WO2025026595A1 - Assemblies for measuring the strength of an electric current, devices for measuring the strength of an electric current, and method for producing such devices - Google Patents

Abstract

The invention relates to an assembly (1) for tapping at least one electrical signal from a resistor arrangement (4), comprising an at least partially flat carrier element (2) for holding electronic components (6) for measuring an electrical signal, wherein the carrier element (2) has a top side (21) and a bottom side (22) and, at least on the top side (21) thereof, has conduit elements for conducting electrical signals, and at least one contact element (3, 31, 32) made of electrically conductive material, wherein the contact element (3, 31, 32) has a top side (33) and a bottom side (34) and, on the bottom side (34) thereof, a first region (35) and a second region (36) physically separated from said first region, wherein the contact element (3, 31, 32) is connected in the first region (35) thereof in a materially bonded manner over the entire area to the top side (21) of the carrier element (2) and wherein the contact element (3, 31, 32) is configured so that the second region (36) of the contact element (3, 31, 32) is able to be connected to a resistor arrangement (4) by means of at least one welded connection (5) such that the contact element (3, 31, 32) is able to tap at least one electrical signal from a resistor arrangement (4) when the resistor arrangement (4) is connected. The invention furthermore relates to an alternative assembly (10), to devices (11, 12) for measuring the strength of an electric current and to methods for producing such devices.

Description

Description

Assemblies for measuring the intensity of an electric current, devices for measuring the intensity of an electric current and methods for producing such devices

The invention relates to an assembly for tapping at least one electrical signal from a resistor arrangement, an assembly for magnetic field-based measurement of the strength of a current in an electrical conductor through which current flows, devices for measuring the strength of an electrical current and methods for producing such devices. In particular, the invention relates to the mounting of a circuit board on an electrical conductor or on a shunt resistor and the electrical contacting of the shunt resistor for tapping an electrical signal.

For current measurement in electronic circuits, measuring resistors are used that are connected in series with the component to be monitored. The current is determined according to Ohm's law from the voltage drop across the measuring resistor, known as the shunt resistor. The value of the resistance is assumed to be known. The correct and reliable measurement of the current is particularly important in a battery management system of an electric or hybrid vehicle, for example. A resistance arrangement used as a shunt resistor for measuring current strengths comprises at least one resistance element and two connection elements for connecting the resistance arrangement to an electrical circuit. The resistance element on the one hand and the connection elements on the other hand are made of different materials, usually metallic materials. The specific electrical resistance of the material of the resistance element can be at least a factor of 10 greater than the specific electrical resistance of the material of the connection elements. On the other hand, the magnitude of the temperature coefficient of resistance of the material of the connection elements is much larger, typically at least a factor of 50 greater than the magnitude of the temperature coefficient of resistance of the material of the resistance element. In particular, the magnitude of the temperature coefficient of resistance of the material of the resistance element can be less than 5 10' ⁵ 1/K, while the temperature coefficient of resistance of the material of the connection elements can be approximately 4-10 ^-3 1/K. The connection elements of the resistor arrangement can consist in particular of copper, a preferably low-alloyed copper alloy, of aluminum or a preferably low-alloyed aluminum alloy, or can comprise at least one of these materials. The resistance element can in particular be made of a copper alloy that is usually used as a resistance alloy. The connection elements and the resistance element of a resistor arrangement are in many cases each designed as plate- or strip-shaped elements and arranged next to one another in a row in a planar manner. The resistance element is connected mechanically and electrically conductively to a connection element on two opposite sides via a joint seam.

The voltage drop across a resistance element can be tapped, for example, via contact pins, wires or similar elements, which are usually arranged on both sides of the resistance element on the connection elements. Such contact pins can be soldered, pressed or welded onto the connection elements of the resistor arrangement. The voltage is recorded and processed by a measuring and evaluation electronics. Electronic components are provided for this purpose, which can be arranged on a circuit board. The circuit board can be located in the immediate vicinity of the resistor arrangement.

Alternatively, magnetic field-based sensors are also used for current measurement. Examples of these are Hall sensors and magneto-resistive sensors. These sensors use the magnetic field that surrounds an electrical conductor through which current flows to generate a signal that is a measure of the strength of the electrical current. Although it is not necessary to establish electrical contact between the sensor and the electrical conductor with a magnetic field-based sensor, the sensor must be positioned close to the electrical conductor at a certain distance. Furthermore, the sensor must be connected to measuring and evaluation electronics. The sensor and the measuring and evaluation electronics are usually mounted on a circuit board that is located in the immediate vicinity of the electrical conductor. Devices with magneto-resistive sensors are described, for example, in the publications EP 1 882 953 A1 and WO 2023/ 079 386 A1.

Both current measurement with shunt resistors and current measurement using magnetic field-based sensors require positioning a circuit board at a certain distance close to the measurement object and establishing at least mechanical contact between the circuit board and the measurement object.

