WO2025188187A1

WO2025188187A1 - Method and apparatus for manufacturing a flexible substrate including an rfid-tag

Info

Publication number: WO2025188187A1
Application number: PCT/NL2025/050112
Authority: WO
Inventors: Meeuwis Adriaan Johan DE WEERD
Original assignee: Collimetrix BV
Current assignee: Collimetrix BV
Priority date: 2024-03-07
Filing date: 2025-03-07
Publication date: 2025-09-12
Anticipated expiration: 2026-09-07
Also published as: WO2025188187A8

Abstract

A method of and an apparatus for manufacturing a flexible substrate including an RFID-tag. First, a flexible carrier substrate is supplied. The carrier substrate is ultrathin. At least part of the carrier substrate surface is covered by an electrically conductive layer. The carrier substrate is in a transport direction along a laser ablation station that is configured to direct a laser beam to the electrically conductive layer applied on the carrier substrate and to move an impact position of the laser beam over the electrically conductive layer to selectively evaporate portions of the electrically conductive layer and to leave an electrically conductive pattern on the carrier substrate surface. The electrically conductive pattern forms an antenna of the RFID-tag. Thereafter, the carrier substrate is moved along a pick-and-place station in which a RFID-chip is picked up from a storage and placed on and bonded to the carrier substrate thereby creating an electrically conductive connection between the RFID-chip and the antenna formed by the electrically conductive pattern to create the RFID-tag.

Description

Title: Method and apparatus for manufacturing a flexible substrate including an RFID-tag

TECHNICAL FIELD

[0001] The present disclosure relates a method and an apparatus for manufacturing a flexible substrate including an RFID-tag comprising an RFID-chip and an electrically conductive pattern on the flexible chip forming an antenna.

BACKGROUND

[0002] US 2004/0188531 discloses method for producing RFID-tags. As disclosed in [0037] of US 2004/0188531 , a fluidic self assembly (FSA) process is used to form a densely packed array of filament tags on a flexible or plastic sheet. FSA is a process where a plurality of integrated circuit devices (such as NanoBlock™ ICs) are dispensed in a slurry. The slurry with the integrated circuits is dispensed over a substrate configured with receptors for the integrated circuits to be disposed therein. Due to the necessity of providing receptors, i.e. cavities, in the substrate, the known method is not fit for manufacturing RFID tags from a carrier substrate which is ultrathin, i.e. having a thickness of less than 20 microns.

SUMMARY

[0003] The object of the present invention is to provide a method and an apparatus with which a flexible substrate can be processed that is ultrathin and which can be provided with an antenna and RFID-chips to create an ultrathin substrate that has an electronic ID.

[0004] To that end, the invention provides the method of claim 1. In particular, the method of the invention comprises: supplying a flexible carrier substrate, wherein the carrier substrate comprises cellulose, cellulose fibers, a polymer, or a composition thereof, at least part of the carrier substrate surface being covered by an electrically conductive layer; moving the carrier substrate in a transport direction along a laser ablation station that is configured to direct a laser beam to the electrically conductive layer applied on the carrier substrate and to move an impact position of the laser beam over the electrically conductive layer to selectively evaporate portions of the electrically conductive layer and to leave an electrically conductive pattern on the carrier substrate surface, the electrically conductive pattern at least forming an antenna of the RFID-tag; moving the carrier substrate along a pick-and-place station in which a RFID-chip is picked up from a storage and placed on and bonded to the carrier substrate thereby creating an electrically conductive connection between the RFID-chip and the antenna formed by the electrically conductive pattern to create the RFID-tag.

[0005] The invention additionally provides an apparatus according to claim 22. In particular, the apparatus of the invention comprises: a carrier substrate transport assembly including a carrier substrate supply, the carrier substrate transport assembly being configured for supplying and transporting a carrier substrate comprising cellulose, cellulose fibers, a polymer, or a composition thereof; a laser ablation station comprising a laser head for generating a laser beam, the laser ablation station being configured to direct the laser beam to an electrically conductive layer applied on the carrier substrate and to move an impact position of the laser beam over the electrically conductive layer to selectively evaporate portions of the electrically conductive layer and to leave an electrically conductive pattern on the carrier substrate surface, the electrically conductive pattern at least forming an antenna of the RFID-tag; a pick-and-place station configured to pick up an RFID-chip from a storage and to place the RFID-chip on and bond to the carrier substrate thereby creating an electrically conductive connection between the RFID-chip and the antenna formed by the electrically conductive pattern to create the RFID-tag; and an electronic controller for controlling at least part of the carrier substrate transport assembly, the laser ablation station and the pick-and-place station.

[0006] With the method and the apparatus according to the invention, it is possible to process a flexible carrier substrate that is ultrathin, i.e. less than 20 microns thick. This allows for automated, serialized, and continuous production electrically conductive patterns to produce antenna’s on the ultrathin carrier substrate and the automated exact placement of RFID-chips thereon thereby bonding the RFID-chips to the carrier substrate and creating an electrically conductive connection between the RFID-chip and the associated antenna.

[0007] Aspects and embodiments of the disclosure are set forth in the dependent claims. [0008] In a first embodiment, of the method, the flexible carrier substrate is ultrathin and has a thickness of less than 20 micrometer. The flexible carrier substrate may be formed from individual sheets, for example, individual sheets of paper. However, it is also possible that the carrier substrate comprises a continuous substrate web that is unwound from a reel. A continuous substrate web has the advantage that transportation of the carrier substrate web through along the laser ablation station and the pick-and-place station may be performed in a more efficient manner, e.g. continuously. However, intermittent and/or intermitted movement of the carrier substrate along the laser ablation station and the pick-and-place station is not excluded.

[0009] In an embodiment, the method may include moving the carrier substrate along a layer application station for applying the electronically conductive layer onto the carrier substrate, wherein the layer application station, when viewed in the transport direction, is positioned upstream from the laser ablation station. Although the method in its most general terms does not exclude that the carrier substrate is already provided with an electrically conductive layer when it is supplied, it is in accordance with this embodiment preferred to apply the electrically conductive layer onto the carrier substrate as part of the present method. This reduces handling of the ultrathin and therefore vulnerable carrier substrate and minimizes the chance of damaging the carrier substrate.

[0010] Various processes are possible to apply the electronically conductive layer including but not limited to:

- coating;

- chemical vapor deposition;

- atomic layer deposition;

- printing;

- stamping;

- bonding of a conductive material onto the carrier substrate; and

- transferring of a metallic surface onto the surface of the carrier substrate.

[0011] Of these layer application processes chemical vapor deposition, atomic layer deposition and other non-contact coating techniques have preference because the chance of damaging the ultrathin carrier substrate is minimal.

[0012] In an embodiment, the electrically conductive layer is one of a metal, carbon, and graphene. [0013] In an embodiment, the electrically conductive pattern additionally includes optically visible image. The optically visible image may comprises at least one of:

- human readable text;

- a bar code;

- a QR-code

- a watermark;

- a logo;

- unique serial numbers;

- identification codes; and

- markings.

[0014] Thus, the carrier substrate is not only provided with an electronically readable RFID-tag but also by an optically visible image that may transfer a meaning to a human user of a piece of carrier substrate provided with such an optically visible image. The meaning may also be transferred indirectly, for example because the optically visible image is a bar code or a QR-code which first must be read by an electronic device like a smartphone to be made interpretable for a human being.

[0015] In an embodiment, the carrier substrate is cooled on a side thereof which is opposite the electrically conductive layer during laser ablation of the electrically conductive layer. This prevents that the vulnerable ultrathin carrier substrate burns or is damaged during the laser ablation. Thus, the intensity of the laser may be increased which may result in a faster formation of the desired pattern in the electrically conductive layer.

[0016] In an further elaboration of this embodiment, the cooling may be performed by guiding the side of carrier substrate which is opposite the electrically conductive layer over a cooling plate, wherein the dimensions of the cooling plate are such any impact position of the laser beam is always directly opposite the cooling plate. Thus, any heat which is introduced by the laser beam is quickly removed to the cool surface of the cooling plate and the risk of damaging the carrier substrate is reduced.

[0017] In a further elaboration of this embodiment, the cooling plate may comprise a Peltier element; or a transparent or metal cooling block, optionally with heat fins and/or with cooling channels for guiding cooling liquid through the cooling block. The transparent cooling block may be manufactured from glass or a therm ically conductive transparent plastic. By virtue of the presence of a transparent cooling block, a laser beam can be transmitted through the transparent cooling block and optionally the transparent cooling liquid. But the intensity of the beam will diminish significantly to be non-destructive when exiting the cooling block. Thus, unwanted reflections of the laser beam on the cooling block may be prevented.

[0018] In an embodiment of the method, the movement of the impact position of the laser beam is controlled by the laser ablation station by moving the impact position of the laser beam both in a direction transverse to the transport direction and in a direction parallel to the transport direction. Thus, any desired pattern can be formed from the electrically conductive layer including an antenna and optionally optical visible images.

[0019] In a further elaboration of this embodiment, the movement of the impact position may be controlled by means of a movable optical element. Examples of optical elements are a movable mirror, a movable lens, a movable prism, and a movable light conductive fiber.

[0020] In an embodiment, the carrier substrate may be moved along the laser ablation station in the transport direction during laser ablation. The movement may be continuous which is beneficial for the production capacity and moreover, with continuous movement of the carrier substrate the risk of damaging the ultrathin carrier substrate is minimized. [0021] In an alternative embodiment, the carrier substrate may be stationary relative to the laser ablation station during laser ablation.

[0022] In an embodiment, the laser beam may be tuned to a defined wavelength and a defined intensity, depending on a material of the carrier substrate and the electrically conductive layer. This may be done in combination with controlling the movement of the impact position of the laser beam over the electrically conductive layer with a defined speed so as effectively locally ablate the electrically conductive layer and simultaneously prevent damage to the carrier substrate. Thus an effective removal of parts of the electrically conductive layer may be effected while simultaneously preventing damaging the ultrathin carrier substrate, for example as a consequence of burning.

[0023] In a further elaboration of this embodiment, the defined wavelength of the electromagnetic radiation ranges between 100 nanometer (nm) to 2500 nm.

[0024] In an embodiment of the method, the bonding of the RFID-chip to the carrier substrate thereby creating an electrically conductive connection between the RFID-chip and the antenna may be effected by: - applying an anisotropic layer or paste at least on bonding areas of the electrically conductive pattern before placing the RFID-chip on the carrier substrate; and

- applying pressure on and optionally supply heat to on the RFID-chip at the bonding areas to create the electrically conductive connection between the RFID-chip and the antenna.

[0025] In a first further elaboration of this method, the anisotropic layer may be applied over at least the entire area of the electrically conductive layer and optionally over the entire surface of the carrier substrate. The anisotropic conductive layer is substantially not electrically conductive in a direction parallel to a main plane of the carrier substrate and is electrically conductive in a direction perpendicular the said main plain at the bonding areas due to the applied pressure and the optionally supplied heat. Thus, in a very effective manner an electrically conductive connection can be created between the contact areas of the RFID-chip and the antenna formed by the pattern in the electrically conductive layer. This may be effected in a manner in which the risk of damaging the ultrathin carrier substrate is minimized.

[0026] In a second further elaboration which is an alternative to the first further elaboration, the anisotropic paste may be applied locally at the bonding areas and is substantially not electrically conductive in a direction parallel to a main plane of the carrier substrate and is electrically conductive in a direction perpendicular the said main plain at the bonding areas due to the applied pressure and the optionally supplied heat. This second further elaboration requires a very delicate application of the anisotropic paste without damaging the ultrathin carrier substrate during the application of the anisotropic paste. This may be achieved by an automated paste dispensing station.

[0027] In an embodiment of the method according to the invention, the flexible substrate including the RFID-tag may be used to make a packaging thereof, wherein the flexible substrate is an integral part of packaging material of the packaging. Such a packaging may be low cost and is identifiable by virtue of the RFID-tag which is incorporated therein. The costs may be so low that the packaging can be a disposable packaging. For instance, for packaging instant foods, like instant soup or in fact any other product. The packaging may be a paper packaging or a carton packaging and it is feasible that the carrier substrate with the antenna and the RFID-chip is laminated on another layer, e.g. for the formation of bags and similar articles, e.g. for food packaging. Each and every item that is contained in such a packaged can be tracked and traced along the various stages of their life time. For example, a database can be provided in which that is connected via the internet to wearable devices such as smartphones which run a special track and trace application. Thus, location, time, type of facility etc. can be stored for each package and thus, the whole life of the package can be followed. For example, when it is manufactured, when and to which location it is transported, when it arrives in the shop, when it is sold, and finally even when it is used or disposed of.

[0028] In an embodiment, the method may further comprise bonding additional electrical components other than an RFID-chips to the electrically conductive pattern, wherein the electrical components are chosen from the group comprising: energy harvesting components, energy storage components, graphic data components, sensors, biosensor components, electronic components, and electro mechanical components. Thus, the functionality of the flexible substrate including the RFID-tag may be increased, for example because it can harvest and store energy, measure conditions of the environment, e.g. temperature, CO-content, humidity, etc.

[0029] An embodiment of the apparatus according to the invention may comprise a layer application station configured for applying the electronically conductive layer onto the carrier substrate. The layer application station, when viewed in the transport direction, is positioned upstream from the laser ablation station. With the presence of such a layer application station it is possible to apply the electrically conductive layer in the same process with the formation of the antenna and the application of the RFID- chip. This reduces the handling of the ultrathin carrier substrate and thus diminishes the risk of damaging the carrier substrate.

