WO2025111973A1 - Display substrate, manufacturing method and display apparatus - Google Patents
Display substrate, manufacturing method and display apparatus Download PDFInfo
- Publication number
- WO2025111973A1 WO2025111973A1 PCT/CN2023/135630 CN2023135630W WO2025111973A1 WO 2025111973 A1 WO2025111973 A1 WO 2025111973A1 CN 2023135630 W CN2023135630 W CN 2023135630W WO 2025111973 A1 WO2025111973 A1 WO 2025111973A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- glass substrate
- light
- electrode
- display substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/50—OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements
Definitions
- the present disclosure relates to but is not limited to the field of display technology, and in particular to a display substrate, a preparation method and a display device.
- OLED Organic Light Emitting Diode
- QLED Quantum-dot Light Emitting Diode
- the embodiment of the present disclosure provides a display substrate, comprising a glass substrate, and a composite layer and a flat layer arranged in a direction away from the glass substrate;
- the glass substrate comprises a first lens area at an end surface close to the composite layer, and the composite layer and/or the flat layer comprises a second lens area at an end surface away from the glass substrate;
- An orthographic projection of the second lens area on the glass substrate at least partially overlaps with an orthographic projection of the first lens area on the glass substrate.
- a plurality of first micro-lenses are disposed in the first lens area, and the first micro-lenses are arranged as first arc-shaped surfaces that are concave toward a side of the glass substrate away from the composite layer;
- a plurality of second micro lenses are disposed in the second lens area, and the second micro lenses are arranged as second arc-shaped surfaces that are recessed toward the glass substrate.
- At least one of the first microlens and the second microlens has the same structure and size.
- the composite layer is made of an inorganic-organic hybrid resin, and the refractive index of the inorganic-organic hybrid resin is 1.5 to 1.9.
- the diameter of the cross section of the first curved surface in a direction parallel to the glass substrate is set to be 1 micron to 50 microns;
- the first curved surface is configured to have a maximum dimension in a direction perpendicular to the glass substrate of 0.5 micrometers to 25 micrometers.
- a filter layer is further included, wherein the filter layer is configured to cover the end surface of the flat layer close to the glass substrate, and the refractive index of the flat layer is configured to be greater than the refractive index of the filter layer;
- the refractive index of the composite layer is set to be greater than the refractive index of the glass substrate.
- a first electrode layer further comprising a first electrode layer, a pixel definition layer, a light emitting layer, and a second electrode layer;
- the first electrode layer, the light-emitting layer and the second electrode layer are stacked in sequence in a direction away from the glass substrate, the first electrode layer is located on a side of the flat layer away from the glass substrate, and the first electrode layer is configured as a light-transmitting electrode;
- the pixel definition layer surrounds a plurality of pixel openings, and the light emitting layer is located in the pixel definition layer within the pixel openings;
- the second electrode layer is configured to reflect light passing through the pixel definition layer toward the glass substrate.
- an orthographic projection of the pixel definition layer on the glass substrate at least overlaps with an orthographic projection of the first lens area or/and the second lens area on the glass substrate.
- the second electrode layer is configured to enclose a plurality of first grooves facing the glass substrate
- the pixel definition layer includes a plurality of pixel definition units arranged at intervals in a direction parallel to the glass substrate, and the plurality of pixel definition units each surround the pixel opening;
- the light-emitting layer includes a plurality of light-emitting components, and the light-emitting components and the pixel defining units are arranged in a one-to-one correspondence and are all located in the first groove.
- the planar layer includes a plurality of planar units, the plurality of planar units are arranged to correspond one-to-one to the plurality of pixel defining units and are located in the first groove, and the plurality of planar units are provided with the second lens area on a side away from the glass substrate.
- a filter layer is further included, and the filter layer is located on a side of the flat layer close to the glass substrate;
- the filter layer includes a plurality of filters arranged at intervals in a direction parallel to the glass substrate.
- the filters are arranged to correspond to the pixel defining units one by one and are located in the first groove.
- a plurality of first lens areas are provided, and the optical filters are arranged in one-to-one correspondence with the first lens areas, and the orthographic projection of the first lens area on the glass substrate is located within the orthographic projection of the optical filter on the glass substrate.
- a driving circuit layer is further included, wherein the driving circuit layer is located between the glass substrate and the first electrode layer;
- the second electrode layer includes groove portions and covering portions alternately arranged in a direction parallel to the glass substrate, the groove portions are configured in a groove shape, the groove portions surround the first groove, and the covering portions cover the surface of the driving circuit layer away from the glass substrate.
- the groove portion includes a groove side wall and a groove bottom wall, the groove side wall is arranged to form a ring in a direction parallel to the glass substrate, and the groove bottom wall is arranged to close an end of the groove side wall away from the glass substrate;
- the circumferential surface of the pixel defining unit in a direction parallel to the glass substrate is set as a first end surface
- the circumferential surface of the flat unit in a direction parallel to the glass substrate is set as a second end surface
- the circumferential surface of the filter in a direction parallel to the glass substrate is arranged as a third end surface
- the first end surface, the second end surface and the third end surface are arranged in sequence in a direction perpendicular to the glass substrate;
- the groove sidewall is configured to cover the first end surface, the second end surface and the third end surface
- the groove bottom wall is configured to cover the pixel defining unit and the end surface of the light emitting member away from the glass substrate.
- a driving circuit component and a light shielding layer are further included, wherein the driving circuit component is located between the planar layer and the composite layer;
- the first electrode layer includes a plurality of first electrode units, and the first electrode units are arranged in the first groove;
- the driving circuit assembly includes a connecting electrode, and the first electrode unit is connected to the connecting electrode through a via hole;
- the light shielding layer is configured as a high reflectivity metal film, and the light shielding layer is located on the first electrode layer and/or the connecting electrode and is configured corresponding to the via hole to shield the light directly irradiated from the via hole to the glass substrate.
- the light shielding layer is configured to cover the end surface of the connecting electrode facing the via hole, and the orthographic projection of the light shielding layer on the glass substrate is configured to at least partially overlap with the orthographic projection of the via hole on the glass substrate.
- the first electrode unit includes a via-hole connecting portion located in the via-hole, and the light shielding layer is configured to cover an end surface of the via-hole connecting portion away from the glass substrate.
- the via hole is configured to penetrate the planar layer and the filter layer
- the first electrode unit is configured to cover at least a portion of a hole wall of the via hole
- the pixel definition layer extends into the via hole
- the present disclosure provides a preparation method, which is applied to the above-mentioned display substrate, comprising:
- a plurality of first micro-lenses are formed on the glass substrate, wherein the first lens area is provided with a plurality of first micro-lenses, and the first micro-lenses are arranged to be first arc-shaped surfaces that are concave toward the end surface of the glass substrate away from the composite layer;
- a plurality of second microlenses are formed on the composite layer and/or the flat layer, a plurality of second microlenses are arranged in the second lens area, and the second microlenses are arranged as second arc-shaped surfaces recessed toward the glass substrate.
- An embodiment of the present disclosure provides a display device, including the above-mentioned display substrate.
- FIG1 is a schematic structural diagram of a display device
- FIG2 is a schematic diagram of a planar structure of a display substrate
- FIG3 is a schematic diagram of a cross-sectional structure of a display substrate
- FIG4 is a schematic diagram of a display substrate of the present exemplary embodiment
- Fig. 5 is a schematic cross-sectional view along the line A-A in Fig. 4;
- Fig. 6 is a schematic cross-sectional view taken along line B-B in Fig. 4;
- FIG7 is a schematic diagram of the glass substrate in FIG5 ;
- FIG8 is a partial enlarged schematic diagram of point D in FIG7;
- FIG9 is a partial enlarged schematic diagram of point C in FIG5;
- FIG10 is a partial schematic diagram of the display substrate in FIG6 ;
- FIG11 is a schematic cross-sectional view of another display substrate of the present exemplary embodiment.
- FIG12 is a schematic cross-sectional view of another display substrate of this exemplary embodiment.
- FIG13 is a schematic cross-sectional view of another display substrate of the present exemplary embodiment.
- FIG14 is a schematic cross-sectional view of another display substrate of this exemplary embodiment.
- FIG15 is a schematic diagram of a first preparation method of the display substrate in FIG5 ;
- FIG16 is a schematic diagram of a second preparation method of the display substrate in FIG5 ;
- FIG17 is a third schematic diagram of manufacturing the display substrate in FIG5 ;
- FIG18 is a fourth schematic diagram of manufacturing the display substrate in FIG5 ;
- FIG19 is a fifth schematic diagram of manufacturing the display substrate in FIG5 ;
- FIG20 is a partial enlarged schematic diagram of point E in FIG19;
- FIG21 is a sixth schematic diagram of manufacturing the display substrate in FIG5 ;
- FIG22 is a seventh schematic diagram of manufacturing the display substrate in FIG5 ;
- FIG23 is an eighth schematic diagram of manufacturing the display substrate in FIG5 ;
- FIG. 24 is a ninth schematic diagram of manufacturing the display substrate in FIG. 5 .
- the proportions of the drawings in this disclosure can be used as a reference in actual processes, but are not limited thereto.
- the width-to-length ratio of the channel, The thickness and spacing of each film layer, the width and spacing of each signal line can be adjusted according to actual needs.
- the number of pixels in the display substrate and the number of sub-pixels in each pixel are not limited to the number shown in the figure.
- the drawings described in this disclosure are only structural schematic diagrams. One method of this disclosure is not limited to the shapes or values shown in the drawings.
- ordinal numbers such as “first”, “second” and “third” are provided to avoid confusion among constituent elements, and are not intended to limit the number.
- the terms “installed”, “connected”, and “connected” should be understood in a broad sense.
- it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements.
- installed can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements.
- a transistor refers to an element including at least three terminals: a gate electrode, a drain electrode, and a source electrode.
- the transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode.
- the channel region refers to a region where current mainly flows.
- the first electrode may be a drain electrode and the second electrode may be a source electrode, or the first electrode may be a source electrode and the second electrode may be a drain electrode.
- the functions of the "source electrode” and the “drain electrode” are sometimes interchanged. Therefore, in this specification, the “source electrode” and the “drain electrode” may be interchanged, and the “source terminal” and the “drain terminal” may be interchanged.
- electrical connection includes the case where components are connected together through an element having some electrical function.
- element having some electrical function There is no particular limitation on the “element having some electrical function” as long as it can transmit and receive electrical signals between the connected components. Examples of “element having some electrical function” include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.
- parallel means a state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore, also includes a state where the angle is greater than -5° and less than 5°.
- perpendicular means a state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore, also includes a state where the angle is greater than 85° and less than 95°.
- film and “layer” may be interchanged.
- conductive layer may be replaced by “conductive film”.
- insulating film may be replaced by “insulating layer”.
- triangles, rectangles, trapezoids, pentagons or hexagons in this specification are not in the strict sense, and may be approximate triangles, rectangles, trapezoids, pentagons or hexagons, etc. There may be some small deformations caused by tolerances, and there may be chamfers, arc edges and deformations.
- FIG1 is a schematic diagram of the structure of a display device.
- the display device may include a timing controller, a data driver, a scan driver, a light emitting driver and a pixel array, wherein the timing controller is connected to the data driver, the scan driver and the light emitting driver respectively, the data driver is connected to a plurality of data signal lines (D1 to Dn) respectively, the scan driver is connected to a plurality of scan signal lines (S1 to Sm) respectively, and the light emitting driver is connected to a plurality of light emitting signal lines (E1 to Eo) respectively.
- the timing controller is connected to the data driver, the scan driver and the light emitting driver respectively
- the data driver is connected to a plurality of data signal lines (D1 to Dn) respectively
- the scan driver is connected to a plurality of scan signal lines (S1 to Sm) respectively
- the light emitting driver is connected to a plurality of light emitting signal lines (E1 to Eo) respectively.
- the pixel array may include a plurality of sub-pixels Pxij, i and j may be natural numbers, and at least one sub-pixel Pxij may be a plurality of sub-pixels Pxij.
- a circuit unit and a light emitting device connected to the circuit unit may be included, and the circuit unit may include a pixel driving circuit, and the pixel driving circuit is connected to a scan signal line, a light emitting signal line, and a data signal line.
- the timing controller may provide a grayscale value and a control signal suitable for the specification of the data driver to the data driver, a clock signal suitable for the specification of the scan driver, a scan start signal, etc.
- the scan driver may be provided to the scan driver, and a clock signal suitable for the specification of the light emitting driver, an emission stop signal, etc. may be provided to the light emitting driver.
- the data driver may generate a data voltage to be provided to the data signal lines D1, D2, D3, ... and Dn using the grayscale value and the control signal received from the timing controller. For example, the data driver may sample the grayscale value using a clock signal, and apply a data voltage corresponding to the grayscale value to the data signal lines D1 to Dn in a unit line, and n may be a natural number.
- the scan driver may generate a scan signal to be provided to the scan signal lines S1, S2, S3, ... and Sm by receiving a clock signal, a scan start signal, etc. from the timing controller.
- the scan driver may sequentially provide a scan signal having a conduction level pulse to the scan signal lines S1 to Sm.
- the scan driver may be configured in the form of a shift register, and may sequentially transmit a scan start signal provided in the form of a conduction level pulse to the next level circuit under the control of a clock signal to generate a scan signal, and m may be a natural number.
- the light-emitting driver may generate an emission signal to be provided to the light-emitting signal lines E1, E2, E3, ... and Eo by receiving a clock signal, an emission stop signal, etc. from a timing controller.
- the light-emitting driver may sequentially provide an emission signal having a cut-off level pulse to the light-emitting signal lines E1 to Eo.
- the light-emitting driver may be configured in the form of a shift register, and may sequentially transmit an emission stop signal provided in the form of a cut-off level pulse to the next level circuit under the control of a clock signal to generate an emission signal, and o may be a natural number.
- a pixel array may be provided on a display substrate.
- FIG2 is a schematic diagram of a planar structure of a display substrate.
- the display substrate may include a plurality of pixel units P arranged in a matrix, and at least one pixel unit P may include a first sub-pixel P1 emitting a first color light, a second sub-pixel P2 emitting a second color light, and a third sub-pixel P3 emitting a third color light.
- Each sub-pixel may include a circuit unit and a light-emitting device, and the circuit unit may include at least a pixel driving circuit, and the pixel driving circuit is respectively connected to a scanning signal line, a light-emitting signal line, and a data signal line, and the pixel driving circuit is configured to receive a data voltage transmitted by the data signal line under the control of the scanning signal line and the light-emitting signal line, and output a corresponding current to the light-emitting device.
- the light-emitting device in each sub-pixel is respectively connected to the pixel driving circuit of the sub-pixel in which it is located, and the light-emitting device is configured to emit light of corresponding brightness in response to the current output by the pixel driving circuit of the sub-pixel in which it is located.
- the first sub-pixel P1 may be a red sub-pixel (R) emitting red light
- the second sub-pixel P2 may be a blue sub-pixel (B) emitting blue light
- the third sub-pixel P3 may be a green sub-pixel (G) emitting green light.
- the shape of the sub-pixels may be rectangular, rhombus, pentagonal or hexagonal, and the three sub-pixels may be arranged in a horizontal parallel, vertical parallel or triangular manner, which is not limited in the present disclosure.
- a pixel unit may include four sub-pixels, and the four sub-pixels may be arranged in a horizontal parallel arrangement, a vertical parallel arrangement, or a square arrangement, etc., which is not limited in the present disclosure.
- FIG3 is a schematic diagram of a cross-sectional structure of a display substrate.
- the display substrate may include a driving circuit layer 20 disposed on a glass substrate 10, a light emitting structure layer 30 disposed on a side of the driving circuit layer 20 away from the glass substrate 10, and an encapsulation structure layer 40 disposed on a side of the light emitting structure layer 30 away from the glass substrate 10.
- the display substrate may include other film layers, such as a touch structure layer, etc., which is not limited in the present disclosure.
- the glass substrate 10 may be a flexible substrate, or may be a rigid substrate.
- the driving circuit layer 20 may include a plurality of circuit units, each of which may include at least a pixel driving circuit composed of a plurality of transistors and a storage capacitor.
- the light-emitting structure layer 30 may include a plurality of light-emitting devices, each of which may include at least an anode, a pixel definition layer, an organic light-emitting layer and a cathode, the anode being connected to the pixel driving circuit, the organic light-emitting layer being connected to the anode, the cathode being connected to the organic light-emitting layer, and the organic light-emitting layer emitting light of corresponding colors under the drive of the anode and the cathode.
- Packaging The structural layer 40 may include a first encapsulation layer, a second encapsulation layer and a third encapsulation layer stacked together.
- the first encapsulation layer and the third encapsulation layer may be made of inorganic materials, and the second encapsulation layer may be made of organic materials.
- the second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer to form an inorganic material/organic material/inorganic material stacked structure, which can ensure that external water vapor cannot enter the light-emitting structure layer 30, but is not limited to this.
- the first encapsulation layer, the second encapsulation layer and the third encapsulation layer are all inorganic materials or are all organic materials.
- OLED display devices without a light-efficiency enhancement structure only 20% of the light emitted by the light-emitting device can be emitted from the front of the screen, which means that 80% of the light cannot be emitted from the end face of the glass substrate away from the light-emitting device and disappears, resulting in low light-emitting efficiency.
- the relevant OLED display devices have a light-efficiency enhancement structure, which allows more light to be emitted from the end face of the glass substrate away from the light-emitting device, although it can improve the light-emitting efficiency to a certain extent, the improvement effect is not ideal.
- FIG4 is a schematic diagram of a display substrate of the exemplary embodiment
- FIG5 is a schematic diagram of a cross section in the direction of A-A in FIG4
- FIG6 is a schematic diagram of a cross section in the direction of B-B in FIG4.
- the display substrate may include a glass substrate 10 and a composite layer 15 and a flat layer 23 arranged in a direction away from the glass substrate 10, wherein the glass substrate 10 may include a first lens area 10c at an end face close to the composite layer 15, and the composite layer 15 and/or the flat layer 23 may include a second lens area 23a at an end face away from the glass substrate 10.
- the orthographic projection of the second lens area 23a on the glass substrate 10 is set to overlap at least partially with the first lens area 10c.
- the display substrate includes at least two layers of microlens arrays (MLA for short), so that more light can be emitted from the display substrate, the brightness of the display substrate can be improved, the luminous efficiency can be improved, and the power consumption can be reduced when the preset light intensity is reached.
- MLA microlens arrays
- FIG. 7 is a schematic diagram of the glass substrate in FIG. 5
- FIG. 8 is a partial enlarged schematic diagram of D in FIG. 7
- the material of the glass substrate 10 may be translucent glass, and the refractive index of the glass substrate 10 may be less than 1.55.
- the display substrate of this example may emit light on the side having the glass substrate 10.
- the surface of one side of the glass substrate 10 includes a light emitting area 10a and a circuit area 10b, and the light emitting area 10a may include a first lens area 10c.
- a plurality of first microlenses 13 are uniformly arranged in the first lens area 10c, and the plurality of first microlenses 13 are arranged in an array to form a microlens array (MLA for short).
- MLA microlens array
- the plurality of first microlenses 13 in the first lens area 10c have the same structure and size.
- the microlens array can converge light, thereby improving brightness and viewing angle, and has the characteristics of miniaturization, light weight, arraying, etc., and can also improve color performance.
- the first microlens 13 may be a first curved surface 14 formed by being recessed on the surface of the glass substrate 10 facing the composite layer 15 , and the first curved surface 14 may be recessed toward the surface of the glass substrate 10 away from the composite layer 15 to form an arc-shaped groove structure.
- the height of the first curved surface 14 may be set to be the maximum distance between the first curved surface 14 and the surface of the glass substrate 10 facing the composite layer 15 , that is, the maximum dimension H1 of the first curved surface 14 in the direction perpendicular to the glass substrate 10 , and the value of H1 may be 0.5 ⁇ m (micrometer) to 25 ⁇ m (micrometer).
- the cross section of the first curved surface 14 in the direction parallel to the glass substrate 10 is circular, and the maximum diameter of the cross section of the first curved surface 14 in the direction parallel to the glass substrate 10 may be D1, and the value of D1 may be 1 ⁇ m (micrometer) to 50 ⁇ m (micrometer).
- the glass substrate 10 has a plurality of light emitting areas 10 a arranged at intervals.
- the circuit area 10 b can separate the plurality of light emitting areas 10 a.
