WO2025162901A1 - Mems structure for a mems device, mems device and method for producing the mems structure - Google Patents

Abstract

The invention relates to a MEMS structure (100) for a MEMS device (1000), in particular a MEMS mirror device, comprising: a functional element (1), which is designed to be movable in an oscillating manner along and/or about at least two oscillation axes X, Y, and spring portions (3a - 3d) which hold the functional element (1) so as to be movable in an oscillating manner along and/or about the at least two oscillation axes, wherein at least a proportion of the spring portions (3a - 3d) are formed at a distance to the functional element (1) in the direction of a normal vector of a substrate plane, and the spring portions (3a - 3d) of the proportion of the spring portions (3a - 3d) are designed to be axially symmetrical with respect to at least one of the oscillation axes X, Y.

Description

MEMS structure for a MEMS device, MEMS device

AND METHOD FOR MANUFACTURING THE MEMS STRUCTURE

Description

The present disclosure relates to a MEMS structure for a MEMS device, in particular a MEMS mirror device, a MEMS device, in particular a MEMS mirror device, comprising the MEMS structure, and a method for manufacturing the MEMS structure.

Background

MEMS devices are microsystems that typically comprise electronics including multiple sensors and actuators arranged on a substrate and have very small dimensions in the range of a few millimeters to sometimes sub-millimeter range.

For the most diverse applications of microsystems or MEMS devices, the moving parts of the MEMS device are operated in a translational manner along one or more spatial axes and/or in a rotational manner around one or more spatial axes, oscillating or vibrating, often in the range of the respective resonance frequency.

In the near future, the aspects of the cost of such MEMS devices, their physical size and weight, as well as the energy they consume during operation, will be of central importance for future generations of MEMS devices. Cost, size, weight, and energy consumption, also known as C-SWAP (Cost, Size, Weight, and Power), are expected to continue to decrease.

Reducing the size of MEMS devices is a particular challenge. The size of a MEMS device in terms of area is essentially determined by its functional sections or elements, which can be, for example, a functional element (such as a movable mass) and spring sections that resiliently hold the functional element, and a solid structure surrounding the spring sections, as is the case, for example, with acceleration sensors and angular rate sensors in In the case of pressure sensors, for example, the size of the elastic membrane and the structure surrounding the membrane can have a significant influence.

A special form of MEMS devices is the MEMS mirror device, which has a mirror plate, spring structures, and a frame that determine the area of the MEMS mirror device.

In particular, in previous designs of MEMS mirror devices, the mirror plate, the spring structures, and the frame are essentially realized in a single plane, resulting in a comparatively large surface area for the mechanically effective functional layer comprising the mirror plate, the spring structures, and the frame compared to the actual usable mirror surface. The space beneath the mirror plate usually remains unused.

WO 2022/128284 A1 discloses a micromirror array in which a flexible membrane with curved webs and a heat-conducting column for supporting the individual mirror are arranged below each individual mirror. Four deformable lever arms are proposed for deflecting the individual mirror. These extend in an arcuate manner counterclockwise from a respective fixing point to column-like connections with the individual mirror.

However, this known design has many disadvantageous elements for high oscillation frequencies, such as the column-like connections and the heat-conducting column, which must be moved with the oscillations of the individual mirror, as well as the lever arms and the deformable membrane, which must be deformed to generate/enable oscillation of the individual mirror. Furthermore, the four deformable lever arms that generate the oscillation of the individual mirror, in combination with the flexible membrane, result in less precise positioning of the oscillation axes, which can lead to less stable oscillation behavior of the oscillating system.

In view of the disadvantages described above, it is an object of the present application to provide an improved MEMS structure and an improved MEMS device as well as a method for manufacturing the MEMS structure, with which the above-mentioned disadvantages are avoided. Summary

The present disclosure relates to a MEMS structure for a MEMS device, in particular a MEMS mirror device, a MEMS device, in particular a MEMS mirror device, comprising the MEMS structure, and a method for manufacturing the MEMS structure.

In particular, to achieve the above-mentioned object, a MEMS structure for a MEMS device, in particular a MEMS mirror device, according to independent claim 1, a MEMS device, in particular a MEMS mirror device, according to independent claim 22, and a method for manufacturing the MEMS structure according to independent claim 23 are proposed. The dependent claims relate to some exemplary preferred embodiments.

According to a first aspect, in some embodiments, a MEMS structure for a MEMS device, in particular a MEMS mirror device, is proposed, comprising: a functional element which is designed to be oscillatingly movable along and/or about at least two oscillation axes, and spring sections which hold the functional element oscillatingly movable along and/or about the at least two oscillation axes, wherein at least some of the spring sections are designed to be spaced apart from the functional element in the direction of a normal vector of a substrate plane and the spring sections of the part of the spring sections are designed to be axially symmetrical to at least one of the oscillation axes.

In some preferred embodiments, the MEMS structure can be further developed such that at least a part of the spring sections at least partially overlaps with the functional element in a direction perpendicular to the normal vector of the substrate plane.

In some preferred embodiments, the MEMS structure can be further developed such that the functional element has at least one coupling section, by means of which the functional element is mechanically connected to the spring sections.

In some preferred embodiments, the MEMS structure can be further developed such that the functional element has at least two coupling sections, by means of which the functional element is mechanically connected to the spring sections. In some preferred embodiments, the MEMS structure can be further developed such that the at least one coupling section or the at least two coupling sections are connected to the functional element on the side of the functional element which faces the spring sections.

In some preferred embodiments, the MEMS structure can be further developed such that the at least one coupling section or at least one of the at least two coupling sections has at least two support sections that are connected to the functional element and a beam section that connects the at least two support sections to one another and that is connected to at least one spring section.

In some preferred embodiments, the MEMS structure can be further developed such that the spring sections are formed in pairs for the oscillation of the functional element in the corresponding dimension.

In some preferred embodiments, the MEMS structure can be further developed such that each pair of spring sections has a connecting section by means of which the two spring sections of the respective pair are connected to one another, and the connecting section of a first pair of spring sections is also the connecting section of a second pair of spring sections.

In some preferred embodiments, the MEMS structure may be further developed such that the spring portions of the first pair of spring portions are formed substantially perpendicular to the spring portions of the second pair of spring portions.

In some preferred embodiments, the MEMS structure may be further developed such that each of the spring portions of the first pair is connected to one of the two coupling portions at an end opposite the connecting portion, and each of the spring portions of the second pair has an anchor portion at an end opposite the connecting portion, which is configured to be connected to an external structure.

In some preferred embodiments, the MEMS structure can be further developed such that the second pair of spring sections is formed so as to protrude relative to the functional element in the longitudinal direction of the second pair of spring sections. In some preferred embodiments, the MEMS structure can be further developed such that the functional element has an overhang relative to the second pair of spring sections in the longitudinal direction of the second pair of spring sections, advantageously an overhang of 10 - 50% of the length of the second pair of spring sections, particularly advantageously an overhang of 25 - 35% of the length of the second pair of spring sections.

In some preferred embodiments, the MEMS structure can be further developed such that the second pair of spring sections terminates with the functional element in the longitudinal direction of the second pair of spring sections, so that neither the functional element has an overhang in the longitudinal direction of the second pair of spring sections relative to the second pair of spring sections, nor does the second pair of spring sections protrude relative to the functional element in the longitudinal direction of the second pair of spring sections.

In some preferred embodiments, the MEMS structure can be further developed such that the functional element has a functional section and a frame section that surrounds the functional section, and the frame section of the functional element has at least one coupling section by means of which the functional element is mechanically connected to the spring sections.

In some preferred embodiments, the MEMS structure can be further developed such that the functional element further comprises at least two holding sections which are formed between the functional section and the frame section and mechanically connect the functional section to the frame section.

In some preferred embodiments, the MEMS structure can be further developed such that the functional element further comprises at least one holding section which is formed between a functional section and at least one coupling section and mechanically connects the functional section to the respective coupling section.

In some preferred embodiments, the MEMS structure can be further developed such that the at least one holding section or the at least two holding sections are further designed as resilient holding sections, in particular as torsion- and/or bending-resilient holding sections. In some preferred embodiments, the MEMS structure can be further developed such that the resilient holding sections between the functional section and the frame section are configured to hold the functional section oscillatively movable relative to the functional element along a first oscillation axis, and at least the part of spring sections that is spaced apart from the functional element in the direction of the normal vector of the substrate plane is configured to hold the functional element oscillatively movable along a second oscillation axis.

In some preferred embodiments, the MEMS structure can be further developed such that the spring sections of the part of spring sections are formed in pairs for the oscillation of the functional element in the corresponding dimension, and the pair of spring sections has a connecting section by means of which the two spring sections of the pair of spring sections are connected to one another, wherein the connecting section further has an anchor section which is configured to be connected to an external structure.

In some preferred embodiments, the MEMS structure can be further developed such that at least one lever section is formed between the respective anchor section and the respective spring section, which lever section is configured to excite an oscillation of the functional element.

In some preferred embodiments, the MEMS structure can be further developed such that each of the spring sections, which is spaced from the functional element in the direction of the normal vector of the substrate plane, is formed from two parallel spring subsections.

In some preferred embodiments, the MEMS structure can be further developed such that a first spring section of a first spring section of the first pair of spring sections has a connecting section with a first spring section of a second spring section of the second pair of spring sections, a second spring section of the second spring section of the second pair of spring sections has a connecting section with a second spring section of a second spring section of the first pair of spring sections, a first spring section of the second spring section of the first pair of spring sections has a connecting section with a first spring section of the first spring section of the second pair of spring sections, and a second spring section of the first Spring section of the second pair of spring sections has a connecting section with a second spring subsection of the first spring section of the first pair of spring sections.

In some preferred embodiments, the MEMS structure can be further developed such that the spring subsections, which have a common connecting section with one another, are formed substantially at right angles to one another.

In some preferred embodiments, the MEMS structure may be further developed such that each of the spring sub-sections of the second pair has, at an end opposite the connecting section, an anchor section which is adapted to be connected to an external structure.