[0030] In a further elaboration of this embodiment, the layer application station may be chosen from the group consisting of:

- a coating station;

- chemical vapor deposition station;

- atomic layer deposition station;

- printing station;

- stamping station;

- bonding station configured for bonding a conductive material onto the carrier substrate; and

- a transfer station configured for transferring of a metallic surface onto the surface of the carrier substrate. [0031] In an embodiment of the apparatus, the electronic controller may be configured to control the laser ablation station assembly to control the movement of the impact position of the laser beam by moving the impact position of the laser beam in a direction transverse to the transport direction and to control one or both of the laser ablation station and the carrier substrate transport assembly to control the movement of the impact position of the laser beam on the carrier substrate in a direction parallel to the transport direction. Thus, any desired pattern may be formed by removing the desired parts from the electrically conductive layer by means of laser ablation.

[0032] In a further elaboration of this embodiment, the laser ablation station may comprise a movable optical element of which the movement is controlled by the controller for controlling a travelling path of the impact position of the laser beam. The optical element may be a movable mirror, a movable lens, a movable prism, or a movable light conductive fiber. Such optical elements are relatively lightweight and can be moved with very low energy actuators. Thus, the energy consumption can be kept very low.

[0033] In an embodiment of the apparatus, the carrier substrate transport assembly thereof may comprise:

- an unwinder serving as carrier substrate supply, the unwinder including a first reel carrying the carrier substrate to be unwound from the reel by the unwinder;

- a rewinder comprising a second reel, the rewinder being configured to rewind the processed carrier substrate with the electrically conductive pattern and the RFID- chip to the second reel; and

- the electronic controller being configured to control the unwinder and the rewinder.

[0034] Such an embodiment makes a very efficient and secure production of a flexible carrier substrate with an antenna and an RFID-chip mounted thereon possible. High capacity production is feasible against very low costs and with a minimal risk of damaging the carrier substrate even when that is a ultrathin substrate, in particular thinner than 20 microns.

[0035] In an embodiment, the apparatus may comprise a bonding paste dispensing unit configured for locally applying a anisotropic paste, or alternatively, a bonding layer dispensing unit for at least locally applying an anisotropic layer on the carrier substrate, wherein the bonding paste dispensing unit is positioned downstream of the laser ablation station and upstream of the pick-and-place station.

[0036] In an embodiment, the apparatus may comprise curing station configured for low temperature curing anisotropic paste or anisotropic layer to bond the RFID-chip onto the antenna.

[0037] In an embodiment, the curing station may be a small thermal heating unit to cure the anisotropic paste or anisotropic layer.

[0038] In an embodiment, the curing station may be a light or UV-light unit which emits electromagnetic waves at a tuned wavelength to cure the anisotropic paste or anisotropic layer. In further elaboration of this embodiment, the light or UV-light unit may comprise an array of light emitting diodes. The light emitting diodes may be emit a focused bundle of light to a position where the anisotropic paste or anisotropic layer has to be cured. The electrically conductive layer from which the antenna is formed allows the penetration of the emitted wavelength through the metallized surface as it allows a translucency of 20 to 30%. This ensures the curing of the anisotropic bonding agent situated between the antenna area and the RFID-chip. The bounce of the emitted light on the RFID-chip and the electrically conductive layer may create a scatter of the light beam through the rest of anisotropic paste that may be a clear bonding resin thus enabling a better bond.

[0039] In a further elaboration, the tuned wavelength may be between 200nm and 600nm. In an further elaboration, the curing station may be configured to emit the electromagnetic waves for a predetermined timespan, thus curing the specially formulated anisotropic bonding paste or anisotropic bonding layer which is applied before placing the RFID-chip on carrier substrate with the pick-and-place station.

[0040] In an embodiment, the curing station may be an integral part of the pick-and- place station.

[0041] For the purpose of clarity, any one of the foregoing embodiments may be combined with any one or more of the other foregoing embodiments to create a new embodiment within the scope of the present disclosure.

[0042] These and other features will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings and claims.

BRIEF DESCRIPTION OF DRAWINGS [0043] For a more complete understanding of this disclosure, reference is now made to the following brief description, taken in connection with the accompanying drawings and detailed description, wherein like reference numerals represent like parts.

[0044] FIGS. 1A-1 B show cross-sectional view of a system for fabricating a patterned thin-film on an ultra-thin substrate in accordance with embodiments of the present disclosure.

[0045] FIGS. 2A-2B show cross-sectional view of a system for fabricating a patterned thin-film on an ultra-thin substrate using a laser beam in accordance with embodiments of the present disclosure.

[0046] FIGS. 3A-3B show cross-sectional view of a system for fabricating a patterned thin-film on an ultra-thin substrate in accordance with embodiments of the present disclosure.

[0047] FIGS. 4A-4B show cross-sectional view of a system for stacking carrier substrates to create an integrated electronic device in accordance with embodiments of the present disclosure.

[0048] FIG. 5 shows structurally schematic cross-sectional view of a system for manufacturing a continuous roll of an ultra-thin substrate in accordance with embodiments of the present disclosure.

[0049] FIG. 6 is a schematic flowchart of a method for fabricating a patterned thin- film on an ultra-thin substrate in accordance with embodiments of the present disclosure.

[0050] FIG. 7A to 7D show schematically an apparatus for manufacturing a continuous roll of an ultra-thin substrate in accordance with embodiments of the present disclosure.

[0051] Fig. 8 shows schematically an apparatus for manufacturing continuous rolls or sheets each including a patterned electrically conductive layer forming an antenna and an RFID-chip connected and bonded to the antenna to form an RFID-tag, wherein each sheet is thus provided with an associated RFID-tag.

DETAILED DESCRIPTION

[0052] In the following detailed description of the illustrative embodiments, reference is made to the accompanying drawings that form a part hereof. These embodiments are described in sufficient detail to enable those skilled in the art to practice the disclosure, and it is understood that other embodiments may be utilized and that logical structural, mechanical, electrical, and chemical changes may be made without departing from the spirit or scope of the disclosure. To avoid detail not necessary to enable those skilled in the art to practice the embodiments described herein, the description may omit certain information known to those skilled in the art. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the illustrative embodiments is defined only by the appended claims.

[0053] The present disclosure relates to devices and methods for forming electrically conductive patterns or an optically readable images onto an ultra-thin substrate by laser irradiation, in particular laser ablation. The disclosed approach allows for automated, serialized, and continuous production of such images and/or patterns on the substrates suitable for flexible and mono material applications with recyclable abilities and a thickness of less than 20 micron.

[0054] Conventional methods for forming electrically conductive images or patterns face limitations in achieving automated and continuous production when the carrier substrate is ultrathin, i.e. less than 20 micron thick. Standardized techniques applicable to a broad range ultra-thin sub-20 micron materials are currently impractical. For example, the current techniques use inkjet, offset, flexography, screen printing, tamponing, and thermal transfer printing. With the exception of inkjet and thermal transfer printing, other technologies use analog 'master images' where, among other things, the application of unique features can be carried out with drastic and/or labor- intensive measures. In addition, printing techniques using liquid/pasty inks are only applicable when a drying or hardening process is part of the whole and where the lifespan and flexibility of the applied image is difficult to guarantee. However, in all cases the material to be printed poses the greatest challenge, with material type, material composition, material surface, (pre)treatment, temperatures, post-treatment, but mainly the thickness of the material to be printed indicating the technical limits. The serial printing of substrates with electrically conductive images or patterns where the material thickness is below 20 microns and/or a material weight below 35 grams per square meter (gsm) of a single layer (i.e. a planar layer) has been impracticable.

[0055] Other alternative printing methods are described in which a layer of conductive material is adhered (e.g., glued, bonded, or deposited) to a carrier material, whereby, immediately prior to the application process or the bonding/hardening process, the image is punched or laser cut, and the residual material is removed as a roll. However, in these alternative methods, the thickness and material strength of the common conductive materials to be applied are limited to 5 microns (mono material film) and the punching or laser cutting takes place with the utmost precision. Also, the biggest challenge is the material properties and thickness limitations. The serial provision of substrates with electrically conductive images or patterns where the material thickness is below 20 microns or a material weight below 35 gsm has heretofore been unfeasible.

[0056] The latest known technology is either the use of a lamination process in which a completely uniform layer is applied to the substrate or a metallized substrate obtained by vapor deposition. In both cases, the substrate thus provided with an electrically conductive layer will be treated in such a way that an electrically conductive image or pattern is created. This treatment consists of creating the electrically conductive image or pattern by means of either a material dissolving substance or the influence of a focused and intense light beam, such as a laser beam, which, by means of a template, does not apply which separates parts of the metallized surface from the electrically conductive image or pattern. The material type, material composition, material surface, (pre)treatment, gluing, and temperatures offer more freedom with these techniques, but paper types with a material weight below 35 gsm quickly lose their structural integrity when using a solvent, and in the case of a focused and intense light beam, many common substrates in a stationary application pose a pyrotechnic hazard to the underlying substrate. In addition, the unused remains of the substrate must be removed, which can be done by rinsing with a release agent, adhesion transfer to another substrate, or, for example, brushing and suction by means of a vacuum. In addition, there is a high chance that the removal process will damage the electrically conductive image or pattern created.

[0057] In all of the above situations, fabricating electrically conductive images or patterns on ultra-thin substrates, less than 20 microns thick or weighting less than 35 grams, presents a significant technological challenge. Existing techniques often exclude paper substrates (i.e., cellulose fibers), as they typically require a material weight of more than 20 gsm. However, the main problem lies in the inability of known techniques and machines to achieve automated, serialized and continuous production of electrically conductive images and/or patterns on substrates which are suited for implementation within (flexible) mono material applications, or those with recyclable abilities and a thickness of a single layer (i.e. a planar layer) of less than 20 microns. Standardized production techniques applicable to a diverse range of sub-20 micron materials remain impractical within the current state of art.

[0058] Thus, to address the mentioned challenges, the present disclosure relates to devices and methods focused on forming electrically conductive patterns or optically readable images on ultra-thin sub-20 micron substrates, for example, cellulose-based paper substrate. This may be achieved by optical surface alteration of a metallic or carbon/graphene-like surface on the ultra-thin substrate. In one embodiment, the optical surface alteration may be used for, but not limited to, creating patterns for Internet-of- Things (loT), radio frequency identification (RFID)-based technologies, establishing conductive connection among electronic, electromechanical, sensors, or (bio)sensor components, and forming conductive tracks between components with electrical capacitance, and viable graphic data components like serial numbers, codes etc. The cellulose-based paper substrates are not only recyclable, simple, inexpensive, flexible, and lightweight to use, but also processes a unique combination of properties such as biodegradability, biocompatibility, and renewability. These features contribute to minimizing waste production and making it significant in an eco-friendly manufacturing practice.

[0059] In one embodiment, the present disclosure enables the creation of ultra-thin electronic devices made of a combination of the patterned carrier substrate and an RFID-chip. In one embodiment, the carrier substrates can be 'stacked' or 'layered' on top of each other to create an integrated electronic device or apparatus. The sub-20 micron thickness of the material has excellent properties to be embedded between two planar carrier substrates of the same material without having a noticeable protrusion, but enabling a distinct optical recognition similar to that of a watermark.

[0060] In one embodiment, the present disclosure describes the creation of a continuous, intermitting patterned, reel/roll made of a (multi)material with a certain thickness and width where the patterned surface is capable of harvesting, conducting, and emitting electrical currents. The manufactured object is suitable for, in-line, collation to/embodiment in other materials but can also be used as a freestanding device. In this manner, the present disclosure provides a continuous roll of ultra-thin substrate and a manufacturing method therefor. By means of the disclosed method, large quantities of ultra-thin substrate can be efficiently and continuously produced from roll to roll in large scales with low costs. In one embodiment, the continuous roll may be used in a reel-to reel production process, a reel-to-sheet production process, or a reel-to item production process.

[0061] The above illustrative examples are given to introduce the reader to the general subject matter discussed herein and are not intended to limit the scope of the disclosed concepts. The following sections describe various additional features and examples with reference to the drawings in which like numerals indicate like elements, and directional descriptions are used to describe the illustrative aspects, but, like the illustrative aspects, should not be used to limit the present disclosure.

[0062] FIG. 1 shows a cross-sectional view of a system 100 for fabricating a patterned thin-film in accordance with the present disclosure. As shown in FIG. 1 , the system 100 comprises a carrier substrate 102 and a metal layer 104. The carrier substrate may be an ultra-thin substrate and having a thickness of sub-20 micron. In one embodiment, the carrier substrate 102 may comprise cellulose, cellulose fibers, a polymer, or a combination thereof. In one embodiment, the carrier substrate is a paper. In an embodiment, the carrier substrate is sub-20 micron paper with a weight less than 15 grams made of virgin wood fiber. In an embodiment, the carrier substrate is sub-20 micron cellulose film made of renewable wood pulp and/or polymers include, but no limited to, sub-20 micron polyethylene terephthalate (PET) film, sub-20 micron polypropylene (PP) film, sub-20 micron polyethylene (PE) film, sub-20 micron acrylonitrile butadiene styrene (ABS), or a combination of the aforementioned.

