of the guide member 69 and the female screw holder 70.

 図6(B)に示すように、クーリングプレート52が熱膨張すると、突出外周部521も径方向外側に移動し、収容穴522に挿入されている係止部材65、および係止部材65に支持されている弾性受部材63も水平方向(クーリングプレート52の径方向外側)にスライドする。これにより、弾性受部材63に収容されている雌ネジ部材66も水平方向にスライドする。 As shown in FIG. 6(B), when the cooling plate 52 thermally expands, the protruding outer periphery 521 also moves radially outward, and the locking member 65 inserted into the accommodation hole 522 and the elastic receiving member 63 supported by the locking member 65 also slide horizontally (radially outward of the cooling plate 52). This causes the female screw member 66 accommodated in the elastic receiving member 63 to also slide horizontally.

 さらに、雌ネジ部材66の水平方向のスライドにより、ワッシャ67および下側すべり座部材68もスライドする。その一方で、下側すべり座部材68のすべり面681に対して、すべり面691により接触しているガイド部材69は、下側すべり座部材68のスライドに追従しない。これにより、ガイド部材69に対して下側すべり座部材68が相対移動することになる。この結果、連結アセンブリ60Aは、隙間C2の外側(クーリングプレート52から離れる方向側)を小さくしながら、クーリングプレート52の熱膨張を受容することができる。 Furthermore, the horizontal sliding of the female screw member 66 also causes the washer 67 and the lower sliding seat member 68 to slide. Meanwhile, the guide member 69, which is in contact with the sliding surface 681 of the lower sliding seat member 68 via the sliding surface 691, does not follow the sliding of the lower sliding seat member 68. This causes the lower sliding seat member 68 to move relative to the guide member 69. As a result, the connecting assembly 60A can accommodate the thermal expansion of the cooling plate 52 while reducing the outer side of the gap C2 (the side away from the cooling plate 52).

 例えば、雌ネジ部材66は、クーリングプレート52の熱膨張によっても変位しない状態を維持できる。したがって、クーリングプレート52の熱膨張の応力が締結構造73に及ぶことが抑制され、連結アセンブリ60Aの損傷、天井部材51またはクーリングプレート52の損傷を回避できる。 For example, the female screw member 66 can be maintained in a state where it is not displaced even by the thermal expansion of the cooling plate 52. This prevents the stress of the thermal expansion of the cooling plate 52 from being exerted on the fastening structure 73, and prevents damage to the connecting assembly 60A, the ceiling member 51, or the cooling plate 52.

 以上のように変形例に係る連結アセンブリ60Aでも、熱膨張係数が異なる2つの部材を良好に連結することができ、また複数の部材の熱膨張の差を許容することが可能となる。特に、連結アセンブリ60Aは、1つのすべり構造74を備えることで、構造をより簡素化することができ、製造コストを低廉化することが可能となる。 As described above, the modified connecting assembly 60A can also effectively connect two components with different thermal expansion coefficients, and can tolerate the difference in thermal expansion of multiple components. In particular, by providing the connecting assembly 60A with a single sliding structure 74, the structure can be further simplified, making it possible to reduce manufacturing costs.

 以上に開示された実施形態は、例えば、以下の態様を含む。 The embodiments disclosed above include, for example, the following aspects:

