WO2025038154A1

WO2025038154A1 - Two-step curable silicone composition and methods for the preparation and use thereof

Info

Publication number: WO2025038154A1
Application number: PCT/US2024/030695
Authority: WO
Inventors: Juyoung YOOK; Allison ABDILLA; Nanguo Liu
Original assignee: Dow Silicones Corp
Current assignee: Dow Silicones Corp
Priority date: 2023-08-17
Filing date: 2024-05-23
Publication date: 2025-02-20
Anticipated expiration: 2026-02-17
Also published as: TW202509150A

Abstract

A two-step curable silicone composition includes an organopolysiloxane resin having silicon bonded alkenyl groups, a (meth)acryloxyalkyl-functional organosiloxane polymer, an organohydrogensiloxane oligomer, a hydrosilylation reaction catalyst, a photoradical initiator, and a hydrosilylation inhibitor. Said composition may further include one or more of an alkenyl-functional organopolysiloxane polymer, a solvent, and a free radical scavenger. The composition can first be partially cured via hydrosilylation reaction and thereafter fully cured via UV irradiation. The composition is useful in semiconductor device fabrication processes.

Description

TWO-STEP CURABLE SILICONE COMPOSITION AND METHODS FOR THE PREPARATION AND USE THEREOF CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application claims the benefit of U.S. Provisional Patent Application No.63/520106 filed 17 August 2023 under 35 U.S.C. §119 (e). U.S. Provisional Patent Application No.63/520106 is hereby incorporated by reference. FIELD [0002] A two-step curable silicone composition is provided. The two-step curable silicone composition cures via hydrosilylation reaction and via radical initiated reaction. The two-step curable silicone composition is useful on uneven surfaces. INTRODUCTION [0003] Covering substrates with uneven surfaces (e.g., substrates common in electronic device fabrication, having features on their surfaces) may be difficult using conventional silicone pressure sensitive adhesives (PSAs) due to the elastic property (recovery force against pressure) of the conventional PSA, regardless of its adhesion strength. However, lowering the crosslink density to produce a PSA having non-elastic property (very low crosslinking) to cover such uneven surfaces, may result in the PSA having a gel-like tacky surface (low modulus) and/or poor physical stability (e.g., the PSA could flow or deform under conditions in which the electronic device is fabricated). Moreover, the low-crosslinked material could stick on the substrate due to development of adhesion under harsh process such as high temperature conditions.) Therefore, there is an industry need for a silicone layer that can cover uneven surfaces but still have sufficient crosslink density to avoid process failure during removal. SUMMARY [0004] A two-step curable silicone composition may comprise an organopolysiloxane resin, a (meth)acryloxyalkyl-functional organosiloxane polymer, an organohydrogensiloxane, a hydrosilylation reaction catalyst, a photoradical initiator, and a hydrosilylation reaction inhibitor. Methods for preparation and use of the two-step curable silicone composition are disclosed. BRIEF DESCRIPTION OF THE DRAWINGS [0005] Figure 1 is a flow diagram showing use of the two-step curable silicone composition in a process for fabrication of a ball grid array (BGA) package. DETAILED DESCRIPTION [0006] The two-step curable silicone composition (Composition) introduced above comprises: (A) an organopolysiloxane resin represented by average unit formula: (R¹ ₃SiO_1/2)_a(R²R¹ ₂SiO_1/2)_b(SiO_4/2)_c(HO_1/2)_d, wherein each R¹ is an independently selected alkyl group; each R² is an independently selected alkenyl group; subscripts a, b, and c are mole fractions of each siloxy unit in the formula; subscript d represents the amount of silicon bonded hydroxyl groups in the formula; and subscripts a, b, c and d have values such that a ≥ 0, b > 0, 0.3 ≤ c ≤ 0.7, a quantity (a + b + c) = 1, and 0 ≤ d ≤ 0.05; (B) a (meth)acryloxyalkyl-functional organosiloxane polymer selected from the group consisting of (B1) an organosiloxane polymer having two silicon atom-bonded alkenyl groups and at least one silicon atom-bonded (meth)acryloyloxyalkyl group per molecule, (B2) an organosiloxane polymer having two silicon atom-bonded hydrogen atoms and at least one silicon atom-bonded (meth)acryloyloxyalkyl group per molecule, and (B₃) a mixture of components (B1) and (B2); (C) an organohydrogensiloxane oligomer having a viscosity at 25 °C of not more than 1,000 mPa·s, and having at least one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded aryl group in a molecule; optionally (D) an alkenyl-functional organopolysiloxane free of silicon atom-bonded aryl groups and SiO_4/2 units; (E) a hydrosilylation reaction catalyst; (F) a photoradical initiator; (G) a hydrosilylation inhibitor; and optionally (H) a solvent. [0007] Component (A) in the Composition is an organopolysiloxane resin represented by average unit formula (A1): (R¹ ₃SiO_1/2)_a(R²R¹ ₂SiO_1/2)_b(SiO_4/2)_c(HO_1/2)_d. In formula (A1), each R¹ is an independently selected alkyl group. The alkyl group for R¹ may be branched, unbranched, or cyclic. Examples of alkyl groups include methyl, ethyl, propyl (including n-propyl and/or iso-propyl), butyl (including iso-butyl, n-butyl, tert-butyl, and/or sec-butyl), pentyl (including, iso-pentyl, neopentyl, and/or tert-pentyl); and hexyl, heptyl, octyl, nonyl, and decyl, as well as branched saturated monovalent hydrocarbon groups of 6 or more carbon atoms; and cyclic alkyl groups such as cyclopentyl or cyclohexyl. Alternatively, R¹ may be methyl or ethyl; alternatively each R¹ may be methyl. [0008] In formula (A1), R² is an alkenyl group. The alkenyl group has a double bond and may be branched or unbranched. Alkenyl groups have at least 2 carbon atoms. Alternatively, alkenyl groups may have 2 to 12 carbon atoms, alternatively 2 to 10 carbon atoms, alternatively 2 to 6 carbon atoms, alternatively 2 to 4 carbon atoms, and alternatively 2 carbon atoms. Suitable alkenyl groups include, but are not limited to vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl, and dodecenyl; alternatively vinyl, allyl and hexenyl; and alternatively vinyl. [0009] In formula (A1), subscripts a, b, and c represent mole fractions of the siloxane units in the molecule, and subscript d represents hydroxyl content. Subscripts a, b, c, and d are numbers satisfying the following conditions: a ≥ 0, b > 0, 0.3 ≤ c ≤ 0.7, a quantity (a + b + c) = 1, and 0 ≤ d ≤ 0.05. Alternatively, subscripts a, b, c, and d may have values such that 0.1 ≤ a ≤ 0.5, 0.01 ≤ b ≤ 0.2, 0.4 ≤ c ≤ 0.7, 0 ≤ d ≤ 0.05, or alternatively 0.2 ≤ a ≤ 0.5, 0.01 ≤ b ≤ 0.2, 0.4 ≤ c ≤ 0.7, 0 ≤ d ≤ 0.05. Without wishing to be bound by theory, it is thought that when subscripts a, b, c and d are numbers within the ranges mentioned above, a pre-cured product obtained by hydrosilylation reaction of the Composition will have appropriate hardness and mechanical strength. [0010] Molecular weight of the organopolysiloxane resin for component (A) is not limited, however, its number average molecular weight (Mn) measured using GPC with with polystyrene standards may be at least 1,500 g/mol, alternatively at least 2,000 g/mol, or alternatively at least 3,000 g/mol; while at the same time Mn may be up to 6,000 g/mol; alternatively up to 5,500 g/mol. The Mn of component (A) can be any range that combines the upper and lower limits described above, e.g., 3,000 g/mol to 5,500 g/mol. [0011] Examples of organopolysiloxane resins suitable for use as component (A) may be made by known methods, such as the methods for making the alkenyl-functional polyorganosilicate resins described in PCT Patent Publication s WO2021225675 and WO/2023/091868, and the references cited therein. Suitable organopolysiloxane resins for component (A) include one or more of the following: A-1) (Me₃SiO_1/2)_0.40(ViMe₂SiO_1/2)_0.04(SiO_4/2)_0.56, A-2) (Me3SiO1/2)0.42(ViMe2SiO1/2)0.05(SiO4/2)0.53(OH)0.02, and A-3) (Me₃SiO_1/2)_0.40(ViMe₂SiO_1/2)_0.10(SiO_4/2)_0.50. [0012] Component (A) is used in the Composition in an amount of < 82 mass %, alternatively up to 80 mass %, alternatively 55 mass % to 80 mass %, alternatively 55 mass % to 75 mass % based on a total mass of components (A), (B), (C), and (D). Alternatively, the amount of component (A) may be at least 59 mass %, alternatively at least 60 mass %, alternatively at least 61 mass %, and alternatively at least 62 mass %; while at the same time, the amount of component (A) may be up to 80 mass %, alternatively up to 75 mass %, alternatively up to 73 mass %, alternatively up to 72 mass %, and alternatively up to 70 mass %, on the same basis. The amount of component (A) can be any range that combines the upper and lower limits described above. Without wishing to be bound by theory, it is thought that if the amount of component (A) is equal to or above the lower limit of the range described above, a pre-cured product obtained by curing the Composition via hydrosilylation reaction will have low tack, or tack-free, surface and appropriate hardness and mechanical strength, whereas if the amount is equal to or below the upper limit of the range described above, the pre-cured product of the Composition has appropriate mechnical stength without brittlenss. [0013] Component (B) in the Composition is a (meth)acryloxyalkyl-functional organosiloxane polymer (Ma Polymer). Component (B) may be used in the Composition for the purpose of proceeding further cross-linking reaction of the pre-cured product obtained by a hydrosilylation reaction, to conform it on the substrate by an active energy ray. Component (B) may be selected from the group consisting of: B₁) a polyorganosiloxane having at least 2 silicon bonded alkenyl groups and at least one (meth)acryloxyalkyl-functional group per molecule, B₂) a polyorganosiloxane having at least 2 silicon bonded hydrogen atoms and at least one (meth)acryloxyalkyl-functional group per molecule, and B₃) a combination of both component B₁) and component B₂). [0014] Component B1) may comprise unit formula (B1): (R²R⁶2SiO1/2)2(R⁶2SiO2/2)n(R⁶R³SiO2/2)m, where each R² is an independently selected alkenyl group as described above for component (A), each R⁶ is independently selected from the group consisting of an alkyl group and an aryl group, R⁴ and each R³ is a (meth)acryloxyalkyl group of R⁴ is H or methyl, and R⁵ is an alkylene group having 2

