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WO2025182852A1 - Diamond spin sensor - Google Patents

Diamond spin sensor

Info

Publication number
WO2025182852A1
WO2025182852A1 PCT/JP2025/006198 JP2025006198W WO2025182852A1 WO 2025182852 A1 WO2025182852 A1 WO 2025182852A1 JP 2025006198 W JP2025006198 W JP 2025006198W WO 2025182852 A1 WO2025182852 A1 WO 2025182852A1
Authority
WO
WIPO (PCT)
Prior art keywords
diamond
spin
concentration
ppm
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/006198
Other languages
French (fr)
Japanese (ja)
Inventor
拡和 辻
良樹 西林
豊 小林
三記 寺本
紘矢 済藤
夏生 辰巳
司 林
洋成 出口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissin Electric Co Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Nissin Electric Co Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Electric Co Ltd, Sumitomo Electric Industries Ltd filed Critical Nissin Electric Co Ltd
Publication of WO2025182852A1 publication Critical patent/WO2025182852A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B19/00Liquid-phase epitaxial-layer growth
    • C30B19/02Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/04Diamond
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/032Measuring direction or magnitude of magnetic fields or magnetic flux using magneto-optic devices, e.g. Faraday or Cotton-Mouton effect
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/20Arrangements or instruments for measuring magnetic variables involving magnetic resonance