 [付記1]
 基板を処理する基板処理装置であって、
 相互に積層され、かつ相互に異なる熱膨張係数を有する第1部材および第2部材と、
 前記第1部材および前記第2部材の積層方向に平行して延在し、前記第1部材と前記第2部材を連結する連結アセンブリと、を備え、
 前記連結アセンブリは、前記第1部材および/または前記第2部材の熱膨張時に、前記積層方向と直交する方向にスライド可能なすべり構造を有する、
 基板処理装置。
[付記2]
 前記連結アセンブリは、前記積層方向に延在して相互に螺合する雄ネジ部材および雌ネジ部材を有し、
 前記雄ネジ部材および前記雌ネジ部材の螺合における軸方向の長さを調整することで、前記第1部材および前記第2部材に対するクランプ力を調整する、
 付記1に記載の基板処理装置。
[付記3]
 前記すべり構造は、前記雄ネジ部材の外周面および前記雌ネジ部材の外周面よりも外側に設けられる、
 付記2に記載の基板処理装置。
[付記4]
 前記すべり構造は、前記雌ネジ部材の隣接位置に配置される、
 付記2または3に記載の基板処理装置。
[付記5]
 前記すべり構造は、前記雌ネジ部材から露出している前記雄ネジ部材の隣接位置に配置される、
 付記2乃至4のいずれか1項に記載の基板処理装置。
[付記6]
 前記連結アセンブリは、前記積層方向に沿って前記すべり構造を複数有する、
 付記1乃至5のいずれか1項に記載の基板処理装置。
[付記7]
 前記すべり構造は、前記積層方向と直交する方向に延在するすべり面を有する2つの部材の当該すべり面同士を接触させている、
 付記1乃至6のいずれか1項に記載の基板処理装置。
[付記8]
 前記すべり構造は、前記積層方向と直交する方向に延在するすべり面を有する部材と、前記すべり面に接触する転動体を有する部材とを接触させている、
 付記1乃至7のいずれか1項に記載の基板処理装置。
[付記9]
 前記第1部材および前記第2部材は、プラズマを生成するプラズマ処理空間を内部に有するプラズマ処理チャンバに設けられる、
 付記1乃至8のいずれか1項に記載の基板処理装置。
[付記10]
 前記第1部材および前記第2部材は、前記プラズマ処理チャンバの内部において処理ガスを吐出すると共に、前記プラズマを生成するための電力が供給されるシャワーヘッドを構成している、
 付記9に記載の基板処理装置。
[付記11]
 前記第1部材は、前記プラズマ処理空間に前記処理ガスを導入する複数のガス導入口を有する天井部材であり、
 前記第2部材は、前記第1部材よりも鉛直方向上側に設けられ、前記天井部材の熱を放熱するクーリングプレートである、
 付記10に記載の基板処理装置。
[付記12]
 基板を処理する基板処理装置に設けられる第1部材および第2部材を連結する連結アセンブリであって、
 前記第1部材および前記第2部材は、相互に積層され、かつ相互に異なる熱膨張係数を有するものであり、
 前記連結アセンブリは、
 前記第1部材および前記第2部材の積層方向に平行して延在し、前記第1部材および/または前記第2部材の熱膨張時に、前記積層方向と直交する方向にスライド可能なすべり構造を有する、
 連結アセンブリ。
[Appendix 1]
A substrate processing apparatus for processing a substrate,
a first member and a second member that are stacked on each other and have different thermal expansion coefficients;
a connecting assembly extending parallel to a stacking direction of the first member and the second member and connecting the first member and the second member,
The connection assembly has a sliding structure that is slidable in a direction perpendicular to the stacking direction when the first member and/or the second member undergo thermal expansion.
Substrate processing equipment.
[Appendix 2]
The connection assembly has a male screw member and a female screw member that extend in the stacking direction and screw together,
a clamping force for the first member and the second member is adjusted by adjusting an axial length of the male screw member and the female screw member in the screwed engagement;
2. The substrate processing apparatus of claim 1.
[Appendix 3]
The sliding structure is provided outside the outer circumferential surface of the male thread member and the outer circumferential surface of the female thread member.
3. The substrate processing apparatus of claim 2.
[Appendix 4]
The sliding structure is disposed adjacent to the female screw member.
4. The substrate processing apparatus according to claim 2 or 3.
[Appendix 5]
The sliding structure is disposed adjacent to the male screw member exposed from the female screw member.
5. The substrate processing apparatus according to claim 2 .
[Appendix 6]
The connecting assembly has a plurality of the sliding structures along the stacking direction.
6. The substrate processing apparatus according to claim 1 .
[Appendix 7]
The sliding structure has sliding surfaces of two members each having a sliding surface extending in a direction perpendicular to the stacking direction, the sliding surfaces being in contact with each other.
7. The substrate processing apparatus according to claim 1 .
[Appendix 8]
The sliding structure is configured to contact a member having a sliding surface extending in a direction perpendicular to the stacking direction with a member having a rolling element in contact with the sliding surface.
8. The substrate processing apparatus according to claim 1 .
[Appendix 9]
The first member and the second member are provided in a plasma processing chamber having a plasma processing space therein for generating plasma.
9. The substrate processing apparatus according to claim 1 .
[Appendix 10]
the first member and the second member constitute a showerhead that discharges a processing gas inside the plasma processing chamber and receives power for generating the plasma;
10. The substrate processing apparatus of claim 9.
[Appendix 11]
the first member is a ceiling member having a plurality of gas inlets through which the processing gas is introduced into the plasma processing space,
The second member is a cooling plate that is provided vertically above the first member and dissipates heat from the ceiling member.
11. The substrate processing apparatus of claim 10.
[Appendix 12]
A connection assembly for connecting a first member and a second member provided in a substrate processing apparatus for processing a substrate, the connection assembly comprising:
the first member and the second member are laminated on each other and have different thermal expansion coefficients;
The connection assembly includes:
a sliding structure extending parallel to a stacking direction of the first member and the second member and capable of sliding in a direction perpendicular to the stacking direction when the first member and/or the second member is thermally expanded;
Linkage assembly.