be linear or branched. Examples of the alkylene groups for R⁵ include ethylene, propylene, methylethylene, butylene, pentylene, and hexylene groups. Alternatively, R⁵ may be propylene, methylethylene, or a combination thereof. Alternatively, R⁵ may be propylene. [0015] Aryl groups for R⁶ may have 6 to 12 carbon atoms such as phenyl, tolyl, xylyl, naphthyl, benzyl, and phenethyl groups. Alkyl groups for R⁶ are as described and exemplified above for R¹ in component (A). Alternatively, in component B1), each R⁶ may be alkyl, alternatively methyl. [0016] Subscripts m and n represent average numbers of each difunctional siloxane unit per molecule in the unit formula (B1) for component B1). Subscript m is an integer of 1 to 500, n is an integer of 1 to 1000, and 0.01 ≤ m/(n+m) ≤ 0.5. Alternatively, subscript m may be at least 1, alternatively at least 10, alternatively at least 15, alternatively at least 25, and alternatively at least 50, while at the same time subscript m may be up to 1000, alternatively up to 500, alternatively up to 400, alternatively up to 300, and alternatively up to 275. Subscript m may have any range that combines the upper and lower limits described above. [0017] Alternatively, in formula (B1) subscript n may be at least 1, alternatively at least 2, alternatively at least 3, alternatively at least 4, alternatively at least 5, alternatively at least 6, alternatively at least 7, and alternatively at least 8; while at the same time subscript m may be up to 500, alternatively up to 400, alternatively up to 300, alternatively up to 200, alternatively up to 100, alternatively up to 50, alternatively up to 25, alternatively up to 10, alternatively up to 9, and alternatively up to 8. Subscript n may have any range that combines the upper and lower limits described above. [0018] Examples of polydiorganosiloxanes suitable for use as component B₁) have average unit formulas B1-1) to B1-9), as follows: B1-1) (ViMe2SiO1/2)2(MaMeSiO2/2)8(Me2SiO2/2)272, B1-2) (ViMe₂SiO_1/2)₂(MaMeSiO_2/2)₁₀(Me₂SiO_2/2)₁₀₀₀, B₁-3) (ViMe₂SiO_1/2)₂(MaMeSiO_2/2)₂(Me₂SiO_2/2)₁₅, B1-4) (ViMe2SiO1/2)2(MaMeSiO2/2)2(Me2SiO2/2)2, B1-5) (ViMe₂SiO_1/2)₂(MaMeSiO_2/2)₄(Me₂SiO_2/2)₂₅, B₁-6) (ViMe₂SiO_1/2)₂(MaMeSiO_2/2)₄(Me₂SiO_2/2)₂₄, B₁- 7) (ViMe2SiO1/2)2(MaMeSiO2/2)2(Me2SiO2/2)25, B1-8) (ViMe2SiO1/2)2(MaMeSiO2/2)2, and B1-9) (ViMe₂SiO_1/2)₂(MaMeSiO_2/2)₁₆(Me₂SiO_2/2)₂₆₅. In the average unit formulas, Vi represents vinyl, Me represents methyl, Ma represents (meth)acryloxypropyl, and the subscripts after each unit represent average number of that unit per molecule. [0019] Component B2) may comprise unit formula (B2): (HR⁶2SiO1/2)2(R⁶2SiO2/2)n(R⁶R³SiO2/2)m, where R³, R⁶, and subscripts m and n are as described above for formula (B1) for component B₁). [0020] The acryloxyalkyl group and/or methacryloxyalkyl group content (hereinafter, referred to as a “(meth)acryl content”) will vary depending on molecular structure of component (B), however component (B) may provide a sufficient (meth)acryl content to provide good UV curability, for example, component (B) may provide a (meth)acryl content of at least 5 mmol/100 g, alternatively at least 7 mmol/100 g, and alternatively at least 10 mmol/100 g or more, relative to a total mass of components (A), (B), (C), and (D). Without wishing to be bound by theory, it is thought that if the amount is at least 5 mmol/100 g, the pre-cured product of the Composition will have good UV curability by irradiation with the active energy ray, as well as high-temperature stability of the fully-cured product, however if (meth)acryl content is lower than 5 mmol/100g, then the fully-cured product may have poor high temperature stability. Without wishing to be bound by theory, it is thought that poor high temperature stability is associated with adhesion drift after exposure to high temperature. The upper limit for (meth)acryl content is not restricted because it is thought that higher (meth)acryl content improves UV curability. However, a practical upper limit for (meth)acryl content may be 100 mmol/100 g or less. [0021] Examples of polydiorganosiloxanes suitable for use as component B₂) have average unit formulas B2-1 to B2-9), as follows: B2-1) (HMe2SiO1/2)2(MaMeSiO2/2)2(Me2SiO2/2)15, B2-2) (HMe₂SiO_1/2)₂(MaMeSiO_2/2)₄(Me₂SiO_2/2)₂₅, B₂-3) (HMe₂SiO_1/2)₂(MaMeSiO_2/2)₈(Me₂SiO_2/2)₂₇₂, B₂- 4) (HMe2SiO1/2)2(MaMeSiO2/2)2(Me2SiO2/2)2, B2-5) (HMe2SiO1/2)2(MaMeSiO2/2)10(Me2SiO2/2)1000, B₂-6) (HMe₂SiO_1/2)₂(MaMeSiO_2/2)₄(Me₂SiO_2/2)₂₄, B₂-7) (HMe₂SiO_1/2)₂(MaMeSiO_2/2)₂(Me₂SiO_2/2)₂₅, B₂-8) (HMe₂SiO_1/2)₂(MaMeSiO_2/2)₁₆(Me₂SiO_2/2)₂₆₅, and B₂-9) (HMe₂SiO_1/2)₂(MaMeSiO_2/2)₁. In the average unit formulas, Me represents methyl, Ma represents (meth)acryloxypropyl, and the subscripts after each unit represent average number of that unit per molecule. [0022] Methods of preparing component (B) are known in the art, as exemplified in U.S. Patents 4,554,339; 5,256,754; and 9,018,332; and U.S. Patent Application Publications 2021/0122769 and 2014/0203323, and PCT Patent Publication WO2021/225675. [0023] Component (B) is used in the Composition in an amount ranging from 10 mass % to 30 mass % based on the total mass of components (A), (B), (C), and (D). Alternatively, component (B) may be used in the Composition in an amount ranging from 12 mass % to 25 mass %, on the same basis. Without wishing to be bound by theory, it is thought that if the amount of component (B) is equal to or above the lower limit of the ranges described above, the pre-cured product of Composition will have good curability by irradiation with the active energy ray (as described below), and if the amount is equal to or below the upper limit of the ranges described above, the Composition will be stable when exposed to stress such as pressure or temperature. Alternatively, the amount of component (B) may be at least 10 mass %, alternatively at least 11 mass %, alternatively at least 12 mass %, alternatively at least 13 mass %, alternatively at least 14 mass %, alternatively at least 15 mass %, and alternatively at least 15.2 mass %; while at the same time the amount of component (B) may be up to 30 mass %, alternatively up to 29 mass %, alternatively up to 27 mass %, alternatively up to 25 mass %, alternatively up to 24 mass %, alternatively up to 23 mass %, and alternatively up to 22.6 mass % on the same basis. [0024] Alternatively, the amount of component B₁) may be at least 10 mass %, alternatively at least 12 mass %, alternatively at least 14 mass %, alternatively at least 15 mass %, alternatively at least 16 mass %, alternatively at least 17 mass %, and alternatively at least 20 mass %; while at the same time the amount of component B₁) may be up to 30 mass %, alternatively up to 27 mass %, alternatively up to 25 mass %, alternatively up to 24 mass %, alternatively up to 23 mass %, alternatively up to 22.6 mass %, and alternatively up to 22 mass %, on the same basis. [0025] Alternatively, the amount of component B₂) may be at least 10 mass %, alternatively at least 11 mass %, alternatively at least 13 mass %, alternatively at least 14 mass %, alternatively at least 15 mass %, alternatively at least 15.2 mass %, and alternatively at least 15.3 mass %; while at the same time the amount of component B₂) may be up to 30 mass %, alternatively up to 25 mass %, alternatively up to 23 mass %, alternatively up to 22 mass %, alternatively up to 20 mass %, alternatively up to 15.7 mass %, and alternatively up to 15.3 mass %, on the same basis. The amount of component (B) can be any range that combines the upper and lower limits described above, provided that the total amount of components B₁) and B₂) is 10 mass % to 30 mass % based on the total mass of components (A), (B), (C), and (D). [0026] Component (C) is an aryl-functional organohydrogensiloxane oligomer, which may be added to the Composition to impart a rigid property, and to impart a pre-cured product (obtained by hydrosilylation reaction of the Composition) with high glass transition temperature (i.e., Tg > 60 ⁰C). Molecular weight of component (C) is not limited, however, it may be ≤ 2,000 g/mol, alternatively ≤ 1,500 g/mol. Component (C) may have a viscosity ≤1,000 mPa·s, alternatively ≤ 500 mPa·s, or alternatively ≤ 100 mPa·s, where viscosity is measured using a type B viscometer according to ASTM D 1084 at 23 ± 2 °C. [0027] Component (C) may also act as a chain extending agent or a crosslinking agent for the Composition. Component (C) may have, per molecule, at least one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded aryl group. Alternatively, component (C) may have, per molecule, at least two silicon atom-bonded hydrogen atoms, and at least one silicon atom- bonded aryl group. [0028] The organohydrogensiloxane oligomer for component (C) may comprise unit formula (C1): (HR⁷ ₂SiO_1/2)₂(R⁷ ₂SiO_2/2)_e, where each R⁷ is independently selected from alkyl and aryl, where suitable alkyl and aryl groups are as described and exemplified above for R⁶, with the proviso that at least one R⁷, per molecule, is an aryl group. Alternatively, at least one R⁷ per molecule is phenyl. Subscript e represents average number of difunctional siloxane units per molecule, and subscript e is an integer with a value of 0 to 10, alternatively 0 to 5, alternatively 0 to 3, and alternatively 0 or 1. [0029] Examples of suitable organohydrogensiloxane oligomers for component (C) may be selected from C-1): H(CH₃)₂SiO(C₆H₅)₂SiOSi(CH₃)₂H, C-2): H(CH₃)₂SiO(C₆H₅)(CH₃)SiOSi(CH₃)₂H, C-3): H(CH₃)(C₆H₅)SiOSi(CH₃)(C₆H₅)H, and C-4): a mixture of two or more of C-1), C-2), and C-3). Alternatively, component (C) may be one or both of C-1) and C-2). [0030] Component (C) is used in an amount ranging from 0.1 mass % to 10 mass %, based on the total mass of components (A), (B), (C), and (D). Without wishing to be bound by theory, it is thought that when the Composition contains at least 0.1 mass % of component (C), the Composition will have good handleability, and a pre-cured product of the Composition will have a tack-free or low tack surface, and when the amount of component (C) in the Compsition is 10 mass % or less, the pre-cured product has high glass transition temperature. Alternatively, the amount of component (C) may be at least 0.1 mass %, alternatively at least 0.2 mass %, alternatively at least 0.3 mass %, alternatively at least 0.4 mass %, alternatively at least 0.5 mass %, alternatively at least 1 mass %, alternatively at least 1.2 mass %, alternatively at least 1.3 mass %, alternatively at least 1.4 mass %, alternatively at least 1.5 mass %, alternatively at least 2 mass %; while at the same time, the amount of component (C) may be up to 10 mass%, alternatively up to 9 mass %, alternatively up to 8 mass %, alternatively up to 7 mass %, alternatively up to 6 mass %, alternatively up to 5.5 mass %, alternatively up to 5.1 mass %, alternatively up to 5 mass %, alternatively up to 4.5 mass %, and alternatively up to 3 mass %, on the same basis. The amount of component (C) can