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WO2025156835A1 - Microwave heating system and method, and microwave heating apparatus - Google Patents

Microwave heating system and method, and microwave heating apparatus

Info

Publication number
WO2025156835A1
WO2025156835A1 PCT/CN2024/137014 CN2024137014W WO2025156835A1 WO 2025156835 A1 WO2025156835 A1 WO 2025156835A1 CN 2024137014 W CN2024137014 W CN 2024137014W WO 2025156835 A1 WO2025156835 A1 WO 2025156835A1
Authority
WO
WIPO (PCT)
Prior art keywords
microwave
heating
microwave heating
dielectric
heating system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/137014
Other languages
French (fr)
Chinese (zh)
Inventor
尹树孟
单晓雯
宋云飞
张卫华
丁莉丽
李建哲
李莹
张健中
许光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Petroleum and Chemical Corp
Sinopec Research Institute of Safety Engineering Co Ltd
Original Assignee
China Petroleum and Chemical Corp
Sinopec Research Institute of Safety Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Petroleum and Chemical Corp, Sinopec Research Institute of Safety Engineering Co Ltd filed Critical China Petroleum and Chemical Corp
Publication of WO2025156835A1 publication Critical patent/WO2025156835A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • B01J19/122Incoherent waves
    • B01J19/126Microwaves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/007Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by irradiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/38Removing components of undefined structure
    • B01D53/44Organic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/86Catalytic processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/86Catalytic processes
    • B01D53/8678Removing components of undefined structure
    • B01D53/8687Organic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/64Heating using microwaves
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/64Heating using microwaves
    • H05B6/72Radiators or antennas
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/70Organic compounds not provided for in groups B01D2257/00 - B01D2257/602
    • B01D2257/708Volatile organic compounds V.O.C.'s
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2259/00Type of treatment
    • B01D2259/80Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
    • B01D2259/806Microwaves