 今回開示された実施形態に係る基板処理装置および連結アセンブリ60、60Aは、すべての点において例示であって制限的なものではない。実施形態は、添付の請求の範囲およびその主旨を逸脱することなく、様々な形態で変形および改良が可能である。上記複数の実施形態に記載された事項は、矛盾しない範囲で他の構成も取り得ることができ、また、矛盾しない範囲で組み合わせることができる。 The substrate processing apparatus and connection assemblies 60, 60A according to the embodiments disclosed herein are illustrative in all respects and not restrictive. The embodiments may be modified and improved in various ways without departing from the spirit and scope of the appended claims. The matters described in the above embodiments may be configured in other ways as long as they are not inconsistent, and may be combined as long as they are not inconsistent.

 本開示の基板処理装置は、Atomic Layer Deposition(ALD)装置、Capacitively Coupled Plasma(CCP)、Inductively Coupled Plasma(ICP)、Radial Line Slot Antenna(RLSA)、Electron Cyclotron Resonance Plasma(ECR)、Helicon Wave Plasma(HWP)のいずれのタイプの装置でも適用可能である。 The substrate processing apparatus disclosed herein can be applied to any type of apparatus, including Atomic Layer Deposition (ALD) apparatus, Capacitively Coupled Plasma (CCP), Inductively Coupled Plasma (ICP), Radial Line Slot Antenna (RLSA), Electron Cyclotron Resonance Plasma (ECR), and Helicon Wave Plasma (HWP).

 本願は、日本特許庁に2023年12月1日に出願された基礎出願である特願2023-204089号の優先権を主張するものであり、その全内容を参照によりここに援用する。 This application claims priority from Japanese Patent Application No. 2023-204089, filed on December 1, 2023 with the Japan Patent Office, the entire contents of which are incorporated herein by reference.