A resistor arrangement with a low-resistance current measuring resistor is known from the publication DE 10 2009 031 408 A1. In this resistor arrangement, connection contacts are provided for tapping the voltage, which are formed by embossing and threading in the plate-shaped sections that serve to connect the resistor arrangement to the external circuit. The measuring leads for voltage measurement are connected to the connection contacts using cable lugs and fastening screws.

Furthermore, the publication US 10 163 553 B2 discloses a

Resistance arrangement with two plate-shaped elements for connecting the resistance arrangement to an external circuit and a strip-shaped resistance element. On both sides of the resistance element there is a hole in each of the two connection elements into which a contact pin is inserted. The contact pins are separate components that must be specially manufactured and added to the resistance arrangement.

With these devices known from the state of the art, it is necessary to use additional components in order to tap the voltage drop across the measuring resistor. This requires additional effort and costs. Furthermore, contact voltages can occur at the contact points of the individual components, which can distort the voltage signal.

Furthermore, the publication DE 11 2021 002 813 T5 contains a

A shunt resistor for current detection and in particular a voltage detection connection of the shunt resistor as well as a manufacturing process for such a shunt resistor are known. The connection between the measuring resistor and the circuit board is made by a melting material, so the connection is made by soldering. Special soldering systems and special knowledge of process control are required to solder a circuit board onto the measuring resistor. The large thermal mass of the measuring resistor plays an important role here. Vapor phase soldering systems are preferred nowadays as an alternative to reflow convection soldering systems. The process in vapor phase soldering systems is However, they are expensive and difficult to integrate into the other steps of the manufacturing process. Furthermore, substances are used in vapor phase soldering systems whose use is controversial, which is why a ban on these substances is threatened.

In view of the disadvantages of the manufacturing processes established today, there is a need to modify devices for measuring the strength of an electric current so that they can be manufactured using alternative methods. The invention is therefore based on the object of specifying an assembly by means of which a resistor arrangement can be mechanically and electrically contacted in a cost-effective manner. The invention is also based on the object of specifying an assembly by means of which a magnetic field-based current sensor can be positioned in the vicinity of an electrical conductor in a cost-effective manner. The invention is also based on the object of specifying devices for measuring the strength of an electric current and methods for producing such devices.

The invention is represented with respect to a first assembly by the features of claim 1, with respect to a second assembly by the features of claim 2, with respect to a first device by the features of claim 9, with respect to a second device by the features of claim 10, with respect to a first method by the features of claim 12 and with respect to a second method by the features of claim 13. The further dependent claims relate to advantageous embodiments and developments of the invention.

A first aspect of the invention relates to an assembly, i.e. an arrangement of components, for tapping at least one electrical signal from a resistor arrangement. The assembly comprises as a first component an at least partially flat carrier element for accommodating electronic components for measuring an electrical signal. The carrier element has a Top side and a bottom side. At least on the top side of the carrier element there are conduction elements, in particular conductor tracks, for conducting electrical signals. The assembly further comprises, as a second component, at least one contact element made of electrically conductive material, preferably copper. The contact element has a top side and a bottom side. On its bottom side, the contact element has a first, preferably flat area and a second, preferably flat area that is spatially separated from it. The contact element is connected in its first area in a material-locking and flat manner to the top side of the carrier element. The connection is preferably a soldered connection. The contact element is configured such that its second area can be connected to a resistor arrangement by means of at least one welded connection. Thus, when the assembly is connected to a resistor arrangement, at least one electrical signal can be tapped from the resistor arrangement through the contact element.

In order to tap an electrical signal, in particular a voltage signal, from a resistor arrangement, a carrier element, for example a circuit board, can be positioned on the resistor arrangement and electrically connected to the resistor arrangement. The carrier element serves to accommodate electronic components, with which at least the top of the carrier element can be equipped. The top of the carrier element refers to the side of the carrier element that faces away from the resistor arrangement after the carrier element has been positioned on the resistor arrangement. It is also possible for both the top and the bottom of the carrier element to be equipped with electronic components. The electrical signal to be tapped can be fed to the electronic components by means of line elements that are located at least on the top of the carrier element. Optionally, the carrier element can also have line elements on its bottom. By means of the electronic components mentioned The signal can be measured, digitized and further processed using components. An AD converter can be such a component, for example. The top of the carrier element, which is provided with conductive elements, has a distance, i.e. a height offset, from the surface of the resistor arrangement.

The invention is based on the consideration of how a mechanical and electrical connection can be established between a resistor arrangement and a carrier element that is to be positioned on the resistor arrangement by means of one or more surface-mountable components. One or more contact elements made of a highly electrically conductive material, for example made of copper or aluminum, are used as surface-mountable components. The side of a contact element that is to face the resistor arrangement is referred to as the underside. The contact elements are shaped in such a way that they have two areas on their underside that are spaced apart from one another, i.e. spatially separated from one another. One of these two areas is connected to the top of the carrier element, for example by a soldered connection. The other area can be connected to the surface of a resistor arrangement by a welded connection, in particular by laser welding. Such a contact element is shaped in such a way that the height offset between the resistor arrangement and the top of the carrier element can be overcome by the contact element. The line elements on the top of the carrier element can thus be contacted.