[0063] As shown in FIG. 1 , the carrier substrate 102 includes a first surface 106 and a second surface 108 opposite to the first surface. In one embodiment, the metal layer 104 is then formed or disposed on the first surface 106 of the carrier substrate 102. In one embodiment, the metal layer 104 may be made of a metallic material or a carbon/graphene-like material. In one embodiment, an electrically conductive polymer may be disposed on the carrier substrate 102. In one embodiment, on the first surface 106 of the carrier substrate 102, an image or pattern is being made by optical surface alteration of the metal layer 104. In one embodiment, the metal layer 104 is disposed by means of coating, vapor deposition, rheologic, heat-transfer, printing, stamping, bonding of a conductive material onto the carrier substrate 102, retransferring of a metallic surface onto the first surface 106, or evaporation of a submicron conductive material onto the carrier substrate. In this manner, a nonconductive sub-20 micron carrier substrate 102 is made conductive by applying a metallic or carbon/graphene- like material onto the surface of the carrier substrate 102, making the carrier substrate 102 conductive on the treated surface side e.g., the first surface 106. In one embodiment, the metal layer is patterned with either a predetermined shape or an irregular shaped image, i.e. the metal layer 104 is either a solid shape with predetermined dimensions or a roughly shaped image 110.

[0064] In one embodiment, the optical surface alteration may be used for, but not limited to, creating patterns for radio frequency interaction, establishing conductive connection among electronic, electro mechanical, or (bio)sensor components, and forming conductive tracks between components with electrical capacitance or as viable graphic data components like serial numbers, codes, etc.

[0065] FIGS. 2A-2B show structurally schematic cross-sectional view of a system for fabricating a patterned thin-film in accordance with the present disclosure. FIG. 2A shows a system 200A comprises a carrier substrate 102, a metal layer 104, an image processing unit comprising a laser head 202, a galvanometer system 204, and a focus lens 206. The carrier substrate and the metal layer depicted in FIGS. 2A-2B are similar to the carrier substrate and the metal layer depicted in FIG. 1 . For the sake of brevity, a detailed description of these elements is not repeated herein. As shown in FIG. 2A, after the surface of the metal layer/film 104 is metallized by vapor deposition, printing, stamping, bonding (i.e. bonding with an electrically conductive film or foil), or retransferring of a metallic surface, the metal layer 104 is then exposed to an electromagnetic radiation emitted by the laser head 202 to form a patterned metal layer on the carrier substrate 102 by laser ablation.

[0066] In one embodiment, the laser head 202 is a laser source that generates an electromagnetic radiation or a high-power laser beam 208. The laser head 202 may comprise a fiber laser (having a power of 20 Watt), which generates the laser beam 208. In an embodiment, the laser beam 208 is a pulsed laser beam or a continuous wave laser beam. The pulsed laser beam 208 may adjusted by the galvanometer system 204 and the focus lens 206. In an embodiment, the electromagnetic radiation or the laser beam 208 is projected upon a surface of the carrier substrate 102 having the metal layer 104 formed thereon at a predefined/specified intensity, a predefined wavelength, or a predefined duration. In one embodiment, the laser beam 208 has a wavelength in the range of about 100 nm and about 2500 nm. In one embodiment, the wavelength may comprise one of a range between 100 nm-2500 nm, 500 nm-2000 nm, 750 nm-1500 nm, 860 nm-1260 nm, 960 nm-1160 nm, 1000 nm-1100 nm, 1050 nm-1070 nm, or about 1060 nm. In one embodiment, the laser beam has an infrared (IR) radiation wavelength preferably about 1060 nm. In one embodiment, the wavelength may occupy deep ultraviolet (DUV) region starting at 200nm towards/above the aforementioned IR spectrum (e.g., 1940nm).

[0067] In one embodiment, a predefined value of intensity, wavelength, or duration depends on a material of the carrier substrate 102, a material of the metalized layer 104, and the thickness of the metalized layer 104. In one embodiment, a traveling path of the laser beam 208 is predetermined depending on a pattern of the metal layer 104 to be transferred unto the substrate 102 and controlled by a computer. In this manner, the output signal from the laser beam 208 follows a digitally preconfigured path at a certain speed and is to a computer for monitoring and controlling the irradiation of the laser beam 208.

[0068] In one embodiment, the surface of the carrier substrate 102 can be metalized either entirely as a solid metallization or partially as a roughly shaped pattern, on specific areas. In one embodiment, the laser beam 208 pass through the carrier substrate 102 and are absorbed by specific portions of the metal layer 104, and being converted to heat energy. The specific portions of the metal layer are heated and molten to release from the carrier substrate by evaporation. In general, the disclosed method involves irradiating the metal layer 104 to be ablated above a temperature at which the specific portions can be vaporized while limiting the transfer of heat energy to other portions. In one embodiment, the laser will ablate the unwanted material. So, all the material surrounding the pattern/image will be evaporated to leave an electrically conductive pattern and optionally an optically readable image onto an ultra-thin substrate 102. In one embodiment, a traveling path of the laser beam 208 can be predetermined by a computer depending on a pattern of the metal layer 104 to be transferred onto the carrier substrate 102. In one embodiment, the shape/size/path of the laser beam 208 will ablate the metalized layer on its calculated trajectory. According to the physical and chemical composition of both the metal layer 104 and the carrier substrate 102, the predetermined settings of intensity, the wavelength, and duration of the laser beam 208 are tuned such that it only removes (ablate/evaporate) the metalized layer while the process does not destruct the structural composition and integrity of the carrier substrate 102. The treatment will result in the total evaporation of excess material 210 or area around the intended image/pattern and leave behind the intended image and/or conductive track and/or a graphic data component 212 on the carrier substrate 102. The material-supporting rear of the arrangement of FIG. 2A is constructed in such a way that it can cool the carrier substrate 102 and directly remove excess heat 214. Thus, to protect the carrier substrate 102, the excess heat must be dissipated. In one embodiment, a heatsink made of a material with excellent thermal conductivity is placed stationary under the carrier substrate 102, therefore diverting the heat and cooling the substrate.

[0069] FIG. 2B cross-sectional view of a system 200B for patterning of a roughly shaped metal layer 1 10 on the carrier substrate 102. All the elements depicted in FIG. 2B are similar to the elements depicted in FIG. 2A. For the sake of brevity, a detailed description of these elements is not repeated herein.

[0070] FIGS. 3A-3B show cross-sectional view of a system for fabricating a patterned thin-film in accordance with the present disclosure. The carrier substrate, the metal layer, and the light source depicted in FIGS. 3A-3B are similar to the carrier substrate, the metal layer, and the light source in FIGS. 2A-2B. For the sake of brevity, a detailed description of these elements is not repeated herein.

[0071] FIG. 3A shows a fully metallized substrate/reel converted into intermitting patterns or images of metallization. As shown in system 300A of FIG. 3A, after that, the ultra-thin, sub-20 micron carrier substrate 102 with the metal layer 104 is patterned via the laser beam 208, the ultra-thin, sub-20 micron carrier substrate 102 containing an electrically conductive pattern or an optically readable image 302 which can be used as a circuitry being capable for bonding/attaching either passive and/or active electronic components and/or energy harvesting and/or energy storage components onto that the electrically conductive pattern or the optically readable image 302. Thus, after metallization, the pattern/image 302 may establish one or more electrical interconnections between different parts on the surface of the carrier substrate 102 and/or may be populated with one or more semiconductor components such as a RFID chip, a RFID TAG, a RFID antenna. All other elements depicted in FIG. 3A are similar to the elements depicted in FIG. 2A. For the sake of brevity, a detailed description of these elements is not repeated herein.

[0072] FIG. 3B shows intermitting metallization on the carrier substrate/reel. The intermitting metallization involves selectively applying metallic coatings to specific areas of the carrier substrate 102 according to the desired patterns or images 304 in a discontinuous manner while the substrate is wound onto a reel. All other elements depicted in FIG. 3B are similar to the elements depicted in FIG. 2B. For the sake of brevity, a detailed description of these elements is not repeated herein. [0073] FIGS. 4A-4B show cross-sectional view of a system for stacking carrier substrates to create an integrated electronic device in accordance with embodiments of the present disclosure. The disclosed embodiments further enable the creation of ultra-thin electronic devices made either entirely of the fabricated carrier substrate(s) and/or a combination of the fabricated carrier substrate and electronic components. FIG. 4A shows a stage one for the creation of a stacked/layered circuity. The purpose of the layered circuitry is to manage conductive traces so they do not cause short circuits with other traces. In an embodiment, the layered circuitry eliminates technical challenges for mounting surface mount devices (SMDs) like chips, capacitors, resistors etc. on small footprints. In an embodiment, the layered circuitry helps improve antenna reception by allowing for the creation of longer antennas with a confined space. This can be achieved by stacking multiple layers of carrier substrates and connecting them with vias. As shown in FIG. 4A, the system 400A depicts two carrier substrates 402 and 404 being stacked 406 or layered on top of each other to create an integrated electronic device 408. The sub-20 micron thickness of the material has excellent properties to be embedded between two planar carrier substrates of the same material without having a noticeable protrusion but enabling a distinct optical recognition similar to that of a watermark.

[0074] FIG. 4B shows a system 400B for stacking carrier substrates to place semiconductor components in accordance with embodiments of the present disclosure. FIG. 4B shows a stage two, wherein semiconductor components or SMDs 410 are mounted on top of two stacked layers 412 with specific patterning.

[0075] In one embodiment, the stacked sub-20 micron flexible carrier substrates where electrically conductive pattern on an upper layer of the first carrier substrate 404 can overlap a pattern of a lower or an underlying layer of the second carrier substrate 402. The upper layer has a cut-out, revealing the two connecting leads from the lower layer. To make a connection between the upper and lower layers, a cut or a via 416 is made in the upper layer. The SMD 410 is then placed/bonded on top of the two layers i.e. on the via 416. In one embodiment, the via 416 is then filled with an electrically conductive material, creating a connection between both layers. This results in a configuration 414 where the connectors of the SMD 410 are physically/electrically connected to both layers i.e. the upper layer of the first carrier substrate 404 and the lower of the second carrier substrate 402. In one embodiment, the cut or via 416 may be large enough to reveal several patterns that can be populated or connected by placing the SMD 410 onto those patterns. In an embodiment, the top view of FIG. 4B shows the carrier substrate and circuitry of the upper layer 418, a part of the carrier substrate and circuitry of the lower layer 420, and the bonded SMD 422.

[0076] FIG. 5 shows a cross-sectional view of an apparatus 500 for manufacturing roll-to-roll, also referred to as reel-to-reel, ultra-thin substrates in a continuous manner in accordance with embodiments of the present disclosure. In one embodiment, the system 500 allows for automated, serialized, and continuous production of such images and/or patterns on the substrates suitable for flexible and mono material applications with recyclable abilities and a thickness of sub-20 micron. The present disclosure describes the creation of a continuous, intermitting patterned, roll made of a (multi)material with a certain thickness and width where the patterned surface is capable of harvesting, conducting, and emitting electrical currents. The manufactured object is suitable for, in-line, collation to/embodiment in other materials but can also be used as a freestanding device. The disclosed methods can be advantageously performed in a roll-to-roll fabrication method because ultra-thin substrates can be processed from a roll while unwinding, processing, and rewinding. By this, large quantities of ultra-thin substrate can be efficiently and continuously produced from roll to roll in large scales with low costs. In one embodiment, the continuous roll may be used in a reel-to reel production process, a reel-to-sheet production process, or a reel- to item production process.

[0077] As shown in FIG. 5, the apparatus 500 comprises a continuous reel 502, an unwinder 504, an image processing unit 506, and a rewinder 508. The continuous reel 502 comprising an unprocessed carrier substrate starts unrolled on the unwinder 504, undergoes the processing steps in the image processing unit 506, and then finished product is re-rolled onto the rewinder 508 coupled to the image processing unit 506. In one embodiment, the reel may comprise a substrate with a metallized film. The elements of image processing unit 506 depicted in FIG. 5 are similar to the elements depicted in FIG. 3A. For the sake of brevity, a detailed description of these elements is not repeated herein.

[0078] When the reel 502 travels from unwinder 504 to rewinder 508, various operations are performed on the reel by the image processing unit 506, such as printing, patterning, and ablation. The main parameters that need to be controlled for the image processing unit 506 are tension, speed of the reel 502, and the position of the intermitting patterns on the substrate. The image processing unit 506 may comprise a printing system, a laser head, a tensioning system, a patterning station, etc. In the processing zone, the unprocessed carrier substrate is led through the tensioning system towards the patterning station. The carrier substrate is then metallized with the meal layer by the printing system, and then ablated with the laser head. This will create the final pattern/image and serial number and or coding if applicable. During this process, there is also the option to demetallize non-applicable areas. Then, the rewinder 508 rewind/re-rolled the final product, i.e. a processed substrate to another reel 510, where the processed substrate is rolled up again in preparation for further processing such as placing/bonding components (e.g., SMDs/chips and/or embodiments between substrates) and for a cutting die, which will separate individual patterns/images.

[0079] In one embodiment, a fully metalized roll is printed/ablated/de-metalized and re-rolled. By means of the disclosed method, large quantities of ultra-thin substrate can be efficiently and continuously produced from roll to roll in large scales with low costs. In one embodiment, the continuous roll may be used in a reel-to reel production process, a reel-to-sheet production process, or a reel-to item production process.

[0080] FIG. 6 is a schematic flowchart of a method 600 for fabricating a patterned thin-film on an ultra-thin substrate in accordance with the present disclosure. In step 602, referring to FIG. 1 A, a carrier substrate is provided. The carrier substrate includes a first surface and a second surface opposite to the first surface. The carrier substrate 200 is an ultra-thin, sub-20 micron substrate, and may comprise cellulose, cellulose fibers, a polymer, or a composition thereof.