- the sizes and arrangements of the first micro lenses 13 in the plurality of light emitting areas 10 a can be consistent.
- the composite layer 15 may be covered on the glass substrate 10.
- the material of the composite layer 15 may be an organic-inorganic hybrid resin.
- the organic-inorganic hybrid resin is a light-transmitting material, which is a mixture of inorganic and organic substances.
- the organic-inorganic hybrid resin contains silicon (Si), oxygen (O) and nitrogen (N).
- the organic-inorganic hybrid resin has good heat resistance and can withstand high temperatures of 300°C to 500°C.
- the composite layer 15 is a hybrid of inorganic and organic materials, so that the composite layer 15 has the functions of a flat layer and a buffer layer at the same time.
- the refractive index of the composite layer 15 may be 1.5 to 1.9, and the refractive index of the composite layer 15 may be changed by adjusting the content ratio of oxygen (O) and nitrogen (N) in the organic-inorganic hybrid resin. At the same time, the refractive index of the composite layer 15 may be greater than the refractive index of the glass substrate 10.
- the composite layer 15 is away from the glass substrate 10. The plane is parallel to the glass substrate 10, and the protruding part of the surface of the composite layer 15 close to the glass substrate 10 fills the arc groove formed by the depression of the first arc surface 14.
- the glass substrate 10 also includes a first metal layer 12, which is arranged corresponding to the circuit area 10b, and the circuit area 10b is at least partially covered by the first metal layer 12.
- the first metal layer 12 can be copper (Cu), aluminum (Al), silver (Ag), titanium (Ti), molybdenum (Mo) or an alloy prepared by a low-resistance metal.
- Part of the first metal layer 12 can be a light shielding plate to block the light from emitting, and another part of the first metal layer 12 can be a SD or VDD wiring.
- FIG9 is a partial enlarged schematic diagram of the C in FIG5 .
- the display substrate further includes a first buffer layer 16, an interlayer dielectric/passivating film (ILD/PVX) 17 and a driving circuit component 18.
- the first metal layer 12, the composite layer 15, the first buffer layer 16, the interlayer dielectric/passivating film (ILD/PVX) 17 and the driving circuit component 18 may constitute a driving circuit layer 20, and the driving circuit layer 20 covers the glass substrate 10.
- the composite layer 15, the first buffer layer 16 and the interlayer dielectric (ILD/PVX) 17 are sequentially stacked in a direction away from the glass substrate 10.
- the driving circuit component 18 is located between the glass substrate 10 and the interlayer dielectric (ILD/PVX) 17 and is electrically connected to the first metal layer 12 through a via structure.
- the interlayer dielectric (ILD/PVX) 17 covers the driving circuit component 18.
- FIG10 is a partial schematic diagram of the display substrate in FIG6.
- the display substrate further includes a first electrode layer 34, a pixel definition layer 36, a light emitting layer 38, a second electrode layer 43 and a filter layer 21, wherein the first electrode layer 34, the light emitting layer 38 and the second electrode layer 43 may be stacked in sequence in a direction away from the glass substrate 10, the first electrode layer 34 may be located on the side of the planar layer 23 away from the glass substrate 10, and the first electrode layer 34 may be a light-transmitting electrode.
- the pixel definition layer 36 may enclose a plurality of pixel openings 37, the light emitting layer 38 is located in the pixel openings 37, the material of the pixel definition layer 36 is set to be a light-transmitting material, the second electrode layer 43 may be a high reflectivity electrode, and the second electrode layer 43 may reflect light passing through the pixel definition layer 36 toward the glass substrate 10.
- the first electrode layer 34, the pixel definition layer 36, the light emitting layer 38, the second electrode layer 43, the planar layer 23 and the filter layer 21 may constitute a light-emitting structure layer 30.
- the second electrode layer 43 is configured to enclose a plurality of first grooves 48 with notches facing the glass substrate 10, and the second electrode layer 43 includes a plurality of groove portions 49 and a plurality of covering portions 50 arranged alternately in a direction parallel to the glass substrate 10, wherein the groove portion 49 may be groove-shaped, and the covering portion 50 covers the surface of the driving circuit layer 20 away from the glass substrate 10.
- the groove portion 49 includes a groove side wall 59 and a groove bottom wall 60, and the groove side wall 59 may be configured to enclose a ring in a direction parallel to the glass substrate 10, and the groove bottom wall 60 is parallel to the glass substrate 10 and may close an end of the groove side wall 59 away from the glass substrate 10.
- the second electrode layer 43 may be a high reflectivity electrode, and the second electrode layer 43 may serve as a cathode.
- the pixel definition layer 36 includes a plurality of pixel defining units 46 arranged at intervals in a direction parallel to the glass substrate, and the plurality of pixel defining units 46 each surround a pixel opening 37, so that the pixel definition layer 36 has a plurality of independent pixel defining units 46.
- the number of the pixel defining units 46 is consistent with the pixel opening 37.
- the light-emitting layer 38 includes a plurality of light-emitting components 39, and the light-emitting components 39 and the pixel defining units 46 can be arranged in a one-to-one correspondence, that is, each light-emitting component 39 is arranged in the pixel opening 37 of the corresponding pixel defining unit 46, and at the same time, each light-emitting component 39 and the corresponding pixel defining unit 46 are integrally located in the first groove 48, so that the light-emitting components 39 and the first groove 48 are arranged in a one-to-one correspondence.
- the light-emitting components 39 can emit white light under power supply conditions.
- the first groove 48 surrounded by the second electrode layer 43 provides installation space for the light-emitting component 39 and the pixel defining unit 46, and separates adjacent light-emitting components 39 and adjacent pixel defining units 46.
- the light emitted by the light-emitting component 39 can only be irradiated toward the glass substrate 10 through the notch of the first groove 48, and multiple light-emitting components 39 share one cathode.
- the first electrode layer 34 includes a plurality of first electrode units 47 arranged at intervals in a direction parallel to the glass substrate 10
- the flat layer 23 includes a plurality of flat units 45 arranged at intervals in a direction parallel to the glass substrate 10
- the filter layer 21 includes a plurality of flat units 45 arranged at intervals in a direction parallel to the glass substrate 10.
- the first electrode unit 47, the flat unit 45, and the filter 31 can all correspond to the first groove 48 one by one and be located in the first groove 48.
- the filter 31, the flat unit 45, and the first electrode unit 47 are sequentially stacked in a direction away from the glass substrate 10.
- the first groove 48 surrounded by the second electrode layer 43 also provides installation space for the first electrode unit 47, the flat unit 45, and the filter 31, and separates the adjacent first electrode units 47, the adjacent flat units 45, and the adjacent filter 31.
- the light emitted by the light-emitting component 39 passes through the flat unit 45 and is filtered by the filter 31, and then irradiated toward the glass substrate 10 from the notch of the first groove 48.
- the filter layer 21 can filter light and filter white light into light of a preset color.
- the filter layer 21 can include a red filter, a green filter or a blue filter, that is, the plurality of filters 31 can be red filters, green filters or blue filters.
- the sizes and arrangements of the first microlenses 13 in the light exit area 10a corresponding to different filters 31 are different, so that sub-pixels of different colors are differentiated to meet the requirements of light extraction intensity of sub-pixels of different colors.
- each light-emitting component 39 emits white light
- the plurality of filters 31 can be divided into three types.
- the first filter 31 can filter white light into red light
- the second filter 31 can filter white light into green light
- the third filter 31 can filter white light into blue light.
- the sizes and arrangements of the first microlenses 13 corresponding to the three filters 31 are different, so that the intensities of red light, green light and blue light are different, meeting the requirements of light extraction intensity of sub-pixels of different colors.
- the orthographic projection of the pixel opening 37 on the glass substrate 10 may be located within the orthographic projection of the filter layer 21 on the glass substrate 10, and another portion of the end surface of the driving circuit layer 20 away from the glass substrate 10 is covered by the covering portion 50 of the second electrode layer 43.
- the refractive index of the flat layer 23 is set to be greater than the refractive index of the filter layer 21.
- the first electrode unit 47 may be a light-transmitting electrode material
- the first electrode unit 4 may be used as an anode
- each light-emitting component 31 uses the first electrode unit 4 corresponding to each other as an anode, but uses the second electrode layer as a cathode to form a common cathode
- the flat unit 45 may be set to a light-transmitting material, thereby, the white light emitted by the light-emitting component 39 passes through the first electrode unit 47 and the flat unit 45, is filtered into a preset color by the filter 31, and then passes through the driving circuit layer 20 and the glass substrate 10, and is emitted from the display substrate.
- the surface of the flat layer 23 away from the glass substrate 10 may include a second lens area 23a, and the orthographic projection of the second lens area 23a on the glass substrate 10 is located in the first lens area 10c.
- the flat layer 23 may have a plurality of second lens areas 23a, and each flat unit 45 has a second lens area 23a, and the second lens area 23a corresponds to the first lens area 10c one by one.
- a plurality of second microlenses 26 are evenly arranged in the second lens area 23a, and the plurality of second microlenses 26 are arranged in an array to form a microlens array.
- the second microlens 26 may be a second arc surface 27 that is recessed on the surface of the flat layer 23 away from the glass substrate 10, and the second arc surface 27 may be recessed toward the surface of the flat layer 23 away from the light emitting structure layer 30 to form an arc groove structure.
- the second arc surface 27 and the first arc surface 14 are consistent in structure, size and arrangement, but are not limited thereto.
- the second arc surface 27 and the first arc surface 14 are inconsistent in at least one of the structure, size and arrangement.
- the orthographic projection of the pixel definition layer 36 on the glass substrate 10 at least overlaps with the orthographic projection of the first lens area 10 c and/or the second lens area 23 a on the glass substrate 10 , and the orthographic projections of the first lens area 10 c and the second lens area 23 a on the glass substrate 10 are both located within the orthographic projection of the filter layer 21 on the glass substrate 10 .
- the surface of the flat layer 23 away from the glass substrate 10 may include a second lens area 23a
- the end surface of the glass substrate 10 close to the composite layer 15 may include a plurality of first lens areas 10c
- the second lens areas 23a correspond to the first lens areas 10c one by one
- the second curved surface 27 of the second lens area 23a and the first curved surface 14 of the first lens area 10c are inconsistent in size
- the size of the first curved surface 14 in the direction perpendicular to the glass substrate 10 is larger than the size of the second curved surface 27 in the direction perpendicular to the glass substrate 10
- the orthographic projection area of a single first curved surface 14 on the glass substrate 10 is larger than the orthographic projection area of a single second curved surface 27 on the glass substrate 10.
- the circumferential end surface of the pixel defining unit 46 is a first end surface 51, and the first end surface 51 is an outer surface of the pixel defining unit 46 in a direction parallel to the glass substrate 10, that is, Each first end face 51 is an end face of the pixel defining unit 46 facing the adjacent pixel defining unit 46.
- the circumferential end face of the flat unit 45 is a second end face 52, which is the outer surface of the flat unit 45 in a direction parallel to the glass substrate 10, that is, the second end face 52 is the end face of each flat unit 45 facing the adjacent flat unit 45.
- the circumferential end face of the filter 31 is a third end face 53, which is the outer surface of the filter 31 in a direction parallel to the glass substrate 10, that is, the third end face 53 is the end face of each filter 31 facing the adjacent filter 31.
- the light emitting member 39, the pixel defining unit 46, the first electrode unit 47, the flat unit 45, and the filter 31 can all correspond to the first groove 48 one by one and be located in the first groove 48, so that the groove sidewall 59 of the groove portion 49 in the second electrode layer 43 covers the first end face 51, the second end face 52, and the third end face 53, which can prevent color mixing, that is, prevent the cross-mixing of light filtered by adjacent filters 31.
- the second electrode layer 43 forms a reflective structure covering the first end face 51, the second end face 52, and the third end face 53, and the reflective structure can reflect the large-angle light emitted by the sub-pixel, so that the light is converged and the light extraction efficiency is improved.
- the driving circuit assembly 18 includes a connecting electrode 19, and the first electrode unit 47 of the first electrode layer 34 is electrically connected to the connecting electrode 19 through the via hole 32.
- the connecting electrode 19 may be provided with an opaque light shielding layer 54 corresponding to the via hole 32 to shield the light directly irradiated from the via hole 32 to the glass substrate 10, and to prevent the white light directly irradiated from the via hole 32 to the glass substrate 10 from mixing with the light with other colors through the filter 31.
- the light shielding layer 54 may be a high reflectivity metal film, and the light shielding layer 54 may cover the end surface of the connecting electrode 19 facing the via hole 32.
- the via hole 32 extends in a direction perpendicular to the glass substrate 10, and the via hole 32 passes through the flat layer 23 and the filter layer 21, and extends to the connecting electrode 19, and the pixel definition layer 36 covers the via hole 32.
- the display substrate further includes an encapsulation structure layer 40, which includes an encapsulation film 43 and a cover plate 44, and the cover plate 44 is installed on the side of the encapsulation film 43 away from the glass substrate 10.
- the encapsulation film 43 may be one or more layers of inorganic or organic thin films, and the encapsulation film 43 covers the end face of the light-emitting structure layer 30 away from the glass substrate 10.
- the encapsulation film 43 can prevent water and oxygen from entering the display substrate, and provides good water and oxygen isolation properties for the display substrate.
- the cover plate 44 covers the side of the encapsulation film 43 away from the glass substrate 10, and the cover plate can provide protection for the display substrate.
- the display substrate of this example may be bottom-emitting, the glass substrate 10 is at the bottom of the display substrate, and the light-emitting component 39 directly irradiates the glass substrate 10 under power supply conditions.
- the light can be filtered by the filter 31 and then irradiated to the glass substrate 10 through the notch of the first groove 48.
- the light irradiated by the light-emitting component 39 to the pixel defining unit 36 will be reflected by the second electrode layer to the side of the glass substrate 10 after passing through the pixel defining unit 36, so that more light is emitted from the light-emitting structure layer 20, thereby improving the brightness and luminous efficiency, and reducing power consumption when the preset brightness is reached.
- FIG. 11 is another cross-sectional schematic diagram of a display substrate of the present exemplary embodiment.
- the driving circuit assembly 18 includes a connecting electrode 19, and the first electrode unit 47 of the first electrode layer 34 is electrically connected to the connecting electrode 19 through the via hole 32.
- the first electrode layer 34 may be provided with an opaque light shielding layer 54 corresponding to the via hole 32 to shield the light directly irradiated from the via hole 32 to the glass substrate 10, and to prevent the white light directly irradiated from the via hole 32 to the glass substrate 10 from mixing with the light with other colors through the filter 31.
- the light shielding layer 54 may be a high reflectivity metal film
- the first electrode unit 47 includes a via hole connecting portion 55 located in the via hole 32
- the via hole connecting portion 55 covers the hole wall of the via hole 32
- the light shielding layer 54 covers the via hole 32.
- the light shielding layer 54 of this example may cover the end surface of the via hole connecting portion 55 away from the connecting electrode 19.
- FIG. 12 is another cross-sectional schematic diagram of a display substrate of the present exemplary embodiment.
- the driving circuit assembly 18 includes a connecting electrode 19, and the first electrode unit 47 of the first electrode layer 34 is electrically connected to the connecting electrode 19 through the via hole 32.
- the first electrode layer 34 and the connecting electrode 19 may be provided with an opaque light shielding layer 54 corresponding to the via hole 32 to shield the light directly irradiated from the via hole 32 to the glass substrate 10, and to prevent the white light directly irradiated from the via hole 32 to the glass substrate 10 from mixing with the light with other colors through the filter 31.
- the light shielding layer 54 may be a high-reflectivity metal film, and the light shielding layer 54 includes a first light shielding portion 56 and a second light shielding portion 57.
- the first electrode unit 47 includes a position The via connecting portion 55 in the via hole 32 covers the hole wall of the via hole 32 , the first shading portion 56 can cover the end surface of the via connecting portion 55 away from the connecting electrode 19 , and the second shading portion 57 can cover the end surface of the connecting electrode 19 facing the via hole 32 .
- FIG13 is a schematic cross-sectional view of another display substrate of the present exemplary embodiment.
- the display substrate may include a glass substrate 10 and a composite layer 15 and a flat layer 23 stacked in a direction away from the glass substrate 10, wherein the glass substrate 10 may include a first lens area 10c at the end face close to the composite layer 15, and a plurality of first microlenses 13 are arranged in an array to form a microlens array; the flat layer 23 is not provided with a microlens array, and the composite layer 15 may include a second lens area 23a at the end face away from the glass substrate 10, and a plurality of second microlenses 26 are arranged in an array to form a microlens array.
- the orthographic projection of the second lens area 23a on the glass substrate 10 is set to overlap at least partially with the first lens area 10c.
- the display substrate has two layers of microlens arrays, so that more light can be emitted from the display substrate, the brightness of the display substrate can be improved, the luminous efficiency can be improved, and the power consumption can be reduced when the preset light intensity is reached.
- FIG14 is another cross-sectional schematic diagram of a display substrate of the present exemplary embodiment.
- the display substrate may include a glass substrate 10, wherein the glass substrate 10 may include a first lens area 10c at the end surface close to the composite layer 15, and a plurality of first microlenses 13 are arranged, and the plurality of first microlenses 13 are arranged in an array to form a microlens array, thereby the display substrate has a layer of microlens array.
- the first groove 48 surrounded by the second electrode layer 43 also provides installation space for the light emitting component 31, the first electrode unit 47, the flat unit 45, and the filter 31, and the adjacent light emitting components 31, the adjacent first electrode unit 47, the adjacent flat unit 45, and the adjacent filter 31 are separated from each other.
- the light emitted by the light emitting component 39 is filtered by the filter 31 and then irradiated to the glass substrate 10 from the notch of the first groove 48, and the second electrode layer 43 forms a reflective structure, which can reflect the large-angle light emitted by the sub-pixel, so that the light is converged and the light extraction efficiency is improved.
- the preparation process of the display substrate as shown in FIGS. 5 and 6 may include the following operations.
- a plurality of first microlenses are formed on a glass substrate.
- FIG15 is a first preparation schematic diagram of the display substrate in FIG5 .
- forming a plurality of first microlenses on a glass substrate may include: first forming a shielding layer pattern 11 on a glass substrate 10, and then etching the glass substrate 10 to form first microlenses 13.
- the surface of the glass substrate 10 facing the light emitting structure layer 30 includes a light emitting area 10a and a circuit area 10b, and the light emitting area 10a further includes a first lens area 10c.
- the shielding layer pattern 11 includes a first metal layer 12 covering the surface of the glass substrate 10, and the circuit area 10b is at least partially covered by the first metal layer 12.
- the first metal layer 12 can be copper (Cu), aluminum (Al), silver (Ag), titanium (Ti), molybdenum (Mo) or an alloy prepared by a low resistance metal.
- Part of the first metal layer 12 can be a light shielding plate to block the light from emitting, and another part of the first metal layer 12 can be an SD or VDD wiring.
- forming the blocking layer pattern 11 includes first depositing a first metal film on the glass substrate 10, then coating the first metal film with photoresist, exposing it to ultraviolet light using a first mask after pre-baking, and retaining the photoresist pattern only at the position of the first metal layer 12 after development, and then post-baking, etching, and stripping the photoresist to obtain the blocking layer pattern 11.
- a plurality of first microlenses 13 are evenly arranged in the first lens area 10c, and the plurality of first microlenses 13 are arranged in an array to form a microlens array.
- the first microlens 13 may be a first curved surface 14 that is recessed on the surface of the glass substrate 10 facing the light-emitting structure layer 30, and the first curved surface 14 may be recessed toward the surface of the glass substrate 10 away from the light-emitting structure layer 30 to form an arc-shaped groove structure.
- the height of the first curved surface 14 may be set to be the maximum distance H1 between the first curved surface 14 and the surface of the glass substrate 10 facing the light-emitting structure layer 30, and the value of H1 may be 0.5 ⁇ m to 25 ⁇ m.
- the cross-section of the first curved surface 14 in a direction parallel to the glass substrate 10 is a circle.
- the maximum diameter of the cross section of the first curved surface 14 in the direction parallel to the glass substrate 10 can be D1, and the value of D1 can be 1 ⁇ m to 50 ⁇ m.
- a plurality of light emitting areas 10a are provided, and the size and arrangement of the first microlenses 13 in the plurality of light emitting areas 10a can be consistent.
- the etching process to form the first microlens 13 on the glass substrate 10 may be wet etching or dry etching.
