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WO2025102277A1 - Caloduc en boucle - Google Patents

Caloduc en boucle Download PDF

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Publication number
WO2025102277A1
WO2025102277A1 PCT/CN2023/131877 CN2023131877W WO2025102277A1 WO 2025102277 A1 WO2025102277 A1 WO 2025102277A1 CN 2023131877 W CN2023131877 W CN 2023131877W WO 2025102277 A1 WO2025102277 A1 WO 2025102277A1
Authority
WO
WIPO (PCT)
Prior art keywords
internal space
heat pipe
loop heat
refrigerant
evaporator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2023/131877
Other languages
English (en)
Inventor
Yuqing Zhang
Shuaijun Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Priority to PCT/CN2023/131877 priority Critical patent/WO2025102277A1/fr
Publication of WO2025102277A1 publication Critical patent/WO2025102277A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Definitions

  • Embodiments of the present disclosure generally relate to loop heat pipes.
  • a loop heat pipe may also be referred to as a thermosiphon.
  • a traditional LHP includes a closed loop formed by an evaporator, a condenser, and conduits connecting between the evaporator and the condenser.
  • the conduits include a vapor conduit leading from the evaporator to the condenser and a liquid conduit leading from the condenser to the evaporator.
  • the LHP uses a phase-change working fluid charged in the closed loop to transfer high-density heat generated by a heat source, such as an electronic device or home electric appliance.
  • a heat source such as an electronic device or home electric appliance.
  • the working fluid in a liquid phase absorbs heat from the heat source, such that a part of the working fluid changes into a gas phase.
  • the mixed working fluid containing the gas phase and the liquid phase moves in the vapor conduit under the action of pressure difference and buoyancy and reaches the condenser.
  • the mixed fluid In the condenser, the mixed fluid is cooled into the liquid phase.
  • the condensed working fluid returns to the evaporator under the action of capillary force or gravity.
  • the LHP is mainly applied to vertically installed products, not horizontally installed products, due to limitation of its working principle.
  • the horizontally installed products such as baseband products, are typically cooled by heat dissipating solutions other than the LHP, for example, heat pipes (HP) and vapor chambers (VC) .
  • heat dissipating solutions have a lower cooling capacity than the loop heat pipe.
  • Example embodiments of the present disclosure provide a loop heat pipe suitable for cooling the horizontally installed products.
  • a loop heat pipe comprising: an evaporator comprising a first internal space and configured to change at least a part of a refrigerant in the first internal space from a liquid phase into a gas phase upon absorbing heat from a heat source; a condensing conduit comprising an inlet in communication with the first internal space and an outlet and configured to change the refrigerant from the gas phase into the liquid phase; and a liquid returning cavity comprising a second internal space in communication with the first internal space and the outlet of the condensing conduit and configured to receive the refrigerant in the liquid phase from condensing conduit and return the refrigerant into the first internal space, wherein in a case that the loop heat pipe is placed on a horizontal surface, the liquid returning cavity is arranged alongside the evaporator in a horizontal direction, and the inlet of the condensing conduit is arranged at a position higher than the outlet of the condensing conduit.
  • the condensing conduit comprises a single conduit or a plurality of sub-conduits connected in parallel between the evaporator and the liquid returning cavity.
  • each of a bottom of the first internal space and a bottom of the second internal space extends in the horizontal direction.
  • the bottom of the first internal space is in flush with the bottom of the second internal space, or the bottom of the first internal space is higher or lower than the bottom of the second internal space.
  • the bottom of the first internal space extends in the horizontal direction
  • the bottom of the second internal space is inclined relative to the horizontal direction
  • an end of the bottom of the second internal space adjacent to the first internal space is lower than the other end of the bottom of the second internal space away from the first internal space.
  • the loop heat pipe further comprises a boiling enhancement material layer arranged at a bottom of the first internal space.
  • the evaporator comprises a first portion connected to the liquid returning cavity and a second portion above the first portion, the first internal space is surrounded by the first portion and the second portion, the inlet of the condensing conduit is connected to a side of the second portion of the evaporator, and the outlet of the condensing conduit is connected to a top of the liquid returning cavity.
  • the loop heat pipe further comprises a separating wall arranged between the first internal space and the second internal space and configured to allow the refrigerant in the liquid phase to flow from the second internal space into the first internal space and prevent the refrigerant in the gas phase from flowing from the first internal space into the second internal space.
  • the loop heat pipe further comprises an injection port arranged on a top of the liquid returning cavity for injection of the refrigerant.
  • the loop heat pipe further comprises fins arranged around the condensing conduit.
  • the loop heat pipe further comprises a fan arranged close to the fins and configured to drive a gas flow to pass through the fins.