be any range that combines the upper and lower limits described above. [0031] Component (D) is optional and may be used in the Composition to facilitate coating the Composition on a substrate. Component (D) is an alkenyl-functional organopolysiloxane, which is free of silicon atom-bonded aryl groups and free of tetrafunctional units of formula SiO_4/2. Component (D) may have a substantially linear, alternatively linear, structure. [0032] Component (D) may have unit formula: (R²R¹ ₂SiO_1/2)₂(R¹ ₂SiO_2/2)_f, where R¹ is an alkyl group and R² is an alkenyl group, as described and exemplified above for component (A), and subscript f represents average number of difunctional siloxane units per molecule, and subscript f is an integer ranging from 10 to 10,000. [0033] Examples of such component (D) include dimethylpolysiloxanes capped at both molecular chain terminals with dimethylvinylsiloxy groups. Component (D) may have a viscosity ranging from 10 mPa·s to 1,000,000 mPa·s measured using a type B viscometer according to ASTM D 1084 at 23 ± 2 °C. [0034] Component (D) is used in the Composition in an amount ranging from 0 to 25 mass %, based on a total mass of components (A), (B), (C), and (D). If a mixture of components (A), (B), and (C) can be fully cured, component (D) may be omitted. Alternatively, by considering an application method, an addition of component (D) might be helpful to facilitate coating on a substrate (e.g., a base film). Alternatively, when component (D) is included in the Composition, the amount may be at least 10 mass %, alternatively at least 10.5 mass %, alternatively at least 11 mass %, alternatively at least 11.6 mass %; while at the same time the amount of component (D) may be up to 25 mass %, alternatively up to 23 mass %, alternatively up to 22.9 mass %, on the same basis described above. The amount of component (D) can be any range that combines the upper and lower limits described above. [0035] Components (A), (B), (C), and (D) are used in amounts in the Composition sufficient to provide a molar ratio of silicon atom-bonded hydrogen atoms (SiH) to silicon atom-bonded alkenyl, e.g., vinyl groups (Vi) sufficient to effect hydrosilylation reaction when heating the Composition to form a pre-cured product (e.g., to react the Composition via hydrosilylation reaction to form the pre-cured product, which is deformable and has a low tack or tack-free surface. A molar ratio ("SiH/Vi ratio") of all silicon atom-bonded hydrogen atoms relative to all silicon atom-bonded alkenyl groups in components (A), (B), (C), (D), and (E) is 0.29/1 to < 0.9/1. Alternatively, SiH/Vi ratio may be at least 0.29/1 alternatively at least 0.3/1, alternatively at least 0.4/1, alternatively at least 0.44/1, alternatively at least 0.5/1, and alternatively at least 0.57/1, while at the same time, SiH/Vi ratio may be up to 0.9/1, alternatively up to 0.7/1, alternatively up to 0.69/1, alternatively up to 0.58/1, and alternatively up to 0.57/1. Without wishing to be bound by theory, it is thought that if the SiH/Vi molar ratio is equal to or above the lower limit of the range described above, the Composition can be properly pre-cured by heating to effect hydrosilylation reaction, and the pre- cured product will have appropriate hardness and a low tack or tack-free surface, and when the molar ratio is equal to or below the upper limit of the range described above, the pre-cured product has deformable property. [0036] Component (E) is a hydrosilylation reaction catalyst used to facilitate thermal curing of the Composition. Hydrosilylation reaction catalysts suitable for component (E) are known in the art and commercially available. Suitable hydrosilylation catalysts comprise a platinum group metal such as platinum, rhodium, ruthenium, palladium, osmium, or iridium metal or an organometallic compound and/or complex. Alternatively, component (E) may comprise a platinum-based catalyst. Examples of the platinum-based catalysts include a platinum fine powder, chloroplatinic acid, an alcohol solution of chloroplatinic acid, a platinum-alkenylsiloxane complex, a platinum-olefin complex and a platinum-carbonyl complex. Alternatively, component (E) may comprise a platinum-alkenylsiloxane complex such as 1,3-divinyl-1,1,3,3-tetramethyldisiloxane complexes with platinum. These complexes may be microencapsulated in a resin matrix. Examples of suitable hydrosilylation reaction catalysts for component (E) are described in, for example, PCT Patent Application Publication WO2021/081822 and the references cited therein. Hydrosilylation reaction catalysts are commercially available, for example, SYL-OFF™ 4000 Catalyst and SYL-OFF™ 2700 are available from Dow. [0037] Component (E) is used in the Composition in an effective quantity for facilitating thermal cure via hydrosilylation reaction. The amount of component (E) is sufficient to provide an amount of the platinum group metal ranging from 0.01 ppm to 500 ppm, alternatively 0.01 ppm to 100 ppm, alternatively 0.01 ppm to 50 ppm, and alternatively 0.1 ppm to 10 ppm, by mass relative to 100 parts by mass of components (A), (B), (C), and (D) combined. Alternatively, the amount of component (E) may be sufficient to provide at least 0.01 ppm, alternatively at least 0.1 ppm, alternatively at least 1 ppm, alternatively at least 2 ppm, and alternatively at least 5 ppm of the platinum group metal, while at the same time the amount of component (E) may be up to 500 ppm, alternatively up to 250 ppm, alternatively up to 100 ppm, alternatively up to 50 ppm, alternatively up to 25 ppm, and alternatively up to 10 ppm of the platinum group metal, on the same basis. The amount of component (E) can be any range that combines the upper and lower limits described above. [0038] Component (F) in the Composition is a photoradical initiator. Component (F) is added to the Composition is to effect curing by irradiating the Composition with an active energy ray. Suitable photoradical initiators include UV initiators such as benzophenone, benzophenone derivatives, acetophenone, acetophenone derivatives (α-hydroxy ketone), propiophenone, 2- hydroxy-2-methylpropiophenone, benzoin and its alkyl esters, phosphine oxide derivatives, xanthone derivatives, oxime ester derivatives, and camphor quinone. Other suitable photoradical initiators include 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexylphenylketone, 1-[4- (2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2- methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one, 2-methyl-1-(4-methylthiophenyl)-2- morpholinopropan-1-one, 2-benzyl-2-dimethylamino-(4-morpholinophenyl)-butanone-1, 2- (dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2,4,6- trimethylbenzoyl-diphenyl-phosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, 1,2-octanedione, 1-[4-(phenylthio)-2-(O-benzoyloxime)]ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)- 9H-carbazol-3-yl]-1-(O-acetyloxime), ethyl-4-dimethylaminobenzoate, 2-ethylhexyl-4- dimethylaminobenzoate, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, benzoyl peroxide, cumene peroxide, and combinations of two or more thereof. [0039] Photoradical initiators are commercially available. For example, photoradical initiators suitable for use herein include 2,6-bis(4-azido benzylidene)cyclohexanone, 2,6-bis(4-azido benzylidene)-4-methylcyclohexanone, 1-hydroxy-cyclohexyl-phenyl-ketone (IRGACURE™ 184), 2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropane-1-one (IRGACURE™ 907); 2-hydroxy-2- methyl-1-phenyl-propane-1-one (DAROCUR™ 1173); a mixed initiator (IRGACURE™ 500) of 50% of IRGACURE™ 184C and 50% of benzophenone; a mixed initiator (IRGACURE™ 1000) of 20% of IRGACURE™ 184C and 80% of DAROCUR™ 1173; 2-hydroxy-1-[4-(2- hydroxyethoxy)phenyl]-2-methyl-1-propanone (IRGACURE™ 2959); methylbenzoylformate (DAROCUR™ MBF); alpha, alpha-dimethoxy-alpha-phenylacetophenone (IRGACURE™ 651); 2- benzyl-2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl]-1-butanone (IRGACURE™ 369); a mixed initiator (IRGACURE™ 1300) of 30% of IRGACURE™ 369 and 70% of IRGACURE™ 651; Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (IRGACURE™ TPO), Ethyl (2,4,6- trimethylbenzoyl) phenyl phosphinate (IRGACURE™ TPO-L), propriety oxime ester compounds (N-1919, NCI-831, NCI-930, NCI-730, and NCI-100 supplied from Adeka Corporation), thioxanthen-9-one; 10-methylphenothiazine; isopropyl-9H-thioxanthen-9-one; 2,4-diethyl-9H- thioxanthen-9-one; 2-chlorothioxanthen-9-one; 1-chloro-4-propoxy-9H-thioxanthen-9-one; or a combination of two or more thereof. The photoradical initiators with the DAROCUR™ and IRGACURE™ brands are commercially available from BASF SE of Ludwigshafen, Germany. Alternatively, the photoradical initiator may be selected from the group consisting of F-1) 2-benzyl- 2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, F-2) benzophenone, F-3) a substituted benzophenone compound, F-4) acetophenone, F-5) a substituted acetophenone compound, F-6) benzoin, F-7) an alkyl ester of benzoin, F-8) a substituted phosphine oxide compound, F-9) xanthone, F-10) a substituted xanthone; and F-11) a combination of two or more of F-1) to F-10). The type of photoradical initiator is not specifically restricted, however, some photoradical initiators, such as those containing thioether groups, phosphinate groups, or phosphine oxide groups, may inhibit the hydrosilylation reaction catalyst, therefore, when such a photoradical initiator will be included, the appropriate amount of (E) hydrosilylation reaction catalyst need to be controlled and/or heating temperature/time may need to be adjusted. [0040] The amount of (F) the photoradical initiator in the Composition will depend on various factors including the desired reaction rate, the photoinitiator used, and the selection and amount of component (B) and its (meth)acryl content, however, the amount may be 0.1 part by mass to 10 parts by mass, alternatively 0.1 part by mass to 5 parts by mass, relative to 100 parts by mass of components (A), (B), (C), and (D) combined. [0041] Component (G) is a hydrosilylation reaction inhibitor that may be added to adjust the hydrosilylation reaction rate of the silicon atom-bonded hydrogen atoms and the silicon atom- bonded alkenyl groups of the components (e.g., components (A) to (D)) in the Composition. Component (G) includes, without limitation, an alkyne alcohol such as 2-methyl-3-butyn-2-ol, 3,5- dimethyl-1-hexyn-3-ol, 2-phenyl-3-butyn-2-ol, or 1-ethynyl-cyclohexan-1-ol (ETCH); an ene-yne compound such as 3-methyl-3-penten-1-yne or 3,5-dimethyl-3-hexen-1-yne; a cyclic alkenyl functional siloxane such as or 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7- tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane, tris[(1,1-dimethyl-2-propynyl)oxy]methylsilane; a maleate such as diallyl maleate; a fumarate such as diethyl fumarate or diallylfumarate; or a triazole such as benzotriazole. Alternatively, the inhibitor may comprise a silylated alkyne alcohol such as those disclosed in U.S. Patent 