- wet etching is used, and during the etching process, an HF series etching liquid may be used to remove part of the glass material on the glass substrate 10 to form a concave first arc-shaped surface 14, as shown in FIG5 .
- the invention is not limited thereto.
- an etching gas is an F series CF4 (carbon tetrafluoride) gas or SF6 (sulfur hexafluoride) gas used in combination with etching to remove part of the glass material on the glass substrate 10 to form a concave first arc-shaped surface 14.
- FIG 16 is a second preparation schematic diagram of the display substrate in Figure 5
- Figure 17 is a third preparation schematic diagram of the display substrate in Figure 5.
- forming a driving circuit layer 20 includes first forming a composite layer 15, and then preparing a first buffer layer (buffer) 16, an interlayer insulating layer (ILD/PVX) 17, and a driving circuit component 18 through processes such as deposition and etching to form a driving circuit layer 20, and the driving circuit layer 20 covers the glass substrate 10.
- buffer layer buffer layer
- ILD/PVX interlayer insulating layer
- the driving circuit layer 20 includes a laminated composite layer 15, a first buffer layer 16, and an interlayer insulating layer (ILD/PVX) 17, wherein the first buffer layer 16 covers the side of the composite layer 15 away from the glass substrate 10, and the interlayer insulating layer (ILD/PVX) 17 is located on the side of the first buffer layer 16 away from the composite layer 15.
- the driving circuit component 18 is connected to the first metal layer 12 through a via structure, and the driving circuit component 18 includes a connecting electrode 19, which may be made of an opaque metal material.
- forming the composite layer first may include: uniformly coating a liquid solvent containing a dielectric material on the glass substrate 10 having the first microlens 13 by spin coating (Spin on Glass, SOG for short), and then curing the composite layer by heat treatment. During the coating of the liquid solvent, the arc groove formed by the depression of the first arc surface 14 may be filled.
- the material of the composite layer 15 may be an organic-inorganic hybrid resin, which contains silicon (Si), oxygen (O) and nitrogen (N).
- the organic-inorganic hybrid resin has good heat resistance and can withstand high temperatures of 300°C to 500°C.
- the composite layer 15 is a hybrid of inorganic and organic materials, so that the composite layer 15 has the functions of a flat layer and a buffer layer at the same time.
- the refractive index of the composite layer 15 may be 1.5 to 2.0, and the refractive index of the composite layer 15 may be changed by adjusting the content ratio of oxygen (O) and nitrogen (N) in the organic-inorganic hybrid resin, and the refractive index of the composite layer 15 is greater than the refractive index of the glass substrate 10.
- the plane of the composite layer 15 away from the glass substrate 10 is parallel to the glass substrate 10, and the protruding portion of the surface of the composite layer 15 on one side close to the glass substrate 10 fills the arc groove formed by the depression of the first arc surface 14.
- FIG18 is a fourth schematic diagram of preparing the display substrate in FIG5
- FIG19 is a fifth schematic diagram of preparing the display substrate in FIG5
- FIG20 is a partial enlarged schematic diagram of point E in FIG19 .
- forming the first microlens may include: first forming a filter layer pattern 28 on the driving circuit layer 20 , forming a flat layer pattern 29 , and etching the second microlens 26 .
- forming a filter layer pattern 28 on the driving circuit layer 20 includes: first depositing a color film on the driving circuit layer 20, and then forming a filter layer 21 by etching to obtain a filter layer pattern 28.
- the filter layer pattern 28 includes a filter layer 21 covering the driving circuit layer 20, and the orthographic projection of the filter layer 21 on the glass substrate 10 is located in the light exit area.
- the filter layer 21 may include a plurality of filters 31, and the plurality of filters 31 are arranged at intervals on a plane parallel to the glass substrate 10.
- the filters 31 are formed by etching the color film.
- the filter layer 21 can filter light and filter white light into light of a preset color.
- the filter layer 21 can be a red filter, a green filter, or a blue filter.
- the filter layer 21 has a first through hole 22, and the first through hole 22 penetrates the filter layer 21 in a direction perpendicular to the glass substrate 10.
- forming the planar layer pattern 29 includes: coating an organic material layer, and then forming a planar layer 23 by etching to obtain the planar layer pattern 29.
- the filter layer pattern 28 includes a planar layer 23 disposed on the filter layer pattern 28, and the planar layer 23 completely covers the end surface of the filter layer 21 away from the driving circuit layer 20.
- the planar layer 23 has a second through hole 24, and the second through hole 24 penetrates the planar layer 23 in a direction perpendicular to the glass substrate 10, and the second through hole 24 is connected to the first through hole 22.
- the interlayer insulating layer (ILD/PVX) 17 has a third through hole 25 on the end surface close to the planar layer 23, one end of the third through hole 25 is connected to the second through hole 24, and the other end extends to the connecting electrode 19, thereby, the first through hole 22, the second through hole 24 and the third through hole 25 form a via 32 extending in a direction perpendicular to the glass substrate 10.
- the second microlenses 26 may be etched by dry etching to remove part of the material on the flat layer 23 to form a recessed second microlens 26.
- the surface of the flat layer 23 away from the glass substrate 10 may include a second lens area 23a, and the orthographic projection of the second lens area 23a on the glass substrate 10 is located in the first lens area 10c.
- the flat layer 23 may have a plurality of second lens areas 23a, and the second lens areas 23a correspond to the first lens areas 10c one by one.
- a plurality of second microlenses 26 are evenly arranged in the second lens area 23a, and the plurality of second microlenses 26 are arranged in an array to form a microlens array.
- the second microlens 26 may be a second arc surface 27 that is recessed on the surface of the flat layer 23 away from the glass substrate 10, and the second arc surface 27 may be recessed toward the surface of the flat layer 23 away from the light-emitting structure layer 30 to form an arc-shaped groove structure.
- the height of the second curved surface 27 can be set to the maximum distance H2 between the second curved surface 27 and the surface of the flat layer 23 facing the light emitting structure layer 30, and the value of H2 can be 0.5 ⁇ m to 25 ⁇ m.
- the cross section of the second curved surface 27 in the direction parallel to the glass substrate 10 is circular, and the maximum diameter of the cross section of the second curved surface 27 in the direction parallel to the glass substrate 10 can be D2, and the value of D2 can be 1 ⁇ m to 50 ⁇ m.
- the second curved surface 27 and the first curved surface 14 are consistent in structure, size and arrangement, but are not limited thereto.
- the second curved surface 27 and the first curved surface 14 are inconsistent in at least one of the structure, size and arrangement.
- Figure 21 is a sixth preparation schematic diagram of the display substrate in Figure 5
- Figure 22 is a seventh preparation schematic diagram of the display substrate in Figure 5
- Figure 23 is an eighth preparation schematic diagram of the display substrate in Figure 5
- Figure 24 is a ninth preparation schematic diagram of the display substrate in Figure 5.
- forming a light-emitting structure layer may include: forming a first electrode pattern 33, forming a pixel definition layer pattern 35, forming a light-emitting layer 38, and forming a second electrode layer 42.
- forming the first electrode pattern 33 includes: first depositing a layer of electrode film on the flat layer pattern 29 where the second microlens 26 is etched, and then etching the electrode film to form the first electrode pattern 33.
- the first electrode pattern 33 includes a stacked filter layer 24 and a flat layer 23, and a first electrode layer 34.
- the first electrode layer 34 covers the second lens area 23a on the flat layer 23, and extends into the via hole 32 and is attached to the connecting electrode 19, so that the first electrode layer 34 is connected to the via hole 32 of the driving circuit.
- the first electrode layer 34 can be used as an anode, and the first electrode layer 34 can be a light-transmitting electrode that allows light to pass through.
- the connecting electrode 19 and/or the first electrode layer 34 can be provided with a light-proof structure to prevent light from directly transmitting through the first electrode layer 34 at the via hole 32 and then continuing to irradiate toward the glass substrate 10.
- the first electrode layer 34 can cover the entire hole wall of the via hole 32, or only cover part of the hole wall of the via hole 32.
- forming the pixel definition layer pattern 35 includes: first depositing a layer of inorganic material film on the first electrode pattern 33, and then forming the pixel definition layer pattern 35 by etching.
- the pixel definition layer pattern 35 includes a pixel definition layer 36 covering the first electrode pattern 33, and a pixel opening 37 is provided on the pixel definition layer 36, and the pixel opening 37 exposes the first electrode layer 34.
- the pixel definition layer 36 is located on the side of the first electrode layer 34 away from the glass substrate 10, and part of the pixel definition layer 36 fills the vacancy of the via 32.
- the pixel definition layer 36 can be made of a high-transmittance material, so that the pixel definition layer 36 has a high transparency, so that more light can pass through the pixel definition layer 36.
- the light-emitting layer 38 can be formed by evaporation, and the light-emitting layer 38 is prepared in the pixel opening 37.
- the light-emitting layer 38 covers the exposed end surface of the first electrode layer 34 facing away from the glass substrate 10, and the light-emitting layer 38 includes a plurality of light-emitting components 39, and the plurality of light-emitting components 39 correspond to the plurality of pixel openings 37 one by one.
- the light-emitting components 39 are respectively arranged in the corresponding pixel openings 37 and are located on the side of the first electrode layer 34 away from the glass substrate 10.
- the orthographic projections of the plurality of light-emitting components 39 on the glass substrate 10 are located within the orthographic projection range of the second lens area 23a on the glass substrate 10.
- the light-emitting components 39 can emit white light when powered.
- the color filter 31, the flat unit 45, the first electrode unit 47, the pixel defining unit 46 and the light emitting member 39 constitute a first member 41, and the first member 41 covers a portion of the end surface of the driving circuit layer 20 away from the glass substrate 10.
- the flat unit 45 has a concave second arc surface 27, the first electrode unit 47 fills in the groove structure formed by the second arc surface 27, and the light emitting member 39 covers the first electrode unit 47, so that the light emitting layer 38 and the first electrode layer 34 in the direction perpendicular to the glass substrate 10 corresponding to the second lens area 23a are both wavy, rather than parallel to the glass substrate 10.
- the circumferential end face of the first member 41 in the direction parallel to the glass substrate 10 is the fourth end face 58
- the end face of the filter 31 in the direction parallel to the glass substrate 10 is the third end face 53
- the end face of the flat unit 45 in the direction parallel to the glass substrate 10 is the second end face 52
- the end face of the pixel defining unit 46 in the direction parallel to the glass substrate 10 and away from the pixel opening 37 is the first end face 51
- the fourth end face 58 is composed of the first end face 51, the second end face 52 and the third end face 53 arranged in sequence in the direction perpendicular to the glass substrate 10.
- the first member 41, the driving circuit layer 20 and the glass substrate 10 constitute an intermediate blank.
- forming the second electrode layer 42 includes: depositing a layer of electrode film on an intermediate blank formed by the first member 41, the driving circuit layer 20 and the glass substrate 10 to form the second electrode layer 42.
- the second electrode layer 42 covers the surface of the outer surface of the first member 41 away from the driving circuit layer 20 and the fourth end face 58.
- the second electrode layer 42 also covers the portion of the end face of the driving circuit layer 20 away from the glass substrate 10 that is not covered by the first member 41.
- the second electrode layer 42 can be used as a cathode, and multiple light-emitting members 39 share one cathode.
- the second electrode layer 42 can be made of a metal with high reflectivity, so that the second electrode layer 42 can reflect the light irradiated thereon by the light-emitting member 39 toward the glass substrate 10.
- forming the encapsulation structure layer 40 may include: preparing an encapsulation film 43 on the light emitting structure layer 30, and installing a cover plate 44 on the side of the encapsulation film 43 away from the glass substrate 10.
- the encapsulation film 43 may be one or more layers of inorganic or organic thin films, and the encapsulation film 43 covers the end face of the light emitting structure layer 30 away from the glass substrate 10 through thin film encapsulation technology (Thin Film Encapsulation, referred to as TFE).
- TFE thin film encapsulation technology
- the encapsulation film 43 can prevent water and oxygen from entering the display substrate, providing the display substrate with good water and oxygen isolation properties.
- the cover plate 44 covers the side of the encapsulation film away from the glass substrate 10, and the cover plate 44 can provide protection for the display substrate.
- the present disclosure also provides a display device, which may include the aforementioned display substrate.
- the display device may be: a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any other product or component with a display function, but the embodiments of the present invention are not limited thereto.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
本公开涉及但不限于显示技术领域,尤指一种显示基板、制备方法和显示装置。The present disclosure relates to but is not limited to the field of display technology, and in particular to a display substrate, a preparation method and a display device.
有机发光二极管(Organic Light Emitting Diode,简称OLED)和量子点发光二极管(Quantum-dot Light Emitting Diodes,简称QLED)为主动发光显示器件,具有自发光、广视角、高对比度、低耗电、极高反应速度、轻薄、可弯曲和成本低等优点。目前,显示基板的发光效率都较低。Organic Light Emitting Diode (OLED) and Quantum-dot Light Emitting Diode (QLED) are active light-emitting display devices with the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, extremely high response speed, lightness, flexibility and low cost. At present, the luminous efficiency of display substrates is relatively low.
发明内容Summary of the invention
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
本公开实施例提供了一种显示基板,包括玻璃基底以及在背离所述玻璃基底的方向上设置的复合层和平坦层;The embodiment of the present disclosure provides a display substrate, comprising a glass substrate, and a composite layer and a flat layer arranged in a direction away from the glass substrate;
所述玻璃基底在靠近所述复合层的端面包括第一透镜区,所述复合层和/或所述平坦层在远离所述玻璃基底的端面包括第二透镜区;The glass substrate comprises a first lens area at an end surface close to the composite layer, and the composite layer and/or the flat layer comprises a second lens area at an end surface away from the glass substrate;
所述第二透镜区在所述玻璃基底上的正投影与所述第一透镜区在所述玻璃基底上的正投影至少部分重叠。An orthographic projection of the second lens area on the glass substrate at least partially overlaps with an orthographic projection of the first lens area on the glass substrate.
在一些示例性实施例中,所述第一透镜区内设有多个第一微透镜,所述第一微透镜设置为向所述玻璃基底远离所述复合层一侧凹陷的第一弧形面;In some exemplary embodiments, a plurality of first micro-lenses are disposed in the first lens area, and the first micro-lenses are arranged as first arc-shaped surfaces that are concave toward a side of the glass substrate away from the composite layer;
所述第二透镜区内设有多个第二微透镜,所述第二微透镜设置为向所述玻璃基底凹陷的第二弧形面。A plurality of second micro lenses are disposed in the second lens area, and the second micro lenses are arranged as second arc-shaped surfaces that are recessed toward the glass substrate.
在一些示例性实施例中,至少一个所述第一微透镜和所述第二微透镜的结构和尺寸一致。In some exemplary embodiments, at least one of the first microlens and the second microlens has the same structure and size.
在一些示例性实施例中,所述复合层的材质为无机有机混合树脂,所述无机有机混合树脂的折射率为1.5至1.9。In some exemplary embodiments, the composite layer is made of an inorganic-organic hybrid resin, and the refractive index of the inorganic-organic hybrid resin is 1.5 to 1.9.
在一些示例性实施例中,所述第一弧形面在平行于所述玻璃基底方向上的截面的直径设置为1微米至50微米;In some exemplary embodiments, the diameter of the cross section of the first curved surface in a direction parallel to the glass substrate is set to be 1 micron to 50 microns;
所述第一弧形面设置为在垂直于所述玻璃基底方向上的最大尺寸设置为0.5微米至25微米。The first curved surface is configured to have a maximum dimension in a direction perpendicular to the glass substrate of 0.5 micrometers to 25 micrometers.
在一些示例性实施例中,还包括滤光层,所述滤光层设置为覆盖所述平坦层靠近所述玻璃基底的端面,所述平坦层的折射率设置为大于所述滤光层的折射率;In some exemplary embodiments, a filter layer is further included, wherein the filter layer is configured to cover the end surface of the flat layer close to the glass substrate, and the refractive index of the flat layer is configured to be greater than the refractive index of the filter layer;
所述复合层的折射率设置为大于所述玻璃基底的折射率。The refractive index of the composite layer is set to be greater than the refractive index of the glass substrate.
在一些示例性实施例中,还包括第一电极层、像素定义层、发光层和第二电极层;In some exemplary embodiments, further comprising a first electrode layer, a pixel definition layer, a light emitting layer, and a second electrode layer;
第一电极层、所述发光层和所述第二电极层在远离所述玻璃基底方向上依次层叠设置,第一电极层位于所述平坦层远离所述玻璃基底的一侧,第一电极层设置为透光电极; The first electrode layer, the light-emitting layer and the second electrode layer are stacked in sequence in a direction away from the glass substrate, the first electrode layer is located on a side of the flat layer away from the glass substrate, and the first electrode layer is configured as a light-transmitting electrode;
所述像素定义层围成多个像素开口,所述发光层位于所述像素开口内像素定义层;The pixel definition layer surrounds a plurality of pixel openings, and the light emitting layer is located in the pixel definition layer within the pixel openings;
所述第二电极层设置成将透过所述像素定义层的光线反射向所述玻璃基底。The second electrode layer is configured to reflect light passing through the pixel definition layer toward the glass substrate.
在一些示例性实施例中,所述像素定义层在所述玻璃基底上的正投影至少与所述第一透镜区或/和所述第二透镜区在所述玻璃基底上的正投影交叠。In some exemplary embodiments, an orthographic projection of the pixel definition layer on the glass substrate at least overlaps with an orthographic projection of the first lens area or/and the second lens area on the glass substrate.
在一些示例性实施例中,所述第二电极层设置为围成多个槽口朝向所述玻璃基底的第一凹槽;In some exemplary embodiments, the second electrode layer is configured to enclose a plurality of first grooves facing the glass substrate;
所述像素定义层包括在平行于所述玻璃基底的方向上间隔布置的多个像素界定单元,多个所述像素界定单元均围成所述像素开口;The pixel definition layer includes a plurality of pixel definition units arranged at intervals in a direction parallel to the glass substrate, and the plurality of pixel definition units each surround the pixel opening;
所述发光层包括多个发光构件,所述发光构件与所述像素界定单元设置为一一对应布置且均位于所述第一凹槽内。The light-emitting layer includes a plurality of light-emitting components, and the light-emitting components and the pixel defining units are arranged in a one-to-one correspondence and are all located in the first groove.
在一些示例性实施例中,所述平坦层包括多个平坦单元,多个所述平坦单元设置为与多个所述像素界定单元一一对应且位于所述第一凹槽内,多个所述平坦单元在远离所述玻璃基底的一侧均设有所述第二透镜区。In some exemplary embodiments, the planar layer includes a plurality of planar units, the plurality of planar units are arranged to correspond one-to-one to the plurality of pixel defining units and are located in the first groove, and the plurality of planar units are provided with the second lens area on a side away from the glass substrate.
在一些示例性实施例中,还包括滤光层,所述滤光层位于所述平坦层靠近所述玻璃基底的一侧;In some exemplary embodiments, a filter layer is further included, and the filter layer is located on a side of the flat layer close to the glass substrate;
所述滤光层包括在平行于所述玻璃基底方向上间隔布置的多个滤光片,所述滤光片设置为与所述像素界定单元一一对应且位于所述第一凹槽内。The filter layer includes a plurality of filters arranged at intervals in a direction parallel to the glass substrate. The filters are arranged to correspond to the pixel defining units one by one and are located in the first groove.
在一些示例性实施例中,所述第一透镜区设有多个,所述滤光片与所述第一透镜区一一对应设置,所述第一透镜区在所述玻璃基底上的正投影位于所述滤光片在所述玻璃基底上的正投影内。In some exemplary embodiments, a plurality of first lens areas are provided, and the optical filters are arranged in one-to-one correspondence with the first lens areas, and the orthographic projection of the first lens area on the glass substrate is located within the orthographic projection of the optical filter on the glass substrate.
在一些示例性实施例中,还包括驱动电路层,所述驱动电路层位于所述玻璃基底和所述第一电极层之间;In some exemplary embodiments, a driving circuit layer is further included, wherein the driving circuit layer is located between the glass substrate and the first electrode layer;
所述第二电极层包括在平行于所述玻璃基底方向上交替布置的凹槽部和覆盖部,所述凹槽部设置为凹槽状,所述凹槽部围成所述第一凹槽,所述覆盖部覆盖在所述驱动电路层远离玻璃基底的表面上。The second electrode layer includes groove portions and covering portions alternately arranged in a direction parallel to the glass substrate, the groove portions are configured in a groove shape, the groove portions surround the first groove, and the covering portions cover the surface of the driving circuit layer away from the glass substrate.