  • the loop heat pipe is suitable for the horizontally installed products such as the baseband products to improve the heat transfer performance and phase-change capacity.
  • the loop heat pipe can achieve higher and more reliable thermal performance.
  • the size and weight of the loop heat pipe can be decreased due to its larger cooling capacity.
  • Fig. 1 is a perspective view of a loop heat pipe according to an embodiment of the present disclosure
  • Fig. 2 is a cross-sectional view of the loop heat pipe as shown in Fig. 1;
  • Fig. 3 is a perspective view of a loop heat pipe according to an embodiment of the present disclosure.
  • Fig. 4 is a perspective view of a loop heat pipe according to an embodiment of the present disclosure.
  • Fig. 5 is a perspective view of a loop heat pipe according to an embodiment of the present disclosure.
  • Fig. 6 is a top view of the loop heat pipe as shown in Fig. 5;
  • Fig. 7 is a graph illustrating a comparison between heat transfer coefficients when a heating surface is implemented as Cu foam or Cu plate.
  • the term “comprises” or “includes” and its variants are to be read as open terms that mean “includes, but is not limited to. ”
  • the term “or” is to be read as “and/or” unless the context clearly indicates otherwise.
  • the term “based on” is to be read as “based at least in part on. ”
  • the term “being operable to” is to mean a function, an action, a motion or a state can be achieved by an operation induced by a user or an external mechanism.
  • the term “one embodiment” and “an embodiment” are to be read as “at least one embodiment. ”
  • the term “another embodiment” is to be read as “at least one other embodiment. ”
  • the terms “first, ” “second, ” and the like may refer to different or same objects. Other definitions, explicit and implicit, may be included below. A definition of a term is consistent throughout the description unless the context clearly indicates otherwise.
  • the LHP is mainly applied to vertically installed products, but not suitable for horizontally installed products, due to limitation of its working principle.
  • phase-change cooling solutions such as rolling bond cards (RBC) and thermosiphons have been applied due to their larger cooling capacity than traditional heatsinks.
  • RBC rolling bond cards
  • thermosiphons have been applied due to their larger cooling capacity than traditional heatsinks.
  • most of such high-performance cooling solutions are mainly applied to the vertically installed products, while the horizontally installed products such as baseband products mainly rely on traditional heat pipes and vapor chambers which have a relatively lower cooling capacity.
  • Embodiments of the present disclosure aim to provide a loop heat pipe suitable for the horizontally installed products such as the baseband products to improve the heat transfer performance and phase-change capacity.
  • principles of example embodiments of the present disclosure will be described with reference to Figs. 1-7.
  • Fig. 1 is a perspective view of a loop heat pipe according to an embodiment of the present disclosure
  • Fig. 2 is a cross-sectional view of the loop heat pipe as shown in Fig. 1.
  • the loop heat pipe 100 described herein generally includes an evaporator 11, a condensing conduit 12, and a liquid returning cavity 13.
  • the evaporator 11 includes a first internal space 110 filled with a refrigerant 14.
  • the refrigerant 14 at least covers a bottom of the first internal space 110.
  • the evaporator 11 may change at least a part of the refrigerant 14 in the first internal space 110 from a liquid phase into a gas phase upon absorbing heat from a heat source 200 thermally connected to the evaporator 11.
  • the heat source 200 may be attached to a bottom of the evaporator 11 via a thermal interface material 201.
  • the thermal interface material 201 may transfer heat generated by the heat source 200 to the evaporator 11, such that at least a part of the refrigerant 14 in the first internal space 110 changes from the liquid phase into the gas phase.
  • the condensing conduit 12 includes an inlet 121 in communication with the first internal space 110 and an outlet 122 connected to the liquid returning cavity 13.
  • the condensing conduit 12 may change the refrigerant 14 from the gas phase into the liquid phase.
  • the refrigerant 14 in the gas phase may flow from the first internal space 110 into the condensing conduit 12 via the inlet 121. Since the condensing conduit 12 is at a relatively low temperature, the refrigerant 14 may condense into the liquid phase in the condensing conduit 12.
  • the refrigerant 14 in the liquid phase may flow from the condensing conduit 12 into the liquid returning cavity 13 via the outlet 122.
  • the condensing conduit 12 is directly connected to the evaporator 11, thus there is no need to separate the evaporator and condenser. Integration of the condensing conduit 12 and the evaporator 11 may decrease a volume of the loop heat pipe 100, such that the loop heat pipe 100 can be applied in space-limited conditions.
  • the liquid returning cavity 13 is arranged alongside the evaporator 11 in a horizontal direction X, and the inlet 121 of the condensing conduit 12 is arranged at a position higher than the outlet 122 of the condensing conduit 12.
  • the heat generated by the heat source 200 may be transferred to the evaporator 11 via the thermal interface material 201, such that at least a part of the refrigerant 14 in the first internal space 110 changes from the liquid phase into the gas phase.
  • the refrigerant 14 in the gas phase may rise in the first internal space 110 and flow from the first internal space 110 into the condensing conduit 12 via the inlet 121.
  • the refrigerant 14 may condense into the liquid phase in the condensing conduit 12.