6,677,407. [0042] Component (G) may be used in the Composition in an amount ranging from 1 ppm to 5,000 ppm, alternatively 10 ppm to 2,000 ppm by mass relative to mass of components (A), (B), (C), and (D) combined. Without wishing to be bound by theory, it is thought that when the amount of component (G) is greater than or equal to the lower limit of the aforementioned range, storage stability of the Composition is good, and when the amount of component (G) is less than or equal to the upper limit of the aforementioned range, curability via hydrosilylation reaction of the Composition at low temperatures is good. [0043] Component (H) is a solvent that may optionally be added to the Composition. The solvent may be added during preparation of the Composition, for example, to aid mixing and delivery of one or more components and/or the solvent may be added after preparation of the Composition, e.g., to facilitate coating the on a substrate, as described hereinbelow. When preparing the Composition, certain components may be delivered in solvent, such as component (A) or (D). Suitable solvents include organic liquids exemplified by, but not limited to, aromatic hydrocarbons, aliphatic hydrocarbons, ketones, esters, ethers, glycols, and glycol ethers. Hydrocarbons include benzene, toluene, xylene, naphtha, hexane, cyclohexane, methylcyclohexane, heptane, octane, decane, hexadecane, isoparaffin such as Isopar L (C11-C13), Isopar H(C11-C12), hydrogenated polydecene. Suitable ketones include, but are not limited to, acetone, methylethyl ketone, 2- pentanone, 3-pentanone, 2-hexanone, 2-heptanone, 4-heptanone, methyl isobutyl ketone, diisobutylketone, acetonylacetone, and cyclohexanone. Esters include ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, and isobutyl acetate Ethers include diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, 1,2-dimethoxyethane, and 1,4-dioxane. Solvents having both ester and ether moieties include 2-methoxyethyl acetate, 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, and 2-butoxyethyl acetate; ethers and esters further include, isodecyl neopentanoate, neopentylglycol heptanoate, glycol distearate, dicaprylyl carbonate, diethylhexyl carbonate, propylene glycol n-propyl ether, propylene glycol-n-butyl ether, ethyl-3 ethoxypropionate, propylene glycol methyl ether acetate, tridecyl neopentanoate, propylene glycol methylether acetate (PGMEA), propylene glycol methylether (PGME), dipropylene glycol methyl ether, or ethylene glycol n-butyl ether, octyldodecyl neopentanoate, diisobutyl adipate, diisopropyl adipate, propylene glycol dicaprylate/dicaprate, octyl ether, and octyl palmitate. Alternatively, the solvent may be selected from polyalkylsiloxanes, ketones, glycol ethers, tetrahydrofuran, mineral spirits, naphtha, or a combination thereof. Polyalkylsiloxanes with suitable vapor pressures may be used as the solvent, and these include hexamethyldisiloxane, octamethyltrisiloxane, hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, tris(trimethylsiloxy)methylsilane, tetrakis(trimethylsiloxy)silane, dodecamethylcyclohexasiloxane, octamethyltrisiloxane, decamethyltetrasiloxane, dodecamethylpentasiloxane, tetradecamethylhexasiloxane, hexadecamethylheptasiloxane, heptamethyl-3- {(trimethylsilyl)oxy)}trisiloxane, hexamethyl-3,3, bis{(trimethylsilyl)oxy}trisiloxane pentamethyl{(trimethylsilyl)oxy}cyclotrisiloxane, and combinations thereof. Polyalkylsiloxanes, such as 0.5 to 1.5 cSt polydimethylsiloxanes are known in the art and commercially available as DOWSIL™ 200 Fluids and DOWSIL™ OS FLUIDS, which are commercially available from Dow. Alternatively, the solvent may be selected from the group consisting of an aliphatic hydrocarbon, an aromatic hydrocarbon, an ether, an ester, and a solvent having both ether and ester moieties. Alternatively, the solvent may be selected from the group consisting of an aliphatic hydrocarbon and an aromatic hydrocarbon. [0044] The amount of solvent will depend on various factors including the type of solvent selected and the amounts and types of other components in the Composition. Alternatively, the amount of solvent may be 0 to 300 parts by weight, per 100 parts by weight of all components in the Composition. Alternatively, the amount of solvent may be 5 parts by weight to 300 parts by weight, alternatively 10 parts by weight to 300 parts by weight, and alternatively 5 parts by weight to 200 parts by weight, on the same basis. [0045] Component (I) is a free radical scavenger that may optionally be added to the Composition. Optional component (I) comprises a free radical scavenger (scavenger) that may be used to control or inhibit a radical reaction of the Composition. Because the Composition comprises component (B), a viable free radical scavenger may be present to prevent premature reaction of the (meth)acryloxy groups, for example, in storage and during hydrosilylation reaction to pre-cure the Composition before use of the active energy ray to fully cure the Composition and/or the pre-cured product thereof. Scavengers comprising phenolic compounds are one class of such materials that may be used in the Composition, including, for example, 4-methoxyphenol (MEHQ, methyl ether of hydroquinone), hydroquinone, 2-methylhydroquinone, 2-t- butylhydroquinone, t-butyl catechol, butylated hydroxy toluene, and butylated hydroxy anisole, combinations of two or more thereof. Other scavengers that may be used include phenothiazine and anaerobic inhibitors, such as the NPAL type inhibitors (tris-(N-nitroso-N-phenylhydroxylamine) aluminum salt) from Albemarle Corporation, Baton Rouge, La. Alternatively, the free radical scavenger may be selected from the group consisting of a phenolic compound, phenothiazine and an anaerobic inhibitor. Free radical scavengers are known, for example, in U.S. Patent 9,475,968, and are commercially available. An amount of scavenger in the Composition will depend on various factors including the type and amount of component (B), however the scavenger may be present in an amount of 1 to 5,000 ppm by mass, alternatively in an amount of 10 to 1,000 ppm by mass, or alternatively in an amount of 50 to 500 ppm by mass, each relative to 100 mass parts of combined amounts of components (A) to (I) of the Composition. [0046] The Composition can be prepared by a method comprising combining all components by any convenient means such as mixing at RT, or at elevated temperature, provided that the elevated temperature is less than that required to effect hydrosilylation reaction. The hydrosilylation reaction inhibitor may be added before the hydrosilylation reaction catalyst, for example, when the Composition will be prepared at elevated temperature and/or the Composition will be prepared as a one part Composition. [0047] Alternatively, the Composition may be prepared as a multiple part Composition, for example, when the Composition will be stored for a period of time before use. In the multiple part Composition, (E) the hydrosilylation reaction catalyst is stored in a separate part from any component having a silicon bonded hydrogen atom, for example component (B2) and/or component (C), and the parts are combined shortly before use of the Composition. For example, a two part Composition may be prepared by combining components comprising component (C) the organohydrogensiloxane oligomer, all or a portion of components (A) the organopolysiloxane resin and (B) the Ma Polymer, and optionally all or a portion of (H) the solvent, component (D) the alkenyl-functional organopolysiloxane, when present, and optionally one or more other additional components described above to form a base part, by any convenient means such as mixing. A curing agent part may be component (E) the hydrosilylation reaction catalyst. Alternatively, the curing agent part may be prepared by combining components comprising component (E) the hydrosilylation reaction catalyst and all or a portion of components (A) the organopolysiloxane resin, Component (B1) the Ma Polymer, and (H) the solvent, component (D) when present, and optionally one or more of the other additional components described above, by any convenient means such as mixing. The components may be combined at ambient or elevated temperature. Component (G) the hydrosilylation reaction inhibitor may be included in one or more of the base part or a separate additional part. Component (A), the organopolysiloxane resin, may be added to the base part, the curing agent part, or a separate additional part. Component (F) the photoradical initiator and component (I) the free radical scavenger, when present, may be added to the base part or a separate additional (e.g., third) part. When a two part Composition is used, the weight ratio of amounts of base part to curing agent part may range from 1:1 to 1000:1. [0048] The Composition can be used to form a pre-cured product and a fully-cured product, as follows. The pre-cured product is obtained by effecting hydrosilylation reaction of the Composition described above, which is typically performed in a process comprising heating the Composition. The term “pre-cured” denotes a state where the product of the Composition is partially crosslinked, but not being a fully crosslinked network. Pre-cured also denotes a state having middle physical properties between the (un-cured) Composition and the fully-cured product. The fully-cured product forms after both heating to effect hydrosilylation reaction and irradiation with the active energy ray. [0049] The pre-cured product may have a tack-free, or low tack, surface. Without wishing to be bound by theory, it is thought that the pre-cured product will have an undesirably tacky surface if storage modulus is less than 50 kPa. Therefore, the pre-cured product may have a storage modulus G' at 25°C is ≥ 50 kPa, alternatively 50 kPa to 4,100 kPa at 25 °C, at the condition of frequency = 1 Hz, Strain = 0.5%, and the temperature showing the maximum value of loss factor is over 60 ⁰C. The pre-cured product may have a temperature showing a maximum loss factor greater than 73 °C and less than 150 °C. The pre-cured product may have a loss factor greater than 0.7 to 2.4. The pre-cured product may have a peel adhesion strength ranging from 2 gf/in to 4 gf/in. Without wishing to be bound by theory, it is thought that this combination of properties may provide good lamination property of the pre-cured product on an uneven surface, such as an uneven surface having electrode bumps. Furthermore, without wishing to be bound by theory, it is thought that if the temperature showing the maximum value of loss factor and its value of loss factor are equal to or above the lower limits of the ranges described above, the Composition will have good handleability, a pre-cured product obtained by heating the Composition will have tack-free, or low tack, surface, and low peel adhesion strength, whereas if the temperature showing the maximum value of loss factor and its value of loss factor are equal to or below the