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WO2025112909A1 - 一种光收发器 - Google Patents

一种光收发器 Download PDF

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Publication number
WO2025112909A1
WO2025112909A1 PCT/CN2024/123359 CN2024123359W WO2025112909A1 WO 2025112909 A1 WO2025112909 A1 WO 2025112909A1 CN 2024123359 W CN2024123359 W CN 2024123359W WO 2025112909 A1 WO2025112909 A1 WO 2025112909A1
Authority
WO
WIPO (PCT)
Prior art keywords
welding
base
cap
side portion
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/123359
Other languages
English (en)
French (fr)
Inventor
肖鹏
魏尹
张德华
王旻琦
邓秀菱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innolight Technology Suzhou Ltd
Original Assignee
Innolight Technology Suzhou Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innolight Technology Suzhou Ltd filed Critical Innolight Technology Suzhou Ltd
Publication of WO2025112909A1 publication Critical patent/WO2025112909A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings

Definitions

  • the present application belongs to the field of lasers, and specifically relates to an optical transceiver.
  • the tube cap and the tube socket are usually welded on the same plane. Since the large surface of the tube socket needs to be connected to the pins, the side of the tube socket is required to dissipate heat. However, the side area of the tube socket is small and the distance from the packaged chip is also far, so a good heat dissipation effect cannot be achieved.
  • the embodiment of the present application provides an optical transceiver to solve the above-mentioned problems.
  • An optical transceiver described in an embodiment of the present application includes:
  • a tube seat comprising a first base portion and a second base portion intersecting and connected to each other, and a first side portion and a second side portion spaced apart in a first direction, wherein the first side portion and the second side portion are both connected to the first base portion and the second base portion and enclose a receiving cavity having a first opening;
  • a pipe cap the pipe cap is connected to the pipe base and covers the first opening
  • An optoelectronic chip wherein the optoelectronic chip is disposed in the accommodating cavity and the optoelectronic chip is disposed on the first base;
  • An electrical connector passes through the second base and extends into the accommodating cavity, one end of the electrical connector passes through the accommodating cavity and is electrically connected to the optoelectronic chip, and the other end is located outside the accommodating cavity.
  • the tube seat has a first welding end face surrounding the first opening
  • the tube cap has a second welding end face
  • the first welding end face and the second welding end face are located in the same plane
  • the tube seat and the tube cap are sealed and connected by the first welding end face and the second welding end face.
  • the first base has a first welding sub-surface facing the tube cap
  • the second base has a second welding sub-surface facing the tube cap
  • the first side has a third welding sub-surface facing the tube cap
  • the second side has a fourth welding sub-surface facing the tube cap
  • the first welding sub-surface, the second welding sub-surface, the third welding sub-surface and the fourth welding sub-surface are located in the same plane and are connected in sequence to form the first welding end surface.
  • the tube cap includes a first cap portion, a second cap portion, and a third side portion and a fourth side portion that are connected to each other and spaced apart in the first direction, the third side portion and the fourth side portion are both connected to the first cap portion and the second cap portion and enclose an optical path cavity having a second opening, the optical path cavity is connected to the accommodating cavity, and the second welding end surface surrounds the second opening;
  • the first cap portion has a fifth welding sub-surface facing the first base portion
  • the second cap portion has a sixth welding sub-surface facing the second base portion
  • the third side portion has a seventh welding sub-surface facing the first side portion
  • the fourth side portion has an eighth welding sub-surface facing the second side portion
  • the fifth welding sub-surface, the sixth welding sub-surface, the seventh welding sub-surface and the eighth welding sub-surface are located in the same plane and are connected in sequence to form the second welding end surface.
  • the first cap portion is extended along a side away from the second cap portion to form a first combining portion, the first combining portion having a first combining surface facing the first welding sub-surface and a first extrusion surface away from the first welding sub-surface, the first combining surface and the fifth welding sub-surface are located in the same plane and connected, and the first extrusion surface is parallel to the first welding sub-surface;
  • the second cap portion is extended along a side away from the first cap portion to form a second combining portion, the second combining portion having a second combining surface facing the second welding sub-surface and a second extrusion surface away from the second welding sub-surface, the second combining surface and the sixth welding sub-surface are located in the same plane and are connected, and the second extrusion surface is parallel to the second welding sub-surface.
  • the first base has a first surface and a second surface corresponding to each other in the second direction
  • the second base has a third surface and a fourth surface corresponding to each other in the third direction
  • the second surface is connected to the third surface
  • the first cap portion is opposite to the third surface in the third direction
  • the second cap portion is opposite to the second surface in the second direction
  • the first direction, the second direction and the third direction intersect each other.
  • the tube cap is provided with an optical port, the optical port faces the optoelectronic chip, the optical port is sealed with a first optical window, and the optoelectronic chip is used to emit or receive laser light toward the first optical window.
  • the tube cap is provided with an observation port, and the observation port is sealed with a second light window.
  • the optical transceiver further comprises:
  • a lens is arranged on a side of the first light window away from the optoelectronic chip, and the lens is used to couple the laser emitted or received by the optoelectronic chip.
  • the optical transceiver further comprises:
  • a monitoring chip is disposed in the accommodating cavity and connected to the second base, and the monitoring chip is electrically connected to the optoelectronic chip and the electrical connector respectively.
  • the optical transceiver of the embodiment of the present application includes a tube seat, the tube seat includes a first base and a second base that intersect and are connected to each other, and a first side portion and a second side portion that are spaced apart in a first direction, the first side portion and the second side portion are both connected to the first base and the second base and surround a receiving cavity with a first opening; a tube cap, the tube cap is connected to the tube seat and covers the first opening; an optoelectronic chip, the optoelectronic chip is arranged in the receiving cavity and is at least connected to the first base; an electrical connector, the electrical connector is connected to the second base, one end of the electrical connector is passed through the receiving cavity and electrically connected to the optoelectronic chip, that is, the optoelectronic chip is arranged on the first base to be spaced apart from the electrical connector on the second base, so that the optoelectronic chip has a larger heat dissipation area and improves the heat dissi
  • first side portion and the second side portion can also be used to contact the optoelectronic chip and serve as the heat dissipation surface of the optoelectronic chip, which is beneficial to further improve the heat dissipation effect.