In some preferred embodiments, the MEMS structure can be further developed such that a lever section is further formed between the respective anchor section and the respective spring part section of the second pair, which lever section is configured to excite an oscillation of the functional element.

In some preferred embodiments, the MEMS structure can be further developed such that each of the spring sections, which is spaced from the functional element in the direction of the normal vector of the substrate plane, is formed from at least two spring subsections extending axially symmetrically to the at least one of the oscillation axes.

In some preferred embodiments, the MEMS structure can be further developed such that each of the two axially symmetrical spring sections is formed exclusively in an angular, arcuate, straight line or as a combination of the designated shapes.

In some preferred embodiments, the MEMS structure can be further developed such that the lever section has a higher spring stiffness relative to the respective spring section or spring sub-section to which the lever section is connected.

In some preferred embodiments, the MEMS structure can be further developed such that the lever sections are arc-shaped or partially circular. In some preferred embodiments, the MEMS structure can be further developed by at least one actuator which is provided on at least one of the spring sections which are formed spaced from the functional element in the direction of the normal vector of the substrate plane, or on at least one lever section.

In some preferred embodiments, the MEMS structure can be further developed such that the at least one actuator is provided between the at least one spring section and the functional element, or the at least one actuator is provided between the at least one lever section and the functional element.

In some preferred embodiments, the MEMS structure can be further developed such that the at least one actuator is provided on the side of the at least one spring section that faces away from the functional element, or the at least one actuator is provided on the side of the at least one lever section that faces away from the functional element.

In some preferred embodiments, the MEMS structure can be further developed such that the functional element has a functional section with a functional surface formed by a mirror surface or by a mirror element provided on the functional section.

According to a second aspect, in some embodiments, a MEMS device, in particular a MEMS mirror device, is proposed, comprising: a previously designated MEMS structure, an outer structure to which the MEMS structure is connected, and a transparent element, wherein the outer structure and the transparent element are configured to vacuum pack the MEMS structure within the MEMS device.

In some preferred embodiments, the MEMS device may be further developed such that the transparent element is a single-layer glass wafer or an element comprising multiple glass layers.

According to a third aspect, in some embodiments, a method for producing the aforementioned MEMS structure is proposed, comprising: providing a base layer with a first stack comprising a semiconductor layer and an insulator layer, wherein the insulator layer of the first stack is connected to the base layer, structuring the semiconductor layer of the first stack to form the at least two coupling sections, providing a second stack on the structured semiconductor layer of the first stack, wherein the second stack comprises a semiconductor layer and an insulator layer and the insulator layer of the second stack is connected at least to the at least two structured coupling sections, structuring the semiconductor layer of the second stack to form the spring sections, which are spaced from the functional element in the direction of the normal vector of the substrate plane and are axially symmetrical to the at least one of the oscillation axes, and the respective anchor sections, structuring the base layer to form the functional element, and partially removing the insulator layer of the first stack and/or the insulator layer of the second stack.

In some preferred embodiments, the method can be further developed by: providing an actuator layer on the structured semiconductor layer of the second stack, and structuring the applied actuator layer to form the at least one actuator on the spring sections.

Further aspects and their advantages as well as advantages and more specific embodiments of the aspects and features described above are described in the following, but in no way limiting, descriptions and explanations of the attached figures.

Short description of the characters

Fig. 1 shows an exemplary embodiment of a MEMS structure with two pairs of spring sections and two coupling sections for connecting the spring sections to the functional element,

Fig. 2 shows exemplary configurations of two coupling sections of the functional element of the MEMS structure as further exemplary embodiments,

Fig. 3 shows exemplary configurations of three coupling sections of the functional element of the MEMS structure as further exemplary embodiments,

Fig. 4 shows another exemplary embodiment of a MEMS structure with two pairs of spring sections and two coupling sections, each coupling section having three support sections and one beam section, Fig. 5 shows an exemplary embodiment of the MEMS structure with coupling sections provided laterally and with actuators applied to the spring sections for driving the functional surface of the functional element,

Fig. 6 shows another exemplary embodiment of a MEMS structure with two pairs of spring sections and two coupling sections with holding sections between the functional section and the coupling sections,

Fig. 7 shows exemplary configurations of holding sections of the MEMS structure as further exemplary embodiments,

Fig. 8 shows a further exemplary embodiment of a MEMS structure with two pairs of spring sections, wherein the functional element comprises the functional section, a frame section and a plurality of holding sections and exemplary actuators are applied to the spring sections,

Fig. 9 shows a further exemplary embodiment of a MEMS structure with two pairs of spring sections, wherein the functional element comprises the functional section, a frame section and two holding sections,

Fig. 10 shows a further exemplary embodiment of a MEMS structure with a pair of spring sections and two holding sections, which are designed as spring holding sections, as well as actuators applied to the spring sections and the holding sections,

Fig. 11 shows the exemplary embodiment of a MEMS structure according to Fig. 4, wherein the spring sections of the two pairs of spring sections are now each formed by two spring subsections,

Fig. 12a shows exemplary embodiments of axially symmetrical spring sections, which together form the respective spring sections,

Fig. 12b shows further exemplary embodiments of axially symmetrical spring sections, which together form the respective spring sections, Fig. 13 shows the exemplary embodiment of a MEMS structure according to Fig. 11, wherein between the spring sections and the anchor sections, lever sections are further provided, which can be configured to excite an oscillation of the functional surface of the functional element,

Fig. 14a shows an exemplary embodiment of a MEMS structure with two pairs of spring sections, wherein the functional element has an overhang relative to at least one of the two pairs of spring sections,

Fig. 14b shows an exemplary embodiment of a MEMS structure with two pairs of spring sections, wherein the spring sections of the second spring pair protrude from the functional element,

Figs. 15a-15c show exemplary steps of an embodiment of a manufacturing process of an exemplary MEMS structure,

Fig. 16 shows an exemplary flowchart of a method for manufacturing a MEMS structure according to exemplary embodiments of the present disclosure,

Fig. 17a shows an exemplary embodiment of an exemplary MEMS device with an exemplary embodiment of the exemplary MEMS structure,

Fig. 17b shows another exemplary embodiment of an exemplary MEMS device with an exemplary embodiment of the exemplary MEMS structure.

Detailed description of the figures and preferred embodiments

Examples and embodiments of the present disclosure are described in detail below with reference to the accompanying figures. Identical or similar elements in the figures may be designated by the same reference numerals, although sometimes different reference numerals may be used.

It should be emphasized that the subject matter of the present disclosure is in no way limited or restricted to the embodiments and their features described below, but rather further modifications of the embodiments, in particular those which are encompassed by modifications of the features of the described examples or by combination of one or more of the features of the described examples within the scope of protection of the independent claims.

Fig. 1 shows in the figures a) to c) an exemplary embodiment of a MEMS structure 100 with two pairs of spring sections 3a - 3d (spring sections 3a and 3b form, for example, a first pair, and spring sections 3c and 3d form, for example, a second pair) and two coupling sections 2 for connecting the spring sections 3a - 3d to the functional element i.

In this case, the functional element 1 can, for example, be designed as a substantially circular layer (functional layer) or as a substantially circular plate (functional plate) (here further designed as a functional section 1a) and, as shown by way of example in illustration b) of Fig. 1, have at least two coupling sections 2 below the functional layer 1d. It should be noted at this point that the shape of the layer or plate can also be any other shape, for example a triangular, rectangular, oval or even polygonal shape. Furthermore, the functional element 1 can also be formed from more than one layer, for example from a stack of several layers, which can also be formed differently in terms of material and/or doping, for example.

The at least two coupling sections 2 form, for example, the connection between the functional element 1 and the spring sections 3a-3d. As shown here by way of example, the coupling sections 2 can be provided on the side of the functional element 1 and connected to the functional element 1 that faces the spring sections 3a-3d, which are spaced from the functional element 1 in the direction of a normal vector of the substrate plane. Using a mirror layer 1d as the example of the functional layer 1d, the coupling sections 2 can also be arranged below the functional layer 1d or provided on the side of the functional element 1 that is opposite the side of the functional surface 1d of the functional element 1. However, it can also be possible for the coupling sections 2 to be arranged substantially laterally on the functional element 1 (as shown by way of example in Fig. 5).

The substrate level (or MEMS substrate) refers to the material level of a MEMS structure 100 / a MEMS device 1000, from which starting from the (mostly layered) construction of the MEMS structure 100 or the MEMS device 1000.

It should be noted at this point that both the number of coupling sections 2 and their position on the functional element 1 or in relation to the functional surface 1d of the functional element 1 can vary. For example, only a single coupling section 2 or at least one coupling section 2 can be provided on the functional element 1, or more than two, for example three or four, coupling sections 2 can be provided. However, combinations of coupling sections 2 arranged laterally and below the functional element 1 can also be possible, for example, in order to counteract deformations of the functional element 1 during operation of the MEMS structure 100 (for example, oscillating movements in at least one, in particular two dimensions) in a MEMS device 1000 (not shown here; see, for example, the MEMS device 1000 in Figs. 17a and 17b).

In addition, the coupling sections 2 can be configured, for example, with a circular and/or rectangular cross-section. The cross-section can also be segment-shaped, for example, in the form of a segment of a circle (see, for example, Fig. 3, illustration b)). The length, width, and thickness of the coupling sections 2 can also vary, making them relatively stiff or flat, or even relatively flexible and thus resilient.

Furthermore, the functional surface ld, as already indicated, can be formed, for example, by a mirror surface ld or by a mirror element ld provided on the functional element 1, so that the MEMS structure 100 can advantageously be used for a MEMS mirror device 1000 (see, for example, Figs. 17a and 17b), for example, to specifically deflect electromagnetic radiation such as a laser. However, it should be noted that the functional surface ld can also be used for other purposes, for example, measurement and sensor purposes, or the functional element 1 itself can be adapted for corresponding purposes.