A second aspect of the invention relates to an assembly for magnetic field-based measurement of the strength of a current in an electrical conductor through which current flows. The assembly comprises an at least partially flat carrier element for receiving electronic components for measuring an electrical signal. The carrier element has a top side and a bottom side The top side of the carrier element is the side of the carrier element that faces away from the electrical conductor after the carrier element has been positioned on the electrical conductor. The assembly further comprises at least one sensor that is mounted on the carrier element. The sensor is configured and set up to generate an electrical signal from the strength of the magnetic field that surrounds an electrical conductor when current flows, which is a measure of the strength of the electrical current. The sensor can in particular be a Hall sensor or a magneto-resistive current sensor. The assembly further comprises at least one contact element that is weldable and preferably consists of electrically conductive material. The contact element has a top side and a bottom side. The side of the contact element that is to face the electrical conductor is referred to as the bottom side. On its bottom side, the contact element has a first, preferably flat area and a second, preferably flat area that is spatially separated from it. In its first area, the contact element is connected in a material-to-material and flat manner, preferably by a soldered connection, to the top side of the carrier element. The contact element is configured such that the second region of the contact element can be connected to an electrical conductor by means of at least one welded connection. Furthermore, the contact element is shaped such that the height offset between the electrical conductor and the top of the carrier element can be overcome by the contact element. With regard to further features of the contact element, reference is made to the above explanations in connection with the assembly for tapping at least one electrical signal from a resistor arrangement.

The contacting technology used in both of the above-described assemblies enables one-sided and therefore cost-optimized assembly of all electrical and electronic components. Furthermore, the welding process, especially laser welding, is a highly reproducible Process. The quality of the welded joint can be easily and reliably checked using optical control. This reduces rejects and the quality of the product can be better ensured. The shape of the contact elements is subject to only a few specifications and can be chosen relatively freely. This makes it possible to design the contact elements so that they are optimally adapted to the geometry and materials of the measurement object, i.e. the resistor arrangement or the electrical conductor. Negative influences on the measurement signal, such as the influence of the weld seam in a resistor arrangement, thermoelectric voltages and the temperature dependence of the specific resistance (TCR), can thus be minimized.

The particular advantage of the proposed contacting technology (SMT) is that the welded connection between the contact element and the measuring object means that the measuring object, i.e. the resistor arrangement or the electrical conductor, does not have to undergo a soldering process. Material changes in the measuring object or in its coating, which can be caused by the high temperatures during the soldering process, are thus excluded. In addition, energy consumption is reduced because the entire measuring object does not have to be heated. Replacing the technically complex soldering process with a simpler and better controllable welding process also expands the circle of suppliers who can reliably master such a process, which ultimately also contributes to cost reduction.

In one embodiment, the contact element can essentially have a step shape or a staircase shape, wherein the first region of the contact element and the second region of the contact element lie in planes that are not coplanar with one another due to the step shape or staircase shape. In the context of this Invention is understood to mean a shape through which a transition from a first level to a second level at a different level is mediated. The step shape or staircase shape of the contact element thus simultaneously enables the top of the carrier element and the surface of the measurement object to be contacted by the bottom of the contact element, although the top of the carrier element and the surface of the measurement object facing the carrier element are spaced apart, i.e. have a height offset. Particularly preferably, the non-coplanar planes can be parallel to one another. This takes account of the generally parallel arrangement of the measurement object and the carrier element.

In a further embodiment, the contact element can be a punched and bent component. Punching and bending processes are particularly well suited to producing suitable contact elements. However, it is also possible for the contact element to be produced by another non-cutting process or by a cutting process.

In a further embodiment, the contact element can be designed in such a way that it has spring properties. The spring effect of the contact element improves the mechanical and electrical connection.

In a further embodiment, the contact element can have several sections in its second area for contacting a measurement object, i.e. a resistor arrangement or an electrical conductor. Multiple contacting improves the mechanical connection. In addition, multiple electrical contacts can be used to tap several electrical signals in parallel from a resistor arrangement. The redundancy of the measurement can thus be improved. Alternatively, an average value can be formed from signals tapped in parallel, which reflects the actual conditions, in particular the course of the electrical potential. better represented than a single measured value. A contact element with several defined sections for contacting a resistor arrangement enables a precisely predeterminable positioning of several voltage taps.