upper limits of the ranges described above, the obtained pre-cured product will be deformable enough to cover uneven surface by applying pressure (e.g., pressure sufficient to deform the pre-cured product to conform to the uneven surface without damage to the uneven surface and the features thereon). The peel adhesion of the pre-cured product is not limited, typically the peel adhesion to stainless steel of less than less than 10 gram force per inch is suitable. [0050] A fully-cured product of the present invention may be obtained by irradiating the pre- cured product described above with an active energy ray. Examples of the active energy ray used to fully cure the pre-cured product include ultraviolet (UV) light and visible light. Typically, light with a wavelength ranging from 250 nm to 500 nm is used to fully cure the pre-cured product. Without wishing to be bound by theory, it is thought that excellent curability can be achieved without decomposition of the fully-cured product by the active energy ray. [0051] The state of the fully-cured product is not limited, however, the cured product may be an elastomer. In particular, a shear storage modulus G' of the fully-cured product at 25 °C may range from 100 kPa to 10,000 kPa, alternatively 100 kPa to 5,000 kPa at the condition of frequency = 1 Hz, Strain = 0.5 %. When the fully-cured product is within the range described above, good cohesive strength against deformation and good flexibility against material fracture may be obtained. The fully-cured product no longer has a deformable property as described above for the pre-cured product. And, the peel adhesion of the fully-cured product to stainless steel is less than 10 gram force per inch. A level of adhesion is maintained after exposed to high temperature such as 120 °C for 1 hour. [0052] A method of producing the fully-cured product described above may comprise: 1) heating Composition described above to form a layer of a pre-cured product on a base film, where the pre- cured product has a surface opposite the base film; 2) contacting the surface of the pre-cured product and a target substrate having an uneven surface, and applying pressure to the base film, thereby deforming the pre-cured product to conform to the uneven surface, and 3) exposing the pre-cured product to an active energy ray. [0053] The method may optionally further comprise an additional step, such as pre-treating the base film before applying the Composition and heating in step 1). Pre-treating may improve adhesion of the layer of the pre-cured product to the base film. Pre-treating may be done by any convenient means, such as applying a primer to the base film, or by subjecting the base film to plasma treatment, corona-discharge treatment, and/or etching before applying the Composition to the base film. Applying the Composition to the base film can be performed by any convenient means. For example, the Composition may be applied onto a base film by gravure coater, offset coater, offset-gravure coater, roller coater, reverse-roller coater, air-knife coater, or curtain (slot- die) coater. The method may optionally further comprise removing all, or a portion, of (H) the solvent (when present) before and/or during hydrosilylation reaction. Removing solvent may be performed by any convenient means, such as heating at a temperature that vaporizes the solvent without effecting hydrosilylation reaction of the Composition sufficient to pre-cure the composition, e.g., heating at a temperature of 70 °C to 120 °C, alternatively 50 °C to 100 °C, and alternatively 70 °C to 80 °C for a time sufficient to remove all or a portion of the solvent (e.g., 30 seconds to 1 hour, alternatively 1 minute to 5 minutes). [0054] In the step 1), the Composition is heated to effect hydrosilylation reaction. Typically, the cure rate can be controlled by the amounts and the ratio of components (E) and (G), and the temperature can be > RT to 180 °C, alternatively 80 °C to 150 °C. The thickness of the silicone layer is not limited, however, the thickness may be 10 micrometers to 1,000 micrometers, alternatively 50 micrometers to 500 micrometers. The base film can be any material that can withstand the curing conditions (described herein) used to cure the Composition to form the layer of the pre-cured product. For example, any base film that can withstand heat treatment at a temperature equal to or greater than 120 °C, alternatively 150 °C may be suitable. Examples of materials suitable for base films including plastic films such as polyetheretherketone (PEEK), polyethylene naphthalate (PEN), liquid-crystal polyarylate, polyamideimide (PAI), polyether sulfide (PES), polyethylene terephthalate (PET), polyethylene (PE), or polypropylene (PP). The thickness of the base film is not critical; however, the thickness may be 10 micrometers to 200 micrometers, alternatively 25 micrometers to 100 micrometers. [0055] In the step 2), the pre-cured product is deformed to conform to an uneven surface of a target substrate by pressure as the pre-cured product has a deformable (thermoplastic) property. When pressure is applied to the base film, and thereby to the pre-cured product, to conform to the uneven surface of the target substrate, the applied pressure can be 0.05 MPa to 2 MPa, alternatively 0.1 MPa to 1 MPa. To remove voids (e.g., to obtain a bubble free laminate after step 2), vacuum may be applied during step 2), particularly when the target substrate has complex three-dimensional features on its uneven surface. Pressure may be 25 torr or less, alternatively 5 torr or less. [0056] The uneven surface may have a line-shaped, a round (circle)-shaped, or a rectangular- shaped pattern, and its pattern can be concave or convex. The width of a line, the diameter of a round circle, and the one side of a rectangular can be 0.1 μm to 1 mm. The height of the thickness unevenness applied on the member is not particularly limited but may range from 0.1 μm to 100 μm or less. Moreover, from the viewpoint of the effect of thin film formation and recovery of the thickness unevenness, the ratio of thickness of the silicone layer to the height of the thickness of the unevenness (thickness of silicone layer/height of thickness unevenness) may be 1.1 to 5, alternatively 1.5 to 4. Particular examples of lamination on uneven surface in an industrial field are described in U.S. Patent 8,920,592; U.S. Patent Publication US2013/0115450A1; U.S. Patent 6,906,425 to Stewart; U.S. Patent 6,000,603; PCT Patent Application Publication WO2015182816 (electronic devices); and U.S. Patent Publication US2019/0148598 (Micro assembled optical devices). The Composition described herein may be used in these examples instead of the adhesives used therein. Alternatively, the two-step curable silicone composition and method for its preparation and use described herein may be in place of the hot melt adhesives described in PCT Patent Publications WO2016/021759, WO2016/175365, and WO2018/169280. [0057] In step 3), the pre-cured product is exposed to an active energy ray, e.g., by means of a UV LED lamp, to form a fully-cured product by further crosslinking reaction of the (meth)acryl groups in the pre-cured product. The fully-cured product obtained in step 3) is not deformable at the pressures above for step 2), and the fully-cured product has thermal stability. In step 3), curing may be ultraviolet-curing conducted by ultraviolet irradiation. Using the active energy ray in step 3) may comprise ultraviolet irradiation and can be performed using a general ultraviolet irradiation apparatus, for example, a face type or a conveyer belt-type ultraviolet irradiation apparatus, where a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a xenon lamp, a metal halide lamp, an electrodeless lamp, an ultraviolet light-emitting diodes or the like is used as the light source. The ultraviolet irradiation dose may be 0.1 to 5 W/cm² for 5 to 120 seconds (= 0.5 to 600 J/cm²). Alternatively, to control cure rate precisely, a UV LED lamp may be used. Typical wavelengths of a UV LED lamp are 365, 385, 395 and 405 nm. Alternatively, 365 nm and 395 nm may be used. Irradiation dose is sufficient to fully-cure the product and may range from 0.1 J/cm² to 200 J/cm², or alternatively 1 J/cm² to 100 J/cm². [0058] The Composition described herein is useful to form a laminate on various target substrates having structured (uneven) surfaces in electronic devices, optical devices, or image displays; wherein a laminated, fully-cured product is obtained by ultraviolet irradiation. The electronic device may be for example, a semiconductor device. Examples of the semiconductor device include semiconductor packages such as a ball grid array (BGA) package, a pin grid array (PGA) package, or a land grid array (LGA). During the process requiring protection of electrode bumps on a surface of a semiconductor device, the Composition is useful to protect the electrode bumps by dry lamination of the pre-cured product and achievement of thermal stability by irradiation to provide the fully-cured product to withstand the harsh process conditions for fabrication of the semiconductor device. The present invention is an advanced solution against typical single (heat) curable compositions in this industrial field, and may be used for example, in semiconductor fabrication processes exemplified in PCT Patent Publication WO2018169280A1, PCT Patent Publication WO2016021759A1, or Korean Patent KR101689018B1). [0059] Figure 1 shows a flow diagram of an example for use of the two-step curable silicone composition in fabrication of a ball grid array package (101). The unshielded ball grid array package 101 has a plurality of electrodes which form an uneven surface 102. The Composition of the present invention is formed in a layer on a surface 104 of a base film 105 as the substrate. The Composition is heated to form a pre-cured silicone layer 103 on the surface 104 of the substrate 105. Pressure (shown by arrow 106) is then applied to the unshielded ball grid array package 101 to contact the uneven surface 102 with the pre-cured silicone layer 103. The precured silicone layer 103 deforms. The pre-cured silicone layer 103 is then irradiated and cures to form a fully-cured silicone layer 103a and protects the uneven surface 102 during processing of the unshielded ball grid array package 101, shown here as sputtering via plasma enhanced chemical vapor deposition to deposit an EMI shielding layer 107 on the exterior of the unshielded ball grid array package 101, thereby preparing a ball grid array package having EMI shielding 108. EXAMPLES [0060] The following examples are provided to illustrate the invention to one of ordinary skill in the art and are not to be interpreted as limiting the scope of the invention set forth in the claims. The components used in these examples are summarized below in Table 1. Table 1 – Components Component Chemical Description Source (A-1) [(CH3)3SiO1/2]0.40[(CH2=CH)(CH3)2SiO1/2]0.04(SiO4/2)0.56