在一些示例性实施例中,所述凹槽部包括槽侧壁和槽底壁,所述槽侧壁设置为在平行于所述玻璃基底方向上围成环形,所述槽底壁设置为封闭所述槽侧壁远离所述玻璃基底的一端;In some exemplary embodiments, the groove portion includes a groove side wall and a groove bottom wall, the groove side wall is arranged to form a ring in a direction parallel to the glass substrate, and the groove bottom wall is arranged to close an end of the groove side wall away from the glass substrate;
所述像素界定单元在平行于所述玻璃基底方向上的周向表面设置为第一端面;The circumferential surface of the pixel defining unit in a direction parallel to the glass substrate is set as a first end surface;
所述平坦单元在平行于所述玻璃基底方向上的周向表面设置为第二端面;The circumferential surface of the flat unit in a direction parallel to the glass substrate is set as a second end surface;
所述滤光片在平行于所述玻璃基底方向上的周向表面设置为第三端面;The circumferential surface of the filter in a direction parallel to the glass substrate is arranged as a third end surface;
所述第一端面、所述第二端面和所述第三端面设置为在垂直于所述玻璃基底方向上依次布置;The first end surface, the second end surface and the third end surface are arranged in sequence in a direction perpendicular to the glass substrate;
所述槽侧壁设置为覆盖所述第一端面、所述第二端面和所述第三端面;The groove sidewall is configured to cover the first end surface, the second end surface and the third end surface;
所述槽底壁设置为覆盖所述像素界定单元和所述发光构件远离所述玻璃基底的端面。The groove bottom wall is configured to cover the pixel defining unit and the end surface of the light emitting member away from the glass substrate.
在一些示例性实施例中,还包括驱动电路组件和遮光层,所述驱动电路组件位于所述平坦层和所述复合层之间;In some exemplary embodiments, a driving circuit component and a light shielding layer are further included, wherein the driving circuit component is located between the planar layer and the composite layer;
所述第一电极层包括多个第一电极单元,所述第一电极单元设置在所述第一凹槽内; The first electrode layer includes a plurality of first electrode units, and the first electrode units are arranged in the first groove;
所述驱动电路组件包括连接电极,所述第一电极单元通过过孔连接所述连接电极;The driving circuit assembly includes a connecting electrode, and the first electrode unit is connected to the connecting electrode through a via hole;
所述遮光层设置为高反射率金属膜,所述遮光层位于所述第一电极层和/或所述连接电极上且对应所述过孔设置,以遮挡由所述过孔直接照射向所述玻璃基底的光线。The light shielding layer is configured as a high reflectivity metal film, and the light shielding layer is located on the first electrode layer and/or the connecting electrode and is configured corresponding to the via hole to shield the light directly irradiated from the via hole to the glass substrate.
在一些示例性实施例中,所述遮光层设置为覆盖所述连接电极面向所述过孔的端面,所述遮光层在所述玻璃基底上的正投影设置为与所述过孔在所述玻璃基底上的正投影至少部分交叠。In some exemplary embodiments, the light shielding layer is configured to cover the end surface of the connecting electrode facing the via hole, and the orthographic projection of the light shielding layer on the glass substrate is configured to at least partially overlap with the orthographic projection of the via hole on the glass substrate.
在一些示例性实施例中,所述第一电极单元包括位于所述过孔内的过孔连接部,所述遮光层设置为覆盖所述过孔连接部远离所述玻璃基底的端面。In some exemplary embodiments, the first electrode unit includes a via-hole connecting portion located in the via-hole, and the light shielding layer is configured to cover an end surface of the via-hole connecting portion away from the glass substrate.
在一些示例性实施例中,所述过孔设置为贯穿所述平坦层和所述滤光层,所述第一电极单元设置为覆盖所述过孔的至少部分孔壁,所述像素定义层延伸至所述过孔内。In some exemplary embodiments, the via hole is configured to penetrate the planar layer and the filter layer, the first electrode unit is configured to cover at least a portion of a hole wall of the via hole, and the pixel definition layer extends into the via hole.
本公开实施例提供了一种制备方法,应用于上述的显示基板,包括:The present disclosure provides a preparation method, which is applied to the above-mentioned display substrate, comprising:
在玻璃基底形成多个第一微透镜,所述第一透镜区内设有多个第一微透镜,所述第一微透镜设置为向所述玻璃基底远离所述复合层的端面凹陷的第一弧形面;A plurality of first micro-lenses are formed on the glass substrate, wherein the first lens area is provided with a plurality of first micro-lenses, and the first micro-lenses are arranged to be first arc-shaped surfaces that are concave toward the end surface of the glass substrate away from the composite layer;
在复合层和/或平坦层形成多个第二微透镜,所述第二透镜区内设有多个第二微透镜,所述第二微透镜设置为向所述玻璃基底凹陷的第二弧形面。A plurality of second microlenses are formed on the composite layer and/or the flat layer, a plurality of second microlenses are arranged in the second lens area, and the second microlenses are arranged as second arc-shaped surfaces recessed toward the glass substrate.
本公开实施例提供了一种显示装置,包括上述的显示基板。An embodiment of the present disclosure provides a display device, including the above-mentioned display substrate.
在阅读并理解了附图和详细描述后,可以明白其他方面。Other aspects will be apparent upon reading and understanding the drawings and detailed description.
附图概述BRIEF DESCRIPTION OF THE DRAWINGS
附图用来提供对本公开技术方案的理解,并且构成说明书的一部分,与本公开的实施例一起用于解释本公开的技术方案,并不构成对本公开技术方案的限制。The accompanying drawings are used to provide an understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation on the technical solution of the present disclosure.
图1为一种显示装置的结构示意图;FIG1 is a schematic structural diagram of a display device;
图2为一种显示基板的平面结构示意图;FIG2 is a schematic diagram of a planar structure of a display substrate;
图3为一种显示基板的剖面结构示意图;FIG3 is a schematic diagram of a cross-sectional structure of a display substrate;
图4为本示例性实施例的一种显示基板示意图;FIG4 is a schematic diagram of a display substrate of the present exemplary embodiment;
图5为图4中的A-A向截面示意图;Fig. 5 is a schematic cross-sectional view along the line A-A in Fig. 4;
图6为图4中的B-B向截面示意图;Fig. 6 is a schematic cross-sectional view taken along line B-B in Fig. 4;
图7为图5中的玻璃基底的示意图;FIG7 is a schematic diagram of the glass substrate in FIG5 ;
图8为图7中的D处局部放大示意图;FIG8 is a partial enlarged schematic diagram of point D in FIG7;
图9为图5中的C处局部放大示意图;FIG9 is a partial enlarged schematic diagram of point C in FIG5;
图10为图6中的显示基板局部示意图;FIG10 is a partial schematic diagram of the display substrate in FIG6 ;
图11为本示例性实施例的又一种显示基板截面示意图;FIG11 is a schematic cross-sectional view of another display substrate of the present exemplary embodiment;
图12为本示例性实施例的另一种显示基板截面示意图;FIG12 is a schematic cross-sectional view of another display substrate of this exemplary embodiment;
图13为本示例性实施例的又一种显示基板截面示意图;FIG13 is a schematic cross-sectional view of another display substrate of the present exemplary embodiment;
图14为本示例性实施例的另一种显示基板截面示意图;FIG14 is a schematic cross-sectional view of another display substrate of this exemplary embodiment;
图15为图5中的显示基板的第一制备示意图; FIG15 is a schematic diagram of a first preparation method of the display substrate in FIG5 ;
图16为图5中的显示基板的第二制备示意图;FIG16 is a schematic diagram of a second preparation method of the display substrate in FIG5 ;
图17为图5中的显示基板的第三制备示意图;FIG17 is a third schematic diagram of manufacturing the display substrate in FIG5 ;
图18为图5中的显示基板的第四制备示意图;FIG18 is a fourth schematic diagram of manufacturing the display substrate in FIG5 ;
图19为图5中的显示基板的第五制备示意图;FIG19 is a fifth schematic diagram of manufacturing the display substrate in FIG5 ;
图20为图19中的E处局部放大示意图;FIG20 is a partial enlarged schematic diagram of point E in FIG19;
图21为图5中的显示基板的第六制备示意图;FIG21 is a sixth schematic diagram of manufacturing the display substrate in FIG5 ;
图22为图5中的显示基板的第七制备示意图;FIG22 is a seventh schematic diagram of manufacturing the display substrate in FIG5 ;
图23为图5中的显示基板的第八制备示意图;FIG23 is an eighth schematic diagram of manufacturing the display substrate in FIG5 ;
图24为图5中的显示基板的第九制备示意图。FIG. 24 is a ninth schematic diagram of manufacturing the display substrate in FIG. 5 .
附图标记说明:Description of reference numerals:
10-玻璃基底; 11-遮挡层; 12-第一金属层;10-glass substrate; 11-shielding layer; 12-first metal layer;
13-第一微透镜; 14-第一弧形面; 15-复合层;13-first microlens; 14-first arc-shaped surface; 15-composite layer;
16-第一缓冲层; 17-层间绝缘层; 18-驱动电路组件;16-first buffer layer; 17-interlayer insulating layer; 18-driving circuit component;
19-连接电极; 20-驱动电路层; 21-滤光层;19-connecting electrodes; 20-driving circuit layer; 21-filter layer;
22-第一通孔; 23-平坦层; 24-第二通孔;22-first through hole; 23-flat layer; 24-second through hole;
25-第三通孔; 26-第二微透镜; 27-第二弧形面;25-third through hole; 26-second microlens; 27-second arc surface;
28-滤光层图案; 29-平坦层图案; 30-发光结构层;28-filter layer pattern; 29-flat layer pattern; 30-light emitting structure layer;
31-滤光片; 32-过孔; 33-第一电极图案;31- filter; 32- via hole; 33- first electrode pattern;
34-第一电极层; 35-像素定义层图案; 36-像素定义层;34-first electrode layer; 35-pixel definition layer pattern; 36-pixel definition layer;
37-像素开口; 38-发光层; 39-发光构件;37-pixel opening; 38-light-emitting layer; 39-light-emitting component;
40-封装结构层; 41-第一构件; 42-第二电极层;40-encapsulation structure layer; 41-first component; 42-second electrode layer;
43-封装膜; 44-盖板; 45-平坦单元;43-encapsulation film; 44-cover plate; 45-flat unit;
46-像素界定单元; 47-第一电极单元; 48-第一凹槽;46-pixel defining unit; 47-first electrode unit; 48-first groove;
49-凹槽部; 50-覆盖部; 51-第一端面;49-groove portion; 50-covering portion; 51-first end surface;
52-第二端面; 53-第三端面; 54-遮光层;52- second end surface; 53- third end surface; 54- light shielding layer;
55-过孔连接部; 56-第一遮光部; 57-第二遮光部;55-via connecting portion; 56-first light shielding portion; 57-second light shielding portion;
58-第四端面; 59-槽侧壁; 60-槽底壁。58-the fourth end face; 59-the groove side wall; 60-the groove bottom wall.
详述Details
为使本公开的目的、技术方案和优点更加清楚明白,下文中将结合附图对本公开的实施例进行详细说明。注意,实施方式可以以多个不同形式来实施。所属技术领域的普通技术人员可以很容易地理解一个事实,就是方式和内容可以在不脱离本公开的宗旨及其范围的条件下被变换为各种各样的形式。因此,本公开不应该被解释为仅限定在下面的实施方式所记载的内容中。在不冲突的情况下,本公开中的实施例及实施例中的特征可以相互任意组合。In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail in conjunction with the accompanying drawings below. Note that the embodiments can be implemented in multiple different forms. A person of ordinary skill in the art can easily understand the fact that the methods and contents can be transformed into various forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.
本公开中的附图比例可以作为实际工艺中的参考,但不限于此。例如:沟道的宽长比、 各个膜层的厚度和间距、各个信号线的宽度和间距,可以根据实际需要进行调整。显示基板中像素的个数和每个像素中子像素的个数也不是限定为图中所示的数量,本公开中所描述的附图仅是结构示意图,本公开的一个方式不局限于附图所示的形状或数值等。The proportions of the drawings in this disclosure can be used as a reference in actual processes, but are not limited thereto. For example: the width-to-length ratio of the channel, The thickness and spacing of each film layer, the width and spacing of each signal line can be adjusted according to actual needs. The number of pixels in the display substrate and the number of sub-pixels in each pixel are not limited to the number shown in the figure. The drawings described in this disclosure are only structural schematic diagrams. One method of this disclosure is not limited to the shapes or values shown in the drawings.
本说明书中的“第一”、“第二”、“第三”等序数词是为了避免构成要素的混同而设置,而不是为了在数量方面上进行限定的。In the present specification, ordinal numbers such as “first”, “second” and “third” are provided to avoid confusion among constituent elements, and are not intended to limit the number.
在本说明书中,为了方便起见,使用“中部”、“上”、“下”、“前”、“后”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示方位或位置关系的词句以参照附图说明构成要素的位置关系,仅是为了便于描述本说明书和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本公开的限制。构成要素的位置关系根据描述各构成要素的方向适当地改变。因此,不局限于在说明书中说明的词句,根据情况可以适当地更换。In this specification, for the sake of convenience, the words and phrases indicating the orientation or positional relationship, such as "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., are used to illustrate the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing this specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which each constituent element is described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the situation.
在本说明书中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解。例如,可以是固定连接,或可拆卸连接,或一体地连接;可以是机械连接,或电连接;可以是直接相连,或通过中间件间接相连,或两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本公开中的具体含义。In this specification, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.
在本说明书中,晶体管是指至少包括栅电极、漏电极以及源电极这三个端子的元件。晶体管在漏电极(漏电极端子、漏区域或漏电极)与源电极(源电极端子、源区域或源电极)之间具有沟道区域,并且电流能够流过漏电极、沟道区域以及源电极。注意,在本说明书中,沟道区域是指电流主要流过的区域。In this specification, a transistor refers to an element including at least three terminals: a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to a region where current mainly flows.
在本说明书中,第一极可以为漏电极、第二极可以为源电极,或者第一极可以为源电极、第二极可以为漏电极。在使用极性相反的晶体管的情况或电路工作中的电流方向变化的情况等下,“源电极”及“漏电极”的功能有时互相调换。因此,在本说明书中,“源电极”和“漏电极”可以互相调换,“源端”和“漏端”可以互相调换。In this specification, the first electrode may be a drain electrode and the second electrode may be a source electrode, or the first electrode may be a source electrode and the second electrode may be a drain electrode. In the case of using transistors with opposite polarities or when the current direction changes during circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged. Therefore, in this specification, the "source electrode" and the "drain electrode" may be interchanged, and the "source terminal" and the "drain terminal" may be interchanged.
在本说明书中,“电连接”包括构成要素通过具有某种电作用的元件连接在一起的情况。“具有某种电作用的元件”只要可以进行连接的构成要素间的电信号的授受,就对其没有特别的限制。“具有某种电作用的元件”的例子不仅包括电极和布线,而且还包括晶体管等开关元件、电阻器、电感器、电容器、其它具有各种功能的元件等。In this specification, "electrical connection" includes the case where components are connected together through an element having some electrical function. There is no particular limitation on the "element having some electrical function" as long as it can transmit and receive electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.
在本说明书中,“平行”是指两条直线状成的角度为-10°以上且10°以下的状态,因此,也包括该角度为-5°以上且5°以下的状态。另外,“垂直”是指两条直线状成的角度为80°以上且100°以下的状态,因此,也包括85°以上且95°以下的角度的状态。In this specification, "parallel" means a state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore, also includes a state where the angle is greater than -5° and less than 5°. In addition, "perpendicular" means a state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore, also includes a state where the angle is greater than 85° and less than 95°.
在本说明书中,“膜”和“层”可以相互调换。例如,有时可以将“导电层”换成为“导电膜”。与此同样,有时可以将“绝缘膜”换成为“绝缘层”。In this specification, "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced by "conductive film". Similarly, "insulating film" may be replaced by "insulating layer".
本说明书中三角形、矩形、梯形、五边形或六边形等并非严格意义上的,可以是近似三角形、矩形、梯形、五边形或六边形等,可以存在公差导致的一些小变形,可以存在导角、弧边以及变形等。The triangles, rectangles, trapezoids, pentagons or hexagons in this specification are not in the strict sense, and may be approximate triangles, rectangles, trapezoids, pentagons or hexagons, etc. There may be some small deformations caused by tolerances, and there may be chamfers, arc edges and deformations.
本公开实施例中的“约”,是指不严格限定界限,允许工艺和测量误差范围内的数值。The term "about" in the embodiments of the present disclosure means that the limits are not strictly defined and a numerical value within the range of process and measurement errors is allowed.
图1为一种显示装置的结构示意图。如图1所示,显示装置可以包括时序控制器、数据驱动器、扫描驱动器、发光驱动器和像素阵列,时序控制器分别与数据驱动器、扫描驱动器和发光驱动器连接,数据驱动器分别与多个数据信号线(D1到Dn)连接,扫描驱动器分别与多个扫描信号线(S1到Sm)连接,发光驱动器分别与多个发光信号线(E1到Eo)连接。像素阵列可以包括多个子像素Pxij,i和j可以是自然数,至少一个子像素Pxij 可以包括电路单元和与电路单元连接的发光器件,电路单元可以包括像素驱动电路,像素驱动电路与扫描信号线、发光信号线和数据信号线连接。在示例性实施方式中,时序控制器可以将适合于数据驱动器的规格的灰度值和控制信号提供到数据驱动器,可以将适合于扫描驱动器的规格的时钟信号、扫描起始信号等提供到扫描驱动器,可以将适合于发光驱动器的规格的时钟信号、发射停止信号等提供到发光驱动器。数据驱动器可以利用从时序控制器接收的灰度值和控制信号来产生将提供到数据信号线D1、D2、D3、……和Dn的数据电压。例如,数据驱动器可以利用时钟信号对灰度值进行采样,并且以单元行为单位将与灰度值对应的数据电压施加到数据信号线D1至Dn,n可以是自然数。扫描驱动器可以通过从时序控制器接收时钟信号、扫描起始信号等来产生将提供到扫描信号线S1、S2、S3、……和Sm的扫描信号。例如,扫描驱动器可以将具有导通电平脉冲的扫描信号顺序地提供到扫描信号线S1至Sm。例如,扫描驱动器可以被构造为移位寄存器的形式,并且可以在时钟信号的控制下顺序地将以导通电平脉冲形式提供的扫描起始信号传输到下一级电路的方式产生扫描信号,m可以是自然数。发光驱动器可以通过从时序控制器接收时钟信号、发射停止信号等来产生将提供到发光信号线E1、E2、E3、……和Eo的发射信号。例如,发光驱动器可以将具有截止电平脉冲的发射信号顺序地提供到发光信号线E1至Eo。例如,发光驱动器可以被构造为移位寄存器的形式,并且可以以在时钟信号的控制下顺序地将以截止电平脉冲形式提供的发射停止信号传输到下一级电路的方式产生发射信号,o可以是自然数。在示例性实施方式中,像素阵列可以设置在显示基板上。FIG1 is a schematic diagram of the structure of a display device. As shown in FIG1 , the display device may include a timing controller, a data driver, a scan driver, a light emitting driver and a pixel array, wherein the timing controller is connected to the data driver, the scan driver and the light emitting driver respectively, the data driver is connected to a plurality of data signal lines (D1 to Dn) respectively, the scan driver is connected to a plurality of scan signal lines (S1 to Sm) respectively, and the light emitting driver is connected to a plurality of light emitting signal lines (E1 to Eo) respectively. The pixel array may include a plurality of sub-pixels Pxij, i and j may be natural numbers, and at least one sub-pixel Pxij may be a plurality of sub-pixels Pxij. A circuit unit and a light emitting device connected to the circuit unit may be included, and the circuit unit may include a pixel driving circuit, and the pixel driving circuit is connected to a scan signal line, a light emitting signal line, and a data signal line. In an exemplary embodiment, the timing controller may provide a grayscale value and a control signal suitable for the specification of the data driver to the data driver, a clock signal suitable for the specification of the scan driver, a scan start signal, etc. may be provided to the scan driver, and a clock signal suitable for the specification of the light emitting driver, an emission stop signal, etc. may be provided to the light emitting driver. The data driver may generate a data voltage to be provided to the data signal lines D1, D2, D3, ... and Dn using the grayscale value and the control signal received from the timing controller. For example, the data driver may sample the grayscale value using a clock signal, and apply a data voltage corresponding to the grayscale value to the data signal lines D1 to Dn in a unit line, and n may be a natural number. The scan driver may generate a scan signal to be provided to the scan signal lines S1, S2, S3, ... and Sm by receiving a clock signal, a scan start signal, etc. from the timing controller. For example, the scan driver may sequentially provide a scan signal having a conduction level pulse to the scan signal lines S1 to Sm. For example, the scan driver may be configured in the form of a shift register, and may sequentially transmit a scan start signal provided in the form of a conduction level pulse to the next level circuit under the control of a clock signal to generate a scan signal, and m may be a natural number. The light-emitting driver may generate an emission signal to be provided to the light-emitting signal lines E1, E2, E3, ... and Eo by receiving a clock signal, an emission stop signal, etc. from a timing controller. For example, the light-emitting driver may sequentially provide an emission signal having a cut-off level pulse to the light-emitting signal lines E1 to Eo. For example, the light-emitting driver may be configured in the form of a shift register, and may sequentially transmit an emission stop signal provided in the form of a cut-off level pulse to the next level circuit under the control of a clock signal to generate an emission signal, and o may be a natural number. In an exemplary embodiment, a pixel array may be provided on a display substrate.