The at least one coupling section 2 or the (for example two) coupling sections 2 are now adjoined by the spring sections 3a - 3d, which are provided, for example, substantially below the functional element 1 or are formed spaced apart from the functional element 1 in the direction of a normal vector of the substrate plane, which extends the functional element 1 along and/or by at least two Oscillation axes X, Y are held in an oscillating manner and are axially symmetrical to at least one of the at least two oscillation axes X, Y.

For example, a first pair of spring sections 3a, 3b initially adjoins the at least one coupling section 2 or the coupling sections 2, wherein, using the example of two coupling sections 2, which in turn themselves have at least partially resilient properties, each spring section 3a, 3b of the first pair of spring sections 3a, 3b is connected to the respective coupling section 2 at its end directed toward the side of the MEMS structure 100. Furthermore, for example, the first pair of spring sections 3a, 3b can have a connecting section 3v directed toward the center of the MEMS structure 100, by means of which the spring sections 3a, 3b of the first pair of spring sections 3a, 3b are connected to one another.

For example, the connecting section 3v can be arranged or formed substantially in the center of the functional element 1, as viewed from the first pair of spring sections 3a, 3b towards the functional element 1.

The connecting section 3v is now followed by the spring sections 3c, 3d, which together form a second pair of spring sections 3c, 3d and share the connecting section 3v with the first pair of spring sections 3a, 3b or have the same connecting section 3v.

Furthermore, the spring sections 3c, 3d of the second pair of spring sections 3c, 3d each extend from the connecting section 3v toward opposite sides of the MEMS structure 100. For example, the spring sections 3a-3d, which are spaced apart from the functional element 1 in the direction of a normal vector of the substrate plane, can be arranged or formed in a region between the at least two coupling sections 2 of the functional element 1. As a result, for example, the extensions, in particular the lengths of the spring sections 3a, 3b, which are connected to the coupling sections 2, can have a certain spatial limitation, but the spring sections 3c, 3d, which can, for example, come into contact with other elements of the MEMS device 1000 (in particular MEMS mirror device 1000), can be designed as desired in their extension, for example, projecting beyond the functional element 1 (as shown by way of example in Fig. 14b).

Furthermore, the first pair of spring sections 3a, 3b and the second pair of spring sections 3c, 3d can be formed substantially at right angles to each other, so that for example, in the case shown here (see figure a) of Fig. 1), the spring sections 3a and 3b form a first oscillation axis X, around which at least the functional surface ld or the functional element 1 moves in an oscillating manner, and the spring sections 3c and 3d form a second oscillation axis Y, around which at least the functional surface ld or the functional element 1 moves in an oscillating manner, wherein, as already described, the oscillation axis X and the oscillation axis Y can, for example, be perpendicular to one another.

However, any other angle between the two exemplary pairs of spring sections 3a-3d can also be selected. Furthermore, the spring properties of the respective pairs of spring sections 3a-3d can also vary. For example, one pair of spring sections can be configured as torsion springs for oscillation around a longitudinal axis of the respective pair of spring sections, and the other pair of spring sections can be configured as bending springs for a translational oscillation of the functional element 1 or the functional surface 1d of the functional element 1, depending on the application of the respective MEMS structure 100.

As shown by way of example, the first pair of spring sections 3a, 3b can extend in their length along the oscillation axis X, wherein the spring sections 3a, 3b can be formed axially symmetrically to the axis/oscillation axis X in their width or in their cross section. For example, the spring sections 3a, 3b can also be formed axially symmetrically to the axis/oscillation axis Y in their respective longitudinal extent (along the X-axis).

Due to their rectangular configuration, as shown here, relative to the first pair of spring sections 3a, 3b, the second pair of spring sections 3c, 3d can be configured, for example, axially symmetrically with interchanged axes/oscillation axes. This means that the second pair of spring sections 3c, 3d can extend lengthwise along the oscillation axis Y, wherein the spring sections 3c, 3d can be configured axially symmetrically to the axis/oscillation axis Y in their width or cross-section. Furthermore, the spring sections 3c, 3d can be configured, for example, axially symmetrically to the axis/oscillation axis X in their respective longitudinal extents (along the Y-axis).

Due to the axial symmetry of the spring sections 3a - 3d to the respective oscillation axes X, Y, a mechanical stabilization of the oscillation system (for example with regard to the pivoting or oscillation behavior of the functional element 1 or the functional area ld) due to the more precise formation of the oscillation axes X, Y.

However, it is also possible for the first and/or second pair of spring sections 3a - 3d to be only axially symmetrical to the oscillation axis X or to the oscillation axis Y. For example, the first pair of spring sections 3a, 3b could be axially symmetrical to the oscillation axis Y in their longitudinal extent and the second pair of spring sections 3c, 3d could be axially symmetrical to the oscillation axis Y in their width or cross-section, but the width or cross-section of the first pair of spring sections 3a, 3b could be asymmetrical to the oscillation axis X and/or the longitudinal extent of the second pair of spring sections 3c, 3d could be asymmetrical to the oscillation axis X. Likewise, this can also be designed with the axes reversed.

The spring sections 3c, 3d can furthermore each have anchor sections 4a at their ends facing away from the common connecting section 3v, which can be configured to be connected to an external structure 10 of a MEMS device 1000 (see, for example, Fig. 17a). This allows, for example, the MEMS structure 100 to be subsequently incorporated or inserted into another structure or external structure.

The spring sections 3c, 3d of the second pair of spring sections 3c, 3d can, for example, extend to such an extent that they overlap, in particular completely overlap, the functional element 1 in the extension directions of the functional surface 1d of the functional element 1. As a result, for example, none of the spring sections 3c, 3d would protrude beyond the functional element 1 on the side of the MEMS structure 100. As a result, for example, an outer structure 10 could be formed quite close to the side of the corresponding MEMS structure 100 without affecting the functionality of the MEMS structure 100. Furthermore, the spring sections 3c, 3d of the second pair of spring sections 3c, 3d can also be designed such that the anchor sections 4a of the spring sections 3c, 3d of the second pair of spring sections 3c, 3d are also overlapped by the functional element 1 in the lateral extension of the MEMS structure 100.

However, it should also be pointed out at this point that the spring sections 3c, 3d of the second pair of spring sections 3c, 3d and/or their respective anchor sections 4a can also protrude beyond the lateral dimensioning of the functional element 1 (see, for example, Fig. 14b). By means of the exemplary configuration of the MEMS structure 100 described here, the space beneath the functional element 1 can be used, for example, to form the spring sections 3a-3d at this location, which together can form a spring structure. This can, for example, lead to an advantageous, more compact design of the MEMS structure 100 and thus to a more compact MEMS device 1000 with more precisely designed oscillation axes X, Y.

In addition, by way of example, this design of the MEMS structure 100 allows the spring sections 3a - 3d or the springs responsible for the oscillation of the functional element 1 to be brought closer to the oscillation axes of the functional element 1, so that the effective moment of inertia decreases and thus advantageously higher oscillation frequencies or higher resonance frequencies of the functional element 1, in which the MEMS structure 100 can preferably be operated, become possible.

In addition, it is advantageous that the spring sections 3a - 3d can be used both for the formation of the oscillation axes X, Y and for generating / initiating the oscillating movement (if, for example, actuators 8a, 8b are applied directly to the spring sections 3a - 3d, see for example Figs. 5 - 10; or if, for the oscillation generation, lever sections 3Lca - 3Ldb are connected to the spring sections 3c, 3d and the lever sections have corresponding actuators 8c, see for example Fig. 13) in the functional element 1.

Fig. 2 shows in the figures a) and b) exemplary configurations of two coupling sections 2 of the functional element 1 of the MEMS structure 100 as further exemplary embodiments.

As already described above, the coupling sections 2 (for example at least two coupling sections 2) can be formed below the functional element 1 or can be formed on the side of the functional element 1 and connected to the functional element 1 which faces the spring sections 3a - 3d.

For example, the coupling sections 2 can be formed in an edge region of the functional element 1, so that, for example, the coupling sections 2 have a common outer surface with the functional element 1, for example, as shown here, a common circular outer surface (see figure a) of Fig. 2).

As a result, for example, the area of the functional element 1 which extends below the functional surface ld of the functional element 1, in this case essentially the Area of the functional section 1a, remain unaffected by the coupling sections 2, which may have an advantageous effect on the imprinting of mechanical stress into the functional element 1 and thus into the functional surface 1d of the functional element 1. This may be advantageous, for example, if the functional surface is designed as a mirror surface 1d or as a mirror 1d and a surface that is as flat as possible for the reflection of electromagnetic radiation (for example from a laser) should be present here.

Furthermore, the coupling sections 2 can also be designed to be closer together on the functional section 1a of the functional element 1, so that they are provided just below the functional surface 1d of the functional element 1 (see, for example, figure b) of Fig. 2), in order, for example, to prevent or minimize potential deformations of the functional element 1 at the location of the functional section 1a with the functional surface 1d.

Fig. 3 shows in the figures a) and b) exemplary configurations of three coupling sections 3 of the functional element 1 of the MEMS structure 100 as further exemplary embodiments.

In addition to the two coupling sections 2 shown as an example in Fig. 2, three or more coupling sections 2 can also be provided on the functional element 1 or on the functional section 1a.

The coupling sections 2, as shown in Fig. 2, can again be provided below the functional element 1 or formed on the side of the functional element 1 facing the spring sections 3a-3d. For the sake of completeness, however, it should be noted that the three or more coupling sections 2 can also be provided laterally of the functional element 1 or the functional section 1a (as shown in Fig. 5 with two coupling sections 2) or in the edge region of the functional element 1.

In addition, depending on the number of coupling sections 2, the coupling sections 2 can be formed evenly distributed below the functional element 1 / functional section 1a, for example, in a circular arrangement and three coupling sections 2, a coupling section 2 can be provided every 120° (as shown by way of example in Figure a) in Fig. 3), as can be described, for example, by 3607N with N=2, 3, 4, etc. However, it is also possible to provide an uneven distribution, for example, in the circular arrangement of the three coupling sections 2, to provide an angle of 60° between two adjacent coupling sections 2 and then, in each case from the two adjacent coupling sections 2 towards the third coupling section 2, an angle of 150'.