  • the inlet 121 of the condensing conduit 12 is arranged at a position higher than the outlet 122 of the condensing conduit 12, the refrigerant 14 changed into the liquid phase may flow from the condensing conduit 12 into the liquid returning cavity 13 via the outlet 122. Further, since the liquid returning cavity 13 is arranged alongside the evaporator 11 in the horizontal direction X, the refrigerant 14 in the liquid returning cavity 13 may return into the first internal space 110. In this manner, the loop heat pipe 100 allows the refrigerant 14 to circulate in a closed loop formed by the evaporator 11, the condensing conduit 12, and the liquid returning cavity 13 so as to cool the heat source 200.
  • the loop heat pipe 100 is suitable for the horizontally installed products such as the baseband products to improve the heat transfer performance and phase-change capacity.
  • the loop heat pipe 100 can achieve higher and more reliable thermal performance.
  • the size and weight of the loop heat pipe 100 can be decreased due to its larger cooling capacity.
  • the condensing conduit 12 includes a single conduit.
  • the single conduit may have a relatively large internal space in communication with the first internal space 110 and the second internal space 130, such that the refrigerant 14 in the gas phase may efficiently flow from the first internal space 110 into the condensing conduit 12 and rapidly condense into the liquid phase in the condensing conduit 12.
  • a width of the single conduit in a direction normal to the horizontal direction X may be much larger than a thickness of the single conduit.
  • a cross-section of the single conduit along the width direction may be rectangular. It is to be understood that the single conduit may have any appropriate size or shape. The scope of the present disclosure is not intended to be limited in this respect.
  • each of a bottom of the first internal space 110 and a bottom of the second internal space 130 extends in the horizontal direction X.
  • the bottom of both the first internal space 110 and the second internal space 130 may be substantially flat. Since the second internal space 130 is in communication with the first internal space 110, a liquid level of the refrigerant 14 in the second internal space 130 tends to be identical to that in the first internal space 110.
  • the refrigerant 14 changed into the liquid phase flows from the condensing conduit 12 into the liquid returning cavity 13
  • the liquid level of the refrigerant 14 in the liquid returning cavity 13 will rise, such that the refrigerant 14 in the liquid returning cavity 13 flows into the first internal space 110.
  • the refrigerant 14 may be circulated in the loop heat pipe 100.
  • the liquid level of the refrigerant 14 in the liquid returning cavity 13 may be below a top of the first internal space 130. In other words, a gap may be provided between the liquid level of the refrigerant 14 in the liquid returning cavity 13 and the top of the first internal space 130. In an embodiment, the liquid level of the refrigerant 14 in the liquid returning cavity 13 may be substantially in flush with the top of the first internal space 130.
  • the bottom of the first internal space 110 may be in flush with the bottom of the second internal space 130. In other embodiments, the bottom of the first internal space 110 may be higher or lower than the bottom of the second internal space 130.
  • the bottom of the first internal space 110 may extend in the horizontal direction X, and the bottom of the second internal space 130 may be inclined relative to the horizontal direction.
  • An end of the bottom of the second internal space 130 adjacent to the first internal space 110 may be lower than the other end of the bottom of the second internal space 130 away from the first internal space 110.
  • the bottom of the first internal space 110 may be in any appropriate position relationship with respect to the bottom of the second internal space 130, as long as the liquid level of the refrigerant 14 in the second internal space 130 can be in flush with the liquid level of the refrigerant 14 in the first internal space 110.
  • the loop heat pipe 100 further includes a boiling enhancement material layer 16 arranged at the bottom of the first internal space 110.
  • the boiling enhancement material layer 16 is applied on a heating surface of the evaporator 11 and immersed in the refrigerant 14 to improve the nucleate boiling process.
  • Traditional phase-change heatsinks without a boiling enhancement material can easily achieve a film boiling regime, such that such phase-change heatsinks cannot work properly at a high heat flux.
  • boiling in the evaporator 11 is a main physical factor that determines the performance of the loop heat pipe 100
  • enhancement of the boiling process by modifying morphology of a heating surface of the evaporator 11 is an effective way to improve heat transfer performance of the loop heat pipe 100.
  • Porous structures of the heating surface may be used to enhance the heat transfer performance.
  • the boiling enhancement material layer 16 includes a Cu foam formed at the bottom of the first internal space 110. Interconnected pores in the porous surface structures may increase a wetted area and a nucleation site density. Additionally, a proper liquid level above the heating surface can further improve the heat transfer coefficient, obviously enhancing the boiling process at certain conditions.
  • the traditional heat pipes (HP) and vapor chambers (VC) also apply porous structures, they mainly focus on a capillary behavior to transport liquid from the condenser to the evaporator, rather than enhancing the boiling process.
  • Main parameters of the boiling enhancement material layer 16 include types of material, thickness, pores per linear Inch (PPI) and pore diameter. These parameters may be determined according to the working property of the refrigerant 14, bubble dynamics, desired heat load, and position of the heat source 200.