  • FIG1 is a schematic diagram of the structure of an optical transceiver according to Embodiment 1 of the present application.
  • FIG2 is a schematic diagram of the internal cross-sectional structure of the optical transceiver in Example 1 of the present application;
  • Example 3 is a schematic diagram of the structure of a tube holder, an optoelectronic chip, an electrical connector and a monitoring chip in Example 1 of the present application;
  • FIG4 is a schematic diagram of the structure of the tube socket in Example 1 of the present application.
  • FIG5 is a schematic diagram of the structure of the tube cap in Example 1 of the present application.
  • FIG6 is a schematic diagram of the structure of an optical transceiver with a coupling lens according to Embodiment 1 of the present application;
  • FIG. 7 is a schematic diagram of the structure of an optical transceiver with a coupling lens according to Embodiment 2 of the present application;
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more features.
  • “multiple” means two or more, and at least one means one, two or more, unless otherwise clearly and specifically defined.
  • vertical means completely vertical at 90° or almost completely vertical, for example, an angle within the range of 80° to 100° is considered vertical.
  • parallel means completely parallel or almost completely parallel, for example, an angle within 10° of completely parallel is considered parallel.
  • the traditional airtight transistor outline (TO) is a coaxial package, with the metal cap and the header welded on the same plane.
  • the larger bottom surface of the header is mostly used for pin lead-out and flexible board welding, which cannot achieve good heat dissipation effect.
  • the heat can only be dissipated by the side of the header, but the side area is small and far away from the chip, so the heat dissipation performance is poor.
  • an embodiment of the present application discloses an optical transceiver, which can solve at least one of the above-mentioned defects.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the optical transceiver 1 has a first direction X, and includes a socket 10, a cap 20, an optoelectronic chip 30, and an electrical connector 40.
  • the socket 10 includes a first base 100, a second base 101, and a first side 102 and a second side 103 that are intersecting and connected to each other in the first direction X.
  • the first side 102 and the second side 103 are connected to the first base 100 and the second base 101 and enclose a receiving cavity 104 having a first opening 105.
  • the cap 20 is connected to the socket 10 and covers the first opening 105.
  • the optoelectronic chip 30 is disposed in the receiving cavity 104, and the optoelectronic chip 30 is at least connected to the first base 100.
  • the electrical connector 40 is connected to the second base 101, one end of the electrical connector 40 is passed through the receiving cavity 104 and electrically connected to the optoelectronic chip 30, and the other end is located outside the receiving cavity 104.
  • the optoelectronic chip 30 is arranged on the first base 100 to be spaced from the electrical connector 40 on the second base 101, so that the optoelectronic chip 30 has a larger heat dissipation area and improves the heat dissipation performance.
  • the first side portion 102 and the second side portion 103 can also be used to contact the optoelectronic chip 30 and serve as the heat dissipation surface of the optoelectronic chip 30, which is beneficial to further improve the heat dissipation effect.
  • the intersection of the first base 100 and the second base 101 means that there is an angle between the first base 100 and the second base 101 that is not 0° or 180°, so that the electrical connector 40 and the optoelectronic chip 30 are spaced from each other in structure, and the electrical connector 40 is prevented from occupying the heat dissipation surface of the optoelectronic chip 30.
  • the optoelectronic chip 30 can also conduct heat to contact the first side portion 102 and/or the second side portion 103, so as to further expand the contact heat dissipation surface, thereby improving the overall heat dissipation effect.
  • the tube base 10 has a first welding end face 106 surrounding the first opening 105
  • the tube cap 20 has a second welding end face 206.
  • the first welding end face 106 and the second welding end face 206 are parallel to each other and connected to each other.
  • the tube base 10 and the tube cap 20 are wedge-shaped structures, and the two can be sealed and combined through the first welding end face 106 and the second welding end face 206.
  • this embodiment takes the arrangement of the optoelectronic chip 30 in the accommodating cavity 104 as an example.
  • the optoelectronic chip 30 can include a laser 300 and a detector (not shown in the figure) integrated in the accommodating cavity 104 to complete the reception and transmission of optical signals.
  • this product is only a light transmitter, that is, the optoelectronic chip 30 can be set as a laser 300; if this product is only a light receiver, that is, the optoelectronic chip 30 can be set as a detector.
  • the optical transceiver 1 further has a second direction Y and a third direction Z, and the first direction X, the second direction Y and the third direction Z intersect each other.
  • the first base 100 has a corresponding first surface 1000 and a second surface 1001 in the second direction Y, and the second base 101 has a corresponding third surface 1010 and a fourth surface 1011 in the third direction Z, and the second surface 1001 is connected to the third surface 1010;
  • the first base 100 has a first welding sub-surface 1060 facing the pipe cap 20
  • the second base 101 has a second welding sub-surface 1061 facing the pipe cap 20
  • the first side portion 102 has a third welding sub-surface 1062 facing the pipe cap 20
  • the second side portion 103 has a fourth welding sub-surface 1063 facing the pipe cap 20, and the first welding sub-surface 1060, the second welding sub-surface 1061, the third welding sub-surface 1062 and the fourth welding sub-surface 1063 are sequentially connected to form a
  • the tube cap 20 includes a first cap portion 200, a second cap portion 201, and a third side portion 202 and a fourth side portion 203 that are connected to each other in the first direction X.
  • the third side portion 202 and the fourth side portion 203 are connected to the first cap portion 200 and the second cap portion 201 and surround an optical path cavity 204.
  • the optical path cavity 204 is connected to the accommodating cavity 104.
  • the second welding end surface 206 surrounds the second opening 205.
  • the first cap portion 200 is opposite to the third surface 1010 in the third direction Z
  • the second cap portion 201 is opposite to the second surface 1001 in the second direction Y.