Furthermore, the cross-sectional shape of the coupling sections 2 can vary. For example, the cross-sectional shape of the coupling sections 2 can have a square shape (as shown in Figure a) in Fig. 3) or a circular segment shape (as shown in Figure b) in Fig. 3). However, other cross-sectional shapes, such as a cylindrical cross-sectional shape of the coupling sections 2, can also be provided.

Fig. 4 shows a further exemplary embodiment of a MEMS structure 100 with two pairs of spring sections 3a - 3d and two coupling sections 2, wherein each coupling section 2 has, for example, three support sections 2a and one beam section 2b.

This allows, for example, the forces that occur at the coupling sections 2 due to the oscillating movement of the functional element 1 to be transmitted via multiple support sections 2a per coupling section 2 from the functional element 1 to the first pair of spring sections 3a, 3b, or vice versa. This allows, for example, a locally limited stress generation/stress impression in the functional element 1 to be avoided.

In addition, for example, the multiple support sections 2a per coupling section 2 can prevent deformations of the functional element 1 due to vibrations and inertia of the functional element 1, which can lead to better and more consistent surface flatness of the functional section 1a or the functional surface ld of the functional element 1 during operation of the MEMS structure 100. This can also be advantageous, for example, if the functional surface is designed as a mirror surface ld or as a mirror ld and a surface that is as flat as possible is to be present here for reflecting electromagnetic radiation (for example, from a laser).

It should be noted at this point that, for example, at least two support sections 2a (or four or more support sections 2a per coupling section 2) and a beam section 2b for connecting the support sections 2a can be provided per coupling section 2. In addition, two adjacent coupling sections 2, as shown in Fig. 3, can be designed as two support sections 2a with a connecting beam section 2b, wherein the beam section 2b is further connected to one of the spring sections 3a, 3b of the first pair of spring sections 3a, 3b, and the third coupling section 2, as shown in Fig. 3, is connected to the other spring section 3a, 3b of the first pair of spring sections 3a, 3b.

Furthermore, for example, as already mentioned in Fig. 3, the coupling sections 2 or the support sections 2a of the coupling sections 2 can also be provided laterally of the functional element 1 / functional section 1a or in the edge region of the functional element 1 / functional section 1a.

The anchor sections 4a, as shown in Fig. 1, can also be provided here, for example, at the ends of the second pair of spring sections 3c, 3d in order to be able to establish a corresponding connection with an external structure 10.

Furthermore, in this exemplary embodiment, as already shown and described in the exemplary embodiment according to Fig. 1, the spring sections 3a - 3d can be formed axially symmetrically to the at least two oscillation axes X, Y or to at least one of the at least two oscillation axes X, Y.

Fig. 5 shows in the figures a) to c) an exemplary embodiment of the MEMS structure 100 with coupling sections 2 provided laterally and with actuators 8a, 8b applied, for example, to the spring sections 3a - 3d for driving the functional surface ld of the functional element 1.

For example, the connection to the coupling sections 2 can be achieved via the at least two projections arranged on opposite sides of the functional element 1, wherein the at least two coupling sections 2 in turn establish the connection between the functional element 1 and the spring sections 3a-3d. As shown here by way of example, the coupling sections 2 can be arranged substantially laterally from the functional surface 1d of the functional element 1 (see, for example, Figure c) of Fig. 5).

In an exemplary embodiment, for example, at least one actuator 8a, 8b can be provided on at least one of the spring sections 3a - 3d, which are spaced from the functional element 1 in the direction of a normal vector of the substrate plane and are axially symmetrical to at least one of the at least two oscillation axes X, Y, and can be configured to cause the functional element 1 to oscillate, in particular to oscillate in at least one dimension or two dimensions (such as about the two oscillation axes X and Y). In addition, several actuators 8a, 8b can also be arranged on the paired spring sections 3a-3d, for example. For example, one actuator 8a, 8b can be provided on each spring section 3a-3d, or several actuators 8a, 8b can be provided per spring section 3a-3d.

In addition, the actuators 8a, 8b can, for example, be provided between the spring sections 3a - 3d and the functional element 1 on the spring sections 3a - 3d, or, for example, also be provided on the side of the spring sections 3a - 3d that is facing away from the functional element 1.

It should also be noted at this point that actuators 8a, 8b can be provided both between the spring sections 3a-3d and the functional element 1, as well as on the side of the spring sections 3a-3d facing away from the functional element 1. However, a combination of the various arrangements of actuators 8a, 8b may also be possible. For example, on the spring sections 3a, 3b of the first pair of spring sections 3a, 3b, the actuators 8a can be provided between the spring sections 3a, 3b and the functional element 1, while on the spring sections 3c, 3d of the second pair of spring sections 3c, 3d, the actuators 8b are provided on the side of the spring sections 3c, 3d facing away from the functional element 1.

Furthermore, the actuators 8a, 8b can be designed as piezo actuators 8a, 8b, as plate capacitors 8a, 8b, or as comb drives 8a, 8b and/or as magnetic actuators 8a, 8b (for example, also as microactuators, etc.). Furthermore, instead of the actuators 8a, 8b or in addition to the actuators 8a, 8b, similar elements (for example, also piezo elements) can be provided, which can be used as sensors for monitoring the respective vibrations or deformations of the spring sections 3a - 3d. Furthermore, for example, the driving actuators 8a, 8b can be designed as plate capacitors, while the sensors for the vibrational movement or deformation of the spring sections 3a - 3d can be designed as piezo elements. In addition, the types can also be different within the actuators / sensors, for example piezo actuators on the side of the spring sections 3a - 3d facing the functional element 1, and capacitive drives below the spring sections 3a - 3d.

Fig. 6 shows in the figures a) to c) a further exemplary embodiment of a MEMS structure 100 with two pairs of spring sections 3a - 3d, which are axially symmetrical to the at least two oscillation axes X, Y, and two coupling sections 2 with holding sections lb between the functional section 1a and the coupling sections 2.

In this case, for example, the holding sections lb can be arranged laterally of the functional section 1a, which has the functional surface ld (e.g., mirror surface ld/mirror ld) of the functional element 1 (see, for example, illustrations b) and c) of Fig. 6). Furthermore, the holding sections lb can be narrower than the coupling sections 2. This can, for example, lead to a spring property of the holding sections lb, which can be advantageous for various applications of the MEMS structure 100. Furthermore, the length of the respective holding sections lb can be adjusted up to different lengths of the two holding sections lb, depending on the application and potential additional vibration/spring behavior.

Furthermore, this configuration of the MEMS structure 100 allows the lengths of the first pair of spring sections 3a, 3b and the second pair of spring sections 3c, 3d to differ significantly from one another (see, for example, Figure a) of Fig. 6). For example, the spring sections 3a, 3b of the first pair of spring sections 3a, 3b can be significantly longer than the spring sections 3c, 3d of the second pair of spring sections 3c, 3d. This can be used, for example, for different oscillation frequencies of the two oscillation axes X and Y and, thereby, for an adjustable frequency ratio of the two oscillation axes.

In addition, the different lengths of the spring sections 3a-3d can, for example, influence the sides on which the actuators 8a, 8b are arranged on the spring sections 3a-3d. Here, for example, the actuators 8a, 8b were provided between the spring sections 3a-3d and the functional element 1. However, different arrangements of the actuators 8a, 8b can also be provided, as described, for example, with reference to Fig. 5.

Fig. 7 shows in the figures a) and b) exemplary configurations of holding sections 1b of the MEMS structure 100 as further exemplary embodiments.

Here, the holding sections lb can, for example, have the same width as the coupling sections 2 over their entire length (see, for example, Figure a) of Fig. 7), or have the same width at the connection to the coupling sections 2 and taper towards the functional section la (see, for example, figure b) of Fig. 7).

As a result, as has already been described with reference to Fig. 6, the at least two holding sections lb can further be designed as resilient holding sections lb, wherein, for example, the property as torsionally resilient and/or flexurally resilient holding sections lb can be advantageous for various applications of the MEMS structure 100.

Fig. 8 shows in the figures a) to c) a further exemplary embodiment of a MEMS structure 100 with two pairs of spring sections 3a - 3d, which are formed axially symmetrically to the at least two oscillation axes X, Y, wherein the functional element 1 has the functional section 1a, a frame section 1c and a plurality of holding sections 1b and actuators 8a, 8b are applied, for example, to the spring sections 3a - 3d.

Compared to the exemplary embodiments of the MEMS structures 100 described so far, the MEMS structure 100 can now comprise a functional element 1, which, for example, comprises a functional section 1a with the functional surface 1d and a frame section 1c that surrounds the functional section 1a in the extension directions of the functional surface 1d. This makes it possible, for example, to achieve a more stable shape of the functional surface 1d or the functional section 1a during operation of the MEMS structure 100.

In addition, for example, the frame section lc of the functional element 1 can have at least two coupling sections 2, by means of which the functional element 1 is mechanically connected to the spring sections 3a-3d, which are spaced apart from the functional element 1 in the direction of a normal vector of the substrate plane. For example, the coupling sections 2 can be provided laterally on the frame section lc. However, it should be noted that the coupling sections 2 can also be provided below the frame section lc, as shown, for example, in Fig. 9.

For example, the functional element 1 can further comprise at least two holding sections 1b, which are formed between the functional section 1a and the frame section 1c and mechanically connect the functional section 1a to the frame section 1c. As shown in Figure c) of Fig. 8, however, more than two Holding sections lb may be provided, for example four holding sections lb, or eight

Holding sections lb.

In addition, for example, the structure of the functional element 1 created by the holding sections 1b can advantageously reduce the moment of inertia of the functional element 1 when oscillating about the two oscillation axes, since material and thus weight can be saved, particularly in the outer region of the functional element 1, and the shape of the functional surface 1d or the functional section 1a can still be supported in a stabilizing manner by the holding sections 1b and the frame section 1c.