Definitions

  • the present disclosure relates to the technical field of microwave heating, and in particular to a microwave heating system, method and microwave heating device.
  • VOC Volatile organic compound
  • FIG. 1 shows an example of catalytic oxidation using microwave technology in the prior art.
  • a catalytic oxidation vessel 100 comprises a catalyst bed 101, an inlet 102, an outlet 103, and a waveguide 104.
  • the catalyst bed 101 contains a substance (i.e., a catalyst) that promotes chemical reactions in VOCs. As VOCs pass through the heated catalyst bed, the catalyst promotes their decomposition, converting them into harmless gases such as carbon dioxide and water vapor.
  • microwaves are introduced into the vessel 100 via the waveguide 104 and absorbed by the catalyst bed 101, heating the catalyst bed 101 to a sufficient temperature to trigger the decomposition reaction of the VOCs.
  • VOCs which may originate from exhaust gases from various industrial processes, enter the vessel 100 through the inlet 102.
  • the VOCs react in the catalyst bed 101, converting them into harmless carbon dioxide and water vapor. These carbon dioxide and water vapor are then discharged through the outlet 103.
  • Microwave catalytic oxidation technology offers significant advantages, including fast heating response, high heating efficiency, and energy savings.
  • existing microwave catalytic oxidation technologies still suffer from numerous drawbacks. For example, as the catalyst bed size increases to the meter level, microwaves struggle to uniformly heat the large bed, potentially causing localized overheating of the catalyst material, impacting the overall efficiency and safety of the catalyst bed.
  • microwaves are introduced into the catalytic oxidation container through a waveguide, where the absorbing material (such as the catalyst bed) absorbs the microwaves, and the microwaves that are not absorbed are reflected and returned through the waveguide, thereby affecting energy utilization.
  • the absorbing material such as the catalyst bed
  • waveguides used to guide and transmit microwaves are metal leakage waveguides. There is current on the metal surface, and the electric field strength at the leakage gap is high, even higher than the breakdown electric field strength under humid air conditions, which poses certain safety hazards for handling flammable and explosive VOCs.
  • the purpose of the present disclosure is to solve at least one of the defects of the above-mentioned microwave catalytic oxidation method and to provide a microwave heating system, method and microwave heating device.
  • the present disclosure provides a microwave heating system in a first aspect, comprising a container body, wherein the container body comprises at least one heating cavity;
  • a microwave shielding element is provided in the heating cavity, which divides the heating cavity into a plurality of sub-heating cavities, each of which is provided with a microwave heating device and a heating carrier capable of absorbing microwaves to generate heat.
  • the microwave heating device is arranged on the side wall of the sub-heating cavity, and includes a dielectric radiator made of dielectric material.
  • the dielectric radiator has a radiation section located in the sub-heating cavity, which is used to radiate microwaves into the sub-heating cavity to heat the heated carrier.
  • the microwave shielding element extends the entire length of the heating cavity, so that each sub-heating cavity is arranged in parallel, and dielectric radiators are installed oppositely on the side walls at both ends of each sub-heating cavity.
  • each sub-heating cavity includes an even number of dielectric radiators, and the even number of dielectric radiators are divided into two groups and symmetrically installed on the side walls at both ends of the sub-heating cavity.
  • the container body includes multiple heating cavities, the multiple heating cavities are stacked up and down, the heat carrier is arranged into a heat carrier layer in the upper part and/or lower part of the sub-heating cavity, and the temperature of the stacked multiple heating cavities is independently controlled or forms a temperature gradient from top to bottom.
  • the microwave shielding element is called a second microwave shielding element, and a first microwave shielding element is arranged between two upper and lower adjacent heating cavities for shielding microwaves.
  • the second microwave shielding element is a steel plate for shielding microwaves and blocking gas
  • the first microwave shielding element is a steel mesh for shielding microwaves and allowing gas to pass through.
  • the radiation section has a multi-faceted structure, and the multi-faceted structure includes a radiation surface facing the heated carrier and emitting microwaves to the heated carrier.
  • the radiation section has a tapered multi-faceted structure, and the radiation surface has a tapered shape.
  • the tapered multi-faceted structure of the radiation section is a truncated pyramid structure
  • the radiation surface is two opposite surfaces of the truncated pyramid structure
  • the radiation section also includes side surfaces adjacent to the two radiation surfaces respectively, and the area of the radiation surface is larger than the area of the side surfaces.
  • the truncated pyramid structure is a truncated quadrangular pyramid structure, and there are two radiation surfaces and two side surfaces.
  • the heating cavity has a rectangular cross-section, and the dielectric radiators on the two adjacent heating cavities are arranged on adjacent sides or non-adjacent sides.
  • the dielectric radiators are arranged on non-adjacent sides, the extension directions of the upper and lower dielectric radiators are perpendicular to each other.
  • the heated carrier includes a catalyst
  • the container body is provided with a reactant inlet and a product outlet to allow the fluid reactant introduced through the reactant inlet to flow through the heated carrier to undergo a chemical reaction under the action of the catalyst.
  • the length of the heating cavity in the length extension direction of the dielectric radiator is 2-4 times the extension length of the radiation section extending into the heating cavity.
  • the microwave heating device includes a microwave generating unit, the dielectric radiator extending into the sub-heating cavity through the side wall of the container body, and a waveguide for guiding the microwaves generated by the microwave generating unit to the dielectric radiator.
  • the dielectric radiator further includes a coupling section extending in the waveguide and a transmission section extending between the coupling section and the radiation section, the coupling section having a tapered multi-faceted pointed structure.
  • the length of the coupling section is 0.75-1 times the microwave wavelength; the length of the radiation section is more than 0.8 times the microwave wavelength.
  • the dielectric constant of the material of the dielectric radiator is greater than 9, and the dielectric loss is less than 0.02.
  • a second aspect of the present disclosure relates to a microwave heating device for use in the microwave heating system described in the first aspect of the present disclosure.
  • the microwave heating device comprises a microwave generating unit, a dielectric radiator for radiating microwaves generated by the microwave generating unit to a heated carrier, and a waveguide for guiding the microwaves generated by the microwave generating unit to the dielectric radiator.
  • the dielectric radiator comprises a radiating section located within the heating cavity, the radiating section having a tapered multi-faceted structure including a radiating surface facing the heated carrier and uniformly emitting microwaves thereto.
  • the dielectric radiator is made of ceramic or polystyrene.
  • a third aspect of the present disclosure relates to an exhaust gas treatment method performed on the microwave heating system described in the first aspect of the present disclosure, wherein the microwave heating system includes a controller and a temperature sensor disposed on a heated carrier or in a heating cavity for real-time monitoring of the temperature of each heated carrier.
  • the method includes:
  • the reactant inlet In response to the measured temperature being greater than or equal to the target temperature, the reactant inlet is opened to inject the exhaust gas containing volatile organic compounds.
  • a fourth aspect of the present disclosure relates to a controller, comprising:
  • a computer-readable storage medium comprises a computer program stored thereon, wherein the computer program comprises executable instructions, and when the executable instructions are executed by the processor, the method according to the third aspect of the present disclosure is implemented.
  • a fifth aspect of the present disclosure relates to a computer-readable storage medium, comprising a computer program stored thereon, the computer program comprising executable instructions, which, when executed by the processor, implement the method according to the third aspect of the present disclosure.
  • a sixth aspect of the present disclosure relates to a computer program product, comprising executable instructions, which, when executed by a processor, implement the method according to the third aspect of the present disclosure.
  • the microwave heating equipment and exhaust gas treatment system disclosed in the present invention can use microwaves to achieve uniform heating of the bed on a larger scale, the microwaves are distributed more evenly in the heating cavity (also called the reaction cavity or free space), and the bed heating is more uniform.
  • the dielectric radiator itself does not generate current and does not generate heat, and is inherently safe when in contact with flammable and explosive gases.
  • the use of the microwave heating device described in the present disclosure to heat a large-scale catalyst bed has the beneficial effects of being inherently safe, having high microwave energy utilization, uniform microwave radiation, uniform heating of the bed, and having relatively low cost.
  • the technical solution disclosed in the present invention has more advantages in large-scale heating, and can achieve larger-scale heating of catalyst beds, which is convenient for realizing large-scale microwave reaction devices; moreover, heating is safer, the maximum electric field intensity in the reactor is much smaller than the electric field breakdown intensity in humid air, and there is no current on the radiator surface; furthermore, the technical solution disclosed in the present invention can be used in flammable and explosive places, especially when processing flammable and explosive gases, and the reactor can be intrinsically safe both inside and outside.
  • the overall heating of the catalyst bed by microwaves can be made more uniform, avoiding local high temperatures, causing safety problems or reducing the service life of the catalyst.
  • the technical solution disclosed in the present invention can be applied to microwave heating of large-scale solids, such as heating of microwave-absorbing solids such as microwave-absorbing catalysts or microwave-absorbing adsorbents, to achieve rapid heating of microwave-absorbing solids; heating of microwave-absorbing catalysts to participate in chemical reactions of gases or liquids to achieve efficient and rapid heating of catalysts; heating of microwave-absorbing adsorbents to be used in the field of environmental protection management of thermal desorption of adsorbents.
  • FIG1 is an example of catalytic oxidation using microwave technology in the prior art
  • FIG2 is a schematic cross-sectional view of a microwave heating system according to a preferred embodiment of the present disclosure
  • FIG3 is a front view of a dielectric radiator of a microwave heating device used in the microwave heating system of FIG2 ;
  • FIG4 is a different projection view of the dielectric radiator in FIG3;
  • FIG5 is a front view of a variant embodiment of the dielectric radiator according to the present disclosure.
  • FIG6 is a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure.
  • FIG7 is a cross-sectional view showing an arrangement of multiple microwave heating devices of the microwave heating system in FIG6 ;
  • FIG8 shows a top view of an arrangement of multiple microwave heating devices of the microwave heating system in FIG6 ;
  • FIG9 is a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure.
  • FIG10 is a cross-sectional view showing an arrangement of multiple microwave heating devices of the microwave heating system in FIG9 ;
  • FIG11 shows a top view of an arrangement of multiple microwave heating devices of the microwave heating system in FIG9 ;
  • FIG12 is a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure.
  • FIG13 is a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure.
  • FIG14 is a surface temperature distribution diagram of heating using a microwave heating device without a dielectric radiator
  • FIG15 is a diagram showing a surface temperature distribution of a microwave heating system using multiple dielectric radiators but without a first microwave shielding element
  • FIG16 is a diagram showing a surface temperature distribution of a microwave heating system using a plurality of dielectric radiators and provided with a first microwave shielding element;
  • FIG. 17 is a diagram showing a surface temperature distribution of a microwave heating system using a plurality of dielectric radiators and provided with a first microwave shielding element and a second microwave shielding element;
  • FIG18 is a temperature distribution diagram corresponding to heating performed by a microwave heating system in which microwave heating devices of adjacent heating cavities are installed on the same side wall;
  • FIG19 is a temperature distribution diagram corresponding to the microwave heating system in which microwave heating devices of adjacent heating cavities are installed on adjacent side walls;
  • FIG20 shows the electric field distribution cloud diagram of Example 6
  • FIG21 shows the electric field distribution cloud diagram of Example 7.
  • FIG22 shows the electric field distribution cloud diagram of Example 8.
  • FIG23 shows the electric field distribution cloud diagram of Example 9
  • FIG24 shows a cloud diagram of the electric field distribution of Example 10.
  • FIG25 shows a cloud diagram of the electric field distribution of Example 11.
  • FIG26 shows a cloud diagram of the electric field distribution of Example 12.
  • FIG27 shows a cloud diagram of the electric field distribution of Example 13
  • FIG28 illustrates a method for treating exhaust gas using the microwave heating system of the present disclosure
  • FIG. 29 shows a controller according to an embodiment of the present disclosure.
  • first and second are used for descriptive purposes only and should not be understood to indicate relative importance or implicitly specify the quantity of the technical features indicated. Therefore, unless otherwise specified, a feature specified as “first” or “second” may explicitly or implicitly include one or more of such features; “plurality” means two or more.
  • the term “comprising” and any variations thereof are intended to be non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components, and/or combinations thereof may be present or added.
  • orientation or positional relationships such as “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” and “outside” are described based on the orientation or relative positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing this application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.
  • the terms “mounted,” “connected,” and “connected” should be understood broadly, and may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.
  • the microwave heating system includes at least a container body 1, which includes at least one heating cavity 11.
  • a heating carrier 2 and a microwave heating device 3 mounted on the side wall of the heating cavity 11 are provided in the heating cavity 11.
  • the heating carrier 2 can absorb microwaves and heat up.
  • the heating carrier 2 is arranged flat to form a layer, which can be called a heating carrier layer.
  • the microwave heating device 3 is mounted on the side wall of the heating cavity 11 to emit microwaves into the heating cavity 11.
  • a catalyst When used for treating exhaust gases (e.g., VOCs), a catalyst is disposed within the heated carrier 2 within the heating chamber 11.
  • the heated carrier absorbs microwaves, raising its temperature and heating the catalyst, thereby causing a decomposition reaction in the exhaust gases flowing through the catalyst.
  • the heated carrier 2 itself may be a microwave-absorbing catalyst, in which case the heated carrier layer becomes a microwave-absorbing catalyst bed.
  • the microwave heating device 3 includes a microwave generating unit 31 , a dielectric radiator 33 extending through the container body 1 or the side wall of the heating cavity 11 into the heating cavity 11 , and a waveguide 32 for guiding the microwaves generated by the microwave generating unit 31 to the dielectric radiator 33 .
  • Dielectric radiator 33 is a dielectric rod antenna, a typical traveling wave antenna made of a low-loss, high-frequency dielectric material.
  • the dielectric material is either a dielectric or insulating material (e.g., polystyrene or ceramic).
  • Dielectric rod antennas guide microwave propagation. Compared to metal waveguides, considerable power overflows from dielectric boundaries into free space (e.g., heating cavity 11).
  • the portion of the dielectric radiator 33 used to emit microwaves toward the heated carrier within the heating cavity is called the radiation section.
  • the inventors have discovered that by adjusting the shape of the radiation section of the dielectric radiator 33, the impedance of the dielectric rod antenna can be adjusted, thereby achieving a good match between the dielectric rod antenna and the air impedance and improving radiation efficiency. Moreover, by adjusting the shape of the radiation section of the dielectric radiator 33, the microwaves emitted by the radiation section can be distributed more evenly on the heated carrier, thereby achieving uniform heating of the heated carrier layer.
  • the radiation section of the dielectric radiator 33 adopts a multi-faceted shape, such as a gradually tapering multi-faceted shape or a multi-faceted tapered structure, such as a pyramid shape or a truncated pyramid shape, preferably a quadrangular pyramid shape or a truncated quadrangular pyramid shape.
  • This multi-faceted structure can achieve a good match between the dielectric rod antenna and the air impedance, reduce surface wave reflections, improve radiation efficiency, and allow most microwaves to be radiated or emitted into the heating cavity 11.
  • the multi-faceted structure can adjust the microwave radiation direction so that the microwaves are evenly radiated onto the heated carrier 2, resulting in uniform heating of the heated carrier 2 and the entire heated carrier layer.
  • the multi-faceted structure of the dielectric radiator 33 will be described in further detail below with reference to FIGS. 3-5 .
  • two or more heating carrier layers may be included, each located around the dielectric radiator 33, for example, above and below the dielectric radiator 33.
  • the dielectric radiator 33 is configured so as to be located between two opposing heating carrier layers.
  • the microwave heating device 3 may be symmetrically installed on both sides of the heating cavity 11 (left and right sides in the figure), so that the dielectric radiators 33 in the microwave heating devices 3 arranged on both sides are opposite to each other, and the opposing dielectric radiators 33 are located on the same straight line in the longitudinal extension direction.
  • dielectric radiator 33 may include a coupling section 333, a transmission section 332, and a radiating section 331.
  • the coupling section 333 and the radiating section 331 are disposed on opposite sides of the transmission section 332, and each may be formed in the shape of a truncated quadrangular pyramid.
  • the dielectric radiator 33 is generally formed into a structure that is thin at both ends and thick in the middle.
  • the truncated quadrangular pyramid shape of the coupling section 333 and the radiating section 331, for example, includes four side surfaces, each of which is trapezoidal.
  • the truncated portion of the truncated quadrangular pyramid forms end faces, each of which is a quadrilateral, preferably a rectangle or square.
  • the four side surfaces of the truncated quadrangular pyramid are two upper and lower opposing side surfaces 331a and two front and rear opposing side surfaces 331b.
  • the width (or area) of the upper and lower side surfaces 331a of the coupling section 333 and the radiating section 331 is greater than the width (or area) of the front and rear opposing side surfaces 331b.
  • the upper and lower side surfaces 331a face the heat receiving carrier layer.
  • the side of the truncated quadrangular pyramid with the larger area faces the heat receiving carrier layer. Accordingly, the side facing the heat receiving carrier layer can be referred to as the radiation surface.
  • the radiation section 331 is located in the heating cavity 11 and is formed with a pair of radiation surfaces 331a facing the corresponding heat carrier layer and a pair of side surfaces 331b adjacent to the radiation surfaces 331a.
  • the width (or area) of the radiation surface 331a can be greater than the width (or area) of the side surface 331b.
  • the radiation surfaces 331a of the two oppositely arranged dielectric radiators 33 extend close to each other, and the side surfaces 331b also extend close to each other, so that the radiation section 331 has a tapered multi-faceted structure.
  • the length of the coupling section 333 is preferably 0.75 to 1 times the microwave wavelength; the length of the radiating section 331 is preferably at least 0.8 times the microwave wavelength, more preferably 0.8 to 2.5 times the microwave wavelength.
  • the microwave can be, for example, a 2450 MHz or 915 MHz microwave. When the microwave is a 2450 MHz microwave, the wavelength is approximately 122.4 mm.
  • the multi-faceted tapering angle of the coupling section 333 (i.e., the angle between the center line and the side surface in the length direction of the dielectric radiator) is preferably 5-85°, and the multi-faceted tapering angle of the radiating section 331 is preferably 5-85°.
  • the size of the heating cavity 11 along the length extension direction of the dielectric radiator 33 is 2-4 times the length of the radiation section 331 extending into the heating cavity 11 .
  • the dielectric constant of the material of the dielectric radiator is greater than 9, and the dielectric loss is less than 0.02.
  • the material of the dielectric radiator is ceramic or polystyrene.
  • the transmission section 332 of the dielectric radiator 33 may have a flange portion 332a.
  • the transmission section 332 passes through the side wall of the container body 1 or the heating cavity 11, and the flange portion 332 is in contact with the wall surface (outer wall surface or inner wall surface) of the container body 1 or the heating cavity 11, and the flange portion can be pressed and fixed to the side wall of the heating cavity 11 via a waveguide flange.
  • This contact and fastening structure is used to prevent VOCs in the container body 1 or the heating cavity 11 from leaking into the microwave heating device 3 or into the external environment, causing explosion or pollution.
  • the microwave heating device 3 described herein may include an explosion-proof excitation cavity 34.
  • the microwave generating unit 31 may be a magnetron disposed within the explosion-proof excitation cavity 34.
  • the explosion-proof excitation cavity 34 is connected to one end of the waveguide 32, and the other end of the waveguide 32 is connected to a dielectric radiator 33.
  • the coupling section 333 of the dielectric radiator 33 extends into the waveguide 32.
  • the explosion-proof excitation cavity 34 is physically isolated from the waveguide 32 by a dielectric sealing window 35, and the microwaves generated by the magnetron can enter the waveguide 32 through the dielectric sealing window 35.
  • the dielectric sealing window 35 is a sealed quartz window. The dielectric sealing window 35 is used to prevent VOCs in the container body 1 and/or the heating cavity 11 from leaking into the explosion-proof excitation cavity 34 and causing explosion or contamination.
  • the waveguide may be further provided with a pin 32a, by which the microwave reflection power can be adjusted, thereby further reducing the microwave reflection power.
  • the microwave output power is adjusted by adjusting the microwave power supply of the microwave generating unit 31, thereby adjusting the temperature of the heated carrier layer composed of the heated carrier 2 (such as an absorbing catalyst), and the overall heating, uniform heating and safe heating of the large-sized catalyst bed can be achieved through the dielectric radiator.
  • the coupling section 333 of the dielectric radiator 33 is located within the waveguide 32, and the radiating section 331 is located within the heating cavity 11.
  • the upper and lower sides of the heating cavity 11 are provided with a heating medium 2 (e.g., a catalyst bed) with excellent microwave absorption and thermal conductivity.
  • the microwave generating unit 31 generates microwaves, which are transmitted through the waveguide 32.
  • the microwaves are coupled to the coupling section 333 of the dielectric radiator 33, further transmitted by the transmission section 332, and uniformly radiated by the radiating section 331.
  • the microwaves are ultimately absorbed by the heating medium 2, achieving the purpose of heating the heating medium.
  • a temperature sensor (not shown) is provided on the heated carrier 2 or in the heating cavity 11 to monitor the temperature of each heated carrier or heated carrier layer in real time.
  • a controller (not shown) provided in the microwave heating system is configured to receive the measured temperature from the temperature sensor, compare the measured temperature with the target temperature, and output a control signal to the microwave generating unit 31 in the microwave heating device based on the difference between the measured temperature and the target temperature, thereby being able to control the output power of the microwave generating unit 31.
  • the reactant inlet is opened to inject the reaction medium (such as VOCs) through the heated carrier 2, and an efficient decomposition reaction occurs under the assistance of the heated carrier 2.
  • the reaction medium such as VOCs
  • FIG. 6-13 show microwave heating systems according to different preferred embodiments, wherein a plurality of microwave heating devices are arranged in different ways on the sidewalls of the heating cavity 11 , wherein the radiating sections 331 of the dielectric radiators 33 in the microwave heating devices extend into the heating cavity 11 .
  • FIG. 6 shows an overall schematic diagram of the microwave heating system.
  • a plurality of heating cavities 11 are provided in the container body 1. These are stacked up and down (can be referred to as stacked along a first direction) to form a microwave heating system.
  • Two upper and lower heating carrier layers (can be referred to as arranged along a first direction) facing each other are arranged in each heating cavity 11.
  • the microwave heating devices 3 are symmetrically arranged in pairs on opposite sides of the space formed between the upper and lower heating carrier layers.
  • the dielectric radiators 33 of each pair of microwave heating devices 3 are located on the same straight line along their length extension direction.
  • FIG 7 a cross-sectional view of the arrangement of the plurality of microwave heating devices in the microwave heating system of Figure 6 is shown. It can be seen that the arrangement is equivalent to a heating system formed by stacking the plurality of heating cavities 11 in Figure 2 up and down.
  • the multiple layers of heating cavities 11 can optionally be separated by a first microwave shielding element 14 (e.g., a shielding steel mesh).
  • the first microwave shielding element 14 allows for independent control of the heating of each heating cavity 11, preventing interaction between adjacent heating cavities 11.
  • the first microwave shielding element 14 does not block the passage of VOCs or other related gases.
  • the first microwave shielding element 14 may be a perforated stainless steel plate or a shielded steel mesh.
  • FIG 8 shows a top view of the arrangement of multiple microwave heating devices in the microwave heating system of Figure 6.
  • the container body 1 has a rectangular cross-section in the horizontal direction.
  • microwave heating devices 3 or dielectric radiators 33 are arranged in pairs on the sidewalls in only one relative direction (e.g., left-right), and not in other directions (e.g., front-to-back). This arrangement is intended to achieve uniform electric field strength and prevent microwaves emitted by multiple microwave heating devices 3 from overlapping and converging in the center of the heating cavity. This strong electric field could potentially break down the air, posing a safety hazard for processing flammable and explosive VOCs.
  • the container body 1 may be provided with a reactant inlet 12 and a product outlet 13 to allow the fluid reactant introduced through the reactant inlet 12 to flow through the heated carrier 2 in the heated carrier layer in a first direction and be discharged through the product outlet 13.
  • the reactant flow entering the container body 1 is processed by the multiple heated carriers in sequence from bottom to top (first direction).
  • each heating cavity 11 controls the heating temperature through its own dielectric radiator 33, and the temperature of each heated carrier is monitored in real time by arranging a temperature sensor on the heated carrier or in the heating cavity 11, and the temperature is fed back to the controller.
  • the controller outputs a control signal to the microwave generating unit 31 based on the comparison between the monitored temperature and the target temperature, thereby controlling the output power of the microwave generating unit 31 and further controlling the temperature of the heated carrier.
  • each heating chamber 11 can be individually controlled, thereby enabling more efficient treatment of different VOC components.
  • gradient temperature control can be implemented between multiple stacked heating chambers 11, so that a temperature gradient is achieved from bottom to top or from top to bottom in the container body 1.
  • FIGs 9-11 illustrate schematic structural diagrams of a microwave heating system according to another embodiment of the present disclosure.
  • the microwave heating system illustrated in Figures 9-11 further improves upon the microwave heating system illustrated in Figures 6-8.
  • the microwave heating devices, or the dielectric radiators included therein are vertically staggered in two adjacent heating cavities 11. To simplify the description, only the differences from the structure illustrated in Figures 6-8 are described below.
  • the left half shows a left view of the microwave heating system
  • the right half is a front view of the microwave heating system.
  • the extension directions of the dielectric radiators of the microwave heating devices are perpendicular to each other and staggered.
  • the staggered configuration means that the two adjacent heating cavities 11 are provided with dielectric radiators on the non-adjacent sides.
  • the microwave heating device or dielectric radiator of a heating cavity is arranged relative to the left and right sides of the heating cavity, then the microwave heating device or dielectric radiator of the heating cavity adjacent to the heating cavity is arranged relative to the front and back sides of the heating cavity.
  • the heat carrier can be heated more evenly.
  • FIG. 10 is a cross-sectional view showing an arrangement of multiple microwave heating devices in the microwave heating system of FIG. 9 ; and FIG. 11 is a top view showing an arrangement of multiple microwave heating devices in the microwave heating system of FIG. 9 .
  • FIG 12 shows a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure.
  • This system further improves upon the microwave heating system shown in Figures 6-8 or the microwave heating system shown in Figures 9-11.
  • a second microwave shielding element 15 may be provided within at least a portion of the heating cavities 11.
  • This second microwave shielding element 15 extends across the entire length of the heating cavities, thereby separating multiple pairs of opposing microwave heating devices 3 or the dielectric radiators included therein. Accordingly, the heating cavities 11 are divided into multiple sub-heating cavities distributed sequentially and in parallel.
  • Each sub-heating cavity is located at either end of the heating cavity 11 and is provided with one or more pairs of opposing microwave heating devices 3 or the dielectric radiators included therein (see Figure 12).
  • the first microwave shielding element 14 and the second microwave shielding element 15 are made of metal.
  • the first microwave shielding element 14 may be a perforated steel plate or steel mesh, while the second microwave shielding element may be a steel plate.
  • the division of the second microwave shielding element 15 makes the heating of the heated carrier in the single heating cavity 11 more uniform, and can prevent the microwaves emitted by adjacent microwave heating devices 3 from overlapping each other, thereby preventing the electric field strength from increasing beyond the air breakdown strength.
  • Figure 13 shows another embodiment of a microwave heating system according to the present disclosure.
  • multiple heating cavities are arranged side by side in the left-right direction within the container body. Accordingly, the individual heat carriers in the heating cavities are laid out in the vertical direction, forming a heat carrier layer located on the left and right sides of the heating cavity.
  • Multiple microwave heating devices 3 are mounted on the sidewalls at the upper and lower ends of the container body 1, corresponding to each heating cavity 11.
  • the dielectric radiators 33 of the microwave heating devices 3 extend vertically into the heating cavity 11.
  • the first microwave shielding element 14 is no longer provided between the heating cavities 11.
  • the heat carrier layers in two adjacent heating cavities are combined to form a single body.
  • Reactant inlets 12 and product outlets 13 are provided on the container body 1 corresponding to the combined heat carrier layer, allowing the fluid reactant introduced through the reactant inlet 12 to flow vertically through the heat carrier layer 2 and be discharged through the product outlet 13.
  • heating is achieved solely through an eight-port waveguide (each rectangular block at the upper and lower ends of the figure represents a port).
  • the microwave radiation efficiency is 94.94%, resulting in a significant maximum temperature difference of 350°C across the catalyst bed.
  • the temperature is primarily concentrated at the microwave radiation indentation, making uniform heating difficult to achieve away from the microwave feed port.
  • the uniformity of the catalyst bed is significantly improved.
  • the catalyst bed away from the microwave feed is heated effectively, with microwave injection efficiency increased to 96.11% and the maximum temperature difference reduced to 180°C.
  • the temperature in the middle range away from the microwave feed is higher on both sides and slightly lower in the middle.
  • the first shielding element is preferably a steel mesh, which shields microwaves while allowing gas to pass through.
  • the second microwave shielding element is a steel plate, which shields microwaves and isolates air.
  • the material of the first shielding element is not limited to steel mesh; any material that can shield microwaves and allow gas to pass through can be used.
  • the second microwave shielding element is not limited to steel plate; any material that can shield microwaves and block gas can be used.
  • the dielectric radiators at different levels above and below adopt a co-directional radiation scheme.
  • the maximum temperature difference of the middle catalyst bed is 60°C.
  • the dielectric radiators at different levels above and below adopt a 90° intersecting (perpendicular) radiation scheme.
  • the maximum temperature difference of the middle catalyst bed is 52°C.
  • both the heating method using multiple radiators and multiple layers arranged in parallel and the heating method using multiple radiators and multiple layers arranged in an interlaced manner can achieve better uniform heating effects; moreover, by setting metal partitions between multiple groups of radiators, the radiation efficiency and heating uniformity can be further improved.
  • el1 as the coupling segment length
  • el2 as the radiation segment length
  • el3 as the transmission segment length
  • the maximum electric field intensity in the container body does not exceed 3.87 ⁇ 10 3 V/m, which is much lower than the electric field breakdown intensity in humid air.
  • the electric field distribution cloud maps of Examples 6-9 are shown in Figures 20-23, respectively.
  • the uniformity of the electric field intensity represented by each represents whether the temperature of the heated catalyst bed is uniform.
  • the electric field intensity of Examples 6 and 7 is mainly concentrated near the wall of the container body, indicating that the electric field intensity distribution is uneven, the catalyst bed temperature distribution is uneven, and the microwave energy utilization rate is also low;
  • Examples 8 and 9 have relatively more uniform electric fields, indicating that the heated catalyst bed temperature is more uniform and the incident efficiency is relatively high.
  • the length of the radiator represented by Examples 8 and 9 is more conducive to producing a uniform and efficient heating effect.
  • a method for treating waste gas e.g., VOCs
  • a controller receives a temperature signal from a temperature sensor located on the heated carrier 2 or within the heating cavity 11. The method then proceeds to step 2802, where the controller compares the received temperature signal with a target temperature.
  • step 2803 a determination is made as to whether the temperature signal has reached the target temperature. If so, the method proceeds to step 2805.
  • the reactant inlet is opened to allow the introduction of waste gas containing volatile organic compounds (e.g., VOCs).
  • the controller If, at step 2803, it is determined that the temperature signal has not yet reached the target temperature, the controller outputs a control signal based on the difference between the temperature signal and the target temperature.
  • the control signal is used to control the microwave generating unit in the microwave heating apparatus 3 to continue generating microwaves to continue heating the heated carrier within the heating cavity 11. Additionally, the controller can also control the inlet airflow based on the composition of the product at the outlet of the container body 1. In the case where there are multiple heating chambers, the controller may control the temperature of each heating chamber separately.
  • FIG 29 shows a controller 2900 according to an embodiment of the present disclosure, which may be the controller mentioned in the previous embodiment.
  • the controller includes a processor 2901, a memory 2902, and an interface 2903.
  • the processor 2901 implements the exhaust gas treatment operation by executing computer-executable instructions that define the method shown in Figure 28.
  • a computer program product including computer-executable instructions can be stored in the memory 2902.
  • the method described in Figure 29 can be defined by computer-executable instructions included in the computer program product stored in the memory 2902 and controlled by the processor 2901 that executes the computer-executable instructions.
  • the interface 2903 may include a network interface for communicating with other devices via a network, and the interface may also include other input/output devices (e.g., a display, keyboard, mouse, speaker, button, touchpad, touch screen, etc.) that enable a user to interact with the controller 2900.
  • input/output devices e.g., a display, keyboard, mouse, speaker, button, touchpad, touch screen, etc.
  • Figure 29 is a high-level representation of some components of such a control system for illustrative purposes.
  • Memory 2902 includes tangible, non-transitory machine-readable storage media and may also include high-speed random access memory, such as dynamic random access memory (DRAM), static random access memory (SRAM), double data rate synchronous dynamic random access memory (DDRRAM), or other random access solid-state memory devices, and may include non-volatile memory, such as one or more magnetic disk storage devices (such as internal hard disks and removable disks), magneto-optical disk storage devices, optical disk storage devices, flash memory devices, semiconductor memory devices (such as erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)), compact disk read-only memory (CD-ROM), digital versatile disk read-only memory (DVD-ROM) disks, or other non-volatile solid-state storage devices.
  • DRAM dynamic random access memory
  • SRAM static random access memory
  • DDRRAM double data rate synchronous dynamic random access memory
  • non-volatile memory such as one or more magnetic disk storage devices (such as internal hard disks and removable disk