图2为一种显示基板的平面结构示意图。如图2所示,显示基板可以包括以矩阵方式排布的多个像素单元P,至少一个像素单元P可以包括出射第一颜色光线的第一子像素P1、出射第二颜色光线的第二子像素P2和出射第三颜色光线的第三子像素P3。每个子像素可以均包括电路单元和发光器件,电路单元可以至少包括像素驱动电路,像素驱动电路分别与扫描信号线、发光信号线和数据信号线连接,像素驱动电路被配置为在扫描信号线和发光信号线的控制下,接收数据信号线传输的数据电压,向发光器件输出相应的电流。每个子像素中的发光器件分别与所在子像素的像素驱动电路连接,发光器件被配置为响应所在子像素的像素驱动电路输出的电流发出相应亮度的光。FIG2 is a schematic diagram of a planar structure of a display substrate. As shown in FIG2 , the display substrate may include a plurality of pixel units P arranged in a matrix, and at least one pixel unit P may include a first sub-pixel P1 emitting a first color light, a second sub-pixel P2 emitting a second color light, and a third sub-pixel P3 emitting a third color light. Each sub-pixel may include a circuit unit and a light-emitting device, and the circuit unit may include at least a pixel driving circuit, and the pixel driving circuit is respectively connected to a scanning signal line, a light-emitting signal line, and a data signal line, and the pixel driving circuit is configured to receive a data voltage transmitted by the data signal line under the control of the scanning signal line and the light-emitting signal line, and output a corresponding current to the light-emitting device. The light-emitting device in each sub-pixel is respectively connected to the pixel driving circuit of the sub-pixel in which it is located, and the light-emitting device is configured to emit light of corresponding brightness in response to the current output by the pixel driving circuit of the sub-pixel in which it is located.
在示例性实施方式中,第一子像素P1可以是出射红色光线的红色子像素(R),第二子像素P2可以是出射蓝色光线的蓝色子像素(B),第三子像素P3可以是出射绿色光线的绿色子像素(G)。在示例性实施方式中,子像素的形状可以是矩形状、菱形、五边形或六边形,三个子像素可以采用水平并列、竖直并列或品字等方式排列,本公开在此不做限定。In an exemplary embodiment, the first sub-pixel P1 may be a red sub-pixel (R) emitting red light, the second sub-pixel P2 may be a blue sub-pixel (B) emitting blue light, and the third sub-pixel P3 may be a green sub-pixel (G) emitting green light. In an exemplary embodiment, the shape of the sub-pixels may be rectangular, rhombus, pentagonal or hexagonal, and the three sub-pixels may be arranged in a horizontal parallel, vertical parallel or triangular manner, which is not limited in the present disclosure.
在示例性实施方式中,像素单元可以包括四个子像素,四个子像素可以采用水平并列、竖直并列或正方形等方式排列,本公开在此不做限定。In an exemplary embodiment, a pixel unit may include four sub-pixels, and the four sub-pixels may be arranged in a horizontal parallel arrangement, a vertical parallel arrangement, or a square arrangement, etc., which is not limited in the present disclosure.
图3为一种显示基板的剖面结构示意图,如图3所示,在垂直于显示基板的平面上,显示基板可以包括设置在玻璃基底10上的驱动电路层20、设置在驱动电路层20远离玻璃基底10一侧的发光结构层30以及设置在发光结构层30远离玻璃基底10一侧的封装结构层40。在一些可能的实现方式中,显示基板可以包括其它膜层,如触控结构层等,本公开在此不做限定。FIG3 is a schematic diagram of a cross-sectional structure of a display substrate. As shown in FIG3, on a plane perpendicular to the display substrate, the display substrate may include a driving circuit layer 20 disposed on a glass substrate 10, a light emitting structure layer 30 disposed on a side of the driving circuit layer 20 away from the glass substrate 10, and an encapsulation structure layer 40 disposed on a side of the light emitting structure layer 30 away from the glass substrate 10. In some possible implementations, the display substrate may include other film layers, such as a touch structure layer, etc., which is not limited in the present disclosure.
在示例性实施方式中,玻璃基底10可以是柔性基底,或者可以是刚性基底。驱动电路层20可以包括多个电路单元,每个电路单元可以至少包括由多个晶体管和存储电容构成的像素驱动电路。发光结构层30可以包括多个发光器件,每个发光器件可以至少包括阳极、像素定义层、有机发光层和阴极,阳极与像素驱动电路连接,有机发光层与阳极连接,阴极与有机发光层连接,有机发光层在阳极和阴极驱动下出射相应颜色的光线。封装 结构层40可以包括叠设的第一封装层、第二封装层和第三封装层,第一封装层和第三封装层可以采用无机材料,第二封装层可以采用有机材料,第二封装层设置在第一封装层和第三封装层之间,形成无机材料/有机材料/无机材料叠层结构,可以保证外界水汽无法进入发光结构层30,但不限于此,例如第一封装层、第二封装层和第三封装层均为无机材料或均为有机材料。In an exemplary embodiment, the glass substrate 10 may be a flexible substrate, or may be a rigid substrate. The driving circuit layer 20 may include a plurality of circuit units, each of which may include at least a pixel driving circuit composed of a plurality of transistors and a storage capacitor. The light-emitting structure layer 30 may include a plurality of light-emitting devices, each of which may include at least an anode, a pixel definition layer, an organic light-emitting layer and a cathode, the anode being connected to the pixel driving circuit, the organic light-emitting layer being connected to the anode, the cathode being connected to the organic light-emitting layer, and the organic light-emitting layer emitting light of corresponding colors under the drive of the anode and the cathode. Packaging The structural layer 40 may include a first encapsulation layer, a second encapsulation layer and a third encapsulation layer stacked together. The first encapsulation layer and the third encapsulation layer may be made of inorganic materials, and the second encapsulation layer may be made of organic materials. The second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer to form an inorganic material/organic material/inorganic material stacked structure, which can ensure that external water vapor cannot enter the light-emitting structure layer 30, but is not limited to this. For example, the first encapsulation layer, the second encapsulation layer and the third encapsulation layer are all inorganic materials or are all organic materials.
目前,在没有光效提升结构的OLED的显示装置中,发光器件发出的光只有20%能从画面的正面出光,这意味着有80%的光无法从玻璃基底远离发光器件的一侧端面射出而消失,造成发光效率低下。对于底发射发光器件而言,相关的OLED显示装置虽具有光效提升结构,使得更多的光从玻璃基底远离发光器件的一侧端面射出,虽然能提升一定的发光效率,但是提升效果并不理想。At present, in OLED display devices without a light-efficiency enhancement structure, only 20% of the light emitted by the light-emitting device can be emitted from the front of the screen, which means that 80% of the light cannot be emitted from the end face of the glass substrate away from the light-emitting device and disappears, resulting in low light-emitting efficiency. For bottom-emitting light-emitting devices, although the relevant OLED display devices have a light-efficiency enhancement structure, which allows more light to be emitted from the end face of the glass substrate away from the light-emitting device, although it can improve the light-emitting efficiency to a certain extent, the improvement effect is not ideal.
图4为本示例性实施例的一种显示基板示意图,图5为图4中的A-A向截面示意图,图,图6为图4中的B-B向截面示意图,本公开实施例提供了一种显示基板,如图4至图6所示,显示基板可包括玻璃基底10以及在背离玻璃基底10的方向上设置的复合层15和平坦层23,其中,玻璃基底10在靠近复合层15的端面可包括第一透镜区10c,复合层15和/或平坦层23在远离玻璃基底10的端面可包括第二透镜区23a。第二透镜区23a在玻璃基底10上的正投影设置为与第一透镜区10c至少部分重叠。由此,显示基板包括至少两层微透镜阵列(microlens array,简称MLA),使得更多的光线可射出显示基板,可提升显示基板亮度,提升发光效率,同时在达到预设光照强度的情况下可减小功耗。FIG4 is a schematic diagram of a display substrate of the exemplary embodiment, FIG5 is a schematic diagram of a cross section in the direction of A-A in FIG4, and FIG6 is a schematic diagram of a cross section in the direction of B-B in FIG4. The embodiment of the present disclosure provides a display substrate, as shown in FIG4 to FIG6, the display substrate may include a glass substrate 10 and a composite layer 15 and a flat layer 23 arranged in a direction away from the glass substrate 10, wherein the glass substrate 10 may include a first lens area 10c at an end face close to the composite layer 15, and the composite layer 15 and/or the flat layer 23 may include a second lens area 23a at an end face away from the glass substrate 10. The orthographic projection of the second lens area 23a on the glass substrate 10 is set to overlap at least partially with the first lens area 10c. Thus, the display substrate includes at least two layers of microlens arrays (MLA for short), so that more light can be emitted from the display substrate, the brightness of the display substrate can be improved, the luminous efficiency can be improved, and the power consumption can be reduced when the preset light intensity is reached.
图7为图5中的玻璃基底的示意图,图8为图7中的D处局部放大示意图,在一些示例性实施例中,如图7和图8所示,玻璃基底10的材质可为透光的玻璃,玻璃基底10的折射率可为小于1.55,本示例的显示基板可在具有玻璃基底10的一侧出光。玻璃基底10一侧的表面包括出光区10a和电路区10b,出光区10a可包括第一透镜区10c。第一透镜区10c内均匀布置有多个第一微透镜13,多个第一微透镜13呈阵列排布,形成微透镜阵列(简称MLA)。在示例性的实施方式中,第一透镜区10c内的多个第一微透镜13结构和尺寸一致。微透镜阵列可以将光线汇聚,从而提高亮度和可视角度,具有微型化,轻量化,阵列化等特点,同时也可以改善色彩表现。FIG. 7 is a schematic diagram of the glass substrate in FIG. 5 , and FIG. 8 is a partial enlarged schematic diagram of D in FIG. 7 . In some exemplary embodiments, as shown in FIG. 7 and FIG. 8 , the material of the glass substrate 10 may be translucent glass, and the refractive index of the glass substrate 10 may be less than 1.55. The display substrate of this example may emit light on the side having the glass substrate 10. The surface of one side of the glass substrate 10 includes a light emitting area 10a and a circuit area 10b, and the light emitting area 10a may include a first lens area 10c. A plurality of first microlenses 13 are uniformly arranged in the first lens area 10c, and the plurality of first microlenses 13 are arranged in an array to form a microlens array (MLA for short). In an exemplary embodiment, the plurality of first microlenses 13 in the first lens area 10c have the same structure and size. The microlens array can converge light, thereby improving brightness and viewing angle, and has the characteristics of miniaturization, light weight, arraying, etc., and can also improve color performance.
在一些示例性实施例中,如图5、图6、图7和图8所示,第一微透镜13可为位于玻璃基底10面向复合层15的表面上凹陷形成的第一弧形面14,第一弧形面14可向玻璃基底10远离复合层15的表面凹陷,形成弧形凹槽结构。第一弧形面14的高度可设置为第一弧形面14和玻璃基底10面向复合层15的表面之间的最大距离,即第一弧形面14在垂直于玻璃基底10方向上的最大尺寸H1,H1的数值可为0.5μm(微米)至25μm(微米)。在示例性的实施方式中,第一弧形面14在平行于玻璃基底10方向上的截面为圆形,第一弧形面14在平行于玻璃基底10方向上的截面的最大直径可为D1,D1的数值可为1μm(微米)至50μm(微米)。玻璃基底10具有多个且间隔布置的出光区10a,电路区10b可将多个出光区10a分隔开,多个出光区10a中的第一微透镜13的尺寸和排列均可一致。In some exemplary embodiments, as shown in FIG. 5 , FIG. 6 , FIG. 7 and FIG. 8 , the first microlens 13 may be a first curved surface 14 formed by being recessed on the surface of the glass substrate 10 facing the composite layer 15 , and the first curved surface 14 may be recessed toward the surface of the glass substrate 10 away from the composite layer 15 to form an arc-shaped groove structure. The height of the first curved surface 14 may be set to be the maximum distance between the first curved surface 14 and the surface of the glass substrate 10 facing the composite layer 15 , that is, the maximum dimension H1 of the first curved surface 14 in the direction perpendicular to the glass substrate 10 , and the value of H1 may be 0.5 μm (micrometer) to 25 μm (micrometer). In an exemplary embodiment, the cross section of the first curved surface 14 in the direction parallel to the glass substrate 10 is circular, and the maximum diameter of the cross section of the first curved surface 14 in the direction parallel to the glass substrate 10 may be D1, and the value of D1 may be 1 μm (micrometer) to 50 μm (micrometer). The glass substrate 10 has a plurality of light emitting areas 10 a arranged at intervals. The circuit area 10 b can separate the plurality of light emitting areas 10 a. The sizes and arrangements of the first micro lenses 13 in the plurality of light emitting areas 10 a can be consistent.
在一些示例性实施例中,如图5至图7所示,复合层15可覆盖在玻璃基底10上,复合层15的材料可为有机无机混合树脂,有机无机混合树脂为透光材料,为无机物和有机物的混合物,有机无机混合树脂中含有硅(Si)、氧(O)和氮(N),有机无机混合树脂具有良好的耐热性,可耐300℃至500℃的高温。复合层15为无机和有机混合材质,使得复合层15同时具有平坦层和缓冲层的功能。复合层15的折射率可为1.5至1.9,而且复合层15的折射率可通过调节有机无机混合树脂中氧(O)和氮(N)的含量比例来改变,同时,复合层15的折射率可大于玻璃基底10的折射率。复合层15远离玻璃基底10的 平面平行于玻璃基底10,复合层15靠近玻璃基底10的一侧表面突出部分填充了第一弧形面14凹陷形成的弧形凹槽。另外,玻璃基底10上还包括第一金属层12,第一金属层12对应电路区10b布置,电路区10b至少部分被第一金属层12覆盖,第一金属层12可以为铜(Cu),铝(Al),银(Ag),钛(Ti),钼(Mo)或低电阻金属配制的合金,第一金属层12的部分可为遮光板,可遮挡光线射出,第一金属层12的另一部分可为SD或VDD走线。出光区10a可设有多个,分隔多个出光区10a的电路区10b可布置第一金属层12。In some exemplary embodiments, as shown in FIGS. 5 to 7 , the composite layer 15 may be covered on the glass substrate 10. The material of the composite layer 15 may be an organic-inorganic hybrid resin. The organic-inorganic hybrid resin is a light-transmitting material, which is a mixture of inorganic and organic substances. The organic-inorganic hybrid resin contains silicon (Si), oxygen (O) and nitrogen (N). The organic-inorganic hybrid resin has good heat resistance and can withstand high temperatures of 300°C to 500°C. The composite layer 15 is a hybrid of inorganic and organic materials, so that the composite layer 15 has the functions of a flat layer and a buffer layer at the same time. The refractive index of the composite layer 15 may be 1.5 to 1.9, and the refractive index of the composite layer 15 may be changed by adjusting the content ratio of oxygen (O) and nitrogen (N) in the organic-inorganic hybrid resin. At the same time, the refractive index of the composite layer 15 may be greater than the refractive index of the glass substrate 10. The composite layer 15 is away from the glass substrate 10. The plane is parallel to the glass substrate 10, and the protruding part of the surface of the composite layer 15 close to the glass substrate 10 fills the arc groove formed by the depression of the first arc surface 14. In addition, the glass substrate 10 also includes a first metal layer 12, which is arranged corresponding to the circuit area 10b, and the circuit area 10b is at least partially covered by the first metal layer 12. The first metal layer 12 can be copper (Cu), aluminum (Al), silver (Ag), titanium (Ti), molybdenum (Mo) or an alloy prepared by a low-resistance metal. Part of the first metal layer 12 can be a light shielding plate to block the light from emitting, and another part of the first metal layer 12 can be a SD or VDD wiring. There can be multiple light emitting areas 10a, and the first metal layer 12 can be arranged in the circuit area 10b that separates the multiple light emitting areas 10a.
图9为图5中的C处局部放大示意图,在一些示例性实施例中,如图5和图10所示,显示基板还包括第一缓冲层(buffer)16、层间绝缘层(Inter-Layer Dielectric/passivating film,ILD/PVX)17和驱动电路组件18,第一金属层12、复合层15、第一缓冲层(buffer)16、层间绝缘层(ILD/PVX)17和驱动电路组件18可构成驱动电路层20,驱动电路层20覆盖在玻璃基底10上。复合层15、第一缓冲层(buffer)16、层间绝缘层(ILD/PVX)17在远离玻璃基底10的方向上依次层叠设置,驱动电路组件18位于玻璃基底10和层间绝缘层(ILD/PVX)17之间且通过过孔结构与连接第一金属层12电连接,层间绝缘层(ILD/PVX)17覆盖了驱动电路组件18。FIG9 is a partial enlarged schematic diagram of the C in FIG5 . In some exemplary embodiments, as shown in FIG5 and FIG10 , the display substrate further includes a first buffer layer 16, an interlayer dielectric/passivating film (ILD/PVX) 17 and a driving circuit component 18. The first metal layer 12, the composite layer 15, the first buffer layer 16, the interlayer dielectric/passivating film (ILD/PVX) 17 and the driving circuit component 18 may constitute a driving circuit layer 20, and the driving circuit layer 20 covers the glass substrate 10. The composite layer 15, the first buffer layer 16 and the interlayer dielectric (ILD/PVX) 17 are sequentially stacked in a direction away from the glass substrate 10. The driving circuit component 18 is located between the glass substrate 10 and the interlayer dielectric (ILD/PVX) 17 and is electrically connected to the first metal layer 12 through a via structure. The interlayer dielectric (ILD/PVX) 17 covers the driving circuit component 18.
图10为图6中的显示基板局部示意图,在一些示例性实施例中,如图5、图6和图10所示,显示基板还包括第一电极层34、像素定义层36、发光层38、第二电极层43和滤光层21,其中,第一电极层34、发光层38和第二电极层43可在远离玻璃基底10方向上依次层叠设置,第一电极层34可位于平坦层23远离玻璃基底10的一侧,第一电极层34可为透光电极。像素定义层36可围成多个像素开口37,发光层38位于像素开口37内,像素定义层36的材质设置为透光材料,第二电极层43可为高反射率电极,第二电极层43可将透过像素定义层36的光线反射向玻璃基底10。第一电极层34、像素定义层36、发光层38、第二电极层43、平坦层23和滤光层21可构成发光结构层30。FIG10 is a partial schematic diagram of the display substrate in FIG6. In some exemplary embodiments, as shown in FIG5, FIG6 and FIG10, the display substrate further includes a first electrode layer 34, a pixel definition layer 36, a light emitting layer 38, a second electrode layer 43 and a filter layer 21, wherein the first electrode layer 34, the light emitting layer 38 and the second electrode layer 43 may be stacked in sequence in a direction away from the glass substrate 10, the first electrode layer 34 may be located on the side of the planar layer 23 away from the glass substrate 10, and the first electrode layer 34 may be a light-transmitting electrode. The pixel definition layer 36 may enclose a plurality of pixel openings 37, the light emitting layer 38 is located in the pixel openings 37, the material of the pixel definition layer 36 is set to be a light-transmitting material, the second electrode layer 43 may be a high reflectivity electrode, and the second electrode layer 43 may reflect light passing through the pixel definition layer 36 toward the glass substrate 10. The first electrode layer 34, the pixel definition layer 36, the light emitting layer 38, the second electrode layer 43, the planar layer 23 and the filter layer 21 may constitute a light-emitting structure layer 30.