  • PPI pores per linear Inch
  • the evaporator 11 may include a first portion 111 connected to the liquid returning cavity 13 and a second portion 112 above the first portion 111.
  • the first internal space 110 is surrounded by the first portion 111 and the second portion 112.
  • the refrigerant 14 is accommodated in the first portion 111.
  • the inlet 111 of the condensing conduit 12 is connected to a side of the second portion 112 of the evaporator 11.
  • the outlet 112 of the condensing conduit 12 is connected to a top of the liquid returning cavity 13.
  • the heat generated by the heat source 200 may be transferred to the evaporator 11, such that at least a part of the refrigerant 14 in the first portion 111 changes from the liquid phase into the gas phase.
  • the refrigerant 14 in the gas phase may rise into the second portion 112 and flow into the condensing conduit 12 via the inlet 121.
  • the loop heat pipe 100 further includes a separating wall 17 arranged between the first internal space 110 and the second internal space 130.
  • a gap is provided between the separating wall 17 and the bottom of the first internal space 110 and the second internal space 30.
  • the liquid level may be above the gap.
  • the separating wall 17 may allow the refrigerant 14 in the liquid phase to flow from the second internal space 130 into the first internal space 110 and prevent the refrigerant 14 in the gas phase from flowing from the first internal space 110 into the second internal space 130.
  • the separating wall 17 can maintain a pressure difference between the evaporator 11 and the liquid returning cavity 13 and ensure that the vapor flows into the condensing conduit 12 in a desired circulating direction.
  • the loop heat pipe 100 further includes an injection port 15 arranged on a top of the liquid returning cavity 13 for injection of the refrigerant 14.
  • the refrigerant 14 may be injected or added into the liquid returning cavity 13.
  • Fig. 3 is a perspective view of a loop heat pipe according to an embodiment of the present disclosure.
  • the loop heat pipe 100 further includes fins 18 arranged around the condensing conduit 12. The fins 100 may enhance the heat dissipating performance of the condensing conduit 12.
  • Fig. 4 is a perspective view of a loop heat pipe according to an embodiment of the present disclosure.
  • the condensing conduit 12 includes a plurality of sub-conduits connected in parallel between the evaporator 11 and the liquid returning cavity 13.
  • the inlet 121 of each of the sub-conduits is connected to the evaporator 11 and the outlet 122 of each of the sub-conduits is connected to the liquid returning cavity 13.
  • the plurality of sub-conduits may extend in the same orientation. In an embodiment, according to an actual requirement, the plurality of sub-conduits may extend in different orientations.
  • the fins 18 may be arranged around the plurality of sub-conduits, so as to enhance the heat dissipating performance of the plurality of sub-conduits.
  • Fig. 5 is a perspective view of a loop heat pipe according to an embodiment of the present disclosure
  • Fig. 6 is a top view of the loop heat pipe as shown in Fig. 5.
  • the loop heat pipe 100 further includes a fan 31 arranged close to the fins 18.
  • the fan 31 may drive a gas flow to pass through the fins 18 along a direction indicated arrows in Figs. 5 and 6, so as to bring the heat away from the fins 18.
  • the fan 31 may blow air towards the fins 18.
  • the fan 31 may draw air from the fins 18.
  • the heat source 200 such as an electronic device or home electric appliance may be arranged on a base 32, and the evaporator 11 of the loop heat pipe 100 covers the heat source 200.
  • Fig. 7 is a graph illustrating a comparison between heat transfer coefficients when a heating surface is implemented as Cu foam or Cu plate. As shown in Fig. 7, the heat transfer coefficient of the evaporator 11 is significantly increased in a case that the heating surface is implemented as Cu foam. Thus, the boiling enhancement material layer 16 may significantly improve the boiling heat transfer coefficient and provide higher cooling capacity.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Des modes de réalisation de la présente divulgation fournissent un caloduc en boucle. Le caloduc en boucle comprend : un évaporateur comprenant un premier espace interne et configuré pour modifier au moins une partie d'un fluide frigorigène dans le premier espace interne d'une phase liquide en une phase gazeuse lors de l'absorption de chaleur provenant d'une source de chaleur ; un conduit de condensation comprenant une entrée en communication avec le premier espace interne et une sortie et configuré pour modifier le fluide frigorigène de la phase gazeuse en phase liquide ; et une cavité de retour de liquide comprenant un second espace interne en communication avec le premier espace interne et la sortie du conduit de condensation et configuré pour recevoir le fluide frigorigène dans la phase liquide à partir du conduit de condensation et retourner le fluide frigorigène dans le premier espace interne, dans un cas où le caloduc en boucle est placé sur une surface horizontale, la cavité de retour de liquide est agencée le long de l'évaporateur dans une direction horizontale, et l'entrée du conduit de condensation est agencée au niveau d'une position supérieure à la sortie du conduit de condensation.
PCT/CN2023/131877 2023-11-15 2023-11-15 Caloduc en boucle Pending WO2025102277A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2023/131877 WO2025102277A1 (fr) 2023-11-15 2023-11-15 Caloduc en boucle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2023/131877 WO2025102277A1 (fr) 2023-11-15 2023-11-15 Caloduc en boucle