[0081] In step 604, referring to FIG. 1 A, a metal layer is deposited on the first surface of the carrier substrate. The metal layer, which may be a metallic or carbon/graphene- like surface, is formed on the carrier substrate by means of coating, vapor deposition, printing, stamping, bonding of a conductive material onto the carrier substrate, or retransferring of a metallic surface onto the surface.

[0082] In step 606, referring to FIG. 2A, an electromagnetic radiation is projected on the metal layer. The carrier substrate is then exposed to the electromagnetic radiation, such as a laser beam, emitting at a defined intensity/wavelength/duration, where the output follows a digitally preconfigured path at a certain speed. For example, a traveling path of the laser beam is predetermined depending on a pattern of the metal layer to be transferred unto the substrate and controlled by a computer. According to the physical and chemical composition of both the metallic material and the carrier substrate the intensity, the wavelength, and duration are tuned such as the process does not destruct the structural composition and integrity of the carrier substrate.

[0083] In step 608, referring to FIG. 3A, the laser treatment will selectively evaporate portions of the metal layer to leave an electrically conductive pattern, an optically readable conductive image, and/or a graphic data component on the surface of the carrier substrate. The metal layer is capable of absorbing laser light with a specific wavelength to convert the absorbed laser light to heat. Portions of the metal layer are heated and molten to release from the carrier substrate. The material-supporting rear of the arrangement is constructed in such a way that it can cool the carrier substrate and directly remove excess heat.

[0084] In an embodiment, referring to FIG. 4A, the method 600 may further comprise bonding electrical components to the conductive pattern or the image, wherein the electrical components comprise at least radio frequency identification (RFID) chips, and optionally energy harvesting components, energy storage components, or graphic data components, biosensor components, or electro mechanical components. The electrically conductive pattern formed from the electrically conductive layer at least forms an antenna which is electrically connected to the RFID-chip after placement of the RFID-chip on the carrier substrate.

[0085] In an embodiment, referring to FIG. 5, the method 600 may further comprise creating a continuous roll of the conductive pattern or the conductive image, wherein the continuous roll is used in a reel-to reel production process, a reel-to-sheet production process, or a reel-to item production process.

[0086] Figs. 7A to 7D show the unwinding unit 504 with the reel supplying the carrier substrate 102 with the electrically conductive layer 104. In laser ablation station 700, the electrically conductive pattern 212 is formed by a laser beam 208 which is moved over the electrically conductive layer 104. The electrically conductive pattern 212 forms an antenna 302 in this embodiment. Subsequently, in station 710 an anisotropic layer of paste 712 is applied at least on bonding areas of the electrically conductive pattern 212. After that, in pick-and-place station 720 an RFID-chip 722 is placed on the electrically conductive pattern 212 at the bonding areas and electrically and mechanically connected with the electrically conductive pattern by applying pressure on the RFID-chip 714 and optionally supplying heat to the bonding areas. Reference number 724 indicates a heat emitting device for curing an anisotropic paste or layer at the bonding areas. Alternatively, an array of light emitting diodes 726 may be present as shown. The light emitting diodes 726 may emit light at a predetermined wave length for a predetermined time period may to cure the anisotropic paste or anistropic layer at the bonding areas to connect the RFID-chip with the antenna. Thus, a continuous strip or web of carrier substrate with a plurality of antennas and RFID-chips bonded on that is manufactured. The web can form the basis for a package or packaging material including an RFID-tag.

[0087] Fig. 8A shows a first embodiment of an apparatus for manufacturing a web of packaging material. The apparatus comprises a first reel 810 on which a strip of a carrier substrate with RFID-tags 812 is mounted. This strip is manufactured with the method according to the invention. Additionally, two paper or polymer webs 814, 816 are supplied and the strip of carrier substrates is sandwiched between these two webs 814, 816 to form the packaging material. Later in the process, the web of thus formed packaging material may be cut into sheets which are indicated by the dashed lines in the Figure.

[0088] Fig. 8b shows a similar apparatus. However, in this case the paper or polymer webs 814, 816 are broader and two reels 810 with strips of carrier substrate with RFID- tags 812 are present. In the same way as in Fig. 8A, the two strips are sandwiched between the two webs 814, 816. Subsequently, a cutting operation may split the wide web into two separate webs each containing a strip of ultrathin carrier substrate including the RFID-tags 812. Again, optionally each web may be cut in separate sheets for example along the dotted lines which are indicated on the upper web 814 in the figure.

[0089] The above-disclosed embodiments have been presented for purposes of illustration and to enable one of ordinary skill in the art to practice the disclosure, but the disclosure is not intended to be exhaustive or limited to the forms disclosed. Many insubstantial modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the disclosure. For instance, although the flowcharts depict a serial process, some of the steps/processes may be performed in parallel or out of sequence, or combined into a single step/process. The scope of the claims is intended to broadly cover the disclosed embodiments and any such modification [0090] Attached is an appendix containing parts 1-10. These parts 1-10 are an integral part of this application and any inventions disclosed therein are part of the present disclosure.

APPENDIX

Part 1: Automated Continuous Thin Film Patterning

The formation of electrically conductive images or patterns onto ultra-thin, sub 20 micron substrates.

Introduction:

The recent trend towards the production of more sustainable products has laid a focus on the production of ‘printed electronics’ in its broadest sense. While this can be regarded as an ‘all-purpose word’, the definition does contain ‘print’ which is, according to the definitions from Oxford Languages, ‘an indentation or mark made on a surface’.

Basically, applying an indication or mark on a surface is where a circuitry starts and when this circuitry is electrically conductive, we will have constructed one of the basic elements of an electronic device, that is, a ‘printed circuit board’ (PCB).

Allas, history tells us that those PCBs are still made using toxics and the carbon footprint of the production thereof as well as the problems with the reuse/recycling of E-waste do not contribute towards a more sustainable world.

Definition of the problem:

Regarding the production of ‘printed electronics’ a significant focus is laid onto the development and manufacturing of electronic components such as Thin Film Transistors (TFTs), resistors, capacitors and even memory modules and Integrated Circuits (ICs), capable of calculating and executing instructed tasks, which ultimately will lead to a mass production of these components in the (near) future.

On the other hand, the development and production of flexible electronics, named ‘flex circuits’ has already established its presence and flexible printed circuits (FPC) and flexible flat cables (FFCs) are used widespread.

Both of the above-mentioned application areas experience the same problems regarding the production of components that:

A. Are as thin and compact as possible,

B. make use of the currently available printing techniques,

C. guarantee a specific lifespan and quality,

D. may not be manufactured at the expense of the environment, and

E. do not have a negative impact on recyclability.

Therefore, the main problem with the current state of the art is that the techniques and machines known and used until this invention do not allow automated and continuous production of electrically conductive images and/or patterns on substrates with a thickness of less than 20 microns. In addition, it is currently virtually impossible to use only 1 standardized production technique in which these conductive images or patterns can be manufactured on a wide range of ultra-thin, sub 20 micron material types. And because of the following:

The current state of knowledge describes, on the one hand, the knowledge of providing substrates with an image using techniques such as inkjet, offset, flexography, screen printing, tamponing and thermal transfer printing.

With the exception of inkjet and thermal transfer printing, these technologies use analog 'master images' where, among other things, the application of unique features can only be carried out technically with very drastic and/or labor-intensive measures. In addition, printing techniques using liquid/pasty inks are only applicable when a drying or hardening process is part of the whole and where the lifespan and flexibility of the applied image is difficult to guarantee.

However, in all cases the material to be printed poses the greatest challenge, with material type, material composition, material surface, (pre)treatment, temperatures, post-treatment, but mainly the thickness of the material to be printed indicating the technical limits. The serial printing of substrates with electrically conductive images or patterns where the material thickness is below 20 microns or a material weight below 35 grams per square meter (gsm) has, until now, been virtually impossible.

On the other hand, methods are described in which a layer of conductive material is glued to a carrier material, whereby, immediately prior to the application process or the bonding/hardening process, the image is punched and the residual material is removed as a roll.

Here too, there are technology-specific challenges where the thickness of the materials to be bonded is decisive. For example, the thickness and material strength of the common conductive materials to be applied are limited to 5 microns (mono material film) and the punching must take place with the utmost precision.

Also, the biggest challenge is the material type, material composition, material surface, (pre)treatment, bonding, temperatures, post-treatment, but mainly the thickness of the material to be printed, indicating the technical limits. The serial provision of substrates with electrically conductive images or patterns where the material thickness is below 20 microns or a material weight below 35 gsm has heretofore been virtually impossible.

The latest known technology is either the use of a lamination process, the application of which has already been briefly described above, and in which a completely uniform layer is applied to the substrate or a metallized substrate obtained by vapor deposition.

In both cases, the substrate thus provided with an electrically conductive layer will be treated in such a way that an electrically conductive image or pattern is created. This treatment consists of 'etching' the electrically conductive image the pattern by means of either a material dissolving substance or the influence of a focused and intense light beam, such as a laser beam, which, by means of a template, does not apply which separates parts of the metallized surface from the electrically conductive image or pattern.

The material type, material composition, material surface, (pre)treatment, gluing, and temperatures offer more freedom with these techniques, but paper types with a material weight below 35 gsm (but also above) quickly lose their structural integrity when using a solvent, and in the case of a focused and intense light beam, many common substrates in a stationary application pose a pyrotechnic hazard to the underlying substrate. In addition, the unused remains of the substrate must be removed, which can only be done by rinsing with a release agent, adhesion transfer to another substrate, or, for example, brushing and suction by means of a vacuum. In addition, there is a high chance that the removal process will damage the electrically conductive image or pattern created.

Conclusion of the problem:

In all of the above situations, the fabrication and formation of electrically conductive images or patterns on ultra-thin substrates, manufactured with either a thickness of less than 20 microns or a material weight of less than 35 gsm, is a technological challenge. In addition, in accordance with the current state of the art, a substrate with a thickness of less than 20 microns when using a paper (cellulose fiber-containing) substrate should almost exclusively have a material weight of less than 20 gsm, which many of the techniques described above excludes.

However, the main problem with the current state of the art is that the techniques and machines known and used up to this invention do not allow automated, serialized and continuous production of electrically conductive images and/or patterns on substrates which are suited for implementation within (flexible) mono material applications, or which are even containing recyclable abilities, with a thickness of less than 20 microns. In addition, it is currently virtually impossible to apply only 1 standardized production technique in which these conductive images or patterns can be manufactured on a wide range of ultra-thin, sub 20micron, material types.

In summary, (i) currently electronic circuitries are manufactured on ‘resin filled boards’ or thick flexible ‘slabs’ made from plastic and copper; (ii) the shrinkage of surface mount semiconductor components (SMTs) requires less energy in current/volts/amps than ever before so those ‘over dimensioned’ circuits are unnecessary. So, if you don’t’ need it and it costs you materials/money/environment, then get rid of it; (iii) current technologies are based on ‘board’ and ‘component’ handling instead of a continuous flow. So low speed versus optimized speed; (iv) current technologies are not allowing embodiment of electronic circuitry into organic/curved shaped items; and (v) current technologies are hardly considered as recyclable/eco-friendly.

Detailed description of the invention:

The present invention relates to the formation of an image or pattern being capable of electrical conductivity onto ultra-thin, sub 20 micron, carrier substrates in a continuous process. The image or pattern is being made by optical surface alteration of a metallic or carbon/graphene-like surface where the metallic or carbon/graphene- like surface is disposed by means of coating, rheologic- and/or heat-transfer and/or evaporation of a submicron conductive material onto the carrier substrate (Fig. 1), the latter being either cellulose, cellulose fibers, a polymer or a composition of the aforementioned (1.). This optical surface alteration may be used for, but not limited to, creating patterns for Radio Frequency interaction and/or as a conductive connection between electronic and/or electro mechanical and/or biosensor components and/or as conductive tracks between components with electrical capacitance and/or as viable graphic data components like serial numbers, codes etc.

As said, a nonconductive sub 20micron substrate is made conductive by applying a metallic or carbon-like material onto the surface of the carrier substrate, making the carrier substrate conductive on the treated surface side. This method can be either by applying a coating, rheologic- and/or heat-transfer and/or vapor deposition of a submicron conductive metallic material onto the carrier substrate as either a solid shape with predetermined dimensions (2.) or as a roughly shaped image (3.). The carrier substrate is then exposed to a high-power light source (Fig. 2a and/or Fig. 2b) emitting at a predefined intensity/wavelength/duration (4), where the output follows a digitally preconfigured path at a certain speed (5) and wherein the materialsupporting rear of the arrangement is constructed in such a way that it can cool the substrate and directly remove excess heat (6).

According to the physical and chemical composition of both the metallic material and the carrier substrate the intensity, the wavelength and duration are tuned so the process does not destruct the structural composition and integrity of the carrier substrate. The treatment will result in the total evaporation of excess material (7), leaving behind the intended image and/or conductive track and/or a graphic data component (8).

The end result will be an ultra-thin, sub 20micorn carrier substrate (Fig. 3a and/or Fig. 3b) containing a conductive pattern (9) which can be used as a circuitry being capable for bonding/attaching either passive and/or active electronic components and/or energy harvesting and/or energy storage components onto that pattern.