在一些示例性实施例中,如图5、图6和图10所示,第二电极层43设置为围成多个槽口朝向玻璃基底10的第一凹槽48,第二电极层43在平行于玻璃基底10的方向上包括交替布置的多个凹槽部49和多个覆盖部50,其中,凹槽部49可为凹槽状,覆盖部50覆盖在驱动电路层20远离玻璃基底10的表面上。凹槽部49包括槽侧壁59和槽底壁60,槽侧壁59可设置为在平行于玻璃基底10方向上围成环形,槽底壁60平行于玻璃基底10且可封闭槽侧壁59远离玻璃基底10的一端。第二电极层43可为高反射率电极,第二电极层43可作为阴极。In some exemplary embodiments, as shown in FIG. 5, FIG. 6 and FIG. 10, the second electrode layer 43 is configured to enclose a plurality of first grooves 48 with notches facing the glass substrate 10, and the second electrode layer 43 includes a plurality of groove portions 49 and a plurality of covering portions 50 arranged alternately in a direction parallel to the glass substrate 10, wherein the groove portion 49 may be groove-shaped, and the covering portion 50 covers the surface of the driving circuit layer 20 away from the glass substrate 10. The groove portion 49 includes a groove side wall 59 and a groove bottom wall 60, and the groove side wall 59 may be configured to enclose a ring in a direction parallel to the glass substrate 10, and the groove bottom wall 60 is parallel to the glass substrate 10 and may close an end of the groove side wall 59 away from the glass substrate 10. The second electrode layer 43 may be a high reflectivity electrode, and the second electrode layer 43 may serve as a cathode.
在一些示例性实施例中,如图5、图6和图10所示,像素定义层36包括在平行于玻璃基底的方向上间隔布置的多个像素界定单元46,多个像素界定单元46均围成像素开口37,使得像素定义层36具有独立的多个像素界定单元46,在示例性的实施方式中,像素界定单元46的个数和像素开口37一致。发光层38包括多个发光构件39,发光构件39与像素界定单元46可一一对应布置,即每个发光构件39布置在对应的像素界定单元46的像素开口37内,同时,每个发光构件39与对应像素界定单元46构成的整体处于第一凹槽48内,使得发光构件39和第一凹槽48一一对应布置。发光构件39可在供电条件下发射白色光线。由此,第二电极层43围成的第一凹槽48为发光构件39与像素界定单元46提供了安装空间,而且使得相邻的发光构件39分隔开,也使得相邻的像素界定单元46也分隔开,发光构件39发出的光线只能由第一凹槽48的槽口照射向玻璃基底10,多个发光构件39共用一个阴极。In some exemplary embodiments, as shown in FIG. 5 , FIG. 6 and FIG. 10 , the pixel definition layer 36 includes a plurality of pixel defining units 46 arranged at intervals in a direction parallel to the glass substrate, and the plurality of pixel defining units 46 each surround a pixel opening 37, so that the pixel definition layer 36 has a plurality of independent pixel defining units 46. In an exemplary embodiment, the number of the pixel defining units 46 is consistent with the pixel opening 37. The light-emitting layer 38 includes a plurality of light-emitting components 39, and the light-emitting components 39 and the pixel defining units 46 can be arranged in a one-to-one correspondence, that is, each light-emitting component 39 is arranged in the pixel opening 37 of the corresponding pixel defining unit 46, and at the same time, each light-emitting component 39 and the corresponding pixel defining unit 46 are integrally located in the first groove 48, so that the light-emitting components 39 and the first groove 48 are arranged in a one-to-one correspondence. The light-emitting components 39 can emit white light under power supply conditions. Thus, the first groove 48 surrounded by the second electrode layer 43 provides installation space for the light-emitting component 39 and the pixel defining unit 46, and separates adjacent light-emitting components 39 and adjacent pixel defining units 46. The light emitted by the light-emitting component 39 can only be irradiated toward the glass substrate 10 through the notch of the first groove 48, and multiple light-emitting components 39 share one cathode.
在一些示例性实施例中,如图5、图6和图10所示,第一电极层34包括在平行于玻璃基底10方向上间隔布置的多个第一电极单元47,平坦层23包括在平行于玻璃基底10方向上间隔布置的多个平坦单元45,滤光层21包括在平行于玻璃基底10方向上间隔布 置的多个滤光片31,第一电极单元47、平坦单元45、滤光片31都可与第一凹槽48一一对应且处于第一凹槽48内,滤光片31、平坦单元45、第一电极单元47在远离玻璃基底10的方向上依次层叠布置。由此,第二电极层43围成的第一凹槽48也为第一电极单元47、平坦单元45、滤光片31提供了安装空间,而且使得相邻的第一电极单元47分隔开,也使得相邻的平坦单元45分隔开,也使得相邻的滤光片31分隔开,发光构件39发出的光线透过平坦单元45且通过滤光片31的滤光后由第一凹槽48的槽口照射向玻璃基底10。In some exemplary embodiments, as shown in FIGS. 5, 6 and 10, the first electrode layer 34 includes a plurality of first electrode units 47 arranged at intervals in a direction parallel to the glass substrate 10, the flat layer 23 includes a plurality of flat units 45 arranged at intervals in a direction parallel to the glass substrate 10, and the filter layer 21 includes a plurality of flat units 45 arranged at intervals in a direction parallel to the glass substrate 10. The first electrode unit 47, the flat unit 45, and the filter 31 can all correspond to the first groove 48 one by one and be located in the first groove 48. The filter 31, the flat unit 45, and the first electrode unit 47 are sequentially stacked in a direction away from the glass substrate 10. Therefore, the first groove 48 surrounded by the second electrode layer 43 also provides installation space for the first electrode unit 47, the flat unit 45, and the filter 31, and separates the adjacent first electrode units 47, the adjacent flat units 45, and the adjacent filter 31. The light emitted by the light-emitting component 39 passes through the flat unit 45 and is filtered by the filter 31, and then irradiated toward the glass substrate 10 from the notch of the first groove 48.
在一些示例性实施例中,如图5、图6和图10所示,滤光层21可过滤光线,将白光过滤为预设颜色的光线,滤光层21可包括红色滤光片、绿色滤光片或蓝色滤光片,即多个滤光片31可为红色滤光片、绿色滤光片或蓝色滤光片。在一些示例性实施例中,不同滤光片31对应的出光区10a中的第一微透镜13的尺寸和排列不同,使得不同颜色的子像素之间进行差异化设置,满足不同颜色子像素光取出强度的需求。例如,每个发光构件39都发白光,多个滤光片31可分为三种,第一种滤光片31可将白光过滤为红光,第二种滤光片31可将白光过滤为绿光,第三种滤光片31可将白光过滤为蓝光,三种滤光片31对应的第一微透镜13的尺寸和排列不同,使得红光、绿光和蓝光的强度不同,满足不同颜色子像素光取出强度的需求。像素开口37在玻璃基底10上的正投影可位于滤光层21在玻璃基底10上的正投影内,驱动电路层20远离玻璃基底10的另一部分端面被第二电极层43的覆盖部50覆盖。平坦层23的折射率设置为大于滤光层21的折射率。第一电极单元47可为透光电极材料,第一电极单元4可作为阳极,每个发光构件31使用各自对应的第一电极单元4作为阳极,但是都使用第二电极层作为阴极,形成共用阴极,平坦单元45可设置为透光材料,由此,发光构件39发出的白色光线穿透第一电极单元47和平坦单元45后,经过滤光片31过滤为预设颜色的光线,再穿透驱动电路层20和玻璃基底10,射出显示基板。In some exemplary embodiments, as shown in FIG. 5 , FIG. 6 and FIG. 10 , the filter layer 21 can filter light and filter white light into light of a preset color. The filter layer 21 can include a red filter, a green filter or a blue filter, that is, the plurality of filters 31 can be red filters, green filters or blue filters. In some exemplary embodiments, the sizes and arrangements of the first microlenses 13 in the light exit area 10a corresponding to different filters 31 are different, so that sub-pixels of different colors are differentiated to meet the requirements of light extraction intensity of sub-pixels of different colors. For example, each light-emitting component 39 emits white light, and the plurality of filters 31 can be divided into three types. The first filter 31 can filter white light into red light, the second filter 31 can filter white light into green light, and the third filter 31 can filter white light into blue light. The sizes and arrangements of the first microlenses 13 corresponding to the three filters 31 are different, so that the intensities of red light, green light and blue light are different, meeting the requirements of light extraction intensity of sub-pixels of different colors. The orthographic projection of the pixel opening 37 on the glass substrate 10 may be located within the orthographic projection of the filter layer 21 on the glass substrate 10, and another portion of the end surface of the driving circuit layer 20 away from the glass substrate 10 is covered by the covering portion 50 of the second electrode layer 43. The refractive index of the flat layer 23 is set to be greater than the refractive index of the filter layer 21. The first electrode unit 47 may be a light-transmitting electrode material, the first electrode unit 4 may be used as an anode, each light-emitting component 31 uses the first electrode unit 4 corresponding to each other as an anode, but uses the second electrode layer as a cathode to form a common cathode, and the flat unit 45 may be set to a light-transmitting material, thereby, the white light emitted by the light-emitting component 39 passes through the first electrode unit 47 and the flat unit 45, is filtered into a preset color by the filter 31, and then passes through the driving circuit layer 20 and the glass substrate 10, and is emitted from the display substrate.
在一些示例性实施例中,如图5、图6和图10所示,平坦层23远离玻璃基底10的表面可包括第二透镜区23a,第二透镜区23a在玻璃基底10上的正投影位于第一透镜区10c内,平坦层23可具有多个第二透镜区23a,每个平坦单元45都具有一个第二透镜区23a,第二透镜区23a和第一透镜区10c一一对应。第二透镜区23a内均匀布置有多个第二微透镜26,多个第二微透镜26呈阵列排布,形成微透镜阵列。第二微透镜26可为位于平坦层23远离玻璃基底10的表面上凹陷的第二弧形面27,第二弧形面27可向平坦层23远离发光结构层30的表面凹陷,形成弧形凹槽结构。第二弧形面27和第一弧形面14的结构、尺寸和排列方式都一致,但不限于此,例如第二弧形面27和第一弧形面14在结构、尺寸和排列方式中的至少一项不一致。像素定义层36在玻璃基底10上的正投影至少与第一透镜区10c或/和第二透镜区23a在玻璃基底10上的正投影交叠,第一透镜区10c和第二透镜区23a在玻璃基底10上的正投影均位于滤光层21在玻璃基底10上的正投影内。In some exemplary embodiments, as shown in FIG. 5 , FIG. 6 and FIG. 10 , the surface of the flat layer 23 away from the glass substrate 10 may include a second lens area 23a, and the orthographic projection of the second lens area 23a on the glass substrate 10 is located in the first lens area 10c. The flat layer 23 may have a plurality of second lens areas 23a, and each flat unit 45 has a second lens area 23a, and the second lens area 23a corresponds to the first lens area 10c one by one. A plurality of second microlenses 26 are evenly arranged in the second lens area 23a, and the plurality of second microlenses 26 are arranged in an array to form a microlens array. The second microlens 26 may be a second arc surface 27 that is recessed on the surface of the flat layer 23 away from the glass substrate 10, and the second arc surface 27 may be recessed toward the surface of the flat layer 23 away from the light emitting structure layer 30 to form an arc groove structure. The second arc surface 27 and the first arc surface 14 are consistent in structure, size and arrangement, but are not limited thereto. For example, the second arc surface 27 and the first arc surface 14 are inconsistent in at least one of the structure, size and arrangement. The orthographic projection of the pixel definition layer 36 on the glass substrate 10 at least overlaps with the orthographic projection of the first lens area 10 c and/or the second lens area 23 a on the glass substrate 10 , and the orthographic projections of the first lens area 10 c and the second lens area 23 a on the glass substrate 10 are both located within the orthographic projection of the filter layer 21 on the glass substrate 10 .
在一些示例性实施例中,平坦层23远离玻璃基底10的表面可包括第二透镜区23a,玻璃基底10在靠近复合层15的端面可包括多个第一透镜区10c,第二透镜区23a和第一透镜区10c一一对应,第二透镜区23a的第二弧形面27和第一透镜区10c的第一弧形面14尺寸不一致,第一弧形面14在垂直于玻璃基底10方向上的尺寸大于第二弧形面27在垂直于玻璃基底10方向上的尺寸,而且单个第一弧形面14在玻璃基底10上的正投影面积大于单个第二弧形面27在玻璃基底10上的正投影面积。In some exemplary embodiments, the surface of the flat layer 23 away from the glass substrate 10 may include a second lens area 23a, and the end surface of the glass substrate 10 close to the composite layer 15 may include a plurality of first lens areas 10c, the second lens areas 23a correspond to the first lens areas 10c one by one, the second curved surface 27 of the second lens area 23a and the first curved surface 14 of the first lens area 10c are inconsistent in size, the size of the first curved surface 14 in the direction perpendicular to the glass substrate 10 is larger than the size of the second curved surface 27 in the direction perpendicular to the glass substrate 10, and the orthographic projection area of a single first curved surface 14 on the glass substrate 10 is larger than the orthographic projection area of a single second curved surface 27 on the glass substrate 10.
在一些示例性实施例中,如图5、图6和图10所示,像素界定单元46的周向端面为第一端面51,第一端面51为像素界定单元46在平行于玻璃基底10方向上的外表面,即 每个第一端面51为像素界定单元46面向相邻的像素界定单元46的端面。平坦单元45的周向端面为第二端面52,第二端面52为平坦单元45在平行于玻璃基底10方向上的外表面,即第二端面52为每个平坦单元45面向相邻的平坦单元45的端面。滤光片31的周向端面为第三端面53,第三端面53为滤光片31在平行于玻璃基底10方向上的外表面,即第三端面53为每个滤光片31面向相邻的滤光片31的端面。发光构件39、像素界定单元46、第一电极单元47、平坦单元45、滤光片31都可与第一凹槽48一一对应且处于第一凹槽48内,使得第二电极层43中凹槽部49的槽侧壁59覆盖第一端面51、第二端面52和第三端面53,可防止混色,即防止经过相邻滤光片31过滤的光线交叉混合。由此,第二电极层43形成覆盖一端面51、第二端面52和第三端面53的反射结构,反射结构可以反射子像素发射的大角度光线,使光得到汇聚,提高光取出效率。In some exemplary embodiments, as shown in FIG. 5, FIG. 6 and FIG. 10, the circumferential end surface of the pixel defining unit 46 is a first end surface 51, and the first end surface 51 is an outer surface of the pixel defining unit 46 in a direction parallel to the glass substrate 10, that is, Each first end face 51 is an end face of the pixel defining unit 46 facing the adjacent pixel defining unit 46. The circumferential end face of the flat unit 45 is a second end face 52, which is the outer surface of the flat unit 45 in a direction parallel to the glass substrate 10, that is, the second end face 52 is the end face of each flat unit 45 facing the adjacent flat unit 45. The circumferential end face of the filter 31 is a third end face 53, which is the outer surface of the filter 31 in a direction parallel to the glass substrate 10, that is, the third end face 53 is the end face of each filter 31 facing the adjacent filter 31. The light emitting member 39, the pixel defining unit 46, the first electrode unit 47, the flat unit 45, and the filter 31 can all correspond to the first groove 48 one by one and be located in the first groove 48, so that the groove sidewall 59 of the groove portion 49 in the second electrode layer 43 covers the first end face 51, the second end face 52, and the third end face 53, which can prevent color mixing, that is, prevent the cross-mixing of light filtered by adjacent filters 31. Thus, the second electrode layer 43 forms a reflective structure covering the first end face 51, the second end face 52, and the third end face 53, and the reflective structure can reflect the large-angle light emitted by the sub-pixel, so that the light is converged and the light extraction efficiency is improved.
在一些示例性实施例中,如图9所示,驱动电路组件18包括连接电极19,第一电极层34的第一电极单元47通过过孔32电连接到连接电极19。连接电极19可为对应过孔32设有不透光的遮光层54,以遮挡由过孔32直接照射向玻璃基底10的光线,避免由过孔32直接照射向玻璃基底10的白光和经过滤光片31而带有其他颜色的光线混合。遮光层54可为高反射率金属膜,遮光层54可为覆盖连接电极19面向过孔32的端面。过孔32沿垂直于玻璃基底10的方向延伸,过孔32贯穿平坦层23和滤光层21,且延伸到连接电极19,像素定义层36覆盖了过孔32。In some exemplary embodiments, as shown in FIG. 9 , the driving circuit assembly 18 includes a connecting electrode 19, and the first electrode unit 47 of the first electrode layer 34 is electrically connected to the connecting electrode 19 through the via hole 32. The connecting electrode 19 may be provided with an opaque light shielding layer 54 corresponding to the via hole 32 to shield the light directly irradiated from the via hole 32 to the glass substrate 10, and to prevent the white light directly irradiated from the via hole 32 to the glass substrate 10 from mixing with the light with other colors through the filter 31. The light shielding layer 54 may be a high reflectivity metal film, and the light shielding layer 54 may cover the end surface of the connecting electrode 19 facing the via hole 32. The via hole 32 extends in a direction perpendicular to the glass substrate 10, and the via hole 32 passes through the flat layer 23 and the filter layer 21, and extends to the connecting electrode 19, and the pixel definition layer 36 covers the via hole 32.
在一些示例性实施例中,如图5和图6所示,显示基板还包括封装结构层40,封装结构层40包括封装膜43和盖板44,在封装膜43远离玻璃基底10的一侧安装盖板44。封装膜43可为一层或多层无机或有机薄膜,封装膜43覆盖发光结构层30远离玻璃基底10的端面。封装膜43可阻止水和氧气进入显示基板内,为显示基板提供了良好的水氧隔绝特性。盖板44则覆盖在封装膜43远离玻璃基底10的一侧,盖板可为显示基板提供保护。In some exemplary embodiments, as shown in FIG. 5 and FIG. 6 , the display substrate further includes an encapsulation structure layer 40, which includes an encapsulation film 43 and a cover plate 44, and the cover plate 44 is installed on the side of the encapsulation film 43 away from the glass substrate 10. The encapsulation film 43 may be one or more layers of inorganic or organic thin films, and the encapsulation film 43 covers the end face of the light-emitting structure layer 30 away from the glass substrate 10. The encapsulation film 43 can prevent water and oxygen from entering the display substrate, and provides good water and oxygen isolation properties for the display substrate. The cover plate 44 covers the side of the encapsulation film 43 away from the glass substrate 10, and the cover plate can provide protection for the display substrate.
在一些示例性实施例中,本示例的显示基板可为底部出光,玻璃基底10处于显示基板的底部,发光构件39在供电条件下,发光构件39直接照向玻璃基底10光线可通过滤光片31的滤光后由第一凹槽48的槽口照射向玻璃基底10。发光构件39照射向像素界定单元36的光线,透过像素界定单元36后会被第二电极层反射向玻璃基底10一侧,使得发光结构层20射出的光线更多,从而能够提升亮度,提升发光效率,在达到预设亮度的情况下可降低功耗。In some exemplary embodiments, the display substrate of this example may be bottom-emitting, the glass substrate 10 is at the bottom of the display substrate, and the light-emitting component 39 directly irradiates the glass substrate 10 under power supply conditions. The light can be filtered by the filter 31 and then irradiated to the glass substrate 10 through the notch of the first groove 48. The light irradiated by the light-emitting component 39 to the pixel defining unit 36 will be reflected by the second electrode layer to the side of the glass substrate 10 after passing through the pixel defining unit 36, so that more light is emitted from the light-emitting structure layer 20, thereby improving the brightness and luminous efficiency, and reducing power consumption when the preset brightness is reached.