In a further embodiment, the contact element can have at least one recess for positioning a temperature sensor on the carrier element. In order to improve the accuracy of the measurement of the current intensity, it is necessary to know the temperature of the resistor arrangement so that the temperature dependence of the specific resistance can be taken into account. It is therefore common to attach a temperature sensor to the carrier element with which the temperature of the resistor arrangement can be recorded. The contact element is made of highly conductive material and is in good thermal contact with the resistor arrangement. Therefore, the contact element has, to a very good approximation, the same temperature as the resistor arrangement, in particular the same temperature as the resistor element. If a temperature sensor is positioned in a recess in the contact element, this leads to a very good thermal connection of the temperature sensor to the resistor arrangement. The determination of the temperature of the resistor arrangement is thus improved. For further optimization, in particular of the thermal response time, materials with good thermal conductivity can also be used between the contact element and the temperature sensor.

In a further embodiment, the assembly can have first contact elements that only serve to mechanically connect the assembly to a resistor arrangement, and second contact elements that serve at least to electrically contact this resistor arrangement. The functions of “mechanical connection” and “electrical contact” are thus structurally separated. This separation enables optimization of the respective contact elements to the respective function. In particular, the contact elements for the electrical contact can be made significantly smaller than the contact elements for the mechanical connection. This makes it possible to position the electrical contacts very close to the resistance element of the resistance arrangement, even when there is little space. This reduces the influence of temperature on the resistance of the actual measuring section.

A further aspect of the invention relates to a device for measuring the strength of an electric current. The device comprises an assembly as described above for tapping at least one electrical signal from a resistor arrangement and a resistor arrangement mechanically and electrically connected to the assembly. The assembly itself comprises at least one contact element as described above. The resistor arrangement is mechanically and electrically connected to the second region of the contact element by means of at least one welded connection. At least one electrical signal can thus be tapped from a resistor arrangement.

A further aspect of the invention relates to a device for magnetic field-based measurement of the strength of an electrical current. The device comprises an electrical conductor and an assembly at least mechanically connected to the electrical conductor as described above. The assembly has an at least partially flat carrier element for receiving electronic components for measuring an electrical signal. The carrier element has a top side and a bottom side. The top side of the carrier element is the side of the carrier element that faces away from the electrical conductor. The assembly also has at least one sensor that is attached to the carrier element. The sensor is configured and set up to generate an electrical signal from the strength of the magnetic field that surrounds the electrical conductor when current flows. which is a measure of the strength of the electric current. The device further comprises at least one contact element, which is preferably made of electrically conductive material. The contact element has a top side and a bottom side. On its bottom side, the contact element has a first region and a second region that is spatially separated from it. In the first region of its bottom side, the contact element is connected in a materially bonded and flat manner to the top side of the carrier element. The electrical conductor is connected to the second region of the bottom side of the contact element by means of at least one welded connection.

The particular advantage of the proposed devices is that the welded connection between the contact element and the measuring element, i.e. the resistance arrangement or the electrical conductor, means that the measuring element itself does not need to be soldered. Material changes in the measuring element or its coating, which can be caused by the high temperatures during the soldering process, are thus excluded. In addition, energy consumption is reduced because the entire measuring element does not have to be heated. Replacing the technically complex soldering process with a simpler and more controllable welding process also expands the circle of suppliers who can reliably master such a process, which ultimately contributes to cost reduction.

In one embodiment, the device can have at least one temperature sensor that is positioned near the contact element. In particular, the temperature sensor can be positioned in a recess in the contact element. As already explained above, positioning a temperature sensor near the contact element, in particular in a recess in the contact element, results in a very good thermal connection of the temperature sensor to the resistor arrangement. The determination of the temperature of the resistor arrangement is thus improved. With regard to further technical features and advantages of the devices according to the invention, explicit reference is hereby made to the explanations in connection with the assemblies according to the invention, to the methods according to the invention for producing such devices as well as to the figures, the description of the figures and the exemplary embodiments.

A further aspect of the invention relates to a method for producing a device for resistance-based measurement of the strength of an electric current. The method comprises the following steps: a) providing an at least partially flat carrier element with a top side and a bottom side, wherein the carrier element has conduction elements for conducting electrical signals at least on its top side, b) providing at least one contact element made of electrically conductive material, wherein the contact element has a top side and a bottom side and has on its bottom side a first, preferably flat region and a second, preferably flat region spatially separated therefrom, c) flat and materially connecting the top side of the carrier element to the first region of the contact element so that the contact element is in electrical contact with at least one conduction element on the top side of the carrier element, d) connecting a resistor arrangement to the second region of the contact element by means of at least one welded connection, wherein step d) takes place chronologically after step c).

Another aspect of the invention relates to a method for producing a device for magnetic field-based measurement of the strength of an electric current. The method comprises the following steps: a) Providing an at least partially flat carrier element with a top side and a bottom side and with at least one sensor which is attached to the carrier element and which is configured and set up to generate an electrical signal from the strength of the magnetic field which surrounds an electrical conductor when current flows, which is a measure of the strength of the electrical current, b) Providing at least one contact element, preferably made of electrically conductive material, wherein the contact element has a top side and a bottom side and has on its bottom side a first, preferably flat region and a second, preferably flat region spatially separated therefrom, c) Flat and materially connecting the top side of the carrier element to the first region of the contact element, d) Connecting an electrical conductor to the second region of the contact element by means of at least one welded connection, wherein step d) takes place chronologically after step c).