Publications (1)

Publication Number Publication Date
WO2025102277A1 true WO2025102277A1 (fr) 2025-05-22

Family

ID=95741921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/131877 Pending WO2025102277A1 (fr) 2023-11-15 2023-11-15 Caloduc en boucle

Country Status (1)

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WO (1) WO2025102277A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005042949A (ja) * 2003-07-23 2005-02-17 Sharp Corp 熱交換システムおよびスターリング冷却庫
CN1624911A (zh) * 2003-11-26 2005-06-08 热成型及功能有限公司 使用相变制冷剂的泵送液体冷却系统
US20110048676A1 (en) * 2009-08-28 2011-03-03 Hitachi, Ltd. Cooling system and electronic apparatus applying the same therein
EP3379909A1 (fr) * 2017-03-24 2018-09-26 Deere & Company Ensemble électronique à refroidissement à changement de phase d'un dispositif semi-conducteur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005042949A (ja) * 2003-07-23 2005-02-17 Sharp Corp 熱交換システムおよびスターリング冷却庫
CN1624911A (zh) * 2003-11-26 2005-06-08 热成型及功能有限公司 使用相变制冷剂的泵送液体冷却系统
US20110048676A1 (en) * 2009-08-28 2011-03-03 Hitachi, Ltd. Cooling system and electronic apparatus applying the same therein
EP3379909A1 (fr) * 2017-03-24 2018-09-26 Deere & Company Ensemble électronique à refroidissement à changement de phase d'un dispositif semi-conducteur

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