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Abstract

A microwave heating system, comprising a container body (1). The container body (1) comprises at least one heating cavity (11); a microwave shielding element (15) is provided in the heating cavity (11); the microwave shielding element (15) divides the heating cavity (11) into a plurality of sub heating cavities; a microwave heating apparatus (3) and a heated carrier (2) capable of absorbing microwaves to generate heat are provided in each sub heating cavity; the microwave heating apparatus (3) is arranged on the side wall of the sub heating cavity; the microwave heating apparatus (3) comprises a dielectric radiator (33) made of a dielectric material; and the dielectric radiator (33) has a radiation section (331) located in the sub heating cavity and used for radiating the microwaves into the sub heating cavity so as to heat the heated carrier (2). The microwave heating system can effectively improve the uniformity of the microwaves heating a large-size heated carrier (2) and the microwave incident efficiency.

Description

微波加热系统、方法以及微波加热装置Microwave heating system, method and microwave heating device 技术领域Technical Field

本公开涉及微波加热技术领域,具体涉及一种微波加热系统、方法及微波加热装置。The present disclosure relates to the technical field of microwave heating, and in particular to a microwave heating system, method and microwave heating device.

背景技术Background Art

挥发性有机物(VOCs)治理以及近零排放日益受到社会重视。目前的VOCs治理方法主要分为销毁法和回收法。销毁法VOCs治理技术相对于回收法VOCs治理技术能够彻底、一次性地将VOCs转化为CO2和H2O,同时也可以将甲烷转化为CO2,实现小分子烃类物质的彻底焚毁,具有不可替代的优势。Volatile organic compound (VOC) control and near-zero emissions are gaining increasing public attention. Current VOC control methods are primarily divided into destruction and recovery. Destruction offers irreplaceable advantages over recovery in that it can completely and instantly convert VOCs into CO₂ and H₂O . It can also convert methane into CO₂ , achieving the complete incineration of small-molecule hydrocarbons.

微波催化氧化法是现有销毁法中比较有前景的一个发展方向。参见附图1,示出了现有技术中采用微波技术进行催化氧化的一个示例。催化氧化容器100包括催化剂床层101、入口102、出口103以及波导104。催化剂床层101包含了能够促进VOCs发生化学反应的物质(即催化剂)。当VOCs通过加热的催化剂床层时,催化剂会促进VOC的分解,将其转化为无害的气体,如二氧化碳和水蒸气。如图所示,微波通过波导104被引入到容器100中,被催化剂床层101吸收从而使催化剂床层101受热升温,达到足够的温度来触发VOCs的分解反应。VOCs通过入口102进入容器100,这些VOCs可能来自于各种工业过程的废气。VOCs在催化剂床层101处发生反应,转化为无害的二氧化碳和水蒸气。然后这些二氧化碳和水蒸气通过出口103排出。Microwave catalytic oxidation is a promising development among existing destruction methods. Figure 1 shows an example of catalytic oxidation using microwave technology in the prior art. A catalytic oxidation vessel 100 comprises a catalyst bed 101, an inlet 102, an outlet 103, and a waveguide 104. The catalyst bed 101 contains a substance (i.e., a catalyst) that promotes chemical reactions in VOCs. As VOCs pass through the heated catalyst bed, the catalyst promotes their decomposition, converting them into harmless gases such as carbon dioxide and water vapor. As shown in the figure, microwaves are introduced into the vessel 100 via the waveguide 104 and absorbed by the catalyst bed 101, heating the catalyst bed 101 to a sufficient temperature to trigger the decomposition reaction of the VOCs. VOCs, which may originate from exhaust gases from various industrial processes, enter the vessel 100 through the inlet 102. The VOCs react in the catalyst bed 101, converting them into harmless carbon dioxide and water vapor. These carbon dioxide and water vapor are then discharged through the outlet 103.

微波催化氧化技术具有加热响应速度快、加热效率高、节能降耗的巨大优势。然而,现有技术中微波催化氧化技术仍存在许多缺陷,例如随着催化剂床层尺寸增大达到米级,微波很难实现大尺度床层的均匀加热,甚至造成催化剂材料的局部高温过热,从而影响催化剂床层的整体利用效率和安全性。Microwave catalytic oxidation technology offers significant advantages, including fast heating response, high heating efficiency, and energy savings. However, existing microwave catalytic oxidation technologies still suffer from numerous drawbacks. For example, as the catalyst bed size increases to the meter level, microwaves struggle to uniformly heat the large bed, potentially causing localized overheating of the catalyst material, impacting the overall efficiency and safety of the catalyst bed.

而且,现有技术中缺乏大尺度催化床层整体穿透加热技术。材料趋肤深度限制微波穿透,微波对吸波催化剂的穿透深度一般小于5cm,针对米级床层难以进行三维立体的穿透加热,进而导致无法工业应用。Furthermore, existing technologies lack the technology to heat the entire catalytic bed through penetration. The skin depth of the material limits microwave penetration, and microwaves typically penetrate less than 5 cm into absorbing catalysts. This makes three-dimensional penetration heating of meter-scale beds difficult, making industrial applications impossible.

另外,微波通过波导引入催化氧化容器内,其中的吸波材料(例如催化剂床层)吸收微波,未被吸收的微波会被反射并通过波导返回,从而影响能量利用率。In addition, microwaves are introduced into the catalytic oxidation container through a waveguide, where the absorbing material (such as the catalyst bed) absorbs the microwaves, and the microwaves that are not absorbed are reflected and returned through the waveguide, thereby affecting energy utilization.

进一步,用于引导并传输微波的波导大多为金属泄漏型波导,金属表面存在电流,且缝隙泄漏处电场强度较高甚至高过潮湿空气条件下的击穿电场强度,对于处理易燃易爆VOCs存在一定的安全隐患。Furthermore, most waveguides used to guide and transmit microwaves are metal leakage waveguides. There is current on the metal surface, and the electric field strength at the leakage gap is high, even higher than the breakdown electric field strength under humid air conditions, which poses certain safety hazards for handling flammable and explosive VOCs.

发明内容Summary of the Invention

本公开的目的是为了解决上述微波催化氧化法中的至少一个缺陷,提供一种微波加热系统、方法以及微波加热装置。The purpose of the present disclosure is to solve at least one of the defects of the above-mentioned microwave catalytic oxidation method and to provide a microwave heating system, method and microwave heating device.

为了实现上述目的,本公开第一方面提供了一种微波加热系统,包括容器主体,所述容器主体包括至少一个加热腔体;To achieve the above-mentioned object, the present disclosure provides a microwave heating system in a first aspect, comprising a container body, wherein the container body comprises at least one heating cavity;

其中所述加热腔体内设置有微波屏蔽元件,所述微波屏蔽元件将所述加热腔体分隔成多个子加热腔,每个子加热腔中设置有微波加热装置和能够吸收微波而生热的受热载体,A microwave shielding element is provided in the heating cavity, which divides the heating cavity into a plurality of sub-heating cavities, each of which is provided with a microwave heating device and a heating carrier capable of absorbing microwaves to generate heat.

其中所述微波加热装置设置在所述子加热腔的侧壁上,所述微波加热装置包括由电介质材料构成的介质辐射器,所述介质辐射器具有位于所述子加热腔内的辐射段,用于向子加热腔内辐射微波以加热所述受热载体。The microwave heating device is arranged on the side wall of the sub-heating cavity, and includes a dielectric radiator made of dielectric material. The dielectric radiator has a radiation section located in the sub-heating cavity, which is used to radiate microwaves into the sub-heating cavity to heat the heated carrier.

根据本公开第一方面所述的微波加热系统,其中所述微波屏蔽元件延伸所述加热腔体的整个长度,使得每个子加热腔并行设置,并且在每个子加热腔的两端侧壁上相对地安装介质辐射器。According to the microwave heating system described in the first aspect of the present disclosure, the microwave shielding element extends the entire length of the heating cavity, so that each sub-heating cavity is arranged in parallel, and dielectric radiators are installed oppositely on the side walls at both ends of each sub-heating cavity.

根据本公开第一方面所述的微波加热系统,其中每个子加热腔包括偶数个介质辐射器,所述偶数个介质辐射器分为2组对称安装在所述子加热腔体的两端侧壁上。According to the microwave heating system described in the first aspect of the present disclosure, each sub-heating cavity includes an even number of dielectric radiators, and the even number of dielectric radiators are divided into two groups and symmetrically installed on the side walls at both ends of the sub-heating cavity.

根据本公开第一方面所述的微波加热系统,其中所述容器主体包括多个加热腔体,所述多个加热腔体上下堆叠,所述受热载体在所述子加热腔的上部和/或下部分别布置成受热载体层,堆叠的所述多个加热腔体的温度独立控制或者从上到下形成温度梯度。According to the microwave heating system described in the first aspect of the present disclosure, the container body includes multiple heating cavities, the multiple heating cavities are stacked up and down, the heat carrier is arranged into a heat carrier layer in the upper part and/or lower part of the sub-heating cavity, and the temperature of the stacked multiple heating cavities is independently controlled or forms a temperature gradient from top to bottom.

根据本公开第一方面所述的微波加热系统,其中所述微波屏蔽元件称为第二微波屏蔽元件,并且其中在上下相邻的2个加热腔体之间设置第一微波屏蔽元件用于屏蔽微波。According to the microwave heating system described in the first aspect of the present disclosure, the microwave shielding element is called a second microwave shielding element, and a first microwave shielding element is arranged between two upper and lower adjacent heating cavities for shielding microwaves.

根据本公开第一方面所述的微波加热系统,其中第二微波屏蔽元件为钢板,用于屏蔽微波并阻隔气体,并且第一微波屏蔽元件为钢网,用于屏蔽微波并允许气体通过。According to the microwave heating system described in the first aspect of the present disclosure, the second microwave shielding element is a steel plate for shielding microwaves and blocking gas, and the first microwave shielding element is a steel mesh for shielding microwaves and allowing gas to pass through.

根据本公开第一方面所述的微波加热系统,其中所述辐射段具有多面结构,所述多面结构包括面向所述受热载体并向所述受热载体发射微波的辐射表面。According to the microwave heating system of the first aspect of the present disclosure, the radiation section has a multi-faceted structure, and the multi-faceted structure includes a radiation surface facing the heated carrier and emitting microwaves to the heated carrier.

根据本公开第一方面所述的微波加热系统,其中所述辐射段具有渐缩的多面结构,所述辐射表面的形状为渐缩形状。According to the microwave heating system of the first aspect of the present disclosure, the radiation section has a tapered multi-faceted structure, and the radiation surface has a tapered shape.

根据本公开第一方面所述的微波加热系统,其中所述辐射段的渐缩的多面结构为截头棱锥结构,所述辐射表面为所述截头棱锥结构的2个相对表面,并且所述辐射段还包括分别与两个所述辐射表面相邻的侧表面,且所述辐射表面的面积大于所述侧表面的面积。According to the microwave heating system described in the first aspect of the present disclosure, the tapered multi-faceted structure of the radiation section is a truncated pyramid structure, the radiation surface is two opposite surfaces of the truncated pyramid structure, and the radiation section also includes side surfaces adjacent to the two radiation surfaces respectively, and the area of the radiation surface is larger than the area of the side surfaces.

根据本公开第一方面所述的微波加热系统,所述截头棱锥结构为截头四棱锥结构,所述辐射表面和所述侧表面均为2个。According to the microwave heating system described in the first aspect of the present disclosure, the truncated pyramid structure is a truncated quadrangular pyramid structure, and there are two radiation surfaces and two side surfaces.

根据本公开第一方面所述的微波加热系统,其中所述加热腔体具有矩形横截面,上下相邻的2个加热腔体上所述介质辐射器设置在上下相邻的侧面上或不相邻的侧面上,在所述介质辐射器设置在上下不相邻的侧面的情况下,所述上下介质辐射器的延伸方向相互垂直。According to the microwave heating system described in the first aspect of the present disclosure, the heating cavity has a rectangular cross-section, and the dielectric radiators on the two adjacent heating cavities are arranged on adjacent sides or non-adjacent sides. When the dielectric radiators are arranged on non-adjacent sides, the extension directions of the upper and lower dielectric radiators are perpendicular to each other.