The invention enables the creation of ultra-thin electronic devices made either entirely of the fabricated carrier substrate(s) and/or a combination of the fabricated carrier substrate and electronic components. Ultimately the carrier substrates can be 'stacked' or 'layered' (Fig. 4a and/or Fig. 4b) on top of each other (10 & 11) to create an integrated electronic device or apparatus (12) where semiconductor components are placed/bonded in such a way that a component (13) connects 2, or more, ‘stacked’ or ‘layered’ substrates containing its specific patterning (14).

The invention describes the creation of a continuous, intermitting patterned, reel made of a (multi)material (Fig. 5) with a certain thickness and width where the patterned surface is capable of harvesting, conducting and emitting electrical currents. The manufactured object is suitable for, in-line, collation to/embodiment in other materials but can also be used as a freestanding device.

The manufacturing of electrically conductive patterns such as circuitry or antennas on a sub 20micron carrier substrate where the surface around the pattern is removed by means of evaporation. The carrier substrate is made of either cellulose, cellulose fibers, a polymer or a composition of the aforementioned with a maximum thickness of 20micron. The surface of the film is metallized by vapor deposition and/or printing and/or stamping and/or bonding (with an electrically conductive film or foil) and or retransferring of a metallic surface.

The film is fabricated as a nearly 2-dimensional continuous roll which can be reeled for use in specialized Reel to Reel (15) and/or Reel to Sheet and/or Reel to Item production methods.

The surface of the carrier substrate can be metalized entirely, as a solid metallization, or partially, as a roughly shaped pattern, on specific areas. Both prior to the exact patterning procedure by means of evaporation of unwanted material.

The evaporation is caused by projecting a laser beam, tuned to a specific wavelength, intensity and duration, onto the surface. The settings will cause the evaporation of the area around the intended image/pattern, thus leaving a technically functional image on the carrier substrate.

After shaping, the pattern can be 'populated' with one or more semiconductor components such as a RFID chip. The latter creates a ultra-thin planar (nearly 2 dimensional) RFID TAG.

The sub20 micron thickness of the material has excellent properties to be embedded between 2 planar (again nearly 2 dimensional) carrier substrates of the same material without having a noticeable protrusion but enabling a distinct optical recognition similar to that of a watermark.

Part 2: Automated Continuous Manufacturing of Thin Film RFID Devices

The invention relates to a method and apparatus for the selective manufacturing of Radio Frequency IDentification (RFID) devices onto sub 20 micron substrates in a continuous manner.

Introduction:

The use of RFID technology has taken off in recent years. In addition to the use for marking and tracing properties (Asset Management), which has been a standard for years, the areas of application are growing, in particular in the identification and authenticity assurance of Fast-Moving Consumer Goods, and therefore also the required numbers of passive RFID tags (hereinafter referred to as RFID tag) required for this technology, annually with solid figures. This means that global production of RFID tags must keep up with increasing demand.

The potential applications of RFID tags are numerous, but there are also obstacles that contribute to the fact that RFID technology cannot, or cannot quickly, become a success in every intended area of application. This partly has to do with available production capacity/production speed, but also partly as a result of environmental requirements and in particular the dimensional properties and production method of the available RFID tags.

Definition of the problem:

Current production methods for the manufacture of passive RFID tags involve the serial production of individual RFID tags on a roll whereby a base substrate is provided with an electrically conductive pattern in such a shape and size that it can be used/functions as antenna. This antenna is then provided with an RFID chip/lntegrated Circuit (IC) using a Pick & Place technology and a mounting medium, such as an electrically conductive epoxy or other type of welding technology, that ensures a closed electrically conductive circuit. The antenna in an RFID tag is constructed of either a thin foil/wire of copper or aluminum which is bonded and then formed onto a supporting material, or a substrate which is printed with electrically conductive ink and where the image is formed in the shape and functionality of an antenna. The RFID chip subsequently placed on this antenna has approximately the physical dimensions of approximately an average grain of sand and causes only a very small bump in the surface of a finished RFID tag.

The technology described above reflects the state of the art known to date, in which individual RFID tags are produced which, in the most common situations fabricated as a series of individual RFID tags after applying a self-adhesive adhesive layer and ‘cutting’ the individual RFID tag, are produced on a roll on a temporary carrier (usually in the form of a release liner). This roll can then be unrolled and an RFID tag can be removed, piece by piece.

Another creation is the formation of separate tags, with or without a self-adhesive glue layer and release liner, but also sheets of specific dimensions with, such as but not limited to, a Legal/A4 paper size and embedded RFID tag are possible. The final and outside category is the creation of an elongated 'wire antenna', equipped with an RFID chip, embedded between a number of polymer layers and provided with a self- adhesive layer and a release liner.

However, as already concluded in Part 1 - Automated Continuous Thin Film Patterning (described in detail herein), these current technologies are not sufficient enough to place RFID tags on a carrier in an automated and serialized manner, with a composite thickness of substrate and antenna, thinner than 20micron to produce.

Conclusion of the problem:

On the one hand, the current state of technology does not offer the possibility of achieving substantially faster production of RFID tags without investing in machines for just more, bulk, production capacity. The current technology is, so to speak, limited in terms of the methodology of how the antennas of the RFID tags are made.

On the other hand, the current production method of almost individually removable RFID tags, acts as an obstacle to application within a production process where the processing speed of the product on which the RFID tag must be applied is the crucial/limiting factor. In many industrial processes, such as the packaging industry, speed is an essential part of production costs. The speed cannot be reduced here, for economic and sometimes also technical reasons.

There are also challenges on a technical level in the current situation. The thickness of an RFID tag, as a composition of substrate, antenna, chip and possibly a substrate as a cover, can have such a bulking effect that it will cause problems in a further production process or that it will have an adverse or disturbing aesthetic effect in the end product.

The economic issue also arises where the number of raw materials used for the production of an RFID tag increases exponentially with a global increase in production/demand. The costs may be negligible for some quantities, but with increasing demand, raw material prices, such as copper or aluminum, which are already sensitive to fluctuations, may also come under pressure.

Finally, there are environmental concerns regarding the material composition of RFID tags. As more and more emphasis is placed on the recycling of used products and materials, there is a growing demand for 'raw material uniform' products, for example a mono-material product as well as products that focus on the use of raw materials and/or the cleanest possible method of production. A new industrial standard as described below could be the answer.

In summary, (i) the currently used RFID tags are made like a ‘pancake’ or ‘mattress’. They are mostly thick, inflexible and bulky; (ii) current production is based on label converting technologies and therefore mostly suitable for the manufacturing of ‘stickers’, not Product Embedded Identifiers as a continuously embeddable solution; (iii) implementing current technologies into a full speed production is like continuously slamming the brake, it’s just stop, wait, step and repeat; and (iv) current technologies are hardly considered as recyclable/eco-friendly. Detailed description of the invention:

The invention describes the manufacturing process of a continuous, ultra-thin, sub 20 micron, substrate containing intermitting patterns of formulated electrically conductive images or patterns, containing at least one Semiconductor UID per pattern, intended for the conceptual and structural integration onto one or between two or more substrates to coalesce into a comprehensive, unified structural roll of RFID enabled material.

As said, a continuous sub 20 micron substrate made of paper, a polymer or a combination thereof containing either a fully or intermitting metallized or carbon/graphene-like coated, electrically conductive, surface of a certain width is being fed into the apparatus in a continuous manner (Fig. 1).

The substrate (1) is then patterned (2) on predefined positions according to a digital instruction by means of an optical surface alteration (3) as described in Part I - Automated Continuous Thin Film Patterning, therefore resulting in a predefined image on a predefined position of the substrate (4) with the capabilities of receiving and transmitting energy on a predetermined radio frequency/bandwidth. The digital instruction also enables the creation of readable unique serial numbers and/or codes in or adjacent to the image.

An interposing material (Fig. 2) with adhesive, anisotropic and electrically conductive properties (5) is then applied on a predefined location of the patterned substrate, enabling the placement of a Integrated Circuit (IC) containing at least an Unique Identity and being capable of interaction on the bandwidth level of the patterned electrically conductive image (6).

After placement of the IC the, so created, RFID Tags on the continuous substrate are then secured by bonding the IC, the interposing material and the patterned surface by means of a predetermined amount of heat and pressure, thus creating a strong bonding with full electrical conductivity and functionality of the forementioned items. Alternatively the bumps of a placed IC can be fused onto the bare metalized surface of the substrate by a, exactly positioned and formed, light flash or laser pulse of a specific wavelength, intensity and duration. The wavelength does not interfere with the substrate but liquifies the metallized surface of the substrate and the connecting bump for a ultrashort moment of time, enabling a permanent weld of the IC to the substrate while maintaining electrical conductivity and functionality.

The created wireless communication devices, being described as largely being a sub20 micron multi-material coalescence with covalent characteristics, can be used as a unified structural roll (Fig. 3) consisting of HF, UHF or Dual Frequency Tags (7) extremely suitable for being embedded between 2 planar (nearly 2 dimensional) substrates of (the same) material without having a noticeable protrusion and eventually enabling a distinct optical recognition similar to that of a watermark.

Machine

The machine is made of several stations, each with their specific steps in the manufacturing process. First a Reel containing the unprocessed substrate and matching the width of the, to be created, pattern/image is placed onto the unwinder station of the machine. The substrate is then led through a tensioning system towards the patterning station. This will create the final pattern/image and serial number and or coding if applicable. During this process there is also the option to demetallize non-applicable areas.

In the following step the substrate is led through a position indicator and optical imaging system for reading/controlling/storing the serial number and/or coding. The feedback of the position system is used for the exact interm ittence in the sequence. As the patterning process requires a certain amount of time, the adhesive layer is being applied on the next station. This station interacts closely with the following placement station.

This placement station contains the supply of the ICs, the mechatronic and optical placement system for placing the ICs at the predefined positions and the bonding/fusing equipment. The last station consists of a Radio Frequency testing unit, a marking unit and a rewinder, for rewinding the processed substrate for later use.

Material

A continuous roll of sub 20micron substrate made of paper, a polymer or a combination thereof containing either a fully or intermitting metallized or carbon/graphene-like coated, electrically conductive, surface of a certain width is being fed into the apparatus in a continuous manner.

The substrate is then patterned on predefined positions according to a digital instruction by means of an optical surface alteration as described in Part 1 - Automated Continuous Thin Film Patterning.

An interposing material with special adhesive and conductive properties is applied on a predefined location of the substrate and an Integrated Circuit (IC) is then placed on top of the interposing material which is followed by additional bonding with heat and pressure for a specific amount of time.

Alternatively, the IC can be placed onto a predefined location of a bare metallized surface/substrate whereafter the bonding requires pressure and a, exactly positioned and formed, light-flash or laser-pulse of a specific wavelength, intensity and duration which will enable the fusion of the IC with the bare metalized surface of the substrate.

The created continuous Reel of sub20 micron substrate of a certain width now contains RFID tags on predetermined intervals. These Reels can be processed onto/into another continuous substrate, such as a packaging material, at a time to be determined.

Part 3: Product Integration of Thin Film RFID Devices

The invention relates to a manufacturing methods for continuous packaging material containing a Wireless Identification Devices with optional serial numbering and/or identification code(s).

Introduction:

A noticeable trend within the Fast-Moving Consumer Goods (FMCG) sector includes an increasing use of passive RFID technology for labeling garments, specifically retail clothing. In addition, and partly due to the success of implementations within the mentioned segment, there is growing interest in labeling/identifying other retail products such as electronics, furnishings, home appliances, and so on. The mandatory requirements regarding the use of RFID technology in packaging, as seen at large retailers recently, clearly indicate the changes to come.

In addition, the increasingly strict laws and regulations in the field of the use of packaging and packaging materials. The associated requirements for recycling, including the Ell Green Deal and the Waste Directive, are direct examples of this and therefore provide an incentive to take steps within the packaging industry to achieve more sustainable products. Moreover, and partly as a result of the upcoming rules on Extended Producer Responsibility (EPR), an increasing number of producers of (daily) consumer goods and foodstuffs are also forced to join these developments.

In turn, these developments offer innovation opportunities in areas where the use of RFID already has made its mark such as the supply chain and logistics sector, where people have built up years of experience in the field of RFID in warehouses, among other places. The domino effect for the application of this technology, within and between the various sectors, is therefore growing steadily.

As a result, these developments in turn offer extra innovation opportunities in sectors where the use of RFID has already made its mark, such as the supply chain and the logistics sector, and where people have built up years of experience in the field of RFID technologies. So, the domino effect for the adoption of this technology, overlapping within and between different sectors, has already been set in motion and is steadily growing in momentum.

Definition of the problem:

Current production methods for the manufacture of passive RFID tags involve the serial production of individual RFID tags on a roll whereby a base substrate is provided with an electrically conductive pattern in such a shape and size that it can be used/functions as antenna. This antenna is then provided with an RFID chip/lntegrated Circuit (IC) using a Pick & Place technology and a mounting medium, such as an electrically conductive epoxy or other type of welding technology, that ensures a closed electrically conductive circuit.

The antenna in an RFID tag is constructed of either a thin foil/wire of copper or aluminum which is bonded and then formed onto a supporting material, or a substrate which is printed with electrically conductive ink and where the image is formed in the shape and functionality of an antenna. The RFID chip subsequently placed on this antenna has approximately the physical dimensions of approximately an average grain of sand and causes only a very small bump in the surface of a finished RFID tag.