Definitions

  • NV centers Diamond spin sensors using NV centers (hereafter referred to as NV centers) in diamond are known.
  • a negatively charged NV center is referred to as an NV - center, but for convenience, it will also be abbreviated as an NV center below.
  • a charged NV center When a charged NV center is excited with laser light (i.e., green light) with a wavelength of approximately 530 nm, it emits fluorescence with a wavelength of approximately 635 nm (i.e., red light).
  • laser light i.e., green light
  • fluorescence With a wavelength of approximately 635 nm (i.e., red light).
  • the intensity of the fluorescence emission changes depending on the spin state of the NV center, and the spin state of the NV center changes due to magnetic resonance caused by a magnetic field applied to the NV center and microwaves or radio waves, so it can be used as a magnetic sensor.
  • Detection uses a diamond containing an NV center, which acts as a diamond spin sensor; an optical system that transmits excitation light from a light source and irradiates the NV center; and a transmission line and microwave circuit that transmit microwaves from a power source and irradiate the NV center. Additionally, an optical system is used that collects fluorescence from the NV center and transmits it to a photodetector.
  • Patent Document 1 discloses that diamonds with low nitrogen content can be produced by adding a getter material such as titanium (i.e., Ti) to the raw material to treat nitrogen, the largest impurity.
  • Patent Document 2 discloses that crystal distortion can be reduced by cutting a portion of a diamond with few crystal defects to a size of 1 mm or less from a diamond of 3 mm or larger in size to serve as a seed crystal, and using this as a seed substrate for growth.
  • a diamond spin sensor includes a diamond containing an NV - center having electron spin, and the product of T2 and C is greater than 65, where the transverse relaxation time of the electron spin measured by the Hahn echo method is T2 ⁇ sec and the concentration of the NV - center in the diamond is C ppm.
  • FIG. 1 is a perspective view illustrating a diamond spin sensor according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic diagram showing the crystal planes and orientations of a diamond.
  • FIG. 3 is a block diagram showing the configuration of an apparatus used for measurements using the diamond spin sensor shown in FIG.
  • FIG. 4 is a sequence diagram showing the timing of irradiation of excitation light and electromagnetic waves and the timing of measurement of synchrotron radiation during measurement using the diamond spin sensor shown in FIG.
  • FIG. 5 is a graph showing a schematic relationship between the observed signal intensity (i.e., fluorescence intensity) and the frequency of the electromagnetic wave (i.e., microwave).
  • FIG. 6 is a schematic diagram showing the NV center of a diamond.
  • FIG. 1 is a perspective view illustrating a diamond spin sensor according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic diagram showing the crystal planes and orientations of a diamond.
  • FIG. 3 is a block diagram showing the configuration of an apparatus used for
  • FIG. 7 is a sequence diagram showing the timing of irradiation of excitation light and electromagnetic waves for measuring the transverse relaxation time T2 of the diamond spin sensor shown in FIG. 1, and the timing of measurement of the emitted light.
  • FIG. 8 is a graph showing the transverse relaxation time T2.
  • FIG. 9 is a schematic diagram showing a diamond synthesis apparatus.
  • FIG. 10 is a schematic diagram showing a method for producing a seed crystal used in diamond synthesis.
  • FIG. 11 is a schematic diagram showing a method for synthesizing diamond using a diamond cut out from the synthetic diamond shown in FIG. 10 as a seed crystal.
  • FIG. 12 is a schematic diagram showing a method for synthesizing diamond using a seed crystal larger than the seed crystal shown in FIG.
  • FIG. 13 is a plan view showing the synthetic diamond shown in FIG.
  • FIG. 14 is a plan view showing a conventional synthetic diamond.
  • FIG. 15 is a table showing the manufacturing conditions of the experimental samples.
  • FIG. 16 is a diagram showing
  • the longer the transverse spin relaxation time T2 the higher the sensor sensitivity, which is preferable.
  • the longer the transverse relaxation time T2 the longer the time that the resonant electromagnetic waves are applied, and therefore the higher the sensor sensitivity.
  • the transverse relaxation time T2 it is possible to consider reducing the concentration of NV centers in diamond.
  • the NV centers which are the source of fluorescence, decrease, the emission intensity weakens.
  • there is a trade-off between the transverse relaxation time T2 and the concentration of the NV centers so it has been difficult to increase the transverse relaxation time T2 without reducing the concentration of the NV centers.
  • Patent Documents 1 and 2 it is easy to produce high-purity diamond crystals that are almost free of impurities and defects.
  • diamonds containing NV centers which require nitrogen and defects (vacancies), as sensors, it is necessary to remove factors that cause fluorescence scattering while leaving trace amounts of strain and impurities.
  • a method is needed to reduce other impurities and strain while leaving trace amounts of nitrogen impurities and defects (vacancies).
  • the present disclosure aims to provide a diamond spin sensor that can increase the transverse relaxation time without reducing the concentration of NV centers.
  • a diamond spin sensor includes a diamond containing an NV - center having electron spin, and where the transverse relaxation time of the electron spin measured by the Hahn echo method is T2 ⁇ sec and the concentration of the NV - center in the diamond is C ppm, the product of T2 and C is greater than 65. This allows the transverse relaxation time T2 to be increased without reducing the concentration of the NV - center in the diamond.
  • the product may be greater than 200. This allows the transverse relaxation time T2 to be increased without reducing the concentration of NV ⁇ centers in the diamond.
  • the concentration of the NV -center may be 0.02 ppm or more and 10 ppm or less, and the average phase difference over the entire surface of the diamond may be 6 nm/mm or less. This allows the transverse relaxation time T2 to be further increased, resulting in a sensor with higher sensitivity.
  • the average phase difference may be 4 nm/mm or less. This allows the transverse relaxation time T2 to be further increased, resulting in a more sensitive sensor.
  • the concentration of the NV ⁇ center may be 0.02 ppm or more and 1.2 ppm or less, thereby further increasing the transverse relaxation time T2 and realizing a sensor with higher sensitivity.
  • the concentration of NV ⁇ centers may be 0.02 ppm or more and 10 ppm or less, and the number of dislocation defects in the entire diamond detected by X-ray topography images may be 10 or less. This allows the transverse relaxation time T2 to be further increased, resulting in a sensor with higher sensitivity.
  • the concentration of NV ⁇ centers may be 0.02 ppm or more and 2 ppm or less, and the number of dislocation defects may be 0. This allows the transverse relaxation time T2 to be further increased, resulting in a sensor with even higher sensitivity.
  • the ratio of the concentration of isolated vacancies in the diamond to the concentration of NV ⁇ centers may be 10% or less, thereby further increasing the transverse relaxation time T2 and realizing a sensor with higher sensitivity.
  • the diamond spin sensor 100 is a rectangular parallelepiped having a first surface 102 and a first edge 104.
  • the diamond spin sensor 100 may also be a rectangular parallelepiped with equal sides, i.e., a cube.
  • the diamond spin sensor 100 is formed from a single crystal diamond containing an NV center composed of nitrogen (N) and vacancies (V).
  • the first surface 102 is a crystal plane, such as the (001) or (111) plane. When the first surface 102 is a (001) plane, the first edge 104 is formed along the ⁇ 100> or ⁇ 010> direction.
  • the first edge 104 is formed along the ⁇ 1-10>, ⁇ 10-1>, or ⁇ 01-1> direction.
  • the notation "-1" corresponds to the crystal orientation notation of a 1 with a bar (horizontal bar) above it.
  • Figure 1 shows a rectangular parallelepiped diamond spin sensor 100, this is not limiting.
  • the shape of the first surface 102 is not limited to a rectangle and can be any shape.
  • the first surface 102 may be triangular, for example.
  • the first side 104 corresponds to one side of the triangle.
  • the three-dimensional shape of the diamond spin sensor 100 is not limited to a rectangular parallelepiped, but may also be a pyramid (such as a pyramid or a cone).
  • the diamond spin sensor 100 may be a tetrahedron (e.g., a corner cube with right-angled sides) in which the first surface 102 is triangular (e.g., an equilateral triangle).
  • the (001) plane is a plane defined by points A5 to A8 (i.e., a plane passing through these four points).
  • the diamond spin sensor 100 is realized, for example, as a cube with vertices from points A1 to A8.
  • the ⁇ 100> direction and ⁇ 010> direction, which are directions that the first edge 104 can take, are the direction from point A1 to point A2 and the direction from point A1 to point A4, respectively.
  • the first edge 104 corresponds to the line segment connecting points A5 and A6, or the line segment connecting points A5 and A8.
  • the (111) plane is a plane defined by points A5, A2, and A4.
  • the first surface 102 may be the (111) plane.
  • the ⁇ 1-10> direction which is a possible direction of the first side 104, is the direction from point A1 to point B1. That is, the first side 104 corresponds to the line segment connecting points A2 and A4.
  • the ⁇ 10-1> direction which is a possible direction of the first side 104, is the direction from point A1 to point B2. That is, the first side 104 corresponds to the line segment connecting points A5 and A2.
  • the ⁇ 01-1> direction, which is a possible direction of the first side 104 is the direction from point A1 to point B3. That is, the first side 104 corresponds to the line segment connecting points A5 and A4.
  • the control unit 230 is equipped with a CPU (Central Processing Unit) and a memory unit (neither shown). The processing performed by the control unit 230 is realized by the CPU reading and executing a program pre-stored in the memory unit.
  • CPU Central Processing Unit
  • the excitation light generating unit 210 Under the control of the control unit 230, the excitation light generating unit 210 generates excitation light for exciting the NV center of the diamond spin sensor 100.
  • the control unit 230 supplies a voltage to the excitation light generating unit 210 at a predetermined timing to cause the excitation light generating unit 210 to emit light.
  • the excitation light 204 is green light (i.e., wavelength 490 nm to 560 nm).
  • the excitation light 204 is, for example, laser light
  • the excitation light generating unit 210 is, for example, a semiconductor laser (e.g., emitted light wavelength 532 nm).
  • the filter 212 is an element for separating the excitation light 204 incident from the excitation light generator 210 and the light (i.e., fluorescent light) emitted from the diamond spin sensor 100.
  • the filter 212 is a filter that cuts out (i.e., reflects) light with wavelengths below a predetermined wavelength and passes light with wavelengths greater than the predetermined wavelength, or a bandpass filter that passes light with wavelengths within a predetermined wavelength range and cuts out (i.e., reflects) light with wavelengths outside the predetermined wavelength range.
  • excitation light has a shorter wavelength than fluorescent light, so this configuration is preferable.
  • the filter 212 is a dichroic mirror with this function.
  • the focusing element 214 focuses the excitation light 204 input from the filter 212.
  • the focusing element 214 is, for example, a spherical lens.
  • the focusing element 214 inputs as much of the excitation light diffused and output from the excitation light generating unit 210 as possible into the end of the optical waveguide 216.
  • the optical waveguide 216 includes a medium for transmitting light and transmits light in both directions. That is, the optical waveguide 216 has a first end and a second end, and transmits the excitation light 204 incident on the first end to the second end located near the diamond spin sensor 100.
  • the optical waveguide 216 also transmits the emitted light (i.e., fluorescence) from the diamond spin sensor 100 incident on the second end to the first end and outputs it.
  • the optical waveguide 216 is, for example, an optical fiber.
  • the LPF (Long Pass Filter) 218 is a long-pass filter that passes light with wavelengths equal to or greater than a predetermined wavelength and cuts out (e.g., reflects) light with wavelengths smaller than the predetermined wavelength.
  • the fluorescent light 206 which is the emitted light of the diamond spin sensor 100, is red light and passes through the LPF 218.
  • the excitation light 204 output from the excitation light generator 210 has a shorter wavelength and does not pass through the LPF 218. This prevents the excitation light 204 emitted from the excitation light generator 210 from being detected by the light detector 220 and becoming noise, which reduces the detection sensitivity of the fluorescent light 206, which is the emitted light of the diamond spin sensor 100.
  • the light detector 220 generates and outputs an electrical signal corresponding to the incident light.
  • the light detector 220 is, for example, a photodiode.
  • the output signal from the light detector 220 is acquired by the control unit 230.
  • the electromagnetic wave irradiation unit 202 irradiates the diamond spin sensor 100 with electromagnetic waves (e.g., microwaves).
  • the electromagnetic wave irradiation unit 202 is, for example, a coil or microwave resonant circuit formed including an electrical conductor.
  • the electromagnetic waves are supplied from the electromagnetic wave generation unit 232 to the electromagnetic wave irradiation unit 202 via, for example, a coaxial cable.
  • the irradiation of the excitation light and electromagnetic waves to the diamond spin sensor 100 is controlled by the control unit 230, and is performed, for example, at the timing shown in Figure 4.
  • the control unit 230 controls the excitation light generating unit 210 to output excitation light for a predetermined period (e.g., time interval t1) at a predetermined timing.
  • the control unit 230 controls the electromagnetic wave generating unit 232 to output electromagnetic waves for a predetermined period (e.g., time interval t2) at a predetermined timing. Any appropriate pulse sequence can be used during time interval t2. This allows the excitation light and electromagnetic waves to be combined in time and space and irradiated onto the diamond.
  • the control unit 230 takes in the output signal of the light detecting unit 220 at a predetermined timing (e.g., time interval t3) and stores it in the memory unit.
  • NV centers transition from the ground state to an excited state when exposed to green light with a wavelength of 490 nm to 560 nm (e.g., 532 nm laser light), and then return to the ground state by emitting red light with a wavelength of 630 nm to 800 nm (e.g., 635 nm fluorescence).
  • an NV center captures one electron (i.e., NV - )
  • it forms spin triplet states with magnetic quantum numbers m s of -1, 0, and +1.
  • the energy levels of the m s ⁇ 1 states split according to the magnetic field strength (i.e., Zeeman splitting).
  • the transitions returning to the ground state include transitions that do not emit light (i.e., fluorescence), and the intensity of the observed emitted light decreases. Therefore, a valley (i.e., a drop in the signal) is observed in the ODMR (Optical Detected Magnetic Resonance) spectrum.
  • the control unit 230 controls the excitation light generating unit 210 and the electromagnetic wave generating unit 232 to measure a spectrum such as that shown in Figure 5.
  • the frequency difference ⁇ f which is the distance between the two observed valleys, depends on the magnetic field strength at the position of the diamond spin sensor 100 (corresponding to Zeeman splitting).
  • the control unit 230 can calculate the magnetic field from the frequency difference ⁇ f.
  • the magnetic field detected by the NV center is the component in the direction of the axis passing through the N and V of the NV center formed in the diamond (hereinafter referred to as the NV axis).
  • the diamond spin sensor 100 detects a change in signal intensity (i.e., fluorescence intensity) according to B cos ⁇ .
  • the magnetic field can be calculated from changes in the ODMR spectrum, but it is known that the center frequency of the two resonant frequencies of the NV center has temperature dependence in the range from 120 K to 700 K. Therefore, temperature can be measured by using the diamond spin sensor 100 to measure the change in the center frequency split into ⁇ f.
  • the transverse relaxation time of the electron spin of the NV center measured by the Hahn echo method described below is T2 ⁇ sec
  • the concentration of the NV center in the diamond measured by electron spin resonance or the like is C ppm
  • the Hahn echo method which is used to measure the transverse relaxation time T2, is included in the electron spin echo method (hereinafter referred to as the spin echo method) described below.
  • the spin echo method is a type of ESR (Electron Spin Resonance) measurement.
  • ESR Electro Spin Resonance
  • microwaves are continuously irradiated while an external magnetic field is applied, and microwave absorption is observed (CW (Continuous Wave)-ESR).
  • CW Continuous Wave
  • the spin echo method excites electron spins with microwave pulses and measures their relaxation.
  • the spin echo method can measure the physical quantities of the spin-lattice relaxation time T1 and the spin-spin relaxation time T2.
  • the spin-lattice relaxation time T1 is also called the longitudinal relaxation time T1.
  • the transverse relaxation time T2 mentioned above refers to the spin-spin relaxation time T2.
  • microwaves are not applied continuously, but rather microwave pulses that rotate the spins by ⁇ ° are applied in several increments.
  • the amount of spin rotation i.e., rotation angle ⁇
  • the operation is ⁇ 1- ⁇ - ⁇ 2, where a microwave pulse rotates the spins by ⁇ 1°, and after a time ⁇ , another microwave pulse rotates the spins by ⁇ 2°.
  • ⁇ 1 90°
  • ⁇ 2 180°.
  • the first pulse causes spins aligned along the Z axis (the direction of the magnetic field) to rotate ⁇ 1° from the Z axis toward the XY plane. All spins rotate in the same direction around the Z axis, but due to local magnetic field fluctuations, the rotation speed of each spin around the Z axis after a ⁇ 1° rotation is slightly different, and over time, the direction of each spin gradually shifts from its position immediately after a ⁇ 1° rotation. In other words, a phase delay or advance occurs in the spins. The dispersion of this shift increases in proportion to time ⁇ (i.e., the elapsed time).
  • each dispersed spin rotates ⁇ 2° in the same direction as when the spins were previously rotated ⁇ 1°.
  • the rotation speed of each spin around the Z axis differs; those that were rotating slowly now rotate slower, and those that were rotating fast now rotate faster.
  • the starting position of each spin's rotation around the Z axis is opposite to that immediately before the ⁇ 2° rotation.
  • microwave pulses are applied in the order of 90°- ⁇ -180°- ⁇ -90° to read the fluorescence intensity due to excited electron spins.
  • the transverse relaxation time T2 is measured, for example, using the spin echo pulse sequence shown in Figure 7.
  • the method of observing signals using such a pulse sequence is called the Hahn echo method.
  • Pulse P1 and pulse P3 are each pulses that rotate the electron spin of the NV center by 90° ( ⁇ /2) as described above.
  • Pulse P2 is a pulse that rotates the electron spin of the NV center by 180° ( ⁇ ) as described above.
  • Pulses P1, P2, and P3 are applied to the diamond spin sensor 100 with the same time interval ⁇ between them.
  • the relaxation time can be determined from the magnitude of decay in echo intensity (fluorescence intensity) as the time interval ⁇ changes. Specifically, by repeatedly measuring echoes using the pulse sequence shown in Figure 7 and plotting the echo intensity (peak value of the echo signal) against time, a graph such as that shown in Figure 8 is obtained. In Figure 8, the solid line schematically represents the measured value (fluorescence intensity).
  • the vertical axis is expressed in arbitrary units (au (arbitrary unit)).
  • the horizontal axis is 2 ⁇ (twice the time interval ⁇ ).
  • the dashed line is a graph obtained by fitting the measured value graph using an exponential function.
  • the transverse relaxation time T2 is the value of time ⁇ when the value of the exponential function becomes 1/e of its initial value. In other words, the transverse relaxation time T2 represents the time over which the measurement signal is sustained, and the longer the transverse relaxation time T2, the longer the signal can be measured.
  • the transverse relaxation time T2 mentioned above increases as the number of NV centers decreases.
  • the transverse relaxation time T2 is affected by defects, strain, and impurities (other than nitrogen) in the crystal. Defects, strain, and impurities (other than nitrogen) in the crystal act as disturbances on the transverse relaxation time T2, and it is thought that the transverse relaxation time T2 is inversely proportional to the amount of defects, strain, and impurities (other than nitrogen) (T2 ⁇ 1/X). Therefore, the product ⁇ (T2 x C) of the transverse relaxation time T2 and the NV center concentration C increases as the number of defects, strain, and impurities (other than nitrogen) in the diamond crystal decreases. If the product ⁇ can be increased, a more sensitive sensor can be achieved.
  • the examples described below show that a diamond spin sensor with a larger product ⁇ of the transverse relaxation time T2 (unit: ⁇ sec) and the NV center concentration C (unit: ppm) can be realized. That is, the product ⁇ of the transverse relaxation time T2 and the NV center concentration C is greater than 65. This allows for a highly sensitive sensor to be realized.
  • the product ⁇ may be greater than 120, greater than 160, or greater than 200.
  • the product ⁇ may be greater than 250 or greater than 300.
  • the larger the product ⁇ the more sensitive the sensor that can be realized. That is, in a diamond spin sensor, the transverse relaxation time T2 can be increased without reducing the NV center concentration C.
  • the NV center concentration may be 0.02 ppm or more and 10 ppm or less.
  • the average phase difference over the entire surface of the diamond spin sensor 100 may be 6 nm/mm or less.
  • the average phase difference represents defects and distortion in the diamond. Having an average phase difference of 6 nm/mm or less reduces defects and distortion in the diamond, and increases the longitudinal relaxation time T2.
  • Such an NV center concentration and average phase difference increases the product ⁇ of the relaxation time T2 and the NV center concentration C. Therefore, in the diamond spin sensor, the transverse relaxation time T2 can be increased without reducing the NV center concentration C, resulting in a sensor with higher sensitivity than conventional sensors.
  • the NV center concentration may be 0.02 ppm or more and 2 ppm or less.
  • the NV center concentration may also be 0.02 ppm or more and 1.2 ppm or less. This allows the transverse relaxation time T2 to be further increased, resulting in a more sensitive sensor.
  • the NV center concentration may also be 0.04 ppm or more and 5 ppm or less.
  • the NV center concentration may also be 0.08 ppm or more and 0.5 ppm or less.
  • the concentration of NV centers in diamond can be calculated from measurements using, for example, electron spin resonance (CW-ESR). Also, for low concentrations, it can be measured by observing with a fluorescence microscope and counting individual NV centers. For high concentrations, for diamonds containing low concentrations of NV centers, the conversion factor between concentration and fluorescence intensity can be found, and this can be used to calculate the concentration by converting from the fluorescence intensity ratio. Furthermore, the concentration of NV centers can also be calculated from the absorption coefficient at 637 nm in the absorption spectrum measured by ultraviolet-visible absorption spectroscopy.
  • CW-ESR electron spin resonance
  • the measured phase difference is the integrated value in the direction in which light passes through the diamond (e.g., the thickness direction of the diamond). Therefore, the phase difference is normalized by the diamond's thickness, i.e., expressed as the phase difference converted to a thickness of 1 mm (unit: nm/mm).
  • the phase difference is measured locally and is distributed two-dimensionally within the measurement surface. Therefore, the phase difference is expressed as the average value within the measurement surface (hereinafter referred to as the average phase difference).
  • average value does not mean the phase difference per area, but rather the value obtained by averaging the phase differences obtained by performing multiple local measurements over the surface, i.e., the average frequency distribution of the phase difference over the surface.
  • the average phase difference over the entire surface of the diamond spin sensor 100 may be 4 nm/mm or less. This allows a larger product ⁇ to be achieved, resulting in a more sensitive sensor.
  • the average phase difference over the entire surface of the diamond spin sensor may also be 3 nm/mm or less, 2 nm/mm or less, or 1 nm/mm or less. This allows the transverse relaxation time T2 to be further increased, resulting in a more sensitive sensor.
  • the number of dislocation defects detected in the entire diamond spin sensor 100 by X-ray topography imaging needs to be 10 or less.
  • a dislocation defect is a defect in which the alignment of one or more crystals in the diamond is misaligned, resulting in a linear boundary with the non-misaligned area. Fewer dislocation defects in the diamond can increase the transverse relaxation time T2, resulting in a more sensitive sensor.
  • a single-crystal diamond can be cut into thin plates using a laser processing machine, and the cut surface can be flattened by skiff polishing.
  • a slit can be placed next to the X-ray source to obtain X-ray topography images using diffracted rays from only a limited layer within the sample (tomographic topography: limited projection topography). This allows relatively thick samples to be evaluated for defects without having to be processed into thin plates.
  • the number of dislocation defects detected throughout the diamond using X-ray topography images may be seven or fewer.
  • the number of dislocation defects detected throughout the diamond using X-ray topography images may be five or fewer, or may be three or fewer.
  • the concentration of NV centers is between 0.02 ppm and 2 ppm
  • the number of dislocation defects detected in the entire diamond by X-ray topography images needs to be zero (i.e., no dislocation defects are detected). This allows the transverse relaxation time T2 to be further increased, resulting in an even more sensitive sensor.
  • the ratio of the concentration of isolated vacancies to the concentration of NV -centers may be 10% or less.
  • Isolated vacancies refer to vacancies in a state where no nitrogen is present around the vacancies. Isolated vacancies include uncharged vacancies and negatively charged vacancies. Therefore, the concentration ratio can be calculated as the ratio of the sum of the number of uncharged vacancies and the number of negatively charged vacancies to the number of NV -centers . This allows for a longer transverse relaxation time T2, resulting in a more sensitive sensor.
  • the vacancy density (concentration) is the sum of the density of neutral isolated vacancies (V 0 ) and the density of negatively charged isolated vacancies (V - ).
  • the density of each isolated vacancy can be calculated from the integrated absorption (wavelength integral of the absorption coefficient: unit meV ⁇ cm -1 ) of light at wavelengths of 741 nm and 394 nm, respectively, at liquid nitrogen temperature.
  • the vacancy density cannot be calculated using the absorption coefficient in the visible region, it can be calculated by positron annihilation.
  • the relative density value obtained by positron annihilation can be converted into density even in low concentration regions by performing calibration (proportional calculation) using the value in the region where density can be obtained using the absorption coefficient as a reference.
  • the ratio of the concentration of isolated vacancies to the concentration of NV 1 -centers may be 3% or less. Also, in the diamond spin sensor 100, the ratio of the concentration of isolated vacancies to the concentration of NV 1 -centers may be 1% or less, or may be 0.3% or less. By reducing the ratio of the concentration of isolated vacancies to the concentration of NV 1 -centers, an even larger product ⁇ can be achieved, resulting in a sensor with even higher sensitivity.
  • the following describes a method for manufacturing the diamond spin sensor 100 shown in Fig. 1. Using granular diamond as a seed crystal, a synthetic diamond is produced by a temperature difference method under high pressure, and a portion of the diamond is selected and cut out to be used as a seed crystal in subsequent processes.
  • FIG 9 shows the configuration of an apparatus for synthesizing diamond by the temperature gradient method under high pressure.
  • the temperature gradient method crystals are grown by utilizing the difference in solubility of diamond in a solvent caused by a temperature difference.
  • a vertical temperature gradient is created within a pressure medium 250 equipped with a graphite heater 252 and an insulating member 254.
  • the insulating member 254 is placed in the high-temperature section, and the seed crystal 300 is placed in the low-temperature section, with the solvent metal 258 placed between them.
  • Single-crystal diamond is grown on the seed crystal 300 by maintaining conditions above the pressure at which diamond becomes thermally stable at a temperature above the temperature at which the solvent metal 258 melts.
  • Diamond powder is preferably used as the carbon source 256.
  • Graphite or pyrolytic carbon may also be used as the carbon source 256.
  • the solvent metal 258 is made of one or more metals selected from the group consisting of iron (Fe), cobalt (Co), nickel (Ni), and manganese (Mn), or an alloy containing these metals.
  • Pressure is applied by pressure medium 250, which receives external force from a high-pressure generator (not shown), and heating is performed by graphite heater 252, achieving a pressure at which diamond is thermodynamically stable and a temperature condition at which solvent metal 258 is eutectic with carbon.
  • Carbon dissolves into solvent metal 258 from carbon source 256 in the high-temperature section and is transported by diffusion to the low-temperature section below solvent metal 258, where a crystal grows on seed crystal 300, forming synthetic diamond 302.
  • a single crystal diamond with a nitrogen concentration of 30 ppm or less is prepared.
  • adding a nitrogen getter to the solvent metal 258 allows for the production of a single crystal diamond with a nitrogen concentration of 30 ppm or less.
  • This allows for the cutting out of a seed crystal with a single growth sector and reduced defects, with 10 or fewer dislocation defects detected by X-ray topography, in the second step described below.
  • the growth sector can be confirmed by a two-dimensional fluorescence image (surface distribution image) of PL (photoluminescence: an emission image caused by ultraviolet irradiation) or CL (cathodoluminescence: an emission image caused by electron beam irradiation). That is, it can be determined by whether the boundary between regions with different fluorescence intensities is linear (see Patent Document 3).
  • Dislocations are measured, for example, by an etching test (see Patent Document 4).
  • the etching test is performed as follows: A single crystal diamond is immersed in a potassium nitrate (KNO 3 ) molten solution, which is an etching solution, and heated to 600°C in a platinum crucible for 1 hour (etching). After slow cooling, the single crystal diamond is removed and its surface is observed under an optical microscope at 50x magnification. The number of point-like etch pits is counted within a rectangular measurement area of 1000 ⁇ m x 1000 ⁇ m to obtain the number of point-like etch pits per mm 2. Point-like etch pits refer to point-like depressions present on the surface of the single crystal diamond.
  • Point-like etch pits correspond to dislocation defects.
  • Point-like depressions are quadrangular, quadrangular with rounded corners, or approximately circular on the (100) plane of the single crystal diamond, and triangular, triangular with rounded corners, or approximately circular on the (111) plane.
  • the diameter of the dot-like recesses is approximately 1 ⁇ m to 50 ⁇ m.
  • the number of dot-like etch pits per 1 mm2 (dislocation density) is calculated by multiplying the number of dot-like etch pits per 1 mm2 by 100. Note that linear etch pits may be observed on the surface of the single crystal diamond after etching, along with dot-like etch pits. Linear etch pits are derived from stacking faults in the single crystal diamond. The number of linear etch pits is not included in the measurement of dislocation defects.
  • Dislocations can also be detected by X-ray topography (see Patent Document 5).
  • Measurements can also be made using a laboratory X-ray diffraction device; for example, (111) diffraction can be observed using a Mo source, and (113) diffraction can be observed using a Cu source. While a CCD (Charge Coupled Device) camera can also be used for measurements, it is preferable to use a nuclear emulsion plate to increase resolution. After developing the nuclear emulsion, dislocations can be identified and quantified by capturing images using an optical microscope.
  • CCD Charge Coupled Device
  • the temperature gradient is adjusted so that the temperature difference between the carbon source 256 and the seed crystal 300 is 10 to 25°C, and a pressure of 5.0 to 5.5 GPa and a temperature of 1300 to 1350°C are maintained for 80 to 250 hours.
  • synthetic diamond 302 is synthesized from the seed crystal 300. If the temperature difference exceeds 25°C, crystal growth becomes disrupted and vicinal growth marks tend to disappear.
  • the temperature difference is less than 10°C, it takes a long time to grow a crystal of the specified size, which increases production costs.
  • temperature changes during the holding period are controlled to within 3°C. This further improves crystallinity. If the temperature change is greater than 3°C, growth becomes unstable, resulting in crystal defects, distortion, and the inclusion of inclusions, reducing crystallinity.
  • a cut diamond 304 (see FIG. 10 ) is cut from the single crystal diamond synthesized in the first step to be used as a seed crystal in the third step described below.
  • the seed surface of the cut diamond 304 used as the seed crystal is preferably, but not limited to, a square or octagon.
  • the size of the seed surface (e.g., the length of the opposite side) is preferably 0.3 mm or more and 3 mm or less.
  • the seed crystal is cut by laser processing into a plate with a thickness of approximately 0.5 mm to 1.0 mm, and the surface of the plate is polished to a surface roughness Ra of 20 nm or less.
  • the cut diamond 304 is a rectangular parallelepiped and the plane used as the seed surface is a (001) crystal plane, one side of the rectangle serving as the seed surface is parallel to the ⁇ 100> or ⁇ 010> direction. If the plane to be used as the seed surface is a (111) crystal plane, one side of the rectangle that is the seed surface is parallel to the ⁇ 1-10> direction, the ⁇ 10-1> direction, or the ⁇ 01-1> direction. This allows the cutting margin to be small, and a seed crystal with a seed surface that is less damaged can be obtained.
  • many dislocation defects exist in the principal plane direction of the seed crystal and in directions with an opening angle of approximately X° from that direction.
  • the principal plane direction is the ⁇ 001> direction
  • the principal plane direction is the ⁇ 111> direction
  • the opening angle being in the X° direction uses the expression X° because a slight deviation occurs in the opening angle when the principal plane direction does not coincide with the ⁇ 001> or ⁇ 111> direction. When they do not coincide, the opening angle is corrected from 35° or 19.5°. Excluding these opening angles and the area within ⁇ 5° of the principal plane direction, a single sector contains a high-quality crystal with few crystal defects. Furthermore, near the boundaries between different sectors, such as the boundary between the ⁇ 001 ⁇ sector and the ⁇ 111 ⁇ sector, there is a lot of crystal distortion and defects are likely to occur.
  • the ⁇ abc ⁇ sector refers to a region grown by stacking on the ⁇ abc ⁇ plane.
  • the ⁇ 001 ⁇ sector is a region grown by stacking ⁇ 001 ⁇ planes. Therefore, in this second step, a seed crystal with few defects is obtained by cutting out a cut diamond 304 from a single growth sector of the principal plane growth of the synthetic diamond 302 seed crystal, excluding ⁇ 5° of the principal plane growth direction.
  • Increasing the seed substrate size allows for larger quality crystals. For example, it is possible to cut a seed crystal with reduced defects, with 10 or fewer dislocation defects detected by X-ray topography. Using such a seed crystal results in a single crystal diamond synthesized in subsequent processes with fewer defects and further reduced distortion.
  • Examples of a single growth sector of the primary surface growth of the synthetic diamond 302, excluding ⁇ 5° from the primary surface growth direction of the seed crystal, include the ⁇ 001 ⁇ sector or the ⁇ 111 ⁇ sector.
  • crystallographically possible sectors may also be used, as long as they are a single growth sector of the primary surface growth excluding ⁇ 5° from the primary surface growth direction of the seed crystal.
  • the cut diamond 304 used as the seed crystal from the synthetic diamond 302 it may be cut from within a single sector, or may be cut to include two or more sectors, as long as it does not include areas with many dislocation defects. That is, the cut diamond 304 may include zero or one sector boundary.
  • the region of each sector can be identified by an luminescence image obtained by irradiating it with ultraviolet light (ultraviolet-excited luminescence image).
  • Diamond is synthesized by the temperature difference method as described above using the seed crystal cut in the second step. That is, referring to Figure 11, cut diamond 304 is used as seed crystal 310 to synthesize synthetic diamond 312. This allows for the production of a single crystal diamond with reduced crystal defects and strain.
  • diamond powder is used as the carbon source 256.
  • Iron or cobalt which has high solubility and affinity for carbon, is used as the solvent metal 258.
  • trace amounts of nickel or manganese may be incorporated into the diamond.
  • the amount of boron impurity contained in the carbon source 256 and solvent metal 258 is controlled to 1 ppm or less. This allows the boron (B) content in the single crystal diamond to be 0.1 ppm or less based on atomic number.
  • Titanium is added to the solvent metal 258 as a nitrogen getter. The concentration of the added titanium is 1.5 mass% or more and 3 mass% or less.
  • the nitrogen content in the single crystal diamond to be 0.1 ppm or more and 10 ppm or less based on atomic number.
  • Aluminum may be added as a nitrogen getter.
  • an Fe-Al alloy may be used for the solvent metal 258.
  • the conditions for the temperature difference method include, for example, adjusting the temperature gradient so that the temperature difference between the carbon source 256 and the seed crystal 300 is 10°C or more and 25°C or less, and maintaining a pressure of 5.0 GPa or more and 5.5 GPa or less and a temperature of 1300°C or more and 1350°C or less for 80 hours or less and 300 hours or less. If the temperature difference exceeds 25°C, crystal growth becomes somewhat disrupted, and vicinal growth often becomes impossible to observe. Furthermore, by controlling the temperature change during maintenance to within 3°C, crystallinity can be further improved.
  • a cut diamond 318 is cut from the synthetic diamond 312 (see FIG. 11) synthesized in the third step.
  • the cut diamond 318 is a region that is within a single growth sector (e.g., sector 316) that does not include the sector boundary 314 and has 10 or fewer dislocations detected by X-ray topography.
  • the cut diamond 318 is cut using laser processing in the same manner as in the second step described above.
  • the cut diamond 318 cut from the synthetic diamond 312 in the fourth step is irradiated with an electron beam having an energy of 300 KeV or more and 1.2 MeV or less. This ionizes the orbital electrons of carbon in the cut diamond 318, ejecting carbon nuclei and forming vacancies in the cut diamond 318.
  • an electron beam having an energy of 500 KeV or more and 1 MeV or less may be irradiated.
  • the electron beam irradiation dose can be changed in the range of 1 ⁇ 10 18 cm ⁇ 2 to 4 ⁇ 10 19 cm ⁇ 2 depending on the amount of NV ⁇ desired to be generated.
  • the cut diamond 318 that has been subjected to the fifth step is annealed in a vacuum at a temperature of 1100° C. to 1400° C. for 0.1 to 0.5 hours, thereby moving the nitrogen in the cut diamond 318 and forming NV centers consisting of nitrogen and vacancies.
  • the irradiation step in step 5 and the annealing step in step 6 may be repeated two or more times. This allows the desired amount of NV centers to be formed in the cut diamond 318.
  • the nitrogen getter can contain any of titanium (Ti), zirconium (Zr), hafnium (Hf), gallium (Ga), aluminum (Al), copper (Cu), silver (Ag), and gold (Au). This increases the product of the transverse relaxation time T2 and the NV center concentration C, resulting in a more sensitive sensor.
  • the cut diamond 318 may include only one sector boundary, or may not include any sector boundaries. This increases the product of the transverse relaxation time T2 and the NV center concentration C, resulting in a more sensitive sensor.
  • the above synthesis step may be performed using a larger seed crystal 320.
  • the length L of one side of the rectangle of the (001) crystal face or the (111) crystal face is 3 mm or more. This allows the sector boundary 324, which is prone to impurities, to be separated from the center of the sector 326. Therefore, a larger cut diamond 328 can be cut out from the sector 326 of the synthetic diamond 322 grown from the seed crystal 320. The cut cut diamond 328 is then subjected to electron beam irradiation (step 5) and annealing (step 6) as described above. This allows a larger diamond spin sensor 100 to be manufactured.
  • Figure 13 is a plan view of the (001) plane.
  • the left-right direction in Figure 13 corresponds to the ⁇ 100> direction.
  • Sectors 332, which are triangular regions at the four corners, represent (111) sectors.
  • the boundaries between different sectors are sector boundaries with different impurity concentrations (see dot pattern), which create distortion and introduce impurities.
  • Figure 12 by increasing the size of the seed crystal, the impurity-contaminated region can be positioned more toward the periphery from the center. Therefore, a larger region can be cut out and a larger diamond spin sensor can be fabricated.
  • a diamond spin sensor can be fabricated by cutting out the shaded portion of one sector 330 and using it as a seed crystal.
  • a larger seed crystal can be fabricated by cutting out a region that includes dislocation defects and two sector regions, and a diamond spin sensor can be fabricated using this. Furthermore, the entire (111) sector 330 can be used as a seed crystal to fabricate a diamond spin sensor.
  • Figure 14 shows a synthetic diamond for a conventional NV spin sensor.
  • Figure 14 is a plan view similar to Figure 13.
  • Sector 342 is a (111) sector.
  • a large sector boundary (see dot pattern) with different impurity concentrations is formed around the periphery of the largest (001) sector 340, and it can be seen that it is not possible to cut out an area large enough for a diamond spin sensor. This is because different sectors, such as the (001) sector and the (111) sector, form a boundary.
  • the effectiveness of the diamond spin sensor disclosed herein will be demonstrated below through examples.
  • the transverse relaxation time T2 and NV center concentration C were measured using multiple diamond spin sensors fabricated using the above-described manufacturing method. The manufacturing conditions are shown in Figure 15, and the measurement results are shown in Figures 15 and 16.
  • Figure 15 shows diamond seed crystals of a specified size cut using a laser processing machine from the synthetic diamond produced as described above (see step 2), shown as Samples 1 to 8.
  • Samples 1 to 6 are 3mm x 3mm x 0.5mm seed crystals.
  • Sample 9 is a commercially available synthetic diamond (DNV-B14 manufactured by ElementSix) produced by CVD (Chemical Vapor Deposition).
  • the various crystals were cut from within the sectors listed in the "Seed Crystal Cutting Sector” column of Figure 15.
  • “(100)” means cut from the (100) sector.
  • “(100) + (111)” means cut to include both the (100) and (111) sectors.
  • the presence or absence of defects in the resulting diamond seed crystals was confirmed using X-ray topography images. The number of dislocation defects confirmed is shown in the "Dislocation Defects" column in Figure 15.
  • a diamond crystal was grown on the diamond seed crystal using the temperature gradient method to obtain a single-crystal diamond for each sample (see step 3).
  • HPHT High-Pressure High-Temperature
  • Diamond powder containing 100 ppm to 200 ppm of nitrogen and 0.5 ppm to 1 ppm of boron as impurities was used as the carbon source.
  • the temperature gradient method for each sample was performed under the following conditions: titanium was used as the nitrogen getter, the temperature difference between the high-temperature section (carbon source) and the low-temperature section (seed crystal) was 23°C, the pressure was 5.3 GPa, and the holding temperature of the low-temperature section was 1350°C. The holding time was 150 hours.
  • steps 4 to 6 described above were carried out to fabricate multiple diamond spin sensors.
  • the electron beam irradiation energy was 0.95 MeV
  • the electron beam dose was 8 x 10 18 cm -2
  • the annealing temperature was 1100°C
  • the annealing time was 15 minutes.
  • the diamonds cut by step 4 are shown in the "Method for cutting sensor material" column in Figure 15.
  • Regarding the "position of growth sector,” represents the shaded area in Figure 13, and “above + adjacent” represents the dashed area in Figure 13.
  • the measured nitrogen concentration (in ppm) and NV - center concentration (in ppm) are shown in the "N concentration” and "NV - concentration” columns, respectively.
  • the transverse relaxation time T2 was measured using the fabricated diamond spin sensor. The results are shown in Figure 16. Samples 1 to 9 are the same as those in Figure 15.
  • the phase difference represents the average phase difference (unit: nm/mm) over the entire surface.
  • (V 0 +V - )/NV - means the ratio of the sum of the number of uncharged isolated vacancies and the number of negatively charged isolated vacancies to the number of NV - centers.
  • the product ⁇ means the product of the transverse relaxation time T2 (unit: ⁇ sec) and the NV - center concentration (unit: ppm).
  • the product ⁇ is greater than 65 for all of Samples 1 to 6.
  • the product ⁇ is greater than 120.
  • the product ⁇ is greater than 160.
  • the product ⁇ for Sample 6 is greater than 200 and greater than 250. It can be seen that Samples 1 and 6 all achieve a greater product ⁇ than Samples 7 to 9, and also have longer transverse relaxation times T2.
  • the NV -center concentrations for Samples 1 to 6 are lower than those for Samples 7 and 8. Therefore, the transverse relaxation times T2 of Samples 1 to 6 are longer than those of Samples 7 and 8.
  • Samples 1 to 6 all achieved 0.02 ppm to 10 ppm, Sample 6 achieved 0.02 ppm to 1.2 ppm, and Samples 5 and 6 achieved 0.02 ppm to 2 ppm.
  • Samples 1 to 6 achieved 6 nm/mm or less, and Samples 1, 2, 5, and 6 achieved an average phase difference of 4 nm/mm or less.
  • Samples 1 to 6 achieved 10% or less.
  • Sample 1 to Sample 6 can achieve 10 or less, while Sample 5 and Sample 6 can achieve 0.
  • Diamond spin sensor 102 First surface 104 First edge 202 Electromagnetic wave irradiating unit 204 Excitation light 206 Fluorescence 210 Excitation light generating unit 212 Filter 214 Light collecting element 216 Optical waveguide 218 LPF 220 Light detection unit 230 Control unit 232 Electromagnetic wave generation unit 250 Pressure medium 252 Graphite heater 254 Insulating member 256 Carbon source 258 Solvent metal 300, 310, 320 Seed crystal 302, 312, 322 Synthetic diamond 304, 318, 328 Cut diamond 314, 324 Sector boundary 316, 326, 330, 332, 340, 342 Sector A1, A2, A3, A4, A5, A6, A7, A8 Point C Carbon L Length N Nitrogen P1, P2, P3 Pulse t, t1, t2, t3, ⁇ Time interval V Vacancy X, Y, Z Axis ⁇ f Frequency difference ⁇ Angle