  • the first cap portion 200 has a fifth welding sub-surface 2060 facing the first base portion 100
  • the second cap portion 201 has a sixth welding sub-surface 2061 facing the second base portion 101
  • the third side portion 202 has a seventh welding sub-surface 2062 facing the first side portion 102
  • the fourth side portion 203 has an eighth welding sub-surface 2063 facing the second side portion 103.
  • the fifth welding sub-surface 2060, the sixth welding sub-surface 2061, the seventh welding sub-surface 2062 and the eighth welding sub-surface 2063 are sequentially connected to form an integral second welding end face 206.
  • the first cap portion 200 , the third side portion 202 and the fourth side portion 203 extend the first bonding portion 2000 on the plane where the second welding end surface 206 is located.
  • the first bonding portion 2000 has a first bonding surface 2001 facing the first welding sub-surface 1060 and a first extrusion surface 2002 away from the first welding sub-surface 1060.
  • the first bonding surface 2001 and the fifth welding sub-surface 2060 are located in the same plane and connected.
  • the first extrusion surface 2002 is parallel to the first welding sub-surface 1060.
  • the fifth welding sub-surface 2060 actually includes the side surface of the first bonding portion 2000 facing the tube seat 10.
  • the second cap portion 201, the third side portion 202 and the fourth side portion 203 extend the second joining portion 2010 on the plane where the second welding surface is located.
  • the second joining portion 2010 has a second joining surface 2011 facing the second welding sub-surface 1061 and a second extrusion surface 2012 away from the second welding sub-surface 1061.
  • the second joining surface 2011 and the sixth welding sub-surface 2061 are located in the same plane and are connected.
  • the second extrusion surface 2012 is parallel to the second welding sub-surface 1061.
  • the above-mentioned sixth welding sub-surface 2061 actually includes the side of the second joining portion 2010 facing the tube seat 10.
  • the integral tube seat 10 can be made of a metal material with high thermal conductivity by machining or stamping. Specifically, metal materials such as copper, aluminum, silver, tungsten, etc. can be flexibly used according to actual needs, and the first base 100, the second base 101, the first side 102 and the second side 103 of the tube seat 10 can actually be integrally formed, and in this case, the first welding end face 106 is formed when the tube seat 10 is formed.
  • the integral pipe cap 20 can also be processed by metal material craftsmanship or stamping. Specifically, metal materials such as copper and aluminum can be flexibly used according to actual needs.
  • the first cap portion 200, the second cap portion 201, the third side portion 202, the fourth side portion 203, the first joint portion 2000 and the second joint portion 2010 of the pipe cap 20 can actually be formed as one piece.
  • the second welding end face 206 is formed when the pipe cap 20 is formed; the pipe cap 20 is usually also subjected to surface treatment, such as tin plating, nickel plating, etc., to improve its corrosion resistance and connection performance.
  • the first side portion 102, the second side portion 103, the third side portion 202 and the fourth side portion 203 are arranged to form a first welding end face 106 and a second welding end face 206 that are parallel to each other. While being compatible with traditional resistance welding tube holder 10 and tube cap 20 equipment, a higher airtightness yield and reliability can be obtained. Compared with only arranging the first base portion 100, the second base portion 101, the first cap portion 200 and the second cap portion 201, the need for multiple welding surfaces at the same time during welding is avoided, the resistance welding process requirements are reduced, and the welding reliability and production efficiency are improved.
  • the first extrusion surface 2002 and the second extrusion surface 2012 are used for abutment by the resistance welding equipment, which is conducive to making the first bonding surface 2001, the second bonding surface 2011 and the overall second welding end surface 206 stably abut against the first welding end surface 106.
  • the tube cap 20 encloses an optical path cavity 204 having a second opening 205, and the second welding end surface 206 is provided with a welding protrusion 207 toward the first welding end surface 106, and the welding protrusion 207 surrounds the second opening 205.
  • the tube cap 20 and the tube base 10 are welded by a resistance welding process to ensure the airtightness of the accommodating cavity 104 and the optical path cavity 204, and the welding protrusion 207 improves the sealing effect when the two are connected by resistance welding.
  • a support portion 1003 is formed on the second surface 1001 of the tube seat 10, and the optoelectronic chip 30 includes a laser 300 (Laser Diode, LD for short) and a pad 301 (Laser Diode Submount, LD SM for short), the pad 301 is fixed on the support portion 1003, and the laser 300 is fixed on the pad 301.
  • the laser 300 can be connected to the pad 301 by gold soldering, and the pad 301 can be fixed to the support portion 1003 by silver glue or gold soldering.
  • the pad 301 can provide mechanical support and protection for the laser 300, preventing the laser 300 from being affected by external shock or vibration, thereby extending the life and stability of the laser 300. At the same time, the pad 301 can dissipate heat for the laser 300 in time to maintain its stable operating temperature. In addition, the pad 301 has precise size and geometric shape, which can provide accurate optical positioning to accurately arrange the laser 300, thereby ensuring the precise alignment between the laser diode and other optical elements to obtain high-quality laser output.
  • the electrical connector 40 is configured as a pin that penetrates the second base 101, and an insulating portion 400 is provided between the outer side of the pin and the second base 101.
  • the insulating portion 400 may be a glass insulator, and is fixed to the stem 10 by high-temperature sintering.
  • the electrical connector 40 is electrically connected to the pad 301 through the connecting portion 401, thereby electrically connecting the laser 300.
  • the connecting portion 401 may be a gold-tin solder sheet, solder paste, etc.
  • the electrical connector 40 may also be directly connected to the pad 301 by gold wire bonding.
  • the electrical connector 40 may also be a multilayer ceramic substrate, which will not be described in detail here.
  • the optical transceiver 1 further includes a monitoring chip 80 (Monitor Photodiode, MPD for short), which is disposed in the accommodating cavity 104 and connected to the third surface 1010 .
  • the monitoring chip 80 can be fixed to the third surface 1010 by using silver glue, and the monitoring chip 80 can be electrically connected to the optoelectronic chip 30 and the electrical connector 40 by welding only, respectively.