1      プラズマ処理装置
51     天井部材
52     クーリングプレート
60、60A 連結アセンブリ
74     すべり構造
W     基板
1 Plasma processing apparatus 51 Ceiling member 52 Cooling plate 60, 60A Connection assembly 74 Slide structure W Substrate

Claims (12)

 基板を処理する基板処理装置であって、
 相互に積層され、かつ相互に異なる熱膨張係数を有する第1部材および第2部材と、
 前記第1部材および前記第2部材の積層方向に平行して延在し、前記第1部材と前記第2部材を連結する連結アセンブリと、を備え、
 前記連結アセンブリは、前記第1部材および/または前記第2部材の熱膨張時に、前記積層方向と直交する方向にスライド可能なすべり構造を有する、
 基板処理装置。
A substrate processing apparatus for processing a substrate,
a first member and a second member that are stacked on each other and have different thermal expansion coefficients;
a connecting assembly extending parallel to a stacking direction of the first member and the second member and connecting the first member and the second member,
The connection assembly has a sliding structure that is slidable in a direction perpendicular to the stacking direction when the first member and/or the second member thermally expands.
Substrate processing equipment.
 前記連結アセンブリは、前記積層方向に延在して相互に螺合する雄ネジ部材および雌ネジ部材を有し、
 前記雄ネジ部材および前記雌ネジ部材の螺合における軸方向の長さを調整することで、前記第1部材および前記第2部材に対するクランプ力を調整する、
 請求項1に記載の基板処理装置。
The connection assembly has a male screw member and a female screw member that extend in the stacking direction and screw together,
a clamping force for the first member and the second member is adjusted by adjusting an axial length of the male screw member and the female screw member in the screwed engagement;
The substrate processing apparatus according to claim 1 .
 前記すべり構造は、前記雄ネジ部材の外周面および前記雌ネジ部材の外周面よりも外側に設けられる、
 請求項2に記載の基板処理装置。
The sliding structure is provided outside the outer circumferential surface of the male thread member and the outer circumferential surface of the female thread member.
The substrate processing apparatus according to claim 2 .
 前記すべり構造は、前記雌ネジ部材の隣接位置に配置される、
 請求項2に記載の基板処理装置。
The sliding structure is disposed adjacent to the female screw member.
The substrate processing apparatus according to claim 2 .
 前記すべり構造は、前記雌ネジ部材から露出している前記雄ネジ部材の隣接位置に配置される、
 請求項2に記載の基板処理装置。
The sliding structure is disposed adjacent to the male screw member exposed from the female screw member.
The substrate processing apparatus according to claim 2 .
 前記連結アセンブリは、前記積層方向に沿って前記すべり構造を複数有する、
 請求項1乃至5のいずれか1項に記載の基板処理装置。
The connecting assembly has a plurality of the sliding structures along the stacking direction.
The substrate processing apparatus according to claim 1 .
 前記すべり構造は、前記積層方向と直交する方向に延在するすべり面を有する2つの部材の当該すべり面同士を接触させている、
 請求項1乃至5のいずれか1項に記載の基板処理装置。
The sliding structure has sliding surfaces of two members each having a sliding surface extending in a direction perpendicular to the stacking direction, the sliding surfaces being in contact with each other.
The substrate processing apparatus according to claim 1 .
 前記すべり構造は、前記積層方向と直交する方向に延在するすべり面を有する部材と、前記すべり面に接触する転動体を有する部材とを接触させている、
 請求項1乃至5のいずれか1項に記載の基板処理装置。
The sliding structure is configured to contact a member having a sliding surface extending in a direction perpendicular to the stacking direction with a member having a rolling element in contact with the sliding surface.
The substrate processing apparatus according to claim 1 .
 前記第1部材および前記第2部材は、プラズマを生成するプラズマ処理空間を内部に有するプラズマ処理チャンバに設けられる、
 請求項1乃至5のいずれか1項に記載の基板処理装置。
The first member and the second member are provided in a plasma processing chamber having a plasma processing space therein for generating plasma.
The substrate processing apparatus according to claim 1 .
 前記第1部材および前記第2部材は、前記プラズマ処理チャンバの内部において処理ガスを吐出すると共に、前記プラズマを生成するための電力が供給されるシャワーヘッドを構成している、
 請求項9に記載の基板処理装置。
the first member and the second member constitute a showerhead that discharges a processing gas inside the plasma processing chamber and receives power for generating the plasma;
The substrate processing apparatus according to claim 9 .
 前記第1部材は、前記プラズマ処理空間に前記処理ガスを導入する複数のガス導入口を有する天井部材であり、
 前記第2部材は、前記第1部材よりも鉛直方向上側に設けられ、前記天井部材の熱を放熱するクーリングプレートである、
 請求項10に記載の基板処理装置。
the first member is a ceiling member having a plurality of gas inlets through which the processing gas is introduced into the plasma processing space,
The second member is a cooling plate that is provided vertically above the first member and dissipates heat from the ceiling member.
The substrate processing apparatus according to claim 10 .
 基板を処理する基板処理装置に設けられる第1部材および第2部材を連結する連結アセンブリであって、
 前記第1部材および前記第2部材は、相互に積層され、かつ相互に異なる熱膨張係数を有するものであり、
 前記連結アセンブリは、
 前記第1部材および前記第2部材の積層方向に平行して延在し、前記第1部材および/または前記第2部材の熱膨張時に、前記積層方向と直交する方向にスライド可能なすべり構造を有する、
 連結アセンブリ。
A connection assembly for connecting a first member and a second member provided in a substrate processing apparatus for processing a substrate, the connection assembly comprising:
the first member and the second member are laminated on each other and have different thermal expansion coefficients;
The connection assembly includes:
a sliding structure extending parallel to a stacking direction of the first member and the second member and capable of sliding in a direction perpendicular to the stacking direction when the first member and/or the second member is thermally expanded;
Linkage assembly.
PCT/JP2024/040864 2023-12-01 2024-11-18 Substrate processing device and connection assembly Pending WO2025115685A1 (en)