The devices described above can be manufactured using the proposed methods. Reference is made to the corresponding explanations in connection with the devices.

The particular advantage of the proposed method is that the welded connection between the contact element and the measuring element, i.e. the resistance arrangement or the electrical conductor, only takes place after the carrier element has been connected to the contact element. Even if the carrier element is connected to the contact element by a soldering process, the measuring element itself does not have to be subjected to a soldering process.

With regard to further technical features and advantages of the methods according to the invention, reference is hereby made explicitly to the explanations in connection with the assemblies according to the invention, to the explanations in connection with the devices according to the invention as well as to the figures, the description of the figures and the embodiments.

Embodiments of the invention are explained in more detail with reference to the schematic drawings, in which:

Fig. 1 a first contact element

Fig. 2 a second contact element

Fig. 3 is a perspective view of a first assembly

Fig. 4 in oblique view the underside of an assembly according to Fig. 3

Fig. 5 is a perspective view of a first device

Fig. 6 is a plan view of a device according to Fig. 5

Fig. 7 is a perspective view of a second assembly

Fig. 8 is a perspective view of a second device

Fig. 9 shows a schematic sequence of a manufacturing process for a first device

Fig. 10 shows a schematic sequence of a manufacturing process for a second device

Corresponding parts are provided with the same reference numerals in all figures.

Fig. 1 shows a first contact element 3, 31. The contact element 3, 31 has a step or staircase shape. The view is selected so that the top 33 of the contact element 3, 31 is visible, while the bottom 34 of the contact element 3, 31 is not visible. The contact element 3, 31 has a first flat area 35 on its bottom 34, in which it can be connected to the top of a carrier element (not shown in Fig. 1) in a material-locking manner, for example by means of a soldered connection. The Contact element 3, 31 also has a recess 38. In the area of this recess 38, a temperature sensor can be positioned on the carrier element, which measures the temperature of the contact element 3, 31. The contact element 3, 31 also has a second flat area 36 on its underside 34, which is spatially separated from the first flat area 35. In the illustrated embodiment of the contact element 3, 31, the second area 36 lies in a plane that is parallel to the plane in which the first area 35 lies. However, the two planes are not coplanar, but offset from one another due to the step shape. The first area 35 and the second area 36 are therefore at different levels. In the second area 36, the contact element 3, 31 can be connected to the surface of an electrical conductor (not shown in Fig. 1) or to the surface of a resistor arrangement (not shown in Fig. 1) by one or more welded connections. The difference in level between the first area 35 and the second area 36 allows the distance between the top of the carrier element and the surface of the resistor arrangement to be bridged. In its second area 36, the contact element 3, 31 has four sections 37 that are separated from one another by incisions. The sections 37 are used to attach several welded connections next to one another. The contact element 3, 31 can be designed as a punched and bent component. To produce it, a flat component is first punched from a band or strip-shaped material. The step or staircase shape is then formed by two bending processes.

Fig. 2 shows a second contact element 3, 32. The contact element 3, 32 has a step or staircase shape. In the case shown, the transition from the lower step to the upper step is not at a right angle, but as an inclined section. The view is selected so that the top 33 of the contact element 3, 32 is visible, while the bottom 34 of the Contact element 3, 32 is not visible. The contact element 3, 32 has a first flat region 35 on its underside 34, in which it can be connected to the top side of a carrier element (not shown in Fig. 2) in a materially bonded manner, for example by a soldered connection. The contact element 3, 32 also has a recess 38. In the area of this recess 38, a temperature sensor can be positioned on the carrier element, which measures the temperature of the contact element 3, 32. The contact element 3, 32 also has a second flat region 36 on its underside 34, which is spatially separated from the first flat region 35. In the illustrated embodiment of the contact element 3, 32, the second region 36 lies in a plane that is parallel to the plane in which the first region 35 lies. The two planes are not coplanar, however, but are offset from one another due to the step shape. The first area 35 and the second area 36 are thus at different levels. In the second area 36, the contact element 3, 32 can be connected to the surface of a resistor arrangement (not shown in Fig. 2) or to one or more welded connections. The difference in level between the first area 35 and the second area 36 can bridge the distance between the top of the carrier element and the surface of the resistor arrangement. In its second area 36, the contact element 3, 32 has two sections 37 which are separated from one another by an incision. The sections 37 serve to attach several welded connections next to one another. The contact element 32 shown in Fig. 2 is narrower than the contact element 31 shown in Fig. 1. The contact element 31 shown in Fig. 2

Contact element 32 can thus preferably be used for electrically contacting a resistor arrangement, while the contact element shown in Fig. 1 can preferably be used to ensure the mechanical connection of the carrier element and resistor arrangement or an electrical conductor. The contact element 3, 32 can be designed as a stamped and bent component. To manufacture it, a strip or A flat component is punched out of strip-shaped material. The step or staircase shape is then formed through two bending processes.