  • the monitoring chip 80 can monitor the backlight intensity output by the laser 300 , that is, by being installed on the back side of the laser 300 , converting the optical signal into an electrical signal to monitor the backlight intensity of the laser 300 in real time, thereby providing a feedback signal for controlling and adjusting the output power and stability of the laser 300 .
  • a semiconductor cooler (Thermoelectric Cooler, TEC for short) can be added to the support part 1003 for connecting the laser 300 and the pad 301, and components such as thermistors can be provided to detect the temperature of the laser 300 in real time to improve the stability of use.
  • TEC Thermoelectric Cooler
  • the first cap portion 200 is provided with an optical port 208 , the optical port 208 faces the laser 300 , and the optical port 208 is sealed with a first optical window 50 .
  • the laser 300 can emit laser light toward the first optical window 50 , so that the laser light can be smoothly guided out of the optical path cavity 204 .
  • the second cap portion 201 is provided with an observation port 209, which faces the laser 300 and is sealed with a second optical window 60.
  • the observation port 209 and the second optical window 60 can be used to observe the components in the accommodating cavity 104 such as the laser 300, facilitate high-precision mounting with external components, and improve the coupling efficiency with external optical components.
  • first light window 50 and the second light window 60 can be made of glass light window material having a thermal expansion coefficient intersecting with the tube cap 20 , and can be sealed and bonded to the tube cap 20 by gold soldering or glass solder high-temperature sintering.
  • the optical transceiver 1 further includes a lens 70 (Lens), which is disposed on a side of the first optical window 50 away from the laser 300 .
  • the lens 70 is used to couple the laser emitted or received by the optoelectronic chip 30 .
  • the vertical and horizontal divergence angles of the laser emitted by the laser 300 can be adjusted by the lens 70 , so as to couple and match with external optical components.
  • the angle between the first base 100 and the second base 101 is limited to be between 60° and 135°. Within this angle range, the first base 100 carries the optoelectronic chip 30 and the second base 101 carries the electrical connector 40 without interfering with each other, and the first base 100 can have enough space for the optoelectronic chip 30 to dissipate heat.
  • the angle between the first base 100 and the second base 101 is less than 60°, the space between the second surface 1001 and the third surface 1010 is narrow, which is not conducive to installing the optoelectronic chip 30; when the angle is greater than 135°, the electrical connector 40 that passes through the second base 101 may affect the installation of the first base 100 and the entire optical transceiver 1. Therefore, it is preferred that the angle between the first base 100 and the second base 101 is between 60° and 135°.