Component Chemical Description Source M^HM^H 1,1,3,3-Tetramethyldisiloxane Dow d

as follows: In a 2 L receiving flask, 300.0 g of 3-methacryloxypropylmethyldimethoxysilane, 239.2 g of 0.01N HCl and 0.09 g of butylated hydroxytoluene were mixed on a rotary evaporator at room temperature for 5 minutes before pulling vacuum (30 mmHg) at 80 °C for 2 hours to remove methanol/H2O.19.6 g of the hydrolyzed product, 254.9 g of octamethylcyclotetrasiloxane, 2.6 g of 1,3-divinyltetramethyldisiloxane and 1.27 g of 11.4 wt% butylated hydroxytoluene in toluene were then added to a 1L 4-neck round bottom flask and heated to 40 °C before adding 210 μL of trifluoromethanesulfonic acid (1000 ppm) to catalyze the equilibration and condensation reaction. The pot temperature was then raised to 87-88 °C and stirred for 3 hours while open to air. The heating block was then removed and 4.2 g of CaCO3 was added at 80 °C. The pot temperature dropped to 24 °C after 3 hours and CaCO3 was filtered out with a 0.45 μm membrane. Volatiles were then removed by rotary evaporation at 100 °C at 2-4 torr for 2 hours. The final sample was clear and colorless, and the composition was analyzed by ¹H and ²⁹Si NMR, which showed component B1-1 in Table 1 above. [0062] In this Reference Example 2, component (B2-1) was prepared as follows: 342.9 g of MAPMDMS and 267.8g of 0.1N HCl were mixed in a 1000 ml receiving flask.0.10 g of BHT inhibitor was added. The mixture was heated to 35 °C for 3.5 hours under vacuum to remove methanol and unreacted water.276.5 g clear liquid was collected in an amble bottle stored in the freezer. 38.3 g of the above intermediate, 122.6 g of octamethylcyclotetrasiloxane, 27.4 g of 1,1,3,3-Tetramethyldisiloxane, and 0.11 g BHT were added into a 500 ml 4-neck flask equipped with a mechanical stirrer, a thermocouple, and a water-cooled condenser. Pot temperature was raised to 50 °C and 105 µl of trifluoromethanesulfonic acid (1000 ppm) was added to catalyze the condensation and equilibration reaction. The pot temperature was raised to 87-88°C. ~100 ml/min air was used to purge the system during the course of the reaction to maintain the inhibitor activity. After 2 hours, heat was removed and 2.8 g of CaCO3 was added to the flask at 80 °C. After 2 hours 45 minutes, pot temperature dropped to 24 °C. CaCO3 was filtered out through a 0.45 µm membrane (filtration was normal).180.0 g after filtration. Volatiles were removed via rotary evaporator at 100 °C and < 3 torr for 1.5 hour. Yield was 158.6 g. Wt loss from volatiles =11.9%. The composition was analyzed by ¹H and ²⁹Si NMR, which showed component B2-1) in Table 1 above. [0063] In this Reference Example 3, component (B2-2) described above was prepared as follows: In a 2 L receiving flask, 300.0 g of 3-methacryloxypropylmethyldimethoxysilane, 239.2 g of 0.01N HCl and 0.09 g of butylated hydroxytoluene were mixed on a rotary evaporator at room temperature for 5 minutes before pulling vacuum (30 mmHg) at 80 °C for 2 hours to remove methanol/H₂O. 120.0 g of the hydrolyzed product, 323.4 g of octamethylcyclotetrasiloxane, 47.3 g of 1,1,3,3- tetramethyldisiloxane and 4.0 g of 10.0 wt% butylated hydroxytoluene in toluene were then added to a 1L 4-neck round bottom flask and heated to 40 °C before adding 284 μL of trifluoromethanesulfonic acid (1000 ppm) to catalyze the equilibration and condensation reaction. [0064] The pot temperature was then raised to 87-88 °C and stirred for 3 hours while under an N₂/Air sweep. The heating block was then removed and 5.7 g of CaCO3 was added at 80 °C. The pot temperature dropped to 24 °C after 3 hours and CaCO3 was filtered out with a 0.45 μm membrane. Volatiles were then removed by evaporating using a rotary evaporator at 100 °C at 2-4 torr for 2 hours. The final sample was clear and colorless, and the composition was analyzed by ¹H and ²⁹Si NMR, which showed component B₂-2) in Table 1 above. [0065] In this Reference Example 4, two-step curable siloxane compositions were prepared as follows: The following components were mixed to uniformity in the quantities shown in Tables 2 and 3 to produce two-step curable silicone compositions. A solution of component (A) dissolved in (H) the xylene solvent was prepared. Components (B), (C), (D) and (G) were added to the solution of component (A) dissolved in (H) the solvent, and the resulting composition was mixed at room temperature to form a mixture. Additionally, components (E) the hydrosilylation reaction catalyst and (F) the photoradical initiator were added to this mixture and mixed at room temperature. The resulting two-step curable silicone compositions are described below in Tables 2 and 3, where amount of each component is in weight parts. The “SiH/Vi ratio” in each of Tables 2 and 3 indicates a molar ratio of all silicon atom-bonded hydrogen atoms relative to all silicon atom- bonded vinyl groups in components (A) to (E), not including (meth)acryl groups). Furthermore, the “(Meth)acryl content” abbreviated MA mmol/100g in each of Tables 2 and 3 indicates a content of methacryloxypropyl group relative to a total mass of components (A) to (D). [0066] In this Reference Example 5, measurement of Shear Storage Modulus and Loss Factor were performed as follows. For Comparative Examples (Comp.) 1 to 7 and Working Examples 1 to 6, each two-step curable silicone composition was applied onto a fluorosilicone-coated polyethylene terephthalate (releasable PET, 50 µm) film for forming a pre-cured silicone layer which, after heat curing for 3 minutes at 150 °C, had a thickness of 350 μm. After storing for 1 day, the fluorosilicone-coated polyethylene terephthalate was removed, and the pre-cured silicone layer was mounted onto a parallel-plate geometry (25 mm) of a rheometer (AtonParr™ MCR-502). Then, the shear storage modulus and loss factor were collected at a fixed frequency of 1 Hz with a strain of 0.5 % and a normal force of 1 N in a range from 0 °C and 150 °C. [0067] To measure shear storage modulus of a fully-cured silicone layer on fluorosilicone-coated PET, the pre-cured silicone layer was prepared by the above same manner and then pasted onto a fluorocoated PET film by means of a laminator. The resulting laminate was further cured by UV irradiation to obtain a fully-cured silicone layer. The condition for UV irradiation was 1 W/cm² by 365 nm LED lamp (FireJet™ FJ100) for 30 seconds. The fully-cured silicone layer was mounted onto a parallel-plate geometry (25 mm) of a rheometer (AtonParr™ MCR-502). Then, the shear storage modulus (G′) and loss factor were collected at a fixed frequency of 1 Hz with a strain of 0.5 % and a normal force of 5 N in a range from 0 °C and 150 °C. [0068] In this Reference Example 6, Lamination Performance on even surfaces was evaluated as follows. Each two-step curable silicone composition prepared as described above was applied onto a corona-treated polyethylene terephthalate (releasable PET, 50 µm) film and heated for 3 minutes at 150°C. After storing for 1 day, the resulting pre-cured silicone layer was cut to 20 mm X 20 mm, and mounted on a surface having a bump electrode