图11为本示例性实施例的又一种显示基板截面示意图,在一些示例性实施例中,如图11所示,驱动电路组件18包括连接电极19,第一电极层34的第一电极单元47通过过孔32电连接到连接电极19。第一电极层34可对应过孔32设有不透光的遮光层54,以遮挡由过孔32直接照射向玻璃基底10的光线,避免由过孔32直接照射向玻璃基底10的白光和经过滤光片31而带有其他颜色的光线混合。遮光层54可为高反射率金属膜,第一电极单元47包括位于过孔32内的过孔连接部55,过孔连接部55覆盖过孔32的孔壁,遮光层54覆盖过孔32,本示例的遮光层54可覆盖过孔连接部55远离连接电极19的端面。FIG. 11 is another cross-sectional schematic diagram of a display substrate of the present exemplary embodiment. In some exemplary embodiments, as shown in FIG. 11 , the driving circuit assembly 18 includes a connecting electrode 19, and the first electrode unit 47 of the first electrode layer 34 is electrically connected to the connecting electrode 19 through the via hole 32. The first electrode layer 34 may be provided with an opaque light shielding layer 54 corresponding to the via hole 32 to shield the light directly irradiated from the via hole 32 to the glass substrate 10, and to prevent the white light directly irradiated from the via hole 32 to the glass substrate 10 from mixing with the light with other colors through the filter 31. The light shielding layer 54 may be a high reflectivity metal film, the first electrode unit 47 includes a via hole connecting portion 55 located in the via hole 32, the via hole connecting portion 55 covers the hole wall of the via hole 32, and the light shielding layer 54 covers the via hole 32. The light shielding layer 54 of this example may cover the end surface of the via hole connecting portion 55 away from the connecting electrode 19.
图12为本示例性实施例的另一种显示基板截面示意图,在一些示例性实施例中,如图12所示,驱动电路组件18包括连接电极19,第一电极层34的第一电极单元47通过过孔32电连接到连接电极19。第一电极层34和连接电极19可为对应过孔32设有不透光的遮光层54,以遮挡由过孔32直接照射向玻璃基底10的光线,避免由过孔32直接照射向玻璃基底10的白光和经过滤光片31而带有其他颜色的光线混合。遮光层54可为高反射率金属膜,遮光层54包括第一遮光部56和第二遮光部57,第一电极单元47包括位 于过孔32内的过孔连接部55,过孔连接部55覆盖过孔32的孔壁,第一遮光部56可覆盖过孔连接部55远离连接电极19的端面,第二遮光部57可为覆盖连接电极19面向过孔32的端面。FIG. 12 is another cross-sectional schematic diagram of a display substrate of the present exemplary embodiment. In some exemplary embodiments, as shown in FIG. 12 , the driving circuit assembly 18 includes a connecting electrode 19, and the first electrode unit 47 of the first electrode layer 34 is electrically connected to the connecting electrode 19 through the via hole 32. The first electrode layer 34 and the connecting electrode 19 may be provided with an opaque light shielding layer 54 corresponding to the via hole 32 to shield the light directly irradiated from the via hole 32 to the glass substrate 10, and to prevent the white light directly irradiated from the via hole 32 to the glass substrate 10 from mixing with the light with other colors through the filter 31. The light shielding layer 54 may be a high-reflectivity metal film, and the light shielding layer 54 includes a first light shielding portion 56 and a second light shielding portion 57. The first electrode unit 47 includes a position The via connecting portion 55 in the via hole 32 covers the hole wall of the via hole 32 , the first shading portion 56 can cover the end surface of the via connecting portion 55 away from the connecting electrode 19 , and the second shading portion 57 can cover the end surface of the connecting electrode 19 facing the via hole 32 .
图13为本示例性实施例的又一种显示基板截面示意图,在一些示例性实施例中,如图13所示,显示基板可包括玻璃基底10以及在背离玻璃基底10的方向上层叠设置的复合层15和平坦层23,其中,玻璃基底10在靠近复合层15的端面可包括第一透镜区10c,布置有多个第一微透镜13,多个第一微透镜13呈阵列排布,形成微透镜阵列;平坦层23上未设有微透镜阵列,复合层15在远离玻璃基底10的端面可包括第二透镜区23a,第二透镜区23a布置有多个第二微透镜26,多个第二微透镜26呈阵列排布,形成微透镜阵列。第二透镜区23a在玻璃基底10上的正投影设置为与第一透镜区10c至少部分重叠。由此,显示基板具有两层微透镜阵列,使得更多的光线可射出显示基板,可提升显示基板亮度,提升发光效率,同时在达到预设光照强度的情况下可减小功耗。FIG13 is a schematic cross-sectional view of another display substrate of the present exemplary embodiment. In some exemplary embodiments, as shown in FIG13 , the display substrate may include a glass substrate 10 and a composite layer 15 and a flat layer 23 stacked in a direction away from the glass substrate 10, wherein the glass substrate 10 may include a first lens area 10c at the end face close to the composite layer 15, and a plurality of first microlenses 13 are arranged in an array to form a microlens array; the flat layer 23 is not provided with a microlens array, and the composite layer 15 may include a second lens area 23a at the end face away from the glass substrate 10, and a plurality of second microlenses 26 are arranged in an array to form a microlens array. The orthographic projection of the second lens area 23a on the glass substrate 10 is set to overlap at least partially with the first lens area 10c. Thus, the display substrate has two layers of microlens arrays, so that more light can be emitted from the display substrate, the brightness of the display substrate can be improved, the luminous efficiency can be improved, and the power consumption can be reduced when the preset light intensity is reached.
图14为本示例性实施例的另一种显示基板截面示意图,在一些示例性实施例中,如图14所示,显示基板可包括玻璃基底10,其中,玻璃基底10在靠近复合层15的端面可包括第一透镜区10c,布置有多个第一微透镜13,多个第一微透镜13呈阵列排布,形成微透镜阵列,由此,显示基板具有一层微透镜阵列。第二电极层43围成的第一凹槽48也为发光构件31、第一电极单元47、平坦单元45、滤光片31提供了安装空间,而且使得相邻的发光构件31、相邻的第一电极单元47、相邻的平坦单元45、相邻的滤光片31都各自分隔开,发光构件39发出的光线通过滤光片31的滤光后由第一凹槽48的槽口照射向玻璃基底10,而且第二电极层43形成反射结构,反射结构可以反射子像素发射的大角度光线,使光得到汇聚,提高光取出效率。FIG14 is another cross-sectional schematic diagram of a display substrate of the present exemplary embodiment. In some exemplary embodiments, as shown in FIG14 , the display substrate may include a glass substrate 10, wherein the glass substrate 10 may include a first lens area 10c at the end surface close to the composite layer 15, and a plurality of first microlenses 13 are arranged, and the plurality of first microlenses 13 are arranged in an array to form a microlens array, thereby the display substrate has a layer of microlens array. The first groove 48 surrounded by the second electrode layer 43 also provides installation space for the light emitting component 31, the first electrode unit 47, the flat unit 45, and the filter 31, and the adjacent light emitting components 31, the adjacent first electrode unit 47, the adjacent flat unit 45, and the adjacent filter 31 are separated from each other. The light emitted by the light emitting component 39 is filtered by the filter 31 and then irradiated to the glass substrate 10 from the notch of the first groove 48, and the second electrode layer 43 forms a reflective structure, which can reflect the large-angle light emitted by the sub-pixel, so that the light is converged and the light extraction efficiency is improved.
在示例性实施方式中,如图5和图6所示的显示基板的制备过程可以包括如下操作。In an exemplary embodiment, the preparation process of the display substrate as shown in FIGS. 5 and 6 may include the following operations.
(1)在玻璃基底形成多个第一微透镜。(1) A plurality of first microlenses are formed on a glass substrate.
图15为图5中的显示基板的第一制备示意图,在一些示例性实施例中,图5至图8、图15所示,在玻璃基底形成多个第一微透镜可以包括:先在玻璃基底10上形成遮挡层图案11,再在玻璃基底10上刻蚀形成第一微透镜13。FIG15 is a first preparation schematic diagram of the display substrate in FIG5 . In some exemplary embodiments, as shown in FIG5 to FIG8 and FIG15 , forming a plurality of first microlenses on a glass substrate may include: first forming a shielding layer pattern 11 on a glass substrate 10, and then etching the glass substrate 10 to form first microlenses 13.
在一些示例性实施例中,玻璃基底10面向发光结构层30的表面包括出光区10a和电路区10b,出光区10a又包括第一透镜区10c。遮挡层图案11包括覆盖在玻璃基底10表面上的第一金属层12,电路区10b至少部分被第一金属层12覆盖,第一金属层12可以为铜(Cu),铝(Al),银(Ag),钛(Ti),钼(Mo)或低电阻金属配制的合金,第一金属层12的部分可为遮光板,可遮挡光线射出,第一金属层12的另一部分可为SD或VDD走线。出光区10a可设有多个,电路区10b可将多个出光区10a分隔开。In some exemplary embodiments, the surface of the glass substrate 10 facing the light emitting structure layer 30 includes a light emitting area 10a and a circuit area 10b, and the light emitting area 10a further includes a first lens area 10c. The shielding layer pattern 11 includes a first metal layer 12 covering the surface of the glass substrate 10, and the circuit area 10b is at least partially covered by the first metal layer 12. The first metal layer 12 can be copper (Cu), aluminum (Al), silver (Ag), titanium (Ti), molybdenum (Mo) or an alloy prepared by a low resistance metal. Part of the first metal layer 12 can be a light shielding plate to block the light from emitting, and another part of the first metal layer 12 can be an SD or VDD wiring. There can be multiple light emitting areas 10a, and the circuit area 10b can separate multiple light emitting areas 10a.
在一些示例性实施例中,形成遮挡层图案11包括先在玻璃基底10上沉积一层第一金属薄膜,然后在第一金属薄膜上涂覆光刻胶,前烘后采用第一掩模板通过紫外光曝光,显影后只在第一金属层12位置保留光刻胶图案,之后经过后烘、刻蚀、剥离光刻胶后,得到遮挡层图案11。In some exemplary embodiments, forming the blocking layer pattern 11 includes first depositing a first metal film on the glass substrate 10, then coating the first metal film with photoresist, exposing it to ultraviolet light using a first mask after pre-baking, and retaining the photoresist pattern only at the position of the first metal layer 12 after development, and then post-baking, etching, and stripping the photoresist to obtain the blocking layer pattern 11.
在一些示例性实施例中,第一透镜区10c内均匀布置有多个第一微透镜13,多个第一微透镜13呈阵列排布,形成微透镜阵列。第一微透镜13可为位于玻璃基底10面向发光结构层30的表面上凹陷的第一弧形面14,第一弧形面14可向玻璃基底10远离发光结构层30的表面凹陷,形成弧形凹槽结构。第一弧形面14的高度可设置为第一弧形面14和玻璃基底10面向发光结构层30的表面之间的最大距离H1,H1的数值可为0.5μm至25μm。在一些示例性实施例中,第一弧形面14在平行于玻璃基底10方向上的截面为圆 形,第一弧形面14在平行于玻璃基底10方向上的截面的最大直径可为D1,D1的数值可为1μm至50μm。出光区10a设有多个,多个出光区10a中的第一微透镜13的尺寸和排列均可一致。In some exemplary embodiments, a plurality of first microlenses 13 are evenly arranged in the first lens area 10c, and the plurality of first microlenses 13 are arranged in an array to form a microlens array. The first microlens 13 may be a first curved surface 14 that is recessed on the surface of the glass substrate 10 facing the light-emitting structure layer 30, and the first curved surface 14 may be recessed toward the surface of the glass substrate 10 away from the light-emitting structure layer 30 to form an arc-shaped groove structure. The height of the first curved surface 14 may be set to be the maximum distance H1 between the first curved surface 14 and the surface of the glass substrate 10 facing the light-emitting structure layer 30, and the value of H1 may be 0.5 μm to 25 μm. In some exemplary embodiments, the cross-section of the first curved surface 14 in a direction parallel to the glass substrate 10 is a circle. The maximum diameter of the cross section of the first curved surface 14 in the direction parallel to the glass substrate 10 can be D1, and the value of D1 can be 1 μm to 50 μm. A plurality of light emitting areas 10a are provided, and the size and arrangement of the first microlenses 13 in the plurality of light emitting areas 10a can be consistent.
在一些示例性实施例中,在玻璃基底10上刻蚀形成第一微透镜13可采用湿法刻蚀,也可采用干法刻蚀,在本例中采用湿法刻蚀,刻蚀过程中可使用HF系列的刻蚀液去除玻璃基底10上的部分玻璃材质而形成凹陷的第一弧形面14,如图5所示。但不限于此,例如采用干法刻蚀,刻蚀过程中,刻蚀气体使用F系列的CF4(四氟化碳)气体或SF6(六氟化硫)气体配合刻蚀,去除玻璃基底10上的部分玻璃材质而形成凹陷的第一弧形面14。In some exemplary embodiments, the etching process to form the first microlens 13 on the glass substrate 10 may be wet etching or dry etching. In this example, wet etching is used, and during the etching process, an HF series etching liquid may be used to remove part of the glass material on the glass substrate 10 to form a concave first arc-shaped surface 14, as shown in FIG5 . However, the invention is not limited thereto. For example, dry etching is used, and during the etching process, an etching gas is an F series CF4 (carbon tetrafluoride) gas or SF6 (sulfur hexafluoride) gas used in combination with etching to remove part of the glass material on the glass substrate 10 to form a concave first arc-shaped surface 14.
(2)形成驱动电路层。(2) Forming a driving circuit layer.
图16为图5中的显示基板的第二制备示意图,图17为图5中的显示基板的第三制备示意图,在一些示例性实施例中,如图16和图17所示,形成驱动电路层20包括先形成复合层15,再通过沉积和刻蚀等工艺制备出第一缓冲层(buffer)16、层间绝缘层(ILD/PVX)17、驱动电路组件18,构成驱动电路层20,驱动电路层20覆盖在玻璃基底10上。Figure 16 is a second preparation schematic diagram of the display substrate in Figure 5, and Figure 17 is a third preparation schematic diagram of the display substrate in Figure 5. In some exemplary embodiments, as shown in Figures 16 and 17, forming a driving circuit layer 20 includes first forming a composite layer 15, and then preparing a first buffer layer (buffer) 16, an interlayer insulating layer (ILD/PVX) 17, and a driving circuit component 18 through processes such as deposition and etching to form a driving circuit layer 20, and the driving circuit layer 20 covers the glass substrate 10.
在一些示例性实施例中,驱动电路层20包括层叠设置的复合层15、第一缓冲层(buffer)16、层间绝缘层(ILD/PVX)17,第一缓冲层(buffer)16覆盖在复合层15远离玻璃基底10的一侧,层间绝缘层(ILD/PVX)17位于第一缓冲层(buffer)16远离复合层15的一侧。驱动电路组件18通过过孔结构连接第一金属层12,驱动电路组件18包括连接电极19,连接电极19可采用不透光的金属材质。In some exemplary embodiments, the driving circuit layer 20 includes a laminated composite layer 15, a first buffer layer 16, and an interlayer insulating layer (ILD/PVX) 17, wherein the first buffer layer 16 covers the side of the composite layer 15 away from the glass substrate 10, and the interlayer insulating layer (ILD/PVX) 17 is located on the side of the first buffer layer 16 away from the composite layer 15. The driving circuit component 18 is connected to the first metal layer 12 through a via structure, and the driving circuit component 18 includes a connecting electrode 19, which may be made of an opaque metal material.
在一些示例性实施例中,先形成复合层可以包括:在具有第一微透镜13的玻璃基底10上以旋转涂布(Spin on Glass,简称SOG))的方式均匀地涂布含有介电材料的液态溶剂,再经过热处理固化形成复合层。涂布液态溶剂过程中,可填补第一弧形面14凹陷形成的弧形凹槽。In some exemplary embodiments, forming the composite layer first may include: uniformly coating a liquid solvent containing a dielectric material on the glass substrate 10 having the first microlens 13 by spin coating (Spin on Glass, SOG for short), and then curing the composite layer by heat treatment. During the coating of the liquid solvent, the arc groove formed by the depression of the first arc surface 14 may be filled.
在一些示例性实施例中,复合层15的材料可为有机无机混合树脂,有机无机混合树脂中含有硅(Si)、氧(O)和氮(N),有机无机混合树脂具有良好的耐热性,可耐300℃至500℃的高温。复合层15为无机和有机混合材质,使得复合层15同时具有平坦层和缓冲层的功能。复合层15的折射率可为1.5至2.0,可通过调节有机无机混合树脂中氧(O)和氮(N)的含量比例以改变复合层15的折射率,而且复合层15的折射率大于玻璃基底10的折射率。复合层15远离玻璃基底10的平面平行于玻璃基底10,复合层15靠近玻璃基底10的一侧表面突出部分填充了第一弧形面14凹陷形成的弧形凹槽。In some exemplary embodiments, the material of the composite layer 15 may be an organic-inorganic hybrid resin, which contains silicon (Si), oxygen (O) and nitrogen (N). The organic-inorganic hybrid resin has good heat resistance and can withstand high temperatures of 300°C to 500°C. The composite layer 15 is a hybrid of inorganic and organic materials, so that the composite layer 15 has the functions of a flat layer and a buffer layer at the same time. The refractive index of the composite layer 15 may be 1.5 to 2.0, and the refractive index of the composite layer 15 may be changed by adjusting the content ratio of oxygen (O) and nitrogen (N) in the organic-inorganic hybrid resin, and the refractive index of the composite layer 15 is greater than the refractive index of the glass substrate 10. The plane of the composite layer 15 away from the glass substrate 10 is parallel to the glass substrate 10, and the protruding portion of the surface of the composite layer 15 on one side close to the glass substrate 10 fills the arc groove formed by the depression of the first arc surface 14.
(3)在平坦层形成多个第二微透镜。(3) A plurality of second micro lenses are formed on the flat layer.
图18为图5中的显示基板的第四制备示意图,图19为图5中的显示基板的第五制备示意图,图20为图19中的E处局部放大示意图,在一些示例性实施例中,如图18至图20所示,形成第一微透镜可以包括:先在驱动电路层20上形成滤光层图案28,形成平坦层图案29,刻蚀第二微透镜26。FIG18 is a fourth schematic diagram of preparing the display substrate in FIG5 , FIG19 is a fifth schematic diagram of preparing the display substrate in FIG5 , and FIG20 is a partial enlarged schematic diagram of point E in FIG19 . In some exemplary embodiments, as shown in FIGS. 18 to 20 , forming the first microlens may include: first forming a filter layer pattern 28 on the driving circuit layer 20 , forming a flat layer pattern 29 , and etching the second microlens 26 .
在一些示例性实施例中,在驱动电路层20上形成滤光层图案28包括:先在驱动电路层20上沉积一层彩光膜,再通过刻蚀方式形成滤光层21,得到滤光层图案28。滤光层图案28包括覆盖在驱动电路层20上的滤光层21,滤光层21在玻璃基底10上的正投影位于出光区内,滤光层21可包括多个滤光片31,多个滤光片31在平行于玻璃基底10的平面上间隔布置,滤光片31由彩光膜刻蚀形成。滤光层21可过滤光线,将白光过滤为预设颜色的光线,滤光层21可为红色滤光片、绿色滤光片或蓝色滤光片。滤光层21上具有第一通孔22,第一通孔22在垂直于玻璃基底10的方向上贯穿滤光层21。 In some exemplary embodiments, forming a filter layer pattern 28 on the driving circuit layer 20 includes: first depositing a color film on the driving circuit layer 20, and then forming a filter layer 21 by etching to obtain a filter layer pattern 28. The filter layer pattern 28 includes a filter layer 21 covering the driving circuit layer 20, and the orthographic projection of the filter layer 21 on the glass substrate 10 is located in the light exit area. The filter layer 21 may include a plurality of filters 31, and the plurality of filters 31 are arranged at intervals on a plane parallel to the glass substrate 10. The filters 31 are formed by etching the color film. The filter layer 21 can filter light and filter white light into light of a preset color. The filter layer 21 can be a red filter, a green filter, or a blue filter. The filter layer 21 has a first through hole 22, and the first through hole 22 penetrates the filter layer 21 in a direction perpendicular to the glass substrate 10.