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Abstract

A diamond spin sensor (100) comprises a diamond including NV - centers having an electron spin. Where a lateral relaxation time of the electron spin measured by the Hahn echo method is denoted by T2 μsec, and the concentration of NV - centers in the diamond is denoted by Cppm, the product of T2 and C is larger than 65.

Description

ダイヤモンドスピンセンサDiamond Spin Sensor

 本開示は、ダイヤモンドスピンセンサに関する。本出願は、2024年2月28日出願の日本出願第2024-028000に基づく優先権を主張する。当該出願に記載された全ての記載内容は、参照によって本明細書に援用される。 This disclosure relates to a diamond spin sensor. This application claims priority to Japanese Application No. 2024-028000, filed February 28, 2024. The entire contents of that application are incorporated herein by reference.

 ダイヤモンドのNV中心(以下、NVセンタという)を用いたダイヤモンドスピンセンサが知られている。ダイヤモンド中の炭素(即ちC)の置換位置に入った窒素(即ちN)と、その窒素に隣接する空孔(即ちV:Vacancy)により構成されるNVセンタは負に帯電すると、その基底状態は三重項状態(即ち、スピンSがS=1)になる。負に帯電したNVセンタはNVセンタと記載されるが、以下においては便宜上NVセンタとも略記する。帯電したNVセンタを波長が約530nmのレーザ光(即ち緑色光)により励起すると波長が約635nm(即ち赤色光)の蛍光を発する。蛍光の発光強度はNVセンタのスピン状態により変化し、NVセンタのスピン状態はNVセンタに印加された磁界とマイクロ波またはラジオ波とによる磁気共鳴により変化するため、磁気センサとして利用できる。 Diamond spin sensors using NV centers (hereafter referred to as NV centers) in diamond are known. When an NV center, consisting of a nitrogen (i.e., N) occupying a substitutional position for a carbon (i.e., C) in diamond and a vacancy (i.e., V: Vacancy) adjacent to the nitrogen, becomes negatively charged, its ground state becomes a triplet state (i.e., spin S = 1). A negatively charged NV center is referred to as an NV - center, but for convenience, it will also be abbreviated as an NV center below. When a charged NV center is excited with laser light (i.e., green light) with a wavelength of approximately 530 nm, it emits fluorescence with a wavelength of approximately 635 nm (i.e., red light). The intensity of the fluorescence emission changes depending on the spin state of the NV center, and the spin state of the NV center changes due to magnetic resonance caused by a magnetic field applied to the NV center and microwaves or radio waves, so it can be used as a magnetic sensor.

 検出には、ダイヤモンドスピンセンサであるNVセンタを含有したダイヤモンドと、光源からの励起光を伝送してNVセンタに照射する光学系と、電源からのマイクロ波を伝送してNVセンタに照射する伝送線およびマイクロ波回路とが使用される。さらに、NVセンタからの蛍光を集光して光検出器に伝送する光学系も使用される。 Detection uses a diamond containing an NV center, which acts as a diamond spin sensor; an optical system that transmits excitation light from a light source and irradiates the NV center; and a transmission line and microwave circuit that transmit microwaves from a power source and irradiate the NV center. Additionally, an optical system is used that collects fluorescence from the NV center and transmits it to a photodetector.

 ダイヤモンド結晶の歪みおよび不純物を低減し、高純度のダイヤモンドを作製する方法が知られている。例えば、下記特許文献1には、最大の不純物となる窒素元素に関して、チタン(即ちTi)などのゲッタ材を原料に添加することにより、窒素の少ないダイヤモンドが作製できることが開示されている。下記特許文献2には、種結晶となるダイヤモンドを3mm級以上のサイズのダイヤモンドから、結晶欠陥が少ない部分を1mmサイズ以下に切り出して、これを種基板として成長させることによって、結晶の歪みを低減できることが開示されている。 Methods for reducing distortion and impurities in diamond crystals and producing high-purity diamonds are known. For example, Patent Document 1 below discloses that diamonds with low nitrogen content can be produced by adding a getter material such as titanium (i.e., Ti) to the raw material to treat nitrogen, the largest impurity. Patent Document 2 below discloses that crystal distortion can be reduced by cutting a portion of a diamond with few crystal defects to a size of 1 mm or less from a diamond of 3 mm or larger in size to serve as a seed crystal, and using this as a seed substrate for growth.

特開平7-148426号公報Japanese Unexamined Patent Publication No. 7-148426 特開平9-165295号公報Japanese Patent Application Publication No. 9-165295 国際公開第2022/210723号International Publication No. 2022/210723 国際公開第2022/209512号International Publication No. 2022/209512 国際公開第2016/013588号International Publication No. 2016/013588

 本開示のある局面に係るダイヤモンドスピンセンサは、電子スピンを持つNVセンタを含むダイヤモンドを含み、ハーンエコー法により測定された電子スピンの横緩和時間をT2μsecとし、ダイヤモンド中のNVセンタの濃度をCppmとして、T2およびCの積は、65よりも大きい。 A diamond spin sensor according to one aspect of the present disclosure includes a diamond containing an NV - center having electron spin, and the product of T2 and C is greater than 65, where the transverse relaxation time of the electron spin measured by the Hahn echo method is T2 μsec and the concentration of the NV - center in the diamond is C ppm.

図1は、本開示の実施形態に係るダイヤモンドスピンセンサを示す斜視図である。FIG. 1 is a perspective view illustrating a diamond spin sensor according to an embodiment of the present disclosure. 図2は、ダイヤモンドの結晶面および方位を示す模式図である。FIG. 2 is a schematic diagram showing the crystal planes and orientations of a diamond. 図3は、図1に示したダイヤモンドスピンセンサを用いた測定に用いられる装置の構成を示すブロック図である。FIG. 3 is a block diagram showing the configuration of an apparatus used for measurements using the diamond spin sensor shown in FIG. 図4は、図1に示したダイヤモンドスピンセンサを用いた測定時の励起光および電磁波の照射タイミング、ならびに、放射光の測定タイミングを示すシーケンス図である。FIG. 4 is a sequence diagram showing the timing of irradiation of excitation light and electromagnetic waves and the timing of measurement of synchrotron radiation during measurement using the diamond spin sensor shown in FIG. 図5は、観測される信号強度(即ち蛍光強度)と電磁波(即ちマイクロ波)の周波数との関係を模式的に示すグラフである。FIG. 5 is a graph showing a schematic relationship between the observed signal intensity (i.e., fluorescence intensity) and the frequency of the electromagnetic wave (i.e., microwave). 図6は、ダイヤモンドのNVセンタを示す模式図である。FIG. 6 is a schematic diagram showing the NV center of a diamond. 図7は、図1に示したダイヤモンドスピンセンサの横緩和時間T2を測定するための励起光および電磁波の照射タイミング、ならびに、放射光の測定タイミングを示すシーケンス図である。FIG. 7 is a sequence diagram showing the timing of irradiation of excitation light and electromagnetic waves for measuring the transverse relaxation time T2 of the diamond spin sensor shown in FIG. 1, and the timing of measurement of the emitted light. 図8は、横緩和時間T2を示すグラフである。FIG. 8 is a graph showing the transverse relaxation time T2. 図9は、ダイヤモンドの合成装置を示す模式図である。FIG. 9 is a schematic diagram showing a diamond synthesis apparatus. 図10は、ダイヤモンドの合成に用いる種結晶を製造する方法を示す模式図である。FIG. 10 is a schematic diagram showing a method for producing a seed crystal used in diamond synthesis. 図11は、図10に示した合成ダイヤモンドから一部を切り出したダイヤモンドを種結晶としたダイヤモンドの合成方法を示す模式図である。FIG. 11 is a schematic diagram showing a method for synthesizing diamond using a diamond cut out from the synthetic diamond shown in FIG. 10 as a seed crystal. 図12は、図11に示した種結晶よりも大きい種結晶を用いたダイヤモンドの合成方法を示す模式図である。FIG. 12 is a schematic diagram showing a method for synthesizing diamond using a seed crystal larger than the seed crystal shown in FIG. 図13は、図12に示した合成ダイヤモンドを示す平面図である。FIG. 13 is a plan view showing the synthetic diamond shown in FIG. 図14は、従来の合成ダイヤモンドを示す平面図である。FIG. 14 is a plan view showing a conventional synthetic diamond. 図15は、実験用サンプルの製造条件などをテーブル形式により示す図である。FIG. 15 is a table showing the manufacturing conditions of the experimental samples. 図16は、実験結果をテーブル形式により示す図である。FIG. 16 is a diagram showing the experimental results in a table format.

 [本開示が解決しようとする課題]
 ダイヤモンドのNVセンタ(カラーセンタともいう)を使ったセンサに関して、スピンの横緩和時間T2が長いほどセンサの感度を高くでき、好ましい。即ち、横緩和時間T2が長いほど、共鳴の電磁波を作用させている時間を長くできるので、センサの感度を高くできる。横緩和時間T2を長くするためには、ダイヤモンド中のNVセンタの濃度を低減することが考えられる。しかし、蛍光の発生源であるNVセンタが少なくなると、発光強度が弱くなる。このように、横緩和時間T2とNVセンタの濃度とはトレードオフの関係になっているために、NVセンタの濃度を減少させることなく、横緩和時間T2を大きくすることは困難であった。
[Problem to be solved by the present disclosure]
For sensors using diamond NV centers (also called color centers), the longer the transverse spin relaxation time T2, the higher the sensor sensitivity, which is preferable. In other words, the longer the transverse relaxation time T2, the longer the time that the resonant electromagnetic waves are applied, and therefore the higher the sensor sensitivity. In order to lengthen the transverse relaxation time T2, it is possible to consider reducing the concentration of NV centers in diamond. However, if the NV centers, which are the source of fluorescence, decrease, the emission intensity weakens. As such, there is a trade-off between the transverse relaxation time T2 and the concentration of the NV centers, so it has been difficult to increase the transverse relaxation time T2 without reducing the concentration of the NV centers.

 特許文献1および特許文献2に開示されているように、ほとんど不純物および欠陥のない高純度ダイヤモンド結晶を作製することは容易である。しかし、窒素および欠陥(空孔)を必要とするNVセンタを含むダイヤモンドをセンサとして用いるには、歪みおよび不純物が微量に残っている状態において、蛍光の散乱要因となるものを除かなければならない。即ち、不純物である窒素および欠陥(空孔)を微量に残しつつ、他の不純物および歪みを低減する方法が望まれる。 As disclosed in Patent Documents 1 and 2, it is easy to produce high-purity diamond crystals that are almost free of impurities and defects. However, to use diamonds containing NV centers, which require nitrogen and defects (vacancies), as sensors, it is necessary to remove factors that cause fluorescence scattering while leaving trace amounts of strain and impurities. In other words, a method is needed to reduce other impurities and strain while leaving trace amounts of nitrogen impurities and defects (vacancies).

 したがって、本開示は、NVセンタの濃度を減少させることなく横緩和時間を増大可能なダイヤモンドスピンセンサを提供することを目的とする。 Therefore, the present disclosure aims to provide a diamond spin sensor that can increase the transverse relaxation time without reducing the concentration of NV centers.

 [本開示の効果]
 本開示によれば、NVセンタの濃度を減少させることなく横緩和時間を増大可能なダイヤモンドスピンセンサを提供できる。
[Effects of the present disclosure]
According to the present disclosure, it is possible to provide a diamond spin sensor capable of increasing the transverse relaxation time without reducing the concentration of the NV center.

 [本開示の実施形態の説明]
 本開示の実施形態の内容を列記して説明する。以下に記載する実施形態の少なくとも一部を任意に組合せてもよい。
Description of the embodiments of the present disclosure
The contents of the embodiments of the present disclosure will be listed and explained below. At least some of the embodiments described below may be combined in any combination.