The technology described above is a reflection of the state of the art known to date, which ultimately only produces individual RFID tags which, in the most common situations, are provided with an adhesive layer as a series of RFID tags on a temporary carrier, (usually in the form of a release liner) are produced on a roll.

Another creation is the formation of separate tags, with or without a self-adhesive glue layer and release liner, but also sheets of specific dimensions with, such as but not limited to, a Legal/A4 paper size and embedded RFID tag are possible. The final and outside category is the creation of an elongated 'wire antenna', equipped with an RFID chip, embedded between a number of polymer layers and provided with a self- adhesive adhesive layer and a release liner. However, the initially mentioned new trend requires the application of RFID technology in separate (price) labels, packaging or even products, and a number of challenges immediately become visible. On the one hand, when applied in a continuous process, where either a Stop-Go technique or a continuous measurement/encoding of the position and placement moment of the RFID tag in/onto a material/item must take place (and which immediately creates an obstacle to the speedy production of labels, packaging or products), and on the other hand, in the current application, challenges arise due to, and among other things, the thickness of the individual RFID tags compared to the intended end product or precisely because there is a need to create an inseparable connection with the packaging material and/or an barrier shielding between RFID tag and contents of the packaging.

With regard to the above, one can speak of an accumulation of production-delaying and cost-driving events where one must be careful not to lose sight of the ultimate intended goal, possibly resulting in even greater economic and environmental damage.

Conclusion of the problem:

On the other hand, the current production method of almost individually removable RFID tags, acts as an obstacle to application within a production process where the processing speed of the product on which the RFID tag must be applied is the crucial/limiting factor. In many industrial processes, such as the packaging industry, speed is an essential part of production costs. The speed cannot be reduced here, for economic and sometimes also technical reasons. There are also challenges on a technical level in the current situation. The thickness of an RFID tag, as a composition of substrate, antenna, chip and possibly a substrate as a cover, can have such a bulking effect that it will cause problems in a further production process or that it will have an adverse or disturbing aesthetic effect in the end product.

Besides (other) economic factors there exists a substantial challenge in how to produce some form of an RFID-technology and/or RFID-tag that is easy to implement in high speed, continuous, production lines without drastic measures to incorporate it. In the best-case scenario, the best moment of implementation an RFID-tag during production is prior to assembly of a product. Hence the need for a commoditized approach spanning all sectors and segments.

Finally, there are environmental concerns regarding the material composition of those RFID tags. As more and more emphasis is placed on the recycling of used products and materials, there is a growing demand for 'raw material uniform' products, for example a mono-material product as well as products that focus on the use of raw materials and/or the cleanest possible method of production. A new industrial standard as described below could be the answer.

In summary, (i) the industry is dying for a solution that is so thin and so easy to implement it has hardly any impact on the current production lines and designs; (ii) again, implementing current technologies into a full speed production is like continuously slamming the brake, you need to merge the technology as early as possible in the manufacturing chain and you need to do this in a ‘flow’; (iii) laws and legislations are coming that will demand full recyclability or, minimally, the retrieval of product information how to recycle; (iv) try to counterfeit a packaging material that ‘own’s’ a digital identity/counterpart embedded into its core and controlled by a secure/remote ID record; and (v) current technologies are hardly considered as recyclable/eco-friendly.

Definition of the invention: The present invention relates to a continuous packaging material with embedded Wireless Identification Devices optionally containing an optically readable unique serial numbering and/or identification code(s) and the manufacturing method thereof. The present invention relates to a technique for mounting in-line in the Roll to Roll, Roll to Sheet manufacturing process of a planar (nearly 2 dimensional) substrate/base-material of a packaging body where the contents of the package body cannot get in contact with the Wireless identification Device after filling.

As said, the invention relates to a Wireless Identification Device in the form of a thread or a strip of pre-fabricated Wireless Identification Devices on a sub 20 micron substrate, as described herein (e.g., in Parts 1 and/or 2), to be embedded in a packaging material (Fig. 1) comprising a carrier material composed of cellulose, cellulose fibers, a polymer or a composition of the aforementioned, adhesive and a sealing material also composed of cellulose, cellulose fibers, a polymer or a composition of the aforementioned thus sandwiching the thread or strip between 2 protective layers (1). The thread or strip (2) is fabricated in such a matter that there is a predetermined distance and repetition of the Wireless Identification Devices so that a finished packaging material contains a device exactly on every, predetermined, location (3, 4).

This technology enables the uninterrupted addition of UIDs in the production of packaging materials that have yet to be printed and/or finished, without having to make any negative concessions in the quality and/or speed of the existing production- and/or supply- chain (Fig. 2). The quality, speed and processing options of existing packaging processes (5) are not disrupted by this application and even offer better assurance of maintaining quality and production requirements.

The end result will be a packaging material containing an embedded Wireless Identification Device with an unique serial number which can be read by means of a Radio Frequency Reading device on a predetermined frequency such as, but not limited to, the LF (128khz), HF (13.56mhz), UHF (840mhz to 960mhz) bandwidth or a combination of the forementioned.

The invention allows a product package to be produced having its own unique digital identity, which can be helpful in proving its authenticity. The invention can also provide insight into, but not limited to, the origin and/or composition of the contents and/or shelf life and/or stock management and/or the composition of the packaging materials itself.

First two bobbins containing the outer substrate/base-material and the inner substrate/base-material are placed onto the unwinder stations of a laminating machine.

Secondly one or more Reel(s) containing the pre-manufactured and functional Wireless Identification Devices is/are placed between the outer and inner bobbins on a predetermined position. The overall width of the bobbins and the design of the packaging dictate the number of reels and their respective positioning.

One or both substrate/base-material(s) is/are then led through a tensioning system towards the adhesive station. After applying the adhesive, the 3 components, being the outer material, the thread or strip and the inner material are being guided between the pressure rollers of the laminating station.

As a result, the materials are combined into a bonded whole, which, after setting, can be used in a regular production process.

In the following step the bonded whole is guided through a position indicator, one or more Near Field Radio Frequency Identification testing units and a, backlit, optical imaging system for reading/controlling/storing serial number(s) and/or coding(s) and/or marking(s). The feedback of the position system, combined with the reads of the Radio Frequency Identification units are used for measuring the exact interm ittence in the sequence.

In the prior mentioned step, the UIDs of the individual devices, the optically readable data and the position may be stored into a production database for further purposes.

The last station may consist of either a rewinding unit, a cutter/sheeter machine or other processing machine.

Part 4: Product Identification

Package containing a Wireless Identification Device with optional embedded serial numbering and/or identification code(s) providing a method for managing product information.

The present invention relates to a packaging constructed entirely from a material such as cellulose, cellulose fibers, a polymer or a composition of the aforementioned, wherein the packaging material is provided with a structurally integrated Wireless Identification Device containing a unique identity which can be read by means of a Radio Frequency IDentification reader in either, but not limited to, the LF (128khz), HF (13.56mhz), UHF (840mhz to 960mhz) bandwidth or a combination two or more of the forementioned. The invention provides the principles for the manufacturing of a product package suited for as for example, but not limited to, general consumer food, cosmetics, pharmaceuticals, daily necessities and miscellaneous goods, etc., and a product identification, authentication and information managing method in the respective stages of production, warehousing, distribution, retail, consumption and waste management/recycling which are performed by using the same.

The invention describes the areas of application of a produced product packaging, provided with its own unique digital identity which, as described herein (e.g., in Part 1 , 2, and/or 3), forms a structural and irremovable part of the packaging material within the entire economical and technical lifecycle of a product packaging.

As said, the invention ensures that product packaging has its own unique and digital identity, which in itself can make a multitude of measuring moments possible and through which an enormous amount of information can be collected and exchanged at such moments.

In contrast to available technologies such as a serial number, bar-, data-matrix and QR-codes which are printed on the outside of a package, the embodiment of a Wireless Identification Device into a package provides a secure and protected method of providing product authenticity up to a level of unique serialization (UID) which can easily be read by mainstream RFID middleware equipment like RFID readers and even smartphones.

This unique serialization, which is structurally embedded in the packaging, also enables new forms of data collection and interaction, which is the base of this invention. In addition, the technical possibilities of this invention enable the application of measuring points within, among other things, the production process, storage and distribution, issue/sale, use/consumption and recycling.

Because the technology is based on issuing unique serial numbers, a timeline full of events can be compiled for each item. The recognition of packaging at certain measuring moments within the production- and/or logistics chain, as well as within sales channels, can be stored per item in a digital logbook and used for later references.

Essentially the UID of a package can easily be scanned to retrieve certain events. The data from the logbook, uniquely linked to this specific UID, will then provide a clear picture.

A subsequent application is also made possible by this invention and that is the provision of specific product properties such as, but not limited to, shelf life, ingredients, composition and preparation method, recipes etc. to an (end) user/consumer.

The invention also makes it possible for a user to receive a clear notification for specific allergies when scanning the packaging. Therefore, the implementation of the Precautionary Allergen Labelling (PAL) standard is a viable option.

The invention also makes it possible for a manufacturer to communicate with an end user at consumption level. Consider an intelligent storage device that can recognize the UID of a package and which can subsequently alert the end user as well as the manufacturer/supplier to a low stock level, expiration date or a replacement time. In conclusion, it can be stated that packaging, provided with a unique and structurally connected identity that also functions as a 'key' between a physical object and the digital logbook of that physical object, is an innovative application for managing product information through a products entire lifecycle.

Detailed Description:

A package is provided with an identification medium. This medium consists of an RFID chip provided with its own unique identification code/serial number (UID).

This UID which is structurally embedded in the packaging acts as a 'handshake medium' between the physical package and its digital counterpart.

The digital counterpart can consist of a unique record in a database that is accessible, for example, via an RFID reader and middleware or an NFC-capable smartphone with or without an App.

The database can be filled with data which is collected by readers/middleware at predetermined moments in the lifecycle. These moments can be certain points in the production, distribution, storage, commerce (i.e. retail/shelving) but also in the consumer and post-consumer phase.

In addition to the existing data, if a UID location is known, data from other types of measurements can also be added to the database.

The combination of UID and data from the database can be used for authenticity checks but also for the release of relevant data applicable to, for example, but not limited to, warranty(s), origin of the content/product, use of the product , ingredients and/or allergy information.

At the end of the lifecycle (EOL) of the package the UID can be used for the package identification, at a technical level, in the recycling process. This will enable a non- Line-Of-Sight (non-LOS) and thus an optimized identification/sorting of reusable materials in the recycling chain.

Part 5: Quality & Integrity

Package containing a Wireless Identification Device with optional embedded serial numbering and/or identification code(s) providing a method for managing monitored product storage and handling conditions and safeguarding shelf-life/expiration treshold values.

The present invention relates to a packaging constructed entirely from a material such as cellulose, cellulose fibers, a polymer or a composition of the aforementioned, wherein the packaging material is provided with a structurally integrated Wireless Identification Device containing a unique identity which can be read by means of a Radio Frequency IDentification reader in either the LF (128khz), HF (13.56mhz), UHF (840mhz to 960mhz) bandwidth or a combination of the forementioned. The invention provides the principles for binding a specific packaging to the environmental values applicable at that time, which are measured by sensors, such as humidity, temperature, location and the like.

The data obtained from this binding can then be used to assess and ensure the quality of the product and, if necessary, predict a final shelf life.

For example, the association of a unique packaging ID with the in situ measured environmental values is suitable for, but not limited to, general consumer food, cosmetics, pharmaceuticals, daily necessities and miscellaneous goods, etc., and a method for product identification, authentication and information management at the respective stages of production, storage, distribution, retail, consumption and waste management/recycling carried out by using the same.

The invention describes the areas of application of a produced product packaging, provided with its own unique digital identity which, as described herein (e.g., in Part 1 , 2, 3, and/or 4), forms a structural and irremovable part of the packaging material within the entire economical and technical lifecycle of a product packaging.

As said, the invention ensures that product packaging has its own unique and digital identity (UID), which is recognizable in itself in a production and supply chain. Linking this digital identity to data obtained/stored by sensors within these chains will contribute to a more accurate quality and integrity monitoring of (a) packaging and/or (its) contents.

The invention enables a standardized chain of measuring moments whereby a packaging and/or its contents can in fact be monitored from production to end use and where gaps and conspicuous features within the chain can be easily identified. Finally, the calculated outcome of the combination of factors can help predict quality, shelf life and integrity and, if necessary, adjust a process to achieve predetermined values.

In contrast to available technologies such as bar-, data matrix and QR-codes which are printed on the outside of a package and which are sometimes easy to erase/reprint/manipulate, the embodiment of a Wireless Identification Device into a package provides a secure and protected method of providing product authenticity up to a level of unique serialization which can easily be read by mainstream RFID middleware equipment like RFID readers and even smartphones.

Basically the UID of a package can easily be scanned to retrieve certain events. The data from the logbook, uniquely linked to this specific UID, will then provide a clear picture. A further application, also made possible by this invention, is the possibility for an end user to receive a clear notification about specific events and/or expired expiration dates of the contents when scanning the packaging.

This includes warnings regarding deviating production variables and recalls.

In conclusion, it can be stated that packaging, provided with a unique and structurally connected identity that also functions as a 'key' between a physical object and the digital logbook of that physical object, is an innovative application for managing and controlling product quality and integrity through a products entire lifecycle.

Detailed Description:

This will enable a non-Line-Of-Sight (non-LOS) interaction and control mechanism where data is secured as a remote constituent of the interacting medium.