  • the first direction X, the second direction Y and the third direction Z are perpendicular to each other, that is, the first base 100 and the second base 101 are perpendicular to each other, and the first cap 200 and the second cap 201 are also perpendicular to each other, so that the optoelectronic chip 30 and the electrical connector 40 are independent of each other, and the internal space layout of the optical transceiver 1 is more reasonable, with better heat dissipation effect and sufficient installation space.
  • the interconnected ends of the first base 100 and the second base 101 are provided with a positioning groove 90 penetrating the first surface 1000 and the fourth surface 1011 , and the positioning groove 90 is intended to correspond to the coaxial packaging equipment to quickly position and install the tube seat 10 .
  • a single-channel laser 300 is taken as an example.
  • multiple lasers 300 and multiple optical signal channels can also be set.
  • an optical receiver can be set or the laser 300 and the optical receiver can be arranged in one piece in the accommodating cavity 104, which will not be repeated here.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the difference between this embodiment and Embodiment 1 is that: illustratively, one end of the first base 100 away from the second base 101 is connected to an extension portion 1002 in the third direction Z, and correspondingly, a smaller lens 70 than that in Embodiment 1 can be used and directly coupled to the extension portion 1002 to adapt to different process methods.
  • the lens 70 may also be directly built into the tube cap 20 , which will not be described in detail herein.
  • optical transceiver provided in the embodiment of the present application is introduced in detail above, and the principles and implementation methods of the present application are explained by applying specific examples.
  • the description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; ordinary technicians in this field should understand that: they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present application.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)

Abstract

一种光收发器（1），其包括管座（10），管座（10）包括相交且相互连接的第一基部（100）、第二基部（101）以及在第一方向（X）上间隔设置的第一侧部（102）和第二侧部（103），第一侧部（102）和第二侧部（103）均连接第一基部（100）和第二基部（101）并围成具有第一开口（105）的容纳腔（104）；管帽（20），与管座（10）连接，且盖设于第一开口（105）；光电芯片（30），设于容纳腔（104）内，光电芯片（30）设置于第一基部（100）上；电连接件（40），穿过第二基部（101）并伸入容纳腔（104），电连接件（40）的一端穿设于容纳腔（104）并电连接光电芯片（30），另一端位于容纳腔（104）外。

Description

一种光收发器
本申请要求于2023年11月27日提交中国专利局、申请号为202311589919.4、发明名称为“一种光收发器”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请属于激光器领域，具体涉及一种光收发器。
 背景技术
气密晶体管外壳（Transistor Outline，简称TO）同轴封装中，管帽和管座通常焊接在同一平面上，由于管座的大面需要连接引脚，此时需要管座的侧面进行散热，而管座的侧面面积较小，距离封装的芯片距离也较远，无法达到良好的散热效果。
 发明内容
发明目的：本申请实施例提供一种光收发器，旨在解决上述问题。
技术方案：本申请实施例所述的一种光收发器，包括：
管座，所述管座包括相交且相互连接的第一基部、第二基部以及在第一方向上间隔设置的第一侧部和第二侧部，所述第一侧部和所述第二侧部均连接所述第一基部和所述第二基部并围成具有第一开口的容纳腔；
管帽，所述管帽与所述管座连接，且盖设于所述第一开口；
光电芯片，所述光电芯片设于所述容纳腔，且所述光电芯片设置于所述第一基部上；
电连接件，所述电连接件穿过所述第二基部并伸入所述容纳腔内，所述电连接件的一端穿设于所述容纳腔并电连接所述光电芯片，另一端位于所述容纳腔外。
在一些实施例中，所述管座具有环绕所述第一开口的第一焊接端面，所述管帽具有第二焊接端面，所述第一焊接端面和所述第二焊接端面位于同一平面内，且所述管座和所述管帽通过所述第一焊接端面和所述第二焊接端面密封连接。
在一些实施例中，所述第一基部具有朝向所述管帽的第一焊接子面，所述第二基部具有朝向所述管帽的第二焊接子面，所述第一侧部具有朝向所述管帽的第三焊接子面，所述第二侧部具有朝向所述管帽的第四焊接子面，所述第一焊接子面、所述第二焊接子面、所述第三焊接子面和所述第四焊接子面位于同一平面内并依次连接形成所述第一焊接端面。
在一些实施例中，所述管帽包括相互连接的第一帽部、第二帽部以及在所述第一方向间隔设置的第三侧部和第四侧部，所述第三侧部和所述第四侧部均连接所述第一帽部和所述第二帽部并围成具有第二开口的光路腔，所述光路腔连通所述容纳腔，所述第二焊接端面环绕所述第二开口；