Fig. 3 shows a perspective view of a first assembly 1. The assembly 1 comprises a carrier element 2 in the form of a circuit board, two first contact elements 31 according to Fig. 1 and two second contact elements 32 according to Fig. 2. The top side 21 of the carrier element 2 is equipped with an electronic component 6. For simplicity, this is shown as a cuboid. The carrier element 2 also has conductor tracks on its top side 21, which are not shown for reasons of clarity. The electronic component 6 is in electrical contact with the conductor tracks. The two first contact elements 31 are each attached opposite one another on the outer edge of the carrier element 2. They are each soldered in their first region 35 to the top side 21 of the carrier element 2. With regard to further details of these first contact elements 31, reference is made to the description of Fig. 1. In addition to the electronic component 6, the carrier element 2 has a recess 23 in the form of an opening. The two second contact elements 32 are mounted in such a way that they protrude into this recess 23. Preferably, the second contact elements 32 can even protrude through the recess 23. The second contact elements 32 are each soldered in their first region 35 to the top side 21 of the carrier element 2 in such a way that an electrical contact is established with the conductor tracks. For further details of these second contact elements 32, reference is made to the description of Fig. 2.

Fig. 4 shows an oblique view of the underside 22 of the assembly 1 shown in Fig. 3. Due to the oblique view, the electronic component 6 with which the carrier element 2 is equipped on its upper side can still be seen. On the outer edge of the carrier element 2, first contact elements 31 and in particular their respective second area 36 on the underside 34 of the contact element 31 can be seen. Due to the step shape of the contact elements 31, their respective second region 36 is located at least at the level of the underside 22 of the carrier element 2 and can thus contact the surface of a resistor arrangement (not shown in Fig. 4). Preferably, the second regions 36 can even have a projection over the underside 22 of the carrier element 2. Approximately in the middle of the carrier element 2 is the recess 23 already mentioned in connection with Fig. 3. In this recess 23, two second contact elements 32 and in particular their respective second region 36 can be seen. Due to the step shape of the contact elements 32, their respective second region 36 is located at least at the level of the underside 22 of the carrier element 2 and can thus contact the surface of a resistor arrangement (not shown in Fig. 4). Preferably, the second contact elements 32 can even protrude through the recess 23 with their respective second region 36.

Fig. 5 shows a perspective view of a first device 11 for measuring the strength of an electric current. The device comprises an assembly 1 as shown in Fig. 3 and Fig. 4 and a resistor arrangement 4. The resistor arrangement 4 consists of two connection elements 41 and a resistor element 42 which is arranged between the two connection elements 41 and is connected to them via a joint seam (not shown in detail). The two connection elements 41 each have a bore 43 by means of which the resistor arrangement 4 can be connected to an external circuit (not shown). The assembly 1 is positioned on the resistor arrangement 4 such that the top side 21 of the carrier element 2 faces away from the resistor arrangement 4. The assembly 1 is at least mechanically connected to the connection elements 41 of the resistor arrangement 4 via the two first contact elements 31, which are each arranged on the edge of the carrier element 2. For this purpose, the second area 36 of a contact element 31 is welded to one of the connection elements 41. Furthermore, the assembly 1 is connected via the two second contact elements 32 are electrically connected to the connection elements 41 of the resistor arrangement 4. For this purpose, the second region 36 of a second contact element 32 is welded to one of the connection elements 41, with the connection element 41 being contacted in the immediate vicinity of the resistance element 42. This essentially allows the voltage to be tapped that drops when current flows through the resistance element 42. The proximity of the voltage taps to the resistance element 42 minimizes the proportion of connection elements 41 whose electrical resistance depends heavily on the temperature. This improves the TCR behavior of the entire measuring section.

Fig. 6 shows a plan view of a device according to Fig. 5. Fig. 6 has been supplemented compared to Fig. 5 in that in the two first contact elements 31 and in the two second contact elements 32 the welded connections 5 with the resistor arrangement 4 are indicated by circles.

Fig. 7 shows a perspective view of a second assembly 10. The assembly 10 comprises a carrier element 2 in the form of a circuit board and two contact elements 31 according to Fig. 1. The top side 21 of the carrier element 2 is equipped with a sensor 8 for magnetic field-based measurement of the current intensity and with an electronic component 6. The carrier element 2 also has conductor tracks on its top side 21, which are not shown for reasons of clarity. The sensor 8 and the electronic component 6 are in electrical contact with the conductor tracks. The two contact elements 31 are attached opposite one another on the outer edge of the carrier element 2. They are each soldered in their first area 35 to the top side 21 of the carrier element 2. For further details of these contact elements 31, reference is made to the description of Fig. 1.