In the example shown here, particularly as shown in Figures a) and b) of Fig. 8, the actuators 8a, 8b can again be arranged on the side of the spring sections 3a-3d facing away from the functional element 1. However, any other arrangement of the actuators 8a, 8b, as already described, can also be provided here.

In addition, for example, in this exemplary embodiment of the MEMS structure 100, the spring sections 3a - 3d can also be designed such that they overlap, in particular completely overlap, with the functional element 1, comprising the functional section 1a, the holding sections 1b and the frame section 1c, in the extension directions of the functional surface 1d of the functional element 1 (see, for example, figure a) of Fig. 8).

Fig. 9 shows in the figures a) to c) a further exemplary embodiment of a MEMS structure 100 with two pairs of spring sections 3a - 3d, which are formed axially symmetrically to the at least two oscillation axes X, Y, wherein the functional element 1 has the functional section 1a, a frame section 1c and two holding sections 1b.

Compared to the exemplary embodiment of the MEMS structure 100 shown in Fig. 8, two holding sections 1b are now provided, which, for example, have an additional spring property and can thus resiliently hold the functional section 1a relative to the frame section 1c. This allows, for example, the vibration behavior of the functional element 1 to be changed/adapted depending on the application of the MEMS structure 100.

Also in Fig. 9, actuators 8a, 8b are shown as examples on the spring sections 3a - 3d, which, as already in the other exemplary embodiments of the MEMS Structure 100 described, can be provided on the spring sections 3a - 3d, for example, at variable positions of the spring sections 3a - 3d (for example between the respective spring section 3a - 3d and the functional element 1 and/or on the side of the respective spring section 3a - 3d that is facing away from the functional element 1).

Fig. 10 shows in the figures a) to c) a further exemplary embodiment of a MEMS structure 100 with a pair of spring sections 3a, 3b and two holding sections 1b, which are designed as spring holding sections 1b, as well as actuators 8a, 8c applied as examples on the spring sections 3a, 3b and the holding sections 1b.

The exemplary embodiment of the MEMS structure 100 shown here is essentially based on the exemplary embodiment of the MEMS structure 100 according to Fig. 9, except that in the exemplary embodiment shown here, one of the oscillation axes (oscillation axis X) is now formed by the resilient holding sections 1b between the frame section 1c and the functional section 1a, and no longer by a pair of spring sections 3c, 3d, as shown in Fig. 9. The two oscillation axes X and Y, formed by the first pair of spring sections 3a, 3b and the resilient holding sections 1b, are formed substantially perpendicular to one another.

As a result, for example, as already described in previous exemplary embodiments of the MEMS structure 100, the oscillation frequencies of the functional surface ld of the functional element 1 can be adjusted and thus a desired frequency ratio between the first oscillation axis X and the second oscillation axis Y can be generated.

Here, too, the axial symmetry of the first pair of spring sections 3a, 3b is designed to the at least two oscillation axes X, Y, and the axial symmetry of the resilient holding sections 1b is designed to the at least two oscillation axes X, Y. As already described, the axial symmetry shown here as an example can also be designed differently from the respective oscillation axes X, Y (see the explanations in Fig. 1 for an example).

Furthermore, the actuators 8c can now be formed on the functional element 1, in particular, for example, on the resilient holding sections 1b, in order to excite the oscillation of the functional surface 1d or the functional section 1a around the second oscillation axis. In this case, the actuators 8c can be arranged on the side of the The actuators 8c can be provided on the side of the functional element 1, on which the functional surface 1d can also be provided, or on the side of the functional element 1 facing the spring sections 3a, 3b. In addition, the actuators 8c can also be provided, for example, on different sides of the functional element 1.

The actuators 8a can again be provided on the spring sections 3a, 3b and can be applied on the different sides of the spring sections 3a, 3b.

Furthermore, for example, the connecting section of the spring sections 3a, 3b of the pair of spring sections 3a, 3b can have or be connected to an anchor section 4a, which is designed to be connected to an external structure 10.

Fig. 11 shows the exemplary embodiment of a MEMS structure 100 according to Fig. 4, wherein the spring sections 3a - 3d of the two pairs of spring sections 3a - 3d are now each formed by two spring sub-sections 3aa - 3db.

In this case, for example, each of the spring sections 3a - 3d, which are spaced from the functional element 1 in the direction of a normal vector of the substrate plane and are formed axially symmetrically to the at least two oscillation axes X, Y or which, using the example of a functional surface ld as an exemplary mirror surface ld, are arranged on the side of the functional element 1 which is opposite the side of the functional surface ld of the functional element 1, can be formed from two parallel spring sub-sections 3aa - 3db.

With regard to the spring sections 3a - 3d, this can mean, for example, that a first spring sub-section 3aa of a first spring section 3a of the first pair of spring sections 3a, 3b has a connecting section with a first spring sub-section 3da of a second spring section 3d of the second pair of spring sections 3c, 3d.

Furthermore, a second spring section 3db of the second spring section 3d of the second pair of spring sections 3c, 3d can then have a connecting section with a second spring section 3bb of a second spring section 3b of the first pair of spring sections 3a, 3b.

Furthermore, a first spring section 3ba of the second spring section 3b of the first pair of spring sections 3a, 3b can then have a connecting section with a first spring section 3ca of the first spring section 3c of the second pair of spring sections 3c, 3d. - TI -

In addition, a second spring section 3cb of the first spring section 3c of the second pair of spring sections 3c, 3d can then have a connecting section with a second spring section 3ab of the first spring section 3a of the first pair of spring sections 3a, 3b.

Even if, as shown in Fig. 11, the spring sections 3aa and 3ab, spring sections 3ba and 3bb, spring sections 3ca and 3cb, and spring sections 3da and 3db, which each form one of the spring sections 3a - 3d, run parallel to each other, the respective spring sections 3aa - 3db can also deviate from the parallelism to each other (see, for example, Figs. 12a and 12b), for example, converge or diverge from their respective connecting sections.

Furthermore, for example, the spring sections 3aa-3db, which have a common connecting section (for example, spring section 3aa with spring section 3da, spring section 3db with spring section 3bb, spring section 3ba with spring section 3ca, and spring section 3cb with spring section 3ab), can be formed substantially at right angles to one another. However, the angles of the spring sections 3aa-3db, which have a common connecting section, can also be at an angle other than 90°.

In the exemplary embodiment shown here, the spring sections 3aa - 3db also have axial symmetry to at least one, in particular to the at least two oscillation axes X, Y.

As shown by way of example, the spring sections 3aa, 3ab, 3ba, and 3bb can extend in their length along the oscillation axis X, wherein the spring sections 3aa, 3ab, 3ba, and 3bb can be designed to be axially symmetrical to the axis/oscillation axis X in their width or cross section. The distance of the individual spring sections 3aa, 3ab, 3ba, and 3bb from the oscillation axis X can also be designed symmetrically, for example. In addition, the spring sections 3aa, 3ab, 3ba, and 3bb can, for example, be designed to be axially symmetrical to the axis/oscillation axis Y in their respective longitudinal extent (along the X-axis).

Furthermore, as shown by way of example, the spring sections 3ca, 3cb, 3da, and 3db can extend in their length along the oscillation axis Y, wherein the spring sections 3ca, 3cb, 3da, and 3db are axially symmetrical in their width or in their cross section to the Axis/oscillation axis Y. The distance of the individual spring sections 3ca, 3cb, 3da, and 3db from the oscillation axis Y can also be designed symmetrically, for example. Furthermore, the spring sections 3ca, 3cb, 3da, and 3db can, for example, be designed axially symmetrically to the axis/oscillation axis X in their respective longitudinal extent (along the Y-axis).

Due to the axial symmetry of the spring sections 3aa - 3db to the respective oscillation axes X, Y, a mechanical stabilization of the oscillation system (for example with regard to the pivoting or oscillation behavior of the functional element 1 or the functional surface ld) can also be advantageously achieved due to the more precisely formed oscillation axes X, Y.

Furthermore, for example, each of the spring sub-sections 3ca - 3db of the second pair of spring sections 3c, 3d can have, at an end opposite the connecting section, an anchor section 4a (not shown here in Fig. 11, but comparable to, for example, Fig. 8), which is adapted to be connected to an external structure 10.

In addition, for example, the ends of the mutually parallel spring sections 3ca - 3db, which are opposite their respective connecting section, can be connected to one another by the anchor section or another section.

Furthermore, the spring sections 3aa - 3db can, for example, be designed as torsion springs or as torsion spring sections 3aa - 3db and/or as spiral springs or as spiral spring sections 3aa - 3db. In addition, actuators 8a, 8b can also be provided on the spring sections 3aa - 3db, analogous to the spring sections 3a - 3d, whereby, if necessary, one actuator 8a, 8b could be divided into two partial actuators 8aa, 8ab and 8ba, 8bb.

Fig. 12a shows exemplary embodiments of spring sections 3aa-3bb which run axially symmetrically to the oscillation axes X, Y and which together form the respective spring sections 3a, 3b.

In this case, as shown by way of example in the illustration a) of Fig. 12a, each of the spring sections 3aa - 3bb can be angular, in particular exclusively angular, so that the spring sections 3a, 3b, which each consist of the paired spring sections 3aa - 3bb (spring sections 3aa, 3ab for spring section 3a and Spring sections 3ba, 3bb for spring section 3b) are formed, essentially have a diamond shape (or rectangular shape).

As a result, at least a 2D movement of the functional element 1 can be provided, for example, without any specific design of the spring sections 3c, 3d of the second pair of spring sections.

As shown here by way of example, the spring sections 3aa - 3bb are connected to the functional element 1 by means of two coupling sections 2 (one coupling section for each spring section 3a, 3b) and, at the ends of the spring sections 3aa - 3bb opposite the coupling sections 2, are connected to one, in particular a single, anchor section 4a.