structure of semiconductor device. The dimensions of the bump electrode were as follows: diameter = 12.6 µm, ball height = 8.7 µm, center pitch = 25.7 µm). [0069] The tape strips were bonded to the BGA packages using a laminator at the condition of RT by pressure. The pressure of 0.5 MPa was applied on each laminate. After pulling out the laminate from the laminator and after 2 hours (wait), it was transferred to UV curing machine, and were then UV irradiated from the top of base film. (The UV irradiating condition was as follows: 365 nm LED (FireJet™ FJ100). Power = 1 W/cm², Time = 30 seconds). After 1 hour, visual inspection was conducted to check whether the fully-cured silicone layer was well-laminated, without any delamination and/or voids. Visual inspection results are shown in Tables 2 and 3, below. A value of ‘A’ means the sample passed the test and had no delamination and no voids. A value of ‘F’ means the sample failed the test and had partial delamination and/or a void. [0070] In this Reference Example 7, Peel Adhesion Strength was measured on the pre-cured and fully-cured silicone layers. Each sample of a two-step curable silicone composition was applied onto a corona-treated polyethylene terephthalate (releasable PET, 50 µm) film and heated for 3 minutes at 150 °C to form a pre-cured silicone layer. The obtained sheet was pasted onto a fluorosilicone-coated polyethylene terephthalate film by means of a laminator, and the resulting laminate was aged for 1 day at RT. The resulting sheet was cut into tape strips 2.54 cm (1 inch) wide. After fluorosilicone-coated polyethylene terephthalate film was removed, it was placed on a stainless steel plate and bonded thereto by moving a rubber-lined pressure roller of 2 kg weight on the strip twice back and forth. The resulting assembly was held at room temperature for 1 hr. The adhesion force (g/inch) required to peel the pre-cured silicone layer (sheet) off from the plate was measured by pulling at a speed of 300 mm/min and an angle of 180°. The adhesion force (g/inch) of the fully-cured silicone layer required to peel the silicone layer (sheet) off from the plate was measured after UV irradiation by pulling at a speed of 300 mm/min and an angle of 180°. The UV irradiating condition was: 365 nm LED (FireJet™ FJ100). Power = 1 W/cm², Time = 30 seconds. [0071] To measure adhesion stability when exposed to high temperature, the assembly of the fully-cured silicone layer and stainless steel plate was aged for 1 hours at 120 °C. Then, the adhesion force (g/inch) was measured in the same manner. The results are below in Tables 2 and 3. Table 2 – Comparative Examples Comp. Comp. Comp. Comp. Comp. C Com Component ^Comp. omp. E_{x 1} Ex 2 Ex 3 Ex 4 Ex 5 Ex 6 Ex 7 p. 0 5 ck

Comp. Comp. Comp. Comp. Comp. Comp Com Component ^Comp. . E_{x. 1} Ex.2 Ex.3 Ex.4 Ex.5 Ex.6 Ex.7 p. E 8

Component Ex .1 Ex .2 Ex .3 Ex .4 Ex .5 Ex .6 (A-1) M04 M^Vi004

Pre-cured After H_{eat Cure} ^{Ex .1 Ex .2 Ex .3 Ex .4 Ex .5 Ex .6}

Table 4 – Performance Target Ranges Pre-cured After Heat Cure Lower Limit Upper Limit ’ °

Adhesion [gf/in] After UV followed by 120 ºC 60 min Lower is better < 10 g/in

present invention that provide a (heat) pre-cured silicone product (which may be a non- or tacky- less and deformable silicone layer) having relatively high shear storage modulus (i.e., greater than 50 kPa and less than 4,100 kPa at 25 °C); a temperature showing a maximum loss factor greater than 73 °C and less than 150 °C; its loss factor greater than 0.7 to < 2.5; and a peel adhesion strength in a range of 2 to 4 gf/in, which provides good lamination property on an uneven surface having electrode bumps. [0073] Working Examples 1-6 also show that upon further curing the pre-cured silicone layers using ultraviolet (UV) light, the resulting fully-cured silicone product (in the form of the fully-cured silicone layer) had shear storage modulus greater than 560 kPa and less than 2,100 kPa at 25 °C; a temperature showing a maximum loss factor greater than or equal to 107 °C and less than 144 °C; its loss factor greater than 0.3 to less than 0.6; a peel adhesion strength in a range of 2 gf/in to 4 gf/in. After aging of the fully-cured product at 120 °C for 1 hr, it still maintained adhesion strength less than 10 gf/in. [0074] Comparative Examples 1 and 2 illustrate that two-step curable silicone compositions containing comparative component (C’-2), a bis-SiH terminated polydimethylsiloxane (instead of an aryl-functional organohydrogensiloxane oligomer), resulted in both an undesirably tacky pre- cured silicone layer, each sample having low modulus (11~19 kPa) and low temperature at maximum loss factor by heat cure, which led high adhesion strength over 10 g/in. [0075] Comparative Examples 3 and 4 illustrate that two-step curable silicone compositions containing lower amount of component (A-1), i.e., less than 55 wt%, resulted in both an undesirable tacky surface on the pre-cured silicone product (layer) having low modulus (e.g., 4-10 kPa) and low temperature of less than 60 °C at maximum loss factor by heat cure, which led high adhesion strength, i.e., over 10 g/in. [0076] Comparative Examples 5 illustrates that a two-step curable silicone composition having SiH/Vi ratio over 0.9 resulted in a lower maximum loss factor of less than 0.55 after heat cure, which led to poor lamination property on the uneven surface. [0077] Comparative Examples 6 and 7 illustrate that two-step curable silicone compositions including comparative component (A’-2), a non-functional MQ resin (which did not have silicon bonded alkenyl groups), led to poor adhesion stability after heat exposure. [0078] Comparative Example 8 illustrates that two-step curable silicone compositions containing higher amount of component (A-1), i.e., greater than 82 wt%, resulted in crack formation after heat cure due to an undesirable brittleness of the pre-cured silicone product (layer). [0079] The inventors surprisingly found that a two-step curable silicone composition as described herein cures to form pre-cured silicone products (layers) and fully cured silicone products (layers), which have a beneficial combination of properties shown as the performance target ranges in Table 4, above. [0080] The SUMMARY and ABSTRACT are hereby incorporated by reference. All amounts, ratios, and percentages are by weight unless otherwise indicated by the context of the specification. The articles ‘a’, ‘an’, and ‘the’ each refer to one or more, unless otherwise indicated by the context of the specification. The disclosure of ranges includes the range itself and also anything subsumed therein, as well as endpoints. Similarly, the disclosure of Markush groups includes the entire group and also any individual members and subgroups subsumed therein. For example, disclosure of the Markush group a vinyl, allyl or hexenyl includes the member vinyl individually; the subgroup vinyl and hexenyl; and any other individual member and subgroup subsumed therein. Abbreviations used in this application are as defined below in Table 5. Table 5 Abbreviation Definition °C degrees Celsius