 (1)本開示の第1の局面に係るダイヤモンドスピンセンサは、電子スピンを持つNVセンタを含むダイヤモンドを含み、ハーンエコー法により測定された電子スピンの横緩和時間をT2μsecとし、ダイヤモンド中のNVセンタの濃度をCppmとして、T2およびCの積は、65よりも大きい。これにより、ダイヤモンド中のNVセンタの濃度を減少させることなく横緩和時間T2を増大できる。 (1) A diamond spin sensor according to a first aspect of the present disclosure includes a diamond containing an NV - center having electron spin, and where the transverse relaxation time of the electron spin measured by the Hahn echo method is T2 μsec and the concentration of the NV - center in the diamond is C ppm, the product of T2 and C is greater than 65. This allows the transverse relaxation time T2 to be increased without reducing the concentration of the NV - center in the diamond.

 (2)上記(1)において、積は、200よりも大きくてもよい。これにより、ダイヤモンド中のNVセンタの濃度を減少させることなく横緩和時間T2をより増大できる。 (2) In the above (1), the product may be greater than 200. This allows the transverse relaxation time T2 to be increased without reducing the concentration of NV centers in the diamond.

 (3)上記(1)または(2)において、NVセンタの濃度は、0.02ppm以上10ppm以下であってもよく、ダイヤモンドの表面全体に関する平均位相差は、6nm/mm以下であってもよい。これにより、横緩和時間T2をより増大でき、より感度の高いセンサを実現できる。 (3) In the above (1) or (2), the concentration of the NV -center may be 0.02 ppm or more and 10 ppm or less, and the average phase difference over the entire surface of the diamond may be 6 nm/mm or less. This allows the transverse relaxation time T2 to be further increased, resulting in a sensor with higher sensitivity.

 (4)上記(3)において、平均位相差は、4nm/mm以下であってもよい。これにより、横緩和時間T2をより増大でき、より感度の高いセンサを実現できる。 (4) In (3) above, the average phase difference may be 4 nm/mm or less. This allows the transverse relaxation time T2 to be further increased, resulting in a more sensitive sensor.

 (5)上記(1)から(4)のいずれか1つにおいて、NVセンタの濃度は、0.02ppm以上1.2ppm以下であってもよい。これにより、横緩和時間T2をより増大でき、より感度の高いセンサを実現できる。 (5) In any one of (1) to (4) above, the concentration of the NV center may be 0.02 ppm or more and 1.2 ppm or less, thereby further increasing the transverse relaxation time T2 and realizing a sensor with higher sensitivity.

 (6)上記(1)から(4)のいずれか1つにおいて、NVセンタの濃度は、0.02ppm以上10ppm以下であってもよく、X線トポグラフィ像により検出されるダイヤモンド全体の転位欠陥は、10本以下であってもよい。これにより、横緩和時間T2をより増大でき、より感度の高いセンサを実現できる。 (6) In any one of (1) to (4) above, the concentration of NV centers may be 0.02 ppm or more and 10 ppm or less, and the number of dislocation defects in the entire diamond detected by X-ray topography images may be 10 or less. This allows the transverse relaxation time T2 to be further increased, resulting in a sensor with higher sensitivity.

 (7)上記(6)において、NVセンタの濃度は、0.02ppm以上2ppm以下であってもよく、転位欠陥は、0本であってもよい。これにより、横緩和時間T2をさらに増大でき、さらに感度の高いセンサを実現できる。 (7) In the above (6), the concentration of NV centers may be 0.02 ppm or more and 2 ppm or less, and the number of dislocation defects may be 0. This allows the transverse relaxation time T2 to be further increased, resulting in a sensor with even higher sensitivity.

 (8)上記(1)から(7)のいずれか1つにおいて、NVセンタの濃度に対するダイヤモンド中の孤立空孔の濃度の割合は、10%以下であってもよい。これにより、横緩和時間T2をより増大でき、より感度の高いセンサを実現できる。 (8) In any one of the above (1) to (7), the ratio of the concentration of isolated vacancies in the diamond to the concentration of NV centers may be 10% or less, thereby further increasing the transverse relaxation time T2 and realizing a sensor with higher sensitivity.

 [本開示の実施形態の詳細]
 以下の実施形態においては、同一の部品には同一の参照番号を付してある。それらの名称および機能も同一である。したがって、それらについての詳細な説明は繰返さない。
[Details of the embodiment of the present disclosure]
In the following embodiments, the same components are denoted by the same reference numerals, and their names and functions are also the same, so detailed descriptions thereof will not be repeated.

 図1を参照して、本開示の実施形態に係るダイヤモンドスピンセンサ100は、第1面102および第1辺104を有する直方体である。ダイヤモンドスピンセンサ100は、各辺の長さが等しい直方体、即ち立方体であってもよい。ダイヤモンドスピンセンサ100は、窒素(N)および空孔(V)により構成されるNVセンタを含むダイヤモンド単結晶により形成されている。第1面102は、結晶面であり、例えば(001)面または(111)面である。第1辺104は、第1面102が(001)面である場合、<100>方向または<010>方向に沿って形成されている。第1辺104は、第1面102が(111)面である場合、<1-10>方向、<10-1>方向または<01-1>方向に沿って形成されている。なお、“-1”の表記は、1の上にバー(横棒)を付した結晶方位の表記に対応する。 Referring to FIG. 1, the diamond spin sensor 100 according to an embodiment of the present disclosure is a rectangular parallelepiped having a first surface 102 and a first edge 104. The diamond spin sensor 100 may also be a rectangular parallelepiped with equal sides, i.e., a cube. The diamond spin sensor 100 is formed from a single crystal diamond containing an NV center composed of nitrogen (N) and vacancies (V). The first surface 102 is a crystal plane, such as the (001) or (111) plane. When the first surface 102 is a (001) plane, the first edge 104 is formed along the <100> or <010> direction. When the first surface 102 is a (111) plane, the first edge 104 is formed along the <1-10>, <10-1>, or <01-1> direction. Note that the notation "-1" corresponds to the crystal orientation notation of a 1 with a bar (horizontal bar) above it.

 図1には、直方体のダイヤモンドスピンセンサ100を示しているが、これに限定されない。第1面102の形状は、矩形に限定されず、任意である。第1面102は、例えば三角形であってもよい。その場合、第1辺104は、三角形の1辺に対応する。ダイヤモンドスピンセンサ100の立体形状は、直方体に限定されず、錐体(角錐または円錐など)であってもよい。例えば、ダイヤモンドスピンセンサ100は、第1面102が三角形(例えば正三角形)の4面体(例えば、側面が直角を有するコーナーキューブ)であってもよい。 Although Figure 1 shows a rectangular parallelepiped diamond spin sensor 100, this is not limiting. The shape of the first surface 102 is not limited to a rectangle and can be any shape. The first surface 102 may be triangular, for example. In that case, the first side 104 corresponds to one side of the triangle. The three-dimensional shape of the diamond spin sensor 100 is not limited to a rectangular parallelepiped, but may also be a pyramid (such as a pyramid or a cone). For example, the diamond spin sensor 100 may be a tetrahedron (e.g., a corner cube with right-angled sides) in which the first surface 102 is triangular (e.g., an equilateral triangle).

 図2を参照して、ダイヤモンドにおける結晶面のうち、(001)面は、点A5から点A8により画定される平面(即ち、それら4点を通る平面)である。上記したように第1面102が(001)面である場合、ダイヤモンドスピンセンサ100は、例えば点A1から点A8を頂点とする立方体として実現される。第1辺104が取り得る方向である<100>方向および<010>方向はそれぞれ、点A1から点A2に向かう方向、および、点A1から点A4に向かう方向である。例えば、第1面102が点A5から点A8を頂点とする面であれば、第1辺104は、点A5および点A6を結ぶ線分、または、点A5および点A8を結ぶ線分に対応する。 With reference to Figure 2, among the crystal planes of diamond, the (001) plane is a plane defined by points A5 to A8 (i.e., a plane passing through these four points). If the first surface 102 is a (001) plane as described above, the diamond spin sensor 100 is realized, for example, as a cube with vertices from points A1 to A8. The <100> direction and <010> direction, which are directions that the first edge 104 can take, are the direction from point A1 to point A2 and the direction from point A1 to point A4, respectively. For example, if the first surface 102 is a plane with vertices from points A5 to A8, the first edge 104 corresponds to the line segment connecting points A5 and A6, or the line segment connecting points A5 and A8.

 (111)面は、点A5、点A2および点A4により画定される平面である。上記したように、第1面102は(111)面であってもよい。その場合、第1辺104がとり得る方向である<1-10>方向は、点A1から点B1に向かう方向である。即ち、第1辺104は、点A2および点A4を結ぶ線分に対応する。また、第1辺104がとり得る方向である<10-1>方向は、点A1から点B2に向かう方向である。即ち、第1辺104は、点A5および点A2を結ぶ線分に対応する。また、第1辺104がとり得る方向である<01-1>方向は、点A1から点B3に向かう方向である。即ち、第1辺104は、点A5および点A4を結ぶ線分に対応する。 The (111) plane is a plane defined by points A5, A2, and A4. As described above, the first surface 102 may be the (111) plane. In that case, the <1-10> direction, which is a possible direction of the first side 104, is the direction from point A1 to point B1. That is, the first side 104 corresponds to the line segment connecting points A2 and A4. The <10-1> direction, which is a possible direction of the first side 104, is the direction from point A1 to point B2. That is, the first side 104 corresponds to the line segment connecting points A5 and A2. The <01-1> direction, which is a possible direction of the first side 104, is the direction from point A1 to point B3. That is, the first side 104 corresponds to the line segment connecting points A5 and A4.

 ダイヤモンドスピンセンサ100を用いた測定は、例えば、図3に示す装置により行われる。制御部230は、CPU(Central Processing Unit)および記憶部(いずれも図示せず)を備えている。制御部230が行う処理は、記憶部に予め記憶されたプログラムをCPUが読出して実行することにより実現される。 Measurements using the diamond spin sensor 100 are performed, for example, by the device shown in Figure 3. The control unit 230 is equipped with a CPU (Central Processing Unit) and a memory unit (neither shown). The processing performed by the control unit 230 is realized by the CPU reading and executing a program pre-stored in the memory unit.

 励起光発生部210は、制御部230の制御を受けて、ダイヤモンドスピンセンサ100のNVセンタを励起するための励起光を発生する。制御部230は、例えば、励起光発生部210を発光させるための電圧を、所定のタイミングにおいて励起光発生部210に供給する。励起光204は、緑色の光(即ち波長490nmから560nm)である。励起光204は、例えばレーザ光であり、励起光発生部210は、例えば半導体レーザー(例えば、放射光の波長532nm)である。 Under the control of the control unit 230, the excitation light generating unit 210 generates excitation light for exciting the NV center of the diamond spin sensor 100. The control unit 230, for example, supplies a voltage to the excitation light generating unit 210 at a predetermined timing to cause the excitation light generating unit 210 to emit light. The excitation light 204 is green light (i.e., wavelength 490 nm to 560 nm). The excitation light 204 is, for example, laser light, and the excitation light generating unit 210 is, for example, a semiconductor laser (e.g., emitted light wavelength 532 nm).

 フィルタ212は、励起光発生部210から入射される励起光204と、ダイヤモンドスピンセンサ100から放射される光(即ち蛍光)とを分離するための素子である。例えば、フィルタ212は、所定波長以下の波長の光をカット(即ち反射)し、所定波長より大きい波長の光を通すフィルタ、または、所定波長範囲内の波長の光を通し、所定波長範囲外の波長の光をカット(即ち反射)するバンドパスフィルタである。一般的に、励起光は蛍光よりも波長が短いことから、このような構成が好ましい。例えば、フィルタ212は、このような機能を持つダイクロイックミラーである。 The filter 212 is an element for separating the excitation light 204 incident from the excitation light generator 210 and the light (i.e., fluorescent light) emitted from the diamond spin sensor 100. For example, the filter 212 is a filter that cuts out (i.e., reflects) light with wavelengths below a predetermined wavelength and passes light with wavelengths greater than the predetermined wavelength, or a bandpass filter that passes light with wavelengths within a predetermined wavelength range and cuts out (i.e., reflects) light with wavelengths outside the predetermined wavelength range. Generally, excitation light has a shorter wavelength than fluorescent light, so this configuration is preferable. For example, the filter 212 is a dichroic mirror with this function.

 集光素子214は、フィルタ212から入力される励起光204を集光する。集光素子214は、例えば球レンズである。集光素子214は、励起光発生部210から拡散して出力された励起光をできるだけ多く、光導波路216の端部に入力する。光導波路216は、光を伝送する媒体を含み、双方向に光を伝送する。即ち、光導波路216は、第1端部および第2端部を有し、第1端部に入射する励起光204を、ダイヤモンドスピンセンサ100の近くに位置する第2端部まで伝送する。また、光導波路216は、第2端部に入射するダイヤモンドスピンセンサ100の放射光(即ち蛍光)を、第1端部まで伝送して出力する。光導波路216は、例えば光ファイバである。 The focusing element 214 focuses the excitation light 204 input from the filter 212. The focusing element 214 is, for example, a spherical lens. The focusing element 214 inputs as much of the excitation light diffused and output from the excitation light generating unit 210 as possible into the end of the optical waveguide 216. The optical waveguide 216 includes a medium for transmitting light and transmits light in both directions. That is, the optical waveguide 216 has a first end and a second end, and transmits the excitation light 204 incident on the first end to the second end located near the diamond spin sensor 100. The optical waveguide 216 also transmits the emitted light (i.e., fluorescence) from the diamond spin sensor 100 incident on the second end to the first end and outputs it. The optical waveguide 216 is, for example, an optical fiber.

 LPF(Long Pass Filter)218は、ロングパスフィルタであり、所定波長以上の波長の光を通し、所定波長より小さい波長の光をカット(例えば反射)する。ダイヤモンドスピンセンサ100の放射光である蛍光206は赤色の光であり、LPF218を通るが、励起光発生部210から出力される励起光204はそれよりも波長が短いので、LPF218を通らない。これにより、励起光発生部210から放射された励起光204が光検知部220により検知されてノイズとなり、ダイヤモンドスピンセンサ100の放射光である蛍光206の検知感度が低下することを抑制できる。光検知部220は、入射する光に応じた電気信号を生成して出力する。光検知部220は、例えばフォトダイオードである。光検知部220の出力信号は、制御部230により取得される。 The LPF (Long Pass Filter) 218 is a long-pass filter that passes light with wavelengths equal to or greater than a predetermined wavelength and cuts out (e.g., reflects) light with wavelengths smaller than the predetermined wavelength. The fluorescent light 206, which is the emitted light of the diamond spin sensor 100, is red light and passes through the LPF 218. However, the excitation light 204 output from the excitation light generator 210 has a shorter wavelength and does not pass through the LPF 218. This prevents the excitation light 204 emitted from the excitation light generator 210 from being detected by the light detector 220 and becoming noise, which reduces the detection sensitivity of the fluorescent light 206, which is the emitted light of the diamond spin sensor 100. The light detector 220 generates and outputs an electrical signal corresponding to the incident light. The light detector 220 is, for example, a photodiode. The output signal from the light detector 220 is acquired by the control unit 230.

 電磁波照射部202は、ダイヤモンドスピンセンサ100に電磁波(例えばマイクロ波)を照射する。電磁波照射部202は、例えば電気導体を含んで形成されたコイルまたはマイクロ波共振回路である。電磁波は、電磁波発生部232から電磁波照射部202に、例えば同軸ケーブルにより供給される。ダイヤモンドスピンセンサ100への励起光および電磁波の照射は、制御部230により制御され、例えば、図4に示すようなタイミングにおいて行われる。 The electromagnetic wave irradiation unit 202 irradiates the diamond spin sensor 100 with electromagnetic waves (e.g., microwaves). The electromagnetic wave irradiation unit 202 is, for example, a coil or microwave resonant circuit formed including an electrical conductor. The electromagnetic waves are supplied from the electromagnetic wave generation unit 232 to the electromagnetic wave irradiation unit 202 via, for example, a coaxial cable. The irradiation of the excitation light and electromagnetic waves to the diamond spin sensor 100 is controlled by the control unit 230, and is performed, for example, at the timing shown in Figure 4.

 図4を参照して、制御部230は、所定のタイミングにおいて所定の期間(例えば時間間隔t1)励起光を出力するように励起光発生部210を制御する。制御部230は、所定の期間(例えば時間間隔t2)、所定のタイミングにおいて電磁波を出力するように電磁波発生部232を制御する。時間間隔t2におけるパルスシーケンスは、適宜、適切なものが使用されればよい。これにより、励起光と共に、電磁波を時間的および空間的に組合せてダイヤモンドに照射する。制御部230は、入力される光検知部220の出力信号を所定のタイミング(例えば時間間隔t3)において取り込み、記憶部に記憶する。 Referring to Figure 4, the control unit 230 controls the excitation light generating unit 210 to output excitation light for a predetermined period (e.g., time interval t1) at a predetermined timing. The control unit 230 controls the electromagnetic wave generating unit 232 to output electromagnetic waves for a predetermined period (e.g., time interval t2) at a predetermined timing. Any appropriate pulse sequence can be used during time interval t2. This allows the excitation light and electromagnetic waves to be combined in time and space and irradiated onto the diamond. The control unit 230 takes in the output signal of the light detecting unit 220 at a predetermined timing (e.g., time interval t3) and stores it in the memory unit.

 NVセンタは、波長が490nmから560nmの緑色の光(例えば532nmのレーザー光)により基底状態から励起状態に遷移し、波長が630nmから800nmの赤色の光(例えば635nmの蛍光)を放射して、基底状態に戻る。NVセンタは、電子を1個捕獲した状態(即ちNV)においては、磁気量子数mが-1、0および+1のスピン三重項状態を形成し、磁場が存在すると、m=±1の状態のエネルギーレベルは磁場強度に応じて分裂する(即ちゼーマン分裂)。周波数2.87GHzのマイクロ波をNVセンタに照射して、m=0の状態をm=±1の状態に遷移(即ち電子スピン共鳴)させた後、緑色の光を照射して励起する。これにより、基底状態に戻るときの遷移には光(即ち蛍光)を放射しない遷移が含まれるので、観測される放射光の強度は低下する。したがって、ODMR(Optically Detected Magnetic Resonance)スペクトルにおいて谷(即ち信号の落込み)が観測される。 NV centers transition from the ground state to an excited state when exposed to green light with a wavelength of 490 nm to 560 nm (e.g., 532 nm laser light), and then return to the ground state by emitting red light with a wavelength of 630 nm to 800 nm (e.g., 635 nm fluorescence). When an NV center captures one electron (i.e., NV - ), it forms spin triplet states with magnetic quantum numbers m s of -1, 0, and +1. In the presence of a magnetic field, the energy levels of the m s = ±1 states split according to the magnetic field strength (i.e., Zeeman splitting). Microwaves with a frequency of 2.87 GHz are irradiated onto the NV center, causing the m s = 0 state to transition to the m s = ±1 state (i.e., electron spin resonance), and then the NV center is excited by irradiating it with green light. As a result, the transitions returning to the ground state include transitions that do not emit light (i.e., fluorescence), and the intensity of the observed emitted light decreases. Therefore, a valley (i.e., a drop in the signal) is observed in the ODMR (Optical Detected Magnetic Resonance) spectrum.