Fig. 8 shows a perspective view of a second device 12 for Measuring the strength of an electric current using a magnetic field-based measuring method. The device comprises an assembly 10 as shown in Fig. 7 and an electrical conductor 7. The electrical conductor 7 consists of a metallic material in the form of a strip. The electrical conductor 7 has a hole 73 at each of its two ends, by means of which the electrical conductor 7 can be connected to an external circuit (not shown). The assembly 10 is positioned on the conductor 7 such that the top side 21 of the carrier element 2 faces away from the electrical conductor 7. The assembly 10 is mechanically connected to the electrical conductor 7 via the two contact elements 31, which are each arranged on the edge of the carrier element 2. For this purpose, the second region 36 of a contact element 31 is welded to the electrical conductor 7. The sensor 8 mounted on the carrier element 2 is set up and configured to generate an electrical signal from the strength of the magnetic field that surrounds the electrical conductor 7 when current flows, which is a measure of the strength of the electrical current flowing in the conductor 7. The sensor 8 can in particular be a Hall sensor or a magneto-resistive current sensor.

Fig. 9 shows a schematic sequence of a method for producing a device 11 according to Figs. 5 and 6. In step a), a carrier element 2 is provided in the form of a circuit board, which can optionally be equipped with electronic components 6 for measuring an electrical signal. In step b), contact elements 31, 32 are provided. In step c), these are connected to the circuit board 2 by a soldering process such that the contact elements 31, 32 are connected to the top 21 of the circuit board on their underside 34 in their respective first region 35. In this way, an assembly 1 is formed. The soldering of the electronic components 6 to the circuit board 2 can take place either simultaneously in step c) or before or after step c). The assembly 1 is positioned on a resistor arrangement 4. The production of such a resistor arrangement 4 is generally known. In process step d) the assembly 1 is connected to the resistor arrangement 4 via the contact elements 31, 32 by one or more welded connections. This forms a device 11 for measuring the strength of an electric current.

Fig. 10 shows a schematic sequence of a method for producing a device 12 according to Figs. 7 and 8. In step a), a carrier element 2 in the form of a circuit board is provided, which is equipped with a sensor 8 and optionally with electronic components 6 for measuring an electrical signal. In step b), contact elements 31 are provided. In step c), these are connected to the circuit board 2 by a soldering process such that the contact elements 31 are connected on their underside 34 in their respective first region 35 to the top side 21 of the circuit board. In this way, an assembly 10 is formed. The electronic components 6 can be soldered to the circuit board 2 either simultaneously in step c) or before or after step c). The assembly 10 is positioned on an electrical conductor 7. In process step d), the assembly 10 is connected to the electrical conductor 7 via the contact elements 31 by one or more welded connections. This forms a device 12 for measuring the strength of an electric current.