The database can be filled with data which is collected by readers/middleware and sensing equipment such as digital thermometers and the like at predetermined moments in the lifecycle. These moments can be certain points in the production, distribution, storage, commerce (i.e. retail/shelving) but also in the consumer and post-consumer phase.

The combination of UID, data from the database and data collected from sensor equipment can be used to calculate whether a product still, among other things, meets the minimum requirements for integrity, quality and/or predetermined shelf life.

The implementation of the obtained information in a rolling forecast also offers opportunities to dynamically adjust and/or improve emerging processes and/or events in the chain or to warn of future developments that could affect integrity and/or quality.

Part 6: Embedded TAX (optionally, paired with ‘Label TAX’ of Part 7)

Package including a wireless identification device with optional built-in serial numbers and/or identification code(s) that provide a method for tax identification and management of tax credit consumption.

The present invention relates to a packaging constructed entirely from a material such as cellulose, cellulose fibers, a polymer or a composition thereof, wherein the packaging material is provided with a structurally integrated Wireless Identification Device that contains a unique identity that can be read by means of a Radio Frequency IDentification reader in the LF (128 kHz), HF (13.56 MHz), UHF (840 MHz to 960 MHz) bandwidth or a combination of the above.

The invention provides the principles for manufacturing product packaging suitable for, for example, but not limited to, products subject to excise duties, such as addictive and/or stimulants such as, but not limited to, alcohol, tobacco and pharmaceutical products, specifically taxable consumer goods etc.

Furthermore, the invention provides a method for product identification, authentication and management/processing of fiscal information at the respective stages of production, storage, distribution, retail, consumption and waste management/recycling, as carried out using the invention.

The invention describes the areas of application of a produced product packaging, provided with its own unique digital identity which, as described herein (e.g., in Part 1 , 2, 3, 4, and/or 5), forms a structural and irremovable part of the packaging material within the entire economical and technical lifecycle of a product packaging.

Unlike available technologies such as bar, data matrix and QR codes which are printed on the outside of a package or applied as a label/seal to a package, the embodiment of a Wireless Identification Device in a package provides a safe and secure method of providing product authenticity to a level of unique serialization (UID) that can be easily read by regular RFID middleware equipment such as RFID readers or even smartphones.

This unique serialization, which is structurally embedded in the packaging, also enables new forms of data collection and interaction, which forms the basis of this invention. In addition, the technical possibilities of this invention enable the application of measuring points within, among other things, the production process, storage and distribution, (geographically and/or economically) predefined issue/sales points, use/consumption and recycling.

Basically, the UID of a package can easily be scanned to retrieve certain events. The data from the logbook, uniquely linked to this specific UID, will then provide a clear picture.

This invention also makes a subsequent application possible and that is to provide specific product properties such as, but not limited to, origin, shelf life, ingredients, composition, etc. to an (end) user/consumer. The invention also makes it possible for a user to receive a clear message regarding specific use, combinations of use and/or allergies when scanning the packaging.

This also makes the implementation of Precautionary standards, as a result of this invention, a viable option.

In conclusion, it can be stated that packaging, provided with a unique and structurally connected identity that also functions as a 'key' between a physical object and the digital logbook of that physical object, is an innovative tax management and tax control application with regard to specific products subject thereto throughout their life cycle.

Detailed Description:

The combination of UID and data from the database can be used for authenticity checks, but also for the release of relevant data applicable to, for example, but not limited to, taxes/duties paid, origin of the content/product, use of the product, the use of the product within predefined (geographical) limits such as 'geofencing', ingredients and/or allergy information. At the end of the packaging distribution process, the UID can be used at the point of sale/issue to mark the package identification as 'consumed' at a specific position in the database record. This registration of the ‘Tax Credit Consumption’ makes the existence of, possibly illegally copied, ghost products/ghost identities impossible. At the end of the lifecycle of the package the UID can be used for the package identification, at a technical level, in the recycling process. This will enable a non- Line-Of-Sight (non-LOS) and thus an optimized identification/sorting of reusable materials in the recycling chain.

Part 7: Label TAX (optionally, paired with ‘Embedded TAX’ of Part 6)

Product seal including a wireless identification device with optional, structurally embedded, serial number(s) and/or identification code(s) that provide a method for tax identification and management of tax credit consumption.

The invention describes the areas of application of a pre-produced tax stamp in the form of a label formed from composite materials, provided with its own unique digital identity which, as described herein (e.g., in Part, 1 , 2, 3, 4, 5, and/or 6), forms a structural part and which, after application, forms an irremovable and tamper-evident part with the packaging material within the entire economic and technical life cycle of a product packaging.

As said, the invention ensures that, after applying the label to product packaging, the packaging acquires its own unique and digital identity, which in itself makes a multitude of measuring moments possible and which allows an enormous amount of information to be collected and exchanged at such moments.

Unlike available technologies such as bar, data matrix and QR codes that are printed on the outside of a package or applied as a label/seal to a package, the structural embodiment of a Wireless Identification Device in the label makes an irreversible mounting of the label as well as clear tamper detection possible.

The composite structure of this label enables a secure method of providing product authenticity to a level of unique serialization (UID) that can be easily read by regular RFID middleware equipment such as RFID readers or even smartphones.

This unique serialization, which is structurally embedded in the label, also enables new forms of item-based data collection and interaction, which form the basis of this invention.

In addition to the use of predetermined measuring points in the regulated production and distribution process, the technical possibilities of this invention also enable the use of measuring points/reading equipment outside the aforementioned processes and these measurements may include checking data such as, but not limited to, the identification of a manufacturer, identification of a product, production process or product type and the identification of the origin of a product, its storage and distribution, (geographically and/or economically) predefined issuing/sales points, the tax payment status, tax payment authority, a tax payment amount and/or a tax payment date.

As a result, reading the UID on the label may include tax payment information, such as tax payment information from multiple tax authorities, and the invention may further enable, in the event of a suspected refill/counterfeit reuse, to determine the probability of validity of the item's consumption life.

Because the technology is based on issuing unique serial numbers, a timeline filled with events can be compiled for each item. The recognition of the label at certain measuring moments within the production- and/or logistics chain, as well as within sales channels, can be stored per item in a digital logbook and used for later references.

This invention also makes a subsequent application possible and that is to provide specific product properties such as, but not limited to, origin, shelf life, ingredients, composition, etc. to an (end) user/consumer.

The invention also makes it possible for a user to receive a clear message regarding health safety, specific use, combinations of use and/or allergies when scanning the label. This also makes the implementation of Precautionary standards, as a result of this invention, a viable option.

In conclusion, it can be stated that the label, provided with a unique and structurally connected identity that also functions as a 'key' between a physical object and the digital logbook of that physical object, is an innovative tax management and tax control application with regard to specific products subject thereto throughout their life cycle.

Detailed Description:

A package is provided with a label that is intended as an identification medium. This medium consists of an RFID chip with its own unique identification code/serial number (UID) and can, optionally, be provided with a unique 'embedded' coding such as an alphanumeric sequence and/or a QR code which, although also embedded within the label substrate, is optically and/or digitally readable on the surface of said label.

This UID, structurally embedded in the label which is irreversibly and visibly applied onto a package, acts as a “handshake medium” between the physical package and its digital counterpart. Furthermore an, optional, visible encryption can be used as additional verification and/or encryption key.

The combination of UID and data from the database can be used for authenticity checks, but also for the release of relevant data applicable to, for example, but not limited to, taxes/duties paid, origin of the content/product, use of the product, the use of the product within predefined (geographical) limits such as 'geofencing', ingredients and/or allergy information.

At the end of the packaging distribution process, the UID can be used at the point of sale/issue to mark the package identification as 'consumed' at a specific position in the database record. This renders the existence of, possibly illegally copied, ghost products/ghost identities or counterfeit refills virtually impossible.

Finally, at the end of the lifecycle of the package the UID can be used for the package identification, at a technical level, in the recycling process. This will enable a non-Line-Of-Sight (non-LOS) and thus an optimized identification/sorting of reusable materials in the recycling chain.

Part 8: Postal & Logistics

Packaging, a packaging label and/or stamp including a wireless identification device with optional, structurally embedded, serial number(s) and/or identification code(s) that provide a method for packaging identification, tracking, tracing and proof of delivery for use within Postal and/or Supply Chain Management systems.

The invention describes the areas of application of a pre-produced packaging, shipping/address label and/or stamp in the form of a an envelope, box, shipping/address label or postal stamp formed from composite materials, provided with its own unique digital identity which, as described in herein (e.g., in Part 1 , 2, 3, 4, 5, 6, and/or 7), forms a structural part and which, after application if relevant, forms an irremovable and tamper-evident part with the packaging material within the entire logistic, economic and technical life cycle of that relevant item.

As said, the invention ensures that an item, as provided/applied with the invention, acquires its own unique and digital identity, which in itself makes a multitude of measuring moments possible and which allows an enormous amount of information to be collected and exchanged within Postal and Supply Chain Management systems.

Unlike available technologies such as bar, data matrix and QR codes that are printed on the outside of a package or applied as a label/seal to a package, the structural embodiment of a Wireless Identification Device into the label makes an irreversible mounting of the label as well as clear tamper detection possible.

Furthermore, the invention has no risk of damage to optically readable information due to external influences such as scratches, mislabeling and/or contamination by foreign matters as the composite structure of this label enables a secure method of providing product authenticity and identity to a level of unique serialization (UID) that can be easily read by regular RFID middleware equipment such as RFID readers or even smartphones. This unique serialization, which thus functions as an integrated part of the article applied to, also enables new forms of item-based data collection and interaction, which form the basics of this invention.

In addition to the use of predetermined measuring points in the regulated production and distribution process, the technical possibilities of this invention also make it possible to produce items based on the principles of dynamic programming methods such as, but not limited to, algorithms such as Bellman-Ford and/or Dijkstra arrange these items in a supply chain in order to achieve the greatest possible return and efficiency in Postal and/or Supply Chain Management systems.

Because the technology is based on the issuance of unique serial numbers, a timeline filled with events can be created for each item by registering the item at certain measurement moments within the supply chain, but also the confirmation of receipt can be stored per item and made available for later reference.

In principle, the UID of a package can easily be scanned to display its origin, destination and measurement moments. The data from the logbook, uniquely linked to this specific UID, then provides a clear picture.

The invention also makes it possible for designated parties to receive clear notification at specific measurement points about the status of the item within Postal and/or Supply Chain Management systems.

This also makes the automated merging of individual shipments, whether or not in the form of groupage with equivalent region-based shipments, into a combined shipment as a result of this invention a viable option.

In conclusion, it can be stated that packaging, a packaging label and/or stamp, containing a unique and structurally connected identity that also functions as a 'key' between a physical object and the digital logbook of that physical object, is an innovative application for enabling specific products and/or services during the life cycle of the application. Detailed Description:

A package is provided with a label that is intended as an identification medium. This medium consists of an RFID chip with its own unique identification code/serial number (UID) and can, optionally, be provided with a unique 'embedded' coding such as an alphanumeric sequence and/or a QR code which, although also embedded within the label substrate, is optically readable on the surface of said label.

This UID, structurally embedded, acts as a “handshake medium” between the physical item and its digital counterpart. Furthermore an, optional, visible encryption can be used as additional verification and/or encryption key.

The database can be filled with data collected by readers/middleware at predetermined moments in the Postal and/or Supply Chain. These moments can be specific points in the distribution, storage, clearing (i.e. for combined shipment/groupage) but also for the transfer to the (end) recipient.

The combination of UID and database data can be used for authenticity checks, as well as for the release of relevant data applicable to, for example, but not limited to, taxes/duties paid, origin of content/product, transport regulations/warnings, shipping within or outside predefined (geographical) boundaries, etc.

At the end of the distribution process, the UID can be used to confirm that the item has been 'delivered' to a specific position in the database record. This makes the existence of potentially false claims, mistaken identity or counterfeit deliveries virtually impossible. Finally, at the end of the lifecycle the UID can be used for packaging material identification, at a technical level, in the recycling process. This will enable a non- Line-Of-Sight (non-LOS) and thus an optimized identification/sorting of reusable materials in the recycling chain.

Part 9: Waste & Recycling

Package made of an assembled, mono-material structure containing an integrated Wireless Identification Device, made from the same carrier material, that provides a method for retrieving package structure and raw material information, usable as an object-based wireless identification medium for automated separation by residue classification in recycling processes

The present invention relates to a packaging that is constructed entirely from a material such as cellulose, cellulose fibers, organic polymer or a composition thereof, wherein elements of the packaging material is composed as a structurally integrated Wireless Identification Device and that has a unique identity that can be read using a Radio Frequency IDentification reader in the LF (128 kHz), HF (13.56 MHz), UHF (840 MHz to 960 MHz) bandwidth or a combination of the above.

The invention provides the principles for the manufacture of a product packaging suitable for, for example, but not limited to, general consumer foods, cosmetics, pharmaceuticals, daily necessities and miscellaneous goods, etc., and a method for product identification, authentication and information management, at the respective stages of production, storage, distribution, retail, consumption and waste management/recycling carried out through its use.

The invention describes the areas of application of a produced product packaging, provided with its own unique digital identity which, as described herein (e.g., in Part 1 , 2, 3, 4, 5, 6, 7, and/or 8), forms a structural and irremovable part of the packaging material within the entire economic and technical life cycle of a product packaging.