Furthermore, the spring sections 3aa - 3bb, as shown by way of example in figure b) of Fig. 12a, can be straight-shaped, in particular exclusively straight-shaped, wherein the spring sections 3aa, 3ab and 3ba, 3bb, which together each form a spring section 3a, 3b, extend at a certain angle (for example 30°, 60°, 90° or 120° and other angles) from the corresponding coupling section 2 in order to be connected to the respective anchor section 4a.

The four spring sections 3aa - 3bb can together form a diamond shape or a rectangular shape and thereby provide the oscillation of the functional element 1 in at least two dimensions.

In addition, two anchor sections 4a can be provided, each in a region between the coupling sections 2, wherein a spring section 3aa, 3ab of one spring section 3a can be connected to one of the spring sections 3ba, 3bb of the other spring section 3b via an anchor section 4a.

It should be noted at this point that actuators 8a (possibly distributed among the individual spring sections 3aa - 3bb) can also be applied/attached to the spring sections 3aa - 3bb shown or described here in order to generate the respective vibrations/vibration axes X, Y. The same applies to potential sensors on the spring sections 3aa - 3bb.

Furthermore, it should be noted at this point that lever sections 3Lca - 3Ldb may also be provided on the anchor sections 4a described and shown here or on the spring sections 3a, 3b or spring sections 3a - 3bb which can be configured to excite an oscillation of the functional element 1 (see in particular Fig. 13 and the associated description).

Fig. 12b shows further exemplary embodiments of spring sections that run axially symmetrically to the oscillation axes X, Y and that together form the respective spring sections.

In this case, as shown by way of example in illustration a) of Fig. 12b, each of the spring sections 3aa - 3bb can be arcuate, in particular exclusively arcuate, so that the spring sections 3a, 3b, which are each formed from the paired spring sections 3aa - 3bb (spring sections 3aa, 3ab for spring section 3a and spring sections 3ba, 3bb for spring section 3b), have a substantially oval shape (or also a circular shape).

In this way, at least a 2D movement of the functional element 1 can be provided, for example, without any specific design of the spring sections 3c, 3d of the second pair of spring sections.

In this example, too, the spring sections 3aa - 3bb are connected to the functional element 1 by means of two coupling sections 2 (one coupling section for each spring section 3a, 3b) and, at the ends of the spring sections 3aa - 3bb opposite the coupling sections 2, are connected to one, in particular a single, anchor section 4a.

Furthermore, as shown by way of example in illustration b) of Fig. 12b, each of the spring sections 3aa-3bb can have a combination of the shapes already described, i.e., a combination of straight, arcuate, and/or angular spring sections 3aa-3bb. As shown here by way of example, a combination can be formed, for example, from a straight shape (as shown, for example, in Fig. 12a, illustration b)) and an angular shape (as shown, for example, in Fig. 12a, illustration a)), so that each of the spring sections 3aa-3bb is straight with an angular extension.

In this way, at least a 2D movement of the functional element 1 can be provided, for example, without any specific design of the spring sections 3c, 3d of the second pair of spring sections. In this example, too, the spring sections 3aa - 3bb are connected to the functional element 1 by means of two coupling sections 2 (one coupling section for each spring section 3a, 3b) and, at the ends of the spring sections 3aa - 3bb opposite the coupling sections 2, are connected to one, in particular a single, anchor section 4a.

It should be noted at this point that actuators 8a (possibly distributed among the individual spring sections 3aa - 3bb) can also be applied/attached to the spring sections 3aa - 3bb shown or described here in order to generate the respective vibrations/vibration axes X, Y. The same applies to potential sensors on the spring sections 3aa - 3bb.

Furthermore, it should be noted at this point that lever sections 3Lca - 3Ldb can potentially be provided on the anchor sections 4a described and shown here or on the spring sections 3a, 3b or spring sub-sections 3a - 3bb, which can be configured to excite an oscillation of the functional element 1 (see in particular the following Fig. 13 and the associated description).

Fig. 13 shows the exemplary embodiment of a MEMS structure 100 according to Fig. 11, wherein between the spring sections 3a - 3d, which here are each formed by their spring sub-sections 3aa - 3db, and anchor sections 3kl, 3k2, lever sections 3Lca, 3Lcb, 3Lda, 3Ldb are further provided, which can be configured to excite an oscillation of the functional element 1.

In this case, for example, the lever section 3Lca can be connected to the end of the spring section 3ca, which is opposite the connecting section of the spring section 3ca with the spring section 3ba, on one side, and to a second anchor section 3k2 on the other side.

Furthermore, for example, the lever section 3Ldb can be connected to the end of the spring section 3db, which is opposite the connecting section of the spring section 3db with the spring section 3bb, on one side, and to the second anchor section 3k2 on the other side.

For example, as shown in Fig. 13, at the point of the second anchor portion 3k2 that the lever portions 3Lca and 3Ldb have in common, an opening or a gap may be provided between the two lever portions 3Lca and 3Ldb; however, this opening/gap may also be closed. Furthermore, for example, the lever section 3Lda can be connected to the end of the spring section 3da, which is opposite the connecting section of the spring section 3da with the spring section 3aa, on one side, and to a first anchor section 3kl on the other side.

Furthermore, for example, the lever section 3Lcb can be connected to the end of the spring section 3cb, which is opposite the connecting section of the spring section 3cb with the spring section 3ab, on one side, and to the first anchor section 3kl on the other side.

For example, as also shown in Fig. 13, an opening or gap may be provided between the two lever sections 3Lda and 3Lcb at the point of the first anchor section 3kl that is common to the lever sections 3Lda and 3Lcb; however, this opening/gap may also be closed.

Furthermore, for example, the respective lever section 3Lca, 3Lcb, 3Lda, 3Ldb can have a higher spring stiffness relative to the respective spring section 3c, 3d or spring subsection 3ca, 3cb, 3da, 3db to which the lever section 3Lca, 3Lcb, 3Lda, 3Ldb is connected. Furthermore, the respective lever section 3Lca, 3Lcb, 3Lda, 3Ldb can be arcuate or partially circular. However, other shapes for the lever sections 3Lca, 3Lcb, 3Lda, 3Ldb are also possible.

It should be noted at this point that the lever sections 3Lca, 3Lcb, 3Lda, 3Ldb shown here can also be connected, for example, to the spring sections 3c, 3d of the second pair of spring sections 3c, 3d. In such an exemplary embodiment, the lever sections 3Lca, 3Lcb are connected together to the end of the spring section 3c opposite the connecting section 3v. Furthermore, in this exemplary embodiment, the lever sections 3Lda, 3Ldb would be connected together to the end of the spring section 3d opposite the connecting section 3v, with the spring sections 3a, 3b of the first pair of spring sections 3a, 3b then extending from the connecting section 3v to the coupling sections 2.

The lever sections 3Lca, 3Lcb, 3Lda, 3Ldb can also advantageously be designed to be axially symmetrical to at least one, in particular to the at least two oscillation axes X, Y. Furthermore, actuators 8d - 8g can also be provided on the lever sections, which are designed to cause the lever sections 3Lca, 3Lcb, 3Lda, 3Ldb to oscillate and thus to cause the functional element 1 to oscillate, for example about two oscillation axes (for example oscillation axes X and Y; see for example Fig. 1). However, only a single actuator 8d - 8g can also be provided.

Furthermore, for example, the at least one actuator 8d-8g can be provided between the at least one lever section 3Lca, 3Lcb, 3Lda, 3Ldb and the functional element 1, or the at least one actuator 8d-8g can be provided on the side of the at least one lever section 3Lca, 3Lcb, 3Lda, 3Ldb that faces away from the functional element 1. It should be noted, however, that combinations of arrangements of the actuators 8d-8g on the lifting sections 3Lca, 3Lcb, 3Lda, 3Ldb are also possible, comparable to the combination possibilities for the actuators 8a, 8b of the spring sections.

In addition, the lever sections 3Lca, 3Lcb, 3Lda, 3Ldb can also be provided on the spring sections 3a-3d, as shown in Fig. 4, if these are not formed from spring subsections 3aa-3db; this could also excite vibrations of the functional element 1, again about the two vibration axes X and Y, for example.

Fig. 14a shows in the figures a) and b) an exemplary embodiment of a MEMS structure 100 with two pairs of spring sections 3a - 3d, which are formed axially symmetrically to the at least two oscillation axes X, Y, wherein the functional element 1 has an overhang U relative to at least one of the two pairs of spring sections 3a - 3d.

For example, the functional element 1 can have an overhang U relative to the second pair of spring sections 3c, 3d in the longitudinal direction L of the second pair of spring sections 3c, 3d. For example, the overhang U can be in a range of 10-50% of the length L of the second pair of spring sections 3c, 3d, or, for example, also in a range of 25-35% of the length L of the second pair of spring sections 3c, 3d.

For example, the amplitude or the deflection angle of the functional element 1 or the functional surface ld around the oscillation axis formed by the spring sections 3a, 3b can be increased, since the functional element 1 is provided with a the spring sections 3c, 3d or with one of the anchor sections 4a would only collide much later.

In addition, the overhang U of the functional element 1 can be evenly distributed relative to the length L of the second pair of spring sections 3c, 3d, as expressed in Figure b) of Fig. 14a by U/2 to both sides. It should be noted that the overhang U can also be distributed unevenly, for example, so that the overhang in the spring section 3c is different, for example, larger, than the overhang in the spring section 3d.

In this exemplary embodiment of the MEMS structure 100, actuators 8a, 8b can again be provided arbitrarily on the spring sections 3a - 3d.

Fig. 14b shows in the illustrations a) and b) an exemplary embodiment of a MEMS structure 100 with two pairs of spring sections 3a - 3d, which are formed axially symmetrically to the at least two oscillation axes X, Y, wherein the spring sections 3c, 3d of the second spring pair protrude relative to the functional element 1.