所述第一帽部具有朝向所述第一基部的第五焊接子面，所述第二帽部具有朝向所述第二基部的第六焊接子面，所述第三侧部具有朝向所述第一侧部的第七焊接子面，所述第四侧部具有朝向所述第二侧部的第八焊接子面，所述第五焊接子面、所述第六焊接子面、所述第七焊接子面和所述第八焊接子面位于同一平面内并依次连接形成所述第二焊接端面。
在一些实施例中，所述第一帽部沿背离所述第二帽部的一侧延伸设置有第一结合部，所述第一结合部具有朝向所述第一焊接子面的第一结合面以及背离所述第一焊接子面的第一挤压面，所述第一结合面和所述第五焊接子面位于同一平面内并相连接，且所述第一挤压面平行于所述第一焊接子面；
所述第二帽部沿背离所述第一帽部的一侧延伸设置有第二结合部，所述第二结合部具有朝向所述第二焊接子面的第二结合面以及背离所述第二焊接子面的第二挤压面，所述第二结合面和所述第六焊接子面位于同一平面内并相连接，且所述第二挤压面平行于所述第二焊接子面。
在一些实施例中，所述第一基部在第二方向具有相对应的第一面和第二面，所述第二基部在第三方向具有相对应的第三面和第四面，所述第二面连接所述第三面；
所述第一帽部在所述第三方向相对所述第三面，所述第二帽部在所述第二方向相对所述第二面，所述第一方向、所述第二方向和所述第三方向两两相交。
在一些实施例中，所述管帽开设有光口，所述光口朝向所述光电芯片，所述光口封设有第一光窗，所述光电芯片用于朝向所述第一光窗发射或接收激光。
在一些实施例中，所述管帽开设有观察口，所述观察口封设有第二光窗。
在一些实施例中，所述光收发器还包括：
透镜，所述透镜设于所述第一光窗背离所述光电芯片的一侧，所述透镜用于耦合所述光电芯片发出或接收的激光。
在一些实施例中，所述光收发器还包括：
监控芯片，所述监控芯片设于所述容纳腔，且所述监控芯片连接所述第二基部，所述监控芯片分别电连接所述光电芯片和所述电连接件。
有益效果：本申请实施例的光收发器包括管座，管座包括相交且相互连接的第一基部、第二基部以及在第一方向上间隔设置的第一侧部和第二侧部，第一侧部和所述第二侧部均连接第一基部和第二基部并围成具有第一开口的容纳腔；管帽，管帽与管座连接并盖设于第一开口；光电芯片，光电芯片设于容纳腔并至少连接第一基部；电连接件，电连接件连接第二基部，电连接件的一端穿设于容纳腔并电连接光电芯片，即将光电芯片设于第一基部，以与第二基部上的电连接件间隔，从而使光电芯片具有较大散热面积，提高散热性能，同时第一侧部和第二侧部同样可用以接触光电芯片并作为光电芯片的散热面，有利于进一步提高散热效果。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例1光收发器的结构示意图；
图2是本申请实施例1光收发器内部剖视结构示意图；
图3是本申请实施例1管座、光电芯片、电连接件及监控芯片的结构示意图；
图4是本申请实施例1管座的结构示意图；
图5是本申请实施例1管帽的结构示意图；
图6是本申请实施例1耦合透镜的光收发器的结构示意图；
图7是本申请实施例2耦合透镜的光收发器的的结构示意图；
附图标记：1、光收发器；10、管座；100、第一基部；1000、第一面；1001、第二面；1002、延伸部；1003、支撑部；101、第二基部；1010、第三面；1011、第四面；102、第一侧部；103、第二侧部；104、容纳腔；105、第一开口；106、第一焊接端面；1060、第一焊接子面；1061、第二焊接子面；1062、第三焊接子面；1063、第四焊接子面；20、管帽；200、第一帽部；2000、第一结合部；2001、第一结合面；2002、第一挤压面；201、第二帽部；2010、第二结合部；2011、第二结合面；2012、第二挤压面；202、第三侧部；203、第四侧部；204、光路腔；205、第二开口；206、第二焊接端面；2060、第五焊接子面；2061、第六焊接子面；2062、第七焊接子面；2063、第八焊接子面；207、焊接凸部；208、光口；209、观察口；30、光电芯片；300、激光器；301、垫块；40、电连接件；400、绝缘部；401、连接部；50、第一光窗；60、第二光窗；70、透镜；80、监控芯片；90、定位槽；X、第一方向；Y、第二方向；Z、第三方向。
 具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个特征。在本申请的描述中，“多个”的含义是两个或两个以上，至少一个指可以为一个、两个或者两个以上，除非另有明确具体的限定。
还需要说明的是，在本申请的描述中，“垂直”是指完全垂直成90°或者几乎完全垂直，例如，在夹角为80°~100°的范围内都算作垂直，类似的，“平行”是指完全平行或几乎完全平行，例如，在完全平行的10°范围内都算作平行。
申请人注意到，随着1550nm激光雷达需求兴起，以及硅光技术在光模块的应用，大功率激光器被应用其中，以低成本的方式实现更好的散热，将对1550nm激光雷达以及硅光光模块的光源输出功率起到正向帮助。传统的气密晶体管外壳（Transistor Outline，简称TO）为同轴封装，管帽（Metal Cap）与管座（Header）封焊在同一个平面上，面积较大的管座底面多用于引脚引出与软板焊接，无法起到良好的散热效果，只能用管座侧面散热，但侧面面积小且距离芯片较远，散热性能差。
有鉴于此，本申请实施例公开了一种光收发器，该光收发器能够解决上述缺陷的至少一者。
实施例1：
参照图1至图5，光收发器1具有第一方向X，光收发器1包括管座10、管帽20、光电芯片30以及电连接件40。其中，管座10包括相交且相互连接的第一基部100、第二基部101以及在第一方向X上间隔设置的第一侧部102和第二侧部103。第一侧部102和第二侧部103均连接第一基部100和第二基部101并围成具有第一开口105的容纳腔104。管帽20与管座10连接并盖设于第一开口105。光电芯片30设于容纳腔104，且光电芯片30至少连接第一基部100。电连接件40连接第二基部101，电连接件40的一端穿设于容纳腔104并电连接光电芯片30，另一端位于容纳腔104外。
将光电芯片30设于第一基部100，以与第二基部101上的电连接件40间隔，从而使光电芯片30具有较大散热面积，提高散热性能，同时第一侧部102和第二侧部103同样可用以接触光电芯片30并作为光电芯片30的散热面，有利于进一步提高散热效果。
需要说明的是，本实施例中第一基部100和第二基部101相交指的是第一基部100和第二基部101之间具有一不为0°或180°的夹角，从而在结构上使电连接件40和光电芯片30相互间隔，避免电连接件40占用光电芯片30的散热面。在此基础上，第一侧部102和第二侧部103在连接管帽20后，第一侧部102和第二侧部103均未被电连接件40占用，即光电芯片30同样可导热接触第一侧部102和/或第二侧部103，以进一步扩大接触散热面，从而提高整体散热效果。
进一步的，参照图1至图5，在一些实施例中，管座10具有环绕第一开口105的第一焊接端面106，管帽20具有第二焊接端面206。第一焊接端面106和第二焊接端面206相互平行且相互连接。本实施例中，管座10和管帽20分别呈楔形结构，二者通过第一焊接端面106和第二焊接端面206可密封结合。
此外，本实施例以容纳腔104内设置光电芯片30为例，可以理解的是，光电芯片30可以包括激光器300以及探测器（图中未示出）集成在容纳腔104内，以完成接收和发射光信号，在其他实施例中，若本产品仅为光发射器，即光电芯片30可设置为激光器300，若本产品仅为光接收器，即光电芯片30可设置为探测器。