根据本公开第一方面所述的微波加热系统,其中所述受热载体中包括催化剂,所述容器主体上设有反应物入口和产物出口,以允许由所述反应物入口通入的流体反应物流过所述受热载体以在所述催化剂的作用下发生化学反应。According to the microwave heating system described in the first aspect of the present disclosure, the heated carrier includes a catalyst, and the container body is provided with a reactant inlet and a product outlet to allow the fluid reactant introduced through the reactant inlet to flow through the heated carrier to undergo a chemical reaction under the action of the catalyst.

根据本公开第一方面所述的微波加热系统,其中所述加热腔体在所述介质辐射器的长度延伸方向的长度为所述辐射段延伸进入所述加热腔体的延伸长度的2-4倍。According to the microwave heating system of the first aspect of the present disclosure, the length of the heating cavity in the length extension direction of the dielectric radiator is 2-4 times the extension length of the radiation section extending into the heating cavity.

根据本公开第一方面所述的微波加热系统,其中所述微波加热装置包括微波发生单元、穿过所述容器主体的侧壁伸入至所述子加热腔内的所述介质辐射器以及用于将所述微波发生单元产生的微波引导至该介质辐射器的波导。According to the microwave heating system described in the first aspect of the present disclosure, the microwave heating device includes a microwave generating unit, the dielectric radiator extending into the sub-heating cavity through the side wall of the container body, and a waveguide for guiding the microwaves generated by the microwave generating unit to the dielectric radiator.

根据本公开第一方面所述的微波加热系统,其中所述介质辐射器还包括在所述波导内延伸的耦合段以及在所述耦合段和所述辐射段之间延伸的传输段,所述耦合段具有渐缩的多面削尖结构。According to the microwave heating system of the first aspect of the present disclosure, the dielectric radiator further includes a coupling section extending in the waveguide and a transmission section extending between the coupling section and the radiation section, the coupling section having a tapered multi-faceted pointed structure.

根据本公开第一方面所述的微波加热系统,其中所述耦合段的长度为0.75-1倍的微波波长;所述辐射段的长度为0.8倍以上的微波波长。According to the microwave heating system described in the first aspect of the present disclosure, the length of the coupling section is 0.75-1 times the microwave wavelength; the length of the radiation section is more than 0.8 times the microwave wavelength.

根据本公开第一方面所述的微波加热系统,其中所述介质辐射器的材料的介电常数大于9,介质损耗<0.02。According to the microwave heating system of the first aspect of the present disclosure, the dielectric constant of the material of the dielectric radiator is greater than 9, and the dielectric loss is less than 0.02.

本公开的第二方面涉及一种微波加热装置,用于本公开第一方面中所述的微波加热系统中,所述微波加热装置包括微波发生单元、用于将所述微波发生单元产生的微波辐射至受热载体的介质辐射器和用于将所述微波发生单元产生的所述微波引导至所述介质辐射器的波导,所述介质辐射器包括具有位于所述加热腔体内的辐射段,所述辐射段具有渐缩的多面结构,所述多面结构包括面向所述受热载体并向所述受热载体均匀发射微波的辐射表面。所述介质辐射器的材料为陶瓷或聚苯乙烯。A second aspect of the present disclosure relates to a microwave heating device for use in the microwave heating system described in the first aspect of the present disclosure. The microwave heating device comprises a microwave generating unit, a dielectric radiator for radiating microwaves generated by the microwave generating unit to a heated carrier, and a waveguide for guiding the microwaves generated by the microwave generating unit to the dielectric radiator. The dielectric radiator comprises a radiating section located within the heating cavity, the radiating section having a tapered multi-faceted structure including a radiating surface facing the heated carrier and uniformly emitting microwaves thereto. The dielectric radiator is made of ceramic or polystyrene.

本公开的第三方面涉及一种在本公开第一方面所述的微波加热系统上执行的废气处理方法,所述微波加热系统包括控制器以及设置在受热载体上或加热腔体内的温度传感器,用于实时监测各受热载体的温度,所述方法包括:A third aspect of the present disclosure relates to an exhaust gas treatment method performed on the microwave heating system described in the first aspect of the present disclosure, wherein the microwave heating system includes a controller and a temperature sensor disposed on a heated carrier or in a heating cavity for real-time monitoring of the temperature of each heated carrier. The method includes:

从所述温度传感器接收测量到的温度;receiving a measured temperature from the temperature sensor;

将测量到的温度和目标温度进行比较;comparing the measured temperature to the target temperature;

基于测量到的温度和目标温度之间的差值来输出控制信号给微波加热装置中的微波发生单元,从而控制微波发生单元生成微波对加热腔体内的受热载体进行加热;以及outputting a control signal to a microwave generating unit in the microwave heating device based on a difference between the measured temperature and the target temperature, thereby controlling the microwave generating unit to generate microwaves to heat a heated carrier in the heating cavity; and

响应于测量到的温度大于或等于目标温度,打开反应物入口以注入含挥发性有机物的废气。In response to the measured temperature being greater than or equal to the target temperature, the reactant inlet is opened to inject the exhaust gas containing volatile organic compounds.

本公开的第四方面涉及一种控制器,包括:A fourth aspect of the present disclosure relates to a controller, comprising:

处理器,和processor, and

计算机可读存储介质,包括存储在其上的计算机程序,所述计算机程序包括可执行指令,所述可执行指令在由所述处理器执行时实现根据本公开的第三方面所述的方法。A computer-readable storage medium comprises a computer program stored thereon, wherein the computer program comprises executable instructions, and when the executable instructions are executed by the processor, the method according to the third aspect of the present disclosure is implemented.

本公开的第五方面涉及计算机可读存储介质,包括存储在其上的计算机程序,所述计算机程序包括可执行指令,所述可执行指令在由所述处理器执行时实现根据本公开的第三方面所述的方法。A fifth aspect of the present disclosure relates to a computer-readable storage medium, comprising a computer program stored thereon, the computer program comprising executable instructions, which, when executed by the processor, implement the method according to the third aspect of the present disclosure.

本公开的第六方面涉及一种计算机程序产品,包括可执行指令,所述可执行指令在由处理器执行时实现根据本公开的第三方面涉及所述的方法。A sixth aspect of the present disclosure relates to a computer program product, comprising executable instructions, which, when executed by a processor, implement the method according to the third aspect of the present disclosure.

通过上述技术方案,本公开的微波加热设备和废气处理系统能够利用微波实现更大尺度的床层均匀加热,微波在加热腔体(也称为反应腔体或自由空间)内分布均匀性更佳,床层加热均匀性更高。Through the above technical solution, the microwave heating equipment and exhaust gas treatment system disclosed in the present invention can use microwaves to achieve uniform heating of the bed on a larger scale, the microwaves are distributed more evenly in the heating cavity (also called the reaction cavity or free space), and the bed heating is more uniform.

在本公开所述的微波加热设备和微波加热装置中,介质辐射器本身无电流、不发热,与易燃易爆气体接触本质安全。In the microwave heating equipment and microwave heating device disclosed in the present invention, the dielectric radiator itself does not generate current and does not generate heat, and is inherently safe when in contact with flammable and explosive gases.

总之,利用本公开所述的微波加热装置加热大尺度催化剂床层,具有本质安全、微波能量利用率高,微波均匀辐射、床层均匀加热,同时成本较低等有益效果。In summary, the use of the microwave heating device described in the present disclosure to heat a large-scale catalyst bed has the beneficial effects of being inherently safe, having high microwave energy utilization, uniform microwave radiation, uniform heating of the bed, and having relatively low cost.

与现有技术相比,本公开的技术方案在大尺度加热上更有优势,能够实现更大尺度的催化剂床层加热,便于实现大型微波反应装置;而且,加热更加安全,反应器内最大电场强度远小于潮湿空气中的电场击穿强度,辐射器表面无电流;再者,本公开的技术方案可用于易燃易爆场所,尤其是处理易燃易爆气体时,反应器内外均实现本质安全设计;此外,通过增加介质辐射器和屏蔽元件,能够使得微波在催化剂床层的整体加热更均匀,避免出现局部高温,产生安全问题或者降低催化剂使用寿命。Compared with the existing technology, the technical solution disclosed in the present invention has more advantages in large-scale heating, and can achieve larger-scale heating of catalyst beds, which is convenient for realizing large-scale microwave reaction devices; moreover, heating is safer, the maximum electric field intensity in the reactor is much smaller than the electric field breakdown intensity in humid air, and there is no current on the radiator surface; furthermore, the technical solution disclosed in the present invention can be used in flammable and explosive places, especially when processing flammable and explosive gases, and the reactor can be intrinsically safe both inside and outside. In addition, by adding dielectric radiators and shielding elements, the overall heating of the catalyst bed by microwaves can be made more uniform, avoiding local high temperatures, causing safety problems or reducing the service life of the catalyst.

本公开所述的技术方案可以应用于微波加热大尺度固体,例如加热吸波催化剂或加热吸波吸附剂等吸波固体,实现吸波固体的快速加热;加热吸波催化剂用于参与气体或液体的化学反应,实现催化剂的高效快速加热;加热吸波吸附剂,用于吸附剂的热解吸的环保治理领域。The technical solution disclosed in the present invention can be applied to microwave heating of large-scale solids, such as heating of microwave-absorbing solids such as microwave-absorbing catalysts or microwave-absorbing adsorbents, to achieve rapid heating of microwave-absorbing solids; heating of microwave-absorbing catalysts to participate in chemical reactions of gases or liquids to achieve efficient and rapid heating of catalysts; heating of microwave-absorbing adsorbents to be used in the field of environmental protection management of thermal desorption of adsorbents.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

附图示出了本公开的各方面的各种示例,并且它们与说明书一起用于解释本公开的原理。本技术领域内的技术人员明白,附图所示的特定实施例仅是示例性的,并且它们无意限制本公开的范围。应该认识到,在某些示例中的一个元件也可以被设计为多个元件,或者多个元件也可以被设计为一个元件。在某些示例中,被示出为另一个元件的内部部件的元件也可以被实现为该另一个元件的外部部件,反之亦然。在附图中:The accompanying drawings illustrate various examples of various aspects of the present disclosure, and together with the description, they serve to explain the principles of the present disclosure. Those skilled in the art will appreciate that the particular embodiments shown in the drawings are exemplary only and are not intended to limit the scope of the present disclosure. It should be appreciated that in some examples, one element may be designed as multiple elements, or multiple elements may be designed as one element. In some examples, an element shown as an internal component of another element may also be implemented as an external component of the other element, and vice versa. In the drawings:

图1是现有技术中采用微波技术进行催化氧化的一个示例;FIG1 is an example of catalytic oxidation using microwave technology in the prior art;

图2是根据本公开一种优选实施方式的微波加热系统的剖视结构示意图;FIG2 is a schematic cross-sectional view of a microwave heating system according to a preferred embodiment of the present disclosure;

图3是图2中微波加热系统使用的微波加热装置的介质辐射器的主视图;FIG3 is a front view of a dielectric radiator of a microwave heating device used in the microwave heating system of FIG2 ;

图4是图3中介质辐射器的不同投影视图;FIG4 is a different projection view of the dielectric radiator in FIG3;

图5是本公开所述的介质辐射器的一种变型实施方式的主视图;FIG5 is a front view of a variant embodiment of the dielectric radiator according to the present disclosure;

图6是根据本公开另一种优选实施方式的微波加热系统的结构示意图;FIG6 is a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure;

图7示出图6中微波加热系统的多个微波加热装置的布置方案的剖视图;FIG7 is a cross-sectional view showing an arrangement of multiple microwave heating devices of the microwave heating system in FIG6 ;

图8示出图6中微波加热系统的多个微波加热装置的布置方案的俯视图;FIG8 shows a top view of an arrangement of multiple microwave heating devices of the microwave heating system in FIG6 ;

图9是根据本公开另一种优选实施方式的微波加热系统的结构示意图;FIG9 is a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure;

图10示出图9中微波加热系统的多个微波加热装置的布置方案的剖视图;FIG10 is a cross-sectional view showing an arrangement of multiple microwave heating devices of the microwave heating system in FIG9 ;

图11示出图9中微波加热系统的多个微波加热装置的布置方案的俯视图;FIG11 shows a top view of an arrangement of multiple microwave heating devices of the microwave heating system in FIG9 ;

图12是根据本公开另一种优选实施方式的微波加热系统的结构示意图;FIG12 is a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure;

图13是根据本公开另一种优选实施方式的微波加热系统的结构示意图;FIG13 is a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure;

图14是采用没有介质辐射器的微波加热装置实施加热的表面温度分布图;FIG14 is a surface temperature distribution diagram of heating using a microwave heating device without a dielectric radiator;

图15是采用多个介质辐射器但无第一微波屏蔽元件的微波加热系统实施加热的表面温度分布图;FIG15 is a diagram showing a surface temperature distribution of a microwave heating system using multiple dielectric radiators but without a first microwave shielding element;

图16是采用多个介质辐射器且设置有第一微波屏蔽元件的微波加热系统实施加热的表面温度分布图;FIG16 is a diagram showing a surface temperature distribution of a microwave heating system using a plurality of dielectric radiators and provided with a first microwave shielding element;

图17是采用多个介质辐射器且设置有第一微波屏蔽元件和第二微波屏蔽元件的微波加热系统实施加热的表面温度分布图;17 is a diagram showing a surface temperature distribution of a microwave heating system using a plurality of dielectric radiators and provided with a first microwave shielding element and a second microwave shielding element;

图18是对应相邻加热腔体的微波加热装置被安装于相同侧壁的微波加热系统实施加热的温度分布图;FIG18 is a temperature distribution diagram corresponding to heating performed by a microwave heating system in which microwave heating devices of adjacent heating cavities are installed on the same side wall;

图19是对应相邻加热腔体的微波加热装置被安装于相邻侧壁的微波加热系统实施加热的温度分布图;FIG19 is a temperature distribution diagram corresponding to the microwave heating system in which microwave heating devices of adjacent heating cavities are installed on adjacent side walls;

图20示出了实施例6的电场分布云图;FIG20 shows the electric field distribution cloud diagram of Example 6;

图21示出了实施例7的电场分布云图;FIG21 shows the electric field distribution cloud diagram of Example 7;

图22示出了实施例8的电场分布云图;FIG22 shows the electric field distribution cloud diagram of Example 8;

图23示出了实施例9的电场分布云图;FIG23 shows the electric field distribution cloud diagram of Example 9;

图24示出了实施例10的电场分布云图;FIG24 shows a cloud diagram of the electric field distribution of Example 10;

图25示出了实施例11的电场分布云图;FIG25 shows a cloud diagram of the electric field distribution of Example 11;

图26示出了实施例12的电场分布云图;FIG26 shows a cloud diagram of the electric field distribution of Example 12;

图27示出了实施例13的电场分布云图;FIG27 shows a cloud diagram of the electric field distribution of Example 13;

图28示出了使用本公开的微波加热系统来处理废气的方法;以及FIG28 illustrates a method for treating exhaust gas using the microwave heating system of the present disclosure; and

图29示出了根据本公开实施例的一种控制器。FIG. 29 shows a controller according to an embodiment of the present disclosure.

附图标记说明
1-容器主体;11-加热腔体;12-反应物入口;13-产物出口;14-第一
微波屏蔽元件;15-第二微波屏蔽元件;
2-受热载体;
3-微波加热装置;31-微波发生单元;32-波导;32a-销钉;33-介质
辐射器;331-辐射段;331a-辐射表面;331b-侧表面;34-防爆激励腔;332-传输段;332a-凸缘部;333-耦合段;35-介质密封窗。
Description of Reference Numerals
1-container body; 11-heating cavity; 12-reactant inlet; 13-product outlet; 14-first microwave shielding element; 15-second microwave shielding element;
2-heating carrier;
3-microwave heating device; 31-microwave generating unit; 32-waveguide; 32a-pin; 33-dielectric radiator; 331-radiation section; 331a-radiation surface; 331b-side surface; 34-explosion-proof excitation cavity; 332-transmission section; 332a-flange portion; 333-coupling section; 35-dielectric sealing window.