 上記したように、制御部230が、励起光発生部210および電磁波発生部232を制御することにより、例えば、図5に示すようなスペクトルが測定される。観測される2つの谷の間隔である周波数差Δfは、ダイヤモンドスピンセンサ100の位置における磁場強度に依存する(ゼーマン分裂に相当)。制御部230は、周波数差Δfから磁場を算出できる。図6を参照して、NVセンタにより検出される磁場は、ダイヤモンドに形成されるNVセンタのNおよびVを通る軸(以下、NV軸という)方向の成分である。即ち、磁場ベクトルBとNV軸の成す角度をφとして、Bcosφに応じた信号強度(即ち蛍光強度)の変化がダイヤモンドスピンセンサ100により検出される。 As described above, the control unit 230 controls the excitation light generating unit 210 and the electromagnetic wave generating unit 232 to measure a spectrum such as that shown in Figure 5. The frequency difference Δf, which is the distance between the two observed valleys, depends on the magnetic field strength at the position of the diamond spin sensor 100 (corresponding to Zeeman splitting). The control unit 230 can calculate the magnetic field from the frequency difference Δf. Referring to Figure 6, the magnetic field detected by the NV center is the component in the direction of the axis passing through the N and V of the NV center formed in the diamond (hereinafter referred to as the NV axis). In other words, where φ is the angle between the magnetic field vector B and the NV axis, the diamond spin sensor 100 detects a change in signal intensity (i.e., fluorescence intensity) according to B cosφ.

 上記においては、ODMRスペクトルの変化から磁場を算出できることを説明したが、NVセンタの2つの共鳴周波数の中心の周波数は120Kから700Kまでの範囲において温度依存性を持つことが知られている。したがって、ダイヤモンドスピンセンサ100を用いて、Δfに分裂した中心の周波数変化を測定することにより、温度測定が可能である。 As explained above, the magnetic field can be calculated from changes in the ODMR spectrum, but it is known that the center frequency of the two resonant frequencies of the NV center has temperature dependence in the range from 120 K to 700 K. Therefore, temperature can be measured by using the diamond spin sensor 100 to measure the change in the center frequency split into Δf.

 ダイヤモンドスピンセンサ100は、後述するハーンエコー法により測定されたNVセンタの電子スピンの横緩和時間をT2μsecとし、電子スピン共鳴法などにより測定されたダイヤモンド中のNVセンタの濃度(炭素原子の個数に対するNVセンタの個数の比率)をCppmとして、横緩和時間T2およびNVセンタ濃度Cの積α(α=T2×C)は、65よりも大きい。これにより、ダイヤモンドスピンセンサ100中のNVセンタの濃度を減少させることなく、横緩和時間T2を増大できる。したがって、蛍光強度の減少を抑制でき、従来よりも高感度のセンサを実現できる。 In the diamond spin sensor 100, the transverse relaxation time of the electron spin of the NV center measured by the Hahn echo method described below is T2 μsec, and the concentration of the NV center in the diamond measured by electron spin resonance or the like (the ratio of the number of NV centers to the number of carbon atoms) is C ppm, and the product α (α = T2 × C) of the transverse relaxation time T2 and the NV - center concentration C is greater than 65. This makes it possible to increase the transverse relaxation time T2 without reducing the concentration of the NV - center in the diamond spin sensor 100. Therefore, it is possible to suppress the decrease in fluorescence intensity and realize a sensor with higher sensitivity than conventional sensors.

 横緩和時間T2を測定するために用いられるハーンエコー法は、以下に示す電子スピンエコー法(以下、スピンエコー法という)に含まれる。スピンエコー法はESR(Electron Spin Resonance)測定の一種である。一般的なESR測定においては、マイクロ波を連続的に照射しながら、外部磁場を印加してマイクロ波の吸収を観測する(CW(Continuous Wave)-ESR)。これに対してスピンエコー法においては、マイクロ波パルスにより電子スピンを励起し、電子スピンの緩和を計測する。スピンエコー法によりスピン-格子緩和時間T1およびスピン-スピン緩和時間T2の物理量を測定できる。スピン-格子緩和時間T1は縦緩和時間T1ともいわれる。上記した横緩和時間T2は、スピン-スピン緩和時間T2を意味する。 The Hahn echo method, which is used to measure the transverse relaxation time T2, is included in the electron spin echo method (hereinafter referred to as the spin echo method) described below. The spin echo method is a type of ESR (Electron Spin Resonance) measurement. In a typical ESR measurement, microwaves are continuously irradiated while an external magnetic field is applied, and microwave absorption is observed (CW (Continuous Wave)-ESR). In contrast, the spin echo method excites electron spins with microwave pulses and measures their relaxation. The spin echo method can measure the physical quantities of the spin-lattice relaxation time T1 and the spin-spin relaxation time T2. The spin-lattice relaxation time T1 is also called the longitudinal relaxation time T1. The transverse relaxation time T2 mentioned above refers to the spin-spin relaxation time T2.

 スピンエコー法においては、マイクロ波を連続的に加えるのではなく、スピンがθ°だけ回転するマイクロ波パルスを何回かに分けて印加する。このときのスピンの回転量(即ち回転角度θ)はマイクロ波の強度および印加時間により決まる。多くの場合、θ1-τ-θ2というように、マイクロ波パルスによりスピンをθ1°回転させ、時間τを置いた後、さらにマイクロ波パルスによりスピンをθ2°回転させる操作を行う。例えば、θ1=90(°)、θ2=180(°)である。 In spin echo spectroscopy, microwaves are not applied continuously, but rather microwave pulses that rotate the spins by θ° are applied in several increments. The amount of spin rotation (i.e., rotation angle θ) is determined by the microwave intensity and application time. In many cases, the operation is θ1-τ-θ2, where a microwave pulse rotates the spins by θ1°, and after a time τ, another microwave pulse rotates the spins by θ2°. For example, θ1 = 90°, θ2 = 180°.

 ラーモア周波数により回転する回転座標系におけるスピンの動作を考える。最初のパルスにより、Z軸方向(磁場の方向)に揃っているスピンはZ軸からXY面に向かってθ1°回転する。全てのスピンはZ軸周りに同じ方向に回転するが、局所的な磁場の揺らぎがあるので、θ1°回転した後の各スピンのZ軸周りの回転速度は少しずつ異なり、時間経過に伴って、各スピンの向きはθ1°回転した直後の位置から少しずつずれてくる。即ち、スピンに位相の遅れまたは進みが発生する。このずれの分散は時間τ(即ち経過時間)に比例して増大する。その後θ2°回転させるマイクロ波パルスを加えると、分散した各スピンは、先ほどスピンをθ1°回転させたときと同じ向きにθ2°回転する。θ2°回転した後にも、全てのスピンはZ軸周りに同じ方向に回転し、同様に各スピンのZ軸周りの回転速度が異なり、遅く回転していたものは遅く、速く回転していたものは速く回転する。しかし、Z軸周りの各スピンの回転の開始位置(θ2°回転した直後の位相)は、θ2°回転する直前とは反対である。即ち、回転速度が遅く、遅れた位相にあったスピンは進んだ位相になり、回転速度が速く、進んだ位相にあったスピンは遅れた位相になる。そのため、θ2°回転した後、今度は時間経過に伴いスピン間の位相差が減少していく。その結果、時間τの経過後にスピンが揃う。これにより、スピンによる信号としてスピンエコー(以下、エコーという)が検出される。 Consider the behavior of spins in a rotating coordinate system that rotates at the Larmor frequency. The first pulse causes spins aligned along the Z axis (the direction of the magnetic field) to rotate θ1° from the Z axis toward the XY plane. All spins rotate in the same direction around the Z axis, but due to local magnetic field fluctuations, the rotation speed of each spin around the Z axis after a θ1° rotation is slightly different, and over time, the direction of each spin gradually shifts from its position immediately after a θ1° rotation. In other words, a phase delay or advance occurs in the spins. The dispersion of this shift increases in proportion to time τ (i.e., the elapsed time). If a microwave pulse that rotates θ2° is then added, each dispersed spin rotates θ2° in the same direction as when the spins were previously rotated θ1°. After a θ2° rotation, all spins still rotate in the same direction around the Z axis, and similarly, the rotation speed of each spin around the Z axis differs; those that were rotating slowly now rotate slower, and those that were rotating fast now rotate faster. However, the starting position of each spin's rotation around the Z axis (the phase immediately after a θ2° rotation) is opposite to that immediately before the θ2° rotation. In other words, spins that were in a delayed phase due to a slow rotation speed now have an advanced phase, and spins that were in an advanced phase due to a fast rotation speed now have a delayed phase. Therefore, after a θ2° rotation, the phase difference between the spins decreases over time. As a result, the spins align after the passage of time τ. This allows a spin echo (hereafter referred to as an echo) to be detected as a signal due to the spins.

 ダイヤモンドのNVセンタなどの緩和時間測定においては、励起された電子スピンによる蛍光強度を読み取るため、90°-τ-180°-τ-90°のようにマイクロ波パルスをかける。横緩和時間T2は、例えば、図7に示すスピンエコー法のパルスシーケンスを用いて測定される。このようなパルスシーケンスを用いて信号を観測する方法は、ハーンエコー法と呼ばれる。パルスP1およびパルスP3の各々は、NVセンタの電子スピンを上記したように90°(π/2)回転させるパルスである。パルスP2は、NVセンタの電子スピンを上記したように180°(π)回転させるパルスである。パルスP1、パルスP2およびパルスP3は、同じ時間間隔τを開けて、ダイヤモンドスピンセンサ100に印加される。 When measuring the relaxation time of NV centers in diamond, microwave pulses are applied in the order of 90°-τ-180°-τ-90° to read the fluorescence intensity due to excited electron spins. The transverse relaxation time T2 is measured, for example, using the spin echo pulse sequence shown in Figure 7. The method of observing signals using such a pulse sequence is called the Hahn echo method. Pulse P1 and pulse P3 are each pulses that rotate the electron spin of the NV center by 90° (π/2) as described above. Pulse P2 is a pulse that rotates the electron spin of the NV center by 180° (π) as described above. Pulses P1, P2, and P3 are applied to the diamond spin sensor 100 with the same time interval τ between them.

 スピンエコーは、上記したように磁場の局所的な揺らぎにより生じるものであり、磁場の揺らぎは、パルス磁場の不均一さ、スピン-核相互作用、およびスピン-スピン双極子相互作用などによって引き起こされる。そして、時間間隔τの値を変化させたときのエコー強度(蛍光強度)の減衰の大きさから緩和時間を求めることができる。即ち、図7に示したパルスシーケンスによるエコーの測定を繰返し、時間に関してエコー強度(エコー信号のピーク値)をプロットすると、例えば図8に示すようなグラフが得られる。図8において、実線は測定値(蛍光強度)を模式的に示している。縦軸は、任意単位(a.u.(arbitrary unit))により表されている。横軸は、2τ(時間間隔τの2倍)である。破線は、測定値のグラフを、指数関数を用いてフィッティングしたグラフである。横緩和時間T2は、指数関数の値が初期値の1/eになるときの時間τの値である。即ち、横緩和時間T2は、測定信号が持続される時間を表し、横緩和時間T2が長ければ、より長い時間、信号を測定可能になる。 As mentioned above, spin echoes are caused by localized fluctuations in the magnetic field. These fluctuations are caused by factors such as inhomogeneity in the pulsed magnetic field, spin-nuclear interactions, and spin-spin dipole interactions. The relaxation time can be determined from the magnitude of decay in echo intensity (fluorescence intensity) as the time interval τ changes. Specifically, by repeatedly measuring echoes using the pulse sequence shown in Figure 7 and plotting the echo intensity (peak value of the echo signal) against time, a graph such as that shown in Figure 8 is obtained. In Figure 8, the solid line schematically represents the measured value (fluorescence intensity). The vertical axis is expressed in arbitrary units (au (arbitrary unit)). The horizontal axis is 2τ (twice the time interval τ). The dashed line is a graph obtained by fitting the measured value graph using an exponential function. The transverse relaxation time T2 is the value of time τ when the value of the exponential function becomes 1/e of its initial value. In other words, the transverse relaxation time T2 represents the time over which the measurement signal is sustained, and the longer the transverse relaxation time T2, the longer the signal can be measured.

 上記した横緩和時間T2は、NVセンタの数が少ないほど大きくなる。横緩和時間T2は、結晶中の欠陥、歪みおよび不純物(窒素以外)の影響を受ける。結晶中の欠陥、歪みおよび不純物(窒素以外)は、横緩和時間T2に対して外乱として作用し、横緩和時間T2は、欠陥、歪みおよび不純物(窒素以外)の量に反比例する(T2∝1/X)と考えられる。したがって、横緩和時間T2とNVセンタ濃度Cとの積α(T2×C)は、ダイヤモンド結晶中の欠陥、歪みおよび不純物(窒素以外)が少ないほど大きくなる。積αを大きくできれば、より感度の高いセンサを実現できる。 The transverse relaxation time T2 mentioned above increases as the number of NV centers decreases. The transverse relaxation time T2 is affected by defects, strain, and impurities (other than nitrogen) in the crystal. Defects, strain, and impurities (other than nitrogen) in the crystal act as disturbances on the transverse relaxation time T2, and it is thought that the transverse relaxation time T2 is inversely proportional to the amount of defects, strain, and impurities (other than nitrogen) (T2 ∝ 1/X). Therefore, the product α (T2 x C) of the transverse relaxation time T2 and the NV center concentration C increases as the number of defects, strain, and impurities (other than nitrogen) in the diamond crystal decreases. If the product α can be increased, a more sensitive sensor can be achieved.

 後述する実施例により、横緩和時間T2(μsec単位)およびNVセンタ濃度C(ppm単位)の積αがより大きいダイヤモンドスピンセンサを実現できることを示す。即ち、横緩和時間T2およびNVセンタ濃度Cの積αは、65よりも大きい。これにより、感度の高いセンサを実現できる。積αは、120より大きくてもよく、160よりも大きくてもよく、200よりも大きくてもよい。積αは、250よりも大きくてもよく、300よりも大きくてもよい。積αが大きいほど、より感度の高いセンサを実現できる。即ち、ダイヤモンドスピンセンサにおいて、NVセンタ濃度Cを低減することなく、横緩和時間T2をより増大できる。 The examples described below show that a diamond spin sensor with a larger product α of the transverse relaxation time T2 (unit: μsec) and the NV center concentration C (unit: ppm) can be realized. That is, the product α of the transverse relaxation time T2 and the NV center concentration C is greater than 65. This allows for a highly sensitive sensor to be realized. The product α may be greater than 120, greater than 160, or greater than 200. The product α may be greater than 250 or greater than 300. The larger the product α, the more sensitive the sensor that can be realized. That is, in a diamond spin sensor, the transverse relaxation time T2 can be increased without reducing the NV center concentration C.

 図1に示したダイヤモンドスピンセンサ100において、NVセンタ濃度は、0.02ppm以上10ppm以下であればよい。また、ダイヤモンドスピンセンサ100の表面全体に関する平均位相差は、6nm/mm以下であればよい。後述するように、平均位相差は、ダイヤモンドの欠陥および歪みを表す。平均位相差が6nm/mm以下であることにより、ダイヤモンドの欠陥および歪みを低減でき、縦緩和時間T2を大きくできる。このようなNVセンタ濃度および平均位相差により、緩和時間T2およびNVセンタ濃度Cの積αを大きくできる。したがって、ダイヤモンドスピンセンサにおいて、NVセンタ濃度Cを低減することなく、横緩和時間T2を増大でき、従来よりも感度の高いセンサを実現できる。 In the diamond spin sensor 100 shown in Figure 1, the NV center concentration may be 0.02 ppm or more and 10 ppm or less. Furthermore, the average phase difference over the entire surface of the diamond spin sensor 100 may be 6 nm/mm or less. As will be described later, the average phase difference represents defects and distortion in the diamond. Having an average phase difference of 6 nm/mm or less reduces defects and distortion in the diamond, and increases the longitudinal relaxation time T2. Such an NV center concentration and average phase difference increases the product α of the relaxation time T2 and the NV center concentration C. Therefore, in the diamond spin sensor, the transverse relaxation time T2 can be increased without reducing the NV center concentration C, resulting in a sensor with higher sensitivity than conventional sensors.

 NVセンタ濃度は、0.02ppm以上2ppm以下であってもよい。また、NVセンタ濃度は、0.02ppm以上1.2ppm以下であってもよい。これにより、横緩和時間T2をより増大でき、より感度の高いセンサを実現できる。NVセンタ濃度は、0.04ppm以上5ppm以下であってもよい。NVセンタの濃度は、0.08ppm以上0.5ppm以下であってもよい。 The NV center concentration may be 0.02 ppm or more and 2 ppm or less. The NV center concentration may also be 0.02 ppm or more and 1.2 ppm or less. This allows the transverse relaxation time T2 to be further increased, resulting in a more sensitive sensor. The NV center concentration may also be 0.04 ppm or more and 5 ppm or less. The NV center concentration may also be 0.08 ppm or more and 0.5 ppm or less.

 なお、ダイヤモンド中のNVセンタの濃度は、例えば電子スピン共鳴法(CW-ESR)による測定値から算出できる。また、低濃度の場合、蛍光顕微鏡により観察し、単一のNVセンタを数えることにより計測できる。高濃度の場合、低濃度のNVセンタを含むダイヤモンドに関して、濃度と蛍光強度との換算率を求め、これを用いて、蛍光強度比から換算して濃度を算出できる。さらに、紫外可視吸収分光により測定した吸収スペクトルにおける637nmの吸収係数からNVセンタの濃度を算出することもできる。 The concentration of NV centers in diamond can be calculated from measurements using, for example, electron spin resonance (CW-ESR). Also, for low concentrations, it can be measured by observing with a fluorescence microscope and counting individual NV centers. For high concentrations, for diamonds containing low concentrations of NV centers, the conversion factor between concentration and fluorescence intensity can be found, and this can be used to calculate the concentration by converting from the fluorescence intensity ratio. Furthermore, the concentration of NV centers can also be calculated from the absorption coefficient at 637 nm in the absorption spectrum measured by ultraviolet-visible absorption spectroscopy.