Abbreviation Definition mW milliwatt

ave age o ecu a o u a o s a g a e a s a , suc as ose e oned in Table 1 was determined via NMR Analysis based on the following ²⁹Si-NMR and ¹H-NMR analysis: NMR apparatus: Fourier Transform Nuclear Magnetic Resonance Spectrometer JEOL™ (JEOL is a registered trademark of JEOL Ltd. Japan) JNM-EX400 (the product of JEOL Ltd.). Determination method: Integrated values of the peaks were calculated based on signals derived from ²⁹Si for various siloxane units shown below. An average molecular formula was identified by finding ratios of the integrated signal values obtained for various siloxane units (M, D, T, and Q units) and then finding siloxane-unit ratios based on the determined signal ratios. Due to overlap of chemical shift of Me2SiO2/2 units and MaMeSiO2/2 unit in ²⁸Si-NMR, the ratio of Me2SiO2/2 (D) and MaMeSiO2/2 (D’) to obtain m/n ratio was determined by ¹H-NMR. The contents of Reactive Group including unsaturated bonds and (meth)acryl groups was derived from an average molecular formula.

Claims

CLAIMS: 1. A two-step curable silicone composition comprising: (A) an organopolysiloxane resin represented by average unit formula: (R¹3SiO1/2)a(R²R¹2SiO1/2)b(SiO4/2)c(HO1/2)d, wherein each R¹ is an independently selected alkyl group; each R² is an independently selected alkenyl group; and subscripts a, b, and c are mole fractions of each siloxy unit in the formula; subscripts a, b, c and d have values such that a ≥ 0, b > 0, 0.3 ≤ c ≤ 0.7, and a quantity (a + b + c) = 1; and subscript d represents the amount of silicon bonded hydroxyl groups in the formula and has a value such that 0 ≤ d ≤ 0.05; (B) a (meth)acryloxyalkyl-functional organosiloxane polymer selected from the group consisting of (B1) an organosiloxane polymer having two silicon atom-bonded alkenyl groups and at least one silicon atom-bonded (meth)acryloyloxyalkyl group per molecule, (B₂) an organosiloxane polymer having two silicon atom-bonded hydrogen atoms and at least one silicon atom-bonded (meth)acryloyloxyalkyl group per molecule, and (B₃) a mixture of components (B₁) and (B₂); (C) an organohydrogensiloxane oligomer having at least one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded aryl group per molecule and a viscosity less than or equal to 1,000 mPa·s measured using a type B viscometer according to ASTM D 1084 at 23 ± 2 °C; optionally (D) an alkenyl-functional organopolysiloxane free of silicon atom-bonded aryl groups and SiO_4/2 units; (E) a hydrosilylation reaction catalyst; (F) a photoradical initiator; (G) a hydrosilylation inhibitor; optionally (H) a solvent; and optionally (I) a free radical scavenger; where component (A) is present in an amount ranging from 55 mass % to 75 mass % based on a total mass of components (A), (B), (C), and (D); component (B) is present in an amount ranging from 10 mass % to 30 mass % based on the total mass of components (A), (B), (C), and (D); component (C) is present in an amount ranging from 0.1 mass % to 10 mass % based on the total mass of components (A), (B), (C), and (D); component (D) is present in an amount ranging from 0 to 25 mass % based on the total mass of components (A), (B), (C), and (D); component (E) is present in an amount sufficient to provide 0.1 ppm to 500 ppm of a platinum group metal by mass relative to 100 parts by mass of components (A), (B), (C), and (D) combined; component (F) is present in an amount ranging from 0.01 to 10 parts by mass relative to 100 parts by mass of components (A), (B), (C), and (D) combined; component (G) is present in an amount ranging from 1 ppm to 5,000 ppm by mass relative to mass of components (A), (B), (C), and (D) combined; component (H) is present in an amount ranging from 0 to 300 parts by mass relative to 100 parts by mass of components (A), (B), (C), and (D) combined; and component (I) is present in an amount of 0 to 1,000 ppm by mass, relative to combined amounts of all starting materials in the composition; and with the provisos that a molar ratio of silicon atom-bonded hydrogen atoms relative to silicon atom bonded- alkenyl groups in components (A) to (E) is 0.29/1 to less than 0.9/1; and component (B) is used in an amount such that a content of the (meth)acryloxyalkyl group is 5 mmol/100 g or more relative to a total mass of components (A) to (D). 2. The composition of claim 1, wherein in (A) the organopolysiloxane resin, each R¹ is methyl, each R² is vinyl, subscripts a, b, c, and d have values such that 0.1 ≤ a ≤ 0.5, 0.01 ≤ b ≤ 0.2, 0.4 ≤ c ≤ 0.7, 0 ≤ d ≤ 0.05, and the organopolysiloxane resin has a number average molecular weight of 3,000 g/mol to 5,500 g/mol. 3. The composition of claim 1 or claim 2, wherein component B₁) comprises unit formula: (R²R⁶2SiO1/2)2(R⁶2SiO2/2)n(R⁶R³SiO2/2)m, where each R² is an independently selected alkenyl group; each R⁶ is independently selected from the group consisting of an alkyl group and an aryl group; R⁴ each R³ is a (meth)acryloxyalkyl group of R⁴ is H or methyl, and 5

R is an alkylene group having 2 to 6 subscripts m and n represent average numbers of each difunctional siloxane unit per molecule in the unit formula for B₁), where subscript m is an integer of 1 to 500, subscript n is an integer of 1 to 1000, and .01 ≤ m/(n+m) ≤ 0.5. 4. The composition of any one of claims 1 to 3, where component B2) comprises unit formula: (HR⁶ ₂SiO_1/2)₂(R⁶ ₂SiO_2/2)_n(R⁶R³SiO_2/2)_m, where each R⁶ is independently selected from the group consisting of an alkyl group and an aryl group; R⁴ each R³ is a (meth)acryloxyalkyl group of , where

R⁴ is H or methyl, R⁵ is an alkylene group having 2 to 6 carbon atoms; and subscripts m and n represent average numbers each difunctional siloxane unit per molecule in the unit formula for B₁), where subscript m is an integer of 1 to 500, subscript n is an integer of 1 to 1000, and 0.01 ≤ m/(n+m) ≤ 0.5. 5. The composition of any one of claims 1 to 4, wherein component (C) comprises unit formula: (HR⁷ ₂SiO_1/2)₂(R⁷ ₂SiO_2/2)_e, where each R⁷ is independently selected from an alkyl group or an aryl group, with the proviso that at least one R⁷, per molecule, is an aryl group, and subscript e is an integer with a value of 0 to 10. 6. The composition of any one of claims 1 to 5, where component (D) is present and comprises unit formula: (R²R¹ ₂SiO_1/2)₂(R¹ ₂SiO_2/2)_f, where each R¹ is an independently selected alkyl group, each R² is an independently selected alkenyl group, and subscript f represents average number of difunctional siloxane units per molecule, and subscript f is an integer ranging from 10 to 10,000. 7. The composition of any one of claims 1 to 6, wherein component (B) provides a (meth)acryl content of 5 mmol/100 g to 100 mmol/100 g, relative to a total mass of components (A), (B), (C), and (D). 8. A pre-cured product obtained by hydrosilylation reacting the composition according to any one of claims 1 to 7. 9. A fully-cured product obtained by exposing the pre-cured product according to claim 8 to an active energy ray. 10. A method for producing a fully-cured product, wherein the method comprising: 1) heating the composition of any one of claims 1 to 7 to form a layer of a pre-cured product on a base film, where the layer of the pre-cured product has a surface opposite the base film; 2) contacting the surface of the layer of the pre-cured product and a target substrate having an uneven surface and applying pressure, thereby deforming the layer of the pre-cured product to conform to the uneven surface of the target substrate, and 3) exposing the layer of the pre-cured product to an active energy ray, thereby forming the fully-cured product. 11. Use of the method of claim 10 to protect an uneven surface during fabrication of a semiconductor device.