具体的，参照图2、图3和图4，光收发器1还具有第二方向Y和第三方向Z，第一方向X、第二方向Y和第三方向Z两两相交。第一基部100在第二方向Y具有相对应的第一面1000和第二面1001，第二基部101在第三方向Z具有相对应的第三面1010和第四面1011，第二面1001连接第三面1010；第一基部100具有朝向管帽20的第一焊接子面1060，第二基部101具有朝向管帽20的第二焊接子面1061，第一侧部102具有朝向管帽20的第三焊接子面1062，第二侧部103具有朝向管帽20的第四焊接子面1063，第一焊接子面1060、第二焊接子面1061、第三焊接子面1062和第四焊接子面1063依次连接并形成第一焊接端面106。
参照图2和图5，在一些实施例中，管帽20包括相互连接的第一帽部200、第二帽部201以及在第一方向X间隔设置的第三侧部202和第四侧部203。第三侧部202和第四侧部203均连接第一帽部200和第二帽部201并围成有光路腔204。光路腔204连通容纳腔104。第二焊接端面206环绕第二开口205。第一帽部200在第三方向Z相对第三面1010，第二帽部201在第二方向Y相对第二面1001。
具体的，第一帽部200具有朝向第一基部100的第五焊接子面2060，第二帽部201具有朝向第二基部101的第六焊接子面2061，第三侧部202具有朝向第一侧部102的第七焊接子面2062，第四侧部203具有朝向第二侧部103的第八焊接子面2063，第五焊接子面2060、第六焊接子面2061、第七焊接子面2062和第八焊接子面2063依次连接并形成整体的第二焊接端面206。
需要说明的是，参照图5，为了增加第一帽部200、第三侧部202和第四侧部203与管座10的接触面，第一帽部200、第三侧部202和第四侧部203在第二焊接端面206所在平面上延伸设置第一结合部2000，第一结合部2000具有朝向第一焊接子面1060的第一结合面2001以及背离第一焊接子面1060的第一挤压面2002，第一结合面2001和第五焊接子面2060位于同一平面内并相连接，第一挤压面2002平行于第一焊接子面1060，上述第五焊接子面2060实际包括了第一结合部2000朝向管座10的侧面；
同样的，第二帽部201、第三侧部202和第四侧部203在第二焊接面所在平面上延伸设置第二结合部2010，第二结合部2010具有朝向第二焊接子面1061的第二结合面2011以及背离第二焊接子面1061的第二挤压面2012，第二结合面2011和第六焊接子面2061位于同一平面内并相连接，第二挤压面2012平行于第二焊接子面1061，上述第六焊接子面2061实际包括了第二结合部2010朝向管座10的侧面。
需要说明的是，整体管座10可采用高导热系数金属材料机加工或冲压等方式加工而成。具体的，可根据实际需要灵活采用如铜、铝、银、钨等金属材料，而管座10的第一基部100、第二基部101、第一侧部102和第二侧部103实际可一体成型，此时第一焊接端面106在管座10成型时即形成。
同样的，整体管帽20同样可采用金属材料技工或冲压等方式加工而成，具体的，可根据实际需要灵活采用如铜、铝等金属材料，管帽20的第一帽部200、第二帽部201、第三侧部202、第四侧部203、第一结合部2000和第二结合部2010实际可一体成型，此时第二焊接端面206在管帽20成型时即形成；管帽20通常还会进行表面处理，如镀锡、镀镍等，以提高其耐腐蚀性和连接性能。
本实施例中通过第一侧部102、第二侧部103、第三侧部202和第四侧部203的设置，形成相互平行契合的第一焊接端面106和第二焊接端面206，在兼容传统电阻焊接管座10和管帽20设备的同时，可以得到更高的气密良率及可靠性，相较于仅设置第一基部100、第二基部101、第一帽部200和第二帽部201，避免了焊接时需要同时多个焊接面，降低了电阻焊工艺要求，提高了焊接可靠性及生产效率。
为了便于管座10和管帽20通过电阻焊相互连接，第一挤压面2002和第二挤压面2012用于供电阻焊设备抵接，有利于使第一结合面2001、第二结合面2011以及整体第二焊接端面206稳定抵接第一焊接端面106。
此外，参照图5，在一些实施例中，管帽20围成具有第二开口205的光路腔204，第二焊接端面206朝向第一焊接端面106设有焊接凸部207，焊接凸部207环绕第二开口205。本实施例中管帽20和管座10通过电阻焊工艺焊接以保证容纳腔104及光路腔204的气密性，焊接凸部207在二者电阻焊熔融连接时提高密封效果。
示例性的，参照图2和图3，管座10上位于第二面1001上形成有支撑部1003，光电芯片30包括激光器300（Laser Diode，简称LD）以及垫块301（Laser Diode Submount，简称LD SM），垫块301固定在支撑部1003上，激光器300固定在垫块301上。具体的，激光器300可采用金锡焊连接垫块301，垫块301可通过银胶或金锡焊等方式与支撑部1003固定。
垫块301可以为激光器300提供机械支撑和保护，防止激光器300受到外界冲击或振动的影响，从而延长激光器300寿命和稳定性。同时垫块301能够为激光器300及时散热以保持其稳定的工作温度。此外垫块301具有精确的尺寸和几何形状，可以提供准确的光学定位以准确布置激光器300从而可以确保激光二极管和其他光学元件之间的精确对准，以获得高质量的激光输出。
在一些实施例中，参照图1、图2和图3，电连接件40设置为贯穿第二基部101的引脚，引脚外侧与第二基部101之间设有绝缘部400，绝缘部400可采用玻璃绝缘子，通过高温烧结与管座10固定。本实施例中电连接件40通过连接部401与垫块301电连接，从而电连接激光器300，连接部401可以采用金锡焊片、焊膏等，此外电连接件40也可以直接通过金线键合连接垫块301。在其他实施例中，电连接件40还可以采用多层陶瓷基板，在此不再赘述。
此外，在一些实施例中，参照图3，光收发器1还包括监控芯片80（Monitor Photodiode，简称MPD），监控芯片80设于容纳腔104并连接第三面1010，监控芯片80可采用银胶与第三面1010固定，监控芯片80可分别通过仅限焊接实现电连接光电芯片30和电连接件40，监控芯片80可监测激光器300输出的背向光强度，即通过安装在激光器300的背面，转换光信号为电信号来实时监测激光器300的背向光的强度，从而可以提供反馈信号，用于控制和调节激光器300的输出功率和稳定性。
此外，为了进一步提高激光器300的散热效果，在其他实施例中还可以在支撑部1003上加设半导体制冷器（Thermoelectric Cooler，简称TEC）供激光器300及垫块301连接，还可以设置如热敏电阻等元件实时检测激光器300部分的温度，提高使用的稳定性。
在一些实施例中，参照图1、图2和图5，第一帽部200开设有光口208，光口208朝向激光器300，且光口208封设有第一光窗50，激光器300可朝向第一光窗50发射激光，以供激光顺利导出光路腔204。
此外，第二帽部201开设有观察口209，观察口209朝向激光器300，且观察口209封设有第二光窗60。观察口209及第二光窗60可用以观察激光器300等容纳腔104内的元件，方便与外部元件进行高精度贴装，提高与外部光学元件的耦合效率。
需要说明的是，第一光窗50和第二光窗60可采用与管帽20热膨胀系数相交的玻璃光窗材料，通过金锡焊或玻璃焊料高温烧结以实现与管帽20的密封结合。
在一些实施例中，参照图2和图6，光收发器1还包括透镜70（Lens），透镜70设于第一光窗50背离激光器300的一侧，透镜70用于耦合光电芯片30发出或接收的激光，如可以通过透镜70对激光器300发出的激光的垂直和水平的发散角进行调整，从而与外部光学元器件进行耦合匹配。