 平均位相差に関して説明する。ダイヤモンドは本来等方的な結晶構造をしており、等方的な屈折率(誘電率)を有する。しかし、実際には、ダイヤモンド単結晶中に欠陥および歪みが存在し、ダイヤモンドは複屈折率を有する。複屈折率を有するダイヤモンドに円偏光の光が照射されると、直交する2方向の偏光(直線偏光)に位相差が発生し、楕円偏光となって出力される。ダイヤモンドから出力される楕円偏光における楕円の長軸および短軸の向き、ならび、長軸および短軸の長さの比から、光学軸および位相差を求めることができる。測定される位相差は、ダイヤモンドを光が透過する方向(例えば、ダイヤモンドの厚さ方向)に積分された値となる。したがって、位相差は、例えばダイヤモンドの厚さにより規格化されて、即ち1mmの厚さに換算された位相差(単付:nm/mm)として表される。位相差は、局所的に測定され、測定対象面内において2次元的に分布する。したがって、位相差は、測定面内における平均値(以下、平均位相差という)により表される。なお、「平均値」とは、面積当たりの位相差という意味ではなく、局部的な測定を複数回実行して得られた位相差を面内にわたって平均した値であり、即ち、位相差の面内の度数分布の平均を意味する。 Explaining the average phase difference. Diamonds inherently have an isotropic crystal structure and an isotropic refractive index (dielectric constant). However, in reality, defects and distortions exist within single-crystal diamonds, resulting in birefringence. When circularly polarized light is irradiated onto a birefringent diamond, a phase difference occurs between the two orthogonal polarized light beams (linearly polarized light), resulting in the output of elliptically polarized light. The optical axis and phase difference can be determined from the orientation of the major and minor axes of the ellipse in the elliptically polarized light output from the diamond, as well as the ratio of the lengths of the major and minor axes. The measured phase difference is the integrated value in the direction in which light passes through the diamond (e.g., the thickness direction of the diamond). Therefore, the phase difference is normalized by the diamond's thickness, i.e., expressed as the phase difference converted to a thickness of 1 mm (unit: nm/mm). The phase difference is measured locally and is distributed two-dimensionally within the measurement surface. Therefore, the phase difference is expressed as the average value within the measurement surface (hereinafter referred to as the average phase difference). Note that "average value" does not mean the phase difference per area, but rather the value obtained by averaging the phase differences obtained by performing multiple local measurements over the surface, i.e., the average frequency distribution of the phase difference over the surface.

 ダイヤモンドスピンセンサ100の表面全体に関する平均位相差は、4nm/mm以下であってもよい。これにより、より大きい積αを実現でき、より感度の高いセンサを実現できる。また、ダイヤモンドスピンセンサの表面全体に関する平均位相差は、3nm/mm以下であってもよく、2nm/mm以下であってもよく、1nm/mm以下であってもよい。これにより、横緩和時間T2をより増大でき、より感度の高いセンサを実現できる。 The average phase difference over the entire surface of the diamond spin sensor 100 may be 4 nm/mm or less. This allows a larger product α to be achieved, resulting in a more sensitive sensor. The average phase difference over the entire surface of the diamond spin sensor may also be 3 nm/mm or less, 2 nm/mm or less, or 1 nm/mm or less. This allows the transverse relaxation time T2 to be further increased, resulting in a more sensitive sensor.

 上記したように、NVセンタの濃度が0.02ppm以上10ppm以下である場合、X線トポグラフィ像により検出されるダイヤモンドスピンセンサ100全体の転位欠陥は、10本以下であればよい。転位欠陥とは、ダイヤモンド中において結晶の並びが1つまたは複数個ずれることにより、ずれのない部分との境界が線状に形成された欠陥を意味する。ダイヤモンド中の転位欠陥が少なければ、横緩和時間T2をより増大でき、より感度の高いセンサを実現できる。 As mentioned above, when the NV center concentration is between 0.02 ppm and 10 ppm, the number of dislocation defects detected in the entire diamond spin sensor 100 by X-ray topography imaging needs to be 10 or less. A dislocation defect is a defect in which the alignment of one or more crystals in the diamond is misaligned, resulting in a linear boundary with the non-misaligned area. Fewer dislocation defects in the diamond can increase the transverse relaxation time T2, resulting in a more sensitive sensor.

 ダイヤモンドにおける成長セクタおよび転位欠陥は、X線回折により検出できる。即ち、X線としてMoKα1線(波長λ=0.71Å(0.071nm)のモリブデンの特性X線)を用い、単結晶ダイヤモンドの(220)面の回折によるX線トポグラフィ像をラングカメラにより撮影する。ダイヤモンド全体の転位欠陥を得るには、X線トポグラフィ像をダイヤモンドの基板全体において撮影して線状の欠陥を数える。欠陥の分布状態をより分かり易くするためには、試料の厚さを0.5mm程度の薄板状に加工することが好ましい。例えば、レーザ加工機により単結晶ダイヤモンドを薄板状に切断し、切断面をスカイフ研磨により平坦化する。または、X線源の側にスリットを設置して、試料内部の限られた層のみからの回折線によるX線トポグラフィ像を得てもよい(断層トポグラフィ:limited projection topography)。これにより、比較的厚い試料に対して薄板状に加工せずに欠陥の有無を評価できる。 Growth sectors and dislocation defects in diamond can be detected by X-ray diffraction. Specifically, MoKα1 X-rays (characteristic X-rays of molybdenum with a wavelength of λ = 0.71 Å (0.071 nm)) are used as the X-rays, and X-ray topography images are taken with a Lang camera due to diffraction from the (220) plane of a single-crystal diamond. To obtain dislocation defects throughout the entire diamond, X-ray topography images are taken across the entire diamond substrate and linear defects are counted. To more clearly visualize the distribution of defects, it is preferable to process the sample into a thin plate approximately 0.5 mm thick. For example, a single-crystal diamond can be cut into thin plates using a laser processing machine, and the cut surface can be flattened by skiff polishing. Alternatively, a slit can be placed next to the X-ray source to obtain X-ray topography images using diffracted rays from only a limited layer within the sample (tomographic topography: limited projection topography). This allows relatively thick samples to be evaluated for defects without having to be processed into thin plates.

 X線トポグラフィ像により検出されるダイヤモンド全体の転位欠陥は、7本以下であってもよい。X線トポグラフィ像により検出されるダイヤモンド全体の転位欠陥は、5本以下であってもよく、3本以下であってもよい。 The number of dislocation defects detected throughout the diamond using X-ray topography images may be seven or fewer. The number of dislocation defects detected throughout the diamond using X-ray topography images may be five or fewer, or may be three or fewer.

 また、上記したように、NVセンタの濃度が0.02ppm以上2ppm以下である場合、X線トポグラフィ像により検出されるダイヤモンド全体の転位欠陥は、0本(即ち、転位欠陥が検出されない)であればよい。これにより、横緩和時間T2をさらに増大でき、さらに感度の高いセンサを実現できる。 Furthermore, as mentioned above, when the concentration of NV centers is between 0.02 ppm and 2 ppm, the number of dislocation defects detected in the entire diamond by X-ray topography images needs to be zero (i.e., no dislocation defects are detected). This allows the transverse relaxation time T2 to be further increased, resulting in an even more sensitive sensor.

 図1に示したダイヤモンドスピンセンサ100において、NVセンタの濃度に対する孤立空孔の濃度の割合は、10%以下であってもよい。孤立空孔とは、空孔の周りに窒素が存在しない状態の空孔を意味する。孤立空孔には、帯電していない空孔と負に帯電している空孔とがある。したがって、濃度の割合は、NVセンタの個数に対する、帯電していない空孔の個数と負に帯電している空孔の個数との和の割合により算出できる。これにより、横緩和時間T2をより増大でき、より感度の高いセンサを実現できる。空孔の密度(濃度)は、中性孤立空孔(V)の密度および負荷電孤立空孔(V)の密度の合計値である。それぞれの孤立空孔の密度は、液体窒素温度においてそれぞれに起因する波長741nmおよび394nmの光の積分吸収(吸収係数の波長積分:単位meV×cm-1)より算出できる。積分吸収Aと密度β(単位cm-3)との比例係数k(k=A/β)は、それぞれ1.2×10-16、および4.8×10-16である。また、空孔の密度を可視領域の吸収係数により算出できない場合には、陽電子消滅法によって算出すればよい。陽電子消滅法により得られる密度の相対数値は、吸収係数により密度を得られる領域の数値を基準として検量(比例計算)することにより、少ない濃度領域も密度に換算できる。 In the diamond spin sensor 100 shown in FIG. 1 , the ratio of the concentration of isolated vacancies to the concentration of NV -centers may be 10% or less. Isolated vacancies refer to vacancies in a state where no nitrogen is present around the vacancies. Isolated vacancies include uncharged vacancies and negatively charged vacancies. Therefore, the concentration ratio can be calculated as the ratio of the sum of the number of uncharged vacancies and the number of negatively charged vacancies to the number of NV -centers . This allows for a longer transverse relaxation time T2, resulting in a more sensitive sensor. The vacancy density (concentration) is the sum of the density of neutral isolated vacancies (V 0 ) and the density of negatively charged isolated vacancies (V - ). The density of each isolated vacancy can be calculated from the integrated absorption (wavelength integral of the absorption coefficient: unit meV×cm -1 ) of light at wavelengths of 741 nm and 394 nm, respectively, at liquid nitrogen temperature. The proportionality coefficient k (k=A/β) between the integrated absorption A and the density β (unit: cm −3 ) is 1.2×10 −16 and 4.8×10 −16 , respectively. Furthermore, when the vacancy density cannot be calculated using the absorption coefficient in the visible region, it can be calculated by positron annihilation. The relative density value obtained by positron annihilation can be converted into density even in low concentration regions by performing calibration (proportional calculation) using the value in the region where density can be obtained using the absorption coefficient as a reference.

 ダイヤモンドスピンセンサ100において、NVセンタの濃度に対する孤立空孔の濃度の割合は、3%以下であってもよい。また、ダイヤモンドスピンセンサ100において、NVセンタの濃度に対する孤立空孔の濃度の割合は、1%以下であってもよく、0.3%以下であってもよい。NVセンタの濃度に対する孤立空孔の濃度の割合を低減することにより、さらに大きい積αを実現でき、さらに感度の高いセンサを実現できる。 In the diamond spin sensor 100, the ratio of the concentration of isolated vacancies to the concentration of NV 1 -centers may be 3% or less. Also, in the diamond spin sensor 100, the ratio of the concentration of isolated vacancies to the concentration of NV 1 -centers may be 1% or less, or may be 0.3% or less. By reducing the ratio of the concentration of isolated vacancies to the concentration of NV 1 -centers, an even larger product α can be achieved, resulting in a sensor with even higher sensitivity.

(ダイヤモンドスピンセンサの製造方法)
 図1に示したダイヤモンドスピンセンサ100の製造方法に関して説明する。粒状ダイヤモンドを種結晶として用い、高圧下の温度差法により合成ダイヤモンドを作製し、その一部を選別して切り出して、後続工程における種結晶とする。
(Manufacturing method of diamond spin sensor)
The following describes a method for manufacturing the diamond spin sensor 100 shown in Fig. 1. Using granular diamond as a seed crystal, a synthetic diamond is produced by a temperature difference method under high pressure, and a portion of the diamond is selected and cut out to be used as a seed crystal in subsequent processes.

 高圧下における温度差法によりダイヤモンドを合成するための装置の構成を図9に示す。温度差法においては、温度差により生じる、溶媒に対するダイヤモンドの溶解度の差を利用して結晶を成長させる。図9を参照して、黒鉛ヒータ252および絶縁部材254を備えた圧力媒体250内において、縦方向の温度勾配を形成し、高温部に絶縁部材254を配置し、低温部に種結晶300を配置し、それらの間に溶媒金属258を配置する。溶媒金属258が溶解する温度以上においてダイヤモンドが熱的に安定になる圧力以上の条件に保持して種結晶300上に単結晶ダイヤモンドを成長させる。炭素源256としては、ダイヤモンド粉末を用いることが好ましい。また、炭素源256として、グラファイト(黒鉛)または熱分解炭素を用いてもよい。溶媒金属258には、鉄(Fe)、コバルト(Co)、ニッケル(Ni)およびマンガン(Mn)などから選ばれる1種以上の金属またはそれらの金属を含む合金が用いられる。高圧発生装置(図示せず)から外力を受けた圧力媒体250による加圧および黒鉛ヒータ252による加熱により、ダイヤモンドが熱力学的に安定な圧力と、溶媒金属258が炭素と共融する温度条件とを実現する。高温部の炭素源256から炭素が溶媒金属258に溶け込み、溶媒金属258下方の低温部に拡散輸送され、種結晶300上に結晶が成長して合成ダイヤモンド302が形成される。 Figure 9 shows the configuration of an apparatus for synthesizing diamond by the temperature gradient method under high pressure. In the temperature gradient method, crystals are grown by utilizing the difference in solubility of diamond in a solvent caused by a temperature difference. Referring to Figure 9, a vertical temperature gradient is created within a pressure medium 250 equipped with a graphite heater 252 and an insulating member 254. The insulating member 254 is placed in the high-temperature section, and the seed crystal 300 is placed in the low-temperature section, with the solvent metal 258 placed between them. Single-crystal diamond is grown on the seed crystal 300 by maintaining conditions above the pressure at which diamond becomes thermally stable at a temperature above the temperature at which the solvent metal 258 melts. Diamond powder is preferably used as the carbon source 256. Graphite or pyrolytic carbon may also be used as the carbon source 256. The solvent metal 258 is made of one or more metals selected from the group consisting of iron (Fe), cobalt (Co), nickel (Ni), and manganese (Mn), or an alloy containing these metals. Pressure is applied by pressure medium 250, which receives external force from a high-pressure generator (not shown), and heating is performed by graphite heater 252, achieving a pressure at which diamond is thermodynamically stable and a temperature condition at which solvent metal 258 is eutectic with carbon. Carbon dissolves into solvent metal 258 from carbon source 256 in the high-temperature section and is transported by diffusion to the low-temperature section below solvent metal 258, where a crystal grows on seed crystal 300, forming synthetic diamond 302.

(第1工程)
 まず、窒素濃度が30ppm以下の単結晶ダイヤモンドを準備する。上記した、高圧単結晶ダイヤモンドの合成方法において、窒素ゲッタを溶媒金属258の中に添加することにより、窒素濃度が30ppm以下の単結晶ダイヤモンドを作製できる。これにより、後述の第2工程において、成長セクタが単一となっており、かつX線トポグラフィにより検出される転位欠陥が10本以下である欠陥の低減された種結晶を切り出すことができる。成長セクタは、PL(Photoluminescence:紫外線照射による発光像)またはCL(Cathodoluminescence:電子線照射による発光像)の蛍光の2次元像(面分布像)により確認できる。即ち、蛍光強度の違う領域の境界が線状をなしているかどうかにより判断できる(特許文献3参照)。
(1st step)
First, a single crystal diamond with a nitrogen concentration of 30 ppm or less is prepared. In the above-mentioned high-pressure single crystal diamond synthesis method, adding a nitrogen getter to the solvent metal 258 allows for the production of a single crystal diamond with a nitrogen concentration of 30 ppm or less. This allows for the cutting out of a seed crystal with a single growth sector and reduced defects, with 10 or fewer dislocation defects detected by X-ray topography, in the second step described below. The growth sector can be confirmed by a two-dimensional fluorescence image (surface distribution image) of PL (photoluminescence: an emission image caused by ultraviolet irradiation) or CL (cathodoluminescence: an emission image caused by electron beam irradiation). That is, it can be determined by whether the boundary between regions with different fluorescence intensities is linear (see Patent Document 3).

 転位は、例えばエッチングテスト(特許文献4参照)により測定される。エッチングテストは、以下のように実行される。単結晶ダイヤモンドを、エッチング液である硝酸カリウム(KNO)融液に浸漬し、白金製のるつぼ内において600℃により1時間加熱する(エッチング)。徐冷した後に単結晶ダイヤモンドを取り出し、表面を光学顕微鏡により50倍の倍率により観察する。1000μm×1000μmの矩形の測定領域内において点状エッチピットの数をカウントして、1mm当たりの点状エッチピットの数を得ることができる。点状エッチピットとは、単結晶ダイヤモンド表面に存在する点状の凹部を意味する。点状エッチピットは転位欠陥に対応する。点状の凹部は、単結晶ダイヤモンドの(100)面上においては四角形、角が丸みを帯びた四角形、または、略円形であり、(111)面上においては三角形、角が丸みを帯びた三角形、または、略円形である。点状の凹部の差し渡し長は約1μmから50μmである。1mm当たりの点状エッチピットの数を100倍することにより、1cm当たりの点状エッチピットの数(転位密度)を算出する。なお、エッチング後の単結晶ダイヤモンドの表面には、点状エッチピットとともに、線状エッチピットが確認される場合がある。線状エッチピットは、単結晶ダイヤモンド中の積層欠陥に由来する。転位欠陥の測定においては、線状エッチピットの数は算入されない。 Dislocations are measured, for example, by an etching test (see Patent Document 4). The etching test is performed as follows: A single crystal diamond is immersed in a potassium nitrate (KNO 3 ) molten solution, which is an etching solution, and heated to 600°C in a platinum crucible for 1 hour (etching). After slow cooling, the single crystal diamond is removed and its surface is observed under an optical microscope at 50x magnification. The number of point-like etch pits is counted within a rectangular measurement area of 1000 μm x 1000 μm to obtain the number of point-like etch pits per mm 2. Point-like etch pits refer to point-like depressions present on the surface of the single crystal diamond. Point-like etch pits correspond to dislocation defects. Point-like depressions are quadrangular, quadrangular with rounded corners, or approximately circular on the (100) plane of the single crystal diamond, and triangular, triangular with rounded corners, or approximately circular on the (111) plane. The diameter of the dot-like recesses is approximately 1 μm to 50 μm. The number of dot-like etch pits per 1 mm2 (dislocation density) is calculated by multiplying the number of dot-like etch pits per 1 mm2 by 100. Note that linear etch pits may be observed on the surface of the single crystal diamond after etching, along with dot-like etch pits. Linear etch pits are derived from stacking faults in the single crystal diamond. The number of linear etch pits is not included in the measurement of dislocation defects.

 転位は、X線トポグラフィによっても検出できる(特許文献5参照)。放射光のX線を用いて透過型により測定する場合、例えば、波長0.71Å(0.071nm)のX線を用い、回折角2θ=32.9°の(220)回折を用いて測定する。また、反射型により測定する場合、例えば、波長0.96Å(0.096nm)のX線を用い、2θ=52.4°の(113)回折を用いて測定してもよい。X線の波長を変えて、また回折角2θを変えて撮影してもよい。実験室系のX線回折装置を用いて測定してもよく、例えばMo線源を用いて(111)回折を、Cu線源を用いて(113)回折を観察してもよい。測定にはCCD(Charge Coupled Device)カメラを使用することも可能だが、解像度を高めるためには原子核乾板を用いるのが好ましい。原子核乾板を現像後、光学顕微鏡により画像を取り込むことにより、転位を特定し、定量化できる。 Dislocations can also be detected by X-ray topography (see Patent Document 5). When measuring in transmission mode using synchrotron X-rays, for example, X-rays with a wavelength of 0.71 Å (0.071 nm) are used, and (220) diffraction at a diffraction angle 2θ = 32.9° is used. When measuring in reflection mode, for example, X-rays with a wavelength of 0.96 Å (0.096 nm) can be used, and (113) diffraction at a diffraction angle 2θ = 52.4° can be used. Images can also be taken by changing the X-ray wavelength and the diffraction angle 2θ. Measurements can also be made using a laboratory X-ray diffraction device; for example, (111) diffraction can be observed using a Mo source, and (113) diffraction can be observed using a Cu source. While a CCD (Charge Coupled Device) camera can also be used for measurements, it is preferable to use a nuclear emulsion plate to increase resolution. After developing the nuclear emulsion, dislocations can be identified and quantified by capturing images using an optical microscope.