For example, the functional element 1, as shown here, can have a substantially circular shape, so that the length L of the second pair of spring sections 3c, 3d can be greater than the diameter D of the functional element 1 (L > D). However, since the functional element 1 can also have any other shape, for example, square, polygonal, oval, etc., the length L of the second pair of spring sections 3c, 3d can be at least greater than the functional element 1 in the direction of the longitudinal direction L of the second pair of spring sections 3c, 3d.

This can be advantageously used, for example, to implement/provide the MEMS structure 100 in a MEMS device 1000, as shown in Fig. 17b, wherein the anchor sections 3k1, 3k2 are directly integrated into the layer structure of the MEMS device 1000. This can, for example, lead to more advantageous electrical contacting of the potentially applied actuators 8a, 8b.

However, as shown in illustration c) of Fig. 14b, an anchor section 4a can also be formed as shown and described in Figs. 1, 5, 6, 8, 9 or 14a.

It should be noted at this point that the MEMS structure 100 can also be designed such that the spring sections 3c, 3d of the second pair of spring sections have a length L which essentially corresponds to the extension of the Functional element 1 in the longitudinal direction L of the second pair of spring sections 3c, 3d, so that the spring sections 3c, 3d terminate in their longitudinal direction L with the functional element 1 (see, for example, Figs. 1, 4, 5, 6, 8, 9 and 13).

Figs. 15a - 15c show exemplary steps of an embodiment of a manufacturing process of an exemplary MEMS structure 100, wherein the starting wafer, which can be provided in a first step (i), initially comprises a base layer LI (starting substrate LI as an exemplary shape of the substrate plane) and a first stack L2 with an insulator layer L2b, which is connected to the base layer LI, and a semiconductor layer L2a.

The first stack L2 can now be structured (step (ii); structuring, for example, by an etching step) by introducing at least one cavity into the semiconductor layer L2a using known lithography followed by etching processes. A portion of the semiconductor layer L2a of the first stack L2 can be formed, for example, as coupling sections 2. An additional section of the layer L2 can be left standing, for example, to provide reinforcement for the later functional section 1a or the functional layer 1.

In a further step (iii), the second stack L3 can now be applied/provided, for example, on the already structured semiconductor layer L2a (with coupling sections 2) of the first stack L2. An exemplary bonding step (e.g., fusion bonding) can then connect the second stack L3 to the first stack L2. For example, the insulator layer L3b of the second stack L3 is connected to the semiconductor layer L2a (as well as to the coupling sections 2) of the first stack L2.

In a further step (iv), the spring sections, for example the spring sections 3a - 3d, can now be structured from the semiconductor layer L3a of the second stack L3.

In further steps (v) and (vi), a semiconductor layer can now firstly (in step (v)), for example, be applied as an anchor layer L4 to the structured semiconductor layer L3a of the second stack L3 (and in the process form a connection with the spring sections 3a - 3d) and then (in step (vi)) can be partially removed (for example etching processes) or structured by correspondingly known lithography and etching processes in order to form, for example, the anchor section(s) 4a which are in connection with at least one of the spring sections 3a - 3d. In a further step (vii), a further semiconductor layer can now be applied as a base layer L5 onto the structured anchor layer L4 and connected to the anchor section(s) 4a.

For the subsequent structuring (step (viii)) of the base layer LI to form the functional element 1 (for example with functional surface ld, which can be formed, for example, in a later step as a mirror surface ld or as a mirror element ld), it can be advantageous to first flip the previously formed MEMS structure in order to be able to process / structure the base layer LI accordingly (again, for example, by lithography and subsequent etching processes) and to remove the remaining areas of the insulator layers L2b and L3b.

This allows, for example, the MEMS structure 100 of the exemplary embodiments described above to be produced. The remaining laterally exposed regions of the individual layers L1-L5 can be used, for example, as an outer structure 10 to which the anchor sections 4a can be connected.

Fig. 16 shows an exemplary flowchart of a method for manufacturing a MEMS structure 100 for a MEMS device 1000, in particular a MEMS mirror device, according to exemplary embodiments of the present disclosure. Although steps for manufacturing the exemplary MEMS structure 100 have already been described in the previous exemplary embodiment, in particular in the exemplary embodiment of Figs. 15a-15c, a general method will nevertheless be described below.

In an exemplary step S101, a base layer LI (as an exemplary substrate level, for example also formed as a semiconductor layer) with a first stack L2, which has a semiconductor layer L2a and an insulator layer L2b, can first be provided, wherein the insulator layer L2b of the first stack L2 is connected, for example, to the base layer LI.

In a further exemplary step S102, the semiconductor layer L2a of the first stack L2 can now be structured to form the at least two coupling sections 2, wherein, for example, known lithography processes with subsequent etching processes can be used for this purpose.

Furthermore, in an exemplary step S103, a second stack L3 may be provided on the structured semiconductor layer L2a of the first stack L2, wherein the second Stack L3 can have a semiconductor layer L3a and an insulator layer L3b and the insulator layer L3b of the second stack L3 can be connected at least to the at least two structured coupling sections 2 (for example by fusion bonding).

In a further exemplary step S104, the semiconductor layer L3a of the second stack L3 can now be structured to form the spring sections 3a - 3d, which are spaced from the functional element 1 in the direction of a normal vector of the substrate plane and are formed axially symmetrically to the at least one, in particular to the at least two oscillation axes X, Y, and the respective anchor sections 4a.

In this case, for example, for the formation of the anchor sections 4a, an additional layer L4, for example semiconductor layer L4, can be applied to the structured semiconductor layer L3a of the second stack L3 and thus to the structured spring sections 3a - 3d and then structured.

In a further exemplary step S105, the base layer LI can now be structured to form the functional element 1 (for example with the functional surface 1d), wherein, for example, flipping or turning over the previously formed MEMS structure can be advantageous for this purpose in order to be able to advantageously carry out corresponding lithography and subsequent etching steps on the base layer LI again.

Furthermore, in an exemplary step S106, a partial removal of the insulator layer L2b of the first stack L2 and the insulator layer L3b of the second stack L3 can be carried out in order to detach the final MEMS structure 100 from the laterally exemplary remaining sections of the layers LI to L5 (as shown by way of example in Fig. 15c), wherein these remaining sections of the layers LI to L5 can be used, for example, as the outer structure 10 of the MEMS device 1000 (see, for example, Figs. 17a and 17b).

Furthermore, in a further exemplary step S107, an actuator layer L8 can be provided on the structured semiconductor layer L3a of the second stack L3, and, in a further exemplary step S108, the applied actuator layer L8 can be structured to form the at least one actuator 8a, 8b on the spring sections 3a - 3d.

It should be noted that the provision of the actuator layer L8 can also take place at a different time and not only after the structuring of the semiconductor layer L3a of the second stack L3. It should be noted at this point that the steps of the method/manufacturing process described here do not necessarily have to be performed in the same order as in the manufacturing process. Rather, these steps can be interchanged or supplemented by additional steps.

Fig. 17a shows an exemplary embodiment of an exemplary MEMS device 1000, for example an exemplary MEMS mirror device 1000, with an exemplary embodiment of the exemplary MEMS structure 100.

The MEMS structure 100 can be connected to the outer structure 10, for example, by means of the anchor section(s) 4a, wherein the outer structure 10, as already shown and described in Figs. 15a - 15c, can be formed by the lateral sections of the layers LI - L5 that remained during the exemplary manufacturing process of the MEMS structure 100.

In this case, for example, the MEMS structure 100 can be provided within the outer structure 10 and the outer structure 10 can have an opening only in the region of the functional element 1 or the functional surface ld (for example the mirror surface ld / mirror ld) of the functional element 1.

This opening of the outer structure 10 can, for example, advantageously be closed with a transparent element 7, for example with a glass element 7. The glass element 7 can have a variety of shapes, such as a dome shape (see, for example, Figs. 17a and 17b), or the shape of a flat slope.

In addition, the transparent element 7 can be connected to the outer structure 10 in such a way that it can vacuum-pack the MEMS structure 100 accommodated in the outer structure 10. This can be achieved, for example, by so-called glass frits (shown in Figs. 17a and 17b as thicker black elements between the transparent element 7 and the outer structure 10).

This allows, for example, the MEMS structure 100 to oscillate with a fluid without significant damping losses due to friction, thereby reducing the energy consumption of the operation of the MEMS structure 100. Furthermore, the enclosure comprising the outer structure 10 and the transparent element 7 protects the MEMS structure 100 and, in particular, the functional section 1a/the functional surface 1d (e.g., the mirror surface 1d/the mirror 1d) from contamination. In addition, for example, a getter (not shown here) can be provided in the interior of the outer structure 10, which further supports the maintenance of the vacuum within the outer structure 10 and the transparent element 7.

In addition, TSV (Through-Silicon-Via) can be used as an example for contacting the actuators 8a, 8b (not shown here), which can advantageously enable contacting on the outside of the outer structure 10, for example in the vicinity of the bottom layer L5.

Furthermore, the transparent element 7, which may be a glass element 7, for example, may also be formed as a single-layer glass wafer 7 or an element 7 having several glass layers.

Fig. 17b shows a further exemplary embodiment of an exemplary MEMS device 1000, for example an exemplary MEMS mirror device 1000, with an exemplary embodiment of the exemplary MEMS structure 100 according to Fig. 14b, illustrations a) and b).

In particular, in comparison to the MEMS device 1000 as shown in Fig. 17a, the MEMS structure 100 can be integrated into the formed outer structure 10 by the anchor sections 3kl and 3k2, so that the MEMS structure 100 and the outer structure 10 are not only connected to each other in the region of the L4, L5 layers, but the connection has already been established via the L3 layer, which, as already described, can lead to a more advantageous electrical contacting of the potentially applied actuators 8a, 8b (not shown here; also applies to the sensors).

In addition, the additional space below the MEMS structure 100 can be used to provide a getter (not shown here) that helps maintain the vacuum within the MEMS device 1000.