The invention concerns the creation of a technical application intended as a technological innovation applicable to, but not limited to, recycling systems and/or methods as, for example, described and claimed in US Pat. Pub. No. US20040129781A1 , incorporated by reference herein in its entirety.

In contrast to available technologies such as bar-, data matrix and QR-codes which are printed on the outside of a package or RFID tags adhered onto a package, the embodiment of a monomaterial Wireless Identification Device into a package made of the similar materials provides a secure and protected method of providing product authenticity up to a level of unique serialization (UID) which can easily be read by mainstream RFID middleware equipment like RFID readers and even smartphones.

This unique serialization, which is structurally embedded in the packaging, also enables new forms of data collection and interaction while guaranteeing the originality of the packaging, which forms the basis of this invention.

In addition, the technical possibilities of this invention make it possible to apply measurement and/or interaction trigger points within, among other things, the production process, but also at the moments of issue/sale, use/consumption and collection/recycling.

With regard to the moments of issue/sale, use/consumption and collection/recycling, it can be noted that a specific purchase transaction can be linked to the identity of the packaging. This simplifies the tracing of illegally discharged waste/litter back to its last known owner, but for example the refund of deposits also offers more options for implementing a rewarding system.

Because the technology is based on issuing unique serial numbers, a structure- and material-passport can be created for each item. The recognition of the packaging within a waste management/recycling chain by means of Wireless Radio Frequency Identification devices (RFID-readers) can trigger instructions for handling and sorting based on available, specific, product information retrieved form storage in a remote database.

In contrast to the state of the art, in which a mix of materials often determines the final form and functionality of a package, the claimed invention consists of a wireless identification device that, in addition to the microchip and antenna, is constructed entirely from a specific base material which is surrounded by the same identical material which is then formed as a product package.

Through this application, the invention enables a controllable and automated sorting of used packaging materials during the waste sorting process, allowing instructions on processing, recycling and recovery and also providing feedback of processed and/or recovered materials in the product database of the original packaging manufacturer.

In conclusion, it can be stated that packaging, provided with a unique and structurally connected identity that also functions as a 'key' between a physical object and the digital logbook of that physical object, is an innovative application for managing product information through a products entire lifecycle up to the waste management and recycling process.

Detailed Description:

A packaging material produced with an integrated identification medium that ultimately forms a package. This medium consists of an RFID chip with its own unique identification code/serial number (UID).

The database can be populated with production data and data collected by readers/middleware at predetermined points in the life cycle. These moments can be specific points in production, distribution, warehousing, commerce (i.e. retail/shelf), as well as in the consumer and post-consumer phases. In addition to the existing data, if a UID location is known, data from other types of measurements can also be added to the database.

As mentioned, the UID at the end of the packaging life cycle can be used to identify the packaging, at a technical level, in the recycling process. The wireless recognition enables non-Line-Of-Sight (non-LOS) and therefore optimized identification/sorting of reusable materials in the recycling chain.

The combination of UID and data from the database is then used for authenticity checks but also for the release of relevant data applicable to, for example, but not limited to, origin of the content/product, use of the product, refunds, composition of the packaging materials and instructions on separating/processing the packaging in the waste stream.

Based on the measured values/quantities, a definitive calculation of fees, as a result of agreements and/or rules and/or laws, to the designated responsible parties, such as an importer and/or producer, is now possible through the application of the collected empirical evidence.

Part 10: Manufacturing of leadframes and SMD packaging

A leadframe is essentially a tiny version of a PCB. The fabrication of the circuitry and the mounting of a 'bare die' has been described. In one embodiment, the planar dimensions of the substrate/circuitry may shrink and may use the described/patented method for placing/bonding the IC/bare die.

This results in a paper/cellulose based leadframe/IC combo which then can be 'packed', just like the current tech, within a packaging medium. Currently this packaging medium is an epoxy, the black stuff, but it is not hard to exchange an epoxy for a bio-resin (with/without a cellulose based nanopowder, the same stuff which is used in pharmacy/food etc.).

The 'packed' components (such as a QFN or SOT package) could then be placed/bonded onto a 'regular' paper-based circuit board, again made according to initial patent.

The reason for this application, based on the tech described in patent 1 , is to further minimize the use of plastics/hazardous materials in the SMD industry (the volume of a bare die sometimes increases by the factor 10 when packed (i.e., single is none & mass is volume). It also follows the trend of the ROHS and WEE/EEE directives.

Claims

1. A method of manufacturing a flexible substrate including an RFID-tag, the method comprising: supplying a flexible carrier substrate, wherein the carrier substrate comprises cellulose, cellulose fibers, a polymer, or a composition thereof, at least part of the carrier substrate surface being covered by an electrically conductive layer; moving the carrier substrate in a transport direction along a laser ablation station that is configured to direct a laser beam to the electrically conductive layer applied on the carrier substrate and to move an impact position of the laser beam over the electrically conductive layer to selectively evaporate portions of the electrically conductive layer and to leave an electrically conductive pattern on the carrier substrate surface, the electrically conductive pattern at least forming an antenna of the RFID-tag; moving the carrier substrate along a pick-and-place station in which a RFID-chip is picked up from a storage and placed on and bonded to the carrier substrate thereby creating an electrically conductive connection between the RFID-chip and the antenna formed by the electrically conductive pattern to create the RFID-tag.

2. The method of claim 1 , wherein the flexible carrier substrate is ultrathin and has a thickness of less than 20 micrometer.

3. The method of claim 1 or 2, wherein the method includes moving the carrier substrate along a layer application station for applying the electronically conductive layer onto the carrier substrate, wherein the layer application station, when viewed in the transport direction, is positioned upstream from the laser ablation station.

4. The method according to claim 3, wherein the applying of the electronically conductive layer is performed by one of:

- coating;

- chemical vapor deposition;

- atomic layer deposition;

- printing;

- stamping; - bonding of a conductive material onto the carrier substrate; and

- transferring of a metallic surface onto the surface of the carrier substrate.

5. The method according to any one of claims 1 -4, wherein the electrically conductive layer is one of a metal, carbon, and graphene.

6. The method according to any one of claims 1 -5, wherein the electrically conductive pattern additionally includes optically visible image.

7. The method according to claim 6, wherein the optically visible image comprises at least one of:

- human readable text;

- a bar code;

- a QR-code

- a watermark;

- a logo;

- unique serial numbers;

- identification codes; and

- markings.

8. The method according to any one of claims 1-7, wherein during laser ablation of the electrically conductive layer, the carrier substrate is cooled on a side thereof which is opposite the electrically conductive layer.

9. The method according to claim 8, wherein the cooling is performed by guiding the side of carrier substrate which is opposite the electrically conductive layer over a cooling plate, wherein the dimensions of the cooling plate are such any impact position of the laser beam is always directly opposite the cooling plate.

10. The method according to claim 9, wherein the cooling plate comprises at least one of: a Peltier element; - a transparent cooling block, optionally with at least one of heat fins and cooling channels for guiding cooling liquid through the cooling block; and

- a metal cooling block, optionally with at least one of heat fins and cooling channels for guiding cooling liquid through the cooling block.

11 . The method according to any one of claims 1 -10, wherein the movement of the impact position of the laser beam is controlled by the laser ablation station by moving the impact position of the laser beam both in a direction transverse to the transport direction and in a direction parallel to the transport direction.

12. The method according to claim 11 , wherein the movement of the impact position is controlled by means of a movable optical element.

13. The method according to any one of claims 11 -12, wherein during laser ablation the carrier substrate is moved along the laser ablation station in the transport direction.

14. The method according to any one of claims 11-12, wherein during laser ablation the carrier substrate is stationary relative to the laser ablation station.

15. The method according to any one of claims 1 -14, further comprising: tuning the laser beam to a defined wavelength and a defined intensity, depending on a material of the carrier substrate and the electrically conductive layer, in combination with controlling the movement of the impact position of the laser beam over the electrically conductive layer with a defined speed so as effectively locally ablate the electrically conductive layer and simultaneously prevent damage to the carrier substrate.

16. The method of claim 15, wherein the defined wavelength of the electromagnetic radiation ranges between 100 nanometer (nm) to 2500 nm.

17. The method according to any one of claims 1-16, wherein the bonding of the RFID-chip to the carrier substrate thereby creating an electrically conductive connection between the RFID-chip and the antenna is effected by: - applying an anisotropic layer or paste at least on bonding areas of the electrically conductive pattern before placing the RFID-chip on the carrier substrate; and

- applying pressure on and optionally supplying heat to the RFID-chip at the bonding areas to create the electrically conductive connection between the RFID-chip and the antenna.

18. The method according to claim 17, wherein the anisotropic layer is applied over at least the entire area of the electrically conductive layer and optionally over the entire surface of the carrier substrate, wherein the anisotropic conductive layer is substantially not electrically conductive in a direction parallel to a main plane of the carrier substrate and is electrically conductive in a direction perpendicular the said main plain at the bonding areas due to the applied pressure and the optionally supplied heat.

19. The method according to claim 17, wherein the anisotropic paste is applied locally at the bonding areas and is substantially not electrically conductive in a direction parallel to a main plane of the carrier substrate and is electrically conductive in a direction perpendicular the said main plain at the bonding areas due to the applied pressure and the optionally supplied heat.

20. The method according to any of claims 1 -19, comprising:

- using the flexible substrate including the RFID-tag to make a packaging thereof, wherein the flexible substrate is an integral part of packaging material of the packaging.

21 . The method according to any of claims 1 -20, further comprising:

- bonding additional electrical components other than an RFID-chips to the electrically conductive pattern, wherein the electrical components are chosen from the group comprising: energy harvesting components, energy storage components, graphic data components, sensors, biosensor components, electronic components, and electro mechanical components.

22. An apparatus for manufacturing a flexible substrate including an RFID-tag, the apparatus comprising: a carrier substrate transport assembly including a carrier substrate supply, the carrier substrate transport assembly being configured for supplying and transporting a carrier substrate comprising cellulose, cellulose fibers, a polymer, or a composition thereof; a laser ablation station comprising a laser head for generating a laser beam, the laser ablation station being configured to direct the laser beam to an electrically conductive layer applied on the carrier substrate and to move an impact position of the laser beam over the electrically conductive layer to selectively evaporate portions of the electrically conductive layer and to leave an electrically conductive pattern on the carrier substrate surface, the electrically conductive pattern at least forming an antenna of the RFID-tag; a pick-and-place station configured to pick up an RFID-chip from a storage and to place the RFID-chip on and bond to the carrier substrate thereby creating an electrically conductive connection between the RFID-chip and the antenna formed by the electrically conductive pattern to create the RFID-tag an electronic controller for controlling at least part of the carrier substrate transport assembly, the laser ablation station and the pick-and-place station.

23. The apparatus according to claim 22, comprising: a layer application station configured for applying the electronically conductive layer onto the carrier substrate, wherein the layer application station, when viewed in the transport direction, is positioned upstream from the laser ablation station.

24. The apparatus according to claim 23, wherein the layer application station is chosen from the group consisting of:

- a coating station;

- chemical vapor deposition station;

- atomic layer deposition station;

- printing station;

- stamping station;

- bonding station configured for bonding a conductive material onto the carrier substrate; and a transfer station configured for transferring of a metallic surface onto the surface of the carrier substrate

25. The apparatus according to any one of claims 22-24, wherein the electronic controller is configured to control the laser ablation station assembly to control the movement of the impact position of the laser beam by moving the impact position of the laser beam in a direction transverse to the transport direction and to control one or both of the laser ablation station and the carrier substrate transport assembly to control the movement of the impact position of the laser beam on the carrier substrate in a direction parallel to the transport direction.

26. The apparatus according to claim 25, wherein laser ablation station comprises a movable optical element of which the movement is controlled by the controller for controlling a travelling path of the impact position of the laser beam.

27. The apparatus according to claim 26, wherein the optical element is chosen from the group consisting of:

- a movable mirror;

- a movable lens;

- a movable prism; and

- a movable light conductive fiber.

28. The apparatus according to any one of claims 22-27, wherein the carrier substrate transport assembly comprises:

- a rewinder comprising a second reel, the rewinder being configured to rewind the processed carrier substrate with the electrically conductive pattern and the RFID-chip to the second reel;

29. The apparatus according to any one of claims 22-28, comprising: - a bonding paste dispensing unit positioned downstream of the laser ablation station and upstream of the pick-and-place station and being configured for locally applying a anisotropic paste, or alternatively,

- a bonding layer dispensing unit positioned downstream of the laser ablation station and upstream of the pick-and-place station and being configured for at least locally applying an anisotropic layer on the carrier substrate.

30. The apparatus according to any one of claims 22-29, comprising:

- curing station configured for low temperature curing anisotropic paste or anisotropic layer to bond the RFID-chip onto the antenna.

31 . The apparatus according to claim 30, wherein the curing station is a thermal heating unit to emit heat to cure the anisotropic paste or anisotropic layer.

32. The apparatus according to claim 30, wherein the curing station is a light or UV- light unit which emits electromagnetic waves at a tuned wavelength to cure the anisotropic paste or anisotropic layer.

33. The apparatus according to claim 32, wherein the tuned wavelength is between 200nm and 600nm.

34. The apparatus according to claim 32 or 33, wherein the curing station is configured to emit the electromagnetic waves for a predetermined timespan, thus curing the anisotropic bonding paste or anisotropic bonding layer which is applied before placing the RFID-chip on carrier substrate with the pick-and-place station.

35. The apparatus according to any one of claims 30-34, wherein the curing station is an integral part of the pick-and-place station.