 温度差法による単結晶ダイヤモンドの合成において、例えば、溶媒金属258である溶媒金属の組成はFe/Co=10/90から90/10(質量比)とし、溶媒金属に窒素ゲッタとしてチタン(Ti)またはアルミニウム(Al)を1.5質量%以上3質量%以下添加する。炭素源256と種結晶300との温度差が10℃以上25℃以下になるように温度勾配を調整し、圧力5.0GPa以上5.5GPa以下、および、温度1300℃以上1350℃以下の状態を、80時間以上250時間以下にわたって保持する。これにより、図10を参照して、種結晶300から合成ダイヤモンド302が合成される。温度差が25℃を超えると結晶成長が乱れて、微斜面成長痕が認められなくなる傾向がある。温度差が10℃より低いと所定のサイズの結晶成長に長時間を要し、製造コストが問題となる。また、保持中の温度の変化を3℃以内に制御する。これにより、結晶性がより向上する。温度変化が3℃より大きいと成長が不安定となり、結晶欠陥、歪み、および内包物の混入などが発生し、結晶性が低下する。 In the synthesis of single-crystal diamond using the temperature gradient method, for example, the composition of the solvent metal (solvent metal 258) is Fe/Co = 10/90 to 90/10 (mass ratio), and 1.5 to 3 mass% of titanium (Ti) or aluminum (Al) is added to the solvent metal as a nitrogen getter. The temperature gradient is adjusted so that the temperature difference between the carbon source 256 and the seed crystal 300 is 10 to 25°C, and a pressure of 5.0 to 5.5 GPa and a temperature of 1300 to 1350°C are maintained for 80 to 250 hours. As a result, as shown in Figure 10, synthetic diamond 302 is synthesized from the seed crystal 300. If the temperature difference exceeds 25°C, crystal growth becomes disrupted and vicinal growth marks tend to disappear. If the temperature difference is less than 10°C, it takes a long time to grow a crystal of the specified size, which increases production costs. In addition, temperature changes during the holding period are controlled to within 3°C. This further improves crystallinity. If the temperature change is greater than 3°C, growth becomes unstable, resulting in crystal defects, distortion, and the inclusion of inclusions, reducing crystallinity.

(第2工程)
 第1工程により合成した単結晶ダイヤモンドから、後述の第3工程において種結晶として用いるために、カットダイヤモンド304(図10参照)を切り出す。種結晶とするカットダイヤモンド304の種面は、四角形または八角形であることが好ましいが、これらに限定されない。種面のサイズ(例えば対辺の長さ)は、0.3mm以上3mm以下であることが好ましい。種結晶の切り出しは、レーザ加工により厚さ0.5mmから1.0mm程度の板状に切断し、板の表面を研磨して表面粗さRaが20nm以下となるように仕上げる。その後、レーザ切断により0.3mm×0.3mm×0.3mmから3.0mm×3.0mm×1.0mm程度の板状に切り出すことが好ましい。サイズが大きい方が転位欠陥を避けて、単一セクタを取りやすくて好ましい。カットダイヤモンド304が直方体であり、その種面とする平面が(001)結晶面の場合、種面である長方形の1辺は<100>方向または<010>方向に平行である。種面とする平面が(111)結晶面であれば、種面である長方形の1辺は、<1-10>方向、<10-1>方向または<01-1>方向に平行である。これにより、切代を小さくでき、ダメージの少ない種面を有する種結晶が得られる。
(Second process)
A cut diamond 304 (see FIG. 10 ) is cut from the single crystal diamond synthesized in the first step to be used as a seed crystal in the third step described below. The seed surface of the cut diamond 304 used as the seed crystal is preferably, but not limited to, a square or octagon. The size of the seed surface (e.g., the length of the opposite side) is preferably 0.3 mm or more and 3 mm or less. The seed crystal is cut by laser processing into a plate with a thickness of approximately 0.5 mm to 1.0 mm, and the surface of the plate is polished to a surface roughness Ra of 20 nm or less. It is then preferably cut into a plate with a thickness of approximately 0.3 mm × 0.3 mm × 0.3 mm to 3.0 mm × 3.0 mm × 1.0 mm by laser cutting. Larger sizes are preferable because they avoid dislocation defects and make it easier to obtain a single sector. When the cut diamond 304 is a rectangular parallelepiped and the plane used as the seed surface is a (001) crystal plane, one side of the rectangle serving as the seed surface is parallel to the <100> or <010> direction. If the plane to be used as the seed surface is a (111) crystal plane, one side of the rectangle that is the seed surface is parallel to the <1-10> direction, the <10-1> direction, or the <01-1> direction. This allows the cutting margin to be small, and a seed crystal with a seed surface that is less damaged can be obtained.

 温度差法により合成された単結晶ダイヤモンドにおいては、種結晶の主面方向およびその方位からの開き角が約X°方向には転位欠陥が多く存在する。例えば、主面方向が<001>方向の場合は、開き角が約35°(即ちX=35)の<112>方向、<-112>方向、<1-12>方向および<-1-12>方向の4方向に転位欠陥が多い。また、主面方向が<111>方向の場合は、開き角が約19.5°(即ちX=19.5)の<112>方向、<121>方向および<211>方向の3方向に転位欠陥が多い。上記の開き角がX°方向という記載においては、主面方向と<001>方向または<111>方向とが一致していない場合に、開き角に若干のずれが生じるためにX°と表現した。それらが一致していない場合、開き角は35°または19.5°から補正された角度となる。これら開き角と主面の方向±5°とを除く、単一セクタ内は結晶欠陥が少ない良質な結晶である。また、{001}セクタと{111}セクタとの境界のように異なるセクタの境界付近は結晶歪みが多く、欠陥となりやすい。種基板が大きくなると、種基板を起点とした開き角の間隔が広くなり、異なるセクタ境界も端の方に偏るので、良質な結晶のサイズも大きくできる。ここで{abc}セクタとは、{abc}面上に積み重なって成長した領域を意味する。例えば、{001}セクタとは{001}面が積み重なって成長した領域である。よって、この第2工程において、合成ダイヤモンド302の種結晶の主面成長方向±5°を除く、主面成長の単一の成長セクタからカットダイヤモンド304を切り出すことにより、欠陥が少ない種結晶が得られる。 In single-crystal diamonds synthesized by the temperature gradient method, many dislocation defects exist in the principal plane direction of the seed crystal and in directions with an opening angle of approximately X° from that direction. For example, when the principal plane direction is the <001> direction, many dislocation defects exist in four directions with an opening angle of approximately 35° (i.e., X = 35): the <112> direction, the <-112> direction, the <1-12> direction, and the <-1-12> direction. Furthermore, when the principal plane direction is the <111> direction, many dislocation defects exist in three directions with an opening angle of approximately 19.5° (i.e., X = 19.5): the <112> direction, the <121> direction, and the <211> direction. The above description of the opening angle being in the X° direction uses the expression X° because a slight deviation occurs in the opening angle when the principal plane direction does not coincide with the <001> or <111> direction. When they do not coincide, the opening angle is corrected from 35° or 19.5°. Excluding these opening angles and the area within ±5° of the principal plane direction, a single sector contains a high-quality crystal with few crystal defects. Furthermore, near the boundaries between different sectors, such as the boundary between the {001} sector and the {111} sector, there is a lot of crystal distortion and defects are likely to occur. As the seed substrate becomes larger, the spacing between the opening angles starting from the seed substrate widens, and the boundaries between different sectors are also biased toward the edges, allowing for a larger size of high-quality crystal. Here, the {abc} sector refers to a region grown by stacking on the {abc} plane. For example, the {001} sector is a region grown by stacking {001} planes. Therefore, in this second step, a seed crystal with few defects is obtained by cutting out a cut diamond 304 from a single growth sector of the principal plane growth of the synthetic diamond 302 seed crystal, excluding ±5° of the principal plane growth direction.

 種基板が大きくなると、良質な結晶のサイズも大きくできる。例えば、X線トポグラフィにより検出される転位欠陥が10本以下である欠陥の低減された種結晶を切り出すことができる。その種結晶を用いることにより、後続する工程により合成される単結晶ダイヤモンドは、欠陥が少なく、歪みが更に低減される。合成ダイヤモンド302の種結晶の主面成長方向±5°を除く、主面成長の単一の成長セクタとしては、例えば、{001}セクタまたは{111}セクタである。また、これら以外の、結晶学的に存在可能なセクタ({113}セクタ、{115}セクタ、{110}セクタまたは{135}セクタ)であっても、種結晶の主面成長方向±5°を除く、主面成長の単一の成長セクタであればよい。合成ダイヤモンド302から種結晶とするカットダイヤモンド304を切り出す際、転位欠陥の多い部分を含まないようにする限り、1つのセクタ内から切り出してもよく、2つ以上のセクタを含むように切り出してもよい。即ち、カットダイヤモンド304は、セクタ境界を含まなくても、1つのセクタ境界を含んでいてもよい。単結晶ダイヤモンドにおいて、各セクタの領域は、紫外線照射による発光像(紫外線励起発光像)により特定できる。 Increasing the seed substrate size allows for larger quality crystals. For example, it is possible to cut a seed crystal with reduced defects, with 10 or fewer dislocation defects detected by X-ray topography. Using such a seed crystal results in a single crystal diamond synthesized in subsequent processes with fewer defects and further reduced distortion. Examples of a single growth sector of the primary surface growth of the synthetic diamond 302, excluding ±5° from the primary surface growth direction of the seed crystal, include the {001} sector or the {111} sector. Other crystallographically possible sectors (such as the {113} sector, {115} sector, {110} sector, or {135} sector) may also be used, as long as they are a single growth sector of the primary surface growth excluding ±5° from the primary surface growth direction of the seed crystal. When cutting the cut diamond 304 used as the seed crystal from the synthetic diamond 302, it may be cut from within a single sector, or may be cut to include two or more sectors, as long as it does not include areas with many dislocation defects. That is, the cut diamond 304 may include zero or one sector boundary. In a single crystal diamond, the region of each sector can be identified by an luminescence image obtained by irradiating it with ultraviolet light (ultraviolet-excited luminescence image).

(第3工程)
 第2工程により切り出した種結晶を用いて、上記したように、温度差法によりダイヤモンドを合成する。即ち、図11を参照して、カットダイヤモンド304を種結晶310として用い、合成ダイヤモンド312を合成する。これにより、結晶欠陥および歪みの低減された単結晶ダイヤモンドを得ることができる。
(Third step)
Diamond is synthesized by the temperature difference method as described above using the seed crystal cut in the second step. That is, referring to Figure 11, cut diamond 304 is used as seed crystal 310 to synthesize synthetic diamond 312. This allows for the production of a single crystal diamond with reduced crystal defects and strain.

 具体的には、図9を参照して、炭素源256として、ダイヤモンド粉末を用いる。溶媒金属258には、炭素に対する溶解度が高く親和性のよい鉄またはコバルトを用いる。ニッケルまたはマンガンは、合成条件によりダイヤモンド中に微量ながら取り込まれることがある。炭素源256および溶媒金属258に含まれる不純物硼素量を1ppm以下に制御する。これにより、単結晶ダイヤモンドの硼素(B)の原子数基準の含有率を0.1ppm以下にできる。溶媒金属258には、窒素ゲッタとしてチタンを添加する。添加するチタンの濃度は、1.5質量%以上3質量%以下である。これにより、単結晶ダイヤモンド中の原子数基準の窒素含有率を0.1ppm以上10ppm以下とすることができる。窒素ゲッタとしてアルミニウムを添加してもよい。この場合、溶媒金属258にFe-Al合金を用いてもよい。 Specifically, referring to Figure 9, diamond powder is used as the carbon source 256. Iron or cobalt, which has high solubility and affinity for carbon, is used as the solvent metal 258. Depending on the synthesis conditions, trace amounts of nickel or manganese may be incorporated into the diamond. The amount of boron impurity contained in the carbon source 256 and solvent metal 258 is controlled to 1 ppm or less. This allows the boron (B) content in the single crystal diamond to be 0.1 ppm or less based on atomic number. Titanium is added to the solvent metal 258 as a nitrogen getter. The concentration of the added titanium is 1.5 mass% or more and 3 mass% or less. This allows the nitrogen content in the single crystal diamond to be 0.1 ppm or more and 10 ppm or less based on atomic number. Aluminum may be added as a nitrogen getter. In this case, an Fe-Al alloy may be used for the solvent metal 258.

 温度差法の条件としては、例えば、炭素源256と種結晶300との温度差が10℃以上25℃以下になるように温度勾配を調整し、圧力5.0GPa以上5.5GPa以下、および温度1300℃以上1350℃以下の状態を80時間以上300時間以下保持する。温度差が25℃を超えると結晶成長がやや乱れて、微斜面成長が認められなくなることが多い。また、保持中の温度の変化を3℃以内に制御することにより、結晶性がより向上する。 The conditions for the temperature difference method include, for example, adjusting the temperature gradient so that the temperature difference between the carbon source 256 and the seed crystal 300 is 10°C or more and 25°C or less, and maintaining a pressure of 5.0 GPa or more and 5.5 GPa or less and a temperature of 1300°C or more and 1350°C or less for 80 hours or less and 300 hours or less. If the temperature difference exceeds 25°C, crystal growth becomes somewhat disrupted, and vicinal growth often becomes impossible to observe. Furthermore, by controlling the temperature change during maintenance to within 3°C, crystallinity can be further improved.

(第4工程)
 第3工程により合成された合成ダイヤモンド312(図11参照)から、カットダイヤモンド318を切り出す。カットダイヤモンド318は、セクタ境界314を含まない単一の成長セクタ(例えばセクタ316)内にあり、かつX線トポグラフィにより検出される転位が10本以下である領域である。カットダイヤモンド318の切り出しは、レーザ加工を用いて上記した第2工程と同様に行う。
(4th step)
A cut diamond 318 is cut from the synthetic diamond 312 (see FIG. 11) synthesized in the third step. The cut diamond 318 is a region that is within a single growth sector (e.g., sector 316) that does not include the sector boundary 314 and has 10 or fewer dislocations detected by X-ray topography. The cut diamond 318 is cut using laser processing in the same manner as in the second step described above.

(第5工程)
 第4工程により合成ダイヤモンド312から切り出されたカットダイヤモンド318に、300KeV以上1.2MeV以下のエネルギーの電子線を照射する。これにより、カットダイヤモンド318中の炭素の軌道電子を電離させて、炭素原子核をはじき出し、カットダイヤモンド318中に空孔を形成する。なお、500KeV以上1MeV以下のエネルギーの電子線を照射してもよい。電子線照射量は生成したいNV量に応じて1×1018cm-2から4×1019cm-2の範囲において変化させることができる。
(5th step)
The cut diamond 318 cut from the synthetic diamond 312 in the fourth step is irradiated with an electron beam having an energy of 300 KeV or more and 1.2 MeV or less. This ionizes the orbital electrons of carbon in the cut diamond 318, ejecting carbon nuclei and forming vacancies in the cut diamond 318. Alternatively, an electron beam having an energy of 500 KeV or more and 1 MeV or less may be irradiated. The electron beam irradiation dose can be changed in the range of 1×10 18 cm −2 to 4×10 19 cm −2 depending on the amount of NV desired to be generated.

(第6工程)
 第5工程が実行されたカットダイヤモンド318を、真空中において、1100℃以上1400℃以下の温度において0.1時間以上0.5時間以下の間アニールする。これにより、カットダイヤモンド318中の窒素を移動させて、窒素と空孔とよるNVセンタを形成する。
(6th step)
The cut diamond 318 that has been subjected to the fifth step is annealed in a vacuum at a temperature of 1100° C. to 1400° C. for 0.1 to 0.5 hours, thereby moving the nitrogen in the cut diamond 318 and forming NV centers consisting of nitrogen and vacancies.

 以上により、従来よりもサイズが大きく、NVセンタ濃度Cを減少させることなく、横緩和時間T2が増大したダイヤモンドスピンセンサ100を製造できる。 As a result, it is possible to manufacture a diamond spin sensor 100 that is larger in size than conventional ones and has an increased transverse relaxation time T2 without reducing the NV center concentration C.

 上記の第5工程の照射ステップおよび第6工程のアニールステップは、2回以上繰り返されてもよい。これにより、カットダイヤモンド318中に所望量のNVセンタを形成できる。 The irradiation step in step 5 and the annealing step in step 6 may be repeated two or more times. This allows the desired amount of NV centers to be formed in the cut diamond 318.

 上記したように、第3工程において窒素ゲッタが用いられる。窒素ゲッタは、チタン(Ti)、ジルコニウム(Zr)、ハフニウム(Hf)、ガリウム(Ga)、アルミニウム(Al)、銅(Cu)、銀(Ag)および金(Au)のいずれかを含むことができる。これにより、横緩和時間T2およびNVセンタ濃度Cの積を増大でき、より感度の高いセンサを実現できる。 As mentioned above, a nitrogen getter is used in the third step. The nitrogen getter can contain any of titanium (Ti), zirconium (Zr), hafnium (Hf), gallium (Ga), aluminum (Al), copper (Cu), silver (Ag), and gold (Au). This increases the product of the transverse relaxation time T2 and the NV center concentration C, resulting in a more sensitive sensor.

 上記したように、カットダイヤモンド318は、セクタ境界を1つだけ含む、または、セクタ境界を含まなくてもよい。これにより、横緩和時間T2およびNVセンタ濃度Cの積を増大でき、より感度の高いセンサを実現できる。 As mentioned above, the cut diamond 318 may include only one sector boundary, or may not include any sector boundaries. This increases the product of the transverse relaxation time T2 and the NV center concentration C, resulting in a more sensitive sensor.

 なお、図12を参照して、より大きい種結晶320を用いて、上記の合成ステップ(第3工程参照)を実行してもよい。例えば、直方体である種結晶320において、(001)結晶面または(111)結晶面の長方形の1辺の長さLは3mm以上である。これにより、不純物の入りやすいセクタ境界324をセクタ326の中央部から離隔させることができる。したがって、種結晶320から成長した合成ダイヤモンド322のセクタ326から、より大きいカットダイヤモンド328を切り出すことができる。切り出されたカットダイヤモンド328に対して、上記したように、電子線の照射(第5工程)およびアニール(第6工程)を実行する。これにより、より大きいダイヤモンドスピンセンサ100を製造できる。 Note that, with reference to FIG. 12 , the above synthesis step (see step 3) may be performed using a larger seed crystal 320. For example, in a rectangular seed crystal 320, the length L of one side of the rectangle of the (001) crystal face or the (111) crystal face is 3 mm or more. This allows the sector boundary 324, which is prone to impurities, to be separated from the center of the sector 326. Therefore, a larger cut diamond 328 can be cut out from the sector 326 of the synthetic diamond 322 grown from the seed crystal 320. The cut cut diamond 328 is then subjected to electron beam irradiation (step 5) and annealing (step 6) as described above. This allows a larger diamond spin sensor 100 to be manufactured.