It should be noted that only examples or embodiments of the present disclosure as well as technical advantages have been described above in detail with reference to the attached figures. However, the present disclosure is in no way limited or restricted to the above-described embodiments and their design features or their described combinations, but further includes modifications of the embodiments, in particular those that can be achieved by modifying the features of the described examples or by Combination or partial combination of one or more of the features of the described

Examples are included within the scope of protection of the independent claims.

List of reference symbols

1 Functional element la Functional section lb Holding section I Spring-loaded holding section lc Frame section

Id functional surface / mirror surface / mirror / mirror element

LI base layer

2 coupling section

2a Support section

2b Beam section

L2 first stack

L2a semiconductor layer of the first stack

L2b insulator layer of the first stack

3a - 3d spring sections

3v connecting section

3aa - 3db spring sections

3Lca - 3Ldb lever sections

3kl, 3k2 anchor sections

L3 second stack

L3a semiconductor layer of the second stack L3b Insulator layer of the second stack

4a Anchor section

L4 anchor layer

L5 Bottom layer 7 transparent element / glass wafer / multilayer element

8a - 8c actuators / piezo actuators / plate capacitors / comb drives

L8 Actuator layer

10 External structure

100 MEMS structure 1000 MEMS device/MEMS mirror device

Claims

Patent claims 1. MEMS structure (100) for a MEMS device (1000), in particular a MEMS mirror device (1000), comprising: - a functional element (1) which is designed to be movable in an oscillating manner along and/or around at least two oscillation axes (X, Y), and - spring sections (3a - 3d) which hold the functional element (1) so as to be oscillatingly movable along and/or about the at least two oscillation axes, wherein at least some of the spring sections (3a - 3d) are spaced apart from the functional element (1) in the direction of a normal vector of a substrate plane and the spring sections (3a - 3d) of the part of the spring sections (3a - 3d) are axially symmetrical to at least one of the oscillation axes (X, Y). 2. MEMS structure (100) according to claim 1, wherein the at least one part of the spring sections (3a - 3d) at least partially overlaps with the functional element (1) in a direction perpendicular to the normal vector of the substrate plane. 3. MEMS structure (100) according to claim 1 or 2, wherein the functional element (1) has at least one coupling section (2), in particular at least two coupling sections (2), by means of which the functional element (1) is mechanically connected to the spring sections (3a - 3d). 4. MEMS structure (100) according to claim 4, wherein the at least one coupling section (2) or the at least two coupling sections (2) are connected to the functional element (1) on the side of the functional element (1) which faces the spring sections (3a - 3d). 5. MEMS structure (100) according to claim 3 or 4, wherein the at least one coupling section (2) or at least one of the at least two coupling sections (2) comprises at least two support sections (2a) connected to the functional element (1) and a beam section (2b) connecting the at least two Support sections (2a) are connected to one another and which is connected to at least one spring section (3a - 3d). 6. MEMS structure (100) according to one of the preceding claims, wherein the spring sections (3a - 3d) are formed in pairs for the oscillation of the functional element (1) in the corresponding dimension. 7. MEMS structure (100) according to claim 6, wherein each pair of spring sections (3a - 3d) has a connecting section (3v) by means of which the two spring sections (3a - 3d) of the respective pair are connected to one another, and the connecting section (3v) of a first pair of spring sections (3a, 3b) is also the connecting section (3v) of a second pair of spring sections (3c, 3d). 8. The MEMS structure (100) according to claim 7, wherein each of the spring portions (3a, 3b) of the first pair is connected to one of the two coupling portions (2) at an end opposite the connecting portion (3v), and each of the spring portions (3c, 3d) of the second pair has, at an end opposite the connecting portion (3v), an anchor portion (4a) adapted to be connected to an external structure (10). 9. MEMS structure (100) according to claim 7 or 8, wherein the second pair of spring sections (3c, 3d) is designed to protrude in the longitudinal direction (L) of the second pair of spring sections (3c, 3d) relative to the functional element (1), or the functional element (1) has an overhang (U) in the longitudinal direction (L) of the second pair of spring sections (3c, 3d) relative to the second pair of spring sections (3c, 3d), advantageously an overhang (U) of 10 - 50% of the length (L) of the second pair of spring sections (3c, 3d), particularly advantageously an overhang (U) of 25 - 35% of the length (L) of the second pair of spring sections (3c, 3d), or the second pair of spring sections (3c, 3d) is connected to the functional element (1) in the longitudinal direction (L) of the second pair of spring sections (3c, 3d) so that neither the functional element (1) has an overhang (U) relative to the second pair of spring sections (3c, 3d) in the longitudinal direction (L) of the second pair of spring sections (3c, 3d), the second pair of spring sections (3c, 3d) projects relative to the functional element (1) in the longitudinal direction (L) of the second pair of spring sections (3c, 3d). 10. MEMS structure (100) according to one of claims 3 to 9, wherein the functional element (1) has a functional section (1a) and a frame section (1c) which surrounds the functional section (1a), and the frame section (1c) of the functional element (1) has at least one coupling section (2), by means of which the functional element (1) is mechanically connected to the spring sections (3a - 3d). 11. MEMS structure (100) according to claim 10, wherein the functional element (1) further comprises at least two holding sections (lb) formed between the functional section (la) and the frame section (lc) and mechanically connecting the functional section (la) to the frame section (lc). 12. MEMS structure (100) according to one of claims 3 to 9, wherein the functional element (1) further comprises at least one holding section (1b) which is formed between a functional section (1a) and at least one coupling section (2) and mechanically connects the functional section (1a) to the respective coupling section (2). 13. MEMS structure (100) according to claim 11 or 12, wherein the at least one holding section (lb) or the at least two holding sections (lb) are further designed as resilient holding sections (lb), in particular as torsion- and/or bending-resilient holding sections (lb). 14. MEMS structure (100) according to one of the preceding claims, wherein each of the spring sections (3a - 3d) which is spaced from the functional element (1) in the direction of the normal vector of the substrate plane is formed from two parallel spring subsections (3aa - 3d b). 15. MEMS structure (100) according to claims 7 and 14, wherein a first spring sub-section (3aa) of a first spring section (3a) of the first pair of spring sections (3a, 3b) has a connecting section with a first Spring part section (3da) of a second spring section (3d) of the second pair of spring sections (3c, 3d), a second spring part section (3db) of the second spring section (3d) of the second pair of spring sections (3c, 3d) has a connecting section with a second spring part section (3bb) of a second spring section (3b) of the first pair of spring sections (3a, 3b), a first spring part section (3ba) of the second spring section (3b) of the first pair of spring sections (3a, 3b) has a connecting section with a first spring part section (3ca) of the first spring section (3c) of the second pair of spring sections (3c, 3d), and a second spring part section (3cb) of the first spring section (3c) of the second pair of spring sections (3c, 3d) has a connecting section with a second spring part section (3ab) of the first spring section (3a) of the first pair of spring sections (3a, 3b). 16. The MEMS structure (100) according to claim 15, wherein each of the spring portions (3ca, 3cb, 3da, 3db) of the second pair has, at an end opposite the connecting portion, an anchor portion (3kl, 3k2) adapted to be connected to an external structure (10). 17. MEMS structure (100) according to claim 16, wherein between the respective armature section (3kl, 3k2) and the respective spring part section (3ca, 3cb, 3da, 3db) of the second pair, a lever section (3Lca, 3Lcb, 3Lda, 3Ldb) is further formed, which is configured to excite an oscillation of the functional element (1). 18. MEMS structure (100) according to claim 17, wherein the lever sections (3Lca, 3Lcb, 3Lda, 3Ldb) are arcuate or partially circular. 19. MEMS structure (100) according to one of the preceding claims, further comprising: at least one actuator (8a, 8b) which is arranged on at least one of the spring sections (3a - 3d) projecting from the functional element (1) in the direction of the normal vector of the substrate plane are formed spaced apart, or is provided on at least one lever section (3Lca, 3Lcb, 3Lda, 3Ldb). 20. MEMS structure (100) according to claim 19, wherein the at least one actuator (8a, 8b) is provided on the side of the at least one spring section (3a - 3d) that faces away from the functional element (1), or the at least one actuator (8a, 8b) is provided on the side of the at least one lever section (3Lca, 3Lcb, 3Lda, 3Ldb) that faces away from the functional element (1). 21. MEMS structure (100) according to one of the preceding claims, wherein the functional element (1) has a functional section (1a) with a functional surface (1d) formed by a mirror surface (1d) or by a mirror element (1d) provided on the functional section (1a). 22. MEMS device (1000), in particular a MEMS mirror device, comprising: - a MEMS structure (100) according to one of the preceding claims, - an outer structure (10) to which the MEMS structure (100) is connected, and - a transparent element (7), wherein the outer structure (10) and the transparent element (7) are adapted to vacuum pack the MEMS structure (100) within the MEMS device (1000). 23. A method for producing a MEMS structure (100) according to any one of claims 1 to 21, comprising: - Providing (S101) a base layer (LI) with a first stack (L2) comprising a semiconductor layer (L2a) and an insulator layer (L2b), wherein the insulator layer (L2b) of the first stack (L2) is connected to the base layer (LI), - Structuring (S102) the semiconductor layer (L2a) of the first stack (L2) to form the at least two coupling sections (2), - Providing (S103) a second stack (L3) on the structured semiconductor layer (L2a) of the first stack (L2), wherein the second stack (L3) has a semiconductor layer (L3a) and an insulator layer (L3b), and the insulator layer (L3b) of the second stack (L3) is connected at least to the at least two structured coupling sections (2), - Structuring (S104) the semiconductor layer (L3a) of the second stack (L3) to form the spring sections (3a - 3d), which are spaced from the functional element (1) in the direction of the normal vector of the substrate plane and are axially symmetrical to the at least one of the oscillation axes (X, Y), and the respective anchor sections (4a, 3k1, 3k2), - Structuring (S105) the base layer (LI) to form the functional element (1), and - partially removing (S106) the insulator layer (L2b) of the first stack (L2) and/or the insulator layer (L3b) of the second stack (L3).