具体实施方式DETAILED DESCRIPTION

在本申请的描述中,术语“第一”、“第二”仅用于描述目的,而不能理解为指示相对重要性,或者隐含指明所指示的技术特征的数量。由此,除非另有说明,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征;“多个”的含义是两个或两个以上。术语“包括”及其任何变形,意为不排他的包含,可能存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate relative importance or implicitly specify the quantity of the technical features indicated. Therefore, unless otherwise specified, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features; "plurality" means two or more. The term "comprising" and any variations thereof are intended to be non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components, and/or combinations thereof may be present or added.

另外,“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系的术语,是基于附图所示的方位或相对位置关系描述的,仅是为了便于描述本申请的简化描述,而不是指示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In addition, terms indicating orientation or positional relationships such as “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” and “outside” are described based on the orientation or relative positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing this application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

此外,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,或是两个元件内部的连通。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。Furthermore, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

以下结合附图对本公开实施例的具体实施方式进行详细说明。应当理解的是,此处所描述的具体实施方式仅用于说明和解释本公开实施例,并不用于限制本公开。而且,为简洁起见,下文中仅详细介绍了与本申请的实施例紧密相关的部件。The following describes in detail the specific implementations of the embodiments of the present disclosure in conjunction with the accompanying drawings. It should be understood that the specific implementations described herein are only intended to illustrate and explain the embodiments of the present disclosure and are not intended to limit the present disclosure. Moreover, for the sake of brevity, only the components closely related to the embodiments of the present application are described in detail below.

参照图2所示,其示出了根据本公开一实施方式的微波加热系统。该微波加热系统至少包括容器主体1,所述容器主体1包括至少一个加热腔体11。在加热腔体11中设置有受热载体2和安装于该加热腔体11的侧壁上的微波加热装置3。受热载体2能够吸收微波而变热升温,受热载体2平铺排列形成层,可以称为受热载体层。如图2中所示,微波加热装置3安装在加热腔体11的侧壁上从而向加热腔体11内发射微波。Referring to FIG. 2 , a microwave heating system according to an embodiment of the present disclosure is shown. The microwave heating system includes at least a container body 1, which includes at least one heating cavity 11. A heating carrier 2 and a microwave heating device 3 mounted on the side wall of the heating cavity 11 are provided in the heating cavity 11. The heating carrier 2 can absorb microwaves and heat up. The heating carrier 2 is arranged flat to form a layer, which can be called a heating carrier layer. As shown in FIG. 2 , the microwave heating device 3 is mounted on the side wall of the heating cavity 11 to emit microwaves into the heating cavity 11.

在用于废气(例如VOCs)处理的情形下,所述加热腔体11内的受热载体2中设有催化剂,受热载体吸收微波而升温后能够加热该催化剂,用于使得流经该催化剂的废气发生分解反应。或者,受热载体2本身为例如吸波催化剂,此时受热载体层成为吸波催化剂床层。When used for treating exhaust gases (e.g., VOCs), a catalyst is disposed within the heated carrier 2 within the heating chamber 11. The heated carrier absorbs microwaves, raising its temperature and heating the catalyst, thereby causing a decomposition reaction in the exhaust gases flowing through the catalyst. Alternatively, the heated carrier 2 itself may be a microwave-absorbing catalyst, in which case the heated carrier layer becomes a microwave-absorbing catalyst bed.

继续如图2中所示,微波加热装置3包括微波发生单元31、穿过容器主体1或加热腔体11的侧壁伸入至加热腔体11内的介质辐射器33以及用于将微波发生单元31产生的微波引导至该介质辐射器33的波导32。2 , the microwave heating device 3 includes a microwave generating unit 31 , a dielectric radiator 33 extending through the container body 1 or the side wall of the heating cavity 11 into the heating cavity 11 , and a waveguide 32 for guiding the microwaves generated by the microwave generating unit 31 to the dielectric radiator 33 .

介质辐射器33是介质棒天线,该介质棒天线是由低损耗高频介质材料制成的棒状天线,属于典型的行波天线,介质材料为电介质材料或绝缘材料(例如聚苯乙烯、陶瓷材料)。介质棒天线用于引导微波传播,相比于金属波导,介质边界会有相当可观的功率溢出辐射到自由空间(如加热腔体11)中。Dielectric radiator 33 is a dielectric rod antenna, a typical traveling wave antenna made of a low-loss, high-frequency dielectric material. The dielectric material is either a dielectric or insulating material (e.g., polystyrene or ceramic). Dielectric rod antennas guide microwave propagation. Compared to metal waveguides, considerable power overflows from dielectric boundaries into free space (e.g., heating cavity 11).

介质辐射器33中用于向加热腔体内的受热载体发射微波的部分称为辐射段。发明人发现,通过调整介质辐射器33的辐射段的形状,能够调整介质棒天线的阻抗,从而实现介质棒天线与空气阻抗的良好匹配,提高辐射效率。而且,通过调整介质辐射器33的辐射段的形状,也能够使辐射段发射的微波在受热载体上分布得更加均匀,从而实现对受热载体层的均匀加热。具体地,在本公开中,介质辐射器33的辐射段采用多面形状,例如逐渐变细的多面形状或多面渐缩结构,例如棱锥形状或截头棱锥形状,优选为四棱锥或截头四棱锥形状,通过该多面结构,可以实现介质棒天线与空气阻抗的良好匹配,减少表面波反射,提高辐射效率,使得大部分微波能够辐射或发射到加热腔体11中,而且通过所述多面结构,能够调整微波辐射方向,使微波被均匀地辐射到受热载体2上,使得受热载体2以及整个受热载体层均匀加热。关于介质辐射器33的多面结构将在下文参考图3-5进一步详细描述。The portion of the dielectric radiator 33 used to emit microwaves toward the heated carrier within the heating cavity is called the radiation section. The inventors have discovered that by adjusting the shape of the radiation section of the dielectric radiator 33, the impedance of the dielectric rod antenna can be adjusted, thereby achieving a good match between the dielectric rod antenna and the air impedance and improving radiation efficiency. Moreover, by adjusting the shape of the radiation section of the dielectric radiator 33, the microwaves emitted by the radiation section can be distributed more evenly on the heated carrier, thereby achieving uniform heating of the heated carrier layer. Specifically, in the present disclosure, the radiation section of the dielectric radiator 33 adopts a multi-faceted shape, such as a gradually tapering multi-faceted shape or a multi-faceted tapered structure, such as a pyramid shape or a truncated pyramid shape, preferably a quadrangular pyramid shape or a truncated quadrangular pyramid shape. This multi-faceted structure can achieve a good match between the dielectric rod antenna and the air impedance, reduce surface wave reflections, improve radiation efficiency, and allow most microwaves to be radiated or emitted into the heating cavity 11. Furthermore, the multi-faceted structure can adjust the microwave radiation direction so that the microwaves are evenly radiated onto the heated carrier 2, resulting in uniform heating of the heated carrier 2 and the entire heated carrier layer. The multi-faceted structure of the dielectric radiator 33 will be described in further detail below with reference to FIGS. 3-5 .

继续参见图2,可以包括2个或更多个受热载体层,分别位于介质辐射器33的周围,例如上方和下方。如此构造使得介质辐射器33位于相对的2个受热载体层之间。为了使得受热载体层的各个部分均匀地接受微波辐射,可以在加热腔体11的两侧(图示左右两侧)对称安装微波加热装置3,使得在两侧设置的微波加热装置3中的介质辐射器33彼此相对,并且相对的介质辐射器33在长度延伸方向位于同一直线上。Continuing with FIG2 , two or more heating carrier layers may be included, each located around the dielectric radiator 33, for example, above and below the dielectric radiator 33. The dielectric radiator 33 is configured so as to be located between two opposing heating carrier layers. In order to ensure that each portion of the heating carrier layer receives microwave radiation uniformly, the microwave heating device 3 may be symmetrically installed on both sides of the heating cavity 11 (left and right sides in the figure), so that the dielectric radiators 33 in the microwave heating devices 3 arranged on both sides are opposite to each other, and the opposing dielectric radiators 33 are located on the same straight line in the longitudinal extension direction.

接下来参见图3-5,其示出了介质辐射器33的具体多面结构。如图所示,介质辐射器33可以包括耦合段333、传输段332和辐射段331,其中,所述耦合段333和所述辐射段331分别设置于所述传输段332相对的两侧,且所述耦合段333和所述辐射段331均可以形成为截头四棱锥形状。3-5 , which illustrate the multi-faceted structure of dielectric radiator 33. As shown, dielectric radiator 33 may include a coupling section 333, a transmission section 332, and a radiating section 331. The coupling section 333 and the radiating section 331 are disposed on opposite sides of the transmission section 332, and each may be formed in the shape of a truncated quadrangular pyramid.

所述介质辐射器33整体上形成为两端细中间粗的结构。所述耦合段333和所述辐射段331的截头四棱锥形状例如包括四个侧面,该四个侧面均为梯形,截头四棱锥形状的截头部形成端面,所述端面为四边形,优选为长方形或正方形。参见图4中所示,截头四棱锥形状的四个侧面分别为上下相对的2个侧面331a和前后相对的2个侧面331b。在优选情况下,所述耦合段333和所述辐射段331的上下两个侧面331a的宽度(或面积)大于前后两个侧面331b的宽度(或面积),上下两个侧面331a与受热载体层相对,或者说,辐射段331的截头四棱锥形状中面积大的侧面与受热载体层相对,相应地,与受热载体层相对的侧面可以称为辐射表面。总之,结合图2所示,辐射段331位于加热腔体11中,并形成有分别朝向相应的受热载体层的一对辐射表面331a和与该辐射表面331a相邻的一对侧表面331b,辐射表面331a宽度(或面积)可以大于侧表面331b的宽度(或面积)。沿朝向加热腔体11内的方向,相对设置的2个介质辐射器33的辐射表面331a彼此靠近地延伸,侧表面331b也彼此靠近地延伸,从而使得辐射段331具有渐缩的多面结构。通过这种设置,微波发生单元31产生的微波能够由辐射段331均匀地辐射至加热腔体11内,尤其是由辐射表面331a高效、均匀地辐射至其朝向的受热载体层,从而能够在大尺度范围内均匀加热受热载体层。The dielectric radiator 33 is generally formed into a structure that is thin at both ends and thick in the middle. The truncated quadrangular pyramid shape of the coupling section 333 and the radiating section 331, for example, includes four side surfaces, each of which is trapezoidal. The truncated portion of the truncated quadrangular pyramid forms end faces, each of which is a quadrilateral, preferably a rectangle or square. As shown in FIG4 , the four side surfaces of the truncated quadrangular pyramid are two upper and lower opposing side surfaces 331a and two front and rear opposing side surfaces 331b. Preferably, the width (or area) of the upper and lower side surfaces 331a of the coupling section 333 and the radiating section 331 is greater than the width (or area) of the front and rear opposing side surfaces 331b. The upper and lower side surfaces 331a face the heat receiving carrier layer. In other words, the side of the truncated quadrangular pyramid with the larger area faces the heat receiving carrier layer. Accordingly, the side facing the heat receiving carrier layer can be referred to as the radiation surface. In summary, as shown in FIG2 , the radiation section 331 is located in the heating cavity 11 and is formed with a pair of radiation surfaces 331a facing the corresponding heat carrier layer and a pair of side surfaces 331b adjacent to the radiation surfaces 331a. The width (or area) of the radiation surface 331a can be greater than the width (or area) of the side surface 331b. In the direction toward the interior of the heating cavity 11, the radiation surfaces 331a of the two oppositely arranged dielectric radiators 33 extend close to each other, and the side surfaces 331b also extend close to each other, so that the radiation section 331 has a tapered multi-faceted structure. Through this arrangement, the microwaves generated by the microwave generating unit 31 can be uniformly radiated into the heating cavity 11 by the radiation section 331, especially by the radiation surface 331a to the heat carrier layer it faces efficiently and uniformly, thereby being able to uniformly heat the heat carrier layer over a large scale range.

在所述介质辐射器33中,所述耦合段333的长度优选为0.75-1倍的微波波长;所述辐射段331的长度优选为0.8倍以上的微波波长,更优选为0.8-2.5倍的微波波长。所述微波可以为例如2450MHz或915MHz微波。当所述微波为2450MHz微波时,该微波波长约为122.4mm。In the dielectric radiator 33, the length of the coupling section 333 is preferably 0.75 to 1 times the microwave wavelength; the length of the radiating section 331 is preferably at least 0.8 times the microwave wavelength, more preferably 0.8 to 2.5 times the microwave wavelength. The microwave can be, for example, a 2450 MHz or 915 MHz microwave. When the microwave is a 2450 MHz microwave, the wavelength is approximately 122.4 mm.

在所述介质辐射器33中,所述耦合段333的多面渐缩角度(即介质辐射器长度方向的中心线与侧表面之间的角度)优选为5-85°,所述辐射段331的多面渐缩角度优选为5-85°。In the dielectric radiator 33, the multi-faceted tapering angle of the coupling section 333 (i.e., the angle between the center line and the side surface in the length direction of the dielectric radiator) is preferably 5-85°, and the multi-faceted tapering angle of the radiating section 331 is preferably 5-85°.

在所述微波加热系统中,优选地,所述加热腔体11在沿所述介质辐射器33的长度延伸方向上的尺寸为所述辐射段331伸入至加热腔体11内的长度的2-4倍。In the microwave heating system, preferably, the size of the heating cavity 11 along the length extension direction of the dielectric radiator 33 is 2-4 times the length of the radiation section 331 extending into the heating cavity 11 .

在本公开中,优选地,所述介质辐射器的材料的介电常数大于9,介质损耗<0.02。进一步优选地,所述介质辐射器的材料为陶瓷或聚苯乙烯。In the present disclosure, preferably, the dielectric constant of the material of the dielectric radiator is greater than 9, and the dielectric loss is less than 0.02. Further preferably, the material of the dielectric radiator is ceramic or polystyrene.

如图5所示,所述介质辐射器33的传输段332可以具有凸缘部332a。在安装至容器主体1或加热腔体11的状态下,传输段332穿过容器主体1或加热腔体11的侧壁,并使得凸缘部332与容器主体1或加热腔体11的壁面(外壁面或内壁面)贴合,且该凸缘部可以通过波导法兰与加热腔体11的侧壁压紧固定。该贴合紧固结构用于防止容器主体1或加热腔体11中的VOCs泄露进入微波加热装置3中或进入外部环境中引起爆炸或污染。As shown in FIG5 , the transmission section 332 of the dielectric radiator 33 may have a flange portion 332a. When mounted to the container body 1 or the heating cavity 11, the transmission section 332 passes through the side wall of the container body 1 or the heating cavity 11, and the flange portion 332 is in contact with the wall surface (outer wall surface or inner wall surface) of the container body 1 or the heating cavity 11, and the flange portion can be pressed and fixed to the side wall of the heating cavity 11 via a waveguide flange. This contact and fastening structure is used to prevent VOCs in the container body 1 or the heating cavity 11 from leaking into the microwave heating device 3 or into the external environment, causing explosion or pollution.

参照图2,本公开所述的微波加热装置3可包括防爆激励腔34,微波发生单元31可以是设置于该防爆激励腔34内的磁控管,所述防爆激励腔34与所述波导32的一端连接,波导32的另一端连接介质辐射器33。所述介质辐射器33的耦合段333伸入所述波导32内。2 , the microwave heating device 3 described herein may include an explosion-proof excitation cavity 34. The microwave generating unit 31 may be a magnetron disposed within the explosion-proof excitation cavity 34. The explosion-proof excitation cavity 34 is connected to one end of the waveguide 32, and the other end of the waveguide 32 is connected to a dielectric radiator 33. The coupling section 333 of the dielectric radiator 33 extends into the waveguide 32.