 上記のようにして合成されたダイヤモンドを、図13に模式的に示す。図13は、(001)面の平面図である。図13の左右方向は<100>方向である。4隅の三角形領域であるセクタ332は、(111)セクタを表す。異なるセクタの境界は、不純物濃度が異なるセクタ境界(ドットパターン参照)となり歪みが形成され、不純物が混入している。図12に示したように、種結晶を大きくすることにより、不純物が混入している領域を、中央部からより外周方向に位置させることができる。したがって、より大きい領域を切り出して、より大きいダイヤモンドスピンセンサを作製できる。図13を参照して、1つのセクタ330内の斜線部分を切り出して種結晶として用い、ダイヤモンドスピンセンサを作製できる。また、破線により示すように、転位欠陥と2つのセクタ領域とを含むように切り出すことにより、より大きい種結晶を作製し、それを用いてダイヤモンドスピンセンサを作製してもよい。さらには、(111)セクタであるセクタ330全体を種結晶として用い、ダイヤモンドスピンセンサを作製してもよい。 A diamond synthesized as described above is shown schematically in Figure 13. Figure 13 is a plan view of the (001) plane. The left-right direction in Figure 13 corresponds to the <100> direction. Sectors 332, which are triangular regions at the four corners, represent (111) sectors. The boundaries between different sectors are sector boundaries with different impurity concentrations (see dot pattern), which create distortion and introduce impurities. As shown in Figure 12, by increasing the size of the seed crystal, the impurity-contaminated region can be positioned more toward the periphery from the center. Therefore, a larger region can be cut out and a larger diamond spin sensor can be fabricated. Referring to Figure 13, a diamond spin sensor can be fabricated by cutting out the shaded portion of one sector 330 and using it as a seed crystal. Alternatively, as shown by the dashed lines, a larger seed crystal can be fabricated by cutting out a region that includes dislocation defects and two sector regions, and a diamond spin sensor can be fabricated using this. Furthermore, the entire (111) sector 330 can be used as a seed crystal to fabricate a diamond spin sensor.

 比較例として、従来のNVのスピンセンサ用の合成ダイヤモンドを図14に示す。図14は、図13と同様の平面図である。セクタ342は、(111)セクタである。図14の合成ダイヤモンドにおいて、最も大きい(001)セクタ340の周縁部分には、不純物濃度が異なる大きいセクタ境界(ドットパターン参照)が形成されており、ダイヤモンドスピンセンサとして十分な大きさの領域を切り出すことができないことが分かる。(001)セクタおよび(111)セクタのように異なるセクタが境界を形成するからである。 As a comparative example, Figure 14 shows a synthetic diamond for a conventional NV spin sensor. Figure 14 is a plan view similar to Figure 13. Sector 342 is a (111) sector. In the synthetic diamond of Figure 14, a large sector boundary (see dot pattern) with different impurity concentrations is formed around the periphery of the largest (001) sector 340, and it can be seen that it is not possible to cut out an area large enough for a diamond spin sensor. This is because different sectors, such as the (001) sector and the (111) sector, form a boundary.

 以下、実施例により、本開示のダイヤモンドスピンセンサの有効性を示す。上記した製造方法により作製した複数のダイヤモンドスピンセンサを用いて、横緩和時間T2およびNVセンタ濃度Cを測定した。製造条件を図15に示し、測定結果を図15および図16に示す。 The effectiveness of the diamond spin sensor disclosed herein will be demonstrated below through examples. The transverse relaxation time T2 and NV center concentration C were measured using multiple diamond spin sensors fabricated using the above-described manufacturing method. The manufacturing conditions are shown in Figure 15, and the measurement results are shown in Figures 15 and 16.

 図15には、上記したように作製した合成ダイヤモンドから、レーザ加工機を用いて、所定サイズのダイヤモンド種結晶を切り出した(第2工程参照)ものをSample1からSample8として示している。例えば、Sample1からSample6は、3mm×3mm×0.5mmの種結晶である。Sample9は、CVD(Chemical Vapor Deposition)により製造された市販の合成ダイヤモンド(ElementSix社製のDNV-B14)である。各種結晶は、図15の「種結晶切り出しセクタ」欄に記載したセクタ内から切り出した。「種結晶切り出しセクタ」欄において「(100)」とは、(100)セクタから切り出すことを意味する。また、「(100)+(111)」とは、(100)セクタおよび(111)セクタを含むように切り出すことを意味する。得られたダイヤモンド種結晶における欠陥の有無をX線トポグラフィ像により確認した。確認された転位欠陥の数を、図15の「転位欠陥」の欄に示す。 Figure 15 shows diamond seed crystals of a specified size cut using a laser processing machine from the synthetic diamond produced as described above (see step 2), shown as Samples 1 to 8. For example, Samples 1 to 6 are 3mm x 3mm x 0.5mm seed crystals. Sample 9 is a commercially available synthetic diamond (DNV-B14 manufactured by ElementSix) produced by CVD (Chemical Vapor Deposition). The various crystals were cut from within the sectors listed in the "Seed Crystal Cutting Sector" column of Figure 15. In the "Seed Crystal Cutting Sector" column, "(100)" means cut from the (100) sector. Furthermore, "(100) + (111)" means cut to include both the (100) and (111) sectors. The presence or absence of defects in the resulting diamond seed crystals was confirmed using X-ray topography images. The number of dislocation defects confirmed is shown in the "Dislocation Defects" column in Figure 15.

 次に、温度差法により、上記のダイヤモンド種結晶上に、ダイヤモンド結晶を成長させて、各試料の単結晶ダイヤモンドを得た(第3工程参照)。これは、図15においてHPHT(High-Pressure High-Temperature)により示されている。炭素源には、不純物として窒素を100ppmから200ppm、硼素を0.5ppmから1ppm含むダイヤモンド粉末を用いた。溶媒金属には、高純度の鉄(Fe)およびコバルト(Co)を用い、溶媒組成はFe:Co=55:45(重量比)とした。溶媒金属にチタンを1.75質量%添加した。各試料の温度差法における条件は、窒素ゲッタとしてチタンを用い、高温部(炭素源)と低温部(種結晶)との温度差が23℃、圧力が5.3GPa、低温部の保持温度が1350℃である。保持時間は150時間とした。 Next, a diamond crystal was grown on the diamond seed crystal using the temperature gradient method to obtain a single-crystal diamond for each sample (see step 3). This is indicated by HPHT (High-Pressure High-Temperature) in Figure 15. Diamond powder containing 100 ppm to 200 ppm of nitrogen and 0.5 ppm to 1 ppm of boron as impurities was used as the carbon source. High-purity iron (Fe) and cobalt (Co) were used as the solvent metal, with a solvent composition of Fe:Co = 55:45 (weight ratio). 1.75 mass% titanium was added to the solvent metal. The temperature gradient method for each sample was performed under the following conditions: titanium was used as the nitrogen getter, the temperature difference between the high-temperature section (carbon source) and the low-temperature section (seed crystal) was 23°C, the pressure was 5.3 GPa, and the holding temperature of the low-temperature section was 1350°C. The holding time was 150 hours.

 その後、上記した第4工程から第6工程を実行して、複数のダイヤモンドスピンセンサを作製した。電子線照射エネルギーは0.95MeV、電子線照射量は8×1018cm-2、アニール温度は1100℃、アニール時間は15分であった。第4工程により切り出したダイヤモンドに関して、図15の「センサ用素材の切り出し方法」の欄に示す。「成長セクタの位置」に関して、「上」は、図13の斜線部分を表し、「上+隣」は、図13の破線部分を表す。測定した窒素濃度(ppm単位)およびNVセンタ濃度(ppm単位)を、それぞれ「N濃度」欄および「NV濃度」欄に示す。 Subsequently, steps 4 to 6 described above were carried out to fabricate multiple diamond spin sensors. The electron beam irradiation energy was 0.95 MeV, the electron beam dose was 8 x 10 18 cm -2 , the annealing temperature was 1100°C, and the annealing time was 15 minutes. The diamonds cut by step 4 are shown in the "Method for cutting sensor material" column in Figure 15. Regarding the "position of growth sector,""above" represents the shaded area in Figure 13, and "above + adjacent" represents the dashed area in Figure 13. The measured nitrogen concentration (in ppm) and NV - center concentration (in ppm) are shown in the "N concentration" and "NV - concentration" columns, respectively.

 作製したダイヤモンドスピンセンサを用いて横緩和時間T2を測定した。その結果を、図16に示す。Sample1からSample9は、図15と同じものである。図16において、位相差は表面全体に関する平均位相差(nm/mm単位)を表す。(V+V)/NVは、NVセンタの個数に対する、帯電していない孤立空孔の個数と負に帯電している孤立空孔の個数との和の割合を意味する。積αは、横緩和時間T2(μsec単位)とNVセンタ濃度(ppm単位)との積を意味する。 The transverse relaxation time T2 was measured using the fabricated diamond spin sensor. The results are shown in Figure 16. Samples 1 to 9 are the same as those in Figure 15. In Figure 16, the phase difference represents the average phase difference (unit: nm/mm) over the entire surface. (V 0 +V - )/NV - means the ratio of the sum of the number of uncharged isolated vacancies and the number of negatively charged isolated vacancies to the number of NV - centers. The product α means the product of the transverse relaxation time T2 (unit: μsec) and the NV - center concentration (unit: ppm).

 図16に示したように、積αは、Sample1からSample6のいずれに関しても65よりも大きい。Sample1、Sample2、Sample5およびSample6に関して、積αは120よりも大きい。Sample5およびSample6に関して、積αは160よりも大きい。Sample6の積αは、200よりも大きく、250よりも大きい。Sample1およびSample6はいずれも、Sample7からSample9よりも大きい積αを実現できており、横緩和時間T2も大きいことが分かる。Sample1からSample6のNVセンタ濃度は、Sample7およびSample8のNVセンタ濃度よりも小さい。そのため、Sample1からSample6の横緩和時間T2は、Sample7およびSample8の横緩和時間T2よりも大きくなっている。一方、Sample1からSample3とSample9とを比較すると、NVセンタ濃度はほぼ同程度の値であるが、Sample1からSample3の横緩和時間T2は、Sample9の横緩和時間T2よりも大きい。したがって、NVセンタ濃度を減少させることなく、横緩和時間T2を増大させたダイヤモンドを実現できたことが分かる。 As shown in Figure 16, the product α is greater than 65 for all of Samples 1 to 6. For Samples 1, 2, 5, and 6, the product α is greater than 120. For Samples 5 and 6, the product α is greater than 160. The product α for Sample 6 is greater than 200 and greater than 250. It can be seen that Samples 1 and 6 all achieve a greater product α than Samples 7 to 9, and also have longer transverse relaxation times T2. The NV -center concentrations for Samples 1 to 6 are lower than those for Samples 7 and 8. Therefore, the transverse relaxation times T2 of Samples 1 to 6 are longer than those of Samples 7 and 8. On the other hand, when Samples 1 to 3 are compared with Sample 9, the NV center concentrations are approximately the same, but the transverse relaxation times T2 of Samples 1 to 3 are longer than that of Sample 9. Therefore, it can be seen that a diamond with an increased transverse relaxation time T2 has been achieved without reducing the NV center concentration.

 NVセンタ濃度に関して、Sample1からSample6のいずれも、0.02ppm以上10ppm以下を実現でき、Sample6は0.02ppm以上1.2ppm以下を実現でき、Sample5およびSample6は0.02ppm以上2ppm以下を実現できている。表面全体に関する平均位相差に関して、Sample1からSample6は6nm/mm以下を実現でき、Sample1、Sample2、Sample5およびSample6は、平均位相差4nm/mm以下を実現できている。(V+V)/NVに関して、Sample1からSample6は、10%以下を実現できている。転位欠陥数に関して、Sample1からSample6は、10本以下を実現でき、Sample5およびSample6は、0本を実現できている。 With regard to the NV - center concentration, Samples 1 to 6 all achieved 0.02 ppm to 10 ppm, Sample 6 achieved 0.02 ppm to 1.2 ppm, and Samples 5 and 6 achieved 0.02 ppm to 2 ppm. With regard to the average phase difference over the entire surface, Samples 1 to 6 achieved 6 nm/mm or less, and Samples 1, 2, 5, and 6 achieved an average phase difference of 4 nm/mm or less. With regard to (V 0 +V - )/NV - , Samples 1 to 6 achieved 10% or less. Regarding the number of dislocation defects, Sample 1 to Sample 6 can achieve 10 or less, while Sample 5 and Sample 6 can achieve 0.

 以上、実施の形態を説明することにより本開示を説明したが、上記した実施の形態は例示であって、本開示は上記した実施の形態のみに制限されるわけではない。本開示の範囲は、発明の詳細な説明の記載を参酌した上で、請求の範囲の各請求項によって示され、そこに記載された文言と均等の意味および範囲内での全ての変更を含む。 The present disclosure has been described above by explaining the embodiments, but the above-described embodiments are merely examples, and the present disclosure is not limited to the above-described embodiments. The scope of the present disclosure is indicated by the claims in the scope of the claims, taking into consideration the detailed description of the invention, and includes all modifications that are equivalent in meaning and scope to the wording set forth therein.

100  ダイヤモンドスピンセンサ
102  第1面
104  第1辺
202  電磁波照射部
204  励起光
206  蛍光
210  励起光発生部
212  フィルタ
214  集光素子
216  光導波路
218  LPF
220  光検知部
230  制御部
232  電磁波発生部
250  圧力媒体
252  黒鉛ヒータ
254  絶縁部材
256  炭素源
258  溶媒金属
300、310、320  種結晶
302、312、322  合成ダイヤモンド
304、318、328  カットダイヤモンド
314、324  セクタ境界
316、326、330、332、340、342  セクタ
A1、A2、A3、A4、A5、A6、A7、A8  点
C  炭素
L  長さ
N  窒素
P1、P2、P3  パルス
t、t1、t2、t3、τ  時間間隔
V  空孔
X、Y、Z  軸
Δf  周波数差
φ  角度
 
100 Diamond spin sensor 102 First surface 104 First edge 202 Electromagnetic wave irradiating unit 204 Excitation light 206 Fluorescence 210 Excitation light generating unit 212 Filter 214 Light collecting element 216 Optical waveguide 218 LPF
220 Light detection unit 230 Control unit 232 Electromagnetic wave generation unit 250 Pressure medium 252 Graphite heater 254 Insulating member 256 Carbon source 258 Solvent metal 300, 310, 320 Seed crystal 302, 312, 322 Synthetic diamond 304, 318, 328 Cut diamond 314, 324 Sector boundary 316, 326, 330, 332, 340, 342 Sector A1, A2, A3, A4, A5, A6, A7, A8 Point C Carbon L Length N Nitrogen P1, P2, P3 Pulse t, t1, t2, t3, τ Time interval V Vacancy X, Y, Z Axis Δf Frequency difference φ Angle

Claims (8)

 電子スピンを持つNVセンタを含むダイヤモンドを含み、
 ハーンエコー法により測定された前記電子スピンの横緩和時間をT2μsecとし、前記ダイヤモンド中の前記NVセンタの濃度をCppmとして、前記T2および前記Cの積は、65よりも大きい、ダイヤモンドスピンセンサ。
Diamond containing an NV - center having an electron spin,
A diamond spin sensor, wherein the product of T2 and C is greater than 65, where T2 is the transverse relaxation time of the electron spin measured by the Hahn echo method, and C is the concentration of the NV center in the diamond.
 前記積は、200よりも大きい、請求項1に記載のダイヤモンドスピンセンサ。 The diamond spin sensor of claim 1, wherein the product is greater than 200.  前記NVセンタの前記濃度は、0.02ppm以上10ppm以下であり、
 前記ダイヤモンドの表面全体に関する平均位相差は、6nm/mm以下である、請求項1または請求項2に記載のダイヤモンドスピンセンサ。
the concentration of the NV center is 0.02 ppm or more and 10 ppm or less,
3. The diamond spin sensor according to claim 1, wherein the average phase difference over the entire surface of the diamond is 6 nm/mm or less.
 前記平均位相差は、4nm/mm以下である、請求項3に記載のダイヤモンドスピンセンサ。 The diamond spin sensor of claim 3, wherein the average phase difference is 4 nm/mm or less.  前記NVセンタの前記濃度は、0.02ppm以上1.2ppm以下である、請求項1から請求項4のいずれか1項に記載のダイヤモンドスピンセンサ。 5. The diamond spin sensor according to claim 1, wherein the concentration of the NV center is 0.02 ppm or more and 1.2 ppm or less.  前記NVセンタの前記濃度は、0.02ppm以上10ppm以下であり、
 X線トポグラフィ像により検出される前記ダイヤモンド全体の転位欠陥は、10本以下である、請求項1から請求項4のいずれか1項に記載のダイヤモンドスピンセンサ。
the concentration of the NV center is 0.02 ppm or more and 10 ppm or less,
5. The diamond spin sensor according to claim 1, wherein the number of dislocation defects in the entire diamond detected by an X-ray topography image is 10 or less.
 前記NVセンタの前記濃度は、0.02ppm以上2ppm以下であり、
 前記転位欠陥は、0本である、請求項6に記載のダイヤモンドスピンセンサ。
the concentration of the NV center is 0.02 ppm or more and 2 ppm or less,
7. The diamond spin sensor according to claim 6, wherein the number of dislocation defects is zero.
 前記NVセンタの前記濃度に対する前記ダイヤモンド中の孤立空孔の濃度の割合は、10%以下である、請求項1から請求項7のいずれか1項に記載のダイヤモンドスピンセンサ。
 
8. The diamond spin sensor according to claim 1, wherein the ratio of the concentration of isolated vacancies in the diamond to the concentration of the NV centers is 10% or less.
PCT/JP2025/006198 2024-02-28 2025-02-25 Diamond spin sensor Pending WO2025182852A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006315942A (en) * 2005-04-15 2006-11-24 Sumitomo Electric Ind Ltd Single crystal diamond and method for producing the same
JP2014515000A (en) * 2011-05-24 2014-06-26 エレメント シックス リミテッド Diamond sensor, detector and quantum device
JP2014516905A (en) * 2011-05-06 2014-07-17 エレメント シックス リミテッド Diamond sensors, detectors and quantum devices
WO2022209512A1 (en) * 2021-03-31 2022-10-06 住友電気工業株式会社 Single crystal diamond and method for producing same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006315942A (en) * 2005-04-15 2006-11-24 Sumitomo Electric Ind Ltd Single crystal diamond and method for producing the same
JP2014516905A (en) * 2011-05-06 2014-07-17 エレメント シックス リミテッド Diamond sensors, detectors and quantum devices
JP2014515000A (en) * 2011-05-24 2014-06-26 エレメント シックス リミテッド Diamond sensor, detector and quantum device
WO2022209512A1 (en) * 2021-03-31 2022-10-06 住友電気工業株式会社 Single crystal diamond and method for producing same

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