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JPH06128750A (en) * 1992-10-20 1994-05-10 Ulvac Japan Ltd High frequency induction electrode in vacuum treating device
JPH11111626A (en) * 1997-10-07 1999-04-23 Tokyo Electron Ltd Shower head structure for heat-treating apparatus
JP2001135499A (en) * 1999-11-08 2001-05-18 Anelva Corp High frequency electrode equipment for substrate processing equipment
JP2002129338A (en) * 2000-10-25 2002-05-09 Sony Corp Treatment apparatus with heating means
JP2005526375A (en) * 2001-08-03 2005-09-02 アプライド マテリアルズ インコーポレイテッド Suspended gas distribution manifold in plasma chamber
KR20090120770A (en) * 2008-05-20 2009-11-25 주식회사 테스 Gas supply assembly
JP2011089208A (en) * 2004-02-24 2011-05-06 Applied Materials Inc Movable or flexible showerhead mounting
JP2011137228A (en) * 2009-12-10 2011-07-14 Orbotech Lt Solar Llc Showerhead assembly for vacuum processing apparatus
JP2021052139A (en) * 2019-09-26 2021-04-01 株式会社アルバック Vacuum processing apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06128750A (en) * 1992-10-20 1994-05-10 Ulvac Japan Ltd High frequency induction electrode in vacuum treating device
JPH11111626A (en) * 1997-10-07 1999-04-23 Tokyo Electron Ltd Shower head structure for heat-treating apparatus
JP2001135499A (en) * 1999-11-08 2001-05-18 Anelva Corp High frequency electrode equipment for substrate processing equipment
JP2002129338A (en) * 2000-10-25 2002-05-09 Sony Corp Treatment apparatus with heating means
JP2005526375A (en) * 2001-08-03 2005-09-02 アプライド マテリアルズ インコーポレイテッド Suspended gas distribution manifold in plasma chamber
JP2011089208A (en) * 2004-02-24 2011-05-06 Applied Materials Inc Movable or flexible showerhead mounting
KR20090120770A (en) * 2008-05-20 2009-11-25 주식회사 테스 Gas supply assembly
JP2011137228A (en) * 2009-12-10 2011-07-14 Orbotech Lt Solar Llc Showerhead assembly for vacuum processing apparatus
JP2021052139A (en) * 2019-09-26 2021-04-01 株式会社アルバック Vacuum processing apparatus

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