在一种优选实施方式中,所述防爆激励腔34与所述波导32之间通过介质密封窗35物理隔离,且通过所述磁控管产生的微波能够透过所述介质密封窗35进入所述波导32。在具体的实施方式中,所述介质密封窗35为密封石英窗。介质密封窗35用于防止容器主体1/和或加热腔体11中的VOCs泄露进入防爆激励腔34中而引起爆炸或污染。In a preferred embodiment, the explosion-proof excitation cavity 34 is physically isolated from the waveguide 32 by a dielectric sealing window 35, and the microwaves generated by the magnetron can enter the waveguide 32 through the dielectric sealing window 35. In a specific embodiment, the dielectric sealing window 35 is a sealed quartz window. The dielectric sealing window 35 is used to prevent VOCs in the container body 1 and/or the heating cavity 11 from leaking into the explosion-proof excitation cavity 34 and causing explosion or contamination.

在一种优选实施方式中,所述波导还可以设置有销钉32a,可以通过该销钉32a而调节微波反射功率,从而进一步降低微波的反射功率。In a preferred embodiment, the waveguide may be further provided with a pin 32a, by which the microwave reflection power can be adjusted, thereby further reducing the microwave reflection power.

按照本公开所述的微波加热装置,其中通过调整微波发生单元31的微波电源来调整微波输出功率大小,从而调整受热载体2(如吸波催化剂)构成的受热载体层的温度,通过介质辐射器能够实现大尺寸催化剂床层的整体加热、均匀加热和安全加热。According to the microwave heating device described in the present disclosure, the microwave output power is adjusted by adjusting the microwave power supply of the microwave generating unit 31, thereby adjusting the temperature of the heated carrier layer composed of the heated carrier 2 (such as an absorbing catalyst), and the overall heating, uniform heating and safe heating of the large-sized catalyst bed can be achieved through the dielectric radiator.

按照本公开所述的微波加热装置,介质辐射器33的耦合段333位于波导32内,辐射段331位于加热腔体11内。加热腔体11上下两侧为微波吸收和导热性能俱佳的受热载体2(如催化剂床层)。微波发生单元31产生微波,通过波导32传输,微波被介质辐射器33的耦合段333耦合微波能量,传输段332进一步传输微波,辐射段331定向均匀辐射微波,最终被受热载体2吸收微波能量,达到受热载体被加热的目的。According to the microwave heating device disclosed herein, the coupling section 333 of the dielectric radiator 33 is located within the waveguide 32, and the radiating section 331 is located within the heating cavity 11. The upper and lower sides of the heating cavity 11 are provided with a heating medium 2 (e.g., a catalyst bed) with excellent microwave absorption and thermal conductivity. The microwave generating unit 31 generates microwaves, which are transmitted through the waveguide 32. The microwaves are coupled to the coupling section 333 of the dielectric radiator 33, further transmitted by the transmission section 332, and uniformly radiated by the radiating section 331. The microwaves are ultimately absorbed by the heating medium 2, achieving the purpose of heating the heating medium.

在本公开的微波加热系统中,在受热载体2上或加热腔体11内设置温度传感器(未示出)来实时监测各受热载体或受热载体层的温度,设置于微波加热系统中的控制器(未示出)被配置为从温度传感器接收测量到的温度,将测量到的温度和目标温度进行比较,并基于测量到的温度和目标温度之间的差值来输出控制信号给微波加热装置中的微波发生单元31,从而能够控制微波发生单元31输出功率的大小。In the microwave heating system of the present disclosure, a temperature sensor (not shown) is provided on the heated carrier 2 or in the heating cavity 11 to monitor the temperature of each heated carrier or heated carrier layer in real time. A controller (not shown) provided in the microwave heating system is configured to receive the measured temperature from the temperature sensor, compare the measured temperature with the target temperature, and output a control signal to the microwave generating unit 31 in the microwave heating device based on the difference between the measured temperature and the target temperature, thereby being able to control the output power of the microwave generating unit 31.

在测量到温度达到目标温度后,打开反应物入口以注入反应介质(如VOCs)通过受热载体2,并在受热载体2的辅助作用下发生高效分解反应。After the temperature reaches the target temperature, the reactant inlet is opened to inject the reaction medium (such as VOCs) through the heated carrier 2, and an efficient decomposition reaction occurs under the assistance of the heated carrier 2.

图6-13示出了不同优选实施方式的微波加热系统,其中,多个微波加热装置以不同方式布置于加热腔体11的侧壁上。其中,所述微波加热装置中的介质辐射器33的辐射段331伸入所述加热腔体11内。6-13 show microwave heating systems according to different preferred embodiments, wherein a plurality of microwave heating devices are arranged in different ways on the sidewalls of the heating cavity 11 , wherein the radiating sections 331 of the dielectric radiators 33 in the microwave heating devices extend into the heating cavity 11 .

参见图6-8,其示出了微波加热系统的一种示意结构。其中图6示出微波加热系统的总体示意图。如图6的右半部分所示,容器主体1内设置有多个加热腔体11,它们上下堆叠(可以称为沿第一方向堆叠)形成微波加热系统,每个加热腔体11内分别布置有彼此相对的上下(可以称为沿第一方向布置)两个受热载体层,在该上下两个受热载体层之间构成的空间的相对两侧分别对称地成对设置所述微波加热装置3。参见图6的左半部分所示,每对微波加热装置3的介质辐射器33沿其长度延伸方向位于同一直线上。参见图7,其示出图6中微波加热系统的多个微波加热装置的布置方案的剖视图,可以看出,相当于将图2中的多个加热腔体11上下叠加在一起形成的加热系统。多层加热腔体11之间(或相邻的受热载体层之间)可以可选地通过第一微波屏蔽元件14(例如屏蔽钢网)隔开。通过第一微波屏蔽元件14,可以独立地控制对每个加热腔体11的加热,避免上下邻近加热腔体11之间相互影响,而且第一微波屏蔽元件14并不会阻隔VOCs或其他相关气体的通过,例如第一微波屏蔽元件14为带孔的不锈钢钢板或屏蔽钢网。图8示出图6中微波加热系统的多个微波加热装置的布置方案的俯视图。从图8中可以看出,容器主体1在水平方向将具有矩形横截面,在优选实施例中,在一个加热腔体中,仅在一个相对方向(例如左右方向)上在侧壁上成对地布置微波加热装置3或介质辐射器33,而不在其他方向(例如前后方向)布置微波加热装置3或介质辐射器33。这样布置结构的目的是为了实现电场强度均匀,防止多个方向布置的微波加热装置3发射的微波在加热腔体的中心叠加聚集,导致的强电场可能会击穿空气,对于处理易燃易爆VOCs存在一定的安全隐患。Referring to Figures 6-8, a schematic structure of a microwave heating system is shown. Figure 6 shows an overall schematic diagram of the microwave heating system. As shown in the right half of Figure 6, a plurality of heating cavities 11 are provided in the container body 1. These are stacked up and down (can be referred to as stacked along a first direction) to form a microwave heating system. Two upper and lower heating carrier layers (can be referred to as arranged along a first direction) facing each other are arranged in each heating cavity 11. The microwave heating devices 3 are symmetrically arranged in pairs on opposite sides of the space formed between the upper and lower heating carrier layers. Referring to the left half of Figure 6, the dielectric radiators 33 of each pair of microwave heating devices 3 are located on the same straight line along their length extension direction. Referring to Figure 7, a cross-sectional view of the arrangement of the plurality of microwave heating devices in the microwave heating system of Figure 6 is shown. It can be seen that the arrangement is equivalent to a heating system formed by stacking the plurality of heating cavities 11 in Figure 2 up and down. The multiple layers of heating cavities 11 (or adjacent layers of heating carriers) can optionally be separated by a first microwave shielding element 14 (e.g., a shielding steel mesh). The first microwave shielding element 14 allows for independent control of the heating of each heating cavity 11, preventing interaction between adjacent heating cavities 11. Furthermore, the first microwave shielding element 14 does not block the passage of VOCs or other related gases. For example, the first microwave shielding element 14 may be a perforated stainless steel plate or a shielded steel mesh. Figure 8 shows a top view of the arrangement of multiple microwave heating devices in the microwave heating system of Figure 6. As can be seen from Figure 8, the container body 1 has a rectangular cross-section in the horizontal direction. In a preferred embodiment, within a heating cavity, microwave heating devices 3 or dielectric radiators 33 are arranged in pairs on the sidewalls in only one relative direction (e.g., left-right), and not in other directions (e.g., front-to-back). This arrangement is intended to achieve uniform electric field strength and prevent microwaves emitted by multiple microwave heating devices 3 from overlapping and converging in the center of the heating cavity. This strong electric field could potentially break down the air, posing a safety hazard for processing flammable and explosive VOCs.

容器主体1上可以设有反应物入口12和产物出口13,以允许由反应物入口12通入的流体反应物沿第一方向流过受热载体层中的受热载体2并通过产物出口13排出。在存在多个叠加或堆叠的加热腔体11的情况下,进入所述容器主体1内的反应物流从下到上(第一方向)依次通过多个受热载体进行处理。The container body 1 may be provided with a reactant inlet 12 and a product outlet 13 to allow the fluid reactant introduced through the reactant inlet 12 to flow through the heated carrier 2 in the heated carrier layer in a first direction and be discharged through the product outlet 13. In the case of multiple superimposed or stacked heating cavities 11, the reactant flow entering the container body 1 is processed by the multiple heated carriers in sequence from bottom to top (first direction).

通过图6-8中所示的包括多个加热腔体的微波加热系统,各加热腔体11通过各自的介质辐射器33控制加热温度,通过在受热载体上或加热腔体11内设置温度传感器来实时监测各受热载体的温度,并反馈至控制器,控制器基于监测到的温度和目标温度之间的比较来输出控制信号给微波发生单元31,从而能够控制微波发生单元31输出功率的大小,进而控制受热载体的温度。Through the microwave heating system including multiple heating cavities shown in Figures 6-8, each heating cavity 11 controls the heating temperature through its own dielectric radiator 33, and the temperature of each heated carrier is monitored in real time by arranging a temperature sensor on the heated carrier or in the heating cavity 11, and the temperature is fed back to the controller. The controller outputs a control signal to the microwave generating unit 31 based on the comparison between the monitored temperature and the target temperature, thereby controlling the output power of the microwave generating unit 31 and further controlling the temperature of the heated carrier.

通过多个加热腔体11的这种上下叠加设置,客观上使得多层受热载体上下叠加,受热载体的总厚度得到分层加热,使得每个加热腔体中的受热载体层不必设置得太厚,微波能够充分穿透加热。解决了微波穿透深度不足的问题。By stacking multiple heating cavities 11 one above the other, multiple layers of heat carriers are stacked one above the other, and the total thickness of the heat carriers is heated in layers. This eliminates the need for the heat carrier layer in each heating cavity to be too thick, allowing microwaves to fully penetrate and heat the cavity, thus resolving the problem of insufficient microwave penetration depth.

而且,每个加热腔体11中的温度可以单独控制,从而能够更有效地处理VOCs的不同成分。优选地,可以在多个堆叠的加热腔体11之间实现梯度温度控制,使得在容器主体1中从下到上或从上到下实现温度梯度。Furthermore, the temperature in each heating chamber 11 can be individually controlled, thereby enabling more efficient treatment of different VOC components. Preferably, gradient temperature control can be implemented between multiple stacked heating chambers 11, so that a temperature gradient is achieved from bottom to top or from top to bottom in the container body 1.

接下来参见图9-11,其示出了根据本公开另一种实施方式的微波加热系统的结构示意图。图9-11中所示的微波加热系统在图6-8中所示的微波加热系统的基础上进行了进一步的改进。具体来说,代替图6-8中微波加热装置的设置方式,如图9-11中所示,在上下相邻的两个加热腔体11上,设置的微波加热装置或其包括的介质辐射器垂直交错。为了简化描述,以下仅说明与图6-8所示结构不同部分。Next, refer to Figures 9-11, which illustrate schematic structural diagrams of a microwave heating system according to another embodiment of the present disclosure. The microwave heating system illustrated in Figures 9-11 further improves upon the microwave heating system illustrated in Figures 6-8. Specifically, instead of the microwave heating device arrangement illustrated in Figures 6-8, as illustrated in Figures 9-11, the microwave heating devices, or the dielectric radiators included therein, are vertically staggered in two adjacent heating cavities 11. To simplify the description, only the differences from the structure illustrated in Figures 6-8 are described below.

具体来说,参照图9,其左半部分示出了微波加热系统的左视图,右半部分为微波加热系统的正视图。从图中可以看出,在上下相邻的两个加热腔体11之间,其设置的微波加热装置的介质辐射器的延伸方向是相互垂直且交错配置的,交错配置是指上下相邻的两个加热腔体11在上下不相邻的侧面上设置介质辐射器。换句话说,如果一个加热腔体的微波加热装置或其介质辐射器在加热腔体的左右两侧相对布置,则与该加热腔体上下相邻的加热腔体的微波加热装置或其介质辐射器在加热腔体的前后两侧相对布置。按照该优选的布置方式,所述受热载体可以被加热得更均匀。Specifically, referring to Figure 9, the left half shows a left view of the microwave heating system, and the right half is a front view of the microwave heating system. As can be seen from the figure, between the two adjacent heating cavities 11, the extension directions of the dielectric radiators of the microwave heating devices are perpendicular to each other and staggered. The staggered configuration means that the two adjacent heating cavities 11 are provided with dielectric radiators on the non-adjacent sides. In other words, if the microwave heating device or dielectric radiator of a heating cavity is arranged relative to the left and right sides of the heating cavity, then the microwave heating device or dielectric radiator of the heating cavity adjacent to the heating cavity is arranged relative to the front and back sides of the heating cavity. According to this preferred arrangement, the heat carrier can be heated more evenly.

图10示出图9中微波加热系统的多个微波加热装置的布置方案的剖视图;图11示出图9中微波加热系统的多个微波加热装置的布置方案的俯视图。10 is a cross-sectional view showing an arrangement of multiple microwave heating devices in the microwave heating system of FIG. 9 ; and FIG. 11 is a top view showing an arrangement of multiple microwave heating devices in the microwave heating system of FIG. 9 .

接下来参见图12,其示出根据本公开另一种优选实施方式的微波加热系统的结构示意图。其在图6-8中所示的微波加热系统或图9-11中所示的微波加热系统的基础上进行了进一步的改进。在该实施方式中,为了进一步提升受热载体加热的均匀性,除了设置在加热腔体11之间的第一微波屏蔽元件14之外,至少部分加热腔体11内可以设有第二微波屏蔽元件15,该第二微波屏蔽元件15延伸通过加热腔体的整个长度,从而将多对相对布置的微波加热装置3或其包括的介质辐射器分隔开,相应地将加热腔体11分隔成依次并行分布的多个子加热腔,每个子加热腔的两端位于所述加热腔体11的两侧并设置有一对或多对相对布置的微波加热装置3或其包括的介质辐射器(请见图12)。在具体的实施方式中,所述第一微波屏蔽元件14和第二微波屏蔽元件15为金属材质,第一微波屏蔽元件14例如可以为带孔钢板或钢网,而第二微波屏蔽元件可以为钢板。通过第二微波屏蔽元件15的分割,使得单个加热腔体11内受热载体的加热更加均匀,并且能够防止相邻微波加热装置3发射的微波的相互叠加,避免电场场强增加超过空气击穿强度。Next, refer to Figure 12, which shows a schematic structural diagram of a microwave heating system according to another preferred embodiment of the present disclosure. This system further improves upon the microwave heating system shown in Figures 6-8 or the microwave heating system shown in Figures 9-11. In this embodiment, to further enhance the uniformity of heating of the heated carrier, in addition to the first microwave shielding element 14 disposed between the heating cavities 11, a second microwave shielding element 15 may be provided within at least a portion of the heating cavities 11. This second microwave shielding element 15 extends across the entire length of the heating cavities, thereby separating multiple pairs of opposing microwave heating devices 3 or the dielectric radiators included therein. Accordingly, the heating cavities 11 are divided into multiple sub-heating cavities distributed sequentially and in parallel. Each sub-heating cavity is located at either end of the heating cavity 11 and is provided with one or more pairs of opposing microwave heating devices 3 or the dielectric radiators included therein (see Figure 12). In a specific embodiment, the first microwave shielding element 14 and the second microwave shielding element 15 are made of metal. For example, the first microwave shielding element 14 may be a perforated steel plate or steel mesh, while the second microwave shielding element may be a steel plate. The division of the second microwave shielding element 15 makes the heating of the heated carrier in the single heating cavity 11 more uniform, and can prevent the microwaves emitted by adjacent microwave heating devices 3 from overlapping each other, thereby preventing the electric field strength from increasing beyond the air breakdown strength.