需要说明的是，第一基部100、第二基部101的夹角限定为在60°至135°之间，在该夹角范围内，第一基部100承载光电芯片30、第二基部101承载电连接件40而互不干扰，第一基部100可以有足够的空间用于供光电芯片30散热。当第一基部100和第二基部101的夹角小于60°时，第二面1001和第三面1010之间的空间狭窄，不利于安装光电芯片30；当夹角大于135°时，贯穿第二基部101的电连接件40可能会影响第一基部100及整体光收发器1的安装。由此，优选第一基部100、第二基部101的夹角在60°至135°之间。
本实施例中，第一方向X、第二方向Y和第三方向Z两两垂直，即第一基部100、第二基部101相互垂直，而第一帽部200和第二帽部201也相互垂直，使得光电芯片30和电连接件40各自独立，且光收发器1内部空间布局也更合理，具有较好的散热效果及足够的安装空间。
此外，参照图2，第一基部100和第二基部101相互连接端设有贯穿第一面1000和第四面1011的定位槽90，定位槽90旨在对应适配同轴封装设备，以快速定位安装管座10。
此外，本实施例中以单通道激光器300为例，在其他实施例中也可以设置为多个激光器300及多光信号通道的应用，同时在其他实施例中也可以设置光接收器或激光器300及光接收器一体布置于容纳腔104内，在此不再一一赘述。
实施例2：
参照图7，本实施例与实施例1不同之处在于：示例性的，第一基部100远离第二基部101的一端在第三方向Z连接有延伸部1002，对应的，可以采用相较于实施例1中更小型的透镜70并直接耦合在延伸部1002上，以适配不同的工艺方法。
此外，在其他实施例中，透镜70也可以直接内置于管帽20内部，在此不再赘述。
以上对本申请实施例所提供的一种光收发器进行了详细介绍，并应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (10)

  1. 一种光收发器(1)，其特征在于，包括：
    管座(10)，所述管座(10)包括相交且相互连接的第一基部(100)、第二基部(101)以及在第一方向(X)上间隔设置的第一侧部(102)和第二侧部(103)，所述第一侧部(102)和所述第二侧部(103)均连接所述第一基部(100)和所述第二基部(101)并围成具有第一开口(105)的容纳腔(104)；
    管帽(20)，所述管帽(20)与所述管座(10)连接，且盖设于所述第一开口(105)；
    光电芯片(30)，所述光电芯片(30)设于所述容纳腔(104)，且所述光电芯片(30)设置于所述第一基部(100)上；
    电连接件(40)，所述电连接件(40)穿过所述第二基部(101)并伸入所述容纳腔内，所述电连接件(40)的一端穿设于所述容纳腔(104)并电连接所述光电芯片(30)，另一端位于所述容纳腔外。
  2. 根据权利要求1所述的光收发器(1)，其特征在于，
    所述管座(10)具有环绕所述第一开口(105)的第一焊接端面(106)，所述管帽(20)具有第二焊接端面(206)，所述第一焊接端面(106)和所述第二焊接端面(206)位于同一平面内，且所述管座(10)和所述管帽(20)通过所述第一焊接端面(106)和所述第二焊接端面(206)密封连接。
  3. 根据权利要求2所述的光收发器(1)，其特征在于，
    所述第一基部(100)具有朝向所述管帽(20)的第一焊接子面(1060)，所述第二基部(101)具有朝向所述管帽(20)的第二焊接子面(1061)，所述第一侧部(102)具有朝向所述管帽(20)的第三焊接子面(1062)，所述第二侧部(103)具有朝向所述管帽(20)的第四焊接子面(1063)，所述第一焊接子面(1060)、所述第二焊接子面(1061)、所述第三焊接子面(1062)和所述第四焊接子面(1063)位于同一平面内并依次连接形成所述第一焊接端面(106)。
  4. 根据权利要求3所述的光收发器(1)，其特征在于，
    所述管帽(20)包括相互连接的第一帽部(200)、第二帽部(201)以及在所述第一方向(X)间隔设置的第三侧部(202)和第四侧部(203)，所述第三侧部(202)和所述第四侧部(203)均连接所述第一帽部(200)和所述第二帽部(201)并围成具有第二开口的光路腔(204)，所述光路腔(204)连通所述容纳腔(104)，所述第二焊接端面(206)环绕所述第二开口(205)；
    所述第一帽部(200)具有朝向所述第一基部(100)的第五焊接子面(2060)，所述第二帽部(201)具有朝向所述第二基部(101)的第六焊接子面(2061)，所述第三侧部(202)具有朝向所述第一侧部(102)的第七焊接子面(2062)，所述第四侧部(203)具有朝向所述第二侧部(103)的第八焊接子面(2063)，所述第五焊接子面(2060)、所述第六焊接子面(2061)、所述第七焊接子面(2062)和所述第八焊接子面(2063)位于同一平面内并依次连接形成所述第二焊接端面(206)。
  5. 根据权利要求4所述的光收发器(1)，其特征在于，
    所述第一帽部(200)沿背离所述第二帽部(201)的一侧延伸设置有第一结合部(2000)，所述第一结合部(2000)具有朝向所述第一焊接子面(1060)的第一结合面(2001)以及背离所述第一焊接子面(1060)的第一挤压面(2002)，所述第一结合面(2001)和所述第五焊接子面(2060)位于同一平面内并相连接，且所述第一挤压面(2002)平行于所述第一焊接子面(1060)；
    所述第二帽部(201)沿背离所述第一帽部(200)的一侧延伸设置有第二结合部(2010)，所述第二结合部(2010)具有朝向所述第二焊接子面(1061)的第二结合面(2011)以及背离所述第二焊接子面(1061)的第二挤压面(2012)，所述第二结合面(2011)和所述第六焊接子面(2061)位于同一平面内并相连接，且所述第二挤压面(2012)平行于所述第二焊接子面(1061)。
  6. 根据权利要求4所述的光收发器(1)，其特征在于，
    所述第一基部(100)在第二方向(Y)具有相对应的第一面(1000)和第二面(1001)，所述第二基部(101)在第三方向(Z)具有相对应的第三面(1010)和第四面(1011)，所述第二面(1001)连接所述第三面(1010)；
    所述第一帽部(200)在所述第三方向(Z)相对所述第三面(1010)，所述第二帽部(201)在所述第二方向(Y)相对所述第二面(1001)，所述第一方向(X)、所述第二方向(Y)和所述第三方向(Z)两两相交。
  7. 根据权利要求1所述的光收发器(1)，其特征在于，
    所述管帽(20)开设有光口(208)，所述光口(208)朝向所述光电芯片(30)，所述光口(208)封设有第一光窗(50)，所述光电芯片(30)用于朝向所述第一光窗(50)发射或接收激光。
  8. 根据权利要求1所述的光收发器(1)，其特征在于，
    所述管帽(20)开设有观察口(209)，所述观察口(209)封设有第二光窗(60)。
  9. 根据权利要求7所述的光收发器(1)，其特征在于，所述光收发器(1)还包括：
    透镜(70)，所述透镜(70)设于所述第一光窗(50)背离所述光电芯片(30)的一侧，所述透镜(70)用于耦合所述光电芯片(30)发出或接收的激光。
  10. 根据权利要求1所述的光收发器(1)，其特征在于，所述光收发器(1)还包括：
    监控芯片(80)，所述监控芯片(80)设于所述容纳腔(104)，且所述监控芯片(80)连接所述第二基部(101)，所述监控芯片(80)分别电连接所述光电芯片(30)和所述电连接件(40)。
PCT/CN2024/123359 2023-11-27 2024-10-08 一种光收发器 Pending WO2025112909A1 (zh)

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