在一些示例性实施例中,形成平坦层图案29包括:涂布有机材料层,再通过刻蚀方式形成平坦层23,得到平坦层图案29。滤光层图案28包括设置在滤光层图案28上的平坦层23,平坦层23完全覆盖滤光层21远离驱动电路层20的端面。平坦层23上具有第二通孔24,第二通孔24在垂直于玻璃基底10的方向上贯穿平坦层23,第二通孔24和第一通孔22对应连通。另外,层间绝缘层(ILD/PVX)17在靠近平坦层23的端面上开设有第三通孔25,第三通孔25的一端连通第二通孔24,另一端延伸到连接电极19,由此,第一通孔22、第二通孔24和第三通孔25形成垂直于玻璃基底10的方向延伸的过孔32。In some exemplary embodiments, forming the planar layer pattern 29 includes: coating an organic material layer, and then forming a planar layer 23 by etching to obtain the planar layer pattern 29. The filter layer pattern 28 includes a planar layer 23 disposed on the filter layer pattern 28, and the planar layer 23 completely covers the end surface of the filter layer 21 away from the driving circuit layer 20. The planar layer 23 has a second through hole 24, and the second through hole 24 penetrates the planar layer 23 in a direction perpendicular to the glass substrate 10, and the second through hole 24 is connected to the first through hole 22. In addition, the interlayer insulating layer (ILD/PVX) 17 has a third through hole 25 on the end surface close to the planar layer 23, one end of the third through hole 25 is connected to the second through hole 24, and the other end extends to the connecting electrode 19, thereby, the first through hole 22, the second through hole 24 and the third through hole 25 form a via 32 extending in a direction perpendicular to the glass substrate 10.
在一些示例性实施例中,刻蚀第二微透镜26可采用干法刻蚀,去除平坦层23上的部分材质而形成凹陷的第二微透镜26。平坦层23远离玻璃基底10的表面可包括第二透镜区23a,第二透镜区23a在玻璃基底10上的正投影位于第一透镜区10c内,平坦层23可具有多个第二透镜区23a,第二透镜区23a和第一透镜区10c一一对应。第二透镜区23a内均匀布置有多个第二微透镜26,多个第二微透镜26呈阵列排布,形成微透镜阵列。第二微透镜26可为位于平坦层23远离玻璃基底10的表面上凹陷的第二弧形面27,第二弧形面27可向平坦层23远离发光结构层30的表面凹陷,形成弧形凹槽结构。第二弧形面27的高度可设置为第二弧形面27和平坦层23面向发光结构层30的表面之间的最大距离H2,H2的数值可为0.5μm至25μm。在一些示例性实施中,第二弧形面27在平行于玻璃基底10方向上的截面为圆形,第二弧形面27在平行于玻璃基底10方向上的截面的最大直径可为D2,D2的数值可为1μm至50μm。另外,第二弧形面27和第一弧形面14的结构、尺寸和排列方式都一致,但不限于此,例如第二弧形面27和第一弧形面14在结构、尺寸和排列方式中的至少一项不一致。In some exemplary embodiments, the second microlenses 26 may be etched by dry etching to remove part of the material on the flat layer 23 to form a recessed second microlens 26. The surface of the flat layer 23 away from the glass substrate 10 may include a second lens area 23a, and the orthographic projection of the second lens area 23a on the glass substrate 10 is located in the first lens area 10c. The flat layer 23 may have a plurality of second lens areas 23a, and the second lens areas 23a correspond to the first lens areas 10c one by one. A plurality of second microlenses 26 are evenly arranged in the second lens area 23a, and the plurality of second microlenses 26 are arranged in an array to form a microlens array. The second microlens 26 may be a second arc surface 27 that is recessed on the surface of the flat layer 23 away from the glass substrate 10, and the second arc surface 27 may be recessed toward the surface of the flat layer 23 away from the light-emitting structure layer 30 to form an arc-shaped groove structure. The height of the second curved surface 27 can be set to the maximum distance H2 between the second curved surface 27 and the surface of the flat layer 23 facing the light emitting structure layer 30, and the value of H2 can be 0.5μm to 25μm. In some exemplary embodiments, the cross section of the second curved surface 27 in the direction parallel to the glass substrate 10 is circular, and the maximum diameter of the cross section of the second curved surface 27 in the direction parallel to the glass substrate 10 can be D2, and the value of D2 can be 1μm to 50μm. In addition, the second curved surface 27 and the first curved surface 14 are consistent in structure, size and arrangement, but are not limited thereto. For example, the second curved surface 27 and the first curved surface 14 are inconsistent in at least one of the structure, size and arrangement.
(4)形成发光结构层。(4) Forming a light-emitting structure layer.
图21为图5中的显示基板的第六制备示意图,图22为图5中的显示基板的第七制备示意图,图23为图5中的显示基板的第八制备示意图,图24为图5中的显示基板的第九制备示意图,在一些示例性实施例中,如图21至图24所示,形成发光结构层可以包括:形成第一电极图案33,形成像素定义层图案35,形成发光层38,形成第二电极层42。Figure 21 is a sixth preparation schematic diagram of the display substrate in Figure 5, Figure 22 is a seventh preparation schematic diagram of the display substrate in Figure 5, Figure 23 is an eighth preparation schematic diagram of the display substrate in Figure 5, and Figure 24 is a ninth preparation schematic diagram of the display substrate in Figure 5. In some exemplary embodiments, as shown in Figures 21 to 24, forming a light-emitting structure layer may include: forming a first electrode pattern 33, forming a pixel definition layer pattern 35, forming a light-emitting layer 38, and forming a second electrode layer 42.
在一些示例性实施例中,如图20和图21所示,形成第一电极图案33包括:先在刻蚀出第二微透镜26的平坦层图案29上沉积一层电极薄膜,再对电极薄膜进行刻蚀,构成第一电极图案33。第一电极图案33包括层叠的滤光层24和平坦层23,以及第一电极层34,第一电极层34覆盖了平坦层23上的第二透镜区23a,而且延伸到过孔32内且连接电极19贴合,形成第一电极层34和驱动电路的过孔32连接。第一电极层34可作为阳极,第一电极层34可为透光电极,可容光线贯穿,连接电极19和/或第一电极层34可设置不透光的结构,以阻挡光线在过孔32处直接透射过第一电极层34后继续向玻璃基底10方向照射。第一电极层34可覆盖过孔32的全部孔壁,也可只覆盖过孔32的部分孔壁。In some exemplary embodiments, as shown in FIG. 20 and FIG. 21, forming the first electrode pattern 33 includes: first depositing a layer of electrode film on the flat layer pattern 29 where the second microlens 26 is etched, and then etching the electrode film to form the first electrode pattern 33. The first electrode pattern 33 includes a stacked filter layer 24 and a flat layer 23, and a first electrode layer 34. The first electrode layer 34 covers the second lens area 23a on the flat layer 23, and extends into the via hole 32 and is attached to the connecting electrode 19, so that the first electrode layer 34 is connected to the via hole 32 of the driving circuit. The first electrode layer 34 can be used as an anode, and the first electrode layer 34 can be a light-transmitting electrode that allows light to pass through. The connecting electrode 19 and/or the first electrode layer 34 can be provided with a light-proof structure to prevent light from directly transmitting through the first electrode layer 34 at the via hole 32 and then continuing to irradiate toward the glass substrate 10. The first electrode layer 34 can cover the entire hole wall of the via hole 32, or only cover part of the hole wall of the via hole 32.
在一些示例性实施例中,如图21和图22所示,形成像素定义层图案35包括:先在第一电极图案33上沉积一层无机材料膜,再通过刻蚀形成像素定义层图案35。像素定义层图案35包括覆盖了第一电极图案33的像素定义层36,像素定义层36上开设有像素开口37,像素开口37将第一电极层34裸露出。像素定义层36处于第一电极层34远离玻璃基底10的一侧,而且部分的像素定义层36填补了过孔32的空缺。像素开口37设有多个,多个像素开口37按照阵列排布。像素定义层36可采用高透过率材料,使得像素定义层36透明度较高,使得更多光线可透过像素定义层36。 In some exemplary embodiments, as shown in FIG. 21 and FIG. 22 , forming the pixel definition layer pattern 35 includes: first depositing a layer of inorganic material film on the first electrode pattern 33, and then forming the pixel definition layer pattern 35 by etching. The pixel definition layer pattern 35 includes a pixel definition layer 36 covering the first electrode pattern 33, and a pixel opening 37 is provided on the pixel definition layer 36, and the pixel opening 37 exposes the first electrode layer 34. The pixel definition layer 36 is located on the side of the first electrode layer 34 away from the glass substrate 10, and part of the pixel definition layer 36 fills the vacancy of the via 32. There are a plurality of pixel openings 37, and the plurality of pixel openings 37 are arranged in an array. The pixel definition layer 36 can be made of a high-transmittance material, so that the pixel definition layer 36 has a high transparency, so that more light can pass through the pixel definition layer 36.
在一些示例性实施例中,如图22和图23所示,形成发光层38的方式可采用蒸镀,将发光层38制备在像素开口37内。发光层38覆盖了第一电极层34上背向玻璃基底10且裸露的端面部分,发光层38包括多个发光构件39,多个发光构件39和多个像素开口37一一对应,发光构件39各自布置在各自对应的像素开口37内且位于第一电极层34远离玻璃基底10的一侧,多个发光构件39在玻璃基底10上的正投影位于第二透镜区23a在玻璃基底10上的正投影范围内。发光构件39可在供电情况下发射白色光线。In some exemplary embodiments, as shown in FIG. 22 and FIG. 23 , the light-emitting layer 38 can be formed by evaporation, and the light-emitting layer 38 is prepared in the pixel opening 37. The light-emitting layer 38 covers the exposed end surface of the first electrode layer 34 facing away from the glass substrate 10, and the light-emitting layer 38 includes a plurality of light-emitting components 39, and the plurality of light-emitting components 39 correspond to the plurality of pixel openings 37 one by one. The light-emitting components 39 are respectively arranged in the corresponding pixel openings 37 and are located on the side of the first electrode layer 34 away from the glass substrate 10. The orthographic projections of the plurality of light-emitting components 39 on the glass substrate 10 are located within the orthographic projection range of the second lens area 23a on the glass substrate 10. The light-emitting components 39 can emit white light when powered.
在一些示例性实施例中,如图21至图24所示,滤光片31、平坦单元45、第一电极单元47、像素界定单元46和发光构件39构成第一构件41,第一构件41覆盖了驱动电路层20远离玻璃基底10的端面中的部分。在第一构件41中,平坦单元45具有凹陷的第二弧形面27,第一电极单元47填补在第二弧形面27形成凹槽结构内,而且发光构件39覆盖在第一电极单元47上,使得发光层38和第一电极层34在垂直于玻璃基底10方向上对应第二透镜区23a的部分均为波浪状,而非平行于玻璃基底10。在第一构件41中,在平行于玻璃基底10方向上,第一构件41周向的端面为第四端面58,滤光片31在平行于玻璃基底10方向上的端面为第三端面53,平坦单元45在平行于玻璃基底10方向上的端面为第二端面52,像素界定单元46在平行于玻璃基底10方向上且远离像素开口37的端面为第一端面51,第四端面58由在垂直于玻璃基底10方向上依次布置的第一端面51、第二端面52和第三端面53构成。第一构件41、驱动电路层20和玻璃基底10构成中间坯料。In some exemplary embodiments, as shown in FIGS. 21 to 24 , the color filter 31, the flat unit 45, the first electrode unit 47, the pixel defining unit 46 and the light emitting member 39 constitute a first member 41, and the first member 41 covers a portion of the end surface of the driving circuit layer 20 away from the glass substrate 10. In the first member 41, the flat unit 45 has a concave second arc surface 27, the first electrode unit 47 fills in the groove structure formed by the second arc surface 27, and the light emitting member 39 covers the first electrode unit 47, so that the light emitting layer 38 and the first electrode layer 34 in the direction perpendicular to the glass substrate 10 corresponding to the second lens area 23a are both wavy, rather than parallel to the glass substrate 10. In the first member 41, the circumferential end face of the first member 41 in the direction parallel to the glass substrate 10 is the fourth end face 58, the end face of the filter 31 in the direction parallel to the glass substrate 10 is the third end face 53, the end face of the flat unit 45 in the direction parallel to the glass substrate 10 is the second end face 52, the end face of the pixel defining unit 46 in the direction parallel to the glass substrate 10 and away from the pixel opening 37 is the first end face 51, and the fourth end face 58 is composed of the first end face 51, the second end face 52 and the third end face 53 arranged in sequence in the direction perpendicular to the glass substrate 10. The first member 41, the driving circuit layer 20 and the glass substrate 10 constitute an intermediate blank.
在一些示例性实施例中,如图21至图24所示,形成第二电极层42包括:在第一构件41、驱动电路层20和玻璃基底10构成的中间坯料上沉积一层电极薄膜,构成了第二电极层42。第二电极层42覆盖了第一构件41的外表面中远离驱动电路层20的表面,以及第四端面58,第二电极层42还覆盖了驱动电路层20远离玻璃基底10一侧端面中未被第一构件41遮盖的部分。第二电极层42可作为阴极,多个发光构件39共用一个阴极。第二电极层42可采用高反射率金属,使得第二电极层42可将发光构件39照射到其上的光线反射向玻璃基底10。In some exemplary embodiments, as shown in FIGS. 21 to 24 , forming the second electrode layer 42 includes: depositing a layer of electrode film on an intermediate blank formed by the first member 41, the driving circuit layer 20 and the glass substrate 10 to form the second electrode layer 42. The second electrode layer 42 covers the surface of the outer surface of the first member 41 away from the driving circuit layer 20 and the fourth end face 58. The second electrode layer 42 also covers the portion of the end face of the driving circuit layer 20 away from the glass substrate 10 that is not covered by the first member 41. The second electrode layer 42 can be used as a cathode, and multiple light-emitting members 39 share one cathode. The second electrode layer 42 can be made of a metal with high reflectivity, so that the second electrode layer 42 can reflect the light irradiated thereon by the light-emitting member 39 toward the glass substrate 10.
(5)形成封装结构。(5) Forming a packaging structure.
在一些示例性实施例中,如图5和图6所示,形成封装结构层40可以包括:在发光结构层30上制备封装膜43,在封装膜43远离玻璃基底10的一侧安装盖板44。封装膜43可为一层或多层无机或有机薄膜,封装膜43通过薄膜封装技术(Thin Film Encapsulation,简称TFE)覆盖发光结构层30远离玻璃基底10的端面。封装膜43可阻止水和氧气进入显示基板内,为显示基板提供了良好的水氧隔绝特性。盖板44则覆盖在封装膜远离玻璃基底10的一侧,盖板44可为显示基板提供保护。In some exemplary embodiments, as shown in FIG. 5 and FIG. 6 , forming the encapsulation structure layer 40 may include: preparing an encapsulation film 43 on the light emitting structure layer 30, and installing a cover plate 44 on the side of the encapsulation film 43 away from the glass substrate 10. The encapsulation film 43 may be one or more layers of inorganic or organic thin films, and the encapsulation film 43 covers the end face of the light emitting structure layer 30 away from the glass substrate 10 through thin film encapsulation technology (Thin Film Encapsulation, referred to as TFE). The encapsulation film 43 can prevent water and oxygen from entering the display substrate, providing the display substrate with good water and oxygen isolation properties. The cover plate 44 covers the side of the encapsulation film away from the glass substrate 10, and the cover plate 44 can provide protection for the display substrate.
本公开还提供一种显示装置,显示装置可以包括前述的显示基板。显示装置可以为:手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件,本发明实施例并不以此为限。The present disclosure also provides a display device, which may include the aforementioned display substrate. The display device may be: a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any other product or component with a display function, but the embodiments of the present invention are not limited thereto.
虽然本公开所揭露的实施方式如上,但所述的内容仅为便于理解本公开而采用的实施方式,并非用以限定本公开。任何本公开所属领域内的技术人员,在不脱离本公开所揭露的精神和范围的前提下,可以在实施的形式及细节上进行任何的修改与变化,但本发明的专利保护范围,仍须以所附的权利要求书所界定的范围为准。 Although the embodiments disclosed in the present disclosure are as above, the contents described are only embodiments adopted to facilitate understanding of the present disclosure and are not intended to limit the present disclosure. Any technician in the field to which the present disclosure belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the present disclosure, but the patent protection scope of the present invention shall still be subject to the scope defined in the attached claims.
Claims (20)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2023/135630 WO2025111973A1 (en) | 2023-11-30 | 2023-11-30 | Display substrate, manufacturing method and display apparatus |
| CN202380012097.5A CN120419332A (en) | 2023-11-30 | 2023-11-30 | Display substrate, preparation method and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2023/135630 WO2025111973A1 (en) | 2023-11-30 | 2023-11-30 | Display substrate, manufacturing method and display apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2025111973A1 true WO2025111973A1 (en) | 2025-06-05 |
Family
ID=95896128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2023/135630 Pending WO2025111973A1 (en) | 2023-11-30 | 2023-11-30 | Display substrate, manufacturing method and display apparatus |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN120419332A (en) |
| WO (1) | WO2025111973A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190181384A1 (en) * | 2017-11-17 | 2019-06-13 | The Regents Of The University Of Michigan | Sub-electrode microlens array for organic light emitting devices |
| CN111554716A (en) * | 2020-05-14 | 2020-08-18 | Oppo广东移动通信有限公司 | Display device, manufacturing method thereof and electronic equipment |
| CN115132950A (en) * | 2022-07-27 | 2022-09-30 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN116249410A (en) * | 2023-03-27 | 2023-06-09 | 京东方科技集团股份有限公司 | A display substrate and a display device |
| CN116243410A (en) * | 2022-12-08 | 2023-06-09 | 友达光电股份有限公司 | Microlens structure, manufacturing method thereof and display device |
-
2023
- 2023-11-30 WO PCT/CN2023/135630 patent/WO2025111973A1/en active Pending
- 2023-11-30 CN CN202380012097.5A patent/CN120419332A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190181384A1 (en) * | 2017-11-17 | 2019-06-13 | The Regents Of The University Of Michigan | Sub-electrode microlens array for organic light emitting devices |
| CN111554716A (en) * | 2020-05-14 | 2020-08-18 | Oppo广东移动通信有限公司 | Display device, manufacturing method thereof and electronic equipment |
| CN115132950A (en) * | 2022-07-27 | 2022-09-30 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN116243410A (en) * | 2022-12-08 | 2023-06-09 | 友达光电股份有限公司 | Microlens structure, manufacturing method thereof and display device |
| CN116249410A (en) * | 2023-03-27 | 2023-06-09 | 京东方科技集团股份有限公司 | A display substrate and a display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120419332A (en) | 2025-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6542867B2 (en) | Display device | |
| CN104425556B (en) | Light-emitting device, method of manufacturing light-emitting device, and electronic device | |
| US20250017056A1 (en) | Display Substrate and Preparation Method Thereof, and Display Apparatus | |
| CN117352625B (en) | MicroLED microdisplay chip and preparation method | |
| EP4418840A1 (en) | Display substrate and display device | |
| WO2024255889A1 (en) | Display panel and preparation method therefor, and display apparatus | |
| JP2024045452A (en) | Display devices and electronic equipment | |
| CN113811942B (en) | Display panel and display device | |
| WO2024179214A9 (en) | Display substrate, preparation method therefor, and display apparatus | |
| JP2019054006A (en) | Light-emitting device and electronic equipment | |
| JP2023145605A (en) | Display device and electronic device | |
| WO2025111973A1 (en) | Display substrate, manufacturing method and display apparatus | |
| JP2018088417A (en) | Light-emitting device, manufacturing method for the same, and electronic apparatus | |
| WO2025044572A1 (en) | Display substrate and manufacturing method therefor, and display device | |
| WO2024178600A1 (en) | Display substrate and preparation method therefor, and display apparatus | |
| CN109904210B (en) | Display substrate, manufacturing method thereof and display device | |
| JP2020149983A (en) | Light emitting device, manufacturing method of light emitting device, electronic device | |
| CN223219448U (en) | Display substrate and display device | |
| US20240389420A1 (en) | Display substrate, preparation method therefor, and display apparatus | |
| WO2025199997A1 (en) | Light-emitting substrate and preparation method therefor, and display device | |
| JP2025517681A (en) | Organic Light Emitting Display Device | |
| CN121152440A (en) | Light-emitting components and their manufacturing methods, display panels and display devices | |
| JP2025517679A (en) | Organic Light Emitting Display Device | |
| CN120051117A (en) | Display panel and display device | |
| CN121511664A (en) | Array substrate, display panel and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 23959886 Country of ref document: EP Kind code of ref document: A1 |
|
| WWP | Wipo information: published in national office |
Ref document number: 202380012097.5 Country of ref document: CN |