接下来参见图13,其示出了根据本公开的微波加热系统的另一种实施方式。代替前面6-12中多个加热腔体11在上下方向堆叠,在图13中,多个加热腔体在容器主体中左右方向并排排列,相应地,加热腔体中的各个受热载体沿上下方向铺设,形成的受热载体层位于加热腔体的左右两侧。在容器主体1的上下两端的侧壁上安装有分别对应于各个加热腔体11的多个微波加热装置3,该微波加热装置3的介质辐射器33沿上下方向伸入至加热腔体11内。如图中所示,在该实施例中,加热腔体11之间不再设置第一微波屏蔽元件14,2个左右相邻加热腔体中的受热载体层组合形成一体。在容器主体1上与组合形成的受热载体层的对应部分设有反应物入口12和产物出口13,以允许由反应物入口12通入的流体反应物沿上下方向流过受热载体层2并通过产物出口13排出。Next, refer to Figure 13, which shows another embodiment of a microwave heating system according to the present disclosure. Instead of stacking multiple heating cavities 11 in the vertical direction as described in previous sections 6-12, in Figure 13, multiple heating cavities are arranged side by side in the left-right direction within the container body. Accordingly, the individual heat carriers in the heating cavities are laid out in the vertical direction, forming a heat carrier layer located on the left and right sides of the heating cavity. Multiple microwave heating devices 3 are mounted on the sidewalls at the upper and lower ends of the container body 1, corresponding to each heating cavity 11. The dielectric radiators 33 of the microwave heating devices 3 extend vertically into the heating cavity 11. As shown in the figure, in this embodiment, the first microwave shielding element 14 is no longer provided between the heating cavities 11. The heat carrier layers in two adjacent heating cavities are combined to form a single body. Reactant inlets 12 and product outlets 13 are provided on the container body 1 corresponding to the combined heat carrier layer, allowing the fluid reactant introduced through the reactant inlet 12 to flow vertically through the heat carrier layer 2 and be discharged through the product outlet 13.

以下通过实施例对本公开作进一步描述。The present disclosure is further described below through examples.

对比例1Comparative Example 1

如图14所示,在没有介质辐射器的存在下,仅通过8端口(图中上下两端的每个矩形块代表一个端口)波导对其加热,微波入射辐射效率为94.94%,催化剂床层最大温差为350℃,温差较大。且温度主要集中于微波辐射溃口处,很难实现远离微波馈口的均匀加热辐射。As shown in Figure 14, without a dielectric radiator, heating is achieved solely through an eight-port waveguide (each rectangular block at the upper and lower ends of the figure represents a port). The microwave radiation efficiency is 94.94%, resulting in a significant maximum temperature difference of 350°C across the catalyst bed. Furthermore, the temperature is primarily concentrated at the microwave radiation indentation, making uniform heating difficult to achieve away from the microwave feed port.

实施例1Example 1

如图15所示,采用图2中所示的技术方案,在采用介质辐射器的情况下,可以看出催化剂床层的均匀性得到显著改善。远离微波馈口处的催化剂床层得到较好效果的加热,微波入射效率提升至96.11%,最大温差缩小为180℃,然而远离微波馈口的中间范围两侧温度高,中间温度略低。As shown in Figure 15, employing the technical solution shown in Figure 2, with the use of dielectric radiators, the uniformity of the catalyst bed is significantly improved. The catalyst bed away from the microwave feed is heated effectively, with microwave injection efficiency increased to 96.11% and the maximum temperature difference reduced to 180°C. However, the temperature in the middle range away from the microwave feed is higher on both sides and slightly lower in the middle.

实施例2Example 2

如图16所示,在采用介质辐射器且存在第一微波屏蔽元件的情况下,催化剂床层的均匀性又得到了显著改善,最大温差缩小为180℃。入射效率提升至99.11。虽然最大温差没有得到显著降低,然而远离微波馈口的大部分催化剂床层的温度均匀性得到显著改善。As shown in Figure 16, using a dielectric radiator and the presence of a first microwave shielding element significantly improved the uniformity of the catalyst bed, reducing the maximum temperature difference to 180°C. The incident efficiency increased to 99.11. Although the maximum temperature difference did not significantly decrease, the temperature uniformity of the majority of the catalyst bed, away from the microwave feed port, was significantly improved.

实施例3Example 3

如图17所示,在有介质辐射器且存在第一微波屏蔽元件和第二微波屏蔽元件的情形下,催化剂床层的均匀性进一步得到了显著改善,最大温差缩小为30℃,其中第一屏蔽元件优选为钢网,用于屏蔽微波,但允许气体通过。第二微波屏蔽元件为钢板,用于屏蔽微波并隔绝空气。但是本领域技术人员知道,第一屏蔽元件的材料不限于钢网,任何可以屏蔽微波并允许气体通过的材料均可以。同样,第二微波屏蔽元件不限于钢板,只要可以屏蔽微波并阻隔气体即可。As shown in Figure 17, with a dielectric radiator and both a first and second microwave shielding element, the uniformity of the catalyst bed is significantly improved, with the maximum temperature difference reduced to 30°C. The first shielding element is preferably a steel mesh, which shields microwaves while allowing gas to pass through. The second microwave shielding element is a steel plate, which shields microwaves and isolates air. However, those skilled in the art will appreciate that the material of the first shielding element is not limited to steel mesh; any material that can shield microwaves and allow gas to pass through can be used. Similarly, the second microwave shielding element is not limited to steel plate; any material that can shield microwaves and block gas can be used.

实施例4Example 4

如图18所示,上下不同层次的介质辐射器采用同向辐射方案。中间催化剂床层最大温差为60℃。As shown in Figure 18, the dielectric radiators at different levels above and below adopt a co-directional radiation scheme. The maximum temperature difference of the middle catalyst bed is 60°C.

实施例5Example 5

如图18所示,上下不同层次的介质辐射器采用相交90°(相互垂直)的辐射方案。中间催化剂床层的最大温差为52℃。As shown in Figure 18, the dielectric radiators at different levels above and below adopt a 90° intersecting (perpendicular) radiation scheme. The maximum temperature difference of the middle catalyst bed is 52°C.

由此可见,在所述微波加热反应系统中,采用多辐射器并且多层平行布置的加热方式以及采用多辐射器并且多层相互交错排布的加热方式均可以获得较好的均匀加热效果;而且,通过在多组辐射器之间通过设置金属隔板,可以进一步提升辐射效率以及加热均匀性。It can be seen that in the microwave heating reaction system, both the heating method using multiple radiators and multiple layers arranged in parallel and the heating method using multiple radiators and multiple layers arranged in an interlaced manner can achieve better uniform heating effects; moreover, by setting metal partitions between multiple groups of radiators, the radiation efficiency and heating uniformity can be further improved.

实施例6-9Examples 6-9

定义el1为耦合段长度,el2为辐射段长度,el3为传输段长度。在8个1kW的微波磁控管同时辐射照射下,单催化剂床层尺寸为700mm×700mm的前提下,两个相对的介质辐射器为单独的辐射腔体为175mm条件下,不同el1/el2/el3对应的电场强度和入射效率分别如下表1所示。Define el1 as the coupling segment length, el2 as the radiation segment length, and el3 as the transmission segment length. Under simultaneous irradiation from eight 1kW microwave magnetrons, with a single catalyst bed measuring 700mm x 700mm and two opposing dielectric radiators in separate radiation cavities measuring 175mm, the corresponding electric field strengths and incident efficiencies for different el1/el2/el3 values are shown in Table 1 below.

表1
Table 1

在实施例6-9中,容器主体内最大电场强度不超过3.87×103v/m,均远小于潮湿空气下电场击穿强度。In Examples 6-9, the maximum electric field intensity in the container body does not exceed 3.87×10 3 V/m, which is much lower than the electric field breakdown intensity in humid air.

实施例6-9的电场分布云图分别如图20-23所示,在图中,各自所代表的的电场强度是否均匀则均代表催化剂床层被加热的温度是否均匀。从图中可以看出,实施例6和7电场强度主要集中于靠近容器主体壁面位置,说明电场强度分布不均匀,催化剂床层温度分布不均匀,同时微波能量利用率也较低;实施例8和9则相对电场更均匀,代表被加热的催化剂床层温度更均匀,且入射效率也相对较高。在一定的范围内,实施例8和9所代表的辐射器的长度更有利于产生均匀且高效的加热效果。The electric field distribution cloud maps of Examples 6-9 are shown in Figures 20-23, respectively. In the figures, the uniformity of the electric field intensity represented by each represents whether the temperature of the heated catalyst bed is uniform. As can be seen from the figures, the electric field intensity of Examples 6 and 7 is mainly concentrated near the wall of the container body, indicating that the electric field intensity distribution is uneven, the catalyst bed temperature distribution is uneven, and the microwave energy utilization rate is also low; Examples 8 and 9 have relatively more uniform electric fields, indicating that the heated catalyst bed temperature is more uniform and the incident efficiency is relatively high. Within a certain range, the length of the radiator represented by Examples 8 and 9 is more conducive to producing a uniform and efficient heating effect.

实施例10-13Examples 10-13

除耦合段长度、辐射段长度和传输段长度作出调整外,其余条件均与实施例6-9相同,不同el1/el2/el3对应的电场强度和入射效率分别如下表2所示。Except for the adjustments to the coupling section length, radiation section length, and transmission section length, the other conditions are the same as those in Examples 6-9. The electric field strength and incident efficiency corresponding to different el1/el2/el3 are shown in Table 2 below.

表2
Table 2

实施例10-13的电场分布云图分别如图24-27所示,从图中可以看出,在耦合段长度相同或相似,且耦合段长度均在合理范围内时,介质辐射器的利用效率较高,均超过95%。辐射段长度较短(如实施例10和11)的情况下,容器主体内微波分布出现不均匀情况;当引向辐射段在合理范围值下,则会有更好的微波电场分布效果和辐射效率。The electric field distribution cloud diagrams for Examples 10-13 are shown in Figures 24-27, respectively. As can be seen from the figures, when the coupling segment lengths are the same or similar and within a reasonable range, the dielectric radiator achieves high utilization efficiency, exceeding 95%. When the radiating segment lengths are shorter (as in Examples 10 and 11), the microwave distribution within the container body becomes uneven. When the directed radiating segment lengths are within a reasonable range, the microwave electric field distribution and radiation efficiency are improved.

通过上述实施例6-13可以看出,通过调整耦合段长度、传输段长度和辐射段长度可以进一步调整电场的分布运行,进而调整床层加热均匀性和辐射效率。It can be seen from the above embodiments 6-13 that by adjusting the length of the coupling section, the length of the transmission section and the length of the radiation section, the distribution of the electric field can be further adjusted, thereby adjusting the bed heating uniformity and radiation efficiency.

接下来参见图28,其公开了使用前面所述的微波加热系统中的任一个来处理废气(例如VOCs)的方法。如图28所示,在步骤2801处,控制器(未示出)从设置于受热载体2上或加热腔体11内的温度传感器接收温度信号。然后,方法进行到步骤2802,控制器将接收的温度信号与目标温度进行比较。接下来在步骤2803处确定温度信号是否达到目标温度,如果达到或超过目标温度,则方法进行到步骤2805。在2805处,打开反应物入口以注入含挥发性有机物(如VOCs)的废气。如果在步骤2803处确定温度信号尚未达到目标温度,则控制器基于温度信号与目标温度之间的差值输出控制信号,所述控制信号用于控制微波加热装置3中的微波发生单元继续生成微波,以对加热腔体11内的受热载体继续进行加热。另外,控制器还可以基于容器主体1的出口处的产物的成分来控制入口气流。在存在多个加热腔体的情况下,控制器可以分别控制每个加热腔体的温度。Next, referring to Figure 28 , a method for treating waste gas (e.g., VOCs) using any of the aforementioned microwave heating systems is disclosed. As shown in Figure 28 , at step 2801, a controller (not shown) receives a temperature signal from a temperature sensor located on the heated carrier 2 or within the heating cavity 11. The method then proceeds to step 2802, where the controller compares the received temperature signal with a target temperature. Next, at step 2803, a determination is made as to whether the temperature signal has reached the target temperature. If so, the method proceeds to step 2805. At 2805, the reactant inlet is opened to allow the introduction of waste gas containing volatile organic compounds (e.g., VOCs). If, at step 2803, it is determined that the temperature signal has not yet reached the target temperature, the controller outputs a control signal based on the difference between the temperature signal and the target temperature. The control signal is used to control the microwave generating unit in the microwave heating apparatus 3 to continue generating microwaves to continue heating the heated carrier within the heating cavity 11. Additionally, the controller can also control the inlet airflow based on the composition of the product at the outlet of the container body 1. In the case where there are multiple heating chambers, the controller may control the temperature of each heating chamber separately.

本领域技术人员可以理解,图28中的方法步骤的顺序不一定按照附图中所示的顺序执行,甚至某些步骤可以同时执行,或者某些步骤可以被去除,只要与本公开技术方案要解决的技术问题不冲突即可。Those skilled in the art will understand that the order of the method steps in Figure 28 does not necessarily have to be executed in the order shown in the figure, and some steps may even be executed simultaneously, or some steps may be removed, as long as they do not conflict with the technical problems to be solved by the technical solution of the present disclosure.

现在参见图29,其示出了根据本公开实施例的一种控制器2900,该控制器可以是前面实施例中所提到的控制器。该控制器包括处理器2901、存储器2902以及接口2903。处理器2901通过执行定义了图28中所示方法的计算机可执行指令来实现废气处理操作。可以将包括计算机可执行指令的计算机程序产品存储在存储器2902中。图29中所描述的方法可以由存储在存储器2902中的包括在计算机程序产品中的计算机可执行指令定义,并由执行该计算机可执行指令的处理器2901控制。接口2903可以包括网络接口用于经由网络与其他设备进行通信,该接口也可以包括使用户能够与控制器2900进行交互的其他输入/输出设备(例如,显示器、键盘、鼠标、扬声器、按钮、触摸板、触摸屏等)。本领域的技术人员将认识到,实际控制系统的实施方式也可以包含其他组件,并且图29是用于说明目的的这种控制系统的一些组件的高级表示。Now refer to Figure 29, which shows a controller 2900 according to an embodiment of the present disclosure, which may be the controller mentioned in the previous embodiment. The controller includes a processor 2901, a memory 2902, and an interface 2903. The processor 2901 implements the exhaust gas treatment operation by executing computer-executable instructions that define the method shown in Figure 28. A computer program product including computer-executable instructions can be stored in the memory 2902. The method described in Figure 29 can be defined by computer-executable instructions included in the computer program product stored in the memory 2902 and controlled by the processor 2901 that executes the computer-executable instructions. The interface 2903 may include a network interface for communicating with other devices via a network, and the interface may also include other input/output devices (e.g., a display, keyboard, mouse, speaker, button, touchpad, touch screen, etc.) that enable a user to interact with the controller 2900. Those skilled in the art will recognize that the implementation of the actual control system may also include other components, and Figure 29 is a high-level representation of some components of such a control system for illustrative purposes.