list of reference symbols

assembly

assembly

device

device

support element

top of the support element

underside of the support element

recess

contact element first contact element second contact element

top of a contact element

Bottom of a contact element first area second area

Section

recess

resistor arrangement

connecting element

resistance element

drilling

welded joint

component electrical conductor

drilling

sensor

Claims

patent claims 1. Assembly (1) for tapping at least one electrical signal from a resistor arrangement (4), comprising an at least partially flat carrier element (2) for receiving electronic components (6) for measuring an electrical signal, wherein the carrier element (2) has a top side (21) and a bottom side (22) and has conduction elements for conducting electrical signals at least on its top side (21), and at least one contact element (3, 31, 32) made of electrically conductive material, wherein the contact element (3, 31, 32) has a top side (33) and a bottom side (34) and has a first region (35) and a second region (36) spatially separated therefrom on its bottom side (34), wherein the contact element (3, 31, 32) is connected in its first region (35) in a materially bonded and flat manner to the top side (21) of the carrier element (2), and wherein the contact element (3, 31, 32) is configured such that the second region (36) of the contact element (3, 31, 32) can be connected to a resistor arrangement (4) by means of at least one welded connection (5), so that when connected to a resistor arrangement (4), at least one electrical signal can be tapped from the resistor arrangement (4) through the contact element (3, 32). 2. Assembly (10) for magnetic field-based measurement of the strength of a current in an electrical conductor (7) through which current flows, comprising an at least partially planar carrier element (2) for receiving electronic components (6) for measuring an electrical signal, wherein the carrier element (2) has an upper side (21) and a lower side (22), at least one sensor (8) which is mounted on the Carrier element (2) is attached and which is configured and set up to generate an electrical signal from the strength of the magnetic field that surrounds an electrical conductor (7) when current flows, which is a measure of the strength of the electrical current, and at least one contact element (3, 31), preferably made of electrically conductive material, wherein the contact element (3, 31) has an upper side (33) and a lower side (34) and has on its lower side (34) a first region (35) and a second region (36) spatially separated therefrom, wherein the contact element (3, 31) is connected in its first region (35) in a materially bonded and planar manner to the upper side (21) of the carrier element (2), and wherein the contact element (3, 31) is configured such that the second region (36) of the contact element (3, 31) can be connected to an electrical conductor (7) by means of at least one welded connection (5). 3. Assembly (1, 10) according to claim 1 or 2, characterized in that the contact element (3, 31, 32) has essentially a step shape or a staircase shape, so that the first region (35) of the contact element (3, 31, 32) and the second region (36) of the contact element (3, 31, 32) lie in planes which are not coplanar with one another. 4. Assembly (1, 10) according to one of the preceding claims, characterized in that the contact element (3, 31, 32) is a stamped and bent component. 5. Assembly (1, 10) according to one or more of the preceding claims, characterized in that the contact element (3, 31, 32) has spring properties. 6. Assembly (1, 10) according to one or more of the preceding Claims, characterized in that the contact element (3, 31, 32) has in its second region (36) several sections (37) for contacting a resistor arrangement (4) or an electrical conductor (7). 7. Assembly (1, 10) according to one or more of the preceding claims, characterized in that the contact element (3, 31, 32) has at least one recess (38) for positioning a temperature sensor on the carrier element (2). 8. Assembly (1) according to claim 1 or according to one or more of claims 3 to 7, characterized in that the assembly (1) has first contact elements (31), which serve for the mechanical connection of the assembly (1) to a resistor arrangement (4), and second contact elements (32), which serve for the electrical contacting of this resistor arrangement (4). 9. Device (11) for measuring the strength of an electric current, comprising: an assembly (1) according to one or more of the preceding claims, a resistance arrangement (4) mechanically and electrically connected to the assembly (1), characterized in that the resistance arrangement (4) is mechanically and electrically connected to the second region (36) of the contact element (3, 31, 32) by means of at least one welded connection (5), so that at least one electrical signal can be tapped from the resistance arrangement (4). 10. Device (12) for magnetic field-based measurement of the strength of a electric current, comprising an electrical conductor (7) and an assembly (10) at least mechanically connected to the electrical conductor (7) according to one of claims 2 to 7, with an at least partially flat carrier element (2) for receiving electronic components (6) for measuring an electrical signal, wherein the carrier element (2) has an upper side (21) and a lower side (22), with at least one sensor (8) which is attached to the carrier element (2) and which is configured and set up to generate an electrical signal from the strength of the magnetic field which surrounds the electrical conductor (7) when current flows, which electrical signal is a measure of the strength of the electrical current, and with at least one contact element (3, 31), preferably made of electrically conductive material, wherein the contact element (3, 31) has an upper side (33) and a lower side (34) and has on its lower side (34) a first region (35) and a second region (36) which is spatially separated therefrom, wherein the contact element (3, 31 ) is connected in its first region (35) in a materially bonded and planar manner to the upper side (21 ) of the carrier element (2), characterized in that the electrical conductor (7) is connected to the second region (36) of the contact element (3, 31 ) by means of at least one welded connection (5). 11. Device (11, 12) according to claim 9 or 10, characterized in that it comprises at least one temperature sensor which is positioned in the vicinity of the contact element (3, 31, 32). 12. A method for producing a device (11) for measuring the strength of an electric current, the method comprising the following steps: a) providing an at least partially flat carrier element (2) with an upper side (21) and a lower side (22), the carrier element (2) having conduction elements for conducting electrical signals at least on its upper side (21), b) providing at least one contact element (3, 31, 32) made of electrically conductive material, wherein the contact element (3, 31, 32) has an upper side (33) and a lower side (34) and has on its lower side (34) a first region (35) and a spatially separate second region (36), c) surface and materially connecting the upper side (21) of the carrier element (2) to the first region (35) of the contact element (3, 31, 32) so that the contact element (3, 31, 32) is in electrical contact with at least one line element on the upper side (21) of the carrier element (2), d) connecting a resistor arrangement (4) to the second region (36) of the contact element (3, 31, 32) by means of at least one welded connection (5), wherein step d) takes place after step c). 13. Method for producing a device (12) for magnetic field-based measurement of the strength of an electric current, the method comprising the following steps: a) providing an at least partially flat carrier element (2) with a top side (21) and a bottom side (22) and with at least one sensor (8) which is attached to the carrier element (2) and which is configured and set up to generate an electrical signal from the strength of the magnetic field which surrounds an electrical conductor (7) when current flows, which is a measure of the strength of the electric current, b) providing at least one contact element (3, 31), preferably made of electrically conductive material, the contact element (3, 31) having a top side (33) and a bottom side (34) and having on its bottom side (34) a first region (35) and a second region (36) spatially separated therefrom, c) surface and material-locking connection of the upper side (21) of the carrier element (2) to the first region (35) of the contact element (3, 31), d) connecting an electrical conductor (7) to the second Area (36) of the contact element (3, 31) by means of at least one welded connection (5), wherein step d) takes place after step c).