存储器2902包括有形的非暂时性机器可读存储介质也可包括高速随机存取存储器,诸如动态随机存取存储器(DRAM)、静态随机存取存储器(SRAM)、双倍数据速率同步动态随机存取存储器(DDRRAM)或其他随机存取固态存储器设备,并且可以包括非易失性存储器,诸如一个或多个磁盘存储设备(诸如内部硬盘和可移动磁盘)、磁光盘存储设备、光盘存储设备、闪存设备、半导体存储器设备(诸如可擦除可编程只读存储器(EPROM)、电可擦可编程只读存储器(EEPROM))、紧凑盘只读存储器(CD-ROM)、数字多功能盘只读存储器(DVD-ROM)盘或其他非易失性固态存储设备。Memory 2902 includes tangible, non-transitory machine-readable storage media and may also include high-speed random access memory, such as dynamic random access memory (DRAM), static random access memory (SRAM), double data rate synchronous dynamic random access memory (DDRRAM), or other random access solid-state memory devices, and may include non-volatile memory, such as one or more magnetic disk storage devices (such as internal hard disks and removable disks), magneto-optical disk storage devices, optical disk storage devices, flash memory devices, semiconductor memory devices (such as erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)), compact disk read-only memory (CD-ROM), digital versatile disk read-only memory (DVD-ROM) disks, or other non-volatile solid-state storage devices.

以上详细描述了本公开的实施方式,应认识到,为了清楚起见在单独实施例的上下文中描述的本公开的某些特征还可以在单个实施例中以组合的方式提供。相反,为了简便起见在单个实施例的上下文中描述的本公开的各种特征还可以单独地或以任何适当的子组合或在本公开的任何其它所述实施例中适当地提供。不应将在各种实施例的上下文中描述的某些特征视为那些实施例的必要特征,除非该实施例在没有那些元素的情况下无效。While embodiments of the present disclosure have been described in detail above, it should be appreciated that certain features of the present disclosure described in the context of separate embodiments for clarity may also be provided in combination in a single embodiment. Conversely, various features of the present disclosure described in the context of a single embodiment for simplicity may also be provided individually or in any suitable subcombination or in any other described embodiment of the present disclosure as appropriate. Certain features described in the context of various embodiments should not be considered essential features of those embodiments unless the embodiment would be ineffective without those elements.

虽然已结合本公开的具体实施例描述了本公开,但是很明显,许多替换、修改和变更对于本领域的技术人员来说将是显而易见的。因此,旨在涵盖属于随附权利要求的精神和广泛范围内的所有此类替换、修改和变更。Although the present disclosure has been described in conjunction with the specific embodiments thereof, it is apparent that many substitutions, modifications and variations will be apparent to those skilled in the art. It is therefore intended to encompass all such substitutions, modifications and variations that fall within the spirit and broad scope of the appended claims.

本说明中提及的所有公开、专利和专利申请通过引用整体地结合于本文中,引用的程度如同具体且特别地指示每个单独的公开、专利或专利申请以通过引用结合于本文一样。另外,不应将本公开中的任何参考的引用或识别理解为允许此类参考作为现有技术可用于本公开。在使用分段标题的情况下,不应将其理解为一定是限制性的。All publications, patents, and patent applications mentioned in this specification are incorporated herein by reference in their entirety to the same extent as if each individual publication, patent, or patent application was specifically and specifically indicated to be incorporated herein by reference. In addition, citation or identification of any reference in this disclosure should not be construed as an admission that such reference is available as prior art to the present disclosure. Where section headings are used, they should not be construed as necessarily limiting.

Claims (22)

一种微波加热系统,包括容器主体(1),所述容器主体(1)包括至少一个加热腔体(11);A microwave heating system comprises a container body (1), wherein the container body (1) comprises at least one heating cavity (11); 其中所述加热腔体(11)内设置有微波屏蔽元件(15),所述微波屏蔽元件(15)将所述加热腔体(11)分隔成多个子加热腔,每个子加热腔中设置有微波加热装置(3)和能够吸收微波而生热的受热载体(2),A microwave shielding element (15) is provided in the heating cavity (11), and the microwave shielding element (15) divides the heating cavity (11) into a plurality of sub-heating cavities, each of which is provided with a microwave heating device (3) and a heating carrier (2) capable of absorbing microwaves to generate heat. 其中所述微波加热装置(3)设置在所述子加热腔的侧壁上,所述微波加热装置(3)包括由电介质材料构成的介质辐射器(33),所述介质辐射器(33)具有位于所述子加热腔内的辐射段(331),用于向子加热腔内辐射微波以加热所述受热载体(2)。The microwave heating device (3) is arranged on the side wall of the sub-heating cavity, and the microwave heating device (3) includes a dielectric radiator (33) made of dielectric material, and the dielectric radiator (33) has a radiation section (331) located in the sub-heating cavity, which is used to radiate microwaves into the sub-heating cavity to heat the heated carrier (2). 根据权利要求1所述的微波加热系统,其中所述微波屏蔽元件(15)延伸所述加热腔体(11)的整个长度,使得每个子加热腔并行设置,并且在每个子加热腔的两端侧壁上相对地安装介质辐射器(33)。The microwave heating system according to claim 1, wherein the microwave shielding element (15) extends the entire length of the heating cavity (11), so that each sub-heating cavity is arranged in parallel, and dielectric radiators (33) are installed oppositely on the side walls at both ends of each sub-heating cavity. 根据权利要求2所述的微波加热系统,其中每个子加热腔包括偶数个介质辐射器(33),所述偶数个介质辐射器(33)分为2组对称安装在所述子加热腔体的两端侧壁上。According to the microwave heating system of claim 2, each sub-heating cavity comprises an even number of dielectric radiators (33), and the even number of dielectric radiators (33) are divided into two groups and symmetrically installed on the side walls at both ends of the sub-heating cavity. 根据权利要求1-3中任一项所述的微波加热系统,其中所述容器主体(1)包括多个加热腔体(11),所述多个加热腔体(11)上下堆叠,所述受热载体(2)在所述子加热腔的上部和/或下部分别布置成受热载体层,堆叠的所述多个加热腔体(11)的温度独立控制或者从上到下形成温度梯度。The microwave heating system according to any one of claims 1 to 3, wherein the container body (1) comprises a plurality of heating cavities (11), the plurality of heating cavities (11) are stacked up and down, the heat carrier (2) is arranged as a heat carrier layer at the upper part and/or the lower part of the sub-heating cavity, and the temperature of the stacked plurality of heating cavities (11) is independently controlled or forms a temperature gradient from top to bottom. 根据权利要求4所述的微波加热系统,其中所述微波屏蔽元件(15)称为第二微波屏蔽元件(15),并且其中在上下相邻的2个加热腔体(11)之间设置第一微波屏蔽元件(14)。The microwave heating system according to claim 4, wherein the microwave shielding element (15) is called a second microwave shielding element (15), and wherein a first microwave shielding element (14) is arranged between two upper and lower adjacent heating cavities (11). 根据权利要求5所述的微波加热系统,其中第二微波屏蔽元件(15)为钢板,用于屏蔽微波并阻隔气体,并且第一微波屏蔽元件(14)为钢网,用于屏蔽微波并允许气体通过。The microwave heating system according to claim 5, wherein the second microwave shielding element (15) is a steel plate for shielding microwaves and blocking gas, and the first microwave shielding element (14) is a steel mesh for shielding microwaves and allowing gas to pass through. 根据权利要求1-6中任一项所述的微波加热系统,其中所述辐射段(331)具有多面结构,所述多面结构包括面向所述受热载体(2)并向所述受热载体(2)发射微波的辐射表面(331a)。The microwave heating system according to any one of claims 1 to 6, wherein the radiation section (331) has a multi-faceted structure, the multi-faceted structure including a radiation surface (331a) facing the heated carrier (2) and emitting microwaves toward the heated carrier (2). 根据权利要求7所述的微波加热系统,其中所述辐射段(331)具有渐缩的多面结构,所述辐射表面的形状为渐缩形状。The microwave heating system according to claim 7, wherein the radiation section (331) has a tapered multi-faceted structure, and the shape of the radiation surface is a tapered shape. 根据权利要求8所述的微波加热系统,其中所述辐射段(331)的渐缩的多面结构为截头棱锥结构,所述辐射表面(331a)为所述截头棱锥结构的2个相对表面,并且所述辐射段(331)还包括分别与两个所述辐射表面(331a)相邻的侧表面(331b),且所述辐射表面(331a)的面积大于所述侧表面(331b)的面积。The microwave heating system according to claim 8, wherein the tapered multi-faceted structure of the radiation section (331) is a truncated pyramid structure, the radiation surface (331a) is two opposite surfaces of the truncated pyramid structure, and the radiation section (331) further includes side surfaces (331b) respectively adjacent to the two radiation surfaces (331a), and the area of the radiation surface (331a) is larger than the area of the side surface (331b). 根据权利要求9所述的微波加热系统,所述截头棱锥结构为截头四棱锥结构,所述辐射表面(331a)和所述侧表面(331b)均为2个。According to the microwave heating system of claim 9, the truncated pyramid structure is a truncated quadrangular pyramid structure, and there are two radiation surfaces (331a) and two side surfaces (331b). 根据权利要求1-10中任一项所述的微波加热系统,其中所述加热腔体(11)具有矩形横截面,上下相邻的2个加热腔体(11)上所述介质辐射器(33)设置在上下相邻的侧面上或不相邻的侧面上,在所述介质辐射器设置在上下不相邻的侧面的情况下,所述上下介质辐射器的延伸方向相互垂直。The microwave heating system according to any one of claims 1 to 10, wherein the heating cavity (11) has a rectangular cross-section, and the dielectric radiators (33) on the two upper and lower adjacent heating cavities (11) are arranged on upper and lower adjacent sides or on non-adjacent sides. When the dielectric radiators are arranged on upper and lower non-adjacent sides, the extension directions of the upper and lower dielectric radiators are perpendicular to each other. 根据权利要求1-10中任一项所述的微波加热系统,其中所述受热载体(2)中包括催化剂,所述容器主体(1)上设有反应物入口(12)和产物出口(13),以允许由所述反应物入口(12)通入的流体反应物流过所述受热载体(2)以在所述催化剂的作用下发生化学反应。The microwave heating system according to any one of claims 1 to 10, wherein the heated carrier (2) includes a catalyst, and the container body (1) is provided with a reactant inlet (12) and a product outlet (13) to allow the fluid reactant introduced through the reactant inlet (12) to flow through the heated carrier (2) to undergo a chemical reaction under the action of the catalyst. 根据权利要求1-10中任一项所述的微波加热系统,其中所述加热腔体(11)在所述介质辐射器的长度延伸方向的长度为所述辐射段(331)延伸进入所述加热腔体(11)的延伸长度的2-4倍。The microwave heating system according to any one of claims 1 to 10, wherein the length of the heating cavity (11) in the length extension direction of the dielectric radiator is 2 to 4 times the extension length of the radiation section (331) extending into the heating cavity (11). 根据权利要求1-10中任一项所述的微波加热系统,其中所述微波加热装置(3)包括微波发生单元(31)、穿过所述容器主体(1)的侧壁伸入至所述子加热腔内的所述介质辐射器(33)以及用于将所述微波发生单元(31)产生的微波引导至该介质辐射器(33)的波导(32)。The microwave heating system according to any one of claims 1 to 10, wherein the microwave heating device (3) comprises a microwave generating unit (31), the dielectric radiator (33) extending through the side wall of the container body (1) into the sub-heating cavity, and a waveguide (32) for guiding the microwaves generated by the microwave generating unit (31) to the dielectric radiator (33). 根据权利要求14所述的微波加热系统,其中所述介质辐射器(33)还包括在所述波导(32)内延伸的耦合段(333)以及在所述耦合段(333)和所述辐射段(331)之间延伸的传输段(332),所述耦合段具有渐缩的多面削尖结构。The microwave heating system according to claim 14, wherein the dielectric radiator (33) further includes a coupling section (333) extending within the waveguide (32) and a transmission section (332) extending between the coupling section (333) and the radiation section (331), the coupling section having a tapered multi-faceted pointed structure. 根据权利要求15所述的微波加热系统,其中所述耦合段(333)的长度为0.75-1倍的微波波长;所述辐射段(331)的长度为0.8倍以上的微波波长。The microwave heating system according to claim 15, wherein the length of the coupling section (333) is 0.75-1 times the microwave wavelength; and the length of the radiation section (331) is more than 0.8 times the microwave wavelength. 根据权利要求1-10中任一项所述的微波加热系统,其中所述介质辐射器(33)的材料的介电常数大于9,介质损耗<0.02。The microwave heating system according to any one of claims 1 to 10, wherein the dielectric constant of the material of the dielectric radiator (33) is greater than 9 and the dielectric loss is less than 0.02. 一种微波加热装置,用于权利要求1-17中任一项所述的微波加热系统中,所述微波加热装置包括微波发生单元(31)、用于将所述微波发生单元(31)产生的微波辐射至受热载体的介质辐射器(33)和用于将所述微波发生单元(31)产生的所述微波引导至所述介质辐射器(33)的波导(32),所述介质辐射器(33)包括具有位于所述加热腔体(11)内的辐射段(331),所述辐射段(331)具有渐缩的多面结构,所述多面结构包括面向所述受热载体(2)并向所述受热载体(2)发射微波的辐射表面(331a)。A microwave heating device, used in the microwave heating system according to any one of claims 1 to 17, the microwave heating device comprising a microwave generating unit (31), a dielectric radiator (33) for radiating the microwaves generated by the microwave generating unit (31) to a heated carrier, and a waveguide (32) for guiding the microwaves generated by the microwave generating unit (31) to the dielectric radiator (33), the dielectric radiator (33) comprising a radiating section (331) located within the heating cavity (11), the radiating section (331) having a tapered multi-faceted structure, the multi-faceted structure comprising a radiating surface (331a) facing the heated carrier (2) and emitting microwaves toward the heated carrier (2). 一种在权利要求1-17中任一项所述的微波加热系统上执行的废气处理方法,所述微波加热系统包括控制器以及设置在受热载体上或加热腔体内的温度传感器,用于实时监测各受热载体的温度,所述方法包括:A method for treating exhaust gas performed on a microwave heating system according to any one of claims 1 to 17, wherein the microwave heating system comprises a controller and a temperature sensor disposed on a heated carrier or in a heating cavity for real-time monitoring of the temperature of each heated carrier, the method comprising: 从所述温度传感器接收测量到的温度;receiving a measured temperature from the temperature sensor; 将测量到的温度和目标温度进行比较;comparing the measured temperature to the target temperature; 基于测量到的温度和目标温度之间的差值来输出控制信号给微波加热装置中的微波发生单元,从而控制微波发生单元生成微波对加热腔体内的受热载体进行加热;以及outputting a control signal to a microwave generating unit in the microwave heating device based on a difference between the measured temperature and the target temperature, thereby controlling the microwave generating unit to generate microwaves to heat a heated carrier in the heating cavity; and 响应于测量到的温度大于或等于目标温度,打开反应物入口以注入含挥发性有机物的废气。In response to the measured temperature being greater than or equal to the target temperature, the reactant inlet is opened to inject the exhaust gas containing volatile organic compounds. 一种控制器,包括:A controller comprising: 处理器,和processor, and 计算机可读存储介质,包括存储在其上的计算机程序,所述计算机程序包括可执行指令,所述可执行指令在由所述处理器执行时实现根据权利要求19所述的方法。A computer-readable storage medium comprising a computer program stored thereon, the computer program comprising executable instructions which, when executed by the processor, implement the method according to claim 19. 计算机可读存储介质,包括存储在其上的计算机程序,所述计算机程序包括可执行指令,所述可执行指令在由所述处理器执行时实现根据权利要求19所述的方法。A computer-readable storage medium comprising a computer program stored thereon, the computer program comprising executable instructions which, when executed by the processor, implement the method according to claim 19. 一种计算机程序产品,包括可执行指令,所述可执行指令在由处理器执行时实现根据权利要求19所述的方法。A computer program product comprising executable instructions which, when executed by a processor, implement the method according to claim 19.
PCT/CN2024/137014 2024-01-25 2024-12-05 Microwave heating system and method, and microwave heating apparatus Pending WO2